201030302 六、發明說明： 【發明所屬之技術領域】 一種應 之製作 • 本發明係涉及一種傳熱裝置，特別步及 用於電子元件散熱領域之熱管及其毛細結 方法。 【先前技術】 目前，由於熱管具有較快之傳熱速度 ❹ 應用於電子元件散熱領域。 ，、之 常用之熱管包括一密閉容器、設於密閉容号内 t一吸液芯及適量之"'作液體，該熱管—端為蒸發 端而另-端為冷凝端。當熱管蒸發端受熱時， 液，蒸發汽化，蒸汽在微小壓差下流向冷凝端放出 熱置後凝結成液體，液體在吸液芯之毛細力作用 回流到蒸發端’從岐熱量由熱管蒸發端迅速傳至 ❹ 冷凝端。而熱管C生能受毛細力與滲透性二因 素之影響，該二因素隨著吸液芯之毛細結構之毛細 孔隙之大小而變化，當毛細孔隙較小時，其具有較 大毛田力彳驅動凝結液體進入毛細結構内並向蒸 發端回/瓜’但另一方面，毛細孔隙之減小亦使工作 液體回抓之摩擦力和枯滞力增大即卫作液體回流 =力〜大’導致工作液體回流速度慢，易使產品性 能不：。而當毛細孔隙較大時，工作液體受到較小 之回机阻力’ $，凝結液體吸入毛細結構之毛細力 4 201030302 亦會隨之減小，不利於工作液體之回流，同樣易導 致產品性能不良。 【發明内容】 有鑒於此，有必要提供一種性能較好之熱管。 -種熱管，包括外殼及設於外殼内之毛細結 構，所述毛細結構包括底層及凸設於所述底層上之 複數凸起’所述底層結合於所述外殼上，所述凸起 間隔設置，從而於每相鄰之兩凸起間形成一溝槽， 所述底層靠近溝槽底端之部分形成為溝槽之溝部，201030302 VI. Description of the invention: [Technical field to which the invention pertains] A production method should be made. The present invention relates to a heat transfer device, particularly to a heat pipe for use in the field of heat dissipation of electronic components and a capillary knot method therefor. [Prior Art] At present, heat pipes have a relatively fast heat transfer rate ❹ applied to the field of heat dissipation of electronic components. The commonly used heat pipe comprises a closed container, a liquid absorbing core and a suitable amount of liquid in the sealed container, the heat pipe end being the evaporation end and the other end being the condensation end. When the evaporation end of the heat pipe is heated, the liquid evaporates and vaporizes, and the steam flows to the condensation end under a slight pressure difference to release the heat and then condenses into a liquid. The liquid is sucked back to the evaporation end by the capillary force of the liquid absorbing core. Transfer quickly to the condensing end. The heat pipe C can be affected by the two factors of capillary force and permeability. The two factors vary with the size of the capillary pores of the capillary structure of the wick. When the capillary pores are small, it has a large hair field force driving condensation. The liquid enters the capillary structure and returns to the evaporation end. On the other hand, the reduction of the capillary pores also increases the frictional force and stagnation force of the working liquid back to the grip, that is, the liquid reflux = force ~ large 'causes work The liquid reflux rate is slow, which makes the product performance not easy: When the capillary pores are large, the working fluid is subjected to a small return resistance '$, and the capillary force of the condensed liquid sucking into the capillary structure 4 201030302 is also reduced, which is not conducive to the backflow of the working liquid, and also causes poor product performance. . SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat pipe with better performance. a heat pipe comprising a casing and a capillary structure disposed in the casing, the capillary structure comprising a bottom layer and a plurality of protrusions protruding from the bottom layer, the bottom layer being bonded to the outer casing, the protrusions being spaced apart a groove is formed between each adjacent two protrusions, and a portion of the bottom layer near the bottom end of the groove is formed as a groove portion of the groove.
所述溝部與凸起區域之毛細結構具有不同之毛細半 徑及孔隙率。 T -種熱管之毛細結構之製作方法， 所需毛細結構之孔徑與孔隙率，選擇與毛細結構： 2與:匕隙！相近之開孔海綿作為毛細結構製作之 土…鑛月’j活化處理，以在海綿表面 將具有起錢表層之海綿置入電鑄槽内進:1 鎮；將電鑄好之銅毛細結構進行高溫燒結 網内之海綿組織，报#目士 —〜 陈用 細結構；將且右一狀交聯結構之毛 或㈣成所需要之溝槽形狀，使毛包= ;：及:f於所述底層上間隔排列之複數凸；4 !結:3層靠近溝槽底端之部分料起區域3 ”、 /、有不同之毛細半徑及孔隙率。 5 201030302 所述t = 所述溝部區域之毛細結構具有與 率:而二，，不同之毛細半徑及孔隙 從而使δ亥毛細結構之毛細半徑及 區域之工作液體回、* ”…較大之 細半徑及孔隙率而f毛細結構之毛 二有利，管内之工作流體之渗透 使熱官具有良好之傳熱性能。 、 【實施方式】 圖1所示為本發明一較佳實施例中之敎管兮 ::為板型’其包括-外殼η及形成於該外殼;： -毛細結構13。該熱管内充有適量之工作 “卫作液體選用低海點化學性質穩定之液 體，如乙醇、水等。 鬌 入該外殼11係由導熱性能良好之材料如銅、銅鋁 :金等製成，其包括位於上方之一上殼體m及位 於下方之一下殼體112。 該毛細結構13由導熱性能較好之金屬材料製 3 ’如銅或紹等。圖2所示為該毛細結構藉由顯微 鏡拍攝之照片示意圖’該毛細結構13具有三維網狀 父聯結構’此結構相對於網狀（mesh)二維平面結 構’具有二維立體形狀；相對於溝槽（g_ve)結 構具有更大之毛細力；相對於燒結粉末（sinter Power )結構具有更完整之網狀交聯結構與更大之孔 6 201030302 隙率，且在受力壓制時，還不易破碎。 凊再參照圖1，在本實施例中，該毛細結構13 為溝槽型’其包括一底層及凸設於該底層131 上^複數凸起132。該底| 131 &平板型，其底面 緊密貼合於該外殼^之下殼體112上。該等凸起 均為梯形，且其頂面抵頂於該外殼n之上殼體^ 上。該等凸起132 fa1隔設置，從而於每相鄰之兩凸 ❿ ，I32間形成一倒置梯形狀之溝槽133,該底層131 靠近溝槽133底端之部分形成為溝槽133之溝部 所述溝部135區域之毛細結構具有與所述凸起 132區域之毛細結構不同之毛細半徑及孔隙率，在 本實施例中，所述溝部135區域之毛細結構較凸起 132區域之毛細結構之毛細半徑及孔隙率小。 上述熱管十，由於所述溝部135區域之毛細結 • 構具有與所述凸起132區域之毛細結構不同之毛細° 半控及孔隙率，從而使該毛細結構13之毛細半和及 孔隙率較大之區域（第一實施例中之凸起132區； 之工作液體回流阻力減少，而該毛細結構13之毛細 半徑及孔隙率較小之區域（第一實施例中之溝部⑶ 區域）之工作液體毛細力增加，有利於提高熱管内 之工作流體之渗透性與流動性，使熱管具有良好之 傳熱性能。進一步地’由於所述凸起132區域之毛 細結構之毛細半徑及孔隙率相對較大，故其具有較 7 201030302 ' =之滲透性，從而可使上層之工作液體（靠近散熱 器或其他散熱體之工作液體）通過所述凸起132順 暢地流動到下層，另，所述凸起132可有效地增加 工作液體之蒸發面積，故，有利於增強熱管之散熱 及熱傳效果。再者，所述凸起132之頂面抵頂於該 卜办又11之上设體上，所述底層131之底面緊密 貼合於該外殼U之下殼體112上，可對外殼n、起 • 到加強與支撐作用，以保證熱管具有較高之抗壓性 與平面度。 以下以電鍍銅毛細結構簡單說明上述熱管令之 毛細結構13之製造方法。 根據產品結構及熱傳量，計算出所需毛細力與 毛細半徑，以確定出毛細結構之孔徑與孔隙率；選 ，與毛細結構之孔徑與孔隙率相近之開孔海綿（聚 馨酯、聚醚）作為毛細結構製作之基材；電鍍前活化 處理，對開孔海綿進行必要之水洗、脫脂處理，之 後進行活化進鍍處理（或喷塗導電漆、導電油、化 學鍍等以在海綿表面形成電鍍表層；電鍍加厚處 理，之後將具有起鍍表層之海綿置入電鑄槽内進行 電鑄’在達到-定厚度後，取出，進行鑄後處理； 將電鑄好之銅毛細結構進行高溫燒結，去除鋼網内 之海綿組織，即形成具有三維網狀交聯結構之毛細 結構；將具有三維網狀交聯結構之毛細結構切割或 201030302 壓制成所需要之溝 成上述毛細結構f3“狀，本⑽為梯形’即製 上述製造方法中， 之開孔海錦作為毛細結構；同部;不: 使毛細結構之之衣作基材，以 稱之不Η部位具有不同之毛 率，即可使上述 千< 及孔隙 且有不I 舞之凸起132及溝部135 毛細力與滲透性之效杲羊從而達到合理分佈 開孔海綿作為毛細結構之製作基材， ;ί J方法按壓製作好之毛細結構之.不同 縮=構受…部位因受到擠麼而收 亦於=該雜之毛細半徑及孔料變小，同時 亦於該處形成溝槽133。 圖3所示為本發明熱管之第二實施例，盘第一 實施例中之熱管不同的是，該熱管之外殼21為圓環 形，該毛細結構23之底Μ231,亦呈圓環形，該底層 231之底面貼合於該外殼21之整個内壁上，所述凸 起232沿徑向延伸，且其頂面間隔設置，並未抿頂 於熱管之外殼21上。 當然，上述熱管之毛細結構13、23之凸起M2 與溝槽133之形狀亦不限於梯形，還可為方形、三 角形等。 7 一 依 綜上所述，本發明符合發明專利之要件，爰 9 201030302 法提出專利申請。惟以上所述者僅為本發明之較佳 ' 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 v 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1為本發明第一實施例之熱管沿徑向之剖面 示意圖。 ❹ 圖2為圖1所示熱管中之毛細結構藉由顯微鏡 拍攝之照片示意圖。 圖3為本發明第二實施例之熱管沿徑向之剖面 示意圖。 【主要元件符號說明】 外殼 11、21 上殼體 111 下殼體 112 毛細結構 13、23 底層 131、231 凸起 132> 232 溝槽 133 溝部 135 10The capillary structure of the groove portion and the convex portion has different capillary diameters and porosity. T-type heat pipe capillary structure manufacturing method, required capillary structure pore size and porosity, selection and capillary structure: 2 and: 匕 gap! A similar open-cell sponge is used as the soil for the capillary structure. The mineral moon 'j is activated to place the sponge with the surface of the sponge into the electroforming tank on the surface of the sponge: 1 town; the electro-cast copper capillary structure is carried out. Sponge structure in high-temperature sintering mesh, reported #目士—~ Chen uses fine structure; the right-handed cross-linked structure of the hair or (4) into the desired groove shape, so that the hair bag = ;: and: f in the The plurality of protrusions arranged at intervals on the bottom layer; 4: junction: the portion of the 3 layers near the bottom end of the trench is region 3", /, has different capillary radii and porosity. 5 201030302 the t = the groove region The capillary structure has a rate of: and two, different capillary radii and pores, so that the capillary radius of the delta capillary structure and the working liquid of the region are back, *"...the larger radius and porosity and the capillary structure of the f capillary structure Advantageously, the penetration of the working fluid within the tube provides the heat officer with good heat transfer properties. [Embodiment] FIG. 1 shows a manifold of the present invention in a preferred embodiment of the present invention, which comprises a housing η and is formed in the housing;: - a capillary structure 13. The heat pipe is filled with a proper amount of work. "The liquid used in the maintenance of the liquid is stable at a low sea point, such as ethanol, water, etc. The casing 11 is made of a material having good thermal conductivity such as copper, copper, aluminum: gold, etc. The upper housing m and the lower housing 112 are located at the upper side. The capillary structure 13 is made of a metal material having a good thermal conductivity, such as copper or slag. Figure 2 shows the capillary structure. Photograph taken by a microscope. The capillary structure 13 has a three-dimensional network-like parent structure. This structure has a two-dimensional shape with respect to a mesh two-dimensional planar structure; it has a larger structure than a groove (g_ve) structure. Capillary force; a more complete mesh cross-linked structure and a larger pore size 6 201030302 than the sintered powder (sinter Power) structure, and is not easily broken when pressed by force. 凊 Referring again to Figure 1, in In this embodiment, the capillary structure 13 is of a groove type, which comprises a bottom layer and a plurality of protrusions 132 protruding from the bottom layer 131. The bottom plate has a flat surface and the bottom surface thereof is closely attached to the outer casing. Lower housing 112. The protrusions are all trapezoidal, and the top surface thereof abuts against the upper casing of the outer casing n. The protrusions 132 fa1 are spaced apart to form an inverted ladder shape between each adjacent two ridges and I32. a groove 133, a portion of the bottom layer 131 near the bottom end of the groove 133 is formed as a groove portion of the groove 133. The capillary structure of the groove portion 135 has a capillary radius and a porosity different from the capillary structure of the protrusion 132 region. In the present embodiment, the capillary structure of the region of the groove portion 135 is smaller than the capillary radius and porosity of the capillary structure in the region of the protrusion 132. The heat pipe ten has a capillary structure and a convex portion in the region of the groove portion 135. The capillary structure of the 132 region is different from the capillary half control and porosity, so that the capillary half of the capillary structure 13 and the region with a large porosity (the convex portion 132 in the first embodiment; the working fluid reflux resistance) The working capillary capillary force of the region of the capillary structure 13 having a small capillary radius and a small porosity (the groove portion (3) region in the first embodiment) is increased, which is advantageous for improving the permeability and fluidity of the working fluid in the heat pipe. The heat pipe has good heat transfer performance. Further, since the capillary radius and porosity of the capillary structure in the region of the protrusion 132 are relatively large, it has a permeability higher than that of 7 201030302 ', so that the upper layer can work. The liquid (a working liquid close to the heat sink or other heat sink) smoothly flows to the lower layer through the protrusions 132, and the protrusion 132 can effectively increase the evaporation area of the working liquid, thereby facilitating heat dissipation of the heat pipe. And the heat transfer effect. Further, the top surface of the protrusion 132 abuts against the upper body of the upper portion 11 , and the bottom surface of the bottom layer 131 is closely attached to the lower casing 112 of the outer casing U. It can strengthen and support the outer casing n to ensure the heat pipe has high pressure resistance and flatness. Hereinafter, a method of manufacturing the capillary structure 13 of the above heat pipe will be briefly described by an electroplated copper capillary structure. According to the product structure and heat transfer amount, calculate the required capillary force and capillary radius to determine the pore size and porosity of the capillary structure; select the open-cell sponge (poly-chester, poly-capsule similar to the pore size and porosity of the capillary structure) Ether) as a substrate for capillary structure; activation treatment before plating, necessary water washing and degreasing treatment of the open-cell sponge, followed by activation plating (or spraying of conductive paint, conductive oil, electroless plating, etc. to form on the surface of the sponge) Electroplating surface layer; electroplating thickening treatment, then placing the sponge with the plating surface into the electroforming tank for electroforming 'after reaching the constant thickness, taking out, performing post-casting treatment; and electroforming the copper capillary structure to high temperature Sintering, removing the sponge structure in the steel mesh, forming a capillary structure having a three-dimensional network cross-linking structure; cutting the capillary structure having a three-dimensional network cross-linked structure or pressing the 201030302 into a desired groove into the above-mentioned capillary structure f3 , (10) is a trapezoidal 'in the above manufacturing method, the open hole haijin as a capillary structure; the same; no: the fabric of the capillary structure as a substrate, It is said that the unrestricted parts have different gross ratios, so that the above-mentioned thousand < and the pores have the effect of the capillary 132 and the groove portion 135 capillary force and permeability, thereby achieving a reasonable distribution of the open-cell sponge as the capillary. The structure of the substrate is made, ί J method is pressed to make the fine structure. The different shrinkage = structure is affected by the fact that the part is squeezed and the smaller the capillary radius and the hole material become smaller, and also at that place The groove 133 is formed. Fig. 3 shows a second embodiment of the heat pipe of the present invention. The heat pipe of the first embodiment of the disk is different in that the outer casing 21 of the heat pipe is annular, and the bottom Μ231 of the capillary structure 23 is also In a circular shape, the bottom surface of the bottom layer 231 is attached to the entire inner wall of the outer casing 21. The protrusions 232 extend in the radial direction, and the top surfaces thereof are spaced apart from each other and are not attached to the outer casing 21 of the heat pipe. The shape of the protrusions M2 and the grooves 133 of the capillary structures 13 and 23 of the heat pipe are not limited to trapezoids, and may be square, triangular, etc. 7 As described above, the present invention conforms to the requirements of the invention patent, 爰9 201030302 The law filed a patent application. The preferred embodiment of the present invention, which is equivalent to the spirit of the present invention, should be construed as being within the scope of the following claims. FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a schematic view showing a capillary structure of a heat pipe shown in FIG. 1 taken by a microscope. FIG. 3 is a schematic view of a heat pipe according to a second embodiment of the present invention. Schematic diagram of the cross section. [Main component symbol description] Housing 11, 21 Upper housing 111 Lower housing 112 Capillary structure 13, 23 Bottom layer 131, 231 Projection 132> 232 Groove 133 Groove portion 135 10