201008414 六、發明說明： 〔發明所屬技術領域〕 〔0001 〕 本發明係有關複數個單位配線板排版於同一製品薄片之 聚集基板之單位配線板之更換方法及聚集基板，特別是有 關，在複數個單位配線板存在於同一製品薄片內之聚集基板 中’將存在於形成有複數個單位配線板之聚集基板之製品薄 片內的不良單位配線板更換成良品躍位配線板，良品化聚集 基板之聚集基板內之單位目卩線板之更換方法及聚集基板。 〔先前技術〕 〔00 02〕 自昔以來有種種應付於以複數個堪位配線板構成之聚 集基板中存在有不良單位配線板情形之報告。例如曾揭示在 複數個單位配線板排版於同一製品薄片之聚集基板中存在有 不良單位配線板時，自動進行零件安裝情況下，爲了不將高 價零件裝載於前述不良單位配線板，進行不良顯示，藉由圖 像辨識等讀取該不良單位配線板，跳過此不良單位配線板， 僅對良品單位配線板進行零件安裝之技術（例如參考專利文 獻1)。然而*跳過不良單位配線板而進行零件安裝係安裝作 業惡化的主因。因此，在複數個單位配線板排版於同一製品 薄片之聚集基板中存在有既定數目以上之不良單位配線板 時，不使用此製品薄片而進行廢棄。特別是在使用不具有辨 識不良單位配線板之機構之低廉零件安裝裝障進行零件安裝 情況下，會廢棄即使僅存在—個不良單位配線板之製品薄 3 201008414 片，僅安裝零件於全部爲良品單位配線板之製品薄片。然而， 此種製品薄片之處理方法會廢棄含有多數良品單位配線板之 製品薄片，結果，成爲配線板生產成本增高的主因。 [0003〕 又，亦揭示自連續排列單位配線板之製品薄片更換不良 眾位配線板，將製品薄片良品化之技術（例如參考專利文獻 2) 。根據該技術，藉由使用定位手段、戡板固定手段及黏接 手段在電路圖案連續排列於製品薄片上之聚集基板中，可髙 精度接合固定除去不良單位配線板而印刷正常電路圖案部之 其他單位配線板。又，亦揭示自複數個單位配線板排成一列 之聚集基板更換不良單位配線板之技術（例如參考專利文獻 3) »然而，於上述專利文獻2、3中，將更換之單位配線板嵌 合於聚集基板之既定位置，又充塡黏接劑於嵌入之單位配線 板之側端部之空隙，予以固定。 〔0004〕 進而，亦揭示朝自聚集基板之框架或裁接部衝裁不良單 位配線板之痕跡嵌入良品單位配線板而橋接結合之技術（例 如參考專利文獻4)。又，亦揭示以可裝卸之分離型橋接件安 裝複數個單位配線板於製品薄片框，藉由僅自其中卸下不良 f.位配線板，更換成良品單位配線板，活用迄今廢棄之良品 單位配線板之技術（例如參考專利文獻5)。又，亦揭示以橋接 部，藉黏接劑進行換成良品單位配線板後之結合的方法（例如 參考專利文獻6)。然而，由於上述爯利文獻4、5、6之技術 均以單位配線板之側端壁結合，以嵌合於框的方式嵌入，因 此，僅適用於具有某一程度之厚度的硬質印刷配線板或使用 201008414 具有剛性之框的情形，，無法用於薄而具有可撓性之配線板 (Flexible Printed Circuit，下稱FPC)。又丨丨丨於近年來因零件安 裝之高密度化而位置精度變得很嚴格，因此，在更換存在於 製品薄片內之不良單位配線板與良品單位配線板情況下，需 要使微細位置精度明確之更換技術。 【專利文獻1】日本專利特開平Η - 1 9 1 668號公報 【專利文獻2】日本專利特開2000-252605號公報 【專利文獻3】日本專利特開平1 0-247656號公報 〇 【專利文獻4】日本專利特開昭64 - 48489號公報 【專利文獻5】日本專利特開2001 -2034 82號公報 【專利文獻6】日本專利特開2005 - 38953號公報 〔發明内容〕 〔發明欲解決之課題〕 〔0005〕 _ 因此，本發明之目的在於，於配置複數個薄而具有可撓 性之單位配線板之聚集基板中，商位腭精度地更換不良取位 配線板與良品單位配線板。 〔用以解決問題之手段〕 〔0006〕 本發明係爲達成上述目的而提議者，申請專利範圖第1 項所載發明提供一種聚集基板之單位配線板更換方法，係將 ί?在於形成苻複數個單位配線板之聚染堪板之製品薄片內的 不良單位配線板更換成良品單位配線板，其特徵在於包括以 201008414 下步驟：第一步驟，形成定位用第一導孔於前述製品薄片之 屬於前述單位配線板周邊部分之裁接部；第二步驟，於不包 含第一導孔之區域中，自製品薄片切斷除去不良單位配線 板；第三步驟，自另一製品薄片切斷而準備單位配線板部分 之形狀呈與不良單位配線板形同之形狀，且在含有定位用第 二導孔之區域切斷之良品單位配線板；第四步驟，將第一導 孔與第二導孔對位，把良品單位配線板裝入製品薄片中切斷 除去不良單位配線板之區域；以及第五步驟，藉黏接手段固 定第一導孔與第二導孔之周邊區域。 〔000 7〕 根據此更換方法，在形成有複數個單位配線板之製品薄 片內存在有不良單位配線板情況下，在不含形成於此製品薄 片內之第一導孔之區域切斷除去不良單位配線板。其次，自 另一製品薄片取出單位配線板部分之形狀與不良單位配線板 同一形狀，於包含定位用第二導孔之區域切斷之良品單位配 線板。然後，一面以第一導孔與第二導孔對位，將良品單位 配線板裝入切斷除去不良單位配線板之區域。由於藉此可高 位置精度地於製品薄片上將不良單位配線板更換爲良品單位 配線板，因此，可容易將過去廢棄之製品薄片良品化。並且， 爲了可適合於高密度安裝，可高位置精度地更換單位配線板。 〔0008〕 又，申請專利範圍第2項所載發明提供一種聚集基板之 不良單位配線板更換方法，係將存在於形成有複數個單位配 線板之聚集基板之製品薄片內的不良單位配線板更換成良品 單位配線板，把該製品薄片內的單位配線板全數良品化者， 6 201008414 其特徵在於包括以下步驟：第一步驟，配置各單位配線板於 製品薄片上，使裝載於鄰接之單位配線板之電子零件之安裝 方向互成相反方向，且自各個單位配線板延伸之接合部互成 相同方向；第二步驟，在單位配線板之某一個係不良單位配 線板時，自製品薄片切斷除去包含接合部之不良單位配線 板：第三步驟，自另一製品薄片切斷而準備電子零件之安裝 方向與不良單位配線板成相反方向之良品單位配線板；第四 步驟，反轉良品單位配線板之方向，使電子零件之安裝方向 〇 相對於製品薄片上鄰接之單位配線板成相反方向，將預先形 成於製品薄片之第一導孔與形成於盅品單位配線板之接合部 之第二導孔對位，把良品單位配線板裝入製品薄片中切斷除 . 去不良單位配線板之區域：以及第五步驟，藉黏接手段固定 第一導孔與第二導孔之周邊區域。 〔0009〕 根據此更換方法，在形成複數個單位配線板於製品薄片 _ 內時，含有單位配線板及接合部之形狀於鄰接之諸單位配線 ❹ 板問相同，且電子零件之安裝方向於鄰接之諸琪位配線板間 互成相反方向。於此種構造中，在製品薄片內複數個單位配 線板中某一個爲不良單位配線板情況下，自另一製品薄片切 斷而準備電子零件之安裝方向與該不良單位配線板成相反方 向之良品單位配線板。然後’反轉該良品單位配線板之方向’ 使預先形成於製品薄片之第一導孔與形成於良品單位配線板 之接合部之第二導孔對位’將此良品單位配線板裝入製品薄 片中切斷除去不良單位配線板之區域。由於藉此可使用—種 金屬衝裁金属模，進行不良單位配線板商製品薄片之切斷除 7 201008414 去以及良品單位配線板自另一製品薄片之切斷準備，因此， 可簡化聚集基板之單位配線板更換作業。 C 0010 ) 又*申請專利範圍第3項所載發明提供如申誚專利範圍 第1項或第2項之聚集基板之單位配線板更換方法，其中前 述単位配線板係可撓配線板。 〔0011〕 根據此更換方法，在排列多數撓性配線板於同一製品薄 片內作爲單位配線板情況下•即使於此製品薄片內含有不良 單位配線板，仍可容易將不良單位配線板更換成良品單位配 線板，良品化製品薄片。 因此，不會廢棄良品之撓性配線板，可僅更換不良單位 配線板，予以利用》 C 0012 ] 又，申請專利範圔第4項所載發明提供如申請專利範圍 第1、2項或第3項之聚集基板之單位配線板更換方法，其中 第一導孔與第二導孔之接合部分除去形成於琳位配線板之電 路金屬箔及蓋膜。 C 0013 ] 根據此更換方法，藉由在以第一導孔及第二導孔定位黏 貼而重昼之部分中除去電路金屬箔及蓋膜，可將黏貼而重疊 之部分的厚度變化抑至最小限度，藉此，可抑制電子零件安 裝時之搬送不當等，同時亦可應付高密度安裝。 C 0014 ] 又，申請專利範圍第5項所戦發明提供一種聚集基板， 8 201008414 係將存在於形成有複數個單位配線板之聚集基板之製品薄片 內的不良單位配線板更換成良品單位配線板，良品化該製品 薄片者，其特徵在於，在形成於製品薄片之單位配線板周邊 部分之第一導孔及形成於另外準備之设品职位配線板周邊部 分之第二導孔進行定位，將良品單位配線板裝入製品薄片中 除去不良單位配線板之區域。 * (0015 ] 根據此構成，在形成有複數個單位配線板之製品薄片內 ® 存在有不良單位配線板時，於不含形成於此製品薄片內之第 一導孔之區域切斷除去不良單位配線板》又*自另一製品薄 片取出單位配線板部分之形狀與不负堺位配線板同一形狀* - 具有定位用第二導孔之良品單位配線板。然後，一面使第一 . 導孔與第二導孔對位，一面將良品單位配線板裝入切斷除去 不良單位配線板之區域。由於藉此可高位置精度地於製品薄 片上將不良單位配線板更換成良品單位配線板，因此，不會 0 廢棄過去廢棄之製品薄片，可僅更換不良單位配線板來使 用。並且*爲了可適於高密度安裝，可高位匱精度地更換製 品薄片內之不良單位配線板來使用。 (0016 ) 又，申請專利範圍第6項所載發明提供一種聚集基板， 係配置各單位配線板於前述製品薄片上，使裝載於鄰接之單 位配線板之電子零件之安裝方向互成相反方向，且自單位配 線板延伸之接合部互成相同方向，在單位配線板之某一個係 不良單位配線板時，把該不良單位配線板更換成另外準備之 良品單位配線板，將該製品薄片良品化；其特徵在於，上下 201008414 反轉良品單位配線板之方向，以形成於製品薄片之單位配線 板周邊部分之第一導孔及形成於良品單位配線板周邊部分之 第二導孔進行定位，將良品單位配線板裝入製品薄片中除去 不良單位配線板之區域· 〔0017〕 根據此構成，在製品薄片內形成有複數個單位配線板 時，含有單位配線板及接合部之形狀於鄰接之諸單位配線板 問相同，且電子零件之安裝方向於鄰接之諸單位配線板間互 成相反方向。於此種構成中，在製品薄片内複數個單位配線 板中某一個爲不良單位配線板時，自另一製品薄片切斷而準 備電子零件之安裝方向與該單位配線板成相反方向之良品單 位配線板。然後，反轉該良品單位配線板之方向，使預先於 製品薄片之第一導孔與形成於良品單位配線板之接合部之第 二導孔對位，將此良品單位配線板裝入製品薄片中切斷除去 +良單位配線板之區域。由於藉此可使⑴一秫金屬衝裁金屬 模，進行不良單位配線板自製品薄片之切斷除去以及良品單 位配線板自另一製品薄片之切斷準備，因此，可使製品薄片 內不良單位配線板之更換作業低廉。 C 0018 ] 又，申請專利範圍第7項所載發明提供如申請專利範圍 第5項或第6項之聚集基板，其中前述m位配線板係可撓配 線板。 C 0019 ] 根據此構成，在排列多數撓性配線板於同一製品薄片內 作爲多數單位配線板之聚集基板情況下，即使於此製品薄片 10 201008414 內含有不良單位配線板，仍可容易將該不良單位配線板更換 成良品單位配線板，良品化製品薄片》因此，即使於此製品 薄片內含有不良單位配線板，仍可容易將該不良單位配線板 更換成良品單位配線板，良品化製品薄片*因此，即使包含 不良單位配線板，仍不會廢棄過去廢棄之製品薄片，可僅更 換不良單位配線板來使用* 〔發明效果〕 〔0020〕 根據本發明，由於可在製品薄片上高位置精度地將不良 m位配線板更換成良品單位配線板，因此，可容易使過去廢 棄之製品薄片良品化。並且，爲了可適合於高密度安裝，可 高位置精度地更換單位配線板。 〔實施方式〕 〔用以實施發明之最佳形態〕 〔002 1〕 本發明提供一種聚集基板之不良單位配線板更換方法， 係將存在於形成有複數個單位配線板之製品薄片內的不良單 位配線板更換成良品單位配線板，將該製品薄片內的單位配 線板全數良品化，其特徵在於包括以下步驟：第一步驟，形 成定位用第一導孔於製品薄片內之膈於單位配線板周邊部分 之裁接部：第二步驟，於不包含第一導孔之區域中，自製品 薄片切斷除去不良單位配線板：第三步驟，自另一製品薄片 切斷而準備單位配線板部分之形狀呈與不良谭位配線板同形 201008414 之形狀，且具有定位用第二導孔之良品單位配線板；第四步 驟，將第一導孔與第二導孔對位，把良品單位配線板裝入製 品薄片中切斷除去不良單位配線板之區域；以及第五步驟， 藉黏接手段固定第一導孔與第二導孔之周邊區域。 〔0022〕 以下使用圖1至圖8對有關本發明之聚集越板之不良單 位配線板更換方法之實施例詳加說明。 〔實施例1〕 ❹ 〔0023〕 圖1係適用於本發明之聚集越板之俯視圖。如該圖所 示，製品薄片1呈長形連續形成複數個單位配線板2而構成 聚集基板。藉由以此種構成將製品薄片丨作成聚集基板，可 利用插裝機器等對各單位配線板2連續地自動安裝電子零件 等。因此，在形成於製品薄片1之複數個取位配線板2中存 在有不良單位配線板（未圖示）情況下，須除去該不良單位配 線板，更換成另外準備之良品單位配線板（未圖示）。且聚集 w 鉴板不限於如圖1之長形，亦可適用於平板薄片狀聚集基板。 〔0024〕 圖2係有關本發明實施例1之聚集摇板之不良舉位配線 板更換方法之第一步驟之製程圖。 亦即，圖2顯示配置一個單位配線板2於圖1所示製品 薄片1之一部分之狀態。又，圖3係顯示有關本發明實施例 1之聚集基板之不良單位配線板更換方法之第二步驟之製程 圖。亦即’圖3顯示當圖2所示製品薄片1中之單位配線板 12 201008414 2係不良單位配線板2b時，除去此不良單位配線板2b，匱換 成別的良品單位配線板2a之狀態。進而，圓4係顯示有關本 發明實施例1之聚集基板之不良單位配線板更換方法之第三 步驟之製程圖。亦即，圖4顯示藉圖3之步驟不良單位配線 板2b置換成良品單位配線板2a之製品薄片1之不良單位配 線板更換狀態。 〔0025〕 茲根據圖2圃3及圖4之製程圆，對如圖1所示，屬於 〇 複數個單位配線板2排版於同一製品薄片1之撓性基板’在 此製品薄片1中存在有不良單位配線板時，將此不良單位配 線板更換成另外準備之良品單位配線板，良品化製品薄片1 . 之方法加以說明。 〔0026〕 首先，如圖2所示，製品薄片1成虛線區域內所示單位 配線板2形成於裁接部3內部之狀態描成。又，於製品薄片 1之裁接部3設置定位用導孔4a，4b »在此，於單位配線板 2爲不良單位配線板時，切斷除去包含虛線所示區域內之單 位配線板2惟不含導孔4a，4b之製品外形衝裁區域5。此時’ 在接合部6a、6b附著於單位配線板2側之狀.態下，切斷除去 該單位配線板2。 〔0027〕 其次，如圖3所示，切斷分離裁接部3與不良單位配線 板2b，朝該裁接部3之內部空洞部分裝入另外準備之良品單 位配線板2a。換言之，使用包含具有導孔4al、4bl之導引 部7a、7b，此外區域亦與事先衝裁之不良單位配線板2b同 13 201008414 一形狀而切斷之良品單位配線板2a，將裁接部3之導孔4a、 4b與良品單位配線板2a之導孔4a 1、4b 1對位，匹配裁接部 3之內部空洞部分，貼合良品單位配線板2a。此時之良品單 位配線板2a之貼合藉由塗佈樹脂性黏接劑於设品單位配線 板2a之導引部7a、7b，黏接於裁接部3來進行》 〔0028〕 如此，如圖4所示，貼合良品眾位配線板2a於裁接部3 之內部空洞部分，製品薄片1内的単位配線板全數成爲良 品。在此，產生良品單位配線板2a之導引部7a、7b與裁接 部3重*之部分，設法使厚度不會增加得比其他區域（亦即朝 裁接部3之內部空洞部分裝入之设品职位配線板2a之區域） 大。 C 0029 ] 圖5係圖4所示製品薄片1之A - A截面圖。且由於如圖 1所示，單位配線板2連續形成於製品雜片1，因此，圖5 顯示假設良品單位配線板2a被裝入圖4所示製品薄片1之區 域，於該製品薄片1之鄰接區域（未丨叫示）存在钌屬於设品职 位配線板之單位配線板2之狀態之截面圖。 C 0030 ) 如圖5之截面圖所示，製品薄片1係雙面安裝基板，存 在於相鄰區域之單位配線板2分別於絕緣底座11 -1之兩面形 成電路金屬箔12a-l、12b·丨，進一步塗佈蓋膜13a-l、13b-l 於各表面。同樣，新更換之良品單位配線板2a亦係雙函安裝 越板，分別於絕緣底座11 ·2之兩Ιύί形成11路金颶箔1 2a-2、 12b-2，進一步塗佈蓋膜13a-2、13b-2於各表面。 201008414 〔0031〕 在此，爲了使存在於相鄰區域之艰位配線板2與新更換 之良品單位配線板2a之厚度方向之高度一致，使存在於相鄰 區域之單位配線板2之絕緣底座1 1 · 1與新吏換之良品單位配 線板2a之絕緣底座11-2之厚度方向之高度一致。此時，由 於新更換之良品單位配線板2a之接合部6a 1係良品單位配線 板2a之絕緣底座11-2延伸者，因此，稍微彎曲良品單位配 線板2a之接合部6al，將附設於前端部分之導引部7a(參照 Ο 圖3)密接而裝載於存在於相鄰區域之單位配線板2之絕緣底 座11-U亦即製品薄片1之裁接部3)的上面。當然，此時使 良品單位配線板2a之導孔4a 1與鄰接製品菏片1之裁接部3 - 之導孔4a對位而密接兩者（亦即單位配線板2之絕緣底座 11-1及良品單位配線板2a之導引部7a)。 〔0032〕 藉此，可如圖5所示，使原來存在於相鄰區域之單位配 ^ 線板2與新更換之良品單位配線板2a之高度一致。且由於在 ❹ 职位配線板2與良品單位配線板2a亦有高度微妙不一致的情 形發生，因此，在零件安裝時等中受到厚度影響情況下，較 佳係將良品單位配線板2a之導引部7a、7b設定於盡量不會 發生影響的區域。 〔實施例2〕 〔0033〕 前述實施例1雖然對更換前之單位配線板（亦即圖3之不 良單位配線板2b)之衝裁形狀與更換後之單位配線板（亦即圖 201008414 3之良品單位配線板2a)之形狀不同的情形加以說明，不過， 實施例2對可藉由改變良品單位配線板之方向，以相同衝裁 形狀實現更換前之單位配線板（不良單位配線板）與更換後之 單位配線板（良品單位配線板）的怙形加以說明。 〔0034〕 圖6係顯示有關本發明實施例2之聚集雜板之琳位配線 板更換方法之第一步驟之製程圖。亦即，圖6顯示包含鄰接201008414 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a method for replacing a unit wiring board in which a plurality of unit wiring boards are arranged on a collecting substrate of the same product sheet, and a collecting substrate, in particular, in plural The unit wiring board exists in the aggregate substrate in the same product sheet, and the defective unit wiring board existing in the product sheet in which the plurality of unit wiring boards are formed is replaced with a good jump wiring board, and the aggregated assembly substrate is gathered. A method of replacing a unit mesh board in a substrate and a splicing substrate. [Prior Art] [00 02] Since the past, there have been various reports for the case where a defective unit wiring board exists in a collecting substrate composed of a plurality of panel wiring boards. For example, when a defective unit wiring board exists in a plurality of unit wiring boards in which a plurality of unit wiring boards are arranged on the same product sheet, when the parts are automatically mounted, the defective display is performed so as not to mount the expensive parts on the defective unit wiring board. The defective unit wiring board is read by image recognition or the like, and the defective unit wiring board is skipped, and only the good unit wiring board is mounted on the component (for example, refer to Patent Document 1). However, * skipping the defective unit wiring board and causing deterioration in the mounting work of the component mounting system. Therefore, when a predetermined number or more of the defective unit wiring boards are present in the plurality of unit wiring boards on the same substrate sheet, the product sheets are not used and discarded. In particular, in the case of component mounting using a low-cost component mounting barrier that does not have a mechanism for identifying a defective unit wiring board, even if there is only one defective unit wiring board, the product thin 3 201008414 piece, only the mounting parts are all good. Product sheet of unit wiring board. However, the processing method of such a product sheet discards a product sheet containing a majority of good unit wiring boards, and as a result, it becomes a main cause of an increase in the production cost of the wiring board. Further, the technique of replacing the defective product sheet of the unit wiring board in the continuous arrangement of the unit wiring board and improving the product sheet is also disclosed (for example, refer to Patent Document 2). According to this technique, by using a positioning means, a sill fixing means, and a bonding means, the circuit pattern is continuously arranged on the slab of the product sheet, and the other unit wiring board can be accurately removed and the normal circuit pattern portion can be printed. Unit wiring board. Further, a technique of replacing a defective unit wiring board in which a plurality of unit wiring boards are arranged in a row is disclosed (for example, refer to Patent Document 3). However, in the above-mentioned Patent Documents 2 and 3, the unit wiring board to be replaced is fitted. At a predetermined position of the agglomerated substrate, the adhesive is filled in a gap between the side ends of the unit wiring board to be fixed. Further, a technique of embedding a good unit wiring board with a trace of a defective unit wiring board from a frame or a dicing portion of a self-assembling substrate and bridging the bonding is disclosed (for example, refer to Patent Document 4). Further, it is also disclosed that a plurality of unit wiring boards are mounted on a product sheet frame by a detachable separate type bridge, and a defective unit wiring board is removed from the defective unit wiring board, and the good unit unit that has been discarded so far is utilized. The technology of the wiring board (for example, refer to Patent Document 5). Further, a method of bonding the bridge portion to the good unit wiring board by means of an adhesive is disclosed (for example, refer to Patent Document 6). However, since the techniques of the above-described patent documents 4, 5, and 6 are all joined by the side end walls of the unit wiring board and are fitted in the frame, they are only suitable for a hard printed wiring board having a certain thickness. Or if the 201008414 has a rigid frame, it cannot be used for a thin and flexible printed circuit board (FPC). In addition, in recent years, the positional accuracy has become strict due to the high density of component mounting. Therefore, in the case of replacing a defective unit wiring board and a good unit wiring board existing in the product sheet, it is necessary to make the fine positional accuracy clear. Replacement technology. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. 2000-252605 (Patent Document 3) Japanese Patent Laid-Open Publication No. Hei No. Hei. [Patent Document 5] Japanese Patent Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. 2005-38953 (Patent Document No. 2005-38953) [Problem] [0005] Therefore, in the aggregate substrate in which a plurality of thin and flexible unit wiring boards are disposed, the defective position and the good unit wiring board are accurately replaced. [Means for Solving the Problem] [0006] The present invention proposes to achieve the above object, and the invention contained in claim 1 of the present invention provides a method for replacing a unit wiring board for collecting a substrate, which is to form a crucible. A defective unit wiring board in a product sheet of a plurality of unit wiring boards is replaced with a good unit wiring board, which is characterized by comprising the following steps: 201008414: forming a first guiding hole for positioning in the product sheet a cutting portion belonging to a peripheral portion of the unit wiring board; and a second step of cutting off the defective unit wiring board from the product sheet in a region not including the first conductive hole; and the third step, cutting off another product sheet The shape of the unit wiring board portion is in the shape of a defective unit wiring board, and the good unit wiring board is cut in the area including the second guiding hole for positioning; the fourth step, the first guiding hole and the second guiding hole The guide hole is aligned, the good unit wiring board is loaded into the product sheet to cut off the area of the defective unit wiring board; and the fifth step is fixed by the bonding means And a second guide hole peripheral area of the guide hole. [000 7] According to this replacement method, in the case where a defective unit wiring board exists in the product sheet in which a plurality of unit wiring boards are formed, the removal is not performed in the region where the first conductive hole formed in the product sheet is not formed. Unit wiring board. Next, the shape of the unit wiring board portion is taken out from the other product sheet in the same shape as the defective unit wiring board, and the good unit wiring board is cut in the area including the second guiding hole for positioning. Then, the first via hole and the second via hole are aligned, and the good unit wiring board is placed in a region where the defective unit wiring board is cut and removed. Since the defective unit wiring board can be replaced with the good unit wiring board on the product sheet with high positional accuracy, the product sheet that has been discarded in the past can be easily made. Further, in order to be suitable for high-density mounting, the unit wiring board can be replaced with high positional accuracy. [0008] Further, the invention of claim 2 provides a method for replacing a defective unit wiring board of a splicing substrate, which is to replace a defective unit wiring board existing in a product sheet in which a plurality of unit wiring boards are formed. A good unit wiring board, which is a good unit of the unit wiring board in the product sheet, 6 201008414 is characterized by the following steps: In the first step, each unit wiring board is placed on the product sheet so as to be mounted on the adjacent unit wiring The mounting directions of the electronic components of the board are opposite to each other, and the joints extending from the respective unit wiring boards are in the same direction; in the second step, when one of the unit wiring boards is a defective unit wiring board, the sheet is cut off from the product sheet Removing the defective unit wiring board including the joint portion: In the third step, the product unit is cut from another product sheet to prepare a good unit wiring board in which the mounting direction of the electronic component is opposite to the defective unit wiring board; the fourth step is to invert the good unit The direction of the wiring board, so that the mounting direction of the electronic components is relative to the adjacent sheet on the product sheet The bit wiring board is in the opposite direction, and the first conductive hole formed in advance on the product sheet is aligned with the second conductive hole formed in the joint portion of the defective product wiring board, and the good unit wiring board is loaded into the product sheet to be cut off. The area of the defective unit wiring board: and the fifth step, the peripheral area of the first guiding hole and the second guiding hole are fixed by the bonding means. According to this replacement method, when a plurality of unit wiring boards are formed in the product sheet _, the shape including the unit wiring board and the joint portion is the same as that of the adjacent unit wiring boards, and the mounting direction of the electronic parts is adjacent to each other. The various wiring boards of the Qi are in opposite directions. In such a configuration, when one of the plurality of unit wiring boards in the product sheet is a defective unit wiring board, the mounting direction of the electronic component is cut off from the other product sheet in the opposite direction to the defective unit wiring board. Good unit wiring board. Then, 'reversing the direction of the good unit wiring board', the first guiding hole formed in advance in the product sheet is aligned with the second guiding hole formed in the joint portion of the good unit wiring board, and the good unit wiring board is loaded into the product. The area where the defective unit wiring board is removed is cut in the sheet. Therefore, it is possible to use a metal-cutting metal mold to cut off the defective unit wiring sheet, and to cut off the substrate of the product sheet, and to simplify the assembly of the substrate. Replace the unit wiring board. C 0010) The invention of claim 3, wherein the present invention provides a method of replacing a unit wiring board of a spliced substrate according to claim 1 or 2, wherein the splicing wiring board is a flexible wiring board. [0011] According to the replacement method, when a plurality of flexible wiring boards are arranged in the same product sheet as a unit wiring board, even if the defective unit wiring board is contained in the product sheet, the defective unit wiring board can be easily replaced with a good product. Unit wiring board, good product sheet. Therefore, the flexible wiring board of the good product will not be discarded, and only the defective unit wiring board can be replaced and used. C 0012 ] Further, the invention contained in the patent application No. 4 provides the first, second or the A method for replacing a unit wiring board of a plurality of aggregate substrates, wherein a joint portion of the first via hole and the second via hole is removed from a circuit metal foil and a cap film formed on the interlayer wiring board. According to the replacement method, by removing the circuit metal foil and the cover film in the portion which is overlapped by the first via hole and the second via hole, the thickness variation of the pasted portion can be minimized. By this, it is possible to suppress improper transportation during installation of electronic components, and to cope with high-density mounting. C 0014 ] Further, the invention of claim 5 provides an aggregate substrate, and 8 201008414 replaces a defective unit wiring board existing in a product sheet in which a plurality of unit wiring boards are formed into a good unit wiring board. The product of the product is characterized in that the first guide hole formed in the peripheral portion of the unit wiring board of the product sheet and the second guide hole formed in the peripheral portion of the separately prepared fixture wiring board are positioned. The good unit wiring board is loaded into the product sheet to remove the area of the defective unit wiring board. * (0015) According to this configuration, when there is a defective unit wiring board in the product sheet in which a plurality of unit wiring boards are formed, the defective unit is cut off in a region where the first conductive hole formed in the product sheet is not included. The wiring board"* takes out the shape of the unit wiring board portion from the other product sheet and has the same shape as the non-negative clamping wiring board. * - The good unit wiring board having the second guiding hole for positioning. Then, the first guiding hole is made on one side. When the second conductive via is aligned, the good unit wiring board is placed in the area where the defective unit wiring board is cut and removed, whereby the defective unit wiring board can be replaced with the good unit wiring board on the product sheet with high positional accuracy. Therefore, it is not necessary to discard the discarded product sheets, and it is possible to replace only the defective unit wiring boards. * In order to be suitable for high-density mounting, the defective unit wiring boards in the product sheets can be replaced with high precision. Further, the invention of claim 6 provides a collecting substrate in which each unit wiring board is placed on the above-mentioned product sheet so as to be loaded on the adjacent sheet. The mounting directions of the electronic components of the bit wiring board are opposite to each other, and the joint portions extending from the unit wiring board are mutually in the same direction, and when one of the unit wiring boards is a defective unit wiring board, the defective unit wiring board is replaced with In addition, a good product unit wiring board is prepared, and the product sheet is improved; and the upper and lower 201008414 reverses the direction of the good unit wiring board to form the first guide hole formed in the peripheral portion of the unit wiring board of the product sheet and is formed in the good product. Positioning the second guide hole in the peripheral portion of the unit wiring board, and inserting the good unit wiring board into the product sheet to remove the defective unit wiring board. [0017] According to this configuration, when a plurality of unit wiring boards are formed in the product sheet The shape of the unit wiring board and the joint portion is the same as that of the adjacent unit wiring boards, and the mounting direction of the electronic components is opposite to each other between the adjacent unit wiring boards. In this configuration, the product sheet is plural. When one of the unit wiring boards is a defective unit wiring board, it is cut off from another product sheet to prepare electricity. The mounting direction of the sub-parts is a good unit wiring board in the opposite direction to the unit wiring board. Then, the direction of the good unit wiring board is reversed, so that the first guiding hole of the pre-product sheet is bonded to the good unit wiring board. The second guide hole of the portion is aligned, and the good unit wiring board is loaded into the product sheet to cut off the area of the good unit wiring board. Thereby, (1) one metal can be punched out of the metal mold, and the defective unit wiring board is performed. Since the cutting of the product sheet and the preparation of the good unit wiring board are performed from the cutting of another product sheet, the replacement work of the defective unit wiring board in the product sheet can be reduced. C 0018 ] Further, the patent application section 7 The present invention provides a concentrating substrate according to claim 5 or 6, wherein the m-position wiring board is a flexible wiring board. C 0019] According to this configuration, a plurality of flexible wiring boards are arranged in the same product sheet as In the case of a plurality of unit wiring boards, even if the product sheet 10 201008414 contains a defective unit wiring board, the defective unit wiring can be easily used. Therefore, the board is replaced with a good unit wiring board, and the product sheet is improved. Therefore, even if the defective unit wiring board is contained in the product sheet, the defective unit wiring board can be easily replaced with a good unit wiring board, and the product sheet is improved. Even if the defective unit wiring board is included, the discarded product sheet will not be discarded, and only the defective unit wiring board can be replaced and used. [Invention Effect] [0020] According to the present invention, it is possible to perform poorly on the product sheet with high positional accuracy. Since the m-position wiring board is replaced with a good unit wiring board, it is easy to make a thin product sheet that has been discarded in the past. Further, in order to be suitable for high-density mounting, the unit wiring board can be replaced with high positional accuracy. [Embodiment] [Best Mode for Carrying Out the Invention] [0021] The present invention provides a method for replacing a defective unit wiring board of a spliced substrate, which is a defective unit existing in a product sheet in which a plurality of unit wiring boards are formed The wiring board is replaced with a good unit wiring board, and the unit wiring board in the product sheet is fully improved, and the method includes the following steps: the first step of forming the first guiding hole for positioning in the product sheet to the unit wiring board The cutting portion of the peripheral portion: the second step, in the region not including the first guiding hole, cutting off the defective unit wiring board from the product sheet: In the third step, the unit wiring board portion is prepared by cutting off another product sheet The shape is in the shape of 201008414 which is the same shape as the bad tandem wiring board, and has a good unit wiring board for positioning the second guiding hole; in the fourth step, the first guiding hole and the second guiding hole are aligned, and the good unit wiring board is arranged Inserting into the product sheet to cut off the area of the defective unit wiring board; and in the fifth step, fixing the circumference of the first guiding hole and the second guiding hole by means of bonding Area. [0022] Hereinafter, an embodiment of a method for replacing a defective unit wiring board according to the present invention will be described in detail with reference to Figs. [Embodiment 1] [0023] Fig. 1 is a plan view of a slab that is suitable for use in the present invention. As shown in the figure, the product sheet 1 is formed by continuously forming a plurality of unit wiring boards 2 in an elongated shape to constitute a collecting substrate. By forming the product sheet into a collecting substrate by such a configuration, electronic components and the like can be automatically and continuously mounted to the respective unit wiring boards 2 by a plug-in machine or the like. Therefore, when there is a defective unit wiring board (not shown) in the plurality of positioning wiring boards 2 formed on the product sheet 1, the defective unit wiring board must be removed and replaced with a separately prepared good unit wiring board (not Graphic). Moreover, the gathering plate is not limited to the elongated shape as shown in FIG. 1, and can also be applied to a flat sheet-like aggregate substrate. [0024] Fig. 2 is a process diagram showing the first step of the method for replacing the defective wiring board of the collective rocking plate according to the first embodiment of the present invention. That is, Fig. 2 shows a state in which one unit wiring board 2 is disposed in a portion of the article sheet 1 shown in Fig. 1. Further, Fig. 3 is a process chart showing the second step of the method of replacing the defective unit wiring board of the aggregate substrate of the first embodiment of the present invention. That is, FIG. 3 shows a state in which the defective unit wiring board 2b is removed and the defective unit wiring board 2a is replaced when the unit wiring board 12 201008414 2 in the product sheet 1 shown in FIG. 2 is a defective unit wiring board 2b. . Further, the circle 4 is a process chart showing the third step of the method of replacing the defective unit wiring board of the aggregate substrate of the first embodiment of the present invention. That is, Fig. 4 shows a defective unit wiring board replacement state in which the defective unit wiring board 2b is replaced with the product sheet 1 of the good unit wiring board 2a by the step of Fig. 3. [0025] According to the process circle of FIG. 2圃3 and FIG. 4, as shown in FIG. 1, the flexible substrate which belongs to the plurality of unit wiring boards 2 and is printed on the same product sheet 1 exists in the product sheet 1 In the case of a defective unit wiring board, a method of replacing the defective unit wiring board with a separately prepared good unit wiring board and a good product sheet 1 will be described. [0026] First, as shown in Fig. 2, the product sheet 1 is depicted in a state in which the unit wiring board 2 is formed inside the dicing portion 3 as indicated by a broken line region. Further, the positioning guide holes 4a, 4b are provided in the cutting portion 3 of the product sheet 1. Here, when the unit wiring board 2 is a defective unit wiring board, the unit wiring board 2 in the area indicated by the broken line is cut and removed. The product shape without the guide holes 4a, 4b is punched out. At this time, the unit wiring board 2 is cut and removed in a state where the joint portions 6a and 6b are attached to the unit wiring board 2 side. [0027] Next, as shown in Fig. 3, the separation dicing portion 3 and the defective unit wiring board 2b are cut, and the separately prepared good unit wiring board 2a is placed in the internal cavity portion of the dicing portion 3. In other words, the good unit wiring board 2a which is cut by the shape including the guide portions 7a and 7b having the guide holes 4a1 and 4b1 and the defective unit wiring board 2b which has been previously punched out and 13 201008414 is cut, and the cut portion is cut. The via holes 4a, 4b of the third embodiment are aligned with the via holes 4a1, 4b1 of the good unit wiring board 2a, and match the internal cavity portion of the dicing portion 3, and the good unit wiring board 2a is bonded. At this time, the bonding of the good unit wiring board 2a is performed by applying a resinous adhesive to the guiding portions 7a and 7b of the unit wiring board 2a, and bonding to the cutting unit 3, [0028]. As shown in FIG. 4, the good position wiring board 2a is bonded to the inner cavity portion of the dicing part 3, and the clamp wiring board in the product sheet 1 is all good. Here, the portions 7a, 7b of the good unit wiring board 2a and the portions of the splicing portion 3 are generated, and the thickness is not increased more than the other regions (that is, the inner cavity portion of the splicing portion 3 is loaded. The location of the product wiring board 2a is large. C 0029 ] Fig. 5 is a cross-sectional view taken along line A - A of the product sheet 1 shown in Fig. 4. Further, since the unit wiring board 2 is continuously formed on the product chip 1 as shown in FIG. 1, FIG. 5 shows a region in which the product unit wiring board 2a is placed in the product sheet 1 shown in FIG. The adjacent area (not shown) is a cross-sectional view showing the state of the unit wiring board 2 belonging to the installation position wiring board. C 0030 ) As shown in the cross-sectional view of FIG. 5 , the product sheet 1 is a double-sided mounting substrate, and the unit wiring boards 2 existing in adjacent regions form circuit metal foils 12 a — 1 and 12 b on both sides of the insulating base 11 - 1 . Further, the cover films 13a-1, 13b-1 are further coated on the respective surfaces. Similarly, the newly replaced good unit wiring board 2a is also double-mounted, and the 11-way gold foils 1 2a-2 and 12b-2 are formed on the two sides of the insulating base 11·2, and the cover film 13a is further coated. 2, 13b-2 on each surface. 201008414 [0031] Here, in order to make the height of the hard wiring board 2 existing in the adjacent area and the newly replaced good unit wiring board 2a in the thickness direction, the insulating base of the unit wiring board 2 existing in the adjacent area is formed. 1 1 · 1 is the same height as the thickness of the insulating base 11-2 of the new unit wiring board 2a. At this time, since the joint portion 6a1 of the newly replaced good unit wiring board 2a is extended by the insulating base 11-2 of the good unit wiring board 2a, the joint portion 6a1 of the good unit wiring board 2a is slightly bent, and is attached to the front end. The part of the guide portion 7a (see Fig. 3) is closely attached to the upper surface of the insulating base 11-U of the unit wiring board 2 existing in the adjacent area, that is, the cut portion 3) of the product sheet 1. Of course, at this time, the via hole 4a 1 of the good unit wiring board 2a is aligned with the via hole 4a of the dicing portion 3 - of the adjacent product sheet 1 and is closely adhered to each other (that is, the insulating base 11-1 of the unit wiring board 2). And the guiding portion 7a) of the good unit wiring board 2a. [0032] Thereby, as shown in FIG. 5, the height of the unit wiring board 2 originally existing in the adjacent area and the newly replaced good unit wiring board 2a can be made uniform. In the case where the position wiring board 2 and the good unit wiring board 2a are also slightly inconsistent in height, it is preferable to guide the good unit wiring board 2a in the case where the thickness is affected by the mounting of the parts or the like. 7a and 7b are set in areas where they are not affected as much as possible. [Embodiment 2] [0033] In the first embodiment, the punched shape of the unit wiring board (i.e., the defective unit wiring board 2b of Fig. 3) before replacement and the unit wiring board after replacement (i.e., Fig. 201008414 3 The case where the shape of the good unit wiring board 2a) is different will be described. However, in the second embodiment, the unit wiring board (defective unit wiring board) before replacement can be realized in the same punched shape by changing the direction of the good unit wiring board. The shape of the unit wiring board (good product wiring board) after replacement is explained. [0034] Fig. 6 is a process chart showing the first step of the method for replacing the edge wiring board of the aggregated board according to the second embodiment of the present invention. That is, Figure 6 shows the inclusion of adjacency
之彼此單位配線板12、12b及接合部13a、13b之全體形狀相 A ❿ 同，且在鄰接之彼此單位配線板1 2、1 2b成零件安裝方向（圖 之大箭號方向）相反之形狀時，除去相鄰不良單位配線板1 2b 之步驟。又，圖7係顯示有關本發明责施例2之聚集基板之 單位配線板更換方法之第二步驟之製程圖。亦即，圖7顯示 _ 循著於圖6之第一·步驟中自製品薄片1丨除去不设單位配線板 - 1 2b之痕跡將良品單位配線板1 2a裝入之步驟》進而，圖8 係顯示有關本發明實施例2之聚集越板之單位配線板更換方 法之第三步驟之製程圖。亦即，圖8顯示藉圖7之第二步驟 D 製品薄片1 1之不良單位配線板換裝成良品單位配線板1 2a 之狀態· 〔0035〕 首先，如圓6所示，於製品薄片1 1中，包含鄰接之彼此 單位配線板12、12b及接合部13a、13b之全體形狀相同，且 鄰接之單位配線板12、12b作成電子零件之安裝方向彼此相 反之構成。亦即，單位配線板1 2與鄰接之單位配線板（在此 爲不良單位配線板12b)之各個接合部13a，13b之形狀相冏， 零件之安裝方向（圖之大箭號方向）相反。又，於單位配線板 16 201008414 12及相鄰之不良單位配線板12b中各個接合部Ha、13b之前 端部分分別形成導孔14a、14b。又在相對於接合部13a、13b 而與導孔1 4a、1 4b對稱之位置之製品薄片1 1的面上形成導 孑 1 5 a、1 5 b 〇 [0036) 雖然於如圖6所示之製品薄片11中，圖右側之單位配線 板1 2係良品單位配線板，惟由於鄰接於圖左側之單位配線板 卻係不良單位配線板12b，因此，衝裁除去該不良單位配線 ® 板12b以及連接於該不良單位配線板12b之接合部13a、13b。 C 0037 ] 然後，如圖7所示，自另一製品薄片（未圖示）取出零件 - 安裝方向（圖之大箭號方向）與圖6中衝裁除去之不良單位配 . 線板1 2b相反之良品單位配線板1 2a，使該良品單位配線板 12a之零件安裝方向（圖之大箭號方向）成與如圖6設置之不良 單位配線板1 2b之零件安裝方向（圖之大箭號方向）相同之方 0 向（亦即，如圖之箭頭之方向將良品單位配線板1 2a旋轉1 80 度），將該良品單位配線板12a嵌入製品_片11之不良單位 配線板12b除去之部分。 〔0038〕 然後，使良品單位配線板1 2a之接合部1 3之導孔14a與 預先於製品薄片11上開設之導孔1 5a對位，使良品單位配線 板1 2a之接合.部1 3之導孔1 4b與製品范片丨1側之導孔1 5b 對位，以樹脂性黏接劑貼合。如此，將不良單位配線板12b 更換成良品單位配線板1 2a而黏貼於製品薄片1 1。 〔0039〕 17 201008414 藉此，如圖8所示，嵌入製品薄片1 1之圖視左側之良品 取位配線板12a之零件安裝方向（圖之大箭號方向）與屬於圖 視右側之原良品單位配線板之單位配線板丨2之零件安裝方 向（圖之大箭號方向）逆向配置*製品薄片1 1內之單位配線板 全數成爲良品。如此，藉由改變製品薄片1 1內相鄰諸單位配 線板之零件安裝方向，可將單位配線板之衝裁金屬模統一爲 一種。 〔0040〕 在此，於圖6至圖8中雖然耶位配線板1 2若旋轉丨8(Γ 即成相同形狀之事例，不過，在各單位配線板雖旋轉丨8(Τ卻 不成相同形狀情況下，可組合兩個眾位配線板，形成一旋轉 180°即成相同形狀之單位，於任一個單位配線板不良情況 下，統一更換兩個。例如，於圖9中，個別單位配線板1 2-1、 12-2呈台形形狀，雖然各旋轉18(Γ不成相同形狀，不過，藉 由組合兩個，旋轉180°即成相同形狀。 〔004 1〕 且，寅施例2之情形亦如同關5所术苡施例1之惜形， 可使相鄰區域原已存在之單位配線板1 2與新更換之良品舉 位配線板12a之高度一致。亦即，寅施例1之圖4之Α_Α截 面圖與圖5相同，圖8之Β-Β截ifii圖如圖5所示，良品單位 配線板12a之接合部13之之導孔14a及形成於製品薄片11 之導孔1 5a之接合部分如圖5所示，納入皮品單位配線板1 2a 之高度範圍內。 [0042〕 又由於在實施例1、2中，可如圖5所示，藉由於導孔除 18 201008414 去定位貼合重叠部分（圖5之導引部7a)之電路金屬箔12a-2、 12卜2及蓋膜13a-2、13b-2，將定位貼合重敷部分之厚度改變 抑至最小限度，因此，可抑制電子零件安裝時之搬送不當等。 C 0043〕 且於實施例1、2中，雖然假設導孔爲貫通孔，將導銷插 入此導孔而定位*惟若可使用透視而讀取良品單位配線板之 導孔及製品薄片之導孔之定位裝置（例如X射線相機），導孔 ^ 即不限於貫通孔，例如可爲在電路形成時一起形成於金屬箔 ❹ 之標記等。於此情況下，可不將定位貼合重疊部分與導孔設 於同一處。 〔0044〕 ' 又，就實施例1中，黏接裁接部3與更換之良品單位配 • 線板2a之區域部之方法而言，雖然將樹脂性黏接劑塡充於導 孔周邊區域，惟不限於此，亦可爲使蠘等材料流入導孔（或可 爲其他孔）而固定之方法•於實施例2中，當然亦可使蠘等材 〇 料流入導孔而固定。 〔0045〕 以上雖然針對有關本發明之聚集基板之單位配線板更換 方法說明兩實施例，惟本發明不限於此等實施例，在未逸脫 本發明之精神下’可作種種改變，且當然本發明涵蓋該改變。 201008414 〔圖式簡單說明〕 〔0046〕 圖1係適用於本發明之聚集蕋板之俯視圖。 圖2係有關本發明第一實施例之聚集基板之單位配線板 更換方法之第一步驟之製程圖。 圖3係有關本發明第一實施例之聚集蕋板之單位配線板 更換方法之第二步驟之製程圖。 圖4係有關本發明第一實施例之聚集基板之單位配線板 更換方法之第三步驟之製程圖。 圖5係圔4所示製品薄片之A-A截面圖。 圖6係有關本發明第二實施例之聚集骓板之單位配線板 更換方法之第一步驟之製程圖。 圖7係有關本發明第二實施例之聚集越板之單位配線板 更換方法之第二步驟之製程圖。 圖8係有關本發明第二實施例之聚集驻板$單位配線板 更換方法之第三步驟之製程圖。 圖9係顯示有關本發明第二實施例之聚集基板之單位配 線板更換方法之第一步驟之其他形狀之製程圖。 20 201008414 〔主要元件代表符猇說明〕The overall shape of the unit wiring boards 12 and 12b and the joint portions 13a and 13b is the same, and the adjacent unit wiring boards 1 2 and 1 2b are in the opposite direction of the component mounting direction (the large arrow direction of the figure). In the case of removing the adjacent defective unit wiring board 1 2b. Further, Fig. 7 is a process chart showing the second step of the method of replacing the unit wiring board of the aggregate substrate of the second embodiment of the present invention. That is, FIG. 7 shows that the step of loading the good unit wiring board 12a from the product sheet 1丨 in the first step of FIG. A process chart showing a third step of the method for replacing the unit wiring board of the aggregated board according to the second embodiment of the present invention. That is, FIG. 8 shows a state in which the defective unit wiring board of the product sheet 11 is replaced with the good unit wiring board 1 2a by the second step D of FIG. 7 [0035] First, as shown by the circle 6, the product sheet 1 In the first embodiment, the unit wiring boards 12 and 12b and the joint portions 13a and 13b which are adjacent to each other have the same overall shape, and the adjacent unit wiring boards 12 and 12b are configured such that the mounting directions of the electronic components are opposite to each other. That is, the shape of each of the joint portions 13a and 13b of the unit wiring board 12 and the adjacent unit wiring board (here, the defective unit wiring board 12b) is opposite to each other, and the mounting direction of the components (the large arrow direction of the figure) is reversed. Further, via holes 14a and 14b are formed in the front end portions of the respective joint portions Ha and 13b of the unit wiring board 16 201008414 12 and the adjacent defective unit wiring board 12b. Further, guides 1 5 a, 1 5 b 〇 [0036) are formed on the surface of the product sheet 11 at a position symmetrical with the guide holes 14a, 14b with respect to the joint portions 13a, 13b, although as shown in Fig. 6. In the product sheet 11, the unit wiring board 12 on the right side of the drawing is a good unit wiring board. However, since the unit wiring board adjacent to the left side of the drawing is a defective unit wiring board 12b, the defective unit wiring board 12b is punched and removed. And the joint portions 13a and 13b connected to the defective unit wiring board 12b. C 0037 ] Then, as shown in Fig. 7, the part-mounting direction (the direction of the large arrow in the figure) is taken out from another product sheet (not shown) and the defective unit is removed by punching in Fig. 6. The wire board 1 2b On the contrary, the good unit wiring board 1 2a is such that the component mounting direction of the good unit wiring board 12a (the large arrow direction of the figure) is the component mounting direction of the defective unit wiring board 1 2b provided as shown in FIG. 6 (the large arrow of the figure) The direction of the direction is the same as the zero direction (that is, the good unit wiring board 12a is rotated by 180 degrees in the direction of the arrow), and the good unit wiring board 12a is embedded in the defective unit wiring board 12b of the product_sheet 11 Part of it. [0038] Then, the guide hole 14a of the joint portion 13 of the good unit wiring board 1 2a is aligned with the guide hole 15 5 previously formed in the product sheet 11, and the joint unit wiring board 1 2a is joined. The guide hole 14b is aligned with the guide hole 15b on the side of the product sheet 丨1, and is bonded with a resinous adhesive. In this manner, the defective unit wiring board 12b is replaced with the good unit wiring board 12a and adhered to the product sheet 11. [0039] 17 201008414 Thereby, as shown in FIG. 8, the image of the embedded product sheet 1 is viewed from the left side of the good product receiving wiring board 12a in the component mounting direction (the large arrow direction of the figure) and the original product belonging to the right side of the figure. The unit wiring direction of the unit wiring board 丨2 of the unit wiring board (the direction of the large arrow in the figure) is reversed. * The unit wiring board in the product sheet 1 1 is a good one. Thus, the punching metal mold of the unit wiring board can be unified into one type by changing the mounting direction of the components of the adjacent unit wiring boards in the product sheet 11. [0040] Here, in FIG. 6 to FIG. 8, although the Yer wiring board 1 2 is rotated by 丨 8 (Γ is an example of the same shape, the unit wiring board is rotated by 丨 8 (Τ does not have the same shape). In this case, the two panel panels can be combined to form a unit that rotates 180° into the same shape. In the case of any unit wiring board failure, two are replaced uniformly. For example, in Figure 9, the individual unit wiring board 1 2-1, 12-2 have a trapezoidal shape, and although each rotation is 18 (the same shape is not formed, by combining two, the rotation is 180° to form the same shape. [004 1] Moreover, the case of the embodiment 2 It is also the same as the case of the fifth embodiment, which can make the unit wiring board 12 existing in the adjacent area coincide with the height of the newly replaced good-purpose wiring board 12a. That is, the embodiment 1 4 is the same as FIG. 5, and the if-Β ifif diagram of FIG. 8 is shown in FIG. 5, the via hole 14a of the joint portion 13 of the good unit wiring board 12a, and the via hole 1 formed in the product sheet 11 The joint portion of 5a is as shown in Fig. 5, and is included in the height range of the leather unit wiring board 12 2a. [0042] In the first and second embodiments, as shown in FIG. 5, the circuit metal foils 12a-2, 12b and 2 of the overlapping portion (the guiding portion 7a of FIG. 5) are positioned by the guide holes in addition to 18 201008414. The films 13a-2 and 13b-2 minimize the thickness change of the positioning and bonding re-engaging portion, so that it is possible to suppress improper conveyance during mounting of the electronic component, etc. C 0043] and in the first and second embodiments, It is assumed that the guide hole is a through hole, and the guide pin is inserted into the guide hole to be positioned. * If the guide hole of the good unit wiring board and the guide hole of the product sheet can be read by using the perspective (for example, an X-ray camera), the guide hole That is, it is not limited to the through holes, and may be, for example, a mark formed on the metal foil 一起 at the time of circuit formation. In this case, the positioning and overlapping portions may not be provided at the same place as the guide holes. [0044] ' Also, In the first embodiment, in the method of bonding the dicing portion 3 and the region portion of the replacement unit unit to the wiring board 2a, the resin adhesive is immersed in the peripheral region of the guide hole, but is not limited thereto. It can also be fixed for the material such as helium to flow into the guide hole (or can be other holes). In the second embodiment, it is of course possible to cause the crucible material to flow into the guide hole and fix it. [0045] Although the two embodiments of the unit wiring board replacement method relating to the aggregate substrate of the present invention are described above, the present invention does not The invention is limited to the embodiments, and various changes may be made without departing from the spirit of the invention, and the invention is of course covered by the invention. 201008414 [Simplified illustration] [0046] FIG. 1 is a composite raft suitable for use in the present invention. Figure 2 is a process diagram of a first step of a method for replacing a unit wiring board of a collecting substrate according to a first embodiment of the present invention. Figure 3 is a diagram of a method for replacing a unit wiring board of a collecting board according to a first embodiment of the present invention. The process map of the second step. Fig. 4 is a process view showing the third step of the method of replacing the unit wiring board of the collecting substrate according to the first embodiment of the present invention. Figure 5 is a cross-sectional view taken along line A-A of the product sheet shown in Figure 4. Fig. 6 is a process view showing the first step of the method of replacing the unit wiring board of the aggregated raft according to the second embodiment of the present invention. Fig. 7 is a process diagram showing the second step of the method of replacing the unit wiring board of the gathering board according to the second embodiment of the present invention. Fig. 8 is a process diagram showing the third step of the method of replacing the slab-and-stacking unit wiring board according to the second embodiment of the present invention. Fig. 9 is a process view showing another shape of the first step of the method of replacing the unit wiring board of the concentrating substrate of the second embodiment of the present invention. 20 201008414 [Main component representative symbol description]
1 ' 1 1 製品薄片（聚集基板） 2、12 單位配線板 2a 、 12a 良品單位配線板 2b ' 12b 不良單位配線板 3 裁接部 4a 、 4b 、 4al 、 4b 1 導孔 14a、14b、15a 、15b 導孔 5 製品外形衝裁區域 6a 、 6b 、 6al 、 6b 1接合部 13a 、 13b 接合部 7a ' 7b 導引部 11-1 、 11-2 絕緣底座 12a-l ' 12b-l 電路金屬箔 12a-2 ' 12b-2 電路金屬箔 13a-l 、 13b-l 蓋膜 13a-2 、 13b-2 蓋膜 211 ' 1 1 product sheet (aggregate substrate) 2, 12 unit wiring board 2a, 12a good unit wiring board 2b ' 12b defective unit wiring board 3 dicing portions 4a, 4b, 4al, 4b 1 guide holes 14a, 14b, 15a, 15b guide hole 5 product outline punching area 6a, 6b, 6al, 6b 1 joint portion 13a, 13b joint portion 7a ' 7b guide portion 11-1, 11-2 insulating base 12a-1' 12b-1 circuit metal foil 12a -2 ' 12b-2 circuit metal foil 13a-l, 13b-1 cover film 13a-2, 13b-2 cover film 21