201024738 六、發明說明： 【發明所屬之技術領域1 本發明係有關於-種加熱裝置，_是有關於一種細於積體電路元 件(1C)燒機測試的燒機設備及其中所使用的加熱裝置。 【先前技術】201024738 VI. Description of the Invention: [Technical Field 1 of the Invention] The present invention relates to a heating device, and relates to a burning device which is finer than an integrated circuit component (1C) burning machine test and the heating used therein Device. [Prior Art]
封裝完成1體電路元件(1C) ’之後仍縣-預設的高溫巾進行電性測 試藉以瞭解其穩疋度，此程序通常稱之為燒機(Byj^in)。在燒機程序進行 期間’需要加熱並控制受測1C、制器、以及其他相關元件的溫度。此加 熱系統多年來已經廣為實施，此系統通常包含一加熱器(^对过）、一溫度感 測器、以及一比較測定器，依照溫度感測器上量測到的電壓與—參考電壓 進行差異比較，並按兩者電壓之差異比例以提供能量到一加熱器，進而使 電壓之差異降低，藉以調整加熱溫度。先前技術中，此種具有加熱器與感 測器的測試插槽(Socket)，如美國公告專利US5164661、US5911897及 US7312620所揭露者，藉由直接將加熱器接觸受測的IC，用以提供受測忙 適當的溫度。 然而，現行之1C加熱器與測試插槽的連接結構普遍為單邊軸柩的掀蓋 式結構，而將1C加熱器設置於上蓋，1C加熱器内的加熱棒及溫度感測器需 要再利用導線連接到測試板上。長久使用後發現，設置有IC加熱器的上蓋 易因重複開關而造成導線之絕緣層磨耗破裂而導致導線内的線蕊外露斷 裂。此外，單邊轴樞的掀蓋式結構在實際運作時，為了便於人工操作上蓋 的開閉以檢測1C ’測試板的周圍會刻意留下可供人工操作的空間；然而， 此空間卻容易造成空氣對流，使1C加熱器的熱源因空氣對流而發生改變， 使得1C所承受的加熱溫度不穩定，造成測試結果不可靠，甚至必須重測， 導致耗費時間與費用。對於重視時效及欲降低成本的業界而言，仍有待改 善。 4 201024738 【發明内容】 έ 為了解決上述先前技術不盡理想之處，本發明提供一種Ic元件燒機設 備及其中所使用的ic加熱裝置，供IC之燒機測試使用。其中的IC加熱= 置主要包含有上蓋板、m定座、加熱塊與底座^加熱塊為肋提供接近均 勻之加熱面，以接觸受測之IC。固定座呈中空狀，藉以容許加熱塊朝下露 出，加熱塊之内部容置有至少一加熱器及一溫度感應器，且利用複數條導 線使加熱器及溫度感測器分別電性連接至一連接器。且連接器底部設置有 電路板，此電路板具有複數個第一接點。底座亦呈中空狀， ❷_，，㈣杨嫩概有,座，藉崎上 1C ’且在紐鮮，職於電路板之雜設有連接座，連触具有複數個 第二接點用以對應接觸並導通電路板之複數個第一接點。 因此，本發明之主要目的在於提供一種1C元件燒機設備及其中所使用 的rc加熱裝置’其中IC加熱裝置採用可上下分離的上蓋板及底座，且利 用上蓋板包含的連接贿底座包含的連接絲連結加熱裝置與測試板，故 可不需另外使用導線連結至測試板上，故操作上蓋板與底座賴閉時不會 造成導線損傷。 本發明之次要目的在於提供―種IC元件燒機設備及其巾所使用的ic _加熱裝置’其中IC加熱裝置採用可上下分離的上蓋板及底座，故不需在Ic 加熱裝置周關意留下^間而遭受空氣雌影響，故可使得IC加熱穩定。 -目的在於提供一種IC元件賴設備及其中所使用的IC 加熱裝置，其中IC加熱裝置採用可上下分離的上蓋板及底座，因此整體的 體積不變部可增加1C上方的操作空間，更易於檢修。 m再一目的在於提供一種ic元件燒機設備及其中所使用的冗 加熱裝置’其中IC加熱裝置採用可上下分離的上蓋板及底座，利用上蓋板 的連接器與底座的連接座來連結加熱裝置與測試板 ，故利於導入1C的自動 化上載(loading)與卸載(她ading)，可大幅提升自動化效率。After the package completes the 1-body circuit component (1C)', the county-predetermined high-temperature towel is electrically tested to understand its stability. This program is usually called a burn-in machine (Byj^in). Heating and controlling the temperature of the 1C, controller, and other related components under test is required during the burn-in process. This heating system has been widely implemented for many years. The system usually includes a heater (^), a temperature sensor, and a comparator, according to the measured voltage and reference voltage on the temperature sensor. The difference is compared and the energy is supplied to a heater in proportion to the difference between the voltages of the two, thereby reducing the difference in voltage, thereby adjusting the heating temperature. In the prior art, such a test socket (Socket) having a heater and a sensor, as disclosed in US Pat. No. 5,164,761, US Pat. No. 5,191,897 and US Pat. No. 7,312,620, is provided to directly receive the heater to the IC under test. Measure the appropriate temperature. However, the connection structure of the current 1C heater and the test socket is generally a clamshell structure of a single-sided shaft, and the 1C heater is disposed on the upper cover, and the heating rod and the temperature sensor in the 1C heater need to be reused. Wires are connected to the test board. After long-term use, it was found that the upper cover provided with the IC heater was liable to cause the wire of the wire to be worn and broken due to the repeated switch, and the wire core in the wire was exposed and broken. In addition, in the actual operation of the clamshell structure of the single-sided pivot, in order to facilitate the manual opening and closing of the upper cover to detect the surrounding of the 1C 'test plate, a space for manual operation is intentionally left; however, this space is easy to cause air. Convection causes the heat source of the 1C heater to change due to air convection, which makes the heating temperature of 1C unstable, resulting in unreliable test results and even retesting, resulting in time and expense. For industries that value aging and want to reduce costs, there is still room for improvement. 4 201024738 SUMMARY OF THE INVENTION In order to solve the above-mentioned prior art unsatisfactory, the present invention provides an Ic component burning machine and an ic heating device used therein for use in IC burning test. The IC heating = set mainly includes an upper cover, an m-seat, a heating block and a base. The heating block provides a nearly uniform heating surface for the rib to contact the IC under test. The fixing seat is hollow, so as to allow the heating block to be exposed downward, the heating block has at least one heater and a temperature sensor therein, and the heater and the temperature sensor are electrically connected to each other by using a plurality of wires. Connector. And the bottom of the connector is provided with a circuit board having a plurality of first contacts. The base is also hollow, ❷_,, (4) Yang Nen has a seat, borrowed from the 1C on the Saki, and in the New Zealand, the circuit board is equipped with a connector, and the contact has a plurality of second contacts to correspond Contact and turn on a plurality of first contacts of the circuit board. Accordingly, it is a primary object of the present invention to provide a 1C component burning apparatus and an rc heating apparatus used therein, wherein the IC heating apparatus employs an upper cover and a base that can be separated up and down, and the connection bribe base included in the upper cover includes The connecting wire is connected to the heating device and the test board, so that the wire can be connected to the test board without using a separate wire, so that the wire is not damaged when the upper cover and the base are closed. A secondary object of the present invention is to provide an ic_heating device for use in an IC device burning apparatus and a towel thereof, wherein the IC heating device adopts an upper cover and a base which can be separated up and down, so that it is not necessary to stay in the Ic heating device. Under the influence of the air, it can make the IC heating stable. - The object is to provide an IC component-receiving device and an IC heating device used therein, wherein the IC heating device adopts an upper cover plate and a base which can be separated up and down, so that the integral volume constant portion can increase the operation space above 1C, and is easier Overhaul. A further object is to provide an ic device burning device and a redundant heating device used therein. The IC heating device adopts an upper cover and a base which can be separated up and down, and is connected by a connector of the upper cover and a base of the base. The heating device and the test board facilitate the automatic loading and unloading of the 1C, which can greatly improve the automation efficiency.
S &於提供-種1C元件燒機設備及其巾所使用的1C 5 201024738 '； 加熱裝置，其中IC加熱裝置藉由固定座與上蓋板之間設置第-隔熱片，得 以減少熱能自加熱塊散逸至固定座，更能提昇1(：加熱的穩定度。 本發明之再一目的’在於提供一種IC元件燒機設備及其中所使用的IC 加熱裝置，其中ic加熱裝置藉由底座之底部設置有第二隔熱片，得以減少 熱能散逸至測試板，更能提昇IC加熱的穩定度。 本發明之再一目的在於提供一種IC元件燒機設備及其中所使用的ic 加熱裝置，其中IC加熱裝置藉由增設第一隔熱片與第二隔熱片，可以使得 加熱《BL度的變異量控制在1.2%以内，遠較先前技術20%以上的溫度變異為 ©優。 【實施方式】 由於本發明係揭露一種燒機測試所需的1C元件燒機設備及其中所使用 的1C加熱裝置，其中所利用之燒機測試之基本原理，已為相關技術領域具 有通常知識者職明瞭，故町文巾之·，不再完整描^同時，以下 文中所對照之圖式’係表達與本發明特徵有關之結構示意，並未亦不需要 依據實際尺寸完整續·製，盘先敘明。 藝 首先清參考第1A圖與第1B圖’係根據本發明戶斤提供之第一較佳實施 例，係一種ic加熱裝置100的立體示意圖，供IC2〇〇之燒機測試使用主 要包含有上蓋板11、固定座12、加熱塊13與底座14。加熱塊13之内部至 少容置有-個加熱器132及溫度感應器m，用以提供接近均句之加熱面， 以接觸受測1C 2〇〇 ’並將熱能傳遞至受測IC 2〇〇。在較佳的實施例中，加 熱器132為一對，且溫度感應器131設置於一對加熱器132的中央，並延 伸至加熱塊13的底部，藉此可以獲得最接近受測IC 2〇〇的溫度。 加熱塊13鎖附於上蓋板U之下方中央部位，上蓋板^之下方周緣的 適當部位藉由鎖合組件15(例如：螺絲、彈簧)鎖附至固定座12。固定座Ο 呈中空狀，藉以容許加熱塊13朝下露出，並且利用導線16使得加熱器Η] 6 201024738 . 及溫度感測器131與連接器17電性連接，其中連接器π的底部設置有電 路板18，而電路板18上具有複數個第一接點18卜 底座14位置最接近測試板300，底座14呈中空狀，藉以容許加熱塊 13朝下露出。加熱塊13之下方設有一容設座19，藉以放置受測之ic 2〇〇， 容設座19可防止受測1C200被過度施壓，因為當1C加熱裝置1〇〇因誤動 而過度施壓時，容設座19可抵制於上蓋板U，避免受測1(：2〇〇被加熱塊 13過度施壓而毀損。在容設座19旁，對應於電路板18之部位設有連接座 20’連接座20具有複數個第二接點201為用以對應接觸並導通該電路板π φ 之複數個第一接點181。在較佳實施例中，連接座20可以為探針座，而複 數個第一接點201接點可以為針狀之端子或是為具有彈性之端子，例如彈 簧探針(pogopin)。當然，一般的電性連接器亦可使用，只要使用可以傳導 連接器17與連接座20之間訊號的裝置皆可。 由上述較佳實施例可知，與先前技術相較之下，本發明的1(：加熱裝置 100不需另外拉没導線16連接到測試板3〇〇上，而是利用上蓋板η包含的 連接器17與底座14包含的連接座20來連結1C加熱裝置100,故在操作上 蓋板11開關時並不會造成導線16損傷。而且，因上蓋板U與底座14採 取分離式的結構，所以不需在1<：加熱裝置1〇〇周圍留下空間，因此不易受 空氣對流的影響，故可使得1C200加熱穩定。重要的是，在實際操作燒機 測試時，將會同時使用複數個IC加熱裝置1〇〇，因此本發明的汜加熱裝置 100可同時將複數個上蓋板11裝設在另一個機構的同一平面上可利於 導入自動化流程，提升1C 200上載(loading)、卸載(unloading)與自動化測試 之效率’進而加速燒機測試流程。 凊繼續參考第1A圖，根據本發明之ic加熱裝置100，進一步可在固 疋座12與上蓋板11之接觸部位設置至少一第一隔熱片26，則可減少熱能 自加熱塊13散逸至固定座12 ;以及進一步在底座14之底部設置至少一第 二隔熱片27，則可減少熱能散逸至測試板3〇〇，因此可使加熱塊13給予受 7 201024738 • 測1C 200的加熱溫度介於攝氏1HM50度之間，並使得加熱溫度的變異量 控制在h2%以内，遠較先前技術20%以上的溫度變異為優；再者，於一較 佳的實施例中，本發明所述之加熱塊13的底部更可貼附一石磨片，使汇 加熱裝置1GG於燒機触巾的溫度分散更騎及聽加紐13於扣合或開 啟時碰撞而遭到損傷。 請繼續參考第2圖，係根據本發明所提供之第二較佳實侧，為一種 1C元件燒機設備鲁忙元件燒機設備_，包含有複數個ΐ(：加熱裝置· ❹供1C之燒機測試使用。Ic加熱裝置_，主要包含有上蓋板、固定座、加 熱塊與底座，加熱塊為肋提供接近均勻之加熱面，以接觸㈣之K，其 中1C加熱裝置100之特徵如前述第一較佳實施例所述。 、 X上所述僅為本發明之較佳實施例’並非用以限定本發明之權利範 圍。同時以上的描述，對於熟知本技術領域之專門人士應可明瞭及實施， 因此其他纽縣發騎揭示之精神頂完成崎效 含在申請專利範圍中。 fS & 1C 5 201024738 ' used in the 1C component burning equipment and its towel; heating device, wherein the IC heating device is provided with a first heat insulating sheet between the fixing seat and the upper cover to reduce heat energy The self-heating block is dissipated to the fixing seat, and the lifting degree 1 can be further improved (the heating stability is further.) Another object of the present invention is to provide an IC component burning apparatus and an IC heating apparatus used therein, wherein the ic heating apparatus is provided by the base The second heat insulating sheet is disposed at the bottom to reduce heat energy dissipation to the test board, and the stability of the IC heating is further improved. A further object of the present invention is to provide an IC component burning apparatus and an ic heating device used therein. In the IC heating device, by adding the first heat insulating sheet and the second heat insulating sheet, the variation of the BL degree can be controlled within 1.2%, and the temperature variation of 20% or more is superior to that of the prior art. The present invention discloses a 1C component burning device and a 1C heating device used in the burning machine test, wherein the basic principle of the burning machine test used therein has been There is a general knowledge of the job, so the town's towel is no longer fully described. At the same time, the drawings in the following texts represent the structure related to the features of the present invention, and do not need to be completed according to the actual size. The system is first described with reference to the first preferred embodiment of the present invention. The first preferred embodiment of the present invention is a perspective view of an ic heating device 100 for IC2. The burner test mainly includes an upper cover 11, a fixing base 12, a heating block 13 and a base 14. The inside of the heating block 13 is provided with at least a heater 132 and a temperature sensor m for providing a close to the sentence. The heating surface is contacted to contact the measured 1C 2〇〇' and the thermal energy is transferred to the IC under test 2. In a preferred embodiment, the heaters 132 are a pair and the temperature sensor 131 is disposed in a pair of heaters. The center of 132 extends to the bottom of the heating block 13, whereby the temperature closest to the IC 2 to be tested can be obtained. The heating block 13 is attached to the lower central portion of the upper cover U, and the lower periphery of the upper cover ^ The appropriate part is by the locking assembly 15 (for example: screws, The spring lock is attached to the fixing seat 12. The fixing seat 呈 is hollow, thereby allowing the heating block 13 to be exposed downward, and the heater 16 is used to electrically connect the heater Η 6 201024738 . and the temperature sensor 131 and the connector 17 are electrically connected. The bottom of the connector π is provided with a circuit board 18, and the circuit board 18 has a plurality of first contacts 18. The base 14 is located closest to the test board 300, and the base 14 is hollow, thereby allowing the heating block 13 to be exposed downward. A receiving seat 19 is disposed under the heating block 13 to place the tested ic 2〇〇, and the receiving seat 19 prevents the 1C200 from being overstressed because the 1C heating device 1 is excessively activated due to malfunction. When the pressure is applied, the receiving seat 19 can resist the upper cover U, and the measured 1 (: 2 〇〇 is excessively pressed by the heating block 13 to be damaged. Next to the housing 19, a portion corresponding to the circuit board 18 is provided with a connector 20'. The connector 20 has a plurality of second contacts 201 for correspondingly contacting and conducting a plurality of first contacts of the circuit board π φ 181. In the preferred embodiment, the connector 20 can be a probe holder, and the plurality of first contacts 201 can be pin-shaped terminals or resilient terminals such as pogopins. Of course, a general electrical connector can also be used as long as a device that can transmit signals between the connector 17 and the connector 20 can be used. It can be seen from the above preferred embodiment that, compared with the prior art, the present invention 1 (the heating device 100 does not need to be additionally pulled the wire 16 to be connected to the test board 3, but is covered by the upper cover n The connector 17 and the connecting base 20 included in the base 14 are connected to the 1C heating device 100, so that the wire 16 is not damaged when the upper cover 11 is opened and closed. Moreover, the upper cover U and the base 14 are separated by a structure. Therefore, it is not necessary to leave a space around the 1<:heating device 1 ,, so it is not easily affected by the air convection, so the heating of the 1C200 can be stabilized. It is important that when the actual burning test is performed, the plural will be used at the same time. The IC heating device 1〇〇, therefore, the crucible heating device 100 of the present invention can simultaneously install a plurality of upper cover plates 11 on the same plane of another mechanism, which can facilitate the introduction of an automated process, and enhance the loading and unloading of the 1C 200. (unloading) and the efficiency of the automated test', thereby accelerating the burn-in test flow. 凊Continuously referring to FIG. 1A, the ic heating device 100 according to the present invention may further be disposed at a contact portion between the solid seat 12 and the upper cover 11. If the first heat insulating sheet 26 is less, the heat energy can be reduced from the heating block 13 to the fixing seat 12; and further, at least one second heat insulating sheet 27 is disposed at the bottom of the base 14, thereby reducing heat energy dissipation to the test board 3〇 〇, therefore, the heating block 13 can be given to 7 201024738 • The heating temperature of 1C 200 is between 1 HM and 50 degrees Celsius, and the variation of the heating temperature is controlled within h2%, which is far more than 20% of the temperature variation of the prior art. In a preferred embodiment, the bottom of the heating block 13 of the present invention can be attached with a stone grinding piece, so that the temperature of the heating device 1GG can be dispersed and listened to at the temperature of the burning towel. The button 13 is damaged when it is engaged or opened. Please refer to Fig. 2, which is a second preferred solid side according to the present invention, which is a 1C component burning device Lu busy component burning machine_ , including a plurality of ΐ (: heating device ❹ for 1C burning machine test. Ic heating device _, mainly includes an upper cover, a fixed seat, a heating block and a base, the heating block provides a nearly uniform heating surface for the rib To contact (4) K, where 1C is heated The features of the present invention are as described in the foregoing first preferred embodiment. The above description of the preferred embodiment of the present invention is not intended to limit the scope of the present invention. The special personnel should be able to understand and implement, so other New County hair riding reveals the spirit of the completion of the effect is included in the scope of the patent application.
【圖式簡單說明】 係根據本伽提出之第—較佳實施例，為一 係根據本翻提H較佳實施例，為- 第1A圖為一立體示意囷， 種具有1C元件的加熱裝置。 第1B圖為一立體示意圖， 種具有1C元件的加熱裝置。BRIEF DESCRIPTION OF THE DRAWINGS According to a preferred embodiment of the present invention, a preferred embodiment according to the present invention is a first embodiment, a heating device having a 1C component. . Fig. 1B is a perspective view showing a heating device having a 1C element.
之第二較佳實施例，為一種1C 第2圖為一示意圖 元件燒機設備。 ，係根據本發明提出 【主要元件符號說明】 1C加熱裝置 100 8 11 201024738 -. 上蓋板 12 13 131 132 14 15 16 17 18 181 19 20 201 21 22 23 200 固定座 加熱塊 溫度感應器 加熱器 底座 鎖合組件 導線 ^ 連接器 電路板 第一接點 容設座 連接座 第二接點 扣合組件 扣合槽 導引銷The second preferred embodiment is a 1C Fig. 2 is a schematic diagram of a component burning apparatus. According to the present invention, [main component symbol description] 1C heating device 100 8 11 201024738 -. Upper cover 12 13 131 132 14 15 16 17 18 181 19 20 201 21 22 23 200 Fixed block heating block temperature sensor heater Base lock assembly wire ^ connector circuit board first contact receptacle seat connector second contact snap assembly snap groove guide pin
鲁 1C 測試板 300 第一隔熱片 26 第二隔熱片 27 1C燒機設備 400 9Lu 1C Test Board 300 First Insulation Sheet 26 Second Insulation Sheet 27 1C Burning Machine 400 9