201016568 六、發明說明： 【發明所屬之技術領域】 本發明疋有關於一種晶片定位蓋裝置，特別是指一種 晶片承載盤之晶片定位蓋裝置。 【先前技術】 參閱圖1，習知用於半導體晶片製程中用於搭載晶片之 半成品的承載盤1，一般來說皆具有一板體u，以及複數自201016568 VI. Description of the Invention: [Technical Field] The present invention relates to a wafer positioning cover device, and more particularly to a wafer positioning cover device for a wafer carrier. [Prior Art] Referring to FIG. 1, a carrier disk 1 for use in a semi-finished product for mounting a wafer in a semiconductor wafer process generally has a plate body u and a plurality of
該板體11表面凹陷，以供複數晶片100或是承載有多數小 型晶片100之載板放置的承載槽12。 由於半導體晶片100在進行出貨檢驗時，其表面所依 附之塵粒數量是必需㈣在—定的數量下才為良品，因此 ，在半導體晶片100之封裝製程中，即有一道對封裝後之 晶片100進行水洗之程序，以將依附於該晶片1〇〇上之灰 塵洗淨，而此程序是必需利用該晶片100承載盤i作為晶 片100的_ ’以同時對多數個晶M i⑽進行表面灰塵洗 淨。 雖然該承載盤1之承載槽 η y 逋霄會具有對晶片100 形成夾置使其不易掉落的定位結構，但是，為了顧及晶片 ⑽於該承載槽脫離或置人的方便性，上述之定位:構 所提供之夾固力量並不會很強，因此，在水洗的過程中。， 很容易因外界水液所施於該晶片刚上的力量而導致其脫 離’進而造成晶片1G0料於水洗過程巾賴其相對應之 承載槽12的現象’而此類情況的發生時即必需停止水先 製程，並靠生產線作業人員將掉落之晶片⑽重新放置於 3 201016568 該承載盤1上’除了會影響製程之順暢度外，作業人員在 重新將掉落之晶片100放回該晶片1〇〇承載盤1時，也可 能會產生將晶片100錯誤地放入不是與其相對應的承載槽 12内’進而產生後續存貨管理上的缺失。 【發明内容】 因此，本發明之目的’即在提供一種可以配合晶片承 載盤在水洗製程中固定承載於該晶片承載盤上之晶片的定 位蓋裝置。 於疋’本發明晶片承載盤之晶片定位蓋裝置，是設置 於一承載有複數晶片的晶片承載盤上，以配合該晶片承載 盤進行清洗作業，該定位蓋裝置包含：一底框、一圍繞壁 、一紗網，及複數卡扣件。 該底框具有一呈環形之本體部，以及複數相間隔地自 該本體部外側面向内延伸的第一凹槽部。 該圍繞壁是設置於該本體部之下表面上，並於其外側 面上形成有複數相間隔的第二凹槽部，且該等第二凹槽部 是分別對應該等第一凹槽部並相配合第界定出複數容置空 間，該圍繞壁是與該底框之本體部相配合地蓋設於該晶片 承載盤載有晶片的表面上。 該紗網是夾設於該底框之本體部及該圍繞壁之間，並 與該晶片承載盤相配合地對承置於該晶片承載盤上的晶片 形成挾持。 該等卡扣件是分別可旋動且相間隔地設置於該底框之 本體部上，並位於其相冑應之該第一凹槽部及第二凹槽部 201016568 所相配合形成的該等容置空間中，每一卡扣件具有一軸設 於該本體部上並可繞自身轴線旋轉的轉轴部，以及一連接 於該轉軸部上的擋止部，該轉軸部是可搭載該擋止部在一 自由位置及一卡扣位置間移動’當該擋止部是在自由位置 時’是遠離該晶片承載盤之底側面，當該擋止部是在卡扣 位置時，是卡扣於該晶片承載盤之底侧緣，以將該底框之 本體部、該圍繞壁，以及該紗網固定於該晶片承載盤上。 本發明之功效在於，利用該底框之本體部及該圍繞壁 參 相配合形成的蓋型結構體，並搭載該紗網蓋設於該晶片承 載盤上’再藉由該等卡扣件的卡扣作用，以對位於該晶片 承載盤上的晶片形成壓制固定，進而在水洗製程中，使清 洗用之水液可經過該紗網而接觸到承栽於該晶片承載盤上 之晶片並對其進行清洗。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 ’ 清楚的呈現。 參閱圖2、3，並配合參閱圖4，本發明晶片承載盤之 晶片定位蓋裝置之第一較佳實施例，是設置於—承載有複 數晶片201的晶片承載盤2〇〇上，以配合該晶片承載盤2〇〇 進行清洗作業，該定位蓋裴置包含··一底框2、_圍繞壁3 、一紗網4,及六個卡扣件在此要注意的是，為了方便 後續說明，圖2中僅繪出—卡扣件5，但實際產品應具有六 個卡扣件5。 5 201016568 u底框2具有—呈環形之本體部2卜複數相間隔地自 部21外侧面向内延伸的第—凹槽部22,以及複數相 間隔自該本體部21朝向該本體部21之幾何中心方向延伸 之補強肋23。該底框2之本體部21具有二長邊2ιι、二分 別連接該長邊211之兩相對應端的短邊212，以及複數分別 與相對應之該等第―凹槽部22相連通的軸裝部213 ,該等 第一凹槽部22則是相間隔地分別形成於該二長邊川上。 每-補強肋23具有一肋條部231，以及一自該肋條部231 之底面向下延伸的壓制部232。每一軸裝部213是由上至下 逐漸呈收斂狀，並於其底部形成-可轴接卡固相對應之卡 扣件5之轉㈣51的卡固槽214。在本實施例中，該本體 部21及該補強肋23皆是由硬質塑膠所製成。 該圍繞壁3是設置於該本體部21之下表面上並與該 長邊211及該一短邊212之底部相連接，且於該圍繞壁3 之外側面上形成有複數相間隔的第二凹槽部Μ，該等第二 凹槽部31疋分別對應該等第—凹槽部22並相配合第界定 出複數容置^間，而該圍_ 3是與該底框2之本趙部Μ 相配合地蓋設於該晶片承載盤2〇〇載有晶4 2〇ι的表面上 。在此要注意較’該本體部21及該圍繞壁3之形狀是配 合一特定之晶片承載盤200之型態而設計出，當然，如該 晶片承載盤200為其他形狀時（見圖7)，也可對該本體部21 及該圍繞壁3進行相對應之設計以配合該晶片承載盤2〇〇， 因此並不應以本實施例所揭露之特定態樣為限。 該紗網4是夾設於該底框2之本體部21及該圍繞壁3 201016568 之間，並與該晶片承載盤200相配合地對承置於該晶片承 載盤200上的晶片201形成挾持，而該補強肋23之壓制部 232則是進一步地將該紗網4壓制於該晶片承載盤2〇〇上， 使該紗網4得以更緊密與該晶片承載盤2〇〇相配合地對承 置於該晶片承載盤200上的晶片201形成挾持。而使用有 孔隙之紗網4的目的在於：使本實施在進行水洗過程時， 洗淨用水液可透過該紗網4之孔隙而到達該晶片2〇1處，The surface of the plate body 11 is recessed for the plurality of wafers 100 or the carrier grooves 12 on which the carrier plates carrying the plurality of small wafers 100 are placed. Since the semiconductor wafer 100 is inspected for shipment, the amount of dust particles attached to the surface thereof is necessary (4) to be a good product in a predetermined amount. Therefore, in the packaging process of the semiconductor wafer 100, there is a pair of packages. The wafer 100 is subjected to a water washing process to wash the dust attached to the wafer 1 , and the procedure is necessary to use the wafer 100 to carry the disk i as the wafer 100 to simultaneously surface the plurality of crystals M i (10). Wash the dust. Although the carrying groove η y 逋霄 of the carrier 1 has a positioning structure for forming the wafer 100 so as not to be easily dropped, the above positioning is taken into consideration for the convenience of the wafer (10) being detached or placed in the carrying groove. The clamping force provided by the structure is not very strong, therefore, during the washing process. It is easy to cause the wafer 1G0 to be in the water-washing process towel to the corresponding bearing groove 12 due to the force exerted by the external liquid on the wafer just before, and this is necessary when such a situation occurs. Stop the water first process, and re-place the dropped wafer (10) on the 3 201016568 by the production line operator. In addition to affecting the smoothness of the process, the operator resets the dropped wafer 100 back to the wafer 1 When the disk 1 is carried, it may also occur that the wafer 100 is incorrectly placed in the carrier groove 12 that is not corresponding thereto, thereby causing a defect in subsequent inventory management. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a positioning cover device that can be used in conjunction with a wafer carrier disk to hold a wafer carried on the wafer carrier in a water washing process. The wafer positioning cover device of the wafer carrier of the present invention is disposed on a wafer carrier disk carrying a plurality of wafers for performing a cleaning operation, and the positioning cover device comprises: a bottom frame and a surrounding Wall, a gauze, and a plurality of fasteners. The bottom frame has an annular body portion and a plurality of first groove portions extending inwardly from the outer side of the body portion. The surrounding wall is disposed on a lower surface of the body portion, and a plurality of second groove portions are formed on the outer side surface thereof, and the second groove portions respectively correspond to the first groove portion And correspondingly defining a plurality of accommodating spaces, the surrounding wall is disposed on the surface of the wafer carrier carrying the wafer in cooperation with the body portion of the bottom frame. The gauze is sandwiched between the body portion of the bottom frame and the surrounding wall, and cooperates with the wafer carrier to hold the wafer placed on the wafer carrier. The fastening members are respectively rotatably and spaced apart from each other on the body portion of the bottom frame, and are formed by the matching of the first groove portion and the second groove portion 201016568 In the equal-receiving space, each of the latching members has a shaft portion that is disposed on the body portion and rotatable about the axis thereof, and a stopping portion that is coupled to the rotating shaft portion, and the rotating shaft portion is mountable The blocking portion moves between a free position and a snapping position 'when the blocking portion is in the free position' is away from the bottom side of the wafer carrier tray, when the blocking portion is in the snapping position, The bottom edge of the wafer carrier is snapped to secure the body portion of the bottom frame, the surrounding wall, and the gauze to the wafer carrier. The utility model has the advantages that the cover structure formed by the body portion of the bottom frame and the surrounding wall is matched, and the gauze cover is mounted on the wafer carrier tray, and the fasteners are further a snapping action for forming a press-fixing on the wafer on the wafer carrier, so that in the water washing process, the cleaning liquid can pass through the gauze to contact the wafer loaded on the wafer carrier and It is cleaned. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings. Referring to Figures 2 and 3, and with reference to Figure 4, a first preferred embodiment of the wafer positioning cover device of the wafer carrier of the present invention is disposed on a wafer carrier tray 2 carrying a plurality of wafers 201 to match The wafer carrying tray 2 is subjected to a cleaning operation, and the positioning cover includes a bottom frame 2, a surrounding wall 3, a gauze 4, and six snap members. Note that only the snap fastener 5 is depicted in FIG. 2, but the actual product should have six snap fasteners 5. 5 201016568 The bottom frame 2 has a ring-shaped body portion 2, a plurality of first groove portions 22 extending inwardly from the outer side of the portion 21, and a plurality of phases spaced from the body portion 21 toward the body portion 21 A reinforcing rib 23 extending in the center direction. The main body portion 21 of the bottom frame 2 has two long sides 2, and two short sides 212 respectively connecting the opposite ends of the long sides 211, and a plurality of shafts respectively connected to the corresponding first groove portions 22 The portion 213, the first groove portions 22 are formed on the two long sides of the river at intervals. Each of the reinforcing ribs 23 has a rib portion 231, and a pressing portion 232 extending downward from the bottom surface of the rib portion 231. Each of the shaft mounting portions 213 is gradually converged from top to bottom, and a locking groove 214 is formed at the bottom thereof to axially engage the corresponding rotation (4) 51 of the fastening member 5. In this embodiment, the body portion 21 and the reinforcing ribs 23 are made of a hard plastic. The surrounding wall 3 is disposed on the lower surface of the body portion 21 and connected to the bottom of the long side 211 and the short side 212, and is formed with a plurality of second intervals on the outer side of the surrounding wall 3 The groove portion Μ, the second groove portions 31 对 respectively correspond to the first groove portion 22 and cooperate with the first defining a plurality of accommodating spaces, and the circumference _ 3 is the same as the bottom frame 2 The portion Μ is cooperatively disposed on the surface of the wafer carrier 2 on which the crystal 4 2 is supported. It should be noted here that the shape of the body portion 21 and the surrounding wall 3 is designed to match the shape of a particular wafer carrier 200, of course, if the wafer carrier 200 has other shapes (see FIG. 7). The body portion 21 and the surrounding wall 3 may be correspondingly designed to fit the wafer carrier tray 2, and thus should not be limited to the specific aspects disclosed in the embodiment. The gauze 4 is sandwiched between the body portion 21 of the bottom frame 2 and the surrounding wall 3 201016568, and cooperates with the wafer carrier 200 to form a wafer 201 placed on the wafer carrier 200. And the pressing portion 232 of the reinforcing rib 23 further presses the gauze 4 onto the wafer carrier 2, so that the gauze 4 can be more closely matched with the wafer carrier 2 The wafer 201 placed on the wafer carrier 200 forms a holding. The purpose of using the apertured mesh 4 is to allow the cleaning water to pass through the aperture of the screen 4 to reach the wafer 2 when the water washing process is performed.
進而對其進行洗淨，在本實施例中，該紗網4是由不吸水 之尼龍材質所製成。 回顧圖2，並配合參閱圖5、6，該等卡扣件$是分別 可旋動且相間隔地設置於該底框2之本體部2ι上並位於 其相對應之該第一凹槽部22及第二凹槽部31所相配合形 成的該等容置空間中，每-卡扣# 5具有—軸接卡固:該 本體部21之轴裝部213的卡固槽214中並可繞自身軸線旋 轉的轉轴部51，以及-概呈⑽並連接於該轉 擋止部52« 該轉軸部51是可搭載該擋止部52 甘目由位置及一 卡扣位置間移動，當該擋止部52是在自由位置時，是遠離 該晶片承載盤200之底側面(見圖5)，當等擋止部52是在卡 扣位置時，是卡扣於該晶片承載盤200之底侧緣 進而將該底框2之本體部21、該圍繞壁_ 衊固現壁3，以及 固定於該晶片承載盤200上。 部分之該等第一凹槽部22是兩 ^ 对屨且相間隔地分別 5又置於該一長邊211上，而部分 飞等第一凹槽部22是呈 7 201016568 兩兩錯位地分別形成於該二長邊211上，而該圍繞壁3之第 一凹槽部31之設置位置同樣是對應其相對應之該等第—凹 槽部22,且該等卡扣件5是容置於該等第一及第二凹槽部 22、31所形成之空間内，藉此，位於該等長邊2ΐι之相對 中央段的該等卡扣件5即是呈兩兩錯位的配置狀態，進而 與呈兩兩相互對稱狀之卡扣件5相配合構成更廣泛之夾固 力量的相對分佈。 在此要特別注意的是，當該等擋止部52是位於卡扣位 置時，是完全容置於相對應之第一及第二凹槽部22、31所 形成之空間内，並不會突伸出該圍繞壁3之外側面（如圖6 所示）’以配合自動化生產線之規格，使其於自動化產線上 運送時不會因為該等擋止部52突伸於該圍繞壁3之外側面 而受到影響。 當該載有晶片201之晶片承載盤2〇〇準備要進行水洗 作業之前，生產線作業人員首先需將該等卡扣件5之擋止 部52撥至該自由位置，以使該底框2之本體部21與該圍 繞壁3所相配合界定出之蓋型結構體得以蓋合於該晶片承◎ 載盤200上，此時，生產線作業人員即可撥動該等擋止部 52使其移動到該卡扣位置上，而該等擋止部52及會卡扣於 該晶片承載盤200之底侧緣上，並藉由該等擋止部52與該 晶片承載盤200之底側緣之間的摩擦力’而使該等擋止部 52維持於該卡扣位置上，進而使該底框2之本體部21及該 圍繞壁3可穩固地蓋合固定於該晶片承載盤2〇〇上。 如圖8所示，本發明晶片承載盤之晶片定位蓋裝置之 8 201016568 第二較佳實施例’大致上是與該第一較佳實施例相同，相 同之處不再贅言，其中不相同之處在於：本實施例是採用 不具有補強肋23之態樣，以配合一用於承放小型晶片201 之晶片承載盤200來使用，而此種配置方式同樣可使該紗 網4得以與該晶片承載盤2〇〇相配合地對承置於該晶片承 載盤200上的晶片201形成挾持。 藉由上述設計，本發明之晶片承載盤之晶片定位蓋裝 置’具有下列優點： 1·防止晶片201於水洗過程中自該晶片承載盤2〇〇上 脫落： 藉由該本體部21、補強肋23、圍繞壁3，以及 該紗網4相配合形成一蓋型結構體蓋合於該晶片承 載盤200上，使其蓋合於該晶片承載盤2〇〇上時， 該紗網4可對承置於該晶片承載盤2〇〇上之晶片 201形成壓制固定，再配合該等卡扣件5之卡扣， 使該蓋型結構體不易自該晶片承載盤2〇〇上脫落， 進而在水洗過程中’洗淨用之水液可穿過該紗網4 之孔隙而對該等晶片201表面進行清洗，而該紗網 4則是與該晶片承載盤200相配合地對該等晶片2〇 1 形成一股夾置力量，使其不會因清洗水液之外力而 移位。 2.產品可直接上線使用，毋需改變既有晶片承載盤 200之結構或水洗製程： 本發明在直接蓋設於既有之晶片承載盤2〇〇上 201016568 並固定後，即可與該晶片承載盤200相配合地提供 水洗製程中所需要的晶片201固定功能，並不需要 更換既有之晶片承載盤200或對其進行改裝，而既 有之水洗製程也不需要改變，實用性甚佳。 3.卡扣件5之擋止部52於卡扣時呈隱藏式設計與其 他自動化設備之整合性佳： 當該等擋止部52是位於卡扣位置時，是完全容 置於相對應之第一及第二凹槽部22、31所形成之空 間内，並不會突伸出該圍繞壁3之外侧面，此一隱❹ 藏式設計可配合自動化生產線之規格，使其於自動 化產線上運送時，不會對自動化之輸送帶或機械手 臂等設備造成定位或夾制上的影響，進而提高本發 明與其他設備之間的整合性。 綜上所述，本發明利用該底框2之本體部21及該圍繞 壁3相配合形成的蓋型結構體，並搭載該紗網4蓋設於該 晶片承載盤200上，再藉由該等卡扣件5的卡扣作用以 對位於該晶片承載盤200上的晶片2〇1形成壓制固定，進〇 而在水洗製程中，使清洗用之水液可經過該紗網4之空隙 而接觸到承載於該晶片承載盤2〇〇上之晶片2〇1並對其進 行清洗，且晶片201不會因為清洗水液所施予之外力而產 生位移脫離，使本發明具有防止晶片洲於水洗過程中脫 落间實用性，及可與自動化設備輕易整合之優點，故確 實成達成本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 10 201016568 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明習知的一晶片承載盤與承載於 其上之晶片； 圖2是一立體分解圖，說明本發明晶片承載盤之晶片Further, it is washed, and in the present embodiment, the gauze 4 is made of a non-absorbent nylon material. Referring to FIG. 2, and referring to FIG. 5 and FIG. 6, the fastening members $ are respectively rotatably and spaced apart from each other on the main body portion 2 of the bottom frame 2 and located in the corresponding first groove portion. In each of the accommodating spaces formed by the cooperation of the second recessed portion 31, each of the latches #5 has a shaft-fitting: the retaining groove 214 of the shaft-mounted portion 213 of the body portion 21 is a rotating shaft portion 51 that rotates about its own axis, and - (10) and is connected to the turning stop portion 52. The rotating shaft portion 51 is mounted with the stopping portion 52, and is moved between a position and a buckle position. The blocking portion 52 is in a free position away from the bottom side of the wafer carrier 200 (see FIG. 5). When the blocking portion 52 is in the latching position, it is snapped onto the wafer carrier 200. The bottom side edge further encloses the body portion 21 of the bottom frame 2, the surrounding wall 蔑 蔑 wall 3, and the wafer carrier tray 200. A portion of the first groove portions 22 are two opposite sides and are respectively spaced apart from each other on the long side 211, and the first groove portion 22 is partially displaced by 7 201016568 Formed on the two long sides 211, and the first groove portions 31 of the surrounding wall 3 are disposed at the same position corresponding to the corresponding first groove portions 22, and the fastener members 5 are accommodated. In the space formed by the first and second recessed portions 22, 31, the latching members 5 located at the opposite central sections of the long sides 2, i are in a dislocation configuration. Further, in cooperation with the snap members 5 which are symmetric with each other, a relatively wide distribution of the clamping force is formed. It should be particularly noted that when the blocking portions 52 are located at the latching positions, they are completely accommodated in the spaces formed by the corresponding first and second recessed portions 22, 31, and will not Projecting the outer side of the surrounding wall 3 (as shown in FIG. 6) to match the specifications of the automated production line so that it does not protrude from the surrounding wall 3 due to the stopping portions 52 when transported on the automated production line. The outer side is affected. Before the wafer carrier tray 2 carrying the wafer 201 is ready for the water washing operation, the line operator first needs to turn the blocking portion 52 of the fastening member 5 to the free position, so that the bottom frame 2 is The cover structure defined by the body portion 21 and the surrounding wall 3 is attached to the wafer carrier tray 200. At this time, the line operator can move the stoppers 52 to move the trays. Up to the latching position, the blocking portions 52 are buckled on the bottom side edge of the wafer carrier 200, and the bottom side edges of the wafer carrier 200 are supported by the blocking portions 52. The frictional force between the retaining portions 52 is maintained at the latching position, so that the body portion 21 of the bottom frame 2 and the surrounding wall 3 can be firmly fixed to the wafer carrier tray 2〇〇. on. As shown in FIG. 8, the second preferred embodiment of the wafer positioning cover device of the present invention is substantially the same as the first preferred embodiment, and the similarities are no longer in common, and the difference is not the same. It is to be noted that this embodiment uses a pattern without the reinforcing ribs 23 for use with a wafer carrier 200 for receiving the small wafer 201, and this arrangement also enables the gauze 4 to be The wafer carrier disk 2 is cooperatively formed to hold the wafer 201 placed on the wafer carrier 200. With the above design, the wafer positioning cover device of the wafer carrier of the present invention has the following advantages: 1. Preventing the wafer 201 from falling off from the wafer carrier 2 during the water washing process: by the body portion 21, the reinforcing rib 23, when the wall 3, and the gauze 4 are matched to form a cover structure cover on the wafer carrier 200, when the cover is attached to the wafer carrier 2, the gauze 4 can be The wafer 201 placed on the wafer carrier tray 2 is pressed and fixed, and then the buckle of the fastener member 5 is matched, so that the cover structure body is not easily peeled off from the wafer carrier tray 2, and During the water washing process, the water for washing can pass through the pores of the gauze 4 to clean the surface of the wafer 201, and the gauze 4 is matched with the wafer carrier 200 for the wafer 2 〇1 forms a sandwiching force so that it does not shift due to the force of the washing liquid. 2. The product can be used directly on the line, and it is not necessary to change the structure of the existing wafer carrier 200 or the water washing process: the present invention can be directly mounted on the existing wafer carrier tray 2, 201016568 and fixed, and the wafer can be used with the wafer. The carrier tray 200 cooperatively provides the fixing function of the wafer 201 required in the water washing process, and does not need to replace or modify the existing wafer carrier tray 200, and the existing washing process does not need to be changed, and the utility is very good. . 3. The locking portion 52 of the locking member 5 has a hidden design at the time of the buckle and is well integrated with other automatic devices: when the blocking portion 52 is located at the buckle position, it is completely accommodated in the corresponding position. The space formed by the first and second groove portions 22, 31 does not protrude from the outer side of the surrounding wall 3. This concealed design can be combined with the specifications of the automated production line to make it automated. When transported online, it does not affect the positioning or clamping of automated conveyor belts or robotic arms, thereby improving the integration between the present invention and other devices. In summary, the present invention utilizes a cover structure formed by the body portion 21 of the bottom frame 2 and the surrounding wall 3, and the gauze 4 is mounted on the wafer carrier 200, and The latching action of the fastener member 5 is used to press and fix the wafer 2〇1 located on the wafer carrier 200, and the water for cleaning can pass through the gap of the gauze 4 in the water washing process. Contacting and cleaning the wafer 2〇1 carried on the wafer carrier 2, and the wafer 201 is not displaced by the force applied by the cleaning liquid, so that the invention has the advantage of preventing the wafer from being The utility of the shedding during the washing process and the advantages of being easily integrated with the automation equipment are indeed achieved by the object of the present invention. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is limited to the extent that it is not limited to 10, 2010, 568, which is a simple equivalent change of the scope of the invention and the description of the invention. And modifications are still within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a conventional wafer carrier and a wafer carried thereon; FIG. 2 is an exploded perspective view showing the wafer of the wafer carrier of the present invention.
參 定位蓋裝置之第一較佳實施例與一晶片承載盤之分離後情 形（省略部分卡扣件）； 圖3是一局部立體圖，說明該第一較佳實施例之一轴 裝部（省略相對應之卡扣件）； 圖4是一底視圖，說明該第一較佳實施例之底部結構 圖疋局部剖視圖，說明該第一較佳實施例與一晶 片承載盤之組合情形，以及該較佳實施例之卡扣件之 止部是位於一自由位置； 片承澈般6 r局部剖視圖說明該第一較佳實施例與-晶 載盤之組合情形，以及該播止部是位於—卡扣位置； 種^ 7是一立體分解圖，說明該第一較佳實施例與另-〜樣之晶^片承載盤的分離後情形（省略部分卡扣件）；及 圖8是一立體分解圖，說明本發明晶片承載盤之 疋立蓋裝置之第二較佳實 Μ 形(省略部分卡扣件）。 日日片承載盤之分離後情 11 201016568 【主要元件符號說明】 2 ....... •…底框 3…… •…圍繞壁 21…… •…本體部 31 ••… •…第二凹槽部 211… …長邊 4…… •…紗網 212… •…短邊 5…… -----^扣件 213… •…轴裝部 51 ····. •…轉軸部 214… -----^固槽 52••… •…擋止部 22…… …·第一凹槽部 200… •…晶片承載盤 23…… …·補強肋 201… 日曰片 231 ··· …·肋條部 232 ··· •…壓制部 12FIG. 3 is a partial perspective view showing a shaft mounting portion of the first preferred embodiment (omitted from the case where the first preferred embodiment of the positioning cover device is separated from a wafer carrier disk) FIG. 4 is a bottom view showing a bottom structural view of the first preferred embodiment, illustrating a combination of the first preferred embodiment and a wafer carrier, and The locking portion of the preferred embodiment is located in a free position; the partial cross-sectional view of the first embodiment shows the combination of the first preferred embodiment and the crystal carrier, and the broadcast portion is located at - The buckle position; the type 7 is an exploded perspective view illustrating the separation of the first preferred embodiment from the other-type wafer carrier (the partial snap is omitted); and FIG. 8 is a three-dimensional The exploded view illustrates a second preferred embodiment of the standing cover device of the wafer carrier of the present invention (some of which are omitted). Separation of day and day carrier trays 11 201016568 [Description of main component symbols] 2 ....... •...Bottom frame 3... •...around wall 21... •...body section 31 ••... •... Two groove portions 211 ... long side 4 ... • ... gauze 212 ... • ... short side 5 ... ----- ^ fastener 213 ... • ... shaft mounting portion 51 ····. 214... -----^Fixed groove 52••... •...stop portion 22...the first groove portion 200...•...the wafer carrier tray 23...the reinforcing rib 201...the sundial piece 231· ···· rib portion 232 ··· •...pressing unit 12