201031488 33082pif 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種使用雷射光束（laserbeam)來對 薄膜等進行加工的雷射加工方法、雷射加工裝置以及太陽 能面板（solarpanel)製造方法，且特別是有關於一種可將 1條雷射光束分支為多條來進行加工或可使進行加工時的 各雷射光束間的間距（pitch)寬度可變的雷射加工方法、 雷射加工裝置以及太陽能面板製造方法。 【先前技術】 以往在太陽能面板的製造步驟中，在透光性基板（玻 璃基板）上依次形成透明電極層、半導體層、金屬層，並 在形成後的各步驟中利用雷射光束將各層加工為狹條狀 (strip-like form )’從而完成太陽能面板模組（s〇lar panel module)。在以此方式製造太陽能面板模組時，利用雷射光 束在玻璃基板上的薄膜上例如以約1〇 mm的間距形成切 割線（scribe line)。此切割線是由線寬約為3〇 μιη、且線 與線的間隔約為30 μπι的3條線所構成。在利用雷射光束 來形成切鱗時，通常是將雷縣束騎至㈣移動的玻 璃基板上。由此，可形成深度及線寬穩定的切割線。關於 ^類在使用雷射光束的加工方法巾將雷射光束分支為多條 進行加工的情況，已知有日本專利特開號 公報中所揭示的情況。 工太在日本專利特開2004-141929號公极所揭*的雷射加 法中’使用相位光栅（phasegrating)來將雷射分支為 201031488 33ϋ82ρΐί :條雷射光j ’並對件（WGrk)照射分支的多條雷射光 般而言’在太陽能面板製造步驟中，直接將高斯光 beam)⑽雷射光束，絲光束餘縮小為規 j寬度錢基板移動，從•行切割加工。如果將高斯 光束用作雷射絲’則加工频為稱狀，從而存在中央 部的膜過於懸浮或對玻璃基板造成損傷（damage)。而且， 由於切割加工巾是脈衝（pulse)騎雷射光束 ，因此存在201031488 33082pif VI. Description of the Invention: [Technical Field] The present invention relates to a laser processing method, a laser processing apparatus, and a solar panel manufacturing for processing a film or the like using a laser beam (laser beam) a method, and particularly a laser processing method, laser capable of branching a laser beam into a plurality of pieces for processing or making a pitch width between laser beams which can be processed Processing device and solar panel manufacturing method. [Prior Art] Conventionally, in the manufacturing process of a solar panel, a transparent electrode layer, a semiconductor layer, and a metal layer are sequentially formed on a light-transmitting substrate (glass substrate), and each layer is processed by a laser beam in each step after formation. It is a strip-like form to complete a solar panel module. When the solar panel module is manufactured in this manner, a scribe line is formed on the film on the glass substrate by, for example, a pitch of about 1 mm in a laser beam. This cutting line is composed of three lines having a line width of about 3 μm and a line-to-line spacing of about 30 μm. When using a laser beam to form a scale, it is usually to ride the Leixian to the (four) moving glass substrate. Thereby, a cutting line having a stable depth and a line width can be formed. Regarding the case where the class of the laser beam is branched into a plurality of pieces by a processing method using a laser beam, a case disclosed in Japanese Laid-Open Patent Publication is known. In the laser addition method disclosed in Japanese Patent Laid-Open No. 2004-141929, 'the use of phase grating to split the laser into 201031488 33ϋ82ρΐί : strip laser light j ' and irradiate the branch (WGrk) In the case of multiple lasers, in the solar panel manufacturing step, the Gaussian beam is directly (10), the laser beam is reduced to the width of the substrate, and the cutting process is performed. If a Gaussian beam is used as the laser wire, the processing frequency is called, so that the film in the center portion is excessively suspended or damages the glass substrate. Moreover, since the cutting towel is a pulse riding laser beam, it exists
切割線的兩側脊線起伏的問題。 而且，使同時照射的多條雷射光束的分支方向與雷射 光^的掃描方向所構成的角度θ增大，使照射區域（area) 的範圍減小，從而將多個照射連結起來，而形成範圍較廣 的除去部。但是，在日本專利特開2〇〇4_141929號公報所 揭不的雷射加工方法中是使用相位光柵將雷射光束分支， 因此很難使已分支的雷射光束間的間距寬度形成約為1〇 mm左右’從而難以在太陽能面板的製造步驟中應用日本 專利特開2004-141929號公報所揭示的技術。 為了解決所述問題，以往是在聚光透鏡（collecting kns )的正前方配置相位型衍射光學元件（d〇E : Diffractive Optical Element) ’該相位型衍射光學元件將高斯光束轉換 為頂帽形（TopHat)光束，並對基板照射雷射光束。DOE 是具有對雷射光束的配光特性進行轉換/整形的功能的元 件’主要用來將雷射光束的高斯（Gaussian)強度分佈轉 換為平頂形（flattop)(頂帽形）強度分佈，從而提高雷射 加工等的精度。 201031488 33082pif 然而’由於DOE是價格昂貴的元件，所以存在如下 問題··如上所述在分支的多條雷射光束的聚光透鏡的正前 方分別設置DOE將會導致價格高漲，因而不佳。 而且’日本專利特開2004-141929號公報所揭示的雷 ，加工方法的情況可通過僅使作為單體元件的相位光栅進 打旋轉，而簡單地對雷射光束的分支方向與雷射光束的掃 描方向所構成的角度θ進行可變控制。但是，在太陽能面 板製造步驟巾’由於使用多個半反光鏡（hyf ^^沉）以及 反^鏡等，來將從雷射產生裝置射出的雷射絲分支為間 八度約10 右的雷射光束，因而難以對雷射光束的 刀支方向與雷射光束的掃描方向所構成的角度Θ進行可變 控制，從而現狀為尚未實現所述可變控制。 【發明内容】 本發明的目的之一是蓉於所述問題而完成的，是提供 :種無需針對分支的多條雷射光束中的每條 基騎有雷射光束轉換為頂娜光束並照射至 ^的雷射加工方法、雷射加工裝置以及太陽能面板製造 的之—是提供—種可使用半反光鏡及 反射 :==== =束’並對該分支方向與 本發月Φζ供一^種雷紛“ τ Htr、+ . 多條雷射光束’使分支的多：光:== 201031488 對移動一面進行照射，由此來對工件實施規定的加工的雷 射加工方法中，在所述雷射光束的分支前的光路中設置相 位型衍射光學元件機構，將所述雷射光束轉換為頂帽形強 度分佈，且以轉換後的多條雷射光束照射至所述工件為止 的各光路長度相同的方式，來將所述雷射光束分支為多條 雷射光束而對所述工件進行照射。 本發明中，在將雷射光束分支為多條雷射光束，使分 支的多條雷射光束對工件一面進行相對移動一面進行照射 的情況下，是在雷射光束的分支前的光路中配置相位型衍 射光學元件機構配置，以將雷射光束轉換為頂帽形強度分 佈。轉換後的雷射光束由半反光鏡或反射鏡等而被分支為 多條雷射光束。此時，以轉換後的多條雷射光束照射至工 件為止的各光路長度彼此相等的方式，來將雷射光束引導 照射至工件為止。由此，即便並未針對分支的多條雷射光 束中的每條雷射光束來設置相位型衍射光學元件 (DOE) ’也可將已轉換為頂帽形光束的多條雷射光束照 參 射至基板上，因此可實現成本降低。而且，所述分支是來 自於一個（DOE)光源的分支，因此可較容易地使分支的 雷射光束的特性均一化。 、在所述的雷射加工方法中，使用由半反光鏡及反射鏡 構成的分支機構來將雷射光束分支為多條雷射光束，使用 所述分支機構，將垂直地朝向所述工件的加工面的垂直雷 f光束分支為多條雷射光束，並且以所述垂直雷射光束的 則進方向為中心軸而使所述分支機構旋轉，由此，對所述 201031488 33082pif 雷射光束的分支方向與所述雷射光束的對所述工件的相對 移動方向所構成的角度進行可變控制。 從雷射產生裝置射出的雷射光束最終垂直地照射至工 件的加工面。本發明中，將包括半反光鏡及反射鏡的分支 機構設置在該垂直地朝向所述工件的加工面的垂直雷射光 束的中途，並對雷射光束進行分支。此時，構成為使分支 機構的旋轉中心轴與垂直雷射光束的前進方向相一致，且 使得分支機構整體可旋轉，由此，可容易地對分支方向與 雷射光束的掃描方向所構成的角度進行可變控制。 在所述的雷射加工方法中，在對所述工件照射轉換為 頂帽形強度分佈後的雷射光束，並且所述雷射光束的分支 方向與所述雷射光束的相對移動方向所構成的角度受到旋 轉控制的情況下，使得所述相位型衍射光學元件機構不相 對於所述雷射光束的相對移動方向而旋轉。 一般而言，在太陽能面板製造步驟中，是將高斯光束 用作雷射光束，且將光束直徑縮小為規定的寬度而使基板 移動’從而進行切割加工。如果將高斯光束用作雷射光束， 則加工形狀為研缽狀，從而存在中央部的膜過於懸浮的問 題，而且，進行切割加工時是脈衝照射雷射光束，因此存 在切割線的兩侧脊線起伏的問題。對此，在雷射光束的光 路中配置相位型衍射光學元件（DOE : Diffractive 〇ptical Element) ’將高斯光束轉換為頂帽形（T〇pHat)光束，並 對工件照射雷射光束。DOE是具有對雷射光束的配光特性 進行轉換/整形的功能的元件，主要用於將雷射光束的高斯 201031488 ^^υδζρα 為平頂形(頂帽形)強度分佈，並提高雷射 。通過使用該D〇E，可使雷射光束的照射形 y ·正方形狀且可平滑地形成切割線的兩侧脊 在對雷射光束的分支方向與雷射光束的掃描方 b 、的肖度進行可變控制時，由於照射形狀為大致正 =形狀’因而切割線的兩侧脊線可能反而較高斯強度分佈 ，更加起伏。因此，在本發明中，即便在對雷射光束的分The problem of undulations on both sides of the cutting line. Further, the angle θ formed by the branching direction of the plurality of laser beams simultaneously irradiated with the scanning direction of the laser light is increased, and the range of the irradiation area is reduced, thereby connecting the plurality of irradiations to form a plurality of irradiations. A wide range of removals. However, in the laser processing method disclosed in Japanese Laid-Open Patent Publication No. Hei. No. 4-141929, the phase beam is used to branch the laser beam, so that it is difficult to form the pitch width between the branched laser beams to be about 1. It is difficult to apply the technique disclosed in Japanese Laid-Open Patent Publication No. 2004-141929 to the manufacturing process of the solar panel. In order to solve the above problem, a phase type diffractive optical element (d〇E: Diffractive Optical Element) has been conventionally disposed in front of a collecting lens (the phase type diffractive optical element converts a Gaussian beam into a top hat shape ( TopHat) beam and illuminate the substrate with a laser beam. The DOE is an element having a function of converting/shaping the light distribution characteristics of a laser beam. It is mainly used to convert a Gaussian intensity distribution of a laser beam into a flattop (top hat) intensity distribution. Thereby improving the precision of laser processing and the like. 201031488 33082pif However, since DOE is an expensive component, there are the following problems. As described above, setting DOE in front of the condenser lens of a plurality of branched laser beams as described above will cause an increase in price, which is not preferable. Further, in the case of the lightning disclosed in Japanese Laid-Open Patent Publication No. 2004-141929, the processing method can simply rotate the phase grating as a single element, and simply branch the laser beam to the laser beam. The angle θ formed by the scanning direction is variably controlled. However, in the solar panel manufacturing step towel, the laser light emitted from the laser generating device is branched into a ray of about 10 degrees right due to the use of a plurality of half mirrors (hyf ^^ sinking) and a mirror. Since the light beam is emitted, it is difficult to variably control the angle Θ formed by the blade direction of the laser beam and the scanning direction of the laser beam, so that the variable control has not yet been realized. SUMMARY OF THE INVENTION One of the objects of the present invention is to achieve the above problems, and to provide a laser beam that is not required for a branch to be converted into a top beam and irradiated with each of the plurality of laser beams. To the laser processing method, the laser processing device and the solar panel manufacturing - is to provide a kind of semi-mirror and reflection: ==== = bundle 'and the branch direction and the current month Φ ζ ^Throws of thunder "τ Htr, + . Multiple laser beams" make the branches more: Light: == 201031488 Laser processing of the moving side, thereby performing the specified processing of the workpiece in the laser processing method, in the a phase-type diffractive optical element mechanism is disposed in the optical path before the branching of the laser beam, and the laser beam is converted into a top hat-shaped intensity distribution, and each of the converted plurality of laser beams is irradiated to the workpiece The laser beam is branched into a plurality of laser beams to illuminate the workpiece in the same manner as the optical path length. In the present invention, the laser beam is branched into a plurality of laser beams to make a plurality of branches. Laser beam to workpiece When the light is irradiated while moving relative to each other, the phase type diffractive optical element mechanism is disposed in the optical path before the branching of the laser beam to convert the laser beam into a top hat-shaped intensity distribution. The converted laser beam is composed of a half mirror or a mirror is branched into a plurality of laser beams. At this time, the laser beam is guided to the laser beam by the lengths of the respective optical paths until the converted plurality of laser beams are irradiated to the workpiece. Thus, even if the phase type diffractive optical element (DOE) is not provided for each of the plurality of branched laser beams, the plurality of lasers that have been converted into the top hat beam can be provided. The beam is incident on the substrate, so that cost reduction can be achieved. Moreover, the branch is a branch from a (DOE) source, so that the characteristics of the branched laser beam can be more easily homogenized. In the laser processing method, a branching mechanism composed of a semi-mirror and a mirror is used to branch the laser beam into a plurality of laser beams, and the branching mechanism is used to vertically a vertical lightning beam of the machined surface of the workpiece is branched into a plurality of laser beams, and the branching mechanism is rotated with the forward direction of the vertical laser beam as a central axis, thereby, for the 201031488 33082pif The branching direction of the laser beam is variably controlled from the angle formed by the relative movement direction of the laser beam to the workpiece. The laser beam emitted from the laser generating device is finally irradiated perpendicularly to the processing surface of the workpiece. In the present invention, a branching mechanism including a half mirror and a mirror is disposed in the middle of the vertical laser beam perpendicularly directed to the processing surface of the workpiece, and branches the laser beam. The rotation center axis of the mechanism coincides with the advancing direction of the vertical laser beam, and the branch mechanism as a whole is rotatable, whereby the angle formed by the branching direction and the scanning direction of the laser beam can be easily variably controlled. In the laser processing method, the workpiece is irradiated with a laser beam converted into a top hat-shaped intensity distribution, and a branching direction of the laser beam and a relative moving direction of the laser beam are formed. In the case where the angle is controlled by rotation, the phase type diffractive optical element mechanism is not rotated with respect to the relative moving direction of the laser beam. In general, in the solar panel manufacturing step, a Gaussian beam is used as a laser beam, and the beam diameter is reduced to a predetermined width to move the substrate to perform a cutting process. If a Gaussian beam is used as the laser beam, the shape of the processing is a mortar shape, so that there is a problem that the film at the center portion is too suspended, and the laser beam is irradiated with a laser beam during the cutting process, so that there are both sides of the cutting line. The problem of line ups and downs. In this regard, a phase-type diffractive optical element (DOE: Diffractive 〇ptical Element) is disposed in the optical path of the laser beam to convert the Gaussian beam into a top-hat (T〇pHat) beam, and irradiates the workpiece with a laser beam. The DOE is an element having a function of converting/shaping the light distribution characteristics of a laser beam, and is mainly used to make the Gaussian beam of the laser beam 201031488 ^^υδζρα a flat top (top hat) intensity distribution and to improve the laser. By using the D〇E, the illumination shape of the laser beam can be made y·square-shaped and smoothly formed on both sides of the dicing line in the branching direction of the laser beam and the scanning side b of the laser beam. When the variable control is performed, since the irradiation shape is substantially positive = shape 'the ridge lines on both sides of the cutting line may be more Gaussian intensity distribution, and more undulating. Therefore, in the present invention, even in the division of the laser beam
方向與雷射光束的掃描方向所構成的角度進行可變控制 的情況下，也使得相位型衍射絲元件機構不相對於雷射 光束的相對移財向畴轉。由此，可平滑地形成切割線 的兩侧脊線。 本發明中，在分支前只要設置一個D0E即可，因此 即便在對雷射光束的分支方向與雷射光束的掃描方向所構 成的角度進行可變控制的情況下，也只要僅使所述一個 DOE不旋轉即可，從而可簡化結構。 本發明還提供一種雷射加工裝置：在將雷射光束分支 為多條雷射光束，使分支的多條雷射光束對保持機構所保 持的工件一面進行相對移動一面進行照射，由此來對工件 實施規定的加工的雷射加工裝置中，所述雷射加工裝置包 括：相位型衍射光學元件機構，設置在所述雷射光束的分 支前的光路中，將所述雷射光束轉換為頂帽形強度分佈； 以及分支機構，以由所述相位型衍射光學元件機構轉換的 多條雷射光束照射至所述工件為止的各光路長度相同的方 式’來將所述雷射光束分支為多條雷射光束而對所述工件 9 201031488 33082pif =:=::述雷射加工方法的第1特徵相對 本發明的雷射加工裝置還更包括··分 反光鏡及反射鏡來將垂直躺所述工件的加工面的= 控制機構，使由所述分』 構分支的祕雷射絲對所祕賴構所鱗的 進行相對移動-面進行照射，由此來對1件實魏定的: 工，以及旋轉控制機構，以所述垂直雷射光束的前進方 為中心軸來對所述分支機構進行旋轉控制，由此，對所述 雷射光束的分支方向與所述雷械束的對 對 移動方向所構成的角度進行可變控制。本發明是與 射加工方法的第2特徵相對應的雷射加工裝置的發明。 在所述的雷射加工裝置中：在對所述工件照射由所述 相位型衍射光學元件機構進行轉換後的雷射光束，並且所 述雷射光束的分支方向與所述雷射光束的相對移動方向所 構成的角度受到旋轉控制的情況下，所述相位型衍射光學 元件機構不會相對於所述雷射光束的相對移動方向而旋 轉。本發明是與所述雷射加工方法的第3特徵相對應的雷 射加工裝置的發明。 本發明還提供一種太陽能面板製造方法：使用所述雷 射加工方法、或所述雷射加工裝置來製造太陽能面板。本 發明是使用所述雷射加工方法或所述雷射加工裝置中的任 一者來製造太陽能面板。 [發明的效果] 201031488 33ϋ»2ριί 根據本發明，可具有下述效果：可縮短雷射光束加工 時的作業時間（tact time)，從而可大幅提高整體生產量 (throughput) ° 根據本發明’可具有下述效果：可使用半反光鏡及反 射鏡來將雷射光束分支為多條雷射光束，並且可對該分支 方向與雷射光束的掃描方向所構成的角度進行可變控制。 為讓本發明之上述技術特徵能更明顯易懂，下文特舉 實施例’並配合所附圖式作詳細說明如下。When the direction is variably controlled from the angle formed by the scanning direction of the laser beam, the phase type diffraction grating element mechanism is also prevented from rotating relative to the relative beam of the laser beam. Thereby, the ridge lines on both sides of the cutting line can be smoothly formed. In the present invention, it is only necessary to provide one DOE before branching. Therefore, even if the angle formed by the branching direction of the laser beam and the scanning direction of the laser beam is variably controlled, only one of the ones is required. The DOE does not rotate, which simplifies the structure. The present invention also provides a laser processing apparatus: the laser beam is branched into a plurality of laser beams, and the plurality of branched laser beams are irradiated while moving relative to the workpiece held by the holding mechanism, thereby In a laser processing apparatus for performing a predetermined machining of a workpiece, the laser processing apparatus includes: a phase type diffractive optical element mechanism disposed in an optical path before branching of the laser beam, converting the laser beam into a top a hat-shaped intensity distribution; and a branching mechanism that branches the laser beam into a plurality of ways in which a plurality of laser beams converted by the phase-type diffractive optical element mechanism are irradiated to the workpiece in the same length a laser beam for the workpiece 9 201031488 33082pif =:=:: The first feature of the laser processing method further includes a mirror and a mirror to vertically lie relative to the laser processing apparatus of the present invention. The control mechanism of the machined surface of the workpiece causes the secret ray that is branched by the sub-structure to illuminate the scale of the secret structure, thereby illuminating the surface. And a rotation control mechanism that performs rotation control on the branching mechanism with the advancing side of the vertical laser beam as a central axis, thereby, the branching direction of the laser beam and the device The pair of beams is variably controlled by the angle formed by the direction of movement. The present invention is an invention of a laser processing apparatus corresponding to the second feature of the radiation processing method. In the laser processing apparatus: irradiating the workpiece with a laser beam converted by the phase type diffractive optical element mechanism, and a branching direction of the laser beam is opposite to the laser beam When the angle formed by the moving direction is controlled by rotation, the phase type diffractive optical element mechanism does not rotate with respect to the relative moving direction of the laser beam. The present invention is an invention of a laser processing apparatus corresponding to the third feature of the laser processing method. The present invention also provides a solar panel manufacturing method for manufacturing a solar panel using the laser processing method or the laser processing apparatus. The present invention is to manufacture a solar panel using either the laser processing method or the laser processing apparatus. [Effects of the Invention] 201031488 33ϋ»2ριί According to the present invention, it is possible to reduce the tact time during processing of a laser beam, thereby greatly improving the overall throughput (according to the present invention) The effect is that a half mirror and a mirror can be used to branch the laser beam into a plurality of laser beams, and the angle between the branching direction and the scanning direction of the laser beam can be variably controlled. In order to make the above-described technical features of the present invention more comprehensible, the following detailed description is made in conjunction with the accompanying drawings.
【實施方式】 以下，根據附圖來說明本發明的實施方式。圖1是表 示本發明的一實施方式的雷射加工裝置的概略結構的圖。 該雷射加工裝置進行太陽能面板製造裝置的雷射光束加工 處理（雷射切割）步驟。 圖1的太陽能面板製造裝置是由基座10、χγ平臺 2〇、雷射產生裝置40、光學系統構件5〇、對準照相機 (alignment camera)裝置6〇、線性編碼器〇inear如⑺如） 7〇、控制裝置80以及檢測光學系統構件等所構成。在基座 10上认置著沿基座10的X軸方向及丫軸方向（Χγ平面） 受到驅動控制的χγ平臺2〇。 入Y平臺20受到控制而向X方向及γ方向移動。另 1 ’ XY平臺2〇的驅動機構使用滾珠螺杆（baU或 (linear motor)等’此處省略了它們的圖示。在 XY平臺20的上侧保持著作為雷射加工對象的工件！。而 且’在基座ίο上設置著的滑動架（slideframe) 3〇，所述 11 201031488 33082pif 滑動架一面保持光學系統構件一面沿Y軸方向受到严 動。χγ平臺2〇構成為：可以ζ軸為旋轉軸而沿e方亡/ 行旋轉。另外，當可利用滑動架30來充分確保γ輛;= 的移動量時’ΧΥ平臺20也可構成為僅進行又軸方向的^ 動。此時，ΧΥ平臺20也可為X軸平臺結構。 滑動架30安裝在基座1〇上的四角上所設置的移動臺 上。滑動架30受到此移動台的控制而向γ方向移動。在 底板（base plate ) 31與移動台之間設置著消振 (vibration-free)構件（未圖示）。在滑動架3〇的底板3ΐ 0 上設置著雷射產生裝置40、光學系統構件5〇以及控制裝 置80。光學系統構件50是由鏡片（mirr〇〇及透鏡〇ens) 的組合所構成，該光學系統構件50將由雷射產生裝置4〇 所產生的雷射光束分割為4個系列並引導至χγ平臺2〇 上的工件1上《另外，雷射光束的分割數並不限定為4個 系列，只要為2個系列或2個系列以上即可。 對準照相機裝置60獲取XY平臺2〇上且工件i的兩 端部（X軸方向的前後邊緣部）附近的圖像。所述對準照 〇 相機裝置60所獲取的圖像被輸出到控制裝置8〇中。控制 裝置80將來自對準照相機裝置6〇的圖像與工件丨的識別 子（identity，ID)資料一起存儲在資料庫（database)機 構中，以用於以後的工件1的對準處理。 線性編碼器70是由設置在XY平臺2〇的X轴移動平 臺側面的刻度（scale)構件及檢測部所構成。線性編碼器 70的檢測信號被輸出到控制裝置8〇中。控制裝置80根據 12 201031488 33082pif 來自線性編碼器70的檢測信號，來檢測XY平臺20的X 軸方向的移動速度（移動頻率），並對雷射產生裝置40的 輸出（雷射頻率）進行控制。 如圖1所示，光學系統構件50設置在底板31的下表 面侧。用於將從雷射產生裝置40中射出的雷射光束導向光 學系統構件50的反射鏡33、35是設置在底板31上。從雷 射產生裝置40中射出的雷射光束被反射鏡33反射到反射 鏡35’反射鏡35使來自反射鏡33的反射雷射光束經由設 ® 置在底板31上的穿透孔而導向光學系統構件50。另外， 如果從雷射光束發生裝置40中射出的雷射光束可通過設 置在底板31上的穿透孔，而從上侧導入到光學系統構件 50中’那麼光學系統構件50可採用任意的結構。例如， 也可將雷射產生裝置40設置在穿透孔的上側，經由穿透孔 直接將雷射光束導向光學系統構件50。 圖2是表示光學系統構件50的詳細結構的圖。實際的 光學系統構件50的結構複雜，此處為了簡化說明而將圖示 ❹ 簡化表示。圖2是從圖1的_χ軸方向觀察光學系統構件 50的内部的圖。如圖2所示，在底板31上具有穿透孔37, 此穿透孔37是用於將由反射鏡35所反射的雷射光束導入 到光學系統構件50内。在此穿透孔37的正下方，設置著 將高斯強度分佈的雷射光束轉換為頂帽形強度分佈的雷射 光束的相位型衍射光學元件（DOE : Diffractive Optical Element) 500 〇 經DOE500轉換為頂帽形強度分佈雷射光束（頂帽形 13 201031488 33082pif 光束）的雷射光束，經由半反光鏡511分別分支為反射光 束及透射光束，反射光束朝向右方的半反光鏡512前進， 透射光束朝向下方的反射鏡524前進。由半反光鏡511反 射的光束被半反光鏡512進一步分支為反射光束及透射光 束，反射光束朝向下方的反射鏡522前進，透射光束朝向 右方的反射鏡521前進。穿透半反光鏡512的光束被反射 鏡521反射後，經由下方的聚光透鏡541而照射至工件1 上。由半反光鏡512反射的光束被反射鏡522、523反射後， 經由下方的聚光透鏡542而照射至工件1上。穿透半反光 鏡511的光束被反射鏡524反射後，朝向左方前進。由反 射鏡524反射的光束被半反光鏡513分支為反射光束及透 射光束，反射光束朝向下方的反射鏡526前進，透射光束 朝向左方的反射鏡528前進。由半反光鏡513反射的光束 被反射鏡526、527反射後，經由下方的聚光透鏡543而照 射至工件1上。穿透半反光鏡513的光束被反射鏡528反 射後，經由下方的聚光透鏡544而照射至工件1上。 由DOE500轉換的頂帽形光束經由所述半反光鏡511 〜513及反射鏡521〜528而穿透、反射之後，被導向聚光 透鏡541〜544。此時，設定為從DOE500到各聚光透鏡 541〜544為止的光路長度相等。即，由半反光鏡511反射 的光束穿透半反光鏡512後、再由反射鏡521反射而到達 聚光透鏡541為止的光路長度，由半反光鏡511反射的光 束被半反光鏡512、反射鏡522、523分別反射而到達聚光 透鏡542為止的光路長度，穿透半反光鏡511的光束被反 201031488 射鏡523、半反光鏡513、反射鏡526、527分別反射而到 達聚光透鏡543為止的光路長度，以及穿透半反光鏡511 的光束被反射鏡523反射、並穿透半反光鏡513後由反射 鏡528反射而到達聚光透鏡544為止的光路長度，分別為 相等的距離。由此，即便在光束分支的近前配置DOE500， 也可將頂帽形強度分佈的雷射光束同樣地導向聚光透鏡 541〜544。 快門（shutter)機構531〜534是用於：在從光學系統 ® 構件50的各聚光透鏡541〜544中射出的雷射光束偏離工 件1時’遮蔽雷射光束的射出。自動聚焦（aut〇matic focus ) 用測長系統52、54由未圖示的檢測光照射用雷射器及自動 聚焦用光電二極體（photodiode)所構成，所述自動聚焦 用測長系統接收由檢測光照射用雷射器所照射的光之中、 從工件1的表面所反射的反射光，並根據其反射光量來將 光學系統構件50内的聚光透鏡541〜544上下驅動，從而 調整光學系統構件50相對於工件1的高度（聚光透鏡541 〇 〜544的焦點）。另外，焦點調整用驅動機構並未圖示。 圖3是表示檢測光學系統構件的結構的示意圖。如圖 1及圖3所示，檢測光學系統構件是由光束採樣器（beam sampler) 92、93、高速光電二極體94以及光軸檢查用電 荷輕合器件（Charge Coupled Device，CCD )照相機96所 構成。光束採樣器92、93是設置在導入到光學系統構件 5〇内的雷射光束的光路中。本實施方式中，光束採樣器 92、93是設置在雷射產生裝置4〇與反射鏡33之間。光束 15 201031488 33082pif 採樣器92、93是對雷射光束的一部分（例如，雷射光束的 約1成左右或1成以下的光量）進行採樣（sampling)後 分支輸出到外部的元件。高速光電二極體94配置成在光接 收面的大致中央附近處接收由光束採樣器92分支輸出的 雷射光束的一部分（採樣光束）。與由高速光電二極競94 所檢測的雷射光束的強度相對應的輸出信號被輸出到控制 機構80中。光轴檢查用CCD照相機％配置成在光接收 面的大致中央附近處接收由光束採樣器93分支輸出的雷 射光束的一部分（採樣光束）。由光軸檢查用CCD照相機 〇 %拍攝的影像被輸出到控制機構8〇中。另外，光轴檢杳 用CCD照相機96也可取得表示照射至高速光電二極體94 的雷射光束位置的圖像，且將該圖像輸出到控制機構 中0 控制裝置80根據來自線性編碼器7〇的檢測信號，而 對XY平臺20的X轴方向的移動速度（移動頻率）進行 檢測，並控制雷射產生裝置40的輸出（雷射頻率），且根 據從咼速光電二極體94以及光轴檢查用CCD照相機％ ❹ 輸出的信號而對從雷射產生裝置40射出的雷射光束的漏 脈衝（omission of pulses)進行檢測，或者根據雷射光束 的光輪偏移量而對雷射產生裝置40的射出條件進行控 制’或者對用來將雷射光束導入到光學系統構件内的反 射鏡33、35的配置等進行回饋（feedback)控制。 圖4是表示控制裝置80的詳細處理的方塊（bl〇ck) 圖。控制裝置80是由分支機構81、漏脈衝判定機構82、 16 201031488 33082pif ί機構83、基準CCD圖像存儲機構84、 光軸偏移#測量機構85以及雷射_器86所構 支 機，81，編碼器7〇的檢測信號（時脈脈衝…滅 pulse))为支且輸出到後段的雷射控制器86中。 =衝狀機構82輸人與來自高速光電二極體94的 雷射先束強度相對應的輸出信號（二_輪出）、及從分支 的檢測信號（時脈脈衝），並據此來判定雷射 圖5 (a)、（b)、（c)是表福脈衝判定 機構^的動作的一個例子的圖。在圖5中，圖5⑷表 示從分支機構81輸出的檢測信號（時脈脈衝）的-侧 mi)表示與從高速光電二極體94輸出的雷射光 束強度相對應的輸出信號（二極體輸出）的-個例子，圖 漏脈衝判定機構82在漏脈衝檢測時所輸出的 警報乜號的一個例子。 A ^ = 所示’漏脈衝判定機構82將 ^自7刀支機構81的時脈脈衝的下降時刻作為觸發(trigger) ^號’而狀二極雜出值大於等於規㈣臨界值 Th’當二極體輸出值小於臨界值Th _，將高電平（_ level)信號輸出到警報產生機構83中。警報產生機構83 :以下警報通知外部，所述警報表示：來自赚衝判定機 構82的信號從低電平（lGwlevd)變化為高電平的時刻， 且產生漏脈衝。警報的通知利用圖像顯示、發音等各種方 法進行通過產生警報，操作者（叩咖沉）可辨識漏脈衝 產生。而且，當此警報頻繁產糾，意味著詩產生裝置 17 201031488 33082pif 的性能劣化或哥命結束。 基準CCD圖像存儲機構84存儲著如圖4所示的基準 CCD圖像84a。此基準CCD圖像84a表示：在光軸檢查用 CCD照相機96的光接收面中央處接收雷射光束的狀態的 圖像。從光轴檢查用CCD照相機96輸出如圖4所示的被 檢查圖像85a。光軸偏移量測量機構85取得來自光轴檢查 用CCD照相機96的被檢查圖像85a，並將被檢查圖像85a 與基準CCD圖像84a進行比較，而對光轴的偏移量進行測 量，且將此偏移量輪出到雷射控制器86中。例如，當從光 轴檢查用CCD照相機96輸出如圖4所示的被檢查圖像85a 這樣的圖像時，光轴偏移量測量機構85將兩者進行比較以 測量出X轴及Y轴方向的偏移量，並將該偏移量輸出到雷 射控制器86中。雷射控制器86對與雷射光束的光轴相關 的裝置、即雷射產生裝置4〇的射出條件或用於將雷射光束 導入到光學系統構件50内的反射鏡33、35的配置等進行 回饋調整，以使被檢查圖像85a與基準CCD圖像84a相一 致。 _所述實施方式中’就檢查雷射光束的光軸偏移以及漏 衝的障況進行了說明，但如圖6所示，也可根據來自高 1光電二極體94的輸出波形，而檢查雷射光束的脈衝狀 態:例如，圖6中’也可測量雷射光束的脈衝寬度以及脈 衝同度，並在這些脈衝寬度以及脈衝高度產生異常時發出 警，。另外，就雷射光束的脈衝寬度而言，將來自高速光 電-極體94 #輸出波形達到規定值或規定值以上的期間 18 201031488 33U82pil 處於規定範圍時作為正常情況，當大於或小於此範圍時判 疋，脈衝寬度異常，並輸出警報。而且，就雷射光束的脈 衝南度而言，將來自高速光電二極體94的輸出波形的最大 值處於允許範圍内時作為正常情況，當大於或小於此允許 範圍時判定為脈衝高度異常，並輸出警報。這樣，由於隨 時採樣雷射光束，因此可即時（realtime)地對脈衝寬度、 脈衝高度（轉（ρ_〇)等雷射光束的品s進行管理。 如果頻繁產生如上所述的漏脈衝，那麼可判斷雷射產生裝 置40劣化或壽命結束。 圖7 (A)、（B)、（C)是從下側（工件侧）觀察圖1 的光學系統構件的圖。圖7 (A)、（B)、（C)表示光學系 統構件50與底板31的一部分。圖7 (A)是表示圖丨所示 的光學系統構件50與底板31的位置關係的圖，如圖所示， 光學系統構件50的端面（圖的上側端部）與底板31的端 面（圖的上侧端部）相一致。圖7(B)是表示光學系統構 件50以穿透孔37的中心為旋轉軸而相對於底板3丨逆時針 • 旋轉約3〇度的狀態的圖。圖7 (C)是表示光學系統構件 50以穿透孔37的中心為旋轉軸而相對於底板31逆時針旋 轉約45度的狀態的圖。 本實施方式的太陽能面板製造裝置中，光學系統構件 50構成為：能以雷射光束的導入孔即穿透孔37的中心為 旋轉軸而自如旋轉。也就是’作為分支機構的光學系統構 件50 ’是以圖2的從反射鏡35而通過DOE500後朝向半 反光鏡511前進的垂直雷射光束的前進方向為中心轴，而 19 201031488 33082pif 受到旋轉控制。由此，可自如地對雷射光束的分支方向與 雷射光束的對工件的相對移動方向（圖7的垂直方向）所 構成的角度Θ進行可變控制。另外，光學系統構件50的旋 轉驅動機構可使用滾珠螺杆或線性馬達等的現有的技術， 但這些均省略圖示。 如圖7所示，即便在對雷射光束的分支方向與雷射光 束的掃描方向（圖7的垂直方向）所構成的角度進行可變 控制的情況下，也使DOE500不相對於雷射光束的相對移 動方向而旋轉。即’通過使用DOE500，雷射光束的照射 ❹ 形狀如圖7的聚光透鏡541〜544内所示，成為如虛線正方 形般的照射形狀。因此，如果對光學系統構件50進行旋轉 控制並且使DOE500旋轉’那麼聚光透鏡541〜544内的 虛線正方形也會相應於DOE500的旋轉量而旋轉。如果在 此狀態下掃描照射雷射光束，那麼正方形的角將會位於切 割線的兩侧脊線處，而脊線會顯示出起伏的形狀。因此， 如本實施方式般，即便對光學系統構件5〇進行旋轉控制， 也使待DOE500不會發生旋轉，由此，如圖7 (b)及圖7 ❹ (C)所示，掃描方向（圖7的垂直方向）與聚光透鏡541 〜544内的虛線正方形的左右兩邊相一致，從而可極其平 滑地形成切割線的兩側脊線，而且，即便在使光學系統構 件50旋轉而適當控制切割線的間距時，也 的切割線。另外，所述實施方式中，對在雷 中僅設置一個DOE的情況進行了說明，但也可在分支後 的各聚光透鏡的正前方分別設置D〇E〇在此情況下，也需 20 201031488 35082pit 要構成為：即便對光學系統構件50進行旋轉控制，也使各 DOE不發生旋轉。另外，可通過將DOE500以與光學系統 構件50分離的方式直接連結設置在底板μ上，從而使 DOE500從光學系統構件50的旋轉中獨立出來。 圖8 (A)、（B)、（C)是表示光學系統構件的旋轉量 與切割線的間距寬度的關係的圖。圖8 (A)、（b)、（C) 分別是表示進行雷射切割加工處理後的切割線的狀態的 φ 圖，其中，圖8(A)表示如圖7(a)所示光學系統構件 5〇未發生旋轉的狀態，圖8 (B)表示如圖7 (B)所示光 學系統構件50旋轉了約30度的狀態，圖8 (C)表示如圖 7 (C)所示光學系統構件50旋轉了約45度的狀態。如果 將圖8 (A)的情況下的切割線的間距設為p〇，那麼圖8 (B)的情況下的間距P30成為p〇xcos3〇。，圖§ (c)的 情況下的間距P45成為p〇xCOS45^這樣，本實施方式的 太陽能面板製造裝置可通過適當調整光學系統構件的 旋轉角度，而對切割線的間距進行可變調整。 ® 所述實施方式中，僅觀察漏脈衝的產生，但也可通過 獲取並存儲漏脈衝產生部位的座標資料（位置資料），而進 行切割線的修補（repair)處理。 所述實施方式中，對利用光轴檢查用CCD照相機96 直，接收由光絲樣H 93分支輸出的雷射絲的一部分 (採樣光束），並通過對其進行圖像處理來檢查光轴偏移的 it況進行了說明，但也可通過光軸檢查用ccD照相機96 或者分割型光電二極體來獲取表示在高速光電二極禮94 21 201031488 33082pif 的光接收面中央處接收雷射光束的狀態的圖像，來作為被 檢查圖像’且由此檢查光軸偏移。 所^實施方式中，對檢查雷射光束的光軸偏移以及漏 脈衝的情況進行了說明，但也可將光轴偏移、漏脈衝、脈 衝寬度以及脈衝高度分別適當組合後檢查雷射光束的狀 態。 所述實施方式中，對從形成有薄膜的工件i的表面照 射雷射光束’從而在薄膜上形成切割線（溝槽）的情況進 行了說明，但也可從工件i的背面照射雷射光束，從而在 〇 工件表面的薄膜上形成切割線。 所述實施方式中，以太陽能面板製造裝置為例進行了 說明，但本發明也可應用在電致發光（electr〇luniinescent， EL)面板製造裝置、EL面板修補裝置、平面顯示器（刃紂 Panel Display，FPD)修補裝置等進行雷射加工的裝置中。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明’任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内’當可作些許之更動與潤飾，故本 ❹ 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1是表示本發明的一實施方式的雷射加工裝置的概 略結構的圖。 圖2是表示圖1的光學系統構件的詳細結構的圖。 圖3是表示圖1的檢测光學系統構件的結構的示意圖。 圖4是表示控制裝置的詳細處理的方塊圖。 22 201031488 的漏脈衝判定機構 圖5 (A)、（B)、（C)是表示圖3 的動作的一個例子的圖。 圖6疋表示從圖5的高速光電二極體輸出的波形的一 個例子的圖。 圖7 (A)、（b)、（C)是從下侧（工件側）觀察 的光學系統構件的圖。 、 圖8(A)、（B)、⑹是表示光學系統構 與切割線的間距寬度的關係的圖。 I得量[Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. The laser processing apparatus performs a laser beam processing (laser cutting) step of the solar panel manufacturing apparatus. The solar panel manufacturing apparatus of Fig. 1 is composed of a susceptor 10, a χγ platform 2〇, a laser generating device 40, an optical system member 5〇, an alignment camera device 6〇, a linear encoder 〇inear (7), for example) 7〇, control device 80, detection optical system components, and the like. On the susceptor 10, a χγ stage 2〇 that is driven and controlled along the X-axis direction and the 丫-axis direction (Χγ plane) of the susceptor 10 is recognized. The Y-input platform 20 is controlled to move in the X direction and the γ direction. The drive mechanism of the 1' XY stage 2〇 uses a ball screw (baU or (linear motor), etc., and their illustrations are omitted here. The workpiece to be laser-processed is held on the upper side of the XY stage 20! 'Slideframe 3' provided on the base ίο, the 11 201031488 33082pif carriage maintains the optical system member while being swayed in the Y-axis direction. The χγ platform 2〇 is configured to be rotatable The axis is rotated along the e side. In addition, when the carriage 30 can be used to sufficiently ensure the amount of movement of the gamma vehicle; = the platform 20 can be configured to perform only the axial direction. The platform 20 can also be an X-axis platform structure. The carriage 30 is mounted on a moving platform provided on the four corners of the base 1. The carriage 30 is controlled by the moving table to move in the gamma direction. A vibration-free member (not shown) is disposed between the moving device 31 and the mobile station. The laser generating device 40, the optical system member 5A, and the control device 80 are disposed on the bottom plate 3ΐ0 of the carriage 3〇. Optical system component 50 is made up of lenses A combination of a mirr〇〇 and a lens 〇ens), the optical system member 50 divides the laser beam generated by the laser generating device 4 into four series and guides it to the workpiece 1 on the χγ platform 2〇 The number of divisions of the laser beam is not limited to four series, as long as it is two series or two or more series. The alignment camera device 60 acquires both ends of the XY stage 2 且 and the workpiece i (X-axis direction) An image in the vicinity of the front and rear edge portions. The image acquired by the alignment camera device 60 is output to the control device 8. The control device 80 images and the workpiece from the alignment camera device 6〇 The identity (ID) data is stored together in a database mechanism for later alignment processing of the workpiece 1. The linear encoder 70 is provided on the side of the X-axis moving platform disposed on the XY stage 2〇. A scale member and a detecting portion are formed. The detection signal of the linear encoder 70 is output to the control device 8. The control device 80 detects the X of the XY stage 20 according to the detection signal from the linear encoder 70 according to 12 201031488 33082pif.The moving speed of the direction (moving frequency) is controlled by the output (laser frequency) of the laser generating device 40. As shown in Fig. 1, the optical system member 50 is disposed on the lower surface side of the bottom plate 31. The mirrors 33, 35 of the laser beam guiding optical system member 50 emitted from the radiation generating device 40 are disposed on the bottom plate 31. The laser beam emitted from the laser generating device 40 is reflected by the mirror 33 to the mirror 35' The mirror 35 directs the reflected laser beam from the mirror 33 to the optical system member 50 via a through hole provided in the bottom plate 31. In addition, if the laser beam emitted from the laser beam generating device 40 can be introduced into the optical system member 50 from the upper side through the penetration hole provided in the bottom plate 31, the optical system member 50 can adopt any structure. . For example, the laser generating device 40 may be disposed on the upper side of the penetration hole, and the laser beam is directly guided to the optical system member 50 via the penetration hole. FIG. 2 is a view showing a detailed configuration of the optical system member 50. The actual structure of the optical system member 50 is complicated, and the illustration ❹ is simplified here for the sake of simplicity of explanation. Fig. 2 is a view of the inside of the optical system member 50 as seen from the χ-axis direction of Fig. 1; As shown in Fig. 2, a through hole 37 is formed in the bottom plate 31 for introducing a laser beam reflected by the mirror 35 into the optical system member 50. Directly below the penetration hole 37, a phase diffractive optical element (DOE: Diffractive Optical Element) 500 which converts a laser beam of a Gaussian intensity distribution into a top hat-shaped intensity distribution is converted into a DOE500 The laser beam of the top hat-shaped intensity distribution laser beam (top hat shape 13 201031488 33082pif beam) is respectively branched into a reflected beam and a transmitted beam via the half mirror 511, and the reflected beam is directed toward the right half mirror 512, and the transmitted beam is transmitted. The mirror 524 that faces downward is advanced. The light beam reflected by the half mirror 511 is further branched by the half mirror 512 into a reflected beam and a transmitted beam, and the reflected beam is advanced toward the lower mirror 522, and the transmitted beam is advanced toward the mirror 521 on the right. The light beam that has passed through the half mirror 512 is reflected by the mirror 521, and then irradiated onto the workpiece 1 via the lower collecting lens 541. The light beam reflected by the half mirror 512 is reflected by the mirrors 522 and 523, and then irradiated onto the workpiece 1 via the lower collecting lens 542. The light beam that has penetrated the half mirror 511 is reflected by the mirror 524 and proceeds toward the left. The light beam reflected by the mirror 524 is branched by the half mirror 513 into a reflected beam and a transmitted beam, and the reflected beam is directed toward the lower mirror 526, and the transmitted beam is directed toward the left mirror 528. The light beam reflected by the half mirror 513 is reflected by the mirrors 526 and 527, and is then incident on the workpiece 1 via the lower collecting lens 543. The light beam that has passed through the half mirror 513 is reflected by the mirror 528, and then irradiated onto the workpiece 1 via the lower collecting lens 544. The top hat beam converted by the DOE 500 is penetrated and reflected by the half mirrors 511 to 513 and the mirrors 521 to 528, and then guided to the condensing lenses 541 to 544. At this time, the optical path length from the DOE 500 to each of the collecting lenses 541 to 544 is set to be equal. That is, the optical path length of the light beam reflected by the half mirror 511 after passing through the half mirror 512 and then reflected by the mirror 521 to reach the collecting lens 541 is reflected by the half mirror 511 by the half mirror 512 and reflected. The lengths of the optical paths of the mirrors 522 and 523 respectively reflecting the condensing lens 542 are reflected, and the light beams that have passed through the half mirror 511 are reflected by the anti-201031488 mirror 523, the half mirror 513, and the mirrors 526 and 527, respectively, to reach the collecting lens 543. The length of the optical path until the light beam passing through the half mirror 511 is reflected by the mirror 523 and penetrates the half mirror 513 and is reflected by the mirror 528 to reach the collecting lens 544 is equal. Thereby, even if the DOE 500 is disposed in the vicinity of the beam branch, the laser beam having the top hat-shaped intensity distribution can be similarly guided to the collecting lenses 541 to 544. The shutter mechanisms 531 to 534 are for obscuring the emission of the laser beam when the laser beam emitted from each of the collecting lenses 541 to 544 of the optical system ® member 50 is displaced from the workpiece 1. Autofocus (aut〇matic focus) The length measuring systems 52 and 54 are composed of a laser beam for detecting light and a photodiode for autofocus (not shown), and the autofocus measuring system receives Among the light irradiated by the detecting light-illuminating laser, the reflected light reflected from the surface of the workpiece 1 is driven up and down by the collecting lenses 541 to 544 in the optical system member 50 in accordance with the amount of reflected light. The height of the optical system member 50 with respect to the workpiece 1 (the focus of the condensing lenses 541 〇 544 544). In addition, the focus adjustment drive mechanism is not shown. Fig. 3 is a schematic view showing the structure of a detecting optical system member. As shown in FIGS. 1 and 3, the detecting optical system member is composed of a beam sampler 92, 93, a high-speed photodiode 94, and a charge coupled device (CCD) camera 96 for optical axis inspection. Composition. The beam samplers 92, 93 are disposed in the optical path of the laser beam introduced into the optical system member 5''. In the present embodiment, the beam samplers 92, 93 are disposed between the laser generating device 4A and the mirror 33. Light beam 15 201031488 33082pif The samplers 92 and 93 are elements that are subjected to sampling (sampling) a part of the laser beam (for example, about 10% or less of the laser beam) and then branching and outputting to the outside. The high speed photodiode 94 is configured to receive a portion (sampling beam) of the laser beam branched by the beam sampler 92 at approximately the center of the light receiving surface. The output signal corresponding to the intensity of the laser beam detected by the high speed photodiode 94 is output to the control mechanism 80. The optical axis inspection CCD camera % is arranged to receive a part (sampling beam) of the laser beam branched and output by the beam sampler 93 in the vicinity of substantially the center of the light receiving surface. The image taken by the CCD camera 〇% for optical axis inspection is output to the control unit 8A. Further, the CCD camera 96 for optical axis inspection can also obtain an image indicating the position of the laser beam irradiated to the high-speed photodiode 94, and output the image to the control mechanism. The control device 80 is based on the linear encoder. The detection signal of 7〇 is detected, and the moving speed (moving frequency) of the XY stage 20 in the X-axis direction is detected, and the output (laser frequency) of the laser generating device 40 is controlled, and according to the idle photodiode 94. And an optical axis inspection CCD camera % ❹ a signal outputted to detect an omission of pulses of the laser beam emitted from the laser generating device 40, or a laser beam according to a laser beam offset amount of the laser beam The emission conditions of the generating device 40 are controlled 'or feedback control is performed on the arrangement of the mirrors 33, 35 for introducing the laser beam into the optical system member. FIG. 4 is a block diagram showing the detailed processing of the control device 80. The control device 80 is composed of a branching mechanism 81, a leak pulse determining mechanism 82, a 16 201031488 33082pif ί mechanism 83, a reference CCD image storage mechanism 84, an optical axis offset # measuring mechanism 85, and a laser finder 86, 81 The detection signal (clock pulse ... pulse) of the encoder 7 is branched and output to the laser controller 86 of the rear stage. The punching mechanism 82 inputs an output signal (two rounds) corresponding to the intensity of the laser beam from the high speed photodiode 94, and a detection signal (clock pulse) of the slave branch, and determines therefrom. The laser maps 5 (a), (b), and (c) are diagrams showing an example of the operation of the watch pulse judging means ^. In Fig. 5, Fig. 5 (4) shows that the - side mi of the detection signal (clock pulse) outputted from the branching mechanism 81 indicates an output signal corresponding to the intensity of the laser beam output from the high-speed photodiode 94 (diode). An example of the output) is an example of an alarm nickname output by the drain pulse determining means 82 at the time of leak pulse detection. A ^ = The leak pulse judging mechanism 82 indicates that the falling time of the clock pulse from the 7-knife branch 81 is used as a trigger ^ number ', and the dipole-like value is greater than or equal to the gauge (four) threshold Th' The diode output value is smaller than the threshold value Th _, and a high level (_level) signal is output to the alarm generating mechanism 83. The alarm generating unit 83: the following alarm is notified to the outside, and the alarm indicates that the signal from the earning determination mechanism 82 changes from a low level (lGwlevd) to a high level, and a leak pulse is generated. The notification of the alarm is generated by various methods such as image display and pronunciation, and the operator can recognize the occurrence of the leak pulse. Moreover, when this alarm is frequently produced, it means that the performance of the poetry generating device 17 201031488 33082pif is degraded or the end of the life. The reference CCD image storage unit 84 stores a reference CCD image 84a as shown in Fig. 4 . This reference CCD image 84a indicates an image of a state in which a laser beam is received at the center of the light receiving surface of the optical axis inspection CCD camera 96. The inspection image 85a shown in Fig. 4 is output from the optical axis inspection CCD camera 96. The optical axis shift amount measuring means 85 acquires the inspection image 85a from the optical axis inspection CCD camera 96, compares the inspection image 85a with the reference CCD image 84a, and measures the offset of the optical axis. And the offset is rounded out to the laser controller 86. For example, when an image such as the inspection image 85a shown in FIG. 4 is output from the optical axis inspection CCD camera 96, the optical axis shift amount measuring mechanism 85 compares the two to measure the X-axis and the Y-axis. The offset of the direction is output to the laser controller 86. The laser controller 86 sets the emission conditions of the device related to the optical axis of the laser beam, that is, the laser generating device 4A, or the arrangement of the mirrors 33, 35 for introducing the laser beam into the optical system member 50, and the like. The feedback adjustment is performed such that the image to be inspected 85a coincides with the reference CCD image 84a. In the above-described embodiment, the optical axis shift of the laser beam and the leakage of the laser beam are described. However, as shown in FIG. 6, the output waveform from the high-photodiode 94 may be used. Check the pulse state of the laser beam: for example, in Figure 6, 'the pulse width of the laser beam and the pulse equality can also be measured, and an alarm is issued when these pulse widths and pulse heights are abnormal. Further, in the pulse width of the laser beam, the period 18 201031488 33U82pil from the high-speed photo-electrode body 94 output waveform reaches a predetermined value or a predetermined value or more is a normal condition, and when it is larger or smaller than the range As a result, the pulse width is abnormal and an alarm is output. Further, as for the pulse southness of the laser beam, the maximum value of the output waveform from the high-speed photodiode 94 is within the allowable range as a normal condition, and when it is larger or smaller than the allowable range, it is determined that the pulse height is abnormal, And output an alarm. In this way, since the laser beam is sampled at any time, the product of the laser beam such as the pulse width and the pulse height (rotation (ρ_〇)) can be managed in real time. If the leak pulse as described above is frequently generated, then It can be judged that the laser generating device 40 is deteriorated or the life is completed. Fig. 7 (A), (B), and (C) are views of the optical system member of Fig. 1 as viewed from the lower side (work side). Fig. 7 (A), B) and (C) show a part of the optical system member 50 and the bottom plate 31. Fig. 7(A) is a view showing the positional relationship between the optical system member 50 and the bottom plate 31 shown in Fig. 2, as shown in the figure, the optical system member The end surface (the upper end portion of the drawing) of 50 corresponds to the end surface of the bottom plate 31 (the upper end portion of the drawing). Fig. 7(B) shows the optical system member 50 with the center of the penetration hole 37 as the rotation axis with respect to FIG. 7(C) is a view showing a state in which the optical system member 50 is rotated counterclockwise by about 45 degrees with respect to the bottom plate 31 with the center of the penetration hole 37 as a rotation axis. In the solar panel manufacturing apparatus of the present embodiment, the optical system member 50 is constructed It is possible to freely rotate with the center of the penetration hole 37, which is the introduction hole of the laser beam, as the rotation axis. That is, the 'optical system member 50' as the branching mechanism is oriented from the mirror 35 of FIG. 2 through the DOE 500. The advancing direction of the vertical laser beam advancing by the half mirror 511 is the central axis, and 19 201031488 33082pif is controlled by the rotation. Thus, the branching direction of the laser beam and the relative moving direction of the laser beam to the workpiece are freely ( The angle Θ formed by the vertical direction of Fig. 7 is variably controlled. Further, the conventional rotation technique of the optical system member 50 may be a conventional technique such as a ball screw or a linear motor, but these are omitted. It is shown that even when the angle formed by the branching direction of the laser beam and the scanning direction of the laser beam (the vertical direction of FIG. 7) is variably controlled, the relative movement direction of the DOE 500 with respect to the laser beam is not made. Rotation, that is, 'by using the DOE 500, the illumination ❹ shape of the laser beam is as shown in the condensing lenses 541 to 544 of FIG. Therefore, if the optical system member 50 is rotationally controlled and the DOE 500 is rotated 'the dotted squares in the condensing lenses 541 to 544 are also rotated corresponding to the amount of rotation of the DOE 500. If the laser beam is irradiated in this state, the laser beam is irradiated. Then, the corners of the square will be located at the ridges on both sides of the cutting line, and the ridges will show an undulating shape. Therefore, as in the present embodiment, even if the optical system member 5 is rotated, the DOE 500 is to be treated. The rotation does not occur, and as shown in FIGS. 7(b) and 7(C), the scanning direction (the vertical direction in FIG. 7) coincides with the left and right sides of the dotted square in the collecting lenses 541 to 544. Thereby, the ridge lines on both sides of the dicing line can be formed extremely smoothly, and the dicing line can be cut even when the optical system member 50 is rotated to appropriately control the pitch of the dicing lines. Further, in the above-described embodiment, the case where only one DOE is provided in the ray has been described. However, it is also possible to provide D 〇 E 正 in front of each of the condensing lenses after the branching. In this case, 20 is also required. 201031488 35082pit is configured such that even if the optical system member 50 is rotationally controlled, each DOE does not rotate. Further, the DOE 500 can be independently connected from the rotation of the optical system member 50 by directly connecting the DOE 500 to the bottom plate μ in a manner of being separated from the optical system member 50. 8(A), (B) and (C) are diagrams showing the relationship between the amount of rotation of the optical system member and the pitch width of the dicing line. 8(A), (b), and (C) are φ diagrams showing the state of the dicing line after the laser cutting processing, respectively, wherein Fig. 8(A) shows the optical system as shown in Fig. 7(a). The member 5 is not rotated, and Fig. 8(B) shows the state in which the optical system member 50 is rotated by about 30 degrees as shown in Fig. 7(B), and Fig. 8(C) shows the optical as shown in Fig. 7(C). System component 50 is rotated about 45 degrees. When the pitch of the dicing lines in the case of FIG. 8(A) is p〇, the pitch P30 in the case of FIG. 8(B) becomes p〇xcos3〇. In the case of Fig. § (c), the pitch P45 is p〇xCOS45^, and the solar panel manufacturing apparatus of the present embodiment can variably adjust the pitch of the dicing lines by appropriately adjusting the rotation angle of the optical system member. In the above-described embodiment, only the generation of the leak pulse is observed, but the repair processing of the cut line can also be performed by acquiring and storing the coordinate data (position data) of the portion where the leak pulse is generated. In the above embodiment, the CCD camera 96 for optical axis inspection is used to receive a part (sampling beam) of the laser light branched by the light-wire-like H 93 branch, and the optical axis deviation is checked by performing image processing thereon. The state of the shift is explained, but the CCD camera 96 or the split type photodiode may be used to obtain the laser beam indicating the center of the light receiving surface of the high speed photodiode 94 21 201031488 33082pif. The image of the state comes as the image to be inspected' and thus the optical axis offset is checked. In the embodiment, the optical axis shift and the leak pulse of the laser beam are described. However, the optical beam offset, the leak pulse, the pulse width, and the pulse height may be appropriately combined to check the laser beam. status. In the above embodiment, the case where the surface of the workpiece i on which the thin film is formed is irradiated with the laser beam 'to form a cut line (groove) on the film is described, but the laser beam may be irradiated from the back surface of the workpiece i. Thus, a cut line is formed on the film on the surface of the workpiece. In the above embodiment, the solar panel manufacturing apparatus has been described as an example. However, the present invention is also applicable to an electroluminescence (EL) panel manufacturing apparatus, an EL panel repairing apparatus, and a flat panel display (blade panel display). , FPD) repair devices and other devices for laser processing. The present invention has been disclosed in the above embodiments, but it is not intended to limit the invention to those skilled in the art, and it is possible to make some modifications and refinements without departing from the spirit and scope of the invention. The scope of protection of this invention is defined by the scope of the appended patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention. Fig. 2 is a view showing a detailed configuration of an optical system member of Fig. 1; Fig. 3 is a schematic view showing the structure of the detecting optical system member of Fig. 1. Fig. 4 is a block diagram showing detailed processing of the control device. 22 Leakage pulse judging means of 201031488 Figs. 5(A), (B), and (C) are diagrams showing an example of the operation of Fig. 3. Fig. 6A is a view showing an example of a waveform output from the high-speed photodiode of Fig. 5. Fig. 7 (A), (b), and (C) are views of the optical system member viewed from the lower side (work side). Figs. 8(A), (B) and (6) are views showing the relationship between the optical system structure and the pitch width of the dicing lines. I get the amount
【主要元件符號說明】 1 工件 10 基座 20 XY平臺 30 滑動架 31 底板 33、35 反射鏡 37 穿透孔 40 雷射產生裝置 50 光學系統構件 52、54 自動聚焦用測長系統 60 對準照相機裝置 70 線性編碼器 80 控制裝置 81 分支機構 82 漏脈衝判定機構 23 201031488 33082pif[Main component symbol description] 1 Workpiece 10 Base 20 XY stage 30 Slide frame 31 Base plate 33, 35 Mirror 37 Through hole 40 Laser generating device 50 Optical system components 52, 54 Autofocus measuring system 60 Aligning camera Device 70 linear encoder 80 control device 81 branching mechanism 82 leakage pulse determining mechanism 23 201031488 33082pif
83 警報產生機構 84 基準CCD圖像存儲機構 84a , 基準CCD圖像 85 光轴偏移量測量機構 85a 被檢查圖像 86 雷射控制器 92、93 光束採樣器 94 高速光電二極體 96 光轴檢查用CCD照相機 500 相位型衍射光學元件（DOE) 511〜513 半反光鏡 521〜528 反射鏡 531〜534 快門機構 541〜544 聚光透鏡 P0、P30、P45 間距 2483 alarm generating mechanism 84 reference CCD image storage mechanism 84a, reference CCD image 85 optical axis offset measuring mechanism 85a image to be inspected 86 laser controller 92, 93 beam sampler 94 high speed photodiode 96 optical axis Inspection CCD Camera 500 Phase Diffractive Optical Element (DOE) 511~513 Half Mirrors 521~528 Mirrors 531~534 Shutter Mechanism 541~544 Condenser Lens P0, P30, P45 Pitch 24