201037317 * 六、發明說明： 【發明所屬之技術領域】 本發明财-種探針卡減及其巾之探針座，_是顧於晶圓 測試者。 【先前技術】 在半導體的晶圓製程中，晶圓切割前為了測試晶圓上晶粒(die)的良筹， 必須使用高性能的探針卡(pWe eard)來執行晶圓職，如先前技術中之美 國專利刪趣8、_710〇3、翻伽8等所揭露者。探針卡上具有精 密的測試探針’絲與制晶圓做’導通電路，並執行雜測試，以 確保晶粒的電氣特性與效能是依照設計規袼製造出來。近年來，高速運作 與高頻操作的頻魏元憾行，因此戦機台能針卡也要能高頻率相 適應。但是舰Μ式探針卡顧在高_試時，因秘針制隙化及高 頻峨產生的電磁谓無關題十分嚴重，使得戦結果不财，往往 需要進行額外的重測程序，降低了測試準確度與效能1此，如何改 用的探針卡結構以解決上述問題’實為業界所需。 【發明内容】 針座_試探針。上述之複數個測試探針的尖端自探針座 _以接觸-待職，上述之複數_試探針的另- 具有第一端接端探Γ進一步包含複數個雜訊消除針，各雜訊消除針 L一―端端係紐連接至本體的接地端H祕旦 成，=Γ先前技術不盡理想之處，本發明提供了-觀針卡組 1=、_嫩綱、肅捕㈣蚊咖、以及複 201037317 由探謝=二供’針卡組成，用於晶圓測試，藉 降低高頻職職切=极針，且_觸除針抑躺，可以有效 座中=:欠要目的係提供一種探針卡組成，用於晶圓測試，藉由探針 雜訊，可以提昇高頻測試的準確度。 降低了環境中的 本發明進一步提供—種探針 Ο Ο 設置—撕央部位使針 第一端3複數個雜訊消除針’各雜訊消除針具有 ^曰圓測試時並不接觸待測晶圓，且各雜訊齡針並 因此，本發歡又—目_提供—贿針座，供使胁晶_試 =組成t，藉由探針座中設置複數個雜訊消除針，且將雜訊消除針予以 接地，可以有效降低高頻測試所產生的雜訊。 本發明之再-目的供—贿針座，供使晶胃峨之探 成令，藉由探針座中設置複數個雜訊消除針，且將雜訊消除針予以接地， 降低了環境中的雜訊，可以提昇高頻測試的準確度。 【實施方式】 由於本發明係揭露一種探針卡組成及其中之探針座，用於晶圓之測 試’其中探針卡城及騎座的制原理減本魏，已知目關技術領域 具有通常知識者所能明瞭，故町文巾之綱，不再作完整描述。同時， 以下文中所對照之圖式，係表達與本發明特徵有關之結構示意，並未亦不 需要依據實際尺寸完整繪製，盍先敘明。 μ 5 201037317 百先凊參考第i圖，縣發.出之第—難實施例，為—雌針卡 組成，主要包含有榻u、設置於本體n巾央雜之探針座η血設 置於探針座12中的複數個測試探針13。上述之本體u主要為印刷電路板201037317 * VI. Description of the Invention: [Technical Field of the Invention] The probe holder of the invention is a probe holder for the wafer card. [Prior Art] In the semiconductor wafer process, in order to test the die on the wafer before wafer cutting, a high-performance probe card (pWe eard) must be used to perform the wafer job, as before. The US patents in the technology are deleted, _710〇3, and gamma 8 are disclosed. The probe card has a precision test probe 'wire and wafer made' conduction circuit and performs a miscellaneous test to ensure that the electrical characteristics and performance of the die are manufactured according to design specifications. In recent years, the high-speed operation and the high-frequency operation of the Wei Wei Yuan regretted, so the machine can also be able to adapt to high frequency. However, when the ship-type probe card is used in high-testing, the electromagnetic-related irrelevant problem caused by the gap between the needle and the high-frequency flaw is very serious, so that the result is not good, and often requires additional retesting procedures, which reduces the accuracy of the test. Degree and performance 1. Therefore, how to use the probe card structure to solve the above problems is actually required by the industry. SUMMARY OF THE INVENTION A needle holder _ test probe. The tip of the plurality of test probes from the probe holder _ to contact-standby, and the plurality of _ test probes described above have a first terminal end probe further comprising a plurality of noise canceling pins, each of the noise Eliminating the pin L-end end tie to the ground end of the body H secret, = Γ the prior art is not ideal, the present invention provides - view card set 1 =, _ tender, arrest (four) mosquito Coffee, and Fu 201037317 by the test = two for the 'needle card, for wafer testing, by reducing the high frequency occupational cut = pole, and _ touch the needle to lie down, can be effectively seated =: A probe card assembly is provided for wafer testing, and probe noise can improve the accuracy of high frequency testing. The invention is further provided in a reduced environment - the probe Ο Ο is set - the tearing portion is such that the first end of the needle 3 is a plurality of noise canceling needles' each of the noise eliminating needles has a contact with the crystal to be tested Round, and each of the mixed age needles and therefore, the hair is also a _ _ _ _ bribe needle seat, for the threat 晶 _ test = composition t, by setting a plurality of noise elimination needles in the probe holder, and will The noise cancellation pin is grounded to effectively reduce the noise generated by the high frequency test. The re-purpose of the present invention is for the bribe needle seat, for the detection of the crystal stomach, by setting a plurality of noise elimination needles in the probe base, and grounding the noise elimination needle, thereby reducing the environment Noise can improve the accuracy of high frequency testing. [Embodiment] The present invention discloses a probe card composition and a probe holder therein for testing a wafer, wherein the principle of the probe card and the riding seat is reduced, and the known technical field has Usually the knowledge can be understood, so the outline of the town towel, no longer a complete description. At the same time, the drawings referred to in the following texts express the structural schematics relating to the features of the present invention, and need not be completely drawn according to actual dimensions, as described first. μ 5 201037317 百先凊 Refer to the i-th figure, the county is issued. The first-difficult example, which is the composition of the female needle card, mainly consists of a couch u, placed on the body n towel, the probe seat η blood is set at A plurality of test probes 13 in the probe holder 12. The above body u is mainly a printed circuit board
Circuit B〇ar_) ’其中探針座12主要係以環氧樹脂所形成，為 先在上歡好糊_試探針13，並粒魏_(啊柳定上述 之測试探針η ’而形成_個探針座12，然後再將此探針座12 _於本體 二上。請參考第2圖，為探針座12之剖簡。測試探針13的尖端會自探 針座12伸出，用以接觸-待測晶圓，進行晶圓顧，而測試探針η的另 =與本體η電性連接。探針座12進一步包含複數個雜訊消除針μ，雜 11 第 係電性連接至本體 L的接地細111或本體11的PCB板中的接地層，藉由接地將雜訊消除。 第-端142鄰近於測試探針13接觸待測晶圓的部位，第二端⑷可以埋入 探針座12中，亦可以突出於探針座12之外。但要特別留意的是，第二端 M2於晶圓職時，並不_御侧，纽這些細肖除針μ也 ==的測試探㈣。藉此，_除針14不會因為接觸而破壞鄰近的 U rU13的测為號，部可以因為電感效應與接地作用而消除測試探針 魏中的高頻雜訊’進而提昇高頻測試的準確度。習知技術中，由於測 離針U之間彼此相鄰極近，易發生串音(⑽滅），訊號容易互相干擾. 而讀狀況藉由本發明所提出之雜訊消除針M得以有效地解決。請第 ^為第i圖沿A Μ之侧伽肖除針14以設置於其鄰近的四個 、取二3的對鱗父又點為較佳，且雜訊消除針14的外緣與其鄰近的 ^探針η的外緣’具有5〜30微米之間請。更進—步，本發明經 得到的結果’這些雜訊消除針14的外緣與其鄰近的測試探針13的 ,’，在10〜25微米間隙W1時’更可以有效降低高頻測試所產生的雜訊， 田…、’可視實際製作之需求，設計成其他符合本實施例條件之間隙。 201037317 月、=續參考第i圖、第2圖與第4圖，本發明進—步提出第二較佳 鉍歹’ ’，、、，-種探針卡組成100，主要包含有本體u、設置於本體u中央 =:=12:免置於探針座12中的複數個測試探針13、以及複數個雜 “矛、。凊繼續參考第2圖，雜訊消除針14具有第一端141與第 142。第一端⑷係電性連接至本體11的接地端111或本體11的PCB板中 的接地層藉由接地將雜訊消除。第二端142鄰近於測試探 ❹Circuit B〇ar_) 'The probe holder 12 is mainly formed of epoxy resin, which is the first to lick the paste _ test probe 13, and the grain Wei _ (ah Liu Ding the above test probe η ' Forming a probe holder 12, and then placing the probe holder 12 on the body 2. Referring to Figure 2, the probe holder 12 is simplified. The tip end of the test probe 13 is extended from the probe holder 12. The contact probe η is electrically connected to the body η. The probe holder 12 further includes a plurality of noise canceling pins μ, and the dummy 11 is electrically connected. Connected to the grounding layer 111 of the body L or the ground layer in the PCB board of the body 11, the noise is eliminated by grounding. The first end 142 is adjacent to the portion where the test probe 13 contacts the wafer to be tested, and the second end (4) It can be embedded in the probe base 12, or it can protrude beyond the probe base 12. However, it should be noted that the second end M2 is not in the wafer position, and the key is not removed. Also == test test (4). By this, _ except the needle 14 will not damage the adjacent U rU13 due to contact, the part can eliminate the test probe due to the inductance effect and the grounding effect. Weizhong's high-frequency noise' further enhances the accuracy of high-frequency testing. In the prior art, since the measuring needles U are close to each other, crosstalk is easy to occur ((10) off), and the signals easily interfere with each other. The read condition can be effectively solved by the noise canceling pin M proposed by the present invention. Please refer to the i-th image along the side of the A 伽 伽 除 除 以 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 14 The father is also preferred, and the outer edge of the noise canceling pin 14 and the outer edge 'the proximity of the probe n are between 5 and 30 micrometers. Further, the result of the present invention is 'these impurities'. The outer edge of the elimination pin 14 and the test probe 13 adjacent thereto, 'when the gap is W1 at 10 to 25 micrometers' can effectively reduce the noise generated by the high frequency test, and can be visually processed. Designed into other gaps in accordance with the conditions of this embodiment. 201037317, = continued to refer to the i, 2, and 4, the present invention further proposes a second preferred 铋歹 ' ',,, - The needle card is composed of 100, and mainly includes a body u, which is disposed at the center of the body u=:=12: is plurally placed in the probe base 12 The test probe 13 and the plurality of hybrid "spears" continue to refer to FIG. 2, the noise canceling pin 14 has a first end 141 and a 142. The first end (4) is electrically connected to the ground end 111 of the body 11 or The ground plane in the PCB of the body 11 eliminates noise by grounding. The second end 142 is adjacent to the test probe.
，圓的部位长端142可以埋入探針座12中，亦可以略突出於^寺 之夕但第一端142於晶圓測試時，並不接觸到制晶圓，並且這些雜 訊^除針14也不會接觸_近_試探針13。藉此，這些雜訊消除針μ 不因為接觸而破壞鄰近的測試探針13的測試訊號，卻可以因為接地作用 X除暮嫌針I3魏巾的雜訊，進啸昇高綱試的料度。請繼續參 圖係為第1圖沿A至A之剖視圖，這些雜訊消除針Μ以設置於 」鄰近的四個測試探針u的對角線交叉點為較佳，且雜訊消除針Μ的針 徑中讀其鄰近的測試探針13的針徑中心，具有85〜15〇微米之距離W2。 '步本發月、，星過實驗測試得到的結果，這些雜訊消除針Μ的針徑中 心與其鄰近的測試探針13的針徑中心，在9(M45微米之距離W時，更 可以有效降低高頻測試所產生_訊，雜，可視實際製作之需求，設計 成其他符合本實蝴條件之針彳心間的距離。 士本發日-錢m健實補，為—觀触，供賴於晶圓 ^之探針卡、、a成巾’其特徵如前述第―較佳實施例巾的探針座η所述。 士本發明進—步提出—第四較佳實關，為-麵針座，供使用於晶圓 Μ式之探針卡、减其特徵如前述帛二較佳實施丨料之探針座12所逃。 乂上所述僅為本發明之較佳實施例，並非用以限定本發明之申請專利 翻，同時以上娜述’對於齡味麟領域之專門人士應可喊及實施， 因此其他未脫縣發騎揭故騎下所完賴等效改變或修飾，均應包 含在申請專利範圍中。 7 201037317 【圖式簡單說明】 第1圖為—不意圖，係本發明提供之較佳實施例，為一種探針卡組成 及探針座。 針斑2 ’係本翻提供之較佳實施例，為探針座沿測試探 針與雜_除針畅的剖視圖。 座======帛—繼崎細，為探針 第4圖為一示意圖，係本路明 座沿測試探針與雜訊消除針徑向的之第二與第四較佳實施例，為探針 100 11 111 12 13 14 141 142 W1 【主要元件符號說明】 探針卡組成 本體 接地端 探針座 測試探針 雜訊消除針 第一端 第二端 間隙 距離 W2 8The long end 142 of the round portion may be buried in the probe base 12, or may protrude slightly on the evening of the temple, but the first end 142 is not in contact with the wafer during the wafer test, and the noise is removed. The needle 14 also does not touch the _ near_test probe 13. Thereby, the noise canceling pin μ does not damage the test signal of the adjacent test probe 13 due to the contact, but the grounding action X can eliminate the noise of the needle I3 Wei towel, and the temperature of the test is increased. Please continue to refer to the cross-sectional view of Figure 1 along A to A. These noise cancellation pins are preferably placed at the diagonal intersection of the four adjacent test probes u, and the noise cancellation pinch The needle diameter is read in the center of the needle diameter of its adjacent test probe 13, and has a distance W2 of 85 to 15 μm. 'Steps from the month, the results of the experimental test, these noises eliminate the center of the needle diameter of the needle and the center of the needle diameter of the test probe 13 adjacent to it, which is more effective at 9 (M45 micrometer distance W) Reduce the high-frequency test produced by _, miscellaneous, visible to the actual production needs, designed into other distances between the heart of the needle and the heart of the real thing. Shiben hair day - money m health, make up - for the touch, for The probe card of the wafer, the a towel is characterized by the probe base η of the aforementioned first preferred embodiment towel. The present invention further proposes that the fourth preferred embodiment is - a needle holder for use with a wafer cassette probe card, the features of which are escaped by the probe holder 12 of the preferred embodiment described above. The above description is only a preferred embodiment of the present invention. It is not intended to limit the patent application of the present invention, and at the same time, the above-mentioned Na's special person in the field of ageing Lin should be able to scream and implement, so the other unremoved county rides and rides are equivalent to the equivalent change or modification. , should be included in the scope of the patent application. 7 201037317 [Simple description of the diagram] Figure 1 is - not intended The preferred embodiment provided by the present invention is a probe card assembly and a probe holder. The needle spot 2' is a preferred embodiment provided by the present invention, which is a probe holder along the test probe and the needle is removed. The cross-sectional view of the seat ======帛—following the fineness of the probe, the fourth picture of the probe is a schematic diagram, which is the second and fourth comparison of the test probe and the noise elimination needle radial direction of the road. A preferred embodiment is a probe 100 11 111 12 13 14 141 142 W1 [Description of main component symbols] The probe card is composed of a body ground terminal probe holder test probe noise cancellation pin first end second end gap distance W2 8