KR102394720B1 - Wafer storage case - Google Patents

Wafer storage case Download PDF

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KR102394720B1
KR102394720B1 KR1020200047710A KR20200047710A KR102394720B1 KR 102394720 B1 KR102394720 B1 KR 102394720B1 KR 1020200047710 A KR1020200047710 A KR 1020200047710A KR 20200047710 A KR20200047710 A KR 20200047710A KR 102394720 B1 KR102394720 B1 KR 102394720B1
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South Korea
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wafer
circular jaw
fixing
cover
storage case
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KR1020200047710A
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Korean (ko)
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KR20210129533A (en
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배남호
이석재
이경균
이태재
이문근
염민희
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한국과학기술원
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼 보관 케이스에 관한 것으로, 웨이퍼(W)의 외주 형상에 대응되는 접시 형상의 수납부와, 상기 수납부의 내측단으로는 웨이퍼(W)가 수납될 수 있도록 웨이퍼(W)의 외형에 맞게 형성된 제1 원형턱이 형성된 본체; 상기 제1 원형턱과 대응되는 제2 원형턱과, 상기 제2 원형턱 하부 측면에 웨이퍼(W)를 고정하는 고정부가 형성된 덮개; 및 상기 본체와 덮개가 일체로 연결되도록 형성된 연결부;를 포함하는 것을 특징으로 하는 것을 특징으로 한다.The present invention relates to a wafer storage case, and includes a dish-shaped accommodating part corresponding to the outer periphery shape of the wafer (W), and an inner end of the accommodating part of the wafer (W) so that the wafer (W) can be accommodated. a body having a first circular jaw formed to fit; a cover formed with a second circular jaw corresponding to the first circular jaw, and a fixing part for fixing the wafer (W) to a lower side surface of the second circular jaw; and a connecting part formed so that the main body and the cover are integrally connected.

Description

웨이퍼 보관 케이스{Wafer storage case}Wafer storage case

본 발명은 웨이퍼 보관 케이스에 관한 것으로, 더욱 상세하게는 다양한 사이즈의 웨이퍼 보관이 가능한 웨이퍼 보관 케이스에 관한 것이다.The present invention relates to a wafer storage case, and more particularly, to a wafer storage case capable of storing wafers of various sizes.

일반적으로 반도체 공정에서 사용되는 웨이퍼는 얇고 둥근 형태를 가지고 있으며, 구매 시 25장을 1 set로 하여 전용 캐리어(carrier)에 담겨져 있다.In general, wafers used in the semiconductor process have a thin and round shape, and when purchased, 25 sheets are set as a set and contained in a dedicated carrier.

반도체 공정은 선택적으로 1장 이상 웨이퍼를 이용하여 공정을 진행하며 이때에, 1set을 전부 활용하기 이전 낱장을 활용하는 경우가 많이 발생하는데 이때에, 사용된 캐리어의 빈자리에 다시 삽입하여 이동 및 보관을 한다. 각 공정 프로세스에 따라 여러 단계를 거치게 되는데 Fab 내에서의 이동이라고 할지라도 파손 또는 오염의 인자에 노출되기 쉽다.In the semiconductor process, the process is selectively performed using one or more wafers, and at this time, there are many cases where a single sheet is used before using the entire set. do. It goes through several steps according to each process process, and even if it is moved within the fab, it is easy to be exposed to factors of breakage or contamination.

25개를 1set으로 된 캐리어는 대량 생산으로 인한 주기적 사용 외 큰 부피로 인한 보관이 불편하며, 1장의 공정에도 큰 부피의 캐리어의 사용으로 이동 시 불편할 뿐만 아니라 보관의 장소가 협소한 곳에서의 사용이 불편한 문제점이 있었다.Carriers made of 25 pieces in one set are inconvenient to store due to their large volume other than periodic use due to mass production. I had this inconvenient problem.

상기와 같은 문제점을 해결하기 위한 본 발명의 목적은 반도체 공정 후 낱장의 웨이퍼 보관이 용이하고 이동에 있어 안정감을 줄 수 있는 웨이퍼 보관 케이스를 제공하는 데 있다. An object of the present invention for solving the above problems is to provide a wafer storage case that can easily store a sheet of wafers after semiconductor processing and provide stability in movement.

상기와 같은 목적을 달성하기 위한 본 발명의 웨이퍼 보관 케이스는 웨이퍼(W)를 수납하는 접시 형상의 수납부와, 상기 수납부의 내측단에 웨이퍼(W)의 외형에 맞게 형성된 제1 원형턱이 형성된 본체; 상기 제1 원형턱과 대응되는 제2 원형턱과, 상기 제2 원형턱 하부 측면에 웨이퍼(W)를 고정하는 고정부가 형성된 덮개; 및 상기 본체와 덮개가 일체로 연결되도록 형성된 연결부;를 포함하는 것을 특징으로 한다.The wafer storage case of the present invention for achieving the above object includes a plate-shaped accommodating part for accommodating the wafer (W), and a first circular jaw formed at the inner end of the accommodating part to match the outer shape of the wafer (W). formed body; a cover formed with a second circular jaw corresponding to the first circular jaw, and a fixing part for fixing the wafer (W) to a lower side surface of the second circular jaw; and a connection part formed so that the main body and the cover are integrally connected.

상기 고정부는 탄성력을 갖는“ㄴ”자 형상으로 제2 원형턱의 원주방향을 따라 등간격으로 2~8개를 형성할 수 있다.The fixing part may be formed in a "b" shape having an elastic force, and 2 to 8 pieces may be formed at equal intervals along the circumferential direction of the second circular jaw.

상기 본체의 테두리 내측으로 덮개의 테두리 상단에 형성된 결합부가 끼워져 덮개와 본체가 결합되어 밀폐될 수 있다.A coupling portion formed on the top edge of the cover is fitted inside the edge of the body, so that the cover and the body are coupled and sealed.

상기 제1 원형턱 보다 작은 사이즈의 웨이퍼(W)를 수납부에 수납할 경우에는 웨이퍼(W)를 고정판으로 덮어 고정할 수 있다.When the wafer W having a size smaller than the first circular jaw is accommodated in the receiving unit, the wafer W may be covered with a fixing plate to be fixed.

상기 고정판은 중심부에 해당하는 허브부와, 외곽의 웨이퍼(W)의 외형에 맞게 형성된 림부와, 상기 허브부와 림부를 연결하는 다수개의 스포크부, 및 상기 림부 내측에는 웨이퍼(W)를 고정하는 돌기부를 포함할 수 있다.The fixing plate includes a hub portion corresponding to the central portion, a rim portion formed to fit the outer shape of the wafer (W), a plurality of spoke portions connecting the hub portion and the rim portion, and a wafer (W) inside the rim portion. It may include a protrusion.

이상과 같이, 본 발명의 웨이퍼 보관 케이스에 따르면 웨이퍼 1장씩 보관과 다양한 사이즈의 웨이퍼 보관이 가능하며 부피를 줄어 이동시 편리한 장점이 있다.As described above, according to the wafer storage case of the present invention, it is possible to store one wafer at a time and to store wafers of various sizes, and there is an advantage of convenient movement by reducing the volume.

도 1은 본 발명에 따른 웨이퍼 보관 케이스의 전개 사시도이다.
도 2는 본 발명에 따른 웨이퍼 고정판을 구비한 웨이퍼 보관 케이스의 전개 사시도이다.
도 3은 본 발명에 따른 웨이퍼 고정판의 사시도이다.1 is an exploded perspective view of a wafer storage case according to the present invention.
2 is an exploded perspective view of a wafer storage case having a wafer holding plate according to the present invention.
3 is a perspective view of a wafer holding plate according to the present invention.

아래에서는 첨부한 도면을 참조하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명의 실시 예를 상세히 설명한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시 예에 한정되지 않는다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily carry out the present invention. However, the present invention may be implemented in several different forms and is not limited to the embodiments described herein.

그러면 본 발명에 따른 웨이퍼 보관 케이스의 바람직한 실시예에 대하여 상세히 설명하기로 한다.Then, a preferred embodiment of the wafer storage case according to the present invention will be described in detail.

도 1은 본 발명에 따른 웨이퍼 보관 케이스의 전개 사시도이고, 도 2는 본 발명에 따른 웨이퍼 고정판을 구비한 웨이퍼 보관 케이스의 전개 사시도이며, 도 3은 본 발명에 따른 웨이퍼 고정판의 사시도이다.1 is an exploded perspective view of a wafer storage case according to the present invention, FIG. 2 is an exploded perspective view of a wafer storage case having a wafer holding plate according to the present invention, and FIG. 3 is a perspective view of a wafer holding plate according to the present invention.

도 1 내지 도 3을 참조하면, 본 발명의 웨이퍼 보관 케이스는 합성수지재로 이루어지며, 본체(100)와 덮개(200)가 일체로 연결되도록 연결부(300)가 형성되어 있다. 1 to 3 , the wafer storage case of the present invention is made of a synthetic resin material, and the connection part 300 is formed so that the main body 100 and the cover 200 are integrally connected.

상기 본체(100)는 내측면에 웨이퍼(W)의 외주 형상에 대응되는 접시 형상의 수납부(110)가 형성되어 있다. 이와 같이, 상기 수납부(110)를 접시 형상으로 형성함으로써 웨이퍼(W)의 저면이 본체(100)에 직접 접촉되는 것을 방지하여 웨이퍼(W)의 손상을 예방할 수 있다.The main body 100 has a plate-shaped accommodating part 110 corresponding to the outer periphery shape of the wafer W is formed on the inner surface thereof. As described above, by forming the accommodating part 110 in the shape of a plate, the bottom surface of the wafer W is prevented from being in direct contact with the body 100 , thereby preventing damage to the wafer W.

그리고, 상기 수납부(110)의 내측단으로는 웨이퍼(W)가 수납될 수 있도록 웨이퍼(W)의 외형에 맞게 형성된 제1 원형턱(120)이 형성되어 있다. In addition, a first circular jaw 120 formed to fit the outer shape of the wafer W is formed at the inner end of the accommodating part 110 so that the wafer W can be accommodated.

상기 덮개(200)는 내측면에 제1 원형턱(120)과 대응되는 제2 원형턱(220)이 형성되어 있으며, 제2 원형턱(220) 하부 측면에 웨이퍼(W)를 고정하는 고정부(230)가 형성되어 있다. 여기서, 상기 고정부(230)는 ㄴ”자 형상으로 탄성력을 갖으며 제2 원형턱(220)의 하부 내측면에 원주방향을 따라 등간격으로 2~8개를 형성하며, 바람직하게는 4개를 형성한다.The cover 200 has a second circular jaw 220 corresponding to the first circular jaw 120 is formed on the inner surface, and a fixing part for fixing the wafer W to the lower side of the second circular jaw 220 230 is formed. Here, the fixing part 230 has an elastic force in an L-shape and forms 2 to 8 pieces at equal intervals along the circumferential direction on the lower inner surface of the second circular jaw 220, preferably 4 pieces. to form

또한, 상기 본체(100)의 테두리 내측으로 덮개(200)의 테두리 상단에 형성된 결합부(210)가 끼워져 덮개(200)와 본체(100)가 결합되어 밀폐가 이루어질 수 있다.In addition, the coupling part 210 formed on the upper edge of the edge of the cover 200 is fitted inside the edge of the body 100 so that the cover 200 and the body 100 are coupled to each other, thereby sealing can be achieved.

한편, 제1 원형턱(120) 보다 사이즈가 작은 웨이퍼(W)를 수납부(110)에 수납할 경우에는 도 2와 같이, 웨이퍼(W)를 고정판(400)으로 덮어 고정할 수 있다.Meanwhile, when a wafer W having a size smaller than that of the first circular jaw 120 is accommodated in the receiving unit 110 , the wafer W may be fixed by covering the wafer W with the fixing plate 400 as shown in FIG. 2 .

여기서, 상기 고정판(400)은 중심부에 해당하는 허브부(410)와, 외곽의 웨이퍼(W)의 외형에 맞게 형성된 림부(420), 및 상기 허브부(410)와 림부(420)를 연결하는 다수개의 스포크부(430)를 포함하고, 상기 림부(420) 내측에는 웨이퍼(W)를 고정하는 다수개의 돌기부(440)가 원주방향을 따라 등간격으로 배치되게 형성된다. 이때, 상기 림부(420)와 스포크부(430)는 탄성력을 갖으며 웨이퍼(W)의 저면이 직접 접촉되지 않도록 허브부(410)를 중심으로 상부로 볼록하게 형성되어 있다. Here, the fixing plate 400 includes a hub portion 410 corresponding to the center, a rim portion 420 formed to fit the outer shape of the wafer W, and connecting the hub portion 410 and the rim portion 420 . It includes a plurality of spoke portions 430, and a plurality of protrusions 440 for fixing the wafer W are formed inside the rim portion 420 to be arranged at equal intervals along the circumferential direction. At this time, the rim part 420 and the spoke part 430 have elastic force and are convexly formed with the hub part 410 as the center so that the bottom surface of the wafer W does not come into direct contact with each other.

이상에서 본 발명의 실시예에 대하여 상세하게 설명하였지만 본 발명의 권리범위는 이에 한정되는 것은 아니고 다음의 청구범위에서 정의하고 있는 본 발명의 기본 개념을 이용한 당업자의 여러 변형 및 개량 형태 또한 본 발명의 권리범위에 속하는 것이다.Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention as defined in the following claims are also provided. is within the scope of the right.

100: 본체 110: 수납부
120,220: 원형턱 200: 덮개
210: 결합부 230: 고정부
300: 연결부 400: 고정판
410: 허브부 420: 림부
430: 스포크부 440: 돌기부100: body 110: storage unit
120,220: circular jaw 200: cover
210: coupling portion 230: fixed portion
300: connection 400: fixing plate
410: hub portion 420: rim portion
430: spoke portion 440: protrusion

Claims (5)

웨이퍼(W)를 수납하는 접시 형상의 수납부와, 상기 수납부의 내측단에 웨이퍼(W)의 외형에 맞게 형성된 제1 원형턱이 형성된 본체;
상기 제1 원형턱과 대응되는 제2 원형턱과, 상기 제2 원형턱 하부 측면에 웨이퍼(W)를 고정하는 고정부가 형성된 덮개; 및
상기 본체와 덮개가 일체로 연결되도록 형성된 연결부;를 포함하되,
상기 본체의 테두리 내측으로 덮개의 테두리 상단에 형성된 결합부가 끼워져 덮개와 본체가 결합되어 밀폐되며,
상기 고정부는 탄성력을 갖는“ㄴ”자 형상으로 제2 원형턱의 원주방향을 따라 등간격으로 4개를 형성하고,
상기 본체는,
상기 제1 원형턱 보다 작은 사이즈의 웨이퍼(W)를 수납부에 수납할 경우, 웨이퍼(W)를 고정하도록 구성된 고정판을 더 포함하고,
상기 고정판은,
중심부에 해당하는 허브부와,
외곽의 웨이퍼(W)의 외형에 맞게 형성된 림부와,
상기 허브부와 림부를 연결하는 8 개의 스포크부, 및
상기 림부 내측에는 웨이퍼(W)를 고정하는 돌기부를 포함하되,
상기 돌기부는 원주방향을 따라 등간격으로 8개를 배치하며,
상기 림부와 스포크부는 탄성력을 가지며 웨이퍼(W)의 저면이 직접 접촉되지 않도록 허브부를 중심으로 상부로 볼록하게 형성되고,
웨이퍼 보관 케이스는 합성수지재로 이루어지는 것을 특징으로 하는 웨이퍼 보관 케이스.a body having a plate-shaped accommodating part for accommodating the wafer (W), and a first circular jaw formed at an inner end of the accommodating part to match the outer shape of the wafer (W);
a cover formed with a second circular jaw corresponding to the first circular jaw, and a fixing part for fixing the wafer (W) to a lower side surface of the second circular jaw; and
Containing; a connecting portion formed so that the body and the cover are integrally connected;
The coupling part formed on the top edge of the cover is fitted inside the edge of the body, so that the cover and the body are coupled and sealed,
The fixing part forms four at equal intervals along the circumferential direction of the second circular jaw in a “b” shape having an elastic force,
The body is
When the wafer (W) of a size smaller than the first circular jaw is accommodated in the receiving unit, further comprising a fixing plate configured to fix the wafer (W),
The fixing plate is
A hub portion corresponding to the center,
A rim formed to fit the outer shape of the wafer (W),
eight spoke parts connecting the hub part and the rim part; and
Including a protrusion for fixing the wafer (W) inside the rim portion,
Eight projections are arranged at equal intervals along the circumferential direction,
The rim portion and the spoke portion have elastic force and are formed convexly upwards around the hub portion so that the bottom surface of the wafer (W) does not come into direct contact with each other,
The wafer storage case is a wafer storage case, characterized in that it is made of a synthetic resin material. 삭제delete 삭제delete 삭제delete 삭제delete
KR1020200047710A 2020-04-20 2020-04-20 Wafer storage case KR102394720B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235994A (en) * 2004-02-19 2005-09-02 Sumitomo Electric Ind Ltd Wafer tray
JP2009043862A (en) * 2007-08-08 2009-02-26 Miraial Kk Sheet type wafer case

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3093068B2 (en) * 1992-12-25 2000-10-03 三菱マテリアル株式会社 Wafer case
KR100898637B1 (en) * 2007-07-20 2009-05-21 하현주 Carrier box for transferring a semiconductor substrate and case including the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005235994A (en) * 2004-02-19 2005-09-02 Sumitomo Electric Ind Ltd Wafer tray
JP2009043862A (en) * 2007-08-08 2009-02-26 Miraial Kk Sheet type wafer case

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