201032242 六、發明說明： 【發明所屬之技術領域】 本發明是關於金屬板低電阻片形電阻器’及以較高且 高精度地實現其電阻値的方法。 【先前技術】 在合金所構成的板狀金屬電阻體的兩端形成有電極膜 φ 的低電阻的片形電阻器傳統上被使用。在此種金屬板低電 阻片形電阻器中，期望有以高精度實現較高的電阻値的15 至 5 0m Ω。 作爲金屬板低電阻片形電阻器的製造方法，例如日本 專利第3 846987號（JP-3 846987-B)所述地，有藉由點焊 法進行接合作爲電極的銅板，及藉由蝕刻法或利用金屬模 所作的沖切所製成的模的電阻金屬板，而利用傳遞模塑予 以封裝的方法，然而，點焊電阻金屬板，及作爲電極的銅 φ 板，或是利用傳遞模塑予以封裝’成爲很難得到低高度及 減低製造成本的情形。又，在金屬板低電阻片形電阻器被 通電時，在電阻金屬板會發生局部過熱的情形，而也有降 低可靠性的課題。 作爲與上述者不相同的製造方法，例如在日本專利公 開 2006-19669 號（JP-2006-19669-A)，記載著電極部與 電阻部的底層是使用同一的電阻金屬板，而在電阻部刻設 寬度極窄的開縫以提高電阻値的方法。又，有在電阻部塗 佈保護膜，而電極部是利用覆蓋法等接合銅板而形成的方 -5- 201032242 法。然而，在電阻部刻設寬度極窄的開縫以提高電阻値的 情形，在片形電阻器有電流被接通時，則在電阻金屬板也 發生局部過熱，而有降低可靠性的缺點，還有，電極部是 利用覆蓋法來接合銅板之故，因而仍然很難低成本地加以 製造。 又，作爲金屬板低電阻片形電阻器的其他製造方法， 如日本專利公開平1 1 -3 804號（JP- 1 1 -3 804-A)所述地， 在電阻金屬開設多種形狀的穴以提高電阻値，又利用變更 其尺寸。以調節電阻値，而爲了在電極部保證焊鍚濕潤性 ，形成鍍銅及鍍鍚膜，而隱住穴而可保持自立性的方式來 進行封裝者。在該製造方法中，電阻値會上昇，惟利用進 行封裝，會使零件的高度變高。現在，對於零件的低高度 的期望很大，惟有無法對應於客戶之要求，而且有調節電 阻値的過程變成煩雜的問題。 【發明內容】 本發明是鑑於如以上的現狀而被提案者，其目的是在 於提供在大約15至50m Ω範圍而具有高可靠性，成爲低 高度的金屬板低電阻片形電阻器。 又，本發明的其他目的，是在於提供藉由較簡單又連 續性工序，以高精度，且高良率可製造具有大約15至 50ιηΩ的範圍的特定電阻値的金屬板低電阻片形電阻器的 製造方法。 在本發明中，利用以下所述的（1 )至（7 )的手段， -6 - 201032242 使得上述課題被解決。 (1) —種金屬板低電阻片形電阻器，其特徵爲：具 備：金屬電阻板，及分別形成於該金屬電阻板的兩端的電 極膜，及爲了覆蓋金屬電阻板而形成於兩電極膜間的保護 膜，上述金屬電阻板是長方形的兩側邊的所定位置形成缺 口的形狀，在上述金屬電阻板的兩端部，以所定寬度分別 形成有上述電極膜於端邊側，上述金屬電阻板的無電極膜 φ 的領域設置作爲電阻部，該電阻部中兩側無缺口的部位作 爲電阻値調整部，而該電阻部中兩側有缺口的部位作爲電 阻値固定部，上述保護膜是覆蓋上述金屬電阻板的表面， 而且裝滿上述電阻値固定部的兩側方而形成與兩端部相同 寬度者。 (2) 上述（1)所述的金屬板低電阻片形電阻器中， 上述電阻値固定部是長度形成比寬度還要大者。 (3) —種金屬板低電阻片形電阻器的製造方法，其 • 特徵爲：具備：在所定尺寸的金屬電阻板以所定間隔直線 狀地形成複數貫通溝的工序；及在貫通溝間以所定間隔形 成排列成一列的複數穴的工序；及以保護膜被覆除了上述 貫通溝兩側的所定寬度以外的領域以堵住上述複數穴的保 護膜形成工序；及在從上述金屬電阻板的貫通溝一直到上 述穴爲止的領域中，在穴的兩側設置無電極膜的領域，而 且在有貫通溝的一側以所定寬度形成電極膜的電極膜形成 工序；及在上述保護膜形成工序及上述電極膜形成工序之 後，沿著上述貫通溝進行切斷金屬電阻板而形成帶狀金屬 -7- 201032242 電阻板的帶狀切斷工序；及在設有上述穴的部分朝短邊方 向切斷帶狀金屬電阻板以形成片狀金屬電阻板的片狀切斷 工序，在該片狀切斷工序中，以可得到具備所期望的電阻 値的片狀金屬電阻板的方式，決定帶狀金屬電阻板的切斷 寬度。 (4) 一種金屬板低電阻片形電阻器的製造方法，其 特徵爲：具備：在帶狀金屬電阻板以所定間隔形成排列成 一列的複數穴的工序：及在帶狀金屬電阻板的中央長邊方 ^ ❹ 向形成保護膜以堵住上述複數穴的保護膜形成工序；及在 從上述金屬電阻板的兩側邊一直到上述穴爲止的領域中， 在穴的兩側設置無電極膜的領域，而且在側邊側以所定寬 度形成電極膜的電極膜形成工序；及在設有上述穴的部分 朝短邊方向切斷帶狀金屬電阻板以形成片狀金屬電阻板的 片狀切斷工序，在該片狀切斷工序中，以可得到具備所期 望的電阻値的片狀金屬電阻板的方式，決定帶狀金屬電阻 板的切斷寬度。 © (5) 上述（3)或上述（4)所述的金屬板低電阻片 形電阻器的製造方法中，在上述保護膜形成工序中，將片 狀或帶狀的有機系樹脂材料設置於金屬電阻板的兩面’藉 由一面施加壓力一面施以焊著以形成保護膜。 (6) 上述（3)或上述（4)所述的金屬板低電阻片 形電阻器的製造方法中，上述片狀切斷工序是包含：在設 有上述穴的部分朝短邊方向切斷帶狀的金屬電阻板以形成 片狀金屬電阻板的工序；及測定該片狀金屬電阻板的電阻 -8- 201032242 値的測定工序；及使用上述測定値進行演算，可得到具備 所期望的電阻値的片狀金屬電阻板的方式，算出下一切斷 工序的帶狀金屬電阻板的切斷寬度的演算工序，以在先前 演算工序所算出的切斷寬度朝短邊方向切斷帶狀金屬電阻 板，測定利用此所形成的一個片狀金屬電阻板的電阻値， 使用所測定的電阻値進行演算，可得到具備所期望的電阻 値的片狀金屬電阻板的方式，算出下一切斷工序的帶狀金 φ 屬電阻板的切斷寬度。 (7)上述（3)或上述（4)所述的金屬板低電阻片 形電阻器的製造方法中，上述片狀切斷工序是包含：在設 有上述穴的部分朝短邊方向切斷帶狀的金屬電阻板以形成 片狀金屬電阻板的工序；及測定該片狀金屬電阻板的電阻 値的測定工序；及使用上述測定値進行演算，可得到具備 所期望的電阻値的片狀金屬電阻板的方式，算出下一切斷 工序的帶狀金屬電阻板的短邊方向的切斷寬度的演算工序 • ，利用先前演算工序所算出的切斷寬度朝短邊方向兩次切 斷帶狀金屬電阻板，分別測定利用此所形成的兩個片狀金 屬電阻板的電阻値並算出平均値，使用上述平均値進行演 算，可得到具備所期望的電阻値的片狀金屬電阻板的方式 ，算出下一切斷工序的帶狀金屬電阻板的切斷寬度。 又，在上述（3)的金屬板低電阻片形電阻器的製造 方法中，也可同時地進行著在所定尺寸的金屬電阻板以所 定間隔直線狀地形成複數貫通溝的工序，及在各貫通溝間 以所定間隔形成排列成一列的複數穴的工序。例如藉由蝕 -9- 201032242 刻法或利用金屬模所作的沖切法’可將複數貫通溝與複數 穴同時地形成於金屬電阻板，又作爲不相同工序也可依次 形成。 在本發明的金屬板低電阻片形電阻器中，藉由在金屬 電阻板的所定位置設有窄寬度的電阻値固定部，可得到電 阻値槪略上昇，而在金屬電阻板的兩端部設有無電極膜的 領域，在製造金屬板低電阻片形電阻器時，利用稍微調整 該兩端部的寬度就可微調電阻値，成爲可將電阻値以高精 度設定在所定範圍，例如成爲可設定在15至5 ΟπιΩ左右 範圍的特定電阻値。又金屬電阻板的電阻値固定部是寬度 比兩端部稍窄小，惟電阻固定部是長度形成比寬度還要大 者，電阻値固定部是與兩端部相同厚度，並不是如傳統的 金屬板低電阻片形電阻器地，設有孔溝或開縫者之故，因 而可防止發生局部過熱而具有可靠，又在物理上也可確保 充分的強度。 在本發明的金屬板低電阻片形電阻器的製造方法中， 使用著所定尺寸的金屬電阻板或是帶狀的金屬電阻板的任 一方，由此些金屬電阻板，以所定間隔形成有複數穴，且 設有保護膜及電極膜的帶狀金屬電阻板被製造作爲中間加 工品，而在有穴的位置朝短邊方向切斷該帶狀的中間加工 品以形成片狀電阻器者，藉由適當調整該切斷寬度，可製 造出具備所期望的電阻値的金屬板低電阻片形電阻器。 亦即，設於金屬電阻板的穴，是在帶狀中間加工品被 切斷而成爲片狀金屬電阻板時，成爲上述（1)的金屬電 -10- 201032242 阻板的缺口部分，藉此形成有窄寬的電阻値固定部，以得 到電阻値的槪略上昇。又，帶狀的中間加工品的無穴部分 是被切斷時，成爲上述（1)的金屬電阻板的兩端部’而 該兩端部的寬度是亦即帶狀中間加工品的切斷寬度之故， 因而，尤其是藉由兩端部的無電極膜的領域，金屬板低電 阻片形電阻器的電阻値是被微調成爲所定範圍。作成如此 ，成爲作爲金屬板低電阻片形電阻器的電阻値以高精度可 φ 設定在例如15至50m Ω左右範圍的較高的特定電阻値的 目標電阻値。 在本發明的金屬板低電阻片形電阻器的製造方法中， 以所定間隔形成複數穴，且設有保護膜及電極膜的帶狀金 屬電阻板被製造作爲中間加工品，在有穴的位置，且相當 於一個片狀電阻器的所定切斷寬度（初期設定値）朝短邊 方向切斷該帶狀中間加工品而形成片狀金屬電阻板（片狀 加工品），測定該片狀加工品的電阻値，使用該測定値進 • 行演算，可得到具備所期望的電阻値的片狀加工品的方式 ，算出下一切斷工序的帶狀中間加工品的短邊方向的切斷 寬度。 然後，在所算出的切斷寬度且有穴的位置朝短邊方向 一次或兩次切斷帶狀中間加工品以形成片狀加工品，測定 片狀加工品的電阻値，使用該測定的一個電阻値，或是兩 個電阻値的平均値，進行算出下一切斷工序所用的切斷寬 度。之後，藉由同樣地重複切斷工序，電阻値的測定工序 及切斷寬度的算出工序進行製造片狀加工品，而從電阻値 201032242 爲容許範圍內的片狀加工品進行製造金屬板低電阻片形電 阻器者。 因此，設於金屬電阻板的穴是被切斷而成爲片狀金屬 電阻板時，成爲兩側邊的缺口部分，藉此形成有窄寬的電 阻値固定部，以得到電阻値的槪略上昇。又’帶狀的中間 加工品的無穴部分是被切斷時，成爲上述（1)的金屬電 阻板的兩端部，而該兩端部的寬度是亦即帶狀中間加工品 的切斷寬度之故，因而，尤其是藉由兩端部的無電極膜的 領域，金屬板低電阻片形電阻器的電阻値是被微調成爲所 定範圍。 亦即，在本發明中，對於帶狀中間加工品的短邊方向 的切斷寬度，是因應於在前一工序所形成的一個或兩個片 狀加工品的電阻値經常地被修正之故，因而片狀加工品的 電阻値是以極高精度可控制在容許範圍內，從片狀加工品 所製造的金屬板低電阻片形電阻器的良率也成爲極高者。 在本發明中，藉由較簡單又連結性的工序，而可製造出高 精度的低電阻的金屬板低電阻片形電阻器。 【實施方式】 以下，參照圖式針對於本發明的實施形態進行說明， 惟本發明是並不被限定於此者》 第1(a)圖是表示本發明的金屬板低電阻片形電阻器 10的俯視圖，第1(b)圖是表示沿著B-B線所切斷的斷 面圖’第1 (c)圖是表示沿C-C線所切斷的斷面圖，第1 -12- 201032242 (d)圖是表示構成金屬板低電阻片形電阻器1〇的金屬電 阻板11的俯視圖。金屬板低電阻片形電阻器1〇是在合金 所構成的金屬電阻板11的兩端表背形成有電極膜12，而 在兩端的電極膜12間形成有保護膜13者。 在此，如第1(d)圖所示地，上述金屬電阻板π是 在側邊11a與端邊lib所形成的長方形中，兩側邊iia的 大約中央形成缺口的形狀，而在該缺口部llc大約中央形 φ 成有寬度比兩端部lid還要窄小的領域lie,亦即形成電 阻値固定部lie。該電阻値固定部iie是作成長度L比寬 度W還要大者。又，金屬電阻板11是例如藉由包含鐵， 鉻及鋁的合金，或是包含鎳及鉻的合金可形成。 上述電極膜12是從金屬電阻板11的端邊116以所定 寬度形成在表背面及端面，在接近於兩端部lid的缺口部 lie的一側設有無電極膜12的領域Ilf。如下述地，該兩 端部lid的無電極膜12的領域Ilf，是功能作爲電阻値調 φ 整部Uf。又，作爲電極膜12，積層Ca膜、Ni膜及Sn膜 可形成》 上述保護膜13是由保護膜下層13a與保護膜上層13b 所構成，該保護膜下層13a是例如將具有感光基的樹脂製 片壓接於金屬電阻板11的表背面經熔融之後，藉由光罩 被覆所定部而經由曝光，顯影的照相化學腐蝕製造法的手 段，藉此從形成有電極膜12的領域加以除去所形成。保 護膜下層13a是塡滿金屬電阻板11的缺口部lie’如第1 (a )圖所示地，將金屬板低電阻片形電阻器1 〇的外形作 -13- 201032242 成大約矩形。又，保護膜上層13b是例如由保護膜下層 13a上，藉由網印法來塗佈環氧樹脂糊，藉由將此予以硬 化所形成。 第2圖是表示本發明的金屬板低電阻片形電阻器10 的製程的帶狀中間加工品20的俯視圖。在帶狀金屬電阻 板11，隔著所定間隔形成有複數矩形的穴21，在帶狀的 金屬電阻板11的兩側長邊方向形成有電極膜12，而在表 背中央部的長邊方向形成有保護膜13。 在本發明的製造方法中，以一點鏈線22表示該帶狀 的中間加工品20的方式，在有穴21的位置朝短邊方向以 所定的切斷寬度Wn進行切斷該帶狀的中間加工品20 ’以 形成片狀加工品An者，而在片狀加工品An施以爲了更製 品化的些微工序，形成有作爲完成品的金屬板低電阻片形 電阻器1 〇。 如此地，帶狀中間加工品20是在有穴21的位置被切 斷之故，因而在該切斷工序中，不管第1圖的金屬板低電 阻片形電阻器10的電阻固定部lie的寬度或長度，因應 於切斷寬度wn僅增減電阻値調整部Ilf的寬度’藉此使 得金屬板低電阻片形電阻器10的電阻値會增減而被微調 。亦即，切斷寬度wn是直接成爲電阻値調整部Ilf的寬 度者，若增加該切斷寬度wn，則可些微地降低電阻値’ 相反地，若減小切斷寬度wn，則可些微地上昇電阻値。 一方面，金屬板低電阻片形電阻器10是在其製程中 ，若調整設於金屬電阻板1 1的穴2 1的大小或間隔’則可 -14- 201032242 設定電阻値固定部lie的寬度或長度，藉此，可得到金屬 板低電阻片形電阻器1 〇的電阻値的槪略上昇。 如以上地，金屬板低電阻片形電阻器1 0是利用電阻 値固定部1 1 e可得到電阻値的槪略上昇，而利用電阻値調 整部1 1 f的寬度可得到電阻値的微調。 以下，針對於本發明的金屬板低電阻片形電阻器10 的製造方法加以說明。 φ 在本發明的金屬板低電阻片形電阻器的製造方法中， 在如第3 ( a )圖所示地所定尺寸的金屬電阻板20 A，利用 蝕刻法或利用金屬模所作的沖切法，以所定間隔直線狀地 形成複數貫通溝22，同時地，在此些貫通溝22之間以所 定間隔排列成一列地形成長方形的複數穴21。又，在第3 (a)圖中作爲金屬電阻板20A表示長方形的平面形狀者 ，惟其平面形狀或尺寸是可適當選擇，如第3(b)圖所示 地使用帶狀金屬電阻板20B也可以。在帶狀金靨電阻板 2 0B中，長方形複數穴2 1是也以所定間隔形成排列成一 列。 第4(a)圖至第4(c)圖是表示擴大第3(a)圖的 俯視圖及斷面圖，如此地形成有穴21與貫通溝22的金屬 電阻板20A，是形成在如第1 (d)圖的一個金屬板低電阻 片形電阻器10時，穴21成爲缺口部11c’穴21與穴21 之間的領域成爲電阻値固定部lie，而穴21與貫通溝22 之間成爲兩端部lid。藉由將具有感光基的樹脂製片壓接 於如此地形成有穴21與貫通溝22的金屬電阻板20A的表 -15- 201032242 背兩面全領域經由熔融，將此塡滿於穴21，而被接著於金 屬電阻板20 A的表面。藉由光罩被覆所定部而經由曝光， 顯影的照相化學腐蝕製造法等的手段，將該樹脂製片，從 貫通溝22的兩側所定寬度，亦即從形成有電極膜12的領 域加以除去，如第4(d)圖至第4(f)圖所示地，形成 有保護膜下層13a。該保護膜下層13a是塡滿金屬電阻板 20 A的穴21，被覆設於穴21的兩側所定寬度的電阻値調 整部Ilf的領域。 又，從保護膜下層13a上，藉由網印法塗佈環氧樹脂 糊，將此予以乾燥使之硬化，如第5(a)圖所示地形成有 保護膜上層13b。 之後，在貫通溝22的兩側中，在未形成有保護膜下 層13a及保護膜上層13b的領域，藉由積層Cu膜、Ni膜 及Sn膜形成電極膜12。電極膜12是從金屬電阻板20A 的貫通溝22以所定寬度形成於表背面及端面，而在金屬 電阻板20 A的兩端部lid的有穴21的一側未設有電極膜 12，此爲如上述地以保護膜下層13a及保護膜上層13b所 覆蓋，而該無電極膜12的領域成爲電阻値調整部Ilf。 在金屬電阻板20A形成電極膜12之後，若沿著貫通 溝22進行切斷，則形成有如第2圖所示的帶狀中間加工 品20。 又，在使用如第3(b)圖所示的帶狀金屬電阻板20B 時，也以所定間隔排列成一列地形成長方形的複數穴2 1， 而在帶狀金屬電阻板20B的中央長邊方向形成樹脂製片所 201032242 構成的保護膜下層13a，堵住複數穴21而且以所定寬度被 覆穴2 1的兩側領域，而在穴2 1的兩側領域確保電阻値調 整部Ilf。又，在保護膜下層13a上設置保護膜上層13b 而在形成保護膜13之後，在未形成保護膜13的側邊側’ 積層Cu膜、Ni膜及Sri膜而形成電極膜12’則可形成與 上述同樣的帶狀中間加工品20。 以下，針對於算出帶狀中間加工品20的切斷寬度Wn φ 的方法加以說明。 朝短邊方向以所定切斷寬度W"進行切斷第2圖的帶 狀中間加工品2 0，形成片狀加工品An時’則其電阻値是 藉由下面理論式（1)可進行計算。 R = Ra + Rb + Rb? =p X{Ll/(W!t)}+ p x{L2/(w2t)}+p x{L25/(w2t)} =P /t X { L 1/w 1+L2/W2 + L2 5 / W2 }..................式（1) 在此，電阻部是如第6圖所示地由電阻固定部a與電 阻値調整部b、b’所構成’而全電阻値（R)是表示作爲電 阻値固定部（a)的電阻値（Ra) ’及電阻値調整部b的 電阻値（Rb )，及電阻値調整部b’的電阻値（Rb’）的總 和。 P是體積電阻率，t是金屬電阻板的厚度，W2是相當 於第2圖的切斷寬度Wn。 以下是針對於切斷帶狀中間加工品2 0 ’以形成片狀加 -17- 201032242 工品An的工序加以說明。 在金屬板低電阻片形電阻器的製造裝置（未予圖示） 輸入初期値。就初期値是例如可列舉切斷寬度的容許最小 値，切斷寬度的容許最大値，電阻値測定的頻度，切斷寬 度變更的頻度’目標電阻値，及對於一枚帶狀中間加工品 的切斷次數。 輸入初期値之後，從容許最小値wmin，容許最大値 wmax的平均値（wrain + wmax ) /2，求出第1次的切斷寬度 )之後，以該切斷寬度W!進行切斷中間加工品20，以 形成片狀加工品，測定其電阻値R!，而由電阻値I及 作爲目標的電阻値R的偏差，利用理論式（1)算出第2 次的切斷寬度W2。 在初期値的輸入工序中，將電阻値測定的頻度作爲1 ，而將切斷寬度變更的頻度作爲1時，則第2個以後的片 狀加工品An的形成工序是以切斷寬度\\^進行切斷帶狀中 間加工品20，測定由此所得到片狀加工品An的電阻値Rn ，而由該電阻値Rn，及作爲目標的電阻値R之偏差，來 算出形成第n+1個的片狀加工品 Αη+ι之際的切斷寬度 Wn+i，以上工序爲每當形成一個片狀加工品就被重複，一 直實施至作爲初期値所輸入的切斷次數爲止。 又在初期値的輸入工序中，將電阻値測度的頻度作爲 2，而將切斷寬度變更的頻度作爲2時，則在第2個以後 的片狀加工品的形成工序中，以相同切斷寬度Wn進行切 斷帶狀中間加工品20，以形成片狀加工品 An、An+1。一 -18- 201032242 個一個地測定此些晶片加工品An、An+1的電阻値Rn、 Rn + i，進行演算此些電阻値Rn、Rn+1的平均値，由該平均 値及作爲電阻値R，利用理論式（1)進行算出切斷寬度 Wn + 2。又，連續於片狀加工品An、An+1所形成的兩個片 狀加工品An + 2、An + 3，是以相同切斷寬度Wn + 2從帶狀中 間加工品20進行切斷。以上的工序是每當形成兩個片狀 加工品就被重複，一直實施至作爲初期値所輸入的切斷次 數爲止。 如以上所得到的片狀加工品An，爲經由製品化所用的 多少工序，成爲作爲完成品的金屬板低電阻片形電阻器1 〇 【圖式簡單說明】 第1(a)圖是表示本發明的金屬板低電阻片形電阻器 的俯視圖，第1 ( b )圖是表示沿著B_B線所切斷的斷面 φ 圖，第1 ( c )圖是表示沿著C-C線所切斷的斷面圖，第1 (d)圖是表示構成金屬板低電阻片形電阻器的金屬電阻 板的俯視圖。 第2圖是表示本發明的金屬板低電阻片形電阻器的製 程的帶狀中間加工品的俯視圖。 第3(a)圖是表示特定尺寸的金屬電阻板20A的俯 視圖，第3(b)圖是表示帶狀金屬電阻板20B的俯視圖 〇 第4(a)圖至第4(f)圖是表示本發明的金屬板低 -19- 201032242 電阻片形電阻器的製程的俯視圖或斷面圖。 第5g是表示連續於第4圖的製程的2 第6圖，用以說明算出帶狀中間加工f 理論式的圖式。 序的斷面圖。 1的切斷寬度的 【主要元件符號說明】 10:金屬板低電阻片形電阻器 11 :金屬電阻板 1 1 a :側邊 Ub :端邊 1 lc :缺口部 1 1 d :兩端部 1 1 e :電阻値固定部 1 1 f :電阻値調整部 12 :電極膜 13 :保護膜 13a :保護膜下層 13b :保護膜上層 20 :帶狀中間加工品 2 0A:所定尺寸的金屬電阻板 20B :帶狀金屬電阻板 2 1 :矩形穴 22 :貫通溝 An:利用第η次的切斷所形成的片狀 e 工品 -20- 201032242BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal plate low-resistance chip resistor ’ and a method for realizing its resistance 较高 with high precision and high precision. [Prior Art] A low-resistance chip resistor in which an electrode film φ is formed at both ends of a plate-like metal resistor formed of an alloy is conventionally used. In such a metal plate low resistance chip resistor, it is desirable to have a high resistance 値 of 15 to 50 m Ω with high precision. As a method of manufacturing a metal plate low-resistance chip resistor, for example, as described in Japanese Patent No. 3 846 987 (JP-3 846987-B), there is a copper plate bonded as an electrode by spot welding, and by etching Or a die-casting metal plate made by die-cutting using a metal mold, and a method of packaging by transfer molding, however, spot-welding a metal plate, and a copper φ plate as an electrode, or using transfer molding Packaging it's a situation where it is difficult to obtain low height and reduce manufacturing costs. Further, when the metal plate low-resistance chip resistor is energized, local overheating occurs in the resistance metal plate, and there is a problem that reliability is lowered. As a manufacturing method which is different from the above, for example, Japanese Patent Publication No. 2006-19669 (JP-2006-19669-A) discloses that the bottom portion of the electrode portion and the resistor portion is made of the same resistive metal plate, and the resistor portion is used. A method of engraving a slit having a very narrow width to increase the resistance 値. Further, a protective film is applied to the resistor portion, and the electrode portion is formed by bonding a copper plate by a cover method or the like - the method of -5-201032242. However, in the case where the resistor portion is provided with a slit having a very narrow width to increase the resistance 値, when the current of the chip resistor is turned on, local overheating also occurs in the resistive metal plate, and the reliability is lowered. Further, since the electrode portion is joined by the covering method by the covering method, it is still difficult to manufacture at low cost. Further, as another method of manufacturing a metal plate low-resistance chip resistor, as described in Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei No. Hei No. Hei No. Hei No. Hei No. Hei No. Hei. In order to increase the resistance, the size is changed. In order to adjust the resistance 値, in order to ensure the wettability of the solder joint in the electrode portion, a copper plating and a ruthenium plating film are formed, and the hole can be hidden to maintain the self-standing property. In this manufacturing method, the resistance 値 rises, but by using the package, the height of the part becomes high. Nowadays, the low height of the parts has great expectations, but it cannot meet the requirements of the customer, and the process of adjusting the resistance 变成 becomes a cumbersome problem. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a metal plate low-resistance chip resistor having a high reliability and a high reliability in a range of about 15 to 50 m Ω. Further, another object of the present invention is to provide a metal plate low-resistance chip resistor having a specific resistance 大约 having a range of about 15 to 50 η Ω with high precision and high yield by a relatively simple and continuous process. Production method. In the present invention, the above problems are solved by the means (1) to (7) described below, -6 - 201032242. (1) A metal plate low-resistance chip resistor comprising: a metal resistor plate; and an electrode film respectively formed at both ends of the metal resistor plate, and a double electrode film formed to cover the metal resistor plate In the protective film, the metal resistor plate has a shape in which a predetermined position is formed on both sides of the rectangular shape, and the electrode resistor is formed on the end side of the end portion of the metal resistor plate at a predetermined width, and the metal resistor is formed. The field of the electrodeless film φ of the plate is provided as a resistor portion, and a portion having no notch on both sides of the resistor portion serves as a resistor 値 adjusting portion, and a portion having a notch on both sides of the resistor portion serves as a resistor 値 fixing portion, and the protective film is The surface of the metal resistor plate is covered, and both sides of the resistor ring fixing portion are filled to form the same width as both end portions. (2) In the metal plate low-resistance chip resistor according to the above (1), the resistor 値 fixing portion has a length greater than a width. (3) A method for manufacturing a metal plate low-resistance chip resistor, characterized in that: a step of forming a plurality of through grooves in a straight line at a predetermined interval in a metal resistor plate of a predetermined size; and a step of forming a plurality of holes arranged in a line at a predetermined interval; and a protective film forming step of blocking the plurality of holes in a region other than the predetermined width on both sides of the through groove by a protective film; and a step of forming the protective film from the metal resistor plate In the field from the groove to the above-mentioned hole, an electrode film forming step is formed on both sides of the hole, and an electrode film forming step of forming an electrode film on a side having the through groove; and the protective film forming step and After the electrode film forming step, the strip-shaped cutting step of forming the strip-shaped metal-7-201032242 resistor plate is performed along the through-groove to cut the metal resistor plate; and the portion where the hole is provided is cut in the short-side direction The strip-shaped metal resistor plate is formed into a sheet-like cutting step of forming a sheet-shaped metal resistor plate, and in the sheet-like cutting step, a desired resistance 値 is obtained. Embodiment of the sheet metal resistor plate, determines the cutting width of the strip metal resistor plate. (4) A method of manufacturing a metal plate low-resistance chip resistor, comprising: forming a plurality of holes arranged in a line at a predetermined interval in a strip-shaped metal resistor plate: and in a center of the strip-shaped metal resistor plate a protective film forming process for forming a protective film to block the plurality of holes; and an electrodeless film on both sides of the hole in the field from the both sides of the metal resistor plate to the hole And an electrode film forming step of forming an electrode film at a predetermined width on a side side; and cutting a strip-shaped metal resistor plate in a short-side direction at a portion where the hole is provided to form a sheet-like metal sheet having a sheet metal resistor In the sheet cutting step, the sheet-shaped metal resistor plate having the desired resistance 可 is obtained, and the cutting width of the strip-shaped metal resistor plate is determined. In the method for producing a metal plate low-resistance chip resistor according to the above (4), the sheet-like or strip-shaped organic resin material is provided in the protective film forming step. Both sides of the metal resistor plate are welded by applying pressure on one side to form a protective film. (6) The method for producing a metal plate low-resistance chip resistor according to the above (4), wherein the sheet-like cutting step includes cutting the portion having the hole in a short side direction. a step of forming a sheet-shaped metal resistor plate in a strip-shaped metal resistor plate; and measuring a resistance of the sheet-like metal resistor plate - 8 - 201032242 ;; and calculating using the above-described measurement 値 to obtain a desired resistance In the method of the sheet-shaped metal resistor plate of the crucible, the calculation step of the cutting width of the strip-shaped metal resistor plate in the next cutting step is calculated, and the strip-shaped metal resistor is cut in the short-side direction by the cutting width calculated in the previous calculation step. In the plate, the resistance 値 of one of the sheet-shaped metal resistor plates formed by the measurement was measured, and the measured resistance 値 was used to calculate the sheet-shaped metal resistor plate having the desired resistance ,, and the next cutting step was calculated. The strip gold φ is the cut width of the resistor plate. (7) The method for producing a metal plate low-resistance chip resistor according to the above (4), wherein the sheet-like cutting step includes cutting the portion having the hole in a short side direction. a step of forming a sheet metal resistor plate in a strip-shaped metal resistor plate; and a step of measuring the resistance 値 of the sheet metal resistor plate; and calculating the 値 using the measurement , to obtain a sheet having a desired resistance 値In the method of the metal resistor plate, the calculation process of the cutting width in the short-side direction of the strip-shaped metal resistor plate in the next cutting step is calculated. The cutting width calculated by the previous calculation step is cut in the short-side direction twice. In the metal resistor plate, the resistance 値 of the two chip-shaped metal resistor plates formed by the above is measured, and the average 値 is calculated, and the average 値 is used for calculation, and a sheet metal resistor plate having a desired resistance 値 is obtained. The cutting width of the strip-shaped metal resistor plate in the next cutting step was calculated. Further, in the method for manufacturing a metal plate low-resistance chip resistor according to the above (3), the step of forming a plurality of through grooves linearly at predetermined intervals in the metal resistor plates of a predetermined size may be simultaneously performed, and A step of forming a plurality of holes arranged in a line at a predetermined interval between the through grooves. For example, the plurality of through grooves and the plurality of holes may be simultaneously formed on the metal resistor plate by etching -9-201032242 or a punching method by a metal mold, and may be sequentially formed as a different process. In the metal plate low-resistance chip resistor of the present invention, by providing a narrow-width resistor 値 fixing portion at a predetermined position of the metal resistor plate, the resistance is slightly increased, and at both ends of the metal resistor board In the field of the electrodeless film, when manufacturing a metal plate low-resistance chip resistor, the resistance 値 can be finely adjusted by slightly adjusting the width of the both end portions, so that the resistor 値 can be set to a predetermined range with high precision, for example, Set a specific resistance 范围 in the range of 15 to 5 ΟπιΩ. Further, the resistor 値 fixing portion of the metal resistor plate has a width slightly smaller than the both end portions, but the resistor fixing portion is formed to have a length larger than the width, and the resistor 値 fixing portion is the same thickness as the both end portions, and is not as conventional The metal plate low-resistance chip resistor is provided with a groove or a slit, thereby preventing local overheating and being reliable, and physically ensuring sufficient strength. In the method for manufacturing a metal plate low-resistance chip resistor of the present invention, either one of a metal resistor plate of a predetermined size or a strip-shaped metal resistor plate is used, and thus the metal resistor plates are formed at a predetermined interval. a strip-shaped metal resistor plate provided with a protective film and an electrode film is manufactured as an intermediate processed product, and the strip-shaped intermediate processed product is cut in a short-side direction at a position of a hole to form a chip resistor, By appropriately adjusting the cutting width, a metal plate low-resistance chip resistor having a desired resistance 可 can be manufactured. In other words, when the strip-shaped intermediate processed product is cut into a sheet-shaped metal resistor, the hole formed in the metal resistor plate becomes a notch portion of the metal electric-10-201032242 resistor plate of the above (1). A narrow width of the resistor 値 fixing portion is formed to obtain a slight rise in the resistance 値. Moreover, when the non-hole portion of the strip-shaped intermediate processed product is cut, it becomes the both end portions of the metal resistor plate of the above (1), and the width of the both end portions is the cut of the strip-shaped intermediate processed product. Depending on the width, the resistance 値 of the metal plate low-resistance chip resistor is finely adjusted to a predetermined range, in particular, by the field of the electrodeless film at both ends. In this way, the resistance 値 which is a low-resistance chip resistor of a metal plate can be set to a target resistance 较高 of a high specific resistance 范围 in a range of, for example, about 15 to 50 m Ω with high precision. In the method for producing a metal plate low-resistance chip resistor of the present invention, a plurality of holes are formed at predetermined intervals, and a strip-shaped metal resistor plate provided with a protective film and an electrode film is manufactured as an intermediate processed product at a position of a hole. And the strip-shaped intermediate processed product is cut in the short-side direction by the predetermined cutting width (initial setting 値) of one chip resistor to form a sheet-shaped metal resistor plate (sheet-like processed product), and the sheet-like processing is measured. In the resistance 値 of the product, the measurement method of the sheet-like processed product having the desired resistance 値 is obtained by using the measurement calculation, and the cutting width in the short-side direction of the strip-shaped intermediate product in the next cutting step is calculated. Then, the strip-shaped intermediate product is cut one or two times in the short-side direction at the calculated cutting width and at the position of the hole to form a sheet-like processed product, and the resistance 値 of the sheet-like processed product is measured, and one of the measurements is used. The resistance 値 or the average 値 of the two resistance 値 is used to calculate the cutting width used in the next cutting step. After that, the cutting process is repeated in the same manner, and the process of measuring the resistance enthalpy and the process of calculating the cutting width are performed to produce a sheet-like processed product, and the sheet-like processed product within the allowable range from the resistor 値201032242 is manufactured to have a low resistance of the metal plate. Chip resistors. Therefore, when the hole provided in the metal resistor plate is cut into a sheet-shaped metal resistor plate, the notch portion on both sides is formed, thereby forming a narrow-width resistor 値 fixing portion to obtain a slight rise in the resistance 値. . Further, when the non-hole portion of the strip-shaped intermediate processed product is cut, it becomes the both end portions of the metal resistor plate of the above (1), and the width of the both end portions is the cut of the strip-shaped intermediate processed product. The width is such that, in particular, by the field of the electrodeless film at both ends, the resistance 値 of the metal plate low resistance chip resistor is finely adjusted to a predetermined range. In other words, in the present invention, the cutting width in the short-side direction of the strip-shaped intermediate processed product is often corrected in accordance with the resistance 値 of one or two sheet-like processed products formed in the previous step. Therefore, the resistance 片 of the sheet-like processed product can be controlled within an allowable range with extremely high precision, and the yield of the metal plate low-resistance chip resistor manufactured from the sheet-like processed product is also extremely high. In the present invention, a high-precision, low-resistance metal plate low-resistance chip resistor can be manufactured by a relatively simple and flexible process. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. Fig. 1(a) is a view showing a metal plate low resistance chip resistor of the present invention. Fig. 1(b) is a cross-sectional view taken along line BB. Fig. 1(c) is a cross-sectional view taken along line CC, 1st-12th to 201032242 ( d) The figure is a plan view showing the metal resistor plate 11 constituting the metal plate low-resistance chip resistor 1〇. The metal plate low-resistance chip resistor 1 is formed by forming an electrode film 12 on the front and back sides of the metal resistor plate 11 made of an alloy, and a protective film 13 is formed between the electrode films 12 at both ends. Here, as shown in FIG. 1(d), the metal resistor plate π is formed in a rectangular shape formed by the side edge 11a and the end side lib, and the center of both sides iia forms a notch shape, and the gap is formed in the gap. The portion "llc" has a central shape φ which is narrower than the both ends of the lid lie, that is, the resistor 値 fixing portion lie is formed. The resistor 値 fixing portion iie is formed to have a length L larger than the width W. Further, the metal resistor plate 11 can be formed, for example, by an alloy containing iron, chromium, and aluminum, or an alloy containing nickel and chromium. The electrode film 12 is formed on the front and back surfaces and end faces of the metal resistor plate 11 at a predetermined width, and the electrode Iel 12 is provided on the side close to the notch portion lie of the both end portions. As described below, the field Ilf of the electrodeless film 12 of the both end portions is functional as a resistance φ integral Uf. Further, as the electrode film 12, a laminated Ca film, a Ni film, and a Sn film can be formed. The protective film 13 is composed of a protective film lower layer 13a and a protective film upper layer 13b, which is, for example, a resin having a photosensitive group. After the sheet is crimped to the front and back surfaces of the metal resistor plate 11 and then covered by the mask, the photographic chemical etching method is used for exposure and development, thereby removing the electrode film 12 from the field in which the electrode film 12 is formed. form. The protective film lower layer 13a is a notch portion lie' of the full metal resistor plate 11 as shown in Fig. 1(a), and the outer shape of the metal plate low-resistance chip resistor 1 is approximately 13-201032242. Further, the protective film upper layer 13b is formed, for example, by coating the epoxy resin paste by a screen printing method on the lower layer 13a of the protective film, and hardening it. Fig. 2 is a plan view showing a strip-shaped intermediate product 20 which is a process of the metal plate low-resistance chip resistor 10 of the present invention. In the strip-shaped metal resistor plate 11, a plurality of rectangular holes 21 are formed at predetermined intervals, and the electrode film 12 is formed on both sides of the strip-shaped metal resistor plate 11 in the longitudinal direction, and the longitudinal direction of the center portion of the front and back is formed. A protective film 13 is formed. In the manufacturing method of the present invention, the strip-shaped intermediate product 20 is indicated by a one-dot chain line 22, and the strip-shaped intermediate portion is cut at a predetermined cutting width Wn in the short-side direction at the position of the hole 21 The processed product 20' is formed into a sheet-like processed product An, and a sheet-shaped processed product An is subjected to a micro-step for further productization, and a metal plate low-resistance chip resistor 1 as a finished product is formed. As described above, since the strip-shaped intermediate product 20 is cut at the position of the hole 21, the resistance fixing portion lie of the low-resistance sheet resistor 10 of the metal plate of Fig. 1 is not removed in the cutting step. The width or length is increased or decreased by the width wn of the adjustment portion Ilf by the cut width wn, whereby the resistance 値 of the metal plate low-resistance chip resistor 10 is increased or decreased and finely adjusted. That is, the cutting width wn is directly the width of the resistance adjusting portion 11f. When the cutting width wn is increased, the resistance 値' can be slightly lowered. Conversely, if the cutting width wn is decreased, the cutting width wn can be slightly Rising resistance 値. On the one hand, the metal plate low-resistance chip resistor 10 is in the process of manufacturing, if the size or spacing of the holes 2 1 provided in the metal resistor plate 1 1 is adjusted, then the width of the resistor 値 fixing portion lie can be set. Or the length, whereby a slight increase in the resistance 値 of the metal plate low-resistance chip resistor 1 可 can be obtained. As described above, the metal plate low-resistance chip resistor 10 can obtain a slight rise of the resistance 利用 by the resistor 値 fixing portion 1 1 e, and the fine adjustment of the resistor 可 can be obtained by adjusting the width of the resistor 1 1 1 f. Hereinafter, a method of manufacturing the metal plate low-resistance chip resistor 10 of the present invention will be described. φ In the method for producing a metal plate low-resistance chip resistor of the present invention, the metal resistor plate 20 A having a size as shown in Fig. 3(a) is subjected to an etching method or a die cutting method using a metal mold. The plurality of through grooves 22 are formed linearly at predetermined intervals, and at the same time, a plurality of rectangular holes 21 are formed in a line at a predetermined interval between the through grooves 22. Further, in the third diagram (a), the metal resistor plate 20A has a rectangular planar shape, but the planar shape or size thereof can be appropriately selected, and the strip-shaped metal resistor plate 20B is also used as shown in the third figure (b). can. In the strip-shaped metal 靥 resistor plate 20B, the rectangular plurality of holes 2 1 are also arranged in a line at a predetermined interval. 4(a) to 4(c) are plan views and cross-sectional views showing the enlarged third (a) view, and the metal resistor plate 20A having the holes 21 and the through grooves 22 formed in this manner is formed in the first 1 (d) In the case of a metal plate low-resistance chip resistor 10 of the figure, the hole 21 becomes the gap portion 11c', and the field between the hole 21 and the hole 21 becomes the resistance ring fixing portion lie, and between the hole 21 and the through groove 22 Become the lid at both ends. The resin sheet having the photosensitive group is pressure-bonded to the surface of the surface of the metal resistor plate 20A in which the hole 21 and the through groove 22 are formed in this manner, and the entire surface of the back surface is melted to fill the hole 21, and It is followed by the surface of the metal resistor plate 20 A. The resin sheet is removed from the both sides of the through groove 22 by the exposure or the photographic chemical etching manufacturing method by the exposure of the fixed portion, that is, from the field in which the electrode film 12 is formed. As shown in FIGS. 4(d) to 4(f), the protective film lower layer 13a is formed. The protective film lower layer 13a is a hole 21 filled with the metal resistor plate 20 A, and is covered in the field of the resistor 値 adjusting portion Ilf of a predetermined width on both sides of the hole 21. Further, the epoxy resin paste is applied from the protective film lower layer 13a by a screen printing method, and dried and cured to form a protective film upper layer 13b as shown in Fig. 5(a). Then, in the both sides of the through trench 22, the electrode film 12 is formed by laminating a Cu film, a Ni film, and a Sn film in a region where the protective film underlayer 13a and the protective film upper layer 13b are not formed. The electrode film 12 is formed on the front and back surfaces and the end surface from the through grooves 22 of the metal resistor plate 20A with a predetermined width, and the electrode film 12 is not provided on the side of the metal resistor plate 20A where the holes 21 are provided. In the above-described manner, the protective film lower layer 13a and the protective film upper layer 13b are covered, and the field of the electrodeless film 12 serves as the resistance adjusting portion 11f. After the electrode film 12 is formed on the metal resistor plate 20A, the strip-shaped intermediate product 20 as shown in Fig. 2 is formed by cutting along the through grooves 22. Further, when the strip-shaped metal resistor plate 20B shown in Fig. 3(b) is used, the rectangular plurality of holes 2 1 are formed in a line at a predetermined interval, and the center long side of the strip-shaped metal resistor plate 20B is formed. The protective film lower layer 13a formed by the resin sheet forming unit 201032242 is formed to block the plurality of holes 21 and cover both sides of the hole 2 1 with a predetermined width, and the resistance 値 adjusting portion Ilf is secured in the both sides of the hole 2 1 . Further, the protective film upper layer 13b is provided on the protective film lower layer 13a, and after the protective film 13 is formed, the Cu film, the Ni film, and the Sri film are laminated on the side of the protective film 13 to form the electrode film 12'. The strip-shaped intermediate processed product 20 is the same as described above. Hereinafter, a method of calculating the cutting width Wn φ of the strip-shaped intermediate product 20 will be described. When the strip-shaped intermediate product 20 of the second drawing is cut in the short-side direction by the predetermined cutting width W", when the sheet-shaped processed product An is formed, the electric resistance 値 is calculated by the following theoretical formula (1). . R = Ra + Rb + Rb? =p X{Ll/(W!t)}+ px{L2/(w2t)}+px{L25/(w2t)} =P /t X { L 1/w 1+ L2/W2 + L2 5 / W2 } (1) Here, the resistor portion is fixed by the resistor fixing portion a as shown in Fig. 6 The resistance 値 adjustment unit b, b' constitutes 'the total resistance 値 (R) is the resistance 値 (Ra) ' as the resistance 値 fixed portion (a) and the resistance 値 (Rb ) of the resistance 値 adjustment unit b, and the resistance总 The sum of the resistances 値(Rb') of the adjustment unit b'. P is the volume resistivity, t is the thickness of the metal resistor plate, and W2 is equivalent to the cut width Wn of Fig. 2. The following is a description of the process of cutting the strip-shaped intermediate processed product 20' to form a sheet-like -17-201032242 article An. The initial stage is input to a manufacturing apparatus (not shown) for a metal plate low-resistance chip resistor. The initial enthalpy is, for example, an allowable minimum 切断 of the cutting width, an allowable maximum 切断 of the cutting width, a frequency of the resistance 値 measurement, a frequency of the cutting width change, a target resistance 値, and a strip-shaped intermediate processed product. The number of cuts. After the initial enthalpy is input, the average 値wrain + wmax /2 of the maximum 値wmax is allowed from the allowable minimum 値wmin, and the first cutting width is obtained. Then, the cutting width W! is used to cut the intermediate processing. The product 20 is formed into a sheet-like processed product, and the resistance 値R! is measured, and the second cutting width W2 is calculated from the deviation of the resistance 値I and the target resistance 値R by the theoretical expression (1). In the initial input process, the frequency of the resistance 値 measurement is set to 1, and when the frequency of the change of the cut width is set to 1, the process of forming the second and subsequent sheet-like processed products An is the cut width \\ ^The strip-shaped intermediate product 20 is cut, and the resistance 値Rn of the sheet-like processed product An obtained therefrom is measured, and the variation of the resistance 値Rn and the target resistance 値R is calculated to form the n+1th. The cut width Wn+i of the sheet-like processed product Αn+ι is repeated every time the sheet-like processed product is formed, and is carried out until the number of cuts input as the initial flaw. In the input process of the initial enthalpy, the frequency of the resistance 値 measure is 2, and when the frequency of the change of the cut width is 2, the second and subsequent process of forming the sheet-like processed product is the same. The strip-shaped intermediate product 20 is cut by the width Wn to form the sheet-like processed products An and An+1. -18-201032242 Measure the resistances 値Rn, Rn + i of the processed products An and An+1 one by one, and calculate the average 値 of the resistors nRn and Rn+1 from the average 値 and as the resistor値R, the cut width Wn + 2 is calculated by the theoretical formula (1). Further, the two sheet-like processed products An + 2 and An + 3 formed by the sheet-like processed products An and An+1 are cut from the belt-shaped intermediate product 20 by the same cutting width Wn + 2 . The above steps are repeated every time two sheet-like processed products are formed, and are carried out until the number of cuttings input as the initial flaws. The sheet-like processed product An obtained as described above is a metal plate low-resistance chip resistor 1 as a finished product by a number of steps used for product formation. [Simplified description of the drawing] Fig. 1(a) shows the present In the plan view of the metal plate low-resistance chip resistor of the invention, the first (b) diagram shows the section φ cut along the line B_B, and the first (c) diagram shows the section cut along the CC line. In the cross-sectional view, Fig. 1(d) is a plan view showing a metal resistor plate constituting a metal plate low-resistance chip resistor. Fig. 2 is a plan view showing a strip-shaped intermediate product of the process of the metal plate low-resistance chip resistor of the present invention. Fig. 3(a) is a plan view showing a metal resistor plate 20A having a specific size, and Fig. 3(b) is a plan view showing a strip metal resistor plate 20B. Figs. 4(a) to 4(f) are diagrams showing The metal plate of the present invention is a top view or a cross-sectional view of the process of the resistor -19-201032242 resistor chip resistor. The fifth graph is a sixth graph showing the process continued from Fig. 4, and illustrates a pattern for calculating the theoretical formula of the strip-shaped intermediate processing f. Sectional view of the sequence. [Main component symbol description of cut width] 10: Metal plate low resistance chip resistor 11: Metal resistor plate 1 1 a : Side Ub: End edge 1 lc : Notch 1 1 d : Both ends 1 1 e : resistance 値 fixing portion 1 1 f : resistance 値 adjusting portion 12 : electrode film 13 : protective film 13 a : protective film lower layer 13 b : protective film upper layer 20 : strip-shaped intermediate processed product 2 0A : metal resistor plate 20B of a predetermined size : Strip-shaped metal resistor plate 2 1 : Rectangular hole 22 : Through groove An: Sheet-shaped e-work formed by the n-th cut-off -20- 201032242
Rn : An的電阻値 Wn :第η次的切斷寬度Rn : An resistance 値 Wn : the nth cut width