TWM253771U - Low noise probe head - Google Patents

Description

M253771 Creation Instructions (1) Probing in the New Technical Field This creation relates to a probe card [p r 〇 b e c a r d] head 'especially to a low-noise probe head. [Prior art] ^ During the transmission of a signal, it will be affected by some unwanted extra energy. This extra energy is the so-called noise [n〇 丨 se], which usually causes signal interference. In addition to the source of the distortion, it can also be generated by the receiving system itself. In order to eliminate the noise in the process of integrated electric measurement, conventionally, there are a plurality of bypass capacitors [by-pass capacit〇r] on the external installation of the probe, but it is easy to affect the probe Position and height configuration, and each bypass capacitor is individually joined to the probe head by surface bonding [SMT] or welding technology, "and the probe head needs to be specially designed to connect the bypass paths, and the manufacturing cost is higher . Ling Yi <Green

I U.S. Patent No. 5,373,231 discloses a detection device with an external road capacitance. The detection device includes a coaxial probe (coaxiai probe), a line probe (wire prObe), and The capacitor [capacitor] between the coaxial probe and the line probe, and the coaxial probe and the line probe a probe card [printed circuit board]. It can be mechanically connected to the line probe with the needle [cantueve ... be] installed and / only for cantilever type A 'not suitable for high-density detection

M253771 Fourth, the flat-type probe of the creation description (2). [New content] The main purpose of this creation is to provide a low-noise detection head. At least one accommodating cavity is formed on a first substrate. The accommodating cavity is provided with at least a bypass capacitor. ] In order to reduce the extent to which the test signal is disturbed by noise during transmission. A second objective of this creation is to provide a low-noise probe head that uses a second ground layer formed between the upper surface and the lower surface of a second substrate to 'separate a power layer from a plurality of probe terminals. In order to form shielding effectiveness [shielding effectiveness], to achieve the effect of reducing noise. The low-noise detection head according to the present invention includes a first substrate, a first substrate, at least a by-pass capacitor, and a plurality of probe terminals. The first substrate has an upper surface and On the lower surface, the first substrate is formed with a first ground layer and at least one receiving cavity. The first ground layer is formed on the upper surface of the first substrate. The receiving cavity is formed on the first substrate. Between the upper surface and the lower surface, the second substrate is disposed on the lower surface of the first substrate, the second substrate has an upper surface and a lower surface, and the second substrate is formed with a power source layer and a A second ground layer is formed between the upper surface of the two substrates and the lower surface of the first substrate. The second ground layer is formed between the upper surface and the lower surface of the two substrates. In the meantime, the bypass capacitor is disposed in the accommodating cavity, and the bypass capacitor is electrically connected to the first ground layer of the first substrate and the power layer of the second substrate when the test signal is being transmitted, When abnormal current is generated, it should be abnormal Current may be connected to the second capacitor via the bypass guide

Page 7 M253771 IV. Creative Instructions (3) &quot;-The first-ground plane of a substrate, to reduce the extent to which the test signal is disturbed by noise. The probe terminals are provided on the second substrate. The lower surface is used to probe the circuit of the product under test. [Embodiment] With reference to the attached drawings, the present invention will enumerate the following embodiment descriptions. According to the first specific embodiment of this creation, please refer to FIG. 1. A low noise detection head 100 series mainly includes a first substrate 110, a second substrate 120, and at least one bypass capacitor 13〇 [by-pass capacit〇r] and a plurality of probe terminals 140, the first substrate 11 () is a silicon substrate, a glass substrate or a ceramic substrate, which has an upper surface 丨 u and a lower surface 丨 丨 2, the first substrate 〇Substrate 110 is formed with a first ground layer 113, at least one receiving cavity 114, and a plurality of positioning slots 115. The first ground layer 丨 3 is a metal foil layer, which is formed on the first substrate. 1 1 〇 upper surface 丨 丨 1, the first ground layer 11 3 is formed after the bypass capacitor 1300 is installed in the accommodating cavity 丨 丨 4, the valley locating cavity 134 is a mine The first substrate 110 is formed by drilling or precision casting. The accommodating cavity 4 is formed between the upper surface 111 and the lower surface 112 of the first substrate 110. In this embodiment, In the accommodating cavity 114, a solder layer 116 is provided, and the positioning slots 115 are formed around the first substrate 110. An adjustment mechanism (not shown in the figure) finely adjusts the position of the probe head 100, the second substrate 120 is disposed on the lower surface 112 of the first base plate 110, and the second substrate 120 is a stone eve The substrate, the glass substrate or the ceramic substrate is preferably the same material as the first substrate 110. The second substrate 120 has an upper surface 121 and a lower surface 122, and the second substrate 120 has a surface Power layer 1 2 3, a second ground 1 2 4, complex

Page 8 M253771 4. Creation instructions (4) Several redistribution traces 125 and a plurality of vias 126. The materials of the power supply layer 123 and §1 first ground layer 1 2 4 are metal layers. The power supply layer 12 3 is formed between the upper surface 121 of the second substrate 120 and the lower surface 112 of the first substrate 110. The second ground layer 124 is embedded in the second substrate by a multi-layer technology. 120, formed between the upper surface 121 and the lower surface 122 of the second substrate 120, the redistribution traces 125 are disposed on the lower surface 122 of the second substrate 120, and the vias 126 are penetrated The upper surface 121 and the lower surface 122 of the second substrate 120 are connected to the redistribution traces 125. The bypass capacitor 130 is disposed in the accommodating cavity 114 of the first substrate 110 and passes through a receiving cavity 114. The process of "ref low" is combined with the solder layer 11 6 and fixed in the accommodating cavity 11 4. The bypass capacitor 1 30 is electrically connected to the first ground layer 113 of the first substrate 110 and the first ground layer 113. The power source layer 123 of the second substrate 120. The probe terminals 140 are disposed on the lower surface I 2 2 of the second substrate 120 and are redistributed with the traces. 1 2 5 is electrically connected for detecting the integrated circuit (not shown in the figure). Preferably, the detection head 100 further includes a third substrate 150, and the third substrate 150 is disposed on the The upper surface 111 of the first substrate 110 is formed with a groove 151 for mounting a dielectric panel 200 for transmitting a test signal. The dielectric panel 200 is formed with a plurality of contact terminals 210. The contact ends 2 10 are electrically connected to the first substrate 1 10. § 4 When an abnormal current is generated during the transmission of the test signal from the probe 1 0 0, the abnormal current can be connected to the first through a bypass capacitor 130 provided in the accommodating cavity 1 1 4 The first ground layer II 3 ′ of the substrate 11 is used to reduce the degree to which the test signal is disturbed by noise. In addition, the second

M253771 IV. Creation instructions (5) The second ground layer 124 of the substrate 120 is formed between the power layer 123 of the second substrate 110 and the probe terminals 140 to form a shielding effectiveness and reduce the power supply. The noise caused by the propagation effect or the scattering effect generated by the layer 21 gains the effect of the low-noise detection head 1000. According to the second specific embodiment of this creation, please refer to FIG. 2. A low-noise detection head 3 0 0 mainly includes a substrate 3 0 and at least a bypass capacitor 320 [by-pass capacitor]. The substrate 310 may be A silicon substrate, a glass substrate, or a ceramic substrate. The substrate 3 10 has an upper surface 311 and a lower surface 312. The upper surface 311 of the substrate 310 corresponds to a dielectric panel 400. The dielectric panel 400 is formed with a metal layer. 410, the lower surface 31 2 of the substrate 310 is used to correspond to the integrated circuit to be tested (not shown in the figure). The substrate 3 10 is formed with a plurality of vias 3 1 3, a plurality of redistribution traces 314, 2 The ground / power layer 315 and at least one receiving cavity 316, wherein the vias 313 penetrate the upper surface 311 and the lower surface 312 of the substrate 31, and connect the redistribution traces 3 1 4 and the redistributions. The trace 31 4 is disposed on the lower surface 312 of the substrate 310 and is electrically connected to a plurality of probe terminals 330. The probe terminals 330 are formed on the lower surface 312 of the substrate 31. The ground / power layer 315 It is embedded in the substrate 31 using the mui t i-layer technology, and It is formed between the upper surface 311 and the lower surface 312 of the substrate 310. The accommodating cavity 315 is formed between the upper surface 3 11 and the ground / power layer 315 of the substrate 31, and is exposed on the substrate 3 On the upper surface 311, a solder layer 317 is disposed in the accommodation cavity 316, and the bypass capacitor 32 is disposed in the accommodation cavity 316 'of the substrate 31 () and combined with the solder layer 317, so that Bypass capacitor

M253771 4. Creation instructions (6) 320 is electrically connected to the ground / power layer 315 of the substrate 310. For example, when the probe 300 is used to test the integrated circuit under test, the dielectric panel 400 is bonded. The probe 300 is connected to the interface panel 400. The capacitor 32 is the gold of the interface panel 400. Two contacts are used to guide the unbalanced current generated during the transmission of the test signal and reduce The degree to which the test signal is disturbed. The scope of protection of this book is defined by the scope of the patent application attached to it. Anyone who is familiar with this skill can make any changes and modifications that do not depart from the spirit and f of this creation, which are all within the scope of protection of this creation. .

Page 11 M253771 Brief description of the drawings [Simplified description of the drawings] Figure 1 ·· Sectional diagram of the head according to the first embodiment of the present creation; and Figure 2 · Section of the head of the second embodiment according to the creation schematic diagram. A low-noise detection A simple description of the low-noise detection element symbol 1 0 0 probe head 11 0 first substrate 113 first ground layer 116 material layer 120 second substrate 123 power layer 126 via 130 bypass capacitor 140 probe End 150 Third substrate 2 0 0 Interface panel 300 Probe head 310 Substrate 31 3 Through hole 31 6 Receiving cavity 320 Bypass capacitor 330 Upper surface of the probe end 111 Receiving cavity 1 21 Upper surface 1 2 4 Second ground layer 151 Groove 21 〇Contact end 311 Upper surface 31 4 Redistribution trace 31 7 Fresh material layer 112 Lower surface 11 5 Positioning slot 1 2 2 Lower surface 1 2 5 Redistribution trace 31 2 Lower surface 31 5 Ground / Power Floor

Page 12 M253771 Brief description of the diagram 400 Interface panel 410 Metal layer Φ Φ ι · ϋΐ Page 13

Claims (1)

M253771 [Scope of patent application] 1. A low-noise detection head, which includes a first substrate having an upper surface and a lower surface. The first substrate is formed with a first ground layer and at least one receiving cavity. A ground layer is formed on the upper surface of the first substrate, and the accommodating cavity is formed between the upper surface and the lower surface of the first substrate; and a second substrate disposed on the first substrate The lower surface of a substrate, the second substrate has an upper surface and a lower surface, the second substrate is formed with a power source layer and a second ground layer, and the power source layer is formed on the upper surface of the second substrate And the lower surface of the first substrate, the second ground layer is formed &gt; formed between the upper surface and the lower surface of the second substrate; at least one by-pass capacitor, Is located in the accommodating cavity of the first substrate, and the bypass capacitor is electrically connected between the first ground layer of the first substrate and the power layer of the second substrate; and a plurality of pull contacts It is arranged on the lower surface of the second substrate for detecting the contact A measurable body circuit 2. The low-noise detection head described in item 1 of the scope of patent application, further comprising a plurality of redistribution traces, which are provided on the lower surface of the second substrate, and the redistributions The traces are electrically connected to the probe terminals. 3. The low-noise detection head described in item 2 of the patent application scope, wherein the second substrate is formed with a plurality of vias, which are connected to the redistributions. / Trace. One-knife- 4. The low-noise detection head as described in item 1 of the patent application scope, further comprising a solder layer, which is disposed in the accommodating cavity. M253771 5. Scope of patent application 5. The low-noise detection head described in item 1 of the scope of patent application, wherein the first substrate is formed with a plurality of positioning slots. 6. The low-noise detection head described in item 1 of the patent application scope further includes a third substrate, which is disposed on the upper surface of the first substrate. 7. The low-noise detection head according to item 4 of the scope of patent application, wherein the third substrate is formed with a groove. 8. The low-noise detection head as described in item 丨 of the patent application scope, wherein the first substrate is selected from the group consisting of a silicon substrate, a glass substrate, and a ceramic substrate. 9. A low-noise detection head, including: A substrate having an upper surface and a lower surface, the substrate is arranged into a ground / power layer and at least one receiving cavity, and the ground / power layer is formed between the upper surface and the lower surface, and the receiving A cavity is formed between the upper surface and the ground / power layer; and at least one bypass capacitor [by_pass capacUr] is provided in the receiving cavity of the substrate, and the bypass capacitor is connected to the substrate of the substrate. The ground / power plane is electrically connected. Wherein, the low-noise detection head accommodating cavity as described in item 9 of the scope of patent application is exposed on the upper surface of the substrate. It additionally includes the low-noise detection head 3 described in the patent scope No. 3-the front layer, which is arranged in the accommodation cavity. Its additional package 12. If the patent application scope No. 9 contains a plurality of probe terminals, it is formed on the base low plate hybrid two probe heads 1 3. Such as the patent application scope No. 2 μ lower surface. The low-noise probe described by the crew member, his other father M253771 5. Scope of patent application Contains a plurality of redistribution traces, which are provided on the lower surface of the substrate. The redistribution traces are electrically connected to the probe terminals. / A 14. The low-noise detection head according to item 3 of the patent application scope, wherein the substrate is formed with a plurality of vias connected to the redistribution traces. 15. The low-noise detection head according to item 9 of the scope of patent application, wherein the first substrate is selected from the group consisting of a silicon substrate, a glass substrate, and a ceramic substrate.