M376120 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種平板型熱管，尤其特別是一種透過 一套接體之第一侧部的毛細結構，以有效促使所述平板型 熱管内之工作流體增加流動循環速度，進而達到較佳散熱 及均熱效果的平板型熱管之支撐結構改良。 【先前技術】 隨著工業技術不斷精進，使各種電子產品走向體積 J重里輕與低耗電的趨勢，同時，在高性能、高效率的 泝求下，其所代表的意義不只是工作速度的提昇，其單位 體積所3之電子元件也相對的增加，在性能不斷提昇的過 程中其發熱1：所造成的問題日益嚴重，且在電子元件發 熱篁曰益增加的同時’因電子元件效能設計的不同，使得 發熱的電子元件表面之熱通量分佈不均，仙局部溫度不 同’而會在表面上形成所謂的熱點(hot spot)，造成局部 溫度過高的現象，而電子元件簡作溫度又與其可靠度、 可命D相關，尤其在體積受限的筆記型電腦週邊 …疋件上，因此為了解決前述散熱問題便紛紛開發出一 種平板型熱管。 ^參閱第1圖所示’習知之平板型熱管，係由一第一銅 =及銅板11所構成，其中_—銅板10連接 六ί *古板11 ’以界定一腔室12，前述腔室12係用以 谷\充有-工作流體（如水、液體），並且第一銅板 3 M376120 10及第二銅板11彼此相對表面上各設有毛細結構η 其恰包覆於該腔室12内’即’前述毛細結構_同形成 為腔室12内部表面；而一般所習知之毛細M376120 V. New description: [New technical field] This paper is about a flat type heat pipe, especially a capillary structure that passes through the first side of a set of joints to effectively promote the inside of the flat type heat pipe. The working fluid increases the flow circulation speed, thereby improving the support structure of the flat heat pipe with better heat dissipation and soaking effect. [Prior Art] With the continuous improvement of industrial technology, various electronic products are moving toward the trend of light weight and low power consumption. At the same time, under the high performance and high efficiency, the meaning is not only the working speed. In the process of upgrading, the electronic components per unit volume are also relatively increased. In the process of continuous improvement of performance, the heat generation is caused by the problem of increasing heat generation and the increase in heat generation of electronic components. The difference is that the heat flux on the surface of the hot electronic component is unevenly distributed, and the local temperature is different, and a so-called hot spot is formed on the surface, causing a local temperature to be too high, and the electronic component is simply temperature. It is related to its reliability and life-defining D, especially on the peripherals of notebooks with limited volume. Therefore, in order to solve the above-mentioned heat dissipation problems, a flat type heat pipe has been developed. ^ Referring to the conventional flat heat pipe shown in Fig. 1, which is composed of a first copper = and a copper plate 11, wherein the _-copper plate 10 is connected to a six-yellow plate 11' to define a chamber 12, the aforementioned chamber 12 The system is provided with a working fluid (such as water, liquid), and the first copper plate 3 M376120 10 and the second copper plate 11 are respectively provided with a capillary structure η on the opposite surfaces of each other, which is just wrapped in the chamber 12 'The aforementioned capillary structure _ is formed as the inner surface of the chamber 12; and the conventionally known capillary
能：-、透過液膜效應降低壁面的熱通量；二、增加$ 成核及增大級三、毛域猶如接^阻止篆 氣膜的成長。其中前述工作流體因重力及毛細之作用^ 故，液體分佈於腔室12内部的毛細結構13上（即為前述第 一銅板10及第二銅板11的毛細結構13上）。 L 並且，前述第-銅板10背對該腔室12之表面貼觸於 相對一發熱元件（如中央處理器）的端面上（此 銅板10即為所稱之蒸發端或稱受熱端），用簡發熱元件 產生的熱量引導至第二銅板11(即為所稱之冷凝端）上散 熱，所以當賴元件產生熱量時，使[峨1G吸收前述 熱量的同時’其内毛細結構13上流動的工作流體會因受熱 而蒸發成為紐’嗣’前述統迅速流向較冷部位（即為第 二銅板11)’直到蒸氣到達第二銅板i i放出潛熱後轉變成 液體後，透過前述第二銅板u之毛細結構13内的毛細力 流回到第-銅板1G上’以完成-工作循環達到散熱，但卻 延伸另一問題是前述第一銅板10其内毛細結構13上流動 的工作流體在相變化過程中不順利會產生下例狀況：（D 隨著熱輸送量的增加而增大工作流體兩相轉換的速度，但 毛細結構因孔隙低、滲透率低造成回流的流阻增加，俾使 無法適時提供足夠的工作流體回到前述蒸發端，使熱管的 受熱端燒乾(dry out)，進而導致均熱及散熱不佳；（2)當 4 熱通量不斷增高時，導致液面的氣體壓力大於液體内的壓 力’此時毛細結構内會有蒸氣氣泡的產生，而前述氣泡不 僅會阻礙工作流體的回流’也會使熱管的熱傳面與毛細結 構間產生了熱阻非常大的蒸氣膜層，以造成熱量無法順利 地藉由工作流體轉換帶離蒸發端，使其不斷地在受熱端累 積，造成熱管受熱端燒乾(dry out)，進而導致均熱及散熱 不佳。 另者’請麵第2 ®所示，是巾華民國專利公開號第 443714 5虎’該專利揭露一種熱管均熱板，其係在一腔體2 之上板面20設有複數個凸起柱2卜下板面&設有毛細結 構以’該毛細結構23並與上板面2◦之凸起柱21抵接， 藉著利用毛細結構23做冷凝水液_流導流，並與凸起柱 21抵接，以形成支撐作用’因此，由於凸起柱21無毛細 結構僅用以切該下錢22的毛細結構幻 做回流導流’使得整體流職觀度不佳及散熱效果不佳。 以上所述，習吨術中具有下列之缺點： 1. 散熱效果不佳； 2. 均熱效果不佳； 3.流體循環效率不佳。 之創㈣職失，即為本案 所在者。事 _商所姐研究改善之方向 【新型内容】 友此，為有贿決上叙_，本_之主要目的在 M376120 提供-種透過-套接體之第—側部的毛細結構以有效促 使所述平板型熱管内之工作流體增加流動循環速度，進而 達到較佳健及均熱效果的平_熱管之支撐結構改良。 本創作之次要目的在提供一種具有較佳均溫性及散数 性之平板型熱管之支撐結構改良。 μ 為達上述目的，本創作主要係提出一種平板型熱管之 支撐結構改良，其包括-本體及—套接體，前述套接體且 有至少-開放做與放繼接之—第—側部，該第一 側部設有-毛細結構’係形成於前述第—側部之周侧上， 且所述第-侧部與開放側共同界中空空間，並與相對 該本體套接岐’亦此藉由本創作之第—側部之毛細結構 的設計，得使有效增加所述平板型熱管内之工作流體流動 德環速度，以達到較佳的散熱及均熱效果。 本創作另提出一種平板型熱管之支撐結構改良，係包 括-蓋體、至少-本體及至少—套制，財該蓋體具有 -第-平板及平行該第-平板之-第二平板，前述第一平 板與该第一平板之間界定一腔室，該腔室係用以填充一工 作流體，前述本體具有一頂部、一第二側部及相對該頂部 之一底部，所述頂部及底部分別抵接相對該第一平板及第 二平板，而所述套接體具有一第一侧部，該第一側部之周 側上《^有一毛細結構，且該等套接體彼此相互堆疊套設於 相對該本體上，故藉由前述第一側部的毛細結構，以有效 促使所述平板型熱管内的一工作流體增加流動循環速度， 進而達到較佳循環散熱及均熱的效果。 M376120 【實施方式】 本作之上述目的及其結構與功能上的特性，將依據 所附圖式之較佳實施例予以說明。 口月併參閱第3、4、5圖所示，本創作係一種平板型 熱管之支撐結構改良，在本創作之一較佳實施例中係包 .括一本體3及一套接體4，其t該套接體4具有至少-開 鲁.放側41及與該開放侧4i連接之一第一側部42，該第一側 4 42 5又有-毛細結構421，其係形成於前述第一側部犯 之周侧上’而前述毛細結構421係可為金屬彈酱狀、金屬 網狀或以燒結金屬粉末所赫之乡孔f 構似亦具有導流能力及提供更多的回;^ (channel) ’其亦可將較冷部位的流體迅速導流回到受熱的 部位’以有效增加流體循環速度及流量，且又能夠避免受 , 熱的部位内流動的流體燒乾；此外，前述第-側部42周側 • 上’亦可直接成型出溝槽狀或多孔狀的毛細結構42卜其 相同具有毛細結構促進吸附、蒸發及冷凝循環效果。 並且，前述第一側部42與開放側41共同界定一中空 空間43，並與相對該本體3套接固定，且前述中空空間$ 與開放側41彼此相連通。 ^前述套接體4係為一中空套體，前述中空套體之形狀 係可為-筒形狀及矩形狀及方形狀其中之一，在本較佳時 施例，係以筒形狀說明表示，但並不侷限於此，惟本創作 7 實牙、實把_㈣巾空錢之形狀係選擇匹配對應該本體 3 1形狀；並且，該中空套體具有-第-端411及沿該第 延伸之—第二端412，前述第—端411及第二端 412分別與各自對應界定所賴放側*卜 :者印同時一併參閱第3、4、5、6、7 3係以高熱傳導聽之材料製成，如銅、銀、紹或 具高轉絲，職高溫處（即前述 位)快速傳送(或引導)至低溫處（即前述較冷部位） ί ^好的均溫性及散熱性；前述本體3具有一頂 部32八^卩％及-第二側部& ’其中前述頂部31及底 二中空套體之第一端411及第二賴相平 使f本叙勤^巾空套體套餅相龍本體3上， 部31及底部32恰好與前述中空套體之第 側：= 端Γ目平切，並且所述第-侧部42的内 、。並G覆於相對該第二側部33之周側。 嗣，前述本體3抵接一蓋體5 f傳導材料，如銅、銀、銘或其合金===為 疋件上（圖中未示），如中本卢; =觸於相對發熱元件亦即為;::= 可_=’=第二傾52即翁频料位(或亦 並且’前述第-平板51與第二平板52之間界定一腔 M376120 至53，用以谷置如述套設有中空套體的本體3及適量填充 一工作流體，前述工作流體於本創作係以水做說明表示， 但並不侷限於此，惟本創作實際實施時，凡亦可利於蒸發 散熱之流體為如純水、無機化合物、醇類、綱類、液離金 屬、冷煤、有機化合物或其混合物皆為所敘述的工作流體， 合先陳明。除此之外，前述本體3在該腔室53内係用以定 位支擇s亥第一平板51與第二平板52，並又透過該本體3 • ' 上套設的中空套體增加與第一平板51及第二平板52間的 接觸面積（或支標面積），使得有效能夠增加強度外，進而 於製程組裝上具有較佳便利性及降低成本的效果。 蚋，前述腔室53的内表面鋪設有毛細結構531，即， 前述第一平板51及第二平板52於腔室53中的相對端面 (即為腔室53的内表面）設有毛細結構531，並且前述工作 流體係分佈於第-平板51及第二平板52的毛細結構531 位置。 ’所財前輕熱元㈣生錢時，透賴第—平板51 - (即前述所稱蒸發端）其上毛細結構531内之工作流體吸收 别述熱量’隨即產生相雜由㈣的卫作雜55轉變為汽 態的工作流體56，而前述汽態的工作流體56會於腔室兕 内迅速流向該第二平板52(即前述所稱冷凝端），同時，該 第一平板51接收的部份熱量會透過本體3迅速引導至第二 平板52上擴散散熱，接著此時待所述汽態之工作流體56 至第二平板52後’再次經由相變化釋放出大量潛熱轉變為 液態的工作流體55，使該第二平板52的毛細結構531之 9 M376120 毛細力將祕的作流體55輸送_該第—平板51上， 並同時藉由該第-侧部42的毛細結構421之毛細力提供液 態的工作流體55輪送_所述第-平板51上的另-個路 徑’以促進（增加）I作__環速度，減循環不已 地將熱量制帶離，目此，使得不僅具有難的均熱及均 溫效果，進而又有效達到較佳的散熱效果。 另外’本創作之套接體4係彼此相互堆疊套設於相對Can: -, through the liquid film effect to reduce the heat flux of the wall; Second, increase the nucleation and increase the level three, the hair field is like the ^ to prevent the growth of the 篆 film. The working fluid is distributed on the capillary structure 13 inside the chamber 12 (i.e., on the capillary structure 13 of the first copper plate 10 and the second copper plate 11) due to the action of gravity and capillary. L, the surface of the first copper plate 10 facing the chamber 12 is in contact with the end surface of a heat generating component (such as a central processing unit) (the copper plate 10 is referred to as an evaporation end or a heat receiving end). The heat generated by the simple heating element is guided to the second copper plate 11 (that is, the so-called condensation end) to dissipate heat, so that when the element generates heat, [峨1G absorbs the aforementioned heat while flowing on the inner capillary structure 13] The working fluid will evaporate due to heat, and the above-mentioned system rapidly flows to the colder part (ie, the second copper plate 11)' until the vapor reaches the second copper plate ii, and after the latent heat is released, it is converted into a liquid, and then passes through the second copper plate. The capillary force in the capillary structure 13 flows back to the first copper plate 1G' to complete the work cycle to achieve heat dissipation, but the other problem is that the working fluid flowing on the inner capillary structure 13 of the first copper plate 10 is in the phase change process. If the middle is not smooth, the following conditions will occur: (D) The speed of the two-phase conversion of the working fluid increases as the heat transfer rate increases, but the capillary structure increases the flow resistance due to the low porosity and low permeability, so that no The method provides sufficient working fluid to return to the aforementioned evaporation end, so that the heated end of the heat pipe is dry out, which leads to poor soaking and heat dissipation; (2) when the 4 heat flux is continuously increased, the liquid level is caused. The gas pressure is greater than the pressure in the liquid. At this time, there will be steam bubbles in the capillary structure, and the bubbles will not only hinder the return of the working fluid, but also cause a very large thermal resistance between the heat transfer surface of the heat pipe and the capillary structure. The vapor film layer prevents the heat from being smoothly transferred from the evaporation end by the working fluid, so that it continuously accumulates on the heated end, causing the heat pipe to dry out, which leads to poor soaking and heat dissipation. 'Please refer to the second ® ®, which is the towel of the Republic of China Patent No. 443714 5 Tiger'. The patent discloses a heat pipe soaking plate which is provided with a plurality of raised columns on the upper surface 20 of a cavity 2 2, the lower surface & is provided with a capillary structure to 'the capillary structure 23 and abuts against the raised column 21 of the upper plate surface 2, by using the capillary structure 23 as a condensed water _ flow guiding flow, and convex The uprights 21 abut to form a supporting effect' Because the bulge structure of the raised column 21 is only used to cut the capillary structure of the money 22, the flow reflow is made to make the overall flow less favorable and the heat dissipation effect is not good. As mentioned above, the following has the following Disadvantages: 1. Poor heat dissipation; 2. Poor heat effect; 3. Poor fluid circulation efficiency. (4) Job loss, that is, the case where the case is located. Things _ business sister research improvement direction [new content] In order to have a bribe, the main purpose of this is to provide a capillary structure of the first side of the through-the sleeve to effectively increase the flow rate of the working fluid in the flat heat pipe. The support structure of the flat-heat pipe which achieves better health and uniform heat effect is improved. The secondary objective of the present invention is to provide a support structure improvement of a flat type heat pipe having better uniformity and dispersion. μ In order to achieve the above purpose, the present invention mainly proposes a support structure improvement of a flat type heat pipe, which comprises a body and a socket body, and the socket body has at least an open and a rear side - a side portion The first side portion is provided with a capillary structure formed on a circumferential side of the first side portion, and the first side portion and the open side are in a common hollow space, and are sleeved with respect to the body. The design of the capillary structure of the first side portion of the present invention can effectively increase the flow velocity of the working fluid in the flat-plate heat pipe to achieve better heat dissipation and soaking effects. The present invention further provides a support structure improvement of a flat type heat pipe, comprising: a cover body, at least a body, and at least a sleeve, wherein the cover body has a first plate and a second plate parallel to the first plate, the aforementioned A chamber is defined between the first plate and the first plate, the chamber is for filling a working fluid, and the body has a top portion, a second side portion and a bottom portion opposite to the top portion, the top portion and the bottom portion Abutting against the first flat plate and the second flat plate, respectively, the sleeve body has a first side portion, and the peripheral side of the first side portion has a capillary structure, and the socket bodies are stacked on each other The sleeve is disposed on the opposite body, so that the capillary structure of the first side portion effectively promotes a working fluid in the flat-plate heat pipe to increase the flow circulation speed, thereby achieving better cycle heat dissipation and soaking effect. M376120 [Embodiment] The above object, its structural and functional characteristics are described in accordance with the preferred embodiments of the drawings. As shown in Figures 3, 4, and 5, the present invention is a support structure improvement of a flat type heat pipe. In a preferred embodiment of the present invention, a body 3 and a set of body 4 are included. The sleeve body 4 has at least an open side 41 and a first side 42 connected to the open side 4i, the first side 4 42 5 having a capillary structure 421 formed in the foregoing The first side is made on the side of the circumference and the capillary structure 421 can be metal-like sauce, metal mesh or sintered with metal powder. It also has a conductivity and provides more back. ;^ (channel) 'It can also quickly transfer the fluid from the colder part back to the heated part' to effectively increase the fluid circulation speed and flow rate, and to avoid the flow of fluid flowing in the hot part; The circumferential side of the first side portion 42 and the upper portion can also directly form a groove-like or porous capillary structure 42 which has the same capillary structure to promote adsorption, evaporation and condensation circulation effects. Moreover, the first side portion 42 and the open side 41 together define a hollow space 43 and are sleeved and fixed relative to the body 3, and the hollow space $ and the open side 41 communicate with each other. The sleeve body 4 is a hollow sleeve body, and the shape of the hollow sleeve body may be one of a tube shape, a rectangular shape and a square shape. In the preferred embodiment, the barrel shape is indicated. However, the present invention is not limited to this, but the shape of the solid tooth and the actual _(four) towel empty money are selected to match the shape of the body 3 1; and the hollow sleeve has a - end 411 and extends along the first The second end 412, the first end 411 and the second end 412 are respectively associated with each other, and the third side, the fourth end, the third end, the second end 412, and the third end Made of materials, such as copper, silver, sorghum or with high-speed wire, the high temperature (ie the above position) is quickly transmitted (or guided) to the low temperature (ie the aforementioned colder part) ί ^ good temperature uniformity and The heat dissipation; the body 3 has a top portion 32 and a second side portion & 'the front end 31 and the bottom two hollow sleeve body first end 411 and the second Lai phase flat so that the present The sleeve 31 is on the body 3, and the portion 31 and the bottom portion 32 are just opposite to the first side of the hollow sleeve: = the end portion is flat, and the first side portion Within 42. And G covers the peripheral side of the second side portion 33.嗣, the body 3 abuts a cover 5 f conductive material, such as copper, silver, Ming or its alloy === for the piece (not shown), such as Zhongbenlu; = touch the relative heating element That is;::= can be _='= the second tilt 52 is the Weng frequency level (or also and 'the aforementioned first-plate 51 and the second plate 52 define a cavity M376120 to 53 for the valley to be described The body 3 with a hollow sleeve body and an appropriate amount of a working fluid are filled. The working fluid is represented by water in the creation department, but is not limited thereto, but the actual implementation of the creation may also facilitate evaporation and heat dissipation. The fluid is such as pure water, an inorganic compound, an alcohol, a class, a liquefied metal, a cold coal, an organic compound or a mixture thereof, and the working fluid is described above. In addition, the body 3 is The chamber 53 is configured to position and support the first flat plate 51 and the second flat plate 52, and is further inserted between the first flat plate 51 and the second flat plate 52 through the hollow sleeve of the main body 3' The contact area (or the area of the support) makes it effective to increase the strength, and thus has better decoration in the process assembly. The effect of reducing the cost. The inner surface of the chamber 53 is covered with a capillary structure 531, that is, the opposite end faces of the first plate 51 and the second plate 52 in the chamber 53 (that is, the inside of the chamber 53). The surface is provided with a capillary structure 531, and the aforementioned workflow system is distributed at the position of the capillary structure 531 of the first plate 51 and the second plate 52. 'The front light plate (4) is used to generate money, and the first plate 51 - The above-mentioned so-called evaporation end) the working fluid in the upper capillary structure 531 absorbs the heat of the other kind, and then the mixed fluid (56) is converted into the vaporous working fluid 56, and the aforementioned vaporous working fluid 56 will be The chamber 兕 rapidly flows to the second plate 52 (ie, the so-called condensing end), and at the same time, part of the heat received by the first plate 51 is quickly guided through the body 3 to the second plate 52 for diffusion and heat dissipation. After the working fluid 56 of the vapor state is transferred to the second plate 52, a large amount of latent heat is released to the liquid working fluid 55 via the phase change, so that the capillary structure 531 of the second plate 52 is 9 M376120. Fluid 55 delivery _ the first On the flat plate 51, and at the same time, the liquid working fluid 55 is supplied by the capillary force of the capillary structure 421 of the first side portion 42 to transfer another path on the first plate 51 to promote (increase) I __ ring speed, reduce the cycle to bring the heat system away, so that not only has difficult uniform heat and uniform temperature effect, but also effectively achieve better heat dissipation. In addition, 'the creation of the socket 4 series Stacking each other on each other
該本體3上(如參閱第6至8圖），簡言而之，套接體4係 朝相對該本體3依序套設以，直到所述套漏4同等於 該本體3的®度’且恰與該本體3 —起抵接該第—平板51 及第二平板52，在本較佳實施例，前述套接體4係以3個 做說明，但並不侷限於此，凡也亦可為4個、5個、6個·.. 等’但在這前提下須配合本體3的高度來設計，也就是說 前述套接體4的數4迦_本體3 f際高度大小來 前述數量的多寡。On the body 3 (see Figures 6 to 8), in short, the socket 4 is sequentially sleeved relative to the body 3 until the sleeve 4 is equal to the degree of the body 3 The first plate 51 and the second plate 52 are abutted against the body 3. In the preferred embodiment, the socket 4 is illustrated by three, but is not limited thereto. Can be 4, 5, 6 ·.. etc. 'But in this premise, it must be designed according to the height of the body 3, that is to say, the number of the sleeve body 4 is 4 The amount of the number.
以上所述，本創作係一種平板型熱管之支撐結構改 良’其具有下列之優點： 1.具有較佳散熱效果。 2. 具有較佳均熱及均溫效果。 3. 具有增加工作流體循環速度及流量的效果。 4.具有增加強度及增加支撐(接觸）面積。 惟以上所述者’僅係本創作之較佳可行之實施例r 已，舉凡_本_上述之綠、频、構造、襄置所; 之變化，皆應包含於本案之權利範圍内。 10 M376120 【圖式簡單說明】 第1圖係習知之平板型熱管剖面示意圖； 第2圖係習知之熱管均熱板剖面示意圖； 第3圖係本創作之一較佳實施例之套接體立體示意圖； 第4圖係本創作之一較佳實施例分解示意圖； 第5圖係本創作之一較佳實施例組合剖面示意圖； 第6圖係本創作之另一較佳實施例之套接體相互堆疊立體 不意圖， 第7圖係本創作之另一較佳實施例分解示意圖； 第8圖係本創作之另一較佳實施例組合剖面示意圖。 【主要元件符號說明】 本體 …3 第一端 … 411 頂部 …31 第二端 … 412 底部 …32 蓋體 … 5 第二側部 …33 第一平板 … 51 套接體 -4 第二平板 … 52 開放側 …41 腔室 … 53 第一側部 …42 毛細結構 … 531 毛細結構 …421 液態的工作流體… 55 中空空間 •••43 汽態的工作流體… 56 11As described above, the present invention is a support structure of a flat type heat pipe which has the following advantages: 1. It has a better heat dissipation effect. 2. It has better soaking and equalizing effect. 3. It has the effect of increasing the circulation speed and flow rate of the working fluid. 4. It has increased strength and increased support (contact) area. However, the above-mentioned embodiments are merely preferred embodiments of the present invention, and the changes of the green, the frequency, the structure, and the device are all included in the scope of the present application. 10 M376120 [Simplified description of the drawings] Fig. 1 is a schematic cross-sectional view of a conventional flat heat pipe; Fig. 2 is a schematic view of a conventional heat pipe uniform heat plate; Fig. 3 is a perspective view of a preferred embodiment of the present invention 4 is a schematic exploded view of a preferred embodiment of the present invention; FIG. 5 is a schematic cross-sectional view of a preferred embodiment of the present invention; FIG. 6 is a sleeve of another preferred embodiment of the present invention. FIG. 7 is a schematic cross-sectional view showing another preferred embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing another preferred embodiment of the present invention. FIG. [Description of main component symbols] Main body...3 First end... 411 Top...31 Second end... 412 Bottom...32 Cover... 5 Second side...33 First plate... 51 Socket-4 Second plate... 52 Open side...41 Chamber... 53 First side...42 Capillary structure... 531 Capillary structure...421 Liquid working fluid... 55 Hollow space•••43 Vapor working fluid... 56 11