201028062 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於在塗佈助焊劑於基板上之後安裝 導電球的導電球安裝裝置’特別是一種具有助焊劑塗佈單元 的特點之導電球安裝裝置。 【先前技術】 在用於例如焊錫球的導電球之安裝裝置中，在將焊錫球或 類似物安裝於基板上之前，必須將助焊劑塗佈於基板上。因 此’已經在導電球安裝裝置中設有助焊劑塗佈機構。 ® 關於此種先前技術的助焊劑塗佈機構，已經提出： JP-A-2001-7125及日本專利第4045517號所示的針腳轉印 系統助焊劑塗佈機構，其中，助焊劑被做成黏著於其轉印頭 上所設置的轉印針腳上，且使轉印針腳與其基板接觸，以便 將助焊劑塗佈於基板上；以及，JP-a_2〇〇1 35871及 JP-A-2002-224884所揭示的網版印刷系統助焊劑塗伟機參 構，其中，助焊劑被供應至印刷頭上所設置的印刷罩上，以 便透過此印刷罩而將助焊劑塗佈於基板上。 上述的針腳轉印系統助焊劑塗佈機構之優點在於：處理速 度比起網版印刷系統助焊劑塗佈機構更加快速。另一方面， 假如採用一種導電球安裝裝置，其中的導電球具有非常小的 球體直徑且安裝間距很窄的話，則網版印刷系統助焊劑塗佈 機構具有如下的優點：相較於針腳轉印系統助焊劑塗佈機201028062 VI. Description of the Invention: [Technical Field] The present invention relates to a conductive ball mounting device for mounting a conductive ball after applying a flux on a substrate, in particular, a feature having a flux coating unit Conductive ball mounting device. [Prior Art] In a mounting device for a conductive ball such as a solder ball, a flux must be applied to a substrate before solder balls or the like are mounted on the substrate. Therefore, a flux coating mechanism has been provided in the conductive ball mounting device. The flux coating mechanism of the prior art has been proposed as a flux coating mechanism of the stitch transfer system shown in JP-A-2001-7125 and Japanese Patent No. 4045517, in which the flux is made adhesive. a transfer pin provided on the transfer head, and the transfer pin is brought into contact with the substrate thereof to apply the flux on the substrate; and, JP-a_2〇〇1 35871 and JP-A-2002-224884 The disclosed screen printing system flux coating device, wherein the flux is supplied to a printing cover provided on the printing head, so that the flux is applied to the substrate through the printing cover. The above-described stitch transfer system flux coating mechanism has the advantage that the processing speed is faster than the flux coating mechanism of the screen printing system. On the other hand, if a conductive ball mounting device is used in which the conductive ball has a very small sphere diameter and the mounting pitch is narrow, the screen printing system flux coating mechanism has the following advantages: compared to the stitch transfer System flux coating machine
098140508 4 201028062 構’可以將助焊劑塗佈於正確的位置上。 因此，視導電球所安裝的目標物體之不同’分開使用兩種 助焊劑塗佈機構，是比較理想的。然而，假如僅僅組合兩種 機構的話，他們被設置成如圖5A與5B所示的配置情形。 在圖5A所示的配置情形中，其問題在於安裝面積很大，且 延長運送距離。另一方面，在圖5B所示配置情形的情形中， 雖然可以防止延長運送距離，但是，其問題在於安裝面積被 φ 擴大’而且，當運用此針聊轉印系統以塗佈助焊劑時，會延 長生產節拍時間(tact time)。 【發明内容】 . 本發明之目的是要提出一種導電球安裝裝置，即使，導電 球安裝裝置具有針腳轉印系統助焊劍塗伟機構及網版印刷 系統助焊劑塗佈機構，也能夠擴大安裝區域，延長運送距 離’並加長生產節拍時間。 ❿ 為了解決上述問題，依據本發明的第一實施例，於導電球 安裝裝置内採用以下手段。 也就是說，依據本發明第一型態’提出一種導電球安裝裝 置’包含·支擇基板的台座；以預定方向移動台座的運送單 兀；用以塗怖助焊劑於基板上的助焊劑塗佈單元’且其包括 能夠在垂直於該預定方向的方向上移動的可移動本體；以 及，用以安裝導電球於基板上的球體安裝單元，其中，在利 用助焊劑塗佈單元以塗佈助烊劑到台座所支撑的基板之預 098140508 201028062 定位置上之後，此導電球安裝裝置便利用球體安裝 導電球安裝於台座所續的基板上，且其中，該可移動本體 包含：經由印刷罩而印刷助焊劑的網版印刷機構；以及利 用轉印針腳而將助焊劑黏著於基板上的轉印機構。 根據本發明第二型態，在導電球安裝裝置中，其中，網版 印刷機構及轉印機構係設置於相同的可移動本體上。 根據本發明第三型態，在導電球安裝裝置中，其中，導電 球安裝裝置包含多個彼此平行設置的運送單元，其中，台座 係設置於各個運料元上’且其巾，助焊㈣佈單元依序將 助焊劑塗佈於每個台座上的基板上。 根據本發明，在導電球安裝裝置内的助焊劑塗佈單元，包 括能夠在垂直於運送單㈣方向上移動的可移動本體。此可 移動本體包括透過印刷罩印刷助焊劑的網版印刷機構、及使 助焊劑與轉印針腳相互黏著的轉印機構。因此’本發明提供 -種導電球安裝裝置’即使其巾财兩個機構(亦即，網版 印刷機構及轉印機構）’仍可以防止增加安裝面積，延長運 送距離，且加長生產節拍時間。 另外’根據第二型態，由於網版印刷機構及轉印機構係設 置於相同（共同）的可移動本體上，所以，可以藉由此一可移 動本體而移動兩個機構。因此’可以簡化網版印刷機構及轉 印機構的驅動轴結構，以節省例如安裝面積等空間。 另外，根據第三型態，設有多個運送單元，以便依序將助 098140508 201028062 焊劑塗佈於各別運送單元所運送的基板上。因此，可以增加 焊錫球安裝裝置的製造速度。 【實施方式】 以下，將參考關而以範例說明本發明的實施例。 本範例係目於-種彻焊錫球作為導電球的焊錫球安裝 裝置。此焊錫球安裝裝置係用以將助焊劑塗佈於基板u上 之以預定陣列圖案所形成的各別電極上，且將焊錫球安裝於 0 各別電極上。 如圖1與® 2所示’焊錫球安裝裝置包括基板供應單元 卜助焊劑塗佈單it 2、球體安裝單幻、及基板載出單元4。 在焊錫球安裝裝置中，從基板供應單元1到球體安裝單元 3,形成有用於料上面絲有基板u 板台座5的運送 路徑。被建構成將基板台座5上所安裝的基板u從基板供 應單元1通過助焊劑塗佈單元2運送至球體安裝單元3的運 ❿送單元6和61，係設置於運送路徑上。 基板供應單元1包括載入運送器7、及載入用拾取放置器 8。載入運送器一個接一個地供應基板u。載入用拾取放置 器8則從載入運送器7上拾取每一個基板u，而將基板u 放置在每個基板台座5上。附帶地，用以使每條運送路徑上 方的基板台座5上的基板產生影像的第二位置確認攝影機 29，係安裝於載入用拾取放置器8上。根據第二位置確認攝 影機29，可以準確地確認基板u之對齊記號或球體安裝位 098140508 7 201028062 置。 本發明中使台座（亦即，基板台座5)沿著運送路徑(在圖2 中為水平方向）移動的兩個運送單元6與61 ’在此範例中被 設置成彼此平行，而且，基板台座5係分別設置於右、左運 送單元6與61上。使用兩個運送單元6與61的原因是要增 加生產速率。因此，當然也可以設置一個運送單元或多個運 %*£ HH — 送單兀。 基板放置表面9係形成於基板台座5之頂表面上。基板台 座5包括一個吸附單元及一個旋轉裝置1〇。吸附單元吸住 基板放置表面9上所放置的基板11。旋轉裝置10則以θ軸 方向（亦即，旋轉方向）驅動基板11。 用以使稍後敘述的轉印機構12、印刷機構13、及球體安 裝頭30產生影像的第一位置確認攝影機19,係安裝於基板 台座5上。只要安裝第一位置確認攝影機19於至少一個基 板台座5上就已足夠，而且，只有在改變各別的機構12與 13的規格之後而開始生產之前’才由第一位置確認攝影機 19執行轉印機構12、印刷機構13及球體安装頭3〇之成像。 根據第一位置確認攝影機19，可以確認轉印機構12中的 轉印針腳之對齊記號或位置、或者使助焊劑通過印刷機構 13中的印刷罩18的通孔之對齊記號或位置。因此，可以、名士 合來自第二位置確認攝影機29的影像而執行助焊劑的準確 塗佈。 098140508 8 201028062 本發明的特點是在於助 元2中，如圖3所示，在=表佈單元2。在助焊劑塗佈單 12及印刷機構13的可移動土表面上設置有内設轉印機構 14的可移動本體移較¥體14、及用於該可移動本體 在了移動本體14底 的助焊劑供應單元16 侧上設有用於轉印機構12 e 機構13之印刷| ❿在另一側上則設有用於清潔印刷 基板台座5之=Γ潔單元17,因而呈兩條路線夹住 用於轉印機M t、路& (例如’參考圖2和圖3)。也就是說， =機構12的助焊劑供應單元⑷係以垂直於運送單 置於=送ΓΤ方向(亦即，圖4中的水平方向)設 17則係配置料—^卩刷機構^印刷罩18的清潔單元 構l/j^/助烊劑於基板11上的轉印針腳係設置於轉印機 燋沾’ “此轉印針腳係根據基板11之電極圖案而配置。附 P機構12包括一個轉印機構升降裝置20。另外， ^焊劑到轉印機構12之轉印針腳上的助焊劑供應單元 、尺寸係根據轉印針腳放置區域之尺寸而形成。 板U上的印群18,係絲於印刷 係形成於印刷罩18: U上的電極圖案而配置的多個通孔， ^ 18尹，而且，印刷罩Μ伸展於一個模且外 形件内。此觀外形件係由罩支㈣M28所域。罩^ 098140508 201028062 裝置28透過印刷機構升降|置2ι而設置於可移動本體 14。附帶地’―個助焊劑供應裝置(未顯示)被設置於印刷機 構13上，以便供應適量的助焊劑於印刷罩18上。 藉由印刷機構13印刷助焊劑之步驟，係透過以下構件來 執行：二個塗刷器（squeegee)24、分別支撐住各別的塗刷器 以改變其垂直位置的二個空氣缸筒22、及一個透過諸空氣 缸筒22而水平地移動塗刷器24的塗刷器移動裝置23。 利用印刷機構13以印刷助焊劑於基板u上之步驟’是藉 由移動塗刷器24使其沿著印刷罩18之頂表面滑動而執行。 也就是說，藉由塗刷器24從上向下擠壓印刷罩18，助焊劑 被壓印到印刷罩内的通孔中’而且，助焊劑通過這些通孔而 被供應到基板11之電極上。 在印刷罩18之頂表面上滑行的塗刷器24，是由橡膠、合 成樹脂、金屬等製成。塗刷器24被形成為比印刷罩18中形 成通孔的區域之寬度為寬’且比印刷罩18之寬度為窄。 在印刷機構13之清潔單元17中，清潔片25橋接於進料 滾輪26及捲繞滾輪27之間。清潔單元I?執行清潔，以便 將印刷罩18推到清潔片25上’使清潔片25產生滑行。 可移動本體14安裝於可移動本體移動裝置15上。可移動 本體移動裝置15係以垂直於運送單元6及61的方向移動可 移動本體14。轉印機構12在助焊劑供應單元16與作為轉 印位置的基板台座5上的基板11之間，以可移動本體14 098140508 10 201028062 移動的方向往復移動。印刷機構13在基板11與清潔單元 17之間，以可移動本體14移動的方向往復移動° 在球體安裝單元3中，球體安裝頭30及用於已經安裝好 的基板11的擷取用拾取放置器31 ’係在其上表面上安裝於 相同（共同）的安裝頭移動裝置32，致使，球體安裝頭30及 擷取用拾取放置器31在前後方向上（亦即，圖3中的上下方 向）可以獨立地移動。其中儲存有許多焊錫球的球體供應單 φ 元33、及用以檢查焊錫球是否正確地吸附球體安裝頭30的 吸附檢查單元34，係設置於球體安裝頭3〇之下表面上。 以下，將說明焊錫球安裝裝置的操作。首先，第一位置確 認攝影機19產生以下的影像：（a)轉印機構12内的對齊記 號、及下—個欲使用的印刷機構13中的對齊記號；或者0?) 轉印機構12中的轉印針腳、及印刷機構13之印刷罩18中 的通孔；且；隹 延一步形成球體安裝頭30的影像，以測量其各 ❿ 別的位置。 由載入運钱_哭 7所載入的基板U，係被載入用拾取放j 器8從載入運详098140508 4 201028062 The structure can be applied to the flux in the correct position. Therefore, it is desirable to use two flux coating mechanisms separately depending on the difference in the target object to which the conductive ball is mounted. However, if only two mechanisms are combined, they are set to the configuration shown in Figs. 5A and 5B. In the configuration shown in Fig. 5A, the problem is that the installation area is large and the transportation distance is extended. On the other hand, in the case of the configuration case shown in Fig. 5B, although it is possible to prevent the extension of the conveyance distance, the problem is that the installation area is enlarged by φ' and, when the needle-and-needle transfer system is applied to apply the flux, Will increase the tact time of production. SUMMARY OF THE INVENTION The object of the present invention is to provide a conductive ball mounting device, which can be expanded even if the conductive ball mounting device has a stitch transfer system, a welding brush coating mechanism, and a screen printing system flux coating mechanism. Area, extended shipping distance' and lengthened production tact time. In order to solve the above problems, according to the first embodiment of the present invention, the following means are employed in the conductive ball mounting device. That is, according to the first aspect of the present invention, a conductive ball mounting device includes a pedestal for supporting a substrate, a transport unit for moving the pedestal in a predetermined direction, and a flux coating for coating the flux on the substrate. a cloth unit' and including a movable body movable in a direction perpendicular to the predetermined direction; and a ball mounting unit for mounting a conductive ball on the substrate, wherein the coating unit is coated with a flux After the tincture is placed on the substrate 098140508 201028062 supported by the pedestal, the conductive ball mounting device is conveniently mounted on the substrate of the pedestal by the ball-mounted conductive ball, and wherein the movable body comprises: via the printing cover A screen printing mechanism for printing a flux; and a transfer mechanism for bonding a flux to a substrate by using a transfer pin. According to a second aspect of the invention, in the conductive ball mounting device, wherein the screen printing mechanism and the transfer mechanism are disposed on the same movable body. According to a third aspect of the present invention, in the conductive ball mounting device, the conductive ball mounting device includes a plurality of transport units disposed in parallel with each other, wherein the pedestal is disposed on each of the transport elements, and the towel, the soldering (4) The cloth unit sequentially applies a flux to the substrate on each of the pedestals. According to the present invention, the flux coating unit in the conductive ball mounting device includes a movable body that is movable in a direction perpendicular to the transport sheet (four). The movable body includes a screen printing mechanism that prints a flux through a printing cover, and a transfer mechanism that bonds the flux and the transfer stitches to each other. Therefore, the present invention provides a conductive ball mounting device which can prevent an increase in the mounting area, extend the transport distance, and lengthen the tact time even if the two mechanisms (i.e., the screen printing mechanism and the transfer mechanism) are used. Further, according to the second aspect, since the screen printing mechanism and the transfer mechanism are disposed on the same (common) movable body, the two mechanisms can be moved by the movable body. Therefore, the drive shaft structure of the screen printing mechanism and the transfer mechanism can be simplified to save space such as the installation area. Further, according to the third type, a plurality of transport units are provided to sequentially apply the flux 098140508 201028062 to the substrate carried by the respective transport unit. Therefore, the manufacturing speed of the solder ball mounting device can be increased. [Embodiment] Hereinafter, embodiments of the present invention will be described by way of examples with reference to the accompanying drawings. This example is a solder ball mounting device that uses a solder ball as a conductive ball. The solder ball mounting device is used to apply flux to respective electrodes formed in a predetermined array pattern on the substrate u, and to mount the solder balls on the respective electrodes of 0. As shown in Figures 1 and 2, the solder ball mounting apparatus includes a substrate supply unit, a flux coating unit, a sphere mounting unit, and a substrate carrying unit 4. In the solder ball mounting device, a transport path for the substrate u-plate pedestal 5 on the material is formed from the substrate supply unit 1 to the ball mounting unit 3. The transport unit 6 and 61 which are configured to transport the substrate u mounted on the substrate pedestal 5 from the substrate supply unit 1 to the sphere mounting unit 3 through the flux application unit 2 are provided on the transport path. The substrate supply unit 1 includes a loading conveyor 7, and a loading picker 8. The loading conveyor supplies the substrates u one by one. The loading pick-up placer 8 picks up each of the substrates u from the loading conveyor 7, and places the substrate u on each of the substrate pedestals 5. Incidentally, the second position confirmation camera 29 for generating an image on the substrate on the substrate pedestal 5 above each transport path is attached to the loading pick-and-placer 8. According to the second position confirmation camera 29, it is possible to accurately confirm the alignment mark of the substrate u or the sphere mounting position 098140508 7 201028062. In the present invention, the two transport units 6 and 61' which move the pedestal (i.e., the substrate pedestal 5) along the transport path (horizontal direction in Fig. 2) are disposed in parallel with each other in this example, and the substrate pedestal The 5 series are respectively disposed on the right and left transport units 6 and 61. The reason for using the two transport units 6 and 61 is to increase the production rate. Therefore, it is of course also possible to set up a transport unit or a plurality of transports**HH-delivery orders. The substrate placement surface 9 is formed on the top surface of the substrate pedestal 5. The substrate stage 5 includes an adsorption unit and a rotating device 1A. The adsorption unit sucks the substrate 11 placed on the substrate placement surface 9. The rotary unit 10 drives the substrate 11 in the θ-axis direction (i.e., the direction of rotation). The first position confirmation camera 19 for causing the transfer mechanism 12, the printing mechanism 13, and the ball mounting head 30 to be described later to be imaged is mounted on the substrate pedestal 5. It suffices to install the first position confirmation camera 19 on at least one of the substrate pedestals 5, and the transfer is performed by the first position confirmation camera 19 only after the production of the specifications of the respective mechanisms 12 and 13 is changed. The imaging of the mechanism 12, the printing mechanism 13, and the ball mounting head 3〇. According to the first position confirmation camera 19, the alignment mark or position of the transfer stitch in the transfer mechanism 12 or the alignment mark or position of the flux passing through the through hole of the print cover 18 in the printing mechanism 13 can be confirmed. Therefore, it is possible to perform accurate coating of the flux by the image of the camera 29 from the second position confirmation. 098140508 8 201028062 The invention is characterized in that in the aid 2, as shown in Fig. 3, in the table cloth unit 2. On the movable coating surface of the flux coating sheet 12 and the printing mechanism 13, the movable body of the internal transfer mechanism 14 is disposed to move relative to the body 14, and the movable body is provided at the bottom of the moving body 14. On the side of the flux supply unit 16, there is a printing for the transfer mechanism 12e mechanism 13; on the other side, there is a cleaning unit 17 for cleaning the printed substrate pedestal 5, so that it is sandwiched by two routes for Transfer machine M t, road & (for example 'refer to Figures 2 and 3). That is to say, the flux supply unit (4) of the mechanism 12 is placed perpendicular to the transport order in the direction of the feed (ie, the horizontal direction in FIG. 4), and the system is configured to print the cover. The cleaning unit of the cleaning unit 18/j^/the auxiliary agent on the substrate 11 is disposed on the transfer machine. The transfer pin is disposed according to the electrode pattern of the substrate 11. The P-device 12 includes A transfer mechanism lifting device 20. In addition, the flux supply unit on the transfer pin of the transfer mechanism 12 is sized according to the size of the transfer pin placement area. The print group 18 on the plate U is The wire is printed on a plurality of through holes formed in the electrode pattern on the printing cover 18: U, and the printing cover is extended in a mold and the outer shape. The shape is supported by the cover (4) M28 Cover 098140508 201028062 The device 28 is disposed on the movable body 14 through the printing mechanism lifting and lowering. A flux supply device (not shown) is provided on the printing mechanism 13 to supply an appropriate amount of assistance. The flux is on the printing cover 18. Printed by the printing mechanism 13 The step of brushing the flux is performed by the following components: two squeegees 24, two air cylinders 22 respectively supporting the respective squeegees to change their vertical position, and one through the air The squeegee moving device 23 of the squeegee 24 is horizontally moved by the cylinder 22. The step of printing the flux on the substrate u by the printing mechanism 13 is performed by moving the squeegee 24 along the printing hood 18. The top surface is slid and performed. That is, the print cover 18 is pressed from above and down by the squeegee 24, and the flux is imprinted into the through holes in the print cover'. Moreover, the flux is passed through the through holes. The squeegee 24 that slides on the top surface of the printing cover 18 is made of rubber, synthetic resin, metal, etc. The squeegee 24 is formed to form a through hole in the printing cover 18. The width of the area is wider 'and narrower than the width of the printing cover 18. In the cleaning unit 17 of the printing mechanism 13, the cleaning sheet 25 is bridged between the feeding roller 26 and the winding roller 27. The cleaning unit I performs cleaning In order to push the printing cover 18 onto the cleaning sheet 25 to make cleaning The movable body 14 is mounted on the movable body moving device 15. The movable body moving device 15 moves the movable body 14 in a direction perpendicular to the transport units 6 and 61. The transfer mechanism 12 is in the flux supply unit 16 reciprocates between the substrate 11 on the substrate pedestal 5 as the transfer position in the direction in which the movable body 14 098140508 10 201028062 moves. The printing mechanism 13 moves between the substrate 11 and the cleaning unit 17 as the movable body 14. In the ball mounting unit 3, the ball mounting head 30 and the pick-up picker 31' for the already mounted substrate 11 are attached to the same (common) mounting head movement on the upper surface thereof. The device 32 causes the ball mounting head 30 and the pick-up picker 31 to be independently movable in the front-rear direction (i.e., the up-and-down direction in Fig. 3). The sphere supply unit φ 33 in which a plurality of solder balls are stored, and the adsorption inspection unit 34 for checking whether the solder balls correctly adsorb the sphere mounting head 30 are disposed on the lower surface of the sphere mounting head 3 . Hereinafter, the operation of the solder ball mounting device will be explained. First, the first position confirmation camera 19 generates the following images: (a) an alignment mark in the transfer mechanism 12, and an alignment mark in the next printing mechanism 13 to be used; or 0?) in the transfer mechanism 12. The transfer stitches and the through holes in the printing cover 18 of the printing mechanism 13 are formed; and the image of the ball mounting head 30 is formed in one step to measure the respective positions. The substrate U loaded by the loading money_cry 7 is loaded and loaded by the pick and place device 8
咬盗7上取下。然後，基板u交錯地放置方 基板供應單元】L 上等待的各別基板台座5上。 相對於基板a斑c 〇座5上所放置的基板U，基板11上所標六 的對齊記號、咬虫 4崠體女裝位置，係藉由載入用拾取放置器 上所安裝的第-^ ^ 〜位置確認攝影機29而產生影像，而且’須 量出基板11的办苗Take the bite 7 and take it off. Then, the substrate u is alternately placed on the respective substrate pedestals 5 waiting on the substrate supply unit. With respect to the substrate U placed on the substrate a, the alignment mark of the six on the substrate 11, and the position of the bite insects are mounted by the loading and placing device - ^ ^ ~ Position confirms the camera 29 to generate an image, and 'must count the substrate 11
罝。之後，藉由基板台座5之移動，將J 098140508 11 201028062 板11運送至助焊機塗佈單元2。 在藉由轉印機構12而塗佈助焊劑的情形中， 板11被運送至助焊劑塗佈單元2之前， 土 中的助焊劑被塗刷器抹平而達到厚度均㈣二 =應而^ 16上方㈣印機構12,係藉由轉印機構升降裝 一 下，使助焊劑黏著於轉印針腳之前導端上。 當基板11被運送至助焊劑塗佈單u上時，藉由•可 移動本體14的移動裝置15，轉印機構12移動至基板u之 上侧，而且，用於基板台座5的旋轉裝置1〇也一起旋轉， 以便根據第-位置確認攝影機19及第二位置確認攝影機四 的成像’而執行基板n與轉印機構12的對齊。接著 機構升降裝置20使轉印機構12下降，而將助焊劑黏著於基 板11上。以此方式，在塗佈轉劑之後，轉印機構升降二 置2〇使轉印機構12上升，以準備接下來的轉印；而且，藉 由用於可移動本體14的移動裝置15，轉印機構12移動^ 助焊，供應單元16。附帶地，在轉印操作期間，在助輝劑 供應單元16内，藉由塗㈣而執行抹平轉劑之操作。 在藉由印刷機冑13以塗佈助焊劑的情形中，當基板u 被運送至助焊劑塗佈單元2時，藉由用於可移動本體14的 移動裝置15，印刷機構13移動至基板u之上側，而且， 用於基板台座5的旋轉裝置10也一起旋轉，以根據第一位 置確認攝影機19及第二位置確認攝影機29的成像，而執行 098140508Hey. Thereafter, the J 098140508 11 201028062 board 11 is transported to the flux coater unit 2 by the movement of the substrate pedestal 5. In the case where the flux is applied by the transfer mechanism 12, before the plate 11 is transported to the flux application unit 2, the flux in the soil is smoothed by the squeegee to a thickness of (four) two = should be ^ The upper (four) printing mechanism 12 of the 16 is attached and lowered by the transfer mechanism to adhere the flux to the leading end of the transfer pin. When the substrate 11 is transported onto the flux application sheet u, the transfer mechanism 12 is moved to the upper side of the substrate u by the moving device 15 of the movable body 14, and the rotating device 1 for the substrate pedestal 5 The crucibles are also rotated together to perform alignment of the substrate n with the transfer mechanism 12 in accordance with the imaging of the first position confirmation camera 19 and the second position confirmation camera 4. Next, the mechanism lifting device 20 lowers the transfer mechanism 12 to adhere the flux to the substrate 11. In this manner, after the transfer of the transfer agent, the transfer mechanism is lifted and lowered to cause the transfer mechanism 12 to be raised to prepare for the subsequent transfer; and, by the moving device 15 for the movable body 14, The printing mechanism 12 moves the soldering, supply unit 16. Incidentally, during the transfer operation, in the helper supply unit 16, the operation of smoothing the transfer agent is performed by coating (4). In the case where the flux is applied by the printer 胄13, when the substrate u is transported to the flux coating unit 2, the printing mechanism 13 is moved to the substrate u by the moving device 15 for the movable body 14. On the upper side, and also, the rotating device 10 for the substrate pedestal 5 is also rotated together to perform imaging of the camera 19 and the second position confirmation camera 29 according to the first position, and 098140508
12 201028062 基板11與印刷機構13的對齊。接著，藉由印刷機構升降敦 置21，使印刷機構13下降至一個位置，而使基板^ 表面與印刷罩18之下表面之間具有一段預定距離。之^項 其中一個塗刷器24下降以向下擠壓印刷罩18，且橫向移動 而將助焊舰印至印刷罩18上的通孔中。織，料2 印刷於基板11上。之後，升起塗刷器24。 之後’印刷機構升降裝置20使印刷機構13升起，藉由 ❺於可移動本體14的移動裝置15而移動至清潔單元η 執行印刷罩18的清潔。附帶地，不需要每次都執行清潔且 在需要的時候執行清雜已足夠1下—個基板u被運送 至助焊佈單元2時’印刷機構13移動至基板^之上 侧’以便藉由其他时㈣24 _时絲行印刷。附帶 地，由於基板11被各別的運送單元6及61交替地運送至助 焊劑塗佈單元2，所以’乃是以其運送順序交替地實施轉印 ❹ 操作或印刷操作。 在此範例中，助焊劑塗佈單元2中的轉印機構12及印刷 機構13,係絲於制的可移動本體14上，而且，兩者均 藉由用於可移動本體14的移動裝置15而整體水平地移動。 j而’轉印機構12與印刷機構13也可以彼此分開，而且， 這些機構可以被設置成能夠沿著—條共同的移動路徑移動。 在助焊劑塗佈單元2巾完成塗佈助焊細基板1卜係藉 由基板台座5之移動而被運送至球體安裝單元3。此時，藉 098140508 13 201028062 由安裝頭移動裝置32及旋轉襞置1〇，移動基板u及球體 安裝頭3G，以便根據第—位置確輯影機19喊像的球體 安裝頭30之位置、及第二仅置確認攝影機29所成像的基板 11之位置，而執行基板U與球體安裝頭3〇的對齊。接著， 藉由球體絲頭3〇，料錫球絲於基板u上。 藉由球體安裝單兀3内的球體安裝頭3〇完成安裝焊錫球 的基板11，係被擷取用拾取放置器31 #貞取以便轉移至一 個安裝檢查單元35。相對於完成焊錫球安裝檢查的基板 11 ’在基板載出單元4中’正確安裝好的基板u被轉移至 載出運送H 36’而錯誤安裝的基板u，職由載出用拾取放 置器38而轉移至一個收集單元37。 本發明主張2008年11月28日所申請的日本專利申請案 2008-細7之優先權，該專利案的内容在此併入作為终 【圖式簡單說明】 圖1是依據本發明範例的整轉錫球絲裝置的前視圖。 ，圖U其中省略_錫球安裝裝置之頭部單柄狀態之 平面圖。 圖3是顯示焊錫球安裝裝置之頭部單元的平面圖。 圖4是烊踢球安裝裝置之助禪劑塗佈單元之侧視圖。 示前技術範例中的各別單元之配置情形之 丁意圖@5Α的配置情形顯示其中 印刷單元及—元魏置於基㈣移Hr在版 098140508 201028062 球體安裝單元之前，圖5B的配置情形顯示其中助焊劑塗佈 單元之網版印刷單元係設置於基板的移動方向而位於球體 安裝單元之前，且針腳轉印單元被設置成正對著球體安裝單 元012 201028062 Alignment of the substrate 11 with the printing mechanism 13. Next, the printing mechanism 13 is lowered by a printing mechanism to lower the printing mechanism 13 to a position with a predetermined distance between the surface of the substrate and the lower surface of the printing cover 18. One of the squeegees 24 is lowered to press the printing cover 18 downward and laterally moved to print the fluxing ship into the through hole in the printing cover 18. The woven material 2 is printed on the substrate 11. Thereafter, the squeegee 24 is raised. Thereafter, the printing mechanism lifting device 20 raises the printing mechanism 13 and moves to the cleaning unit η to perform cleaning of the printing cover 18 by the moving device 15 of the movable body 14. Incidentally, it is not necessary to perform cleaning every time and it is sufficient to perform the cleaning when necessary. When the substrate u is transported to the soldering cloth unit 2, the printing mechanism 13 moves to the upper side of the substrate ^ by Other times (four) 24 _ time silk printing. Incidentally, since the substrate 11 is alternately transported to the flux application unit 2 by the respective transport units 6 and 61, the transfer operation or the printing operation is alternately performed in the order of transport. In this example, the transfer mechanism 12 and the printing mechanism 13 in the flux application unit 2 are woven on the movable body 14, and both are supported by the moving device 15 for the movable body 14. The whole moves horizontally. Further, the transfer mechanism 12 and the printing mechanism 13 may be separated from each other, and these mechanisms may be provided to be movable along a common moving path of the strip. The application of the flux-welding fine substrate 1 to the flux application unit 2 is carried by the substrate mounting unit 3 by the movement of the substrate stage 5. At this time, by the mounting head moving device 32 and the rotating device 1 〇, the substrate u and the ball mounting head 3G are moved by the 119140508 13 201028062 to position the ball mounting head 30 according to the first position determining camera 19 Second, only the position of the substrate 11 imaged by the camera 29 is confirmed, and the alignment of the substrate U with the ball mounting head 3 is performed. Next, the tin ball is spun on the substrate u by the ball head 3 〇. The substrate 11 on which the solder balls are mounted is completed by the ball mounting heads 3 in the ball mounting unit 3, and is picked up by the pick-up picker 31 to be transferred to an mounting inspection unit 35. The substrate u that has been correctly mounted in the substrate carrying unit 4 with respect to the substrate 11 that has completed the solder ball mounting inspection is transferred to the substrate u that is erroneously mounted by carrying out the transport H 36', and the pick-and-place picker 38 is placed. Transfer to a collection unit 37. The present invention claims the priority of Japanese Patent Application No. 2008-Sho. 7 filed on Nov. 28, 2008, the content of which is hereby incorporated herein in Front view of the tin ball device. Figure U is a plan view in which the single-handle state of the head of the solder ball mounting device is omitted. Figure 3 is a plan view showing the head unit of the solder ball mounting device. Fig. 4 is a side view of the smear-coating unit of the smashing ball mounting device. The configuration scenario of the individual units in the prior art example is intended to show that the printing unit and the unit are placed in the base (four) shift Hr before the ball mounting unit of the version 098140508 201028062, and the configuration of FIG. 5B is displayed therein. The screen printing unit of the flux coating unit is disposed in the moving direction of the substrate before the ball mounting unit, and the stitch transfer unit is disposed to face the ball mounting unit 0
【主要元件符號說明】 1 基板供應單元 2 助焊劑塗佈單元 3 球體安裝單元 4 基板載出單元 5 (基板）台座 6 運送單元 7 載入運送器 8 載入用拾取放置器 9 基板放置表面 10 旋轉裝置 11 基板 11， 基板 12 轉印機構 13 印刷機構 14 可移動本體 15 可移動本體移動裝置 16 助焊劑供應單元 098140508 15 201028062 17 清潔單元 18 印刷罩 19 第一位置確認攝影機 20 轉印機構升降裝置 21 印刷機構升降裝置 22 空氣缸筒 23 塗刷器移動裝置 24 塗刷器 25 清潔片 26 進料滚輪 27 捲繞滚輪 28 罩支撐裝置 29 第二位置確認攝影機 30 球體安裝頭 31 擷取用拾取放置器 32 安裝頭移動裝置 33 球體供應單元 34 吸附檢查單元 35 安裝檢查單元 36 載出運送器 37 收集單元 38 載出用拾取放置器 098140508 16 201028062 61 運送單元[Main component symbol description] 1 substrate supply unit 2 flux coating unit 3 sphere mounting unit 4 substrate carrying unit 5 (substrate) pedestal 6 transport unit 7 loading transporter 8 loading picker 9 substrate placement surface 10 Rotating device 11 substrate 11, substrate 12 transfer mechanism 13 printing mechanism 14 movable body 15 movable body moving device 16 flux supply unit 098140508 15 201028062 17 cleaning unit 18 printing cover 19 first position confirmation camera 20 transfer mechanism lifting device 21 Printing mechanism lifting device 22 Empty cylinder tube 23 Applicator moving device 24 Applicator 25 Cleaning sheet 26 Feed roller 27 Winding roller 28 Cover support device 29 Second position confirmation camera 30 Ball mounting head 31 Picking up for picking 32 Mounting head moving device 33 Ball supply unit 34 Adsorption inspection unit 35 Mounting inspection unit 36 Carrying out conveyor 37 Collection unit 38 Loading and unloading picker 098140508 16 201028062 61 Shipping unit
098140508 17098140508 17