M320675 八、新型說明： 【新型所屬之技術領域】 本創作係關力-種積體電路元件<測試連接器，尤指 -種以導電膠片為訊號傳遞媒介之測試連接器構造設計。 【先前技術】 為確保積體電路元件出貨之產品良率達到一定水準， 在該些積體電路元件完成構裝之後，均會對該些積體電路 兀件進行功能性檢測，用以篩選出不良品。 有關目前積體電路元件之測試作業，其主要係使用一 組測試設備’丨中利用該測試設備中襄置於測試電路板上 之測試連接器提供待測積體電路元件放置其中定位，且利 用該測試連接器中之連接件作為該待測積體電路元件與測 試電路板間之訊號傳輸媒介，所述之連接件可為探針卡或 導電膠片、…等，使該測試設備中之測試系統程式可對該 待測積體電路元件進行功能檢測，用以判斷該積體電路^ 件之功能是否正確，達到篩選不良產品之目的。 針對前述應用於待測積體電路元件與電路載板 訊號傳輸媒介之導電膠片而言，其主要係—内部具有複數 導線的平板狀彈性膠冑，㈣導線於該彈性膠體中自 向延伸至下表面呈散佈狀，藉此，當該彈性導 冓件應用於測試設備中進行積體電路元件測試時 特定裝置施Μ該待測積體電路元件，㊣而顧該導電" 上’使該待測半導體產件底部的接腳（凸： 專）經由該導電膠片中之導線接觸測試 攸上之接觸 M320675 墊，再為測試設備對其作功能性檢測。 惟前述使用導電膠片之測試連接器設計，主要係使用 固疋座將該導電膠片固定於測試電路板上，其中該固定 座係為固疋式構造’無法因應不同規格之積體電路元件使 用必須對整組測試連接器進行更換，力以設於該固定座中 之導電膠片必須由固定座底部置入，因而更換導電膠片， 即須拆下固定座，造成該連接器使用上之諸多不便。 【新型内容】 本創作之主要目的在於提供一種導電膠片式積體電路 兀件測试連接器，希藉此設計，克服先前既有測試連接器 不便於依不同規格待測積體電路元件更換之框形部件之缺 為達成前揭目的，本創作所設計之導電膠片式積體電 路元件測試連接器係包括：M320675 VIII, new description: [New technical field] This creation is related to the production of circuit components and test connectors, especially the test connector design with conductive film as the signal transmission medium. [Prior Art] In order to ensure that the product yield of the integrated circuit component shipment reaches a certain level, after the integrated circuit components are completed, the integrated circuit components are functionally tested for screening. Defective products. The test operation of the current integrated circuit components is mainly carried out by using a set of test devices, wherein the test connector placed on the test circuit board in the test device is used to provide positioning of the integrated circuit component to be tested, and the use is performed. The connector in the test connector serves as a signal transmission medium between the integrated circuit component to be tested and the test circuit board, and the connector can be a probe card or a conductive film, etc., so that the test in the test device The system program can perform function detection on the integrated circuit component to be tested to determine whether the function of the integrated circuit component is correct, and achieve the purpose of screening for defective products. For the above-mentioned conductive film applied to the integrated circuit component to be tested and the circuit board signal transmission medium, the main one is a flat elastic adhesive tape having a plurality of wires inside, and (4) the wire extends from the elastic colloid to the lower side in the elastic colloid. The surface is scattered, whereby when the elastic guide member is applied to the test device for performing the integrated circuit component test, the specific device applies the integrated circuit component to be tested, and the conductive The pin on the bottom of the semiconductor device is tested to contact the M320675 pad on the test pad via a wire in the conductive film, and then functionally tested for the test device. However, the above test connector design using conductive film mainly uses a solid seat to fix the conductive film on the test circuit board, wherein the fixed seat is a solid-state structure, which cannot be used in accordance with different specifications of the integrated circuit components. The entire set of test connectors is replaced, and the conductive film disposed in the fixed seat must be placed at the bottom of the fixing base, so that the conductive film is replaced, that is, the fixing seat must be removed, which causes the inconvenience of using the connector. [New content] The main purpose of this creation is to provide a conductive film type integrated circuit component test connector, which is designed to overcome the previous test connector is not convenient to replace the integrated circuit components to be tested according to different specifications. The lack of frame-shaped components is achieved. The conductive film-type integrated circuit component test connector designed by the present invention includes:
一基座’具有一容置槽位於底部，以及一裝配槽位於 頂部連通該容置槽； 一導電膠片，係置設於該基座之容置槽中，該導電膠 片包括一彈性片體、以及複數導線佈設於該彈性片體内呈 特定方向細密狀間隔排列；以及 一定位框’係以卡柑式可拆組地置設於該基座之裝配 槽中，該定位框中形成一定位槽。 本創作藉由前揭技術方案之設計，其可達成之功效 是：本創作所設計之測試連接器主要係於該基座中形成上 下連通之裝配槽及容置槽，於該容置槽中裝設導電膠片， 5 M320675 於上方之裝配槽中裝設一可拆組的定位框，該定位框中具 有對應待測積體電路元件之定位槽，藉此，使該測試連接 器裝設於測試設備之測試電路板後，在基座不拆解之狀態 下’利用該定位框與基座間係採取無螺絲之卡柑式可快速 拆組組合構造設計，使其可因應不同尺寸之待測積體電路 元件直接利用簡便的拆解工具拆解定位框，更換與待測 積體電路元件相匹配之定位框，同時可藉由定位框與基座 間可快速拆組之構造，以及導電膠片可由上方置入基座中 等設計，使其可便於更換導電膠片。 【實施方式】 如第一圖所示，係揭示本創作導電膠片式積體電路元 件測試連接器之一較佳實施例，由圖中可以見及該測試連 接器主要係包括一基座（丄〇)、一導電膠片（2〇)以 及一定位框（30)，或進一步包括一導電載板（2 3)，其中：a pedestal has a receiving groove at the bottom, and a mounting groove is located at the top to communicate with the accommodating groove; a conductive film is disposed in the accommodating groove of the pedestal, the conductive film comprises an elastic piece, And the plurality of wires are arranged in the elastic body in a finely spaced manner in a specific direction; and a positioning frame is disposed in the mounting groove of the base in a detachable group, and the positioning frame forms a positioning. groove. This design is achieved by the design of the prior art solution. The achievable effect of the present invention is that the test connector designed by the present invention mainly forms an assembly groove and a receiving groove which are connected up and down in the base, and the accommodating groove is formed in the accommodating groove. The conductive film is installed, and the 5 M320675 is provided with a detachable positioning frame in the upper mounting groove, and the positioning frame has a positioning groove corresponding to the integrated circuit component to be tested, thereby the test connector is mounted on the test connector. After testing the test circuit board of the equipment, in the state where the pedestal is not disassembled, 'the use of the positioning frame and the pedestal adopts a screw-free card type to quickly disassemble the combined structure design, so that it can be tested according to different sizes. The integrated circuit component directly disassembles the positioning frame by using a simple disassembly tool, and replaces the positioning frame matched with the integrated circuit component to be tested, and can be quickly disassembled by the positioning frame and the base, and the conductive film can be The upper base is designed to make it easy to replace conductive film. [Embodiment] As shown in the first figure, a preferred embodiment of the test conductive film type integrated circuit component test connector is disclosed. As can be seen from the figure, the test connector mainly includes a base (丄〇), a conductive film (2〇) and a positioning frame (30), or further comprising a conductive carrier (23), wherein:
«亥基座（1〇)中具有一谷置槽（11)以及一裝配 槽（1 2 )，該容置槽（1 1 )可為方形並成形於該基座 (1 0 )底部，該裝配槽（1 2)可為方形並成形於該基 座（10)頂部對應連通下方的容置槽（11)，該基座 (1 0 )周邊設有數穿孔（1 3 )，用以提供螺絲之類的 固接元件穿設之用，另该基座（1 〇 )尚可設置對位部 (1 4 )，用以與自動機台對位連接時之用。 該導電膠片（2 0)可為方形，並可由上而下地置入 於該基座（i 〇 )之容置槽（i i )中，該導電膠片（2 6 M320675 〇)包括一彈性 -(2 1 )以及複數導線（2 2 )佈今 於該彈性片體（2 1、如 帀 i )内呈特定方向細密狀間隔排列，使 〃具有在特定方向之電性傳導功能，所述之特定方 垂直狀或與彈性片舻 < 两 片體（21)之下表面呈一傾斜角度 傾斜角度介於50〇〜90。。 ^ 办山 90為佳，該些導線（2 2 )上下端略 犬出於該彈性片體（2 1 )之上表面及下表面；又， 電膠片（U)面積可略小於該基座（1Q)之容= 11)底面積，使該導電膠片（2〇)侧邊與該容置槽 11)槽壁間具有間距，提供該導電膠片 膨脹之伸展空間。 … 该定位框（3 0 )係一可以無螺絲之卡扭手段快 組地裝設於該基座（1〇)裝配槽（12)中之構件，該 =位框（30)中形成一定位槽（31)，提供待測積體 電路兀件（5 0 )對位置入其中之用，該定位槽（3 上端部周邊可形成導斜面（32)，使該定位槽（3 上端部形成擴張狀之開p，以便於待測積體電路元件（5 0)導正置入該定位槽（3 1)中。 如第四圖所示，所述之導電載板（2 3)係心該基 座（10)之容置槽（11)中介於定位框（3 〇)二 電膠片（20)之間，㉟導電載板（23)包括—具有複 數牙孔之板體（23 1)，以及複數導電塊（ 、z 3 2 )分 別裝設於該些穿孔中，該些導電塊（2 q 9、 〇 ζ )頂端部可突 出、等高或略低於該板冑（2 3 i)之上表面，該些導電 塊（2 3 2 )底端部則凸出該板體（2 3 Ί、— ± 丄」< 下表面， M320675 分別觸接該導電膠片（2 〇 )上的導線（2 2 )。 如第-、二圖所示，所述之基座（工〇 )於其裝配槽 (1 2 )之内侧壁設有凸塊狀第一定位部（丄5 )，於該 定位框（3 0 )外周邊設有凹部狀第二定位部（3 3 )對 應於該凸塊狀第-定位部（15)，使該基座（1〇)與 該定位框（3 0 )間利用第一定位部（i 5 )、第二定位 部（3 3 )對位組合而定位，前述之凸塊狀第—定位部與 凹部狀第二定位部亦可為反向設計，仍可達到相對組合定 位之目的。 如弟一、三圖所示，該定位框（3 〇 )外周邊尚可進 一步裝設數可壓縮彈性之彈性件（34)，用以在定位框 (30) £入5亥基座之裝配槽（12)中，藉該 些彈性件（3 4 )被壓縮抵靠於該基座（丄〇 )裝配槽 (1 2 )之内侧壁處，使定位框（3 〇 )固定於基座（丄 〇)的裝配槽（12)巾，避免定位框（3〇)晃動。 本創作藉由前揭積體電路元件測試連接器設計，於使 用時’該連接㈣喊於㈣設備之測試電路板（4 〇 ) 2並使導電膠片（2Q)中特定的導線（22)底端接 =測試電路板（40)的接觸墊，以該導電膠片（2 之導線（2 2 )作為該待測積體電路元件（5 〇 )與 及喊電路板（4 0 )間訊號傳輸的媒介。 如第五、力圖所不，當待測積體電路元件（50)進 :♦，忒積體電路元件（5 〇 )係被移送至該定位框 C3〇)之定位槽（31)中定位，再藉由取置裝置（或 M320675 手動裝置）（6 Ο )施壓於該待測積體電路元件（5 〇 ) 上’進而壓抵該導電膠片（2〇)上，或是透過該導電載 板（23)之數導電塊（232)壓抵於該導電膠片（2 〇)上’其中藉由該導電膠片（20)提供待測積體電路 兀件（5 0)自上方壓抵其上之緩衝彈性，以及該導電膠 片（2 0 )特定方向傳導特性，使該待測積體電路元件 (5 0 )底部的接腳（或引墊或凸塊）直接經由該導電膠 片（2 0 )中之導線（2 2 )接觸測試電路板（4 〇 )上 之接觸墊，或是，該待測積體電路元件（5 〇 )底部的接 腳（或引墊或凸塊）經由該導電載板（2 3 )之導電塊（2 3 2 )經由該導電膠片（2 〇 )中之導線（2 2 )接觸測 試電路板（4 Q )上之接觸墊，再為測試設備對該待測積 體電路元件進行功能性檢測。 、 當該測試連接器提供多數個積體電路元件接續置放其 中進灯測錢’雖會因長時間積體電路元件測試工作時產 生的熱能傳向該導電膠片（2〇)，會使導電膠片 ㈧因高溫而膨脹’惟因該基座（10)底部之容置样 …）與該導電膠片⑴以具有間距，提供：= :;广)熱膨服之伸展空間，故使該導電 ◦)在使用過程中可 運:之現象’維持待測積體電路元件功能性檢測之正常 當有在適當的尺寸規格内之不同大 元件要進行測試時，本規格的積體電路 割作之，則3式連接器可利用該定位框 9 M320675 ^亥基座（丄〇 )中為可拆組之 應不同尺寸之待測積體電路元 了因 :電：-件及基座U。) 一定 = 導電膠“20)、導電載二 (2〇广二1 〇)上方置入等設計，藉以在導電膠片 時:亦可取下定位框(3〇)，直接更換: 如第七圖所不，本創作為使定位框（3 0 )更易於自 土座（1 〇)中拆解，尚可進一步於該定位框（3 〇 面没數螺孔（3 5)，該些螺孔可（35)設於該定位框 (3 0 )才目對應兩側之頂面或四周頂面處，提供拆解工具 7 0 )之螺、、、糸（7 2 ) —端螺入其中，透過該拆解工具 (7 0 )將定位框（3 〇 )自基座（丄〇 )中取出；前述 之拆解工具（7 0 )可包括至少二長桿狀螺絲（7 2 )， 或進一步包括一工具導塊（71)，該工具導塊（71) 底部具有一對位凸部（7 1 1 )對應於該定位框（3 〇 ) 之對位槽（3 1 )，且該工具導塊（7 1 )上設有數穿孔 (7 1 2 )分別對應該定位框（3 0 )上的螺孔（3 5 )，該些長桿狀螺絲（7 2 )分別裝設於該些穿孔（7 12)中，如此，作業人員可使用該拆解工具（70)之 工具導塊（7 1 )置放於該定位框（3 0 )上，使其對位 部（1 4 )對應置入該定位槽（3 1 )中，並使該些穿孔 (1 3 )分別對應定位框（3 0 )上的螺孔（3 5 )，繼 M320675 而將該些螺絲（7 2 )虫累人兮令A 4r / ^ )螺人該疋位框（3 Q )之螺孔（3 5 )中，其次，即可手持該至zh ^ W ^ r r-y 、 王夕一螺絲（7 2 )將該定位 框（3 G)自基座（χ 〇)中拔出’順利地拆解定位框 (3 0 )，以便於更換定位框（3 〇 )、導電載板（2 3)或導電膠片（2〇)。 【圖式簡單說明】«Hai base (1〇) has a valley slot (11) and a mounting slot (1 2 ), the receiving slot (1 1 ) can be square and shaped at the bottom of the base (10), The mounting groove (12) may be square and formed on the top of the base (10) corresponding to the communication groove (11) below the communication. The base (10) is provided with a plurality of perforations (13) for providing screws. The fixing component is used for piercing, and the base (1 〇) can also be provided with a aligning portion (1 4 ) for use in the alignment with the automatic machine. The conductive film (20) may be square and may be placed into the receiving groove (ii) of the base (i) from top to bottom. The conductive film (2 6 M320675 〇) includes an elastic- (2) 1) and the plurality of wires (2 2 ) are arranged in a finely spaced manner in the specific direction in the elastic sheet body (2 1 , such as 帀i ), so that the crucible has an electrical conduction function in a specific direction, the specific square Vertically or at an oblique angle to the lower surface of the elastic sheet < two sheets (21) at an oblique angle of 50 〇 to 90. . ^ It is preferable to set up the mountain 90. The upper and lower ends of the wires (2 2 ) are slightly above the upper surface and the lower surface of the elastic piece body (2 1 ); further, the area of the electric film (U) may be slightly smaller than the base ( 1Q) 容 = 11) The bottom area is such that the side of the conductive film (2 〇) and the groove wall of the accommodating groove 11) have a space to provide an expansion space for the conductive film to expand. The positioning frame (30) is a member that can be assembled in the base (1〇) mounting groove (12) by means of a screwless twisting means, and a positioning is formed in the = position frame (30) a slot (31) for providing a position of the integrated circuit component (50) to be tested, wherein the positioning groove (3) can form a guiding slope (32) around the upper end portion, so that the positioning groove (the upper end portion of the positioning groove 3 is expanded) Opening p, so that the integrated circuit component (50) to be tested is placed into the positioning slot (31). As shown in the fourth figure, the conductive carrier (23) is centered. The accommodating groove (11) of the pedestal (10) is interposed between the positioning frame (3 〇) and the second electric film (20), and the 35 conductive carrier plate (23) includes a plate body (23 1) having a plurality of dental holes. And a plurality of conductive blocks ( , z 3 2 ) respectively disposed in the through holes, the top ends of the conductive blocks (2 q 9 , 〇ζ ) may protrude, be equal to or slightly lower than the plate 胄 (2 3 i) On the upper surface, the bottom ends of the conductive blocks (2 3 2 ) protrude from the plate body (2 3 Ί, - ± 丄) < lower surface, and M320675 respectively contacts the wires on the conductive film (2 〇) (2 2 ). As the first -, second As shown, the base (the workpiece) is provided with a convex first positioning portion (丄5) on the inner side wall of the mounting groove (1 2 ), and a concave portion is arranged on the outer periphery of the positioning frame (30). The second positioning portion (3 3 ) corresponds to the convex first positioning portion (15), and the first positioning portion (i 5 ) is used between the base (1〇) and the positioning frame (30). The second positioning portion (3 3 ) is positioned and positioned in combination, and the aforementioned convex-shaped first positioning portion and the concave second positioning portion may also be reverse-designed, and the relative combination positioning may still be achieved. As shown in the three figures, the outer periphery of the positioning frame (3 〇) can be further equipped with a plurality of compressible elastic elastic members (34) for the mounting groove (12) of the positioning base (30) into the 5 hoist base. The elastic members (3 4 ) are compressed against the inner side wall of the susceptor (1 2 ) to fix the positioning frame (3 〇) to the pedestal (丄〇). Assembling the groove (12) to avoid swaying of the positioning frame (3〇). This design is designed by the front uncovering circuit component test connector. When used, the connection (4) is called (4) the test circuit board of the device (4) 2 and the bottom end of the specific wire (22) in the conductive film (2Q) = the contact pad of the test circuit board (40), with the conductive film (2 wire (2 2 ) as the integrated circuit component to be tested (5 〇) and the signal transmission medium between the circuit board (40). If the fifth, the effort is not, when the integrated circuit component (50) to be tested enters: ♦, hoarding circuit components (5 〇) Positioned in the positioning slot (31) of the positioning frame C3), and then pressed on the integrated circuit component (5 〇) by the taking device (or M320675 manual device) (6 Ο) 'In turn, pressing the conductive film (2〇) or pressing the conductive block (232) of the conductive carrier (23) against the conductive film (2 〇), wherein the conductive film (20) Providing a buffering elasticity of the integrated circuit component (50) to be pressed thereon from above, and a conductive characteristic of the conductive film (20) in a specific direction, so that the bottom of the integrated circuit component (50) to be tested is The pin (or pad or bump) directly contacts the contact pad on the test circuit board (4 〇) via the wire (2 2 ) in the conductive film (20) Alternatively, the pin (or pad or bump) at the bottom of the integrated circuit component (5 〇) to be tested is via the conductive film (2 3 2 ) via the conductive pad (2 3 2 ) of the conductive carrier (2 3 ) (2 〇 The wire (2 2 ) in contact with the contact pad on the test circuit board (4 Q ), and then the functional test of the integrated circuit component to be tested for the test device. When the test connector provides a plurality of integrated circuit components to be placed in the light to measure the light, although the thermal energy generated by the long-term integrated circuit component test work is transmitted to the conductive film (2〇), the conductive The film (8) expands due to the high temperature 'but because the bottom of the susceptor (10) is placed...) and the conductive film (1) has a spacing, providing: =:; wide) the expansion space of the thermal expansion, so that the conductive ◦ The phenomenon that can be transported during use: Maintaining the normality of the functional test of the integrated circuit components to be tested. When there are different large components within the appropriate size specifications to be tested, the integrated circuit of this specification is cut, Then, the type 3 connector can utilize the positioning frame 9 M320675. In the pedestal (丄〇), the detachable group of different sizes of the integrated circuit elements to be tested are: electricity: - piece and base U. ) = = conductive adhesive "20", conductive load 2 (2 〇 广二1 〇) placed above, etc., in the case of conductive film: can also remove the positioning frame (3 〇), directly replace: as shown in the seventh figure No, this creation is to make the positioning frame (30) easier to disassemble from the earthen seat (1 〇), and it can be further in the positioning frame (the number of screw holes (3 5) in the 3 〇 face, the screw holes can be (35) is disposed at the top surface or the top surface of the two sides of the positioning frame (30), and provides a screw, a 糸 (7 2 ) of the disassembling tool 70 The disassembling tool (70) takes out the positioning frame (3〇) from the base (丄〇); the aforementioned disassembling tool (70) may include at least two long rod screws (72), or further includes a tool guide block (71) having a pair of position protrusions (7 1 1 ) at the bottom corresponding to the alignment groove (3 1 ) of the positioning frame (3 〇), and the tool guide block (7 1 ) is provided with a plurality of perforations (7 1 2 ) respectively corresponding to the screw holes (3 5 ) on the positioning frame (30), and the long rod screws (7 2 ) are respectively mounted on the perforations (7) 12), so, the operator can use the The tool guide block (7 1 ) of the disassembly tool (70) is placed on the positioning frame (30), and the alignment portion (1 4 ) is correspondingly inserted into the positioning slot (3 1 ), and the The perforations (1 3 ) respectively correspond to the screw holes (3 5 ) on the positioning frame (30), and after the M320675, the screws (7 2 ) are squeezing the A 4r / ^ ) screw to the position box. (3 Q ) in the screw hole (3 5 ), secondly, you can hold the zh ^ W ^ r ry and Wang Xiyi screw (7 2 ) to position the positioning frame (3 G) from the base (χ 〇) Pull out 'smoothly disassemble the positioning frame (3 0) to replace the positioning frame (3 〇), the conductive carrier (2 3) or the conductive film (2 〇). [Simple description]
一第圖係本創作測試連接器之一較佳實施之立體分解 示意圖。 第二圖係第一圖所示測試連接器較佳實施例之組合立 體外觀示意圖。 第二圖係第一圖所示測試連接器較佳實施例之組合剖 面不意圖。 第四圖係本創作測試連接器增設導電載板之另一較佳 實施例之組合剖面示意圖。 第五圖係第一圖所示測試連接器較佳實施例裝設於測 言式電柄 V* W ’提供待測積體電路元件置入測試之使用狀態 參考圖。 、第^圖係第四圖所示測試連接器較佳實施例裝設於測 武電路板上，植ω &供待測積體電路元件置入測試之使用狀態 參考圖。 弟七圖糸Μ 1示弟一圖所示測試連接器較佳實施例拆解其定 位框時之操作示意圖。 【主要元件符號說明】 (1 0 ) Α· ρ （1 1 )容置槽 11A diagram is a perspective exploded view of one preferred embodiment of the present test connector. The second figure is a schematic view of the combined physical appearance of the preferred embodiment of the test connector shown in the first figure. The second drawing is a schematic cross-sectional view of a preferred embodiment of the test connector shown in the first figure. The fourth figure is a schematic cross-sectional view of another preferred embodiment of the present application test connector with a conductive carrier. Fig. 5 is a view showing a preferred embodiment of the test connector shown in the first figure, which is mounted on the test type electric handle V* W ' to provide a use state of the integrated circuit component placement test to be tested. The preferred embodiment of the test connector shown in the fourth figure is mounted on the test circuit board, and the ω & for the measured circuit component to be tested for use in the test state reference diagram. Figure 7 shows the operation of the preferred embodiment of the test connector for disassembling its positioning frame. [Description of main component symbols] (1 0 ) Α· ρ (1 1 ) accommodating groove 11
M320675 (12)裝配槽 （ (1 4 )對位部 （ (2 0 )導電膠片 （ (2 2 )導線 （ (2 3 1 )板體 （ (3 0 )定位框 （ (3 2 )導斜面 （ (3 4 )彈性件 （ (4 0 )測試電路板 (50)積體電路元件 （ (6 0 )取置裝置 (7 0 )拆解工具 （ (7 1 1 )對位凸部 （ 1 3 )穿孔 1 5 )第一定位部 2 1 )彈性片體 2 3 )導電載板 2 3 2 )導電塊 31)定位槽 3 3 )第二定位部 3 5 )螺孔 5 1 )接腳 7 1 )工具導塊 7 2 )螺絲 12M320675 (12) mounting groove ((1 4 ) alignment part ( (2 0 ) conductive film ( (2 2 ) wire ( (2 3 1 ) plate body ( (3 0 ) positioning frame ( (3 2 ) guide bevel ( (3 4) Elastic member ((4 0) test circuit board (50) integrated circuit component ((6 0 ) pick-up device (7 0 ) disassembly tool ((7 1 1 ) aligning convex portion (1 3 ) Perforation 1 5) first positioning portion 2 1) elastic sheet 2 3) conductive carrier 2 3 2) conductive block 31) positioning groove 3 3) second positioning portion 3 5) screw hole 5 1 ) pin 7 1 ) Tool guide 7 2) Screw 12