TW201018935A - A pusher for match plate of test handler - Google Patents

A pusher for match plate of test handler Download PDF

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Publication number
TW201018935A
TW201018935A TW098137673A TW98137673A TW201018935A TW 201018935 A TW201018935 A TW 201018935A TW 098137673 A TW098137673 A TW 098137673A TW 98137673 A TW98137673 A TW 98137673A TW 201018935 A TW201018935 A TW 201018935A
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Taiwan
Prior art keywords
pusher
base
mentioned
groove
mounting groove
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TW098137673A
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Chinese (zh)
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TWI420119B (en
Inventor
Yun-Sung Na
Hyun-Jun Yoo
Jung-Woo Hwang
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Techwing Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

A pusher for match plate of test handler comprises a pusher base and a pusher protuberance in which an air passage hole is formed so that air for temperature control jetted from a duct can pass therethrough. The pusher protuberance is detachably connected with the pusher base so as to facilitate the replacement of the pusher protuberance.

Description

201018935 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及一種測試分選機的分型板用推料器,涉及形 成了空氣通孔使得從管道供給的溫度控制用空氣能夠通 過推料提供給半導體元件一侧的推料。 [0002] [先前技術] 測試分選機是用於測試經過規定的製造工序所製造出的 半導體元件,並根據分選結果將半導體元件分為不同等 級後裝載到顧客貨盤(customer tray)裏的設備,其 已公開在如韓國專利特許第1〇7〇553992號的多個公開文 檔中。 [0003] 一般來說,生產出的半導體元件,是以裝載在顧客貨盤 的狀態提供給測試分選機的。提供給測試分選機的半導 體元件,被位於載入位置的測試託盤載入,因此,在裝 載到測試託盤上的狀態下經過測試區(test site)移 - 動到卸料(unloading)位置後,從卸料位置卸載到顧 客貨盤裏。 [0004]· 在如上所述的測試分選機内,當半導體元件被移動過程 中測試託盤位於測試區上部時,由停靠的測試器來完成 對半導體元件的測試。此時需要用於將安裝在測試托盤 的插入件(insert)的半導體元件向測試器的測試座( test socket) —側施壓的按壓裝置(pushing device,) ° [0005] 在大部分的情況下,按壓裝置是由與測試分選機相配套 098137673 的分型板、和使該分型板向測試分選機方向進退的汽缸 表單編號A0101 第3頁/共28頁 0982064558-0 201018935 構成,但是根據韓國公開特許第ίο一2005-0055685號的 圖18中的參考技術(以下稱為“現有技術1 ),為了能 夠給每個裝載在測試託盤上的半導體元件供給溫度控制 用空氣,在分型板和汽缸之間進一步設置管道(duct )201018935 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a pusher for a parting plate for testing a sorting machine, which relates to forming an air through hole so that temperature control air supplied from a pipe can pass The pusher is supplied to the pusher on the side of the semiconductor element. [0002] [Prior Art] A test sorter is used to test a semiconductor component manufactured through a predetermined manufacturing process, and the semiconductor component is divided into different grades according to the sorting result, and then loaded into a customer tray. The device is disclosed in a plurality of published documents such as Korean Patent No. 1 〇 553 992. [0003] Generally, the produced semiconductor component is supplied to the test sorter in a state of being loaded on the customer's pallet. The semiconductor component supplied to the test sorter is loaded by the test tray at the loading position, and therefore, after being loaded onto the test tray, after passing through the test site to the unloading position , unloaded from the unloading position to the customer's pallet. [0004] In the test sorter as described above, when the test tray is placed on the upper portion of the test area while the semiconductor element is being moved, the test of the semiconductor element is completed by the docked tester. In this case, a pressing device for pressing the semiconductor component of the insert mounted on the test tray to the test socket of the tester is required. [0005] In most cases Next, the pressing device is composed of a parting plate matched with the test sorting machine 098137673, and a cylinder form number A0101, page 3/28 pages 0982064558-0 201018935, which advances and retreats the parting plate toward the test sorting machine. However, according to the reference technique in FIG. 18 of the Korean Patent Laid-Open No. 2005-0055685 (hereinafter referred to as "Prior Art 1"), in order to supply temperature control air to each semiconductor element mounted on the test tray, Further piping between the stencil and the cylinder

[0006]分型板是,由設置架以及在設置架上以矩陣形態排列的 多個推料器(pushers)組成,但是在與現有技術1所述 的情況下,如第一圖中所示,應該在推料器(100)上設 置從管道供給的溫度控制用空氣能夠從前後方向通過的 I氣通孔(101)。 · 推料器是寒在設置架上〖底^推料主體 )、和向羊:挲藏元件一側突件施壓的 推料突起構成。 ❹ [0008] 另一方面,在要被測試的半導體元件的大小變大或變小 的情況下,被推料器施壓的半導黴无掉麻施壓面積也應 該變大或變小,因此只能更換推料。但是為了從設置架 上更換全部的推料器,需要----拆養將推料器固定在設 置架而使用的如螺栓(bolt) —樣的固定部件,因此導 致伴隨更換作業的時間以及人力的浪費,也導致測試分 選機的工作效率下降的結果。 [0009] 由此’為了防止伴隨更換作業所帶來的工作效率的下降 ’更換分型板本身,但是在這種情況下將導致更換費用 以及資源的浪費。 [〇〇1〇]為了解決上述問題,根據韓國公開專利第 098137673 表單編號A0101 第4頁/共28頁 0982064558-0 ii201018935 [0011] ❹ [0012] [0013] ❹ [0014] 10-2007-0032323號中所提出的技術(以下稱為 技術2”)以及根據本中請人在切請的實用新塑登^第 20-2007-0001076號中所提出的技術(以下稱 技術3”)’能夠使推料突起(或者定義為“按廢件 妙,,)裝卸 能夠從推料底座(在現有技術3中定義為“主锻 地相連接。 在根據現有技術2和現有技術3的情況下,當被測試的半 導體元件的大小變得不同時,不使用其他工具就和夠义 成只更換推料突起的作業,因此不僅縮錐更換推料突起 所需的時間,而且能夠提高資源的重複利用妹率以及測 試分選機的工作效率。 但是現有技術2中存在如下問題 根據現有技術2的圏圖5、圖9、圖10、圈11 所示的例子有關的技術,是將推料突起從推料側面/月 而安裝的方式 I· 以及圖12 .. " ;W:.i t W..、' ^ 因此,如果考慮到多個推料置架上的這—^ ^ 1 1卜ce [0015] 098137673 由於進行更換作業時與相*鄰的突起的干棱’其 換性能將下降。並且’根據圖4、圖5、所米的例子有 關的技術,不能在推料器前後方向上形成空氣通孔’ β 此很難與如現有技術1 一樣通過管道向各個爭導艏元件提 供溫度控制用空氣的技術相結合。 另外,根據與現有技術3中的圏13所的例子、以及现有技 術3中的圖5所示的例子有關的技術,由於應用了從赉直 於推料底座的方向通過按壓插入推料突起的方式’因此 〇982〇6455ί 表單編號Α0101 第5頁/共28頁 201018935 更換性能好,但是存在如下問題:根據固定推料底座的 球塞(ball plunger) #插入深度,推料突起被插得太 緊從而導致更換性下降,或者推料突起夹得太鬆從而導 致被很小.的衝擊就脫落掉的危險問題。 [0016] [0017] [0018] [0019] 098137673 另外,在現有技術1至3中,由於推料底座只滿足用於安 裝推料突起的底座功能,因此存在推料底座所具有的功 能簡單、無法更有效地利用的問題。 【發明内容】 繁於此,本發明的目的在於,提供一種應用了從推料底 q 座的垂直方向㈣插人推料突起的方式,只要確保標準 化製作工序就能夠恰當地插(轉突,軾分選機的 分型板用推料器。 根據為了達到上述目的的本發明的賴分職的分型板 用推料器,包括:推料底座,在前後方向(前方向定義 為半導體件-側方向,後变蚊義妙▲ 一側方向) 上形成有安裝槽;推料突起„,從後方向插入上述安裝槽 來進行安裝㈣半”以域&,且在前後方向切 ❹ 成空氣通孔使得溫度控制用氣體從管道喷出後經過上述 推料底座的後讀料切絲槽侧從 而能夠提供給半 導體元件-侧;以及將上述推料突起可裝卸地固定到上 述安裝槽的固定部件。 另外,測試分職的分型板㈣料㈣雜在於,上述 推料底座,至少在-側形成容納槽,在上述安裝槽和容 納槽之間形成了至少-細切具有—定直㈣球孔, 在 突起的ίΓ頁形成有擋槽,上述固定部件包括 第 6 頁/共 28 頁 0982064558-0 201018935 .擋球、彈性部件和固定板,擋球在容納在上述容納槽 内的狀態下有一部分通過球孔向上述安裝槽内側可進退 地突出從而能夠插入到上述擋槽内,並具有比上述球孔 的直徑選大的直徑;彈性部件在容納在上述容納槽内的 狀態下向安裝槽方向弹性支撐上述擋球;固定板在上述 擋球和彈性部件設置在上述容納槽的狀態下封閉上述容 納槽’並通過固定部件固定到上述推料底座上。 [0020] ❹ 另外,測試分選機的分塑板用推料器的特徵在於,上述 容納槽全部都形成在上述推料底座的兩側,上述球孔全 部都形成在上述安裝稽和兩側的容納槽之間,在上述推 料底座的兩側的容納槽裏 部件’上述固定板成對地設置以封 容納槽。 球和彈性 的全部的[0006] The parting plate is composed of a set rack and a plurality of pushers arranged in a matrix form on the setting rack, but in the case described in the prior art 1, as shown in the first figure The I gas passage hole (101) through which the temperature control air supplied from the pipe can pass from the front and rear direction should be provided on the ejector (100). · The pusher is composed of a pusher protrusion that presses on the side of the sheep: the side of the hidden component. 0008 [0008] On the other hand, in the case where the size of the semiconductor element to be tested becomes larger or smaller, the area of the semi-guided mold which is pressed by the ejector should be larger or smaller. Therefore, only the pusher can be replaced. However, in order to replace all the pushers from the rack, it is necessary to disassemble the fixed components such as bolts that are used to fix the pusher to the rack, thus causing the time associated with the replacement work and The waste of manpower also results in a decline in the efficiency of the test sorter. [0009] Thus, in order to prevent a decrease in work efficiency accompanying the replacement work, the parting plate itself is replaced, but in this case, replacement costs and waste of resources are caused. [〇〇1〇] In order to solve the above problem, according to Korean Patent Publication No. 098137673, Form No. A0101, Page 4 of 28, 0982064558-0, ii201018935 [0011] [0013] [0014] 10-00-0032323 The technology proposed in the above (hereinafter referred to as the "Technology 2") and the technology proposed in the "Practical New Plastics" No. 20-2007-0001076 (hereinafter referred to as "Technology 3")" The loading and unloading of the pusher protrusions (or defined as "by the waste,") can be selected from the pusher base (defined in the prior art 3 as "main forged ground connection. In the case according to prior art 2 and prior art 3, When the size of the semiconductor element to be tested becomes different, the operation of replacing only the push protrusion is not used without using other tools, so that not only the time required for the shrink cone to replace the push protrusion but also the resource reuse can be improved. The ratio of the sister rate and the efficiency of the test sorter. However, the following problems exist in the prior art 2, according to the technique shown in the drawings of FIG. 5, FIG. 9, FIG. 10, and the circle 11 of the prior art 2, the push protrusions are Push side/month And the way of installation I· and Figure 12 .. ";W:.it W.., ' ^ Therefore, if you consider this on multiple pusher racks - ^ ^ 1 1 ce [0015] 098137673 due to When the replacement work is performed, the dry edge of the protrusion adjacent to the phase will decrease its performance. And according to the technique related to the example of Fig. 4, Fig. 5, the air through hole cannot be formed in the front and rear direction of the pusher. This is difficult to combine with the technique of providing temperature control air to each of the scrambled elements by means of a pipe as in the prior art 1. Further, according to the example of the crucible 13 of the prior art 3, and the prior art 3 The technique related to the example shown in Fig. 5 is applied by inserting the pusher protrusion from the direction perpendicular to the pusher base. Therefore, 〇982〇6455ί Form No. Α0101 Page 5 of 28 201018935 Good replacement performance However, there is the following problem: according to the ball plunger # insertion depth of the fixed pusher base, the pusher protrusion is inserted too tightly, resulting in a decrease in the replaceability, or the pusher protrusion is too loose to be small. The impact of the loss [0016] [0019] [0019] [0019] [0019] 098137673 In addition, in the prior art 1 to 3, since the pusher base only satisfies the function of the base for mounting the pusher protrusion, there is a pusher base having SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a method of inserting a protrusion from a vertical direction of a push base q seat, as long as standardization is ensured. The production process can be properly inserted (revolution, and the ejector for the parting plate of the 轼 sorter). According to the ejector for the parting plate of the present invention for achieving the above object, the pusher base is included in the front-rear direction (the front direction is defined as the semiconductor piece-side direction, and the rear side becomes a mosquito ▲ side direction) The mounting groove is formed on the upper surface; the pushing protrusion „ is inserted into the mounting groove from the rear direction to mount (four) half” in the field & and is cut in the front and rear direction into an air through hole so that the temperature control gas is ejected from the pipe. The semiconductor element-side can be supplied to the side of the rear-cutting slit of the pusher base so as to be detachably fixed to the mounting groove. In addition, the sub-division plate (four) material (four) of the test sub-division is that the above-mentioned push material base forms a receiving groove at least on the side, and at least a thin cut-shaped (four) ball hole is formed between the mounting groove and the receiving groove. A retaining groove is formed in the protruding page, and the fixing member includes a ball, an elastic member, and a fixing plate, and the ball is partially accommodated in the receiving groove. The ball hole is protruded toward the inside of the mounting groove so as to be inserted into the retaining groove, and has a diameter larger than a diameter of the ball hole; and the elastic member is oriented in the mounting groove in a state of being accommodated in the receiving groove. The retaining ball is elastically supported; the fixing plate closes the receiving groove ' in a state where the blocking ball and the elastic member are disposed in the receiving groove, and is fixed to the pushing base by a fixing member. [0020] Further, the ejector for the split-plastic plate of the test sorter is characterized in that all of the accommodating grooves are formed on both sides of the pusher base, and the ball holes are all formed on the both sides of the mounting Between the accommodating grooves, in the accommodating grooves on both sides of the above-mentioned pusher base, the above-mentioned fixing plates are provided in pairs to seal the accommodating grooves. Ball and elasticity of all

[0021] 參 [0022] 根據與本發明有_推料,即便是在從垂直於推料底座 的方向按壓插人推料突起”械卜'要,鮮化的製 作工序就能夠恰當地等推_華.八,推料底座中,因 此推料突起的更換性能得到>::高乂 另外通過形成在_突起的把持部容*地從安裝槽拆 除推料突起。 [0023] 另外,推料底座分成第—底座部件和第二底座部件且 在第一底座部件和笫- 〜底座部件之間設置有緩衝部件, 因而能夠緩解推料突釦& u * <和半導體元件接觸時施加到半導 體元件上的衝擊。 【實施方式】 098137673 表單編號A0101 第 I共28頁 0982064558-0 201018935 [0024] [0025] [0026] [0027] β面參照附圖更具體地說明本發明優選實施例。第二圖 =與本發明的第—實施例有關的推料器(辦_ )2〇〇的 解立體圖’第二圖是第二圖的推料器2〇〇的組裴立體圖 ’第四圖是沿著第三圖的卜ί線剖開後從卜方向看到的截 面圖’第五圖是沿著第三圖仙^丨線剖開後從Α -方向看 到的戴面圖》 如參照第二圖至第五圖中所示,按照本實施例的推料器 2〇〇包括推料底座21〇、兩個推料突起22〇、以及固定部 件270 ’固定部件270還包括八個擋球23〇、八個盤簧( ccnl spring) 240、兩個固定架250以及四個螺拴260 〇 遽 譬 推料底座射〇中在前後方向A形成了安裝槽211 ’在實施 例中舉出在一個推料底座21〇上形成兩個安裝槽211的例 子。但是’如第六圖中所示第2實施例相同,完全有可能 在一個推料底座210A上只乘.成。個安装槽。在此’前方 向定義為半導體元件一側方向―,後方向定義為管道一側 方向。 .f ...... I § i …丨: 另外,在推料底座的210的兩側中,容納擋球23〇以及盤 簧240的容納槽212在每個安裝槽211的兩側各形成有兩 個,安裝槽211和容納槽212之間形成了標準化的具有一 定直徑的球孔(ball hole) 213。而且’安裝槽211的 中心附近的後側形成了空氣通孔214 ’參照第五圖。 推料突起220以插入到安裝槽211内使得向半導體元件一 側突出的狀態安裝在推料底座210上。在這種推料突起 098137673 表單編號A0101 第8頁/共28頁 0982064558-0 [0028] 201018935 220上形成空氣通孔221和擋槽222。 [0029] 空氣通孔221在推料突起220已插入到安裝槽211上時, 如第五圖所示,與空氣通孔214相連通’起到如下作用: 溫度控制用空氣從管道(未圖示)喷出後通過推料底座 210後端的空氣通孔214輸送到安裝槽211 —侧從而能夠 供給給半導想元件一侧。 [0030] ❹ [0031] 擋槽222形成在推料突起220後端附近,其起到如下作用 :插入有擋球230的一部分,能夠維持推料突起220插入 到安裝槽211中的狀態。. .':今;..-参拳藥:..ϋ翁邊 擋球230為球形,被構成為十_ fe球孔‘21.3的直徑大的直 徑,使得容納在容納槽212¥砵態,,.下' 其一#分能夠通過 球孔213向安裝槽211-侧被盤簧240 .V.., 支撐使得能夠向安裝槽#11 一側彈性進退,向安裝槽211 一側突出的部分被插入到擋槽222,因此將防止推料突起 220的脫落 ❿ [0032] 盤簧240是在容納於容納[0021] According to the invention, there is a push material, and even if the pusher protrusion is pressed from the direction perpendicular to the push base, the fresh manufacturing process can be appropriately pushed. _Hua. Eight, in the pusher base, the replacement performance of the pusher protrusion is obtained >:: The sorghum is additionally removed from the mounting groove by the grip portion formed in the _protrusion. [0023] In addition, push The material base is divided into a first base member and a second base member, and a buffer member is disposed between the first base member and the base member, thereby being capable of alleviating the pushing protrusion & u * < application when contacting the semiconductor element Impact on the semiconductor element. [Embodiment] 098137673 Form No. A0101, I, 28, 0982064558-0, 201018935 [0024] [0027] [0027] [0027] The preferred embodiment of the present invention will be described more specifically with reference to the accompanying drawings. Fig. 2 is a perspective view of the ejector (2) of the ejector of the second embodiment of the present invention. The picture is taken along the line of the second figure The cross-sectional view seen in the fifth figure is a worn-out view seen from the Α-direction after being cut along the line of the third figure. As shown in the second to fifth figures, according to the present embodiment The pusher 2 includes a pusher base 21〇, two pusher projections 22〇, and a fixing member 270. The fixing member 270 further includes eight blocking balls 23〇, eight coil springs 240, two The mounting bracket 250 and the four bolts 260 〇遽譬 pushing the base projections form a mounting groove 211 in the front-rear direction A. In the embodiment, two mounting slots 211 are formed on one pushing base 21〇. For example, as in the second embodiment shown in the sixth figure, it is entirely possible to multiply only one mounting groove on a pusher base 210A. Here, the 'front direction is defined as the direction of the semiconductor element side ―, The rear direction is defined as the direction of one side of the pipe. .f ...... I § i ... 丨: In addition, in both sides of the pusher base 210, the receiving groove 212 that accommodates the blocking ball 23 and the coil spring 240 is Two sides are formed on each side of each mounting groove 211, and a standardized tool is formed between the mounting groove 211 and the receiving groove 212. A ball hole 213 having a certain diameter. And a rear side near the center of the mounting groove 211 is formed with an air through hole 214'. Referring to the fifth drawing, the pusher protrusion 220 is inserted into the mounting groove 211 so as to be a semiconductor element. The side protruding state is mounted on the pusher base 210. The air through hole 221 and the retaining groove 222 are formed in the pusher projection 098137673, Form No. A0101, Page 8/28, 0982064558-0 [0028] 201018935 220. [0029] When the pusher protrusion 220 is inserted into the mounting groove 211, as shown in FIG. 5, the air through hole 221 functions as follows: Temperature control air is used from the pipe (not shown) After being ejected, it is transported to the side of the mounting groove 211 through the air through hole 214 at the rear end of the pusher base 210 so as to be supplied to the side of the semiconductor element. [0030] The retaining groove 222 is formed in the vicinity of the rear end of the pusher projection 220, and functions to insert a portion of the blocking ball 230 to maintain the state in which the pusher projection 220 is inserted into the mounting groove 211. ..:: Today;.. - 拳 药 : : : : : : : : : : 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 230 The lower part of the lower portion can be elastically advanced and retracted toward the mounting groove #11 side by the ball hole 213 toward the mounting groove 211 side, and the portion protruding toward the mounting groove 211 side. It is inserted into the retaining groove 222, so that the falling of the pusher projection 220 will be prevented. [0032] The coil spring 240 is accommodated in the housing.

InfelieduProperty 的狀態 下向安裝槽211 一側彈性支撐擋球230,因此由使擋球230彈性進退的彈 性部件所構成。 [0033] 固定板250在把擋球230和盤簧240設置在容納槽212内的 狀態下封閉容納槽212,因此將防止擋球230及盤簧240 從容納槽212中脫離。 螺栓260由用於將把固定板250固定在推料底座210而準 備的固定部件所構成,為此,在固定板250以及推料底座 210上分別形成螺栓孔251和螺栓槽215。 098137673 表單編號Α0101 第9頁/共28頁 0982064558-0 [0034] 201018935 [0035] 根據上述的推料器2G{),由於採用了在垂直於推料底座 210的前後方向上按壓或者拔出推料突起22〇的方式,因 此在推料底座21G設置於分型板的設置板(相示)上的 狀態下,更換推料突起22G時不受到相鄰的推料突起的干 擾,只要確保球孔213的標準直徑以及盤簧24〇的標準彈 性係數,就能夠使推料突起22〇的插入程度恰當,從而更 換推料突起220變得方便。 [0036] 另外 [0037] 宙於在安裝槽211的兩側對稱地排列了推料突起 220的阻擋結構,因此當分型板被垂直豎立時能夠防止 推料突起22。往向下方向的严斜,因此推料突起22〇的前 面能夠恰當地與半導體元 第七圖是與本發明的第三實·料器700的分解 立體圖,第八圖是第七圖的推料器700的組裝立體圖,第 九圖是沿著第八圖的!—〗線剖開後從Α_方向看到的截面圖 β ❹ [0038] 參照第七圏至第九圖進行說^:,:_器包括推料底座 710、推料突起720、以及Wg妹件730。推料底座71〇具 備第底座部件711、第二底座部件712、以及緩衝部件 713。 ❹ [0039] 第一底座部件711在前後方向上形成有安裝槽7Ua。在此 ,前方向定義為半導體元件一側方向,後方向定義為管 道一側方向。 在第一底座部件711的上面及下面形成有容納固定部件 730的容納槽711b,安裝槽711a和容納槽7nb之間形成 098137673 表單編號A0101 第10頁/共28頁 0982064558-0 [0040] 201018935 [0041] ❹ [0042] [0043] ❹ [0044] —個標準化的有一定直徑的球孔7Uc。而在安裝槽7Ua 中心附近的後側形成有溫度控制用空氣通過的空氣通孔 7l Id 〇 5 第一底座部件712具有插入第一底座部件7丨1的後面而安 裝的安裝槽712a,並通過結合部件74〇與第一底座部件 711相連接。在此,結合部件包括支撐第一底座部件 711的前面的支撐部741、和從支撐部741延伸並穿過第 -底座部件711形成的貫通孔711f固定到第二基座部件 712上的固定部742。而且,在第二底座部件712的中心 附近形成了溫度控制用空氣通過的空氣通過口7121)。 緩衝部件713是由具有規定# ~底座部件711的後面和第 之間並設置成能夠包住固定部74 2 推料突起720在後端插入到安裝槽7Ua裏使得向半導體元 件一侧突出的狀態下安裝。在這種 推料突起720上形成有空氣%^__¥槽722 & 空氣通孔721在推料突起720插入到安裝槽711a上時與空 氣通孔712b相連通,起到如下作用:溫度控制用空氣在 從管道(未圓示)喷出後通過空氣通過口 712b和空氣通 孔71 Id輸送到安裝槽71 la —側從而能夠供給到半導體元 件一側。 擋槽722形成在推料突起72〇的後端附近,插入固定部件 730之後,起到能夠維持推料突起72〇插入到安裝槽η。 狀態的作用。 冰成,其位於第 #安裝槽712a 098137673 表單編號A0101 第丨1頁/共28頁 0982064558-0 [0045] 201018935 [0046] 另夕K . θ 推料突起720還具有把持部723,這種把持部723 疋以從推料突起720的前端兩側面向外侧延伸的突起方式 摄Λ 通過這種把持部723在將推料突起720從安裝槽 7lla中拆卸時能夠容易地把持住推料突起72〇,利用其他 夹具(hg)等時’能夠一次性從安裝槽7Ua同時拆卸多 個推料突起720。 另方面’同樣地’在第十圖中所示的第四實施例中, 把持部723A能夠以形成在突起72〇A兩側的槽形態構成。 固定部730包括擋球731、盤簧732、以及固定板733。 _擋球7 31為球增且具有比球〒!4祕祕晷冬的直徑,使得 在容納在容納槽Π lb内的狀\態卡:,其|二‘部分通過球孔 ή ic能夠向安裝槽ή ia—這,竊聲球73丨通過盤 簧732支撐使得能夠向安裝槽7iia彈性地進退,向安裝槽 711a—側突出的一部分被插入到擋槽722内,從而將防止 推料突起720的脫落。:J ^〜 [0049]盤簧732在容納在容納槽η ib内岛鉍態τ提供彈性勢能以 將擋球731推向安裝槽養此由使擋球731能夠 彈性進退的彈性部件所構成。 [0050] 固定板733在將擋球731和盤簧732安裝在容納槽71 lb的 狀態下封閉容納槽711b,因此將防止擋球731和盤簧732 從容納槽711b的脫落。 [〇〇51] 螺栓734是由用於將固定板733固定在推料底座711而準 備的固定部件所構成,為此在固定板733和第一底座部件 711上分別形成了螺栓孔733a和螺栓槽71 lg。 098137673 表單編號 A0101 第 12 頁/共 28 頁 0982064558-0 201018935 _] _如上所述的推料器·,由於採取在垂直於推料底座 710的前後方向上通過按壓插入或拔出推料突起72〇的方 式,因此在推料底座710設置在分型板的設 )上的狀態下,更換祕突起72㈣*會對相鄰的推料突 起產生干擾,只要確保球孔711c的標準直經以及盤菁732 的標準彈性係數,就能夠使推料突起72〇的插入程度變得 恰當,從而更換推料突起720變得方便。 []另外通過形成在推料突起720上的把持部732,能夠容 © 易從安裝槽711a中拆卸推料突起72〇。 剛另外,推料底座m分為第二底座部 件712,且在第一底座部件7|無件712之間 設置有緩衝部件713,從而和半導體 元件相接觸時施加到半導體元件上的衝擊。 ^Wil&saX: [0055] 如上所述,在本發明的詳細說明中對具體的實施例進行 了說明,但是應該明確的;笨l^ly^員能夠容易 〇 地對本發明的技術進行變^變型實施例也包 含在本發明的專利請求範野技術思想中。 【圖式簡單說明】 [0056] 第一圖是與現有技術有關的推料的例子的截面圖。 [0057] 第二圖是與本發明第一實施例有關的推料的分解立體立 體圖》 [0058] [0059] 098137673 第三圖是第二圖的推料的組裝立體圖。 第四圖是沿著第三圖的I -1線剖開後從Α_方向看到的截面 圖。 表單編號Α0101 第13頁/共28頁 0982064558-0 201018935 [0060]第五圖县、VI· ^ — m 面圖。 圖的1卜11線剖開後從A、方向看到的戴 [0061]第六圖是 圖。 與本發明的第二實施例有關的推料的 分解立體 的分解立體 _]帛七圖是與本發明的第三實施例有關的推料 圖。 [0063] [0064] 第八圖疋第七圖的推料的組裝立體圖。 第九圖是沿著第八圖的卜丨線刻開後 圖。 Λ''方向看到的戴 圖 第十圖是與本發明的第 圖。 【主要元件符號說明】 [0066] < 習知 > [0067] 推料器1〇〇 [〇〇68]空氣通孔1〇1 [0069] <本發明 面 [0065] 四 fJi rUi [0070] 推料器200In the state of the InfelieduProperty, the ball 230 is elastically supported on the side of the mounting groove 211, and thus is constituted by an elastic member that elastically advances and retracts the ball 230. The fixing plate 250 closes the accommodating groove 212 in a state where the blocking ball 230 and the coil spring 240 are disposed in the accommodating groove 212, thereby preventing the blocking ball 230 and the coil spring 240 from being detached from the accommodating groove 212. The bolt 260 is constituted by a fixing member for fixing the fixing plate 250 to the pusher base 210. For this purpose, bolt holes 251 and bolt grooves 215 are formed in the fixing plate 250 and the push base 210, respectively. 098137673 Form No. 101 0101 Page 9 / Total 28 Page 0992064558-0 [0034] According to the above-described ejector 2G{), since the pressing is performed in the front-rear direction perpendicular to the pushing base 210 or pulled out In the state in which the projections 22 are provided on the setting plate (phase shown) of the parting plate, the replacement of the pushing projections 22G is not disturbed by the adjacent pushing projections, as long as the balls are secured. The standard diameter of the hole 213 and the standard elastic modulus of the coil spring 24 能够 enable the insertion degree of the push protrusion 22 恰当 to be appropriate, so that it is convenient to replace the push protrusion 220. [0037] In addition, the blocking structure of the push protrusions 220 is symmetrically arranged on both sides of the mounting groove 211, so that the push protrusions 22 can be prevented when the parting sheets are vertically erected. The direction of the downward direction is strictly inclined, so that the front surface of the pusher protrusion 22〇 can be properly combined with the seventh figure of the semiconductor element and the exploded perspective view of the third solid material 700 of the present invention, and the eighth figure is the push of the seventh figure. The assembled perspective view of the hopper 700, the ninth figure is along the eighth figure! —The cross-sectional view β ❹ seen from the Α_ direction after the line is cut [0038] Referring to the seventh to ninth drawings, the :::_ includes the pusher base 710, the pusher protrusion 720, and the Wg sister. Piece 730. The pusher base 71 has a base member 711, a second base member 712, and a cushioning member 713. [0039] The first base member 711 is formed with a mounting groove 7Ua in the front-rear direction. Here, the front direction is defined as the side direction of the semiconductor element, and the back direction is defined as the direction of the tube side. A receiving groove 711b for accommodating the fixing member 730 is formed on the upper surface and the lower surface of the first base member 711, and a 098137673 is formed between the mounting groove 711a and the receiving groove 7nb. Form No. A0101 Page 10/28 pages 0982064558-0 [0040] 201018935 [ 0041] ❹ [0044] A standardized ball hole 7Uc having a certain diameter. On the rear side near the center of the mounting groove 7Ua, an air through hole 7l Id is formed through which the temperature control air passes. The first base member 712 has a mounting groove 712a inserted into the rear of the first base member 7丨1, and passes through The coupling member 74 is coupled to the first base member 711. Here, the coupling member includes a support portion 741 that supports the front surface of the first base member 711, and a fixing portion that is fixed from the support portion 741 and penetrates through the through hole 711f formed by the first base member 711 to the second base member 712. 742. Further, an air passage port 7121 through which the temperature control air passes is formed in the vicinity of the center of the second base member 712. The cushioning member 713 has a state in which the back surface and the first portion of the base member 711 are provided so as to be able to wrap around the fixing portion 74 2 . The pusher projection 720 is inserted into the mounting groove 7Ua at the rear end so as to protrude toward the side of the semiconductor element. Installed below. The air protrusion hole 720 is formed on the pusher protrusion 720. The air through hole 721 communicates with the air through hole 712b when the pusher protrusion 720 is inserted into the mounting groove 711a, and functions as follows: temperature control After being ejected from the duct (not shown), the air is supplied to the mounting groove 71 la side through the air passage opening 712b and the air through hole 71 Id so as to be supplied to the side of the semiconductor element. The retaining groove 722 is formed in the vicinity of the rear end of the pusher projection 72A, and after the fixing member 730 is inserted, it is possible to maintain the pusher projection 72〇 inserted into the mounting groove η. The role of the state. Ice forming, which is located at the ## mounting groove 712a 098137673 Form No. A0101 Page 1 / 28 pages 0992064558-0 [0045] 201018935 [0046] The K. θ push protrusion 720 also has a grip portion 723, this holding The portion 723 Λ is photographed by a projection extending outward from both sides of the front end of the pusher projection 720. The grip portion 723 can easily hold the push projection 72 when the push projection 720 is detached from the mounting groove 7ll. When a different jig (hg) or the like is used, it is possible to simultaneously detach a plurality of push protrusions 720 from the mounting groove 7Ua at one time. On the other hand, in the fourth embodiment shown in the tenth diagram, the grip portion 723A can be configured in a groove shape formed on both sides of the projection 72A. The fixing portion 730 includes a blocking ball 731, a coil spring 732, and a fixing plate 733. The blocking ball 7 31 is a ball-increasing ball and has a diameter larger than that of the ball 〒! 4, so that the card is accommodated in the receiving slot lb: the |2' portion can pass through the ball hole ic ic The mounting groove ia - this, the tampering ball 73 支撑 is supported by the coil spring 732 so as to be elastically retractable toward the mounting groove 7iia, and a portion protruding toward the side of the mounting groove 711a is inserted into the retaining groove 722, thereby preventing the pushing protrusion 720 shedding. : J ^ [0049] The coil spring 732 provides an elastic potential energy in the island τ accommodated in the accommodating groove η ib to push the blocking ball 731 toward the mounting groove, which is constituted by an elastic member which enables the ball 731 to elastically advance and retreat. The fixing plate 733 closes the accommodating groove 711b in a state where the blocking ball 731 and the coil spring 732 are mounted in the accommodating groove 71 lb, and thus the ball 731 and the coil spring 732 are prevented from coming off from the accommodating groove 711b. [螺栓51] The bolt 734 is constituted by a fixing member prepared for fixing the fixing plate 733 to the push base 711, and for this purpose, bolt holes 733a and bolts are respectively formed on the fixed plate 733 and the first base member 711. Slot 71 lg. 098137673 Form No. A0101 Page 12 of 28 0982064558-0 201018935 _] _ The ejector as described above, since the pusher projection 72 is inserted or pulled out by pressing in the front-rear direction perpendicular to the pusher base 710 In the state of the crucible, therefore, in the state in which the pusher base 710 is disposed on the partitioning plate, the replacement of the protuberances 72(4)* may interfere with the adjacent pusher projections, as long as the standard straightness of the spherical hole 711c and the disc are ensured. The standard elastic modulus of the cyanine 732 can make the insertion degree of the pusher projection 72〇 appropriate, and it becomes convenient to replace the pusher projection 720. Further, by the grip portion 732 formed on the pusher projection 720, it is possible to easily detach the push projection 72 from the mounting groove 711a. In addition, the pusher base m is divided into the second base member 712, and a cushioning member 713 is provided between the first base member 7|without the member 712 so as to be applied to the semiconductor element when it comes into contact with the semiconductor element. ^Wil&saX: [0055] As described above, specific embodiments have been described in the detailed description of the present invention, but it should be clear that the skilled person can easily change the technique of the present invention. A variant embodiment is also included in the technical idea of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0056] The first figure is a cross-sectional view of an example of a pusher related to the prior art. The second drawing is an exploded perspective view of the pusher according to the first embodiment of the present invention. [0058] 098137673 The third drawing is an assembled perspective view of the pusher of the second figure. The fourth figure is a cross-sectional view taken from the Α_ direction after being cut along the line I -1 of the third figure. Form No. Α0101 Page 13 of 28 0982064558-0 201018935 [0060] The fifth picture shows the county, VI·^ — m surface. Figure 6 is a view taken from the direction A and the direction of the figure. The exploded three-dimensional exploded view of the pusher relating to the second embodiment of the present invention is a pusher drawing relating to the third embodiment of the present invention. [0064] An assembled perspective view of the pusher of the eighth figure and the seventh figure. The ninth figure is an engraved rear view along the divination line of the eighth figure. The tenth view of the figure seen in the '' direction is the first figure of the present invention. [Explanation of main component symbols] [0066] <Practical> [0067] Pusher 1〇〇[〇〇68] Air through hole 1〇1 [0069] <The present invention [0065] Four fJi rUi [ 0070] Pusher 200

[0071] 推料底座2i〇、21〇A[0071] Pushing base 2i〇, 21〇A

[0072] 安裝槽211 [0073] 容納槽21 2 [0074]球孔213 098137673 表單編號A0101 第14頁/共28頁 0982064558-0 201018935 [0075] 空氣通孔214 [0076] 推料突起220 [0077] 空氣通孔221 [0078] 擋槽222 [0079] 固定部件270 [0080] 擋球230 [0081] ❹ [0082] 盤簧240 固定架250 [0083] 螺栓260 [0084] 推料器700 '[0085] 推料底座710 [0086] 第一底座部件711 [0087] 安裝槽711a :: [0088] 容納槽711b ^ [0089] 球孔711c [0090] 空氣通孔711d [0091] 貫通孔711f [0092] 螺栓槽711g [0093] 第二底座部件712 098137673 表單編號A0101 第15頁/共28頁 0982064558-0 201018935 [0094] 安裝槽71 2 a [0095] 空氣通過口 712b [0096] 緩衝部件71 3 [0097] 推料突起720[0072] mounting groove 211 [0073] receiving groove 21 2 [0074] ball hole 213 098137673 Form No. A0101 Page 14 / 28 page 0992064558-0 201018935 [0075] Air through hole 214 [0076] Pushing protrusion 220 [0077] Air through hole 221 [0078] stop 222 [0079] fixing member 270 [0080] blocking ball 230 [0081] coil spring 240 fixing bracket 250 [0083] bolt 260 [0084] ejector 700 '[ 0085] Pusher base 710 [0086] First base member 711 [0087] Mounting groove 711a :: [0088] receiving groove 711b ^ [0089] Ball hole 711c [0090] Air through hole 711d [0091] Through hole 711f [0092 Bolt groove 711g [0093] Second base member 712 098137673 Form No. A0101 Page 15 / Total 28 page 0992064558-0 201018935 [0094] Mounting groove 71 2 a [0095] Air passage port 712b [0096] Buffer member 71 3 [ 0097] pusher protrusion 720

[0098] 突起 720A[0098] protrusion 720A

[0099] 空氣通孔721 [0100] 擋槽 722Air through hole 721 [0100] stop groove 722

[0101] 把持部723[0101] grip portion 723

[0102] 把持部 72 3 A[0102] grip portion 72 3 A

[0103] 固定部件730 [0104] 擋球7 31 [0105] 盤簧 732 [0106] 固定板733 [0107] 螺栓孔73 3a [0108] 螺栓734 [0109] 結合部件740 [0110] 支撐部741 [0111] 固定部74 2 0982064558-0 098137673 表單編號A0101 第16頁/共28頁[0103] fixing member 730 [0104] blocking ball 7 31 [0105] coil spring 732 [0106] fixing plate 733 [0107] bolt hole 73 3a [0108] bolt 734 [0109] coupling member 740 [0110] support portion 741 [ 0111] Fixing part 74 2 0982064558-0 098137673 Form number A0101 Page 16 of 28

Claims (1)

201018935 七、申請專利範圍: 1· 一種洌試分選機的分型板用推料器,勺括. 推料底座,在前、後方向上形成有安敦槽· ❹ ’從後方向插人上述安裝槽㈣行钱以向半導 ^件侧突出’且在前、後方向上形成空氣通孔使得溫度 制二氣體從管道噴出後經過上述推料底座的後端輸送到 述女裝槽側從而能夠提供給半導體元件一側,以及 固定部件’將上述推料突起以可震卸地固定到上述安聚槽 A:中’前方向定義為半導趙元件-側方向,後方向定義 為管道一側方向《 2 ·如請切丨所述_試分讀其中, 亡:推料底座’至少在—側,容斯毛“述安裝槽和 艾槽之間減了至少—個以上的具有货直徑的球孔, 在上迷推料突起的後端形成有擒槽,上述固定部件包括 =’其在容納於上述容納产 一部分通過球 孔向上述安裝槽.内倒可:雖^釋|藝|^插 槽内,並具有比上述球孔; 彈性部件,其在容納於上的狀態下向安裝槽方 向彈性支撐上述擋球;以及 =’在上述擋球和彈性部件設置到上述容納槽的狀態 下封閉上述容納槽,並通過固定部件固定到上述推料底座 上。 3.如請求項2所述的測試分選機的分型板用推料器其令, 上述合納槽全部都形成在上述推料底座的兩側,上述球孔 全β都形成在上述安裝槽和兩側的容納槽之間,在上述推 098137673 表單編號Α0Ι01 第17頁/共28頁 0982064558-0 201018935 上述推料底座兩側的全 科::兩側的容納槽中分別設置有上述的擋球和彈性部件 逮固定板,成野地設置以封閉 部容納槽。 如請求項1或2所述的測試分選機的 徵在於,在上述_衫關面形成㈣ ,其特 安裝槽拆卸推料突起時能夠把持推料突起。/在從上述 上被:Γ分選機的分型板用推料器’其中, ^ 一成為位於推料突起兩側的槽 其中 如凊求項1或2所述的職分 態 〇201018935 VII. Patent application scope: 1. A type of squeegee for the sizing machine of the sputum tester, including the shovel. Pushing the base, forming an Anton groove in the front and rear directions ❹ 'Insert the above installation from the rear direction The groove (4) is carried out to protrude toward the side of the semi-conductive member and forms an air through hole in the front and rear directions so that the temperature of the second gas is ejected from the pipe and then conveyed to the side of the trough through the rear end of the pusher base to provide The side of the semiconductor element and the fixing member 'removably fix the above-mentioned push protrusion to the above-mentioned aggregating tank A: the front direction is defined as a semi-guide element-side direction, and the rear direction is defined as a pipe side direction. "2 · If you want to cut the _ test, read it, death: push the base 'at least on the side, Rongsi Mao" said at least one or more balls with the diameter of the cargo between the installation slot and the Ai slot a hole, a groove is formed at a rear end of the protrusion of the pusher, and the fixing member includes: 'It is accommodated in the above-mentioned housing part through the ball hole to the above-mentioned mounting groove. Inside the slot and have a ball hole than the above; a member that elastically supports the blocking ball in a direction of the mounting groove in a state of being accommodated; and = 'closes the receiving groove in a state where the blocking ball and the elastic member are provided to the receiving groove, and is fixed to the above by a fixing member 3. Pushing the base of the material. 3. The parting plate of the test sorting machine according to claim 2 is squeezing the hopper, and the above-mentioned mixing tanks are all formed on both sides of the pushing base, and the spherical hole is completely β. Both are formed between the above-mentioned mounting groove and the accommodating grooves on both sides, in the above-mentioned push 098137673 Form No. Ι0Ι01 Page 17/28 pages 0982064558-0 201018935 The general sides of the above-mentioned pusher base:: the receiving grooves on both sides The above-mentioned blocking ball and elastic member catching fixing plate are respectively provided, and are set in the wild to cover the receiving groove. The test sorting machine according to claim 1 or 2 is characterized in that (4) is formed on the above-mentioned _ shirt closing surface, The special mounting groove can hold the pusher protrusion when the pusher protrusion is removed. / In the above-mentioned top: the ejector for the parting plate of the Γ sorter, where ^ becomes a groove on both sides of the pusher protrusion, such as 凊Item 1 or 2 stated job status 〇 ,上述推料底座包括:„ 型板用推料器· 第一底座部件,在其前面安 第二底座部件,與上述第 缓衝邱杜外甚+ 一〜,工^丨卞的衝货相連接;以及 緩衝epm在上述第-底座部件和第二底: 以能夠緩衝施加在上述第—底座部件上的衝擊顿之間 :請求項6所述的測試分—輸‘器,其中 在上述第二底座部件上形成官㈣上 .、中’ 裝槽’且上魏衝部件設置在ϊ述^槽卜座部件㈣ 〇 098137673 表單編號Α0101 第18頁/共28頁 0982064558-0The above-mentioned pusher base includes: „ a plate pusher·a first base member, and a second base member on the front side thereof, and the above-mentioned first cushioning Qiu Duwai + a ~, the work of the 冲 相Connecting; and buffering the epm between the first base member and the second base: to enable buffering between the impacts applied to the first base member: the test split-transfer device described in claim 6, wherein The two base parts form the official (four) upper, middle 'slotted' and the upper Wei punching parts are set in the description of the ^ slotted seat parts (four) 〇 098137673 Form No. 101 0101 Page 18 / 28 pages 0992064558-0
TW098137673A 2008-11-07 2009-11-06 A pusher for match plate of test handler TWI420119B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559006B (en) * 2013-02-07 2016-11-21 泰克元股份有限公司 Pushing apparatus for test handler

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104338682B (en) * 2013-07-26 2017-04-12 泰克元有限公司 A push component assembly for a matching plate of a testing and sorting machine
KR101532391B1 (en) * 2014-04-10 2015-06-30 주식회사 아이에스시 Pusher apparatus
KR102012745B1 (en) * 2018-08-17 2019-08-21 (주) 나노에이스 Head replacement and displacement type pushing unit

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0690258B2 (en) * 1987-11-26 1994-11-14 山一電機工業株式会社 Socket for electrical parts
JPH06174788A (en) * 1992-12-09 1994-06-24 Mitsubishi Electric Corp Ic containing pallet
TW533316B (en) * 1998-12-08 2003-05-21 Advantest Corp Testing device for electronic device
CN2482099Y (en) * 2001-04-09 2002-03-13 矽统科技股份有限公司 Measuring head of integrated circuit test sorter
CN2519906Y (en) * 2001-11-27 2002-11-06 蔡忠谚 Automation device for LED test platform
JP2003218184A (en) * 2002-01-18 2003-07-31 Yokogawa Electric Corp Device carrying method and device handler
US6861861B2 (en) * 2002-07-24 2005-03-01 Lg Electronics Inc. Device for compensating for a test temperature deviation in a semiconductor device handler
WO2004011952A1 (en) * 2002-07-30 2004-02-05 Advantest Corporation Electronic device test system
KR100505073B1 (en) * 2002-12-31 2005-08-03 미래산업 주식회사 Apparatus for Heat Deviation in Handler for Testing Module IC
WO2006006220A1 (en) * 2004-07-09 2006-01-19 Advantest Corporation Pusher and electronic component handling apparatus
KR100613168B1 (en) * 2004-10-01 2006-08-17 삼성전자주식회사 Insert block for testing semiconductor device
KR100865132B1 (en) * 2007-01-11 2008-10-24 가부시키가이샤 아드반테스트 Pusher and electronic component handling apparatus
KR20080002841U (en) * 2007-01-22 2008-07-25 (주)테크윙 Pusher block for match plate of test handler
KR100869364B1 (en) * 2007-03-21 2008-11-19 (주)테크윙 Pusher for match plate of test handler
US8496113B2 (en) * 2007-04-13 2013-07-30 Techwing Co., Ltd. Insert for carrier board of test handler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559006B (en) * 2013-02-07 2016-11-21 泰克元股份有限公司 Pushing apparatus for test handler

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KR200453190Y1 (en) 2011-04-11

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