TWI291562B - Structure of probe needle for avoiding noise interference of semiconductor test board - Google Patents

Abstract

The present invention is a structure of semiconductor test board for avoiding noise interference, which includes multiple probe needle layers, multiple spacing plates, multiple grounded isolation needles, and multiple spaces. Each probe needle layer is equipped with multiple probe needles. There is a spacing plate between every two probe needle layers to avoid any noise interference between the probe needle layers and these spacing plates are all grounded. Each one of the grounded isolation needles is individually and electrically connected with a probe needle in certain parts to avoid any noise interference caused between the probe needles in these parts and any probe needle in other parts. There is a space between probe needles in certain parts to increase the distance between the probe needles and avoid any noise interference between probe needles in these parts. Therefore, noise resistance between probe needles can be improved by means of spacing plate, isolation needle, and/or space without changing the original probe needle structure.

Description

1291562 IX. Description of the Invention: [Technical Field] The present invention relates to a probe structure for preventing noise interference of a semiconductor test board, especially by a spacer, grounding A probe structure that isolates the needle and/or the space to increase the anti-noise capability of the probe needle to prevent noise interference. [Prior Art] Press, after the wafer is manufactured, it is necessary to enter the wafer testing stage to ensure that its function is in compliance with the standard. In general, the wafer test uses a u-type machine and a pick-up card (ρΓ〇|^car£J) to test each die on the wafer to ensure that the electrical characteristics and performance of the die are in accordance with the original Design specifications. As wafers become more powerful and complex, high-speed and accurate test requirements are even more important. Furthermore, the probe card is applied to the bare crystal with a probe (pr〇be needle) for functional testing before the integrated circuit (IC) is packaged, and then the subsequent package is performed. Therefore, it is one of the important processes in the integrated circuit 蚨k which has a considerable influence on the manufacturing cost. ^ In the general test process, firstly, the die on the wafer is fixed on the test machine on the test machine, so that the pad on the die half picks up the probe of the pin card, and contact. See also the first and second figures, which are respectively a schematic view of the conventional device and a conventional probe for the semiconductor test board. As can be seen from the figure, the conventional semiconductor test board includes 4 1291562 a circuit board (PCB) 1 〇 a, _ connected 3〇a. The probes 3QH2Qa and the plurality of probes are disposed at the probe holder 2, and the intervals are predetermined to be arranged in a matrix to form a complex number = Td υ a . In addition, the probes a (as shown in the second figure, used for the lining of the wafer (not shown to be connected to the board 1 "he ^ ^ Wo) for different types of performance tests. "Children": 0 ° The proximity of the probes 3〇3 to each other and the relationship between the " analog signals is such that the probes 3 〇a interfere with each other, thereby affecting the test value of the wafer. :: It can be seen from the above that the above-mentioned probes for semiconductor test panels are inconvenient and missing, and can be improved. The inventors have felt that the above-mentioned defects can be improved, and based on many years. Relevant experience in this respect, careful observation and research, and with the use of learning = use, shout out - a reasonable design and effectively improve the above-mentioned missing content [invention content], the technical problem to be solved by the present invention is to provide - use The probe structure for preventing noise (nGise) interference in the semiconductor test board. The invention can be used to increase the probe by means of a spacer, a grounding, and a spacer (SPaCe) #mode'. neecUe) is anti-noise ability here. That is, 6 12 of the present invention 91562 The whole product f; In addition, under the "following the original normal body grasping needle structure", it can achieve the advantage of cost saving. 'Chong i solved the above technical problem, according to one of the aspects of the invention A (: Oise) a plurality of , , , , , , , , , , , ,

The ' is used to prevent noise interference between the probe layers. The isolation of the female pin layer, the portion of the scale probe can be grounded (gnnmding) etc. to isolate the noise interference between the other part of the probe; in addition, the other. The file system can be a space 'to increase another part of the probe's interference; the other distance ^ is used to isolate the other part of the probe between the noise and the low part of the neighboring needle. Large needle diameter, used to drop _ X. The resistance of the probe is divided and the working efficiency of the probe is increased. In order to solve the above technical problems, one of the parties according to the present invention

探 — 观 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体 半导体Isolation needle. Wherein, the grounded isolation pin probe pq is connected to the probe portion of the probe, and the noise interference between the pin and the pin is blocked. In order to solve the above-mentioned technical problems, one of the methods according to the present invention is for preventing noise (nGise) interference in a semiconductor test board, which includes: a plurality of probe needles and a plurality of (a) (space). Wherein, the spacers are respectively disposed on a part of the probes 1291562::3: increase: the distance between the probes is used to isolate the noise interference between the needles. The Director of the U.S. Member, and further understanding of the present invention, for the purpose of achieving the pre-existing, widely-received means, means and effects, please refer to the following regarding the present invention, the drawings 'believe the purpose, features and characteristics of the present invention, The test and the passer-by and the specific understanding, however, the only way to provide the reference is to use the 'not intended to limit the invention. [Embodiment] It is shown in the third figure, which is the p!·h diagram of the section plate of the first embodiment of the probe structure for the semiconductor test board showing =r(noise) interference. It is to be understood that the present invention provides a probe structure for semiconductor testing to prevent noise interference, comprising: a plurality of, a probe needle layer and a plurality of separators 2. In the case of f, the semiconductor test board can be a probe card. = = has a plurality of electrical connections to the semiconductor test board, and the probes 1 are respectively arranged and arranged in a matrix. In addition, one of the jT '〇· parts has a larger needle furnace rate than the general needle diameter d:: between the low and the increase, used to prevent the probe layer i between (4): ten layers 1 of 2 For the metal material with noise shielding effect, please refer to the fourth figure, which is the example of the probe structure for the nGise interference of the semiconductor test board 1291562. The detection of noise interference of the board is controlled by = conductor test = ΡΓΐΓ? and a plurality of grounding 3 ^ pin 3. Among them, the grounding isolation pin 3 = the part of the probe 1 Q is used to isolate the jI9 from the connection In addition, the probe 1 Q-part: "the larger diameter of the needle D" is used to reduce the efficiency of the probe. Please refer to the fifth figure for the resistance value and the increase of the part. It is a probe for preventing noise interference. It is used to prevent noise (η-) interference on the +¥ body test board. Probe: a kind of conductor test probe (pr〇beneedle) χ ◦ and a plurality of 匕冓 ' ” plural ^ ΒΙ 4 #, &quot; ( SP ^ ° ^ ^ ^ : r: r ^ '讯干'. These probes 1 have a larger needle diameter D, which is used to reduce the working efficiency of the needle part of the === needle. The resistance value of the leaf and the pong plus are shown in the sixth figure. The probe for preventing noise interference is used in the schematic diagram of the semiconductor test board. The figure can be σ; the fourth embodiment is the profile of the fourth embodiment of the semiconductor test board to prevent noise (_) The secret structure of turbulence, including: a plurality of probes (Pn> be needle) layer \ !291562 a plurality of spacers 2, a plurality of memory from < λ number of spaces (ah 也 4 also (also - isolated needle) 3 and the retransmission (4) its it 'mother reading layer 1 has a reduced electrical connection to the circuit board of the half V body test board (圄去_, ^ 侍八别瑕 (图未未) probe 10 The partitions 2 Ί; wide And placed between the two probe layers 1 of the mother, for preventing the probe layers from being connected to the probes 1 部 部 刀 别 〇 〇 之 。 。 。 。 。 。 。 。 。 。 。 Isolating another part of the probe 1 and then the spacers 4 are respectively disposed between the probes of the - part = the needle 10 to increase the part of the distance between the probes for isolating the part of the probes Neighboring eight grandchildren and ancient / ή interference. In addition, 'the probes 1 〇 heart system has a larger pinch d d-knife probe than the general needle diameter d to increase the reading efficiency of the reading. The embodiment can be seen that the invention can be used according to the needs of the user, and the anti-noise effect is the same as that of the user. In order to achieve the test wafer, the material can not be produced by the ^^^ =, grounding (gr_ding) isolation needle 3 structure, the bad 4 special way to increase the probe mutual interference between the space probes will not be due to this, without changing the original The quality of the whole probe holder two If; the other advantages. v,, more cost-effective 3 This 'this hair is for the inevitable invention σ and progress, fully in line with hair Ming special mouth., very novel A 4 elements, Jiang Yi patent law mention 10 1291562 Detailed description and drawings, but the embodiment of the present invention "Π - specific examples, cover *===围·思之之Change or repair;:= [Simple description of the diagram] The first diagram is a schematic diagram of the top of the semiconductor test board; ^The schematic diagram of the probe of the semiconductor board is taken; the third picture is the date of the fourth (four) A schematic cross-sectional view of a first embodiment of a probe structure for preventing noise (sampling) in a semiconductor test board; and a fourth fourth embodiment of the present invention for preventing noise in a semiconductor test board BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a cross-sectional view showing a third embodiment of a probe structure for preventing noise in a semiconductor test board of the present invention; and a sixth figure A cross-sectional view of a fourth embodiment of a plate needle structure for preventing noise (nΜ%) interference in a semiconductor test board is invented. [Main component symbol description] [Practical] 1291562

Circuit board 10a Probe holder 20a probe [Invention] 3 0 a Probe layer Probe layer 1 Probe Separator 2 Grounded isolation needle 3 Space 4 Needle diameter d, D

Claims (1)

B repair (more) is replacing page 1291562 X. Patent application scope · 1 :: Detection of noise interference on the test board: n (probe needle) layer, in which each probe, the part of the probe is formed as a space (one plus, and some of the probes The distance from each other, and the other: the noise interference between the knife and the needle, and the probe of the part has a larger needle diameter to reduce the working efficiency of the probe of the part of the probe; And a plurality of spacers of the portion, the fractal 4 being between each of the two probe layers to prevent noise interference between the probe layers. 2. For use in claim 1, as described in claim 1 A probe structure for suppressing noise interference of a semiconductor test board, wherein the half-proof board is a probe card, and is reduced by 3, as described in claim 1 Semiconductor test board A noisy interference probe structure in which the probes are connected to the circuit board (PCB) of the semiconductor test board. ', electric 4, the probe structure for the noise interference of the semiconductor test board according to claim 1, wherein the probe systems are spaced apart from each other by a predetermined distance, and Arranged in a matrix manner, 77. The probe structure for noise interference of a semiconductor test board as described in claim 1, wherein the = part of the probes is grounded ( Grounding) is used to isolate noise interference between another part of the probe. 13 1291562 7 10 1 1 婳 炅 炅 ------ ------ ------ ------ ------ ------ — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — The separator is made of a metal material. A probe structure for preventing noise interference of a semiconductor test board, comprising: &amp;probe needles, wherein a part of the probe has a larger needle diameter for Reducing the resistance of part of the probe and increasing the working efficiency of the part of the needle; and the plurality of grounding (g brain nding) secret needles, which are used in the part of the probes to isolate the other part of the probe Interference. ^ A probe structure for preventing a 2 (her e) interference of a semiconductor test board as described in claim 7 wherein the semiconductor test board is a pr〇becard. A probe structure for preventing interference of a semiconductor test board as described in claim 7 wherein the probes are electrically connected to a circuit board (PCB) of the semiconductor test board. a probe structure for interfering with a semiconductor test board according to claim 7 of the invention, wherein the probes are at a predetermined distance and arranged in a matrix. to make. 2: The probe for preventing noise (nGise) interference for the semiconductor test board described in item 7 of the scope is divided into a plurality of layers of the remaining needle. / Track needle system, such as applying for full-time SJ 帛 shape semiconductor test board 1291562 , /, (noise) interference probe structure, 1 spacer, which is placed in each of the two probe layers, including: noise interference between the probe layers such as stagnation. 3. The probe test plate for preventing noise interference described in the ::: Patent Application No. 2 item is made of a metal material. /, the partitions 14 in the semiconductor test board to prevent noise (n〇ise) dry wood needle structure, including: ^ interference of the complex coffee *), part of the probe for the isolation needle In order to isolate the noise interference between the other parts of the probe, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Spaces are respectively disposed at the top of the probe to increase the distance between the probes and the noise interference between the probes. ^ _ 1 1 1 、 、 、 、 、 、 、 、 、 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针Probe card. The probe structure for preventing noise interference of a semiconductor test board according to claim 14, wherein the probes are electrically connected to the circuit board of the semiconductor test board. (PCB). 1 . The probe structure for preventing noise interference of a semiconductor test board according to claim 14 of the patent application, wherein the probes are spaced apart from each other by a predetermined distance and are in a matrix The way is arranged and 15 1291562 • Θ月曰曰 (more) is replacing the page. A probe structure for preventing noise interference of a semiconductor test board as described in claim 14 of the patent application, wherein the probes are divided into a plurality of probe layers. 19. The probe structure for preventing noise interference of a semiconductor test board according to claim 18, further comprising: a plurality of spacers respectively disposed on each of the two probes Between the layers, to prevent noise interference between the probe layers. A probe structure for preventing noise interference of a semiconductor test board as described in claim 14 of the patent application, wherein the spacers are made of a metal material. 16