CN105611746A - Method of replacing unit wiring board of aggregate board, and aggregate board - Google Patents
Method of replacing unit wiring board of aggregate board, and aggregate board Download PDFInfo
- Publication number
- CN105611746A CN105611746A CN201610091931.6A CN201610091931A CN105611746A CN 105611746 A CN105611746 A CN 105611746A CN 201610091931 A CN201610091931 A CN 201610091931A CN 105611746 A CN105611746 A CN 105611746A
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- Prior art keywords
- assembly circuit
- assembly
- circuit plate
- circuit board
- qualified
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
To replace a defective unit wiring board with a good unit wiring board with good positional accuracy to convert an aggregate board to a good one, in a thin and flexible FPC applied to a high-density mounting board or the like. When a defective unit wiring board 2b is included in a product sheet 1, a scrap part 3 and the defective unit wiring board 2b are cut and separated from each other, and a separately-prepared good unit wiring board 2a is incorporated in a cavity part in the scrap part 3. That is to say, the good unit wiring board 2a including guide parts 7a, 7b having guide holes 4a1, 4b1, wherein a region other than them is cut into the same shape as that of the defective unit wiring board 2b is used, guide holes 4a, 4b and the guide holes 4a1, 4b1 are positioned with respect to each other, and the good unit wiring board 2a is incorporated in line with the cavity part in the scrap part 3. A resin adhesive is applied to regions of the guide parts 7a, 7b of the good unit wiring board 2a to stick the good unit wiring board 2a to the scrap part 3 of the product sheet 1 to be fixed.
Description
The present invention is that the denomination of invention of applying on August 5th, 2009 is the " group of assembly substratePart circuit replacement method and assembly substrate " No. 200910161857.0 patent of invention ShenDivisional application please.
Technical field
The present invention relates to the set of the multiple assembly circuit plates of alignment laminating on same goods sheetThe assembly circuit plate replacement method of substrate, and assembly substrate, in particular, the present invention relates toIn same goods sheet, have in the assembly substrate of multiple assembly circuit plates, will be positioned at goods sheetThe defective assembly circuit plate of inside replace with qualified assembly circuit board, make this article assemblyReplacement method and the assembly substrate of the assembly circuit plate in the assembly substrate of qualifiedization.
Background technology
In the past, report has following various technology, and these various technology replies are by multiple groupsIn the assembly substrate that part circuit board forms, there is the occasion of defective assembly circuit plate. Such as,Disclose following technology, wherein, be the multiple electrical component of alignment laminating on same goods sheetIn the assembly substrate of road plate, while there is defective assembly circuit plate, carry out parts automaticallyThe occasion of installing, according to the parts that do not carry high price on above-mentioned defective assembly circuit plateMode is carried out defective demonstration, by modes such as image recognitions, to this defective assembly circuitPlate reads processing, removes this defective assembly circuit plate, only at qualified assembly circuitOn plate, carry out parts installation (such as, with reference to patent documentation 1). But, remove that this is defectiveAssembly circuit plate, carrying out parts installation this point is the master who makes the productivity variation of installation exerciseWant reason. So, be the set of the multiple assembly circuit plates of alignment laminating on same goods sheetIn substrate, while there is defective assembly circuit plate more than specified quantity, do not adopting this systemDiscarded in the situation of product sheet entirety. Particularly do not there is this defective electrical component of identification in employingThe apparatus for mounting component of the low price of the mechanism of road plate, the occasion of carrying out parts installation, evenBe 1, exist the goods sheet of defective assembly circuit plate still to discard, be all onlyThe goods sheet upper mounting component of qualified assembly circuit board. But, locating of such goods sheetIn reason method, discard the goods sheet that comprises multiple qualified assembly circuit boards, consequently,Become the main cause of the cost rising of board production.
In addition, also disclose the goods sheet from being arranged with continuously assembly circuit plate, replaceDefective assembly circuit plate, make goods sheet be qualified technology (such as, with reference to patent documentation2). According to this technology, be to be arranged with continuously on goods sheet the set base of circuit layout portionIn plate, can be by adopting detent mechanism, substrate fixed mechanism and bonding agency, accuratelyEngage and fixedly removed defective circuit layout portion, print normal circuit layout portion separatelyOne assembly circuit plate. In addition also disclose from showing multiple assembly circuit plates according to several rows of,Assembly substrate on, replace defective assembly circuit plate technology (such as, with reference to patent literary compositionOffer 3). But, in the technology of above-mentioned patent documentation 2,3, by the assembly circuit of replacingPlate is embedded in the regulation position of assembly substrate, or at the side end of the assembly circuit plate having embeddedSpace in fill bonding agent, be fixed.
In addition, also disclose framework, scrap portion from assembly substrate, get rid of defectiveOn the marking of assembly circuit plate, embed qualified assembly circuit board, the technology engaging by bridge joint(such as, with reference to patent documentation 4). In addition, also disclose by loading and unloading multiple electrical componentThe divergence type bridge joint of road plate, is installed on goods sheet frame, from wherein only taking off defective groupPart circuit board, replaces with qualified assembly circuit board, thus, uses flexibly at present discardedThe technology of qualified assembly circuit board (such as, with reference to patent documentation 5). In addition also disclose,Combination at bridge part by bonding agent and after replacing with qualified assembly circuit boardMethod (such as, with reference to patent documentation 6). But, due to above-mentioned patent documentation 4,5,6Technology all connect by the side wall of assembly circuit plate, or be embedded in the mode on frameworkEmbed, thus be only only applicable to adopt the hard printed circuit board with thickness to a certain degree,There is the occasion of the framework of rigidity, can not be used for the thin flexible flexible PCB that has(FlexiblePrintedCircuit is called " FPC " below). Further, due to because ofIn recent years the densification that parts are installed, positional precision increasingly stringent, replaces and is positioned at goods sheetInterior defective assembly circuit plate and the occasion of qualified assembly circuit board, necessarily require to eliminate thinThe replacement technology of micro-positional precision.
Patent documentation 1: Japanese kokai publication hei 11-191668 document
Patent documentation 2: TOHKEMY 2000-252605 document
Patent documentation 3: Japanese kokai publication hei 10-247656 document
Patent documentation 4: Japanese kokai publication sho 64-48489 document
Patent documentation 5: TOHKEMY 2001-203482 document
Patent documentation 6: TOHKEMY 2005-38953 document
Summary of the invention
So, the object of the invention is to for thin, have flexible assembly circuit plate byThe assembly substrate of multiple settings, with good positional precision, to defective assembly circuit plate andQualified assembly circuit board is replaced.
The present invention proposes to achieve these goals, the invention described in technical scheme 1A kind of assembly circuit replacement method of assembly substrate is provided, in the method, will be positioned at formationThere is the defective assembly circuit plate in the goods sheet of assembly substrate of multiple assembly circuit plates to replaceBe changed to qualified assembly circuit board, it is characterized in that the method comprises the 1st operation, wherein,As the scrap portion of the assembly circuit plate peripheral part of goods sheet, form the 1st of location use and leadXiang Kong; The 2nd operation, wherein, in the region that does not comprise the 1st pilot hole, from goods sheetCut off and remove defective assembly circuit plate; The 3rd operation, wherein, assembly circuit plate portionShape is the shape identical with defective assembly circuit plate, and cuts off from another goods sheetAnd prepare qualified assembly circuit board, this qualified assembly circuit board is the 2nd leading of having location useRegion to hole cuts off; The 4th operation, wherein, enters the 1st pilot hole and the 2nd pilot holeRow contraposition, the region of defective assembly circuit plate has been removed in the cut-out in goods sheet, assemblingQualified assembly circuit board; The 5th operation, wherein, by bonding agency, by the 1st pilot holeFix with the neighboring area of the 2nd pilot hole.
According to this replacement method, be to be formed with multiple assembly circuit plates goods sheet in, there is the occasion of defective assembly circuit plate in portion, do not comprise be formed at this goods sheet inThe region of the 1st pilot hole of portion, cuts off and removes defective assembly circuit plate. Then, assemblyThe shape of circuit board section is identical with defective assembly circuit plate, is comprising the 2nd of location useThe qualified assembly circuit board that the region of pilot hole cuts off takes out from another goods sheet. Then,In carrying out contraposition by the 1st pilot hole and the 2nd pilot hole, cutting off removal notThe region of qualified assembly circuit board, assembles qualified assembly circuit board. Thus, can be at goods sheetUpper, with good positional precision, defective assembly circuit plate is replaced with to qualified assembly circuitPlate is qualified therefore can easily make the goods sheet of discarding in the past. In addition, position that can be higherPut precision and replace assembly circuit plate, install to high-density to can be applicable to.
In addition, the invention described in technical scheme 2 provides a kind of defective assembly of assembly substrateCircuit board for replacing method, in the method, will be positioned at the collection that is formed with multiple assembly circuit platesThe defective assembly circuit plate closing in the goods sheet of substrate replaces with qualified assembly circuit board, makesWhole qualifiedization of the assembly circuit plate in this goods sheet, is characterized in that the method comprises1 operation, wherein, according to the installation that is equipped on the electronic unit on the assembly circuit plate of adjacencyDirection is mutually opposite direction, and the connecting portion extending from assembly circuit plate is separatelyPhase unidirectional mode each other, is arranged at each assembly circuit plate on goods sheet; The 2nd workOrder, wherein, when certain person in assembly circuit plate is defective assembly circuit plate, from goodsOn sheet, cut off the defective assembly circuit plate of removing including connecting portion; The 3rd operation, itsIn, the installation direction of preparing electronic unit from another goods sheet cut-out is and defective workThe qualified assembly circuit board of the direction that assembly circuit plate is contrary; The 4th operation, wherein, according toThe assembly circuit plate of adjacency on goods sheet relatively, the installation direction of electronic unit is contraryThe mode of direction, by certified products assembly circuit plate towards reversion, to being pre-formed in goodsThe 1st pilot hole in sheet and be formed at the 2nd guiding in the connecting portion of qualified assembly circuit boardContraposition is carried out in hole, and the region of defective assembly circuit plate has been removed in the cut-out in goods sheet,Assemble qualified assembly circuit board; The 5th operation, wherein, by bonding agency, leads the 1stNeighboring area to hole and the 2nd pilot hole is fixed.
According to this replacement method, be that the inside of goods sheet is formed with multiple assembly circuit platesTime, comprise shape phase between the assembly circuit plate of adjacency of assembly circuit plate and connecting portionWith, and the installation direction of electronic unit is mutually contrary between the assembly circuit plate of adjacencyDirection. In such scheme, certain person in the multiple assembly circuit plates in goods sheet isThe occasion of defective assembly circuit plate, the installation direction of electronic unit and this defective electrical componentThe qualified assembly circuit board of the opposite direction of road plate cuts off and prepares from another goods sheet. Connect, by this qualified assembly circuit board towards reversion, by be pre-formed on goods sheetIt is right that 1 pilot hole and the 2nd pilot hole of connecting portion that is formed at qualified assembly circuit board carry outPosition, the region of defective assembly circuit plate has been removed in the cut-out in goods sheet, assembles this and closesLattice assembly circuit plate. Thus, owing to can adopting a kind of stamped metal mould, carry out relative goodsThe cut-out of the defective assembly circuit plate of sheet is removed, with the qualified assembly of relative another goods sheetThe cut-out of circuit board, preparation, replace operation therefore can simplify the assembly circuit plate of assembly substrate.
In addition, the invention described in technical scheme 3 provides the set described in technical scheme 1 or 2The assembly circuit plate replacement method of substrate, is characterized in that said modules circuit board is flexible electricalRoad plate.
According to this replacement method, be the inside of same goods sheet, multiple flexible PCBs are doneFor the occasion that assembly circuit plate is arranged, even in the inside of this goods sheet, comprise defectiveIn the situation of assembly circuit plate, it is qualified still can easily this defective assembly circuit plate to be replaced withAssembly circuit plate, it is qualified making goods sheet.
So not discarded qualified flexible PCB, can be only to defective assembly circuit plateReplace and utilize.
In addition, the invention described in technical scheme 4 provides described in technical scheme 1,2 or 3The assembly circuit plate replacement method of assembly substrate, it is characterized in that at above-mentioned the 1st pilot hole andIn the bonding part of above-mentioned the 2nd pilot hole, remove the electricity being formed on said modules circuit boardRoad metal forming and cover film.
According to this replacement method, positioning by the 1st pilot hole and the 2nd pilot holeThe part of the coincidence of laminating, can remove electric circuit metal paper tinsel and cover film, thus, and can be by subsidesThe situation that the thickness of the intersection of closing changes is suppressed at Min.. Thus, can suppress electricityWhen the installation of subassembly, transport fault etc., and can tackle high-density installation.
In addition, the invention described in technical scheme 5 provides a kind of assembly substrate, wherein, is positioned atBe formed with the defective assembly circuit in the goods sheet of assembly substrate of multiple assembly circuit platesPlate replaces with qualified assembly circuit board, makes this qualifiedization of goods sheet, it is characterized in that by systemBeing formed at the 1st pilot hole on assembly circuit plate peripheral part and being formed at list in product sheetThe 2nd pilot hole on the peripheral part of the qualified assembly circuit board of solely preparing positions,The deletion region of the defective assembly circuit plate in goods sheet, assembles qualified assembly circuit board.
According to this scheme, be the inside of the goods sheet that is formed with multiple assembly circuit plates, depositIn the time of defective assembly circuit plate, do not comprising the 1st the leading of inside that is formed at this goods sheetTo the region in hole, cut off and remove defective assembly circuit plate. In addition, assembly circuit plate portionShape identical with the shape of defective assembly circuit plate, have location use the 2nd pilot holeQualified assembly circuit board take out from another goods sheet. In addition, passing through the 1st pilot holeWhen positioning with the 2nd pilot hole, remove defective assembly circuit plate in cut-outRegion, assemble qualified assembly circuit board. Thus, due on goods sheet, can be goodPositional precision, be qualified assembly by defective component replace, therefore discarded discarded in the pastGoods sheet, can only defective assembly circuit plate be replaced and be used. In addition, canUse the defective assembly circuit plate in goods sheet with the positional precision replacement compared with high, so thatBe suitable for highdensity installation.
Further, the invention described in technical scheme 6 provides a kind of assembly substrate, wherein, according toThe installation direction that is equipped on the electronic unit on the assembly circuit plate of adjacency is mutually oppositeDirection, and the connecting portion phase unidirectional mode each other of extending from assembly circuit plate, eachAssembly circuit plate is arranged on goods sheet, and certain person in assembly circuit plate is defective assemblyWhen circuit board, this defective assembly circuit plate is replaced with to the qualified assembly circuit of independent preparationPlate, makes this qualifiedization of goods sheet, it is characterized in that by qualified assembly circuit board towards up and downReversion, by the 1st pilot hole on assembly circuit plate peripheral part that is formed in goods sheetThe 2nd pilot hole with being formed on the peripheral part of qualified assembly circuit board, positions,The removal region of the defective assembly circuit plate in goods sheet, assembles qualified assembly circuitPlate.
According to this scheme, be the inside of goods sheet, while forming multiple assembly circuit plate, bagThe shape of drawing together assembly circuit plate and connecting portion is identical between the assembly circuit plate of adjacency, andThe installation direction of electronic unit contrary direction each other mutually between the assembly circuit plate of adjacency.In such scheme, certain in the multiple assembly circuit plates in goods sheet is not for conforming toWhen lattice assembly circuit plate, cut off and the installation direction of preparation electronic unit from another goods sheetThe qualified assembly circuit board contrary with this defective assembly circuit plate. In addition, by this qualified clustersPart circuit board towards reversion, by the 1st pilot hole and the formation being pre-formed on goods sheetThe 2nd pilot hole on the connecting portion of qualified assembly circuit board carries out contraposition, in goods sheetThe cut-out region of having removed defective assembly circuit plate, assemble this qualified assembly wiring plate.Thus, owing to can adopting a kind of stamped metal mould, carry out the defective assembly of relative goods sheetThe cut-out of circuit board, removal, with the cut-out of the qualified assembly circuit board of relative another goods sheet,Preparing, is low price therefore can make the replacement operation of the defective assembly circuit plate in goods sheet.
Invention described in technical scheme 7 provides the assembly substrate described in technical scheme 5 or 6,It is characterized in that assembly circuit plate is flexible PCB.
According to this scheme, be the inside of same goods sheet, be arranged with multiple as electrical componentThe occasion of the assembly substrate of the flexible PCB of road plate, even in this goods sheet inside, compriseIn the situation of defective assembly circuit plate, still can easily this defective assembly circuit plate be replacedFor qualified assembly circuit board, make qualifiedization of goods sheet. So, even if comprising defective groupIn the situation of part circuit board, still can not discard qualified flexible PCB, only to defectiveAssembly circuit plate is replaced and is used.
According to the present invention, owing to can, on goods sheet, with good positional precision, not conforming toLattice assembly wiring plate replaces with qualified assembly circuit board, therefore can easily make the system of discarding in the pastProduct sheet is qualified. In addition, positional precision that can be higher, replaces assembly circuit plate, so thatCan be suitable for high-density installation.
Brief description of the drawings
Fig. 1 is the top view that is applicable to assembly substrate of the present invention;
Fig. 2 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 1The process chart of the 1st operation of method;
Fig. 3 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 1The process chart of the 2nd operation of method;
Fig. 4 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 1The process chart of the 3rd operation of method;
Fig. 5 is the cutaway view along the A-A line of the goods sheet 1 shown in Fig. 4;
Fig. 6 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 2The process chart of the 1st operation of method;
Fig. 7 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 2The process chart of the 2nd operation of method;
Fig. 8 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 2The process chart of the 3rd operation of method;
Fig. 9 is the assembly circuit plate replacement side that represents the assembly substrate of embodiments of the invention 2The process chart of another shape of the 1st operation of method.
Label declaration
Label 6a, 6b1 represent connecting portion;
Label 1-2 represents dielectric base.
Detailed description of the invention
The present invention relates to the defective assembly circuit replacement method of assembly substrate, in the methodIn, will be positioned at the defective assembly circuit plate of the goods sheet that is formed with multiple assembly circuit platesReplace with qualified assembly circuit board, making the whole of assembly circuit plate in this goods sheet is to closeLattice, the method comprises the 1st operation, wherein, at the assembly circuit plate periphery as goods sheetThe scrap portion of part, forms the 1st pilot hole of locating use; The 2nd operation, wherein, notComprise the region of the 1st pilot hole, cut off and remove defective assembly circuit plate from goods sheet;The 3rd operation, wherein, the shape of assembly circuit plate portion is and defective assembly circuit plate phaseWith shape, and from another goods sheet, cut off and prepare to have the 2nd of location use and leadTo the qualified assembly circuit board in hole; The 4th operation, wherein, leads the 1st pilot hole and the 2ndCarry out contraposition to hole, the region of having removed defective assembly circuit plate in the cut-out of goods sheet,Assemble qualified assembly circuit board; The 5th operation, wherein, by bonding agency, leads the 1stNeighboring area to hole and the 2nd pilot hole is fixed.
Adopt Fig. 1～Fig. 8 below, to the defective assembly circuit of assembly substrate of the present inventionThe embodiment of plate replacement method is specifically described.
Embodiment 1
Fig. 1 is the top view that is applicable to assembly substrate of the present invention. That shown in this figure of pictureSample, in goods sheet 1, is strip and is formed with continuously multiple assembly circuit plates 2, structureBecome assembly substrate. By the scheme by such, make goods sheet 1 form assembly substrate, byThis, can pass through insertion machine (insertmachine) etc., on each assembly circuit plate 2, continuouslyGround Auto-mounting electronic unit etc. Thus, in the multiple electrical component that are formed on goods sheet 1In road plate 2, there is the occasion of defective assembly circuit plate (not shown), must removeThis defective assembly circuit plate, replaces with the qualified assembly circuit board of independent preparation (in figure notIllustrate). In addition, assembly substrate is not limited to the such strip shown in Fig. 1, also canBe applicable to the assembly substrate of dull and stereotyped sheet.
Fig. 2 is the defective assembly circuit plate that represents the assembly substrate of embodiments of the invention 1The process chart of the 1st operation of replacement method.
, Fig. 2 is illustrated in a part for the goods sheet 1 shown in Fig. 1, arranges 1The state of assembly circuit plate 2. In addition, Fig. 3 is the set that represents embodiments of the invention 1The process chart of the 2nd operation of the defective assembly circuit plate replacement method of substrate. , Fig. 3The assembly circuit plate 2 that is illustrated in the goods sheet 1 shown in Fig. 2 is defective assembly circuit plateWhen 2b, remove this defective assembly circuit plate 2b, replace with another qualified assembly circuit boardThe state of 2a. In addition, Fig. 4 is not the conforming to of assembly substrate that represents embodiments of the invention 1The process chart of the 3rd operation of lattice assembly circuit plate replacement method. , Fig. 4 represents by figure3 operation, replaces with putting of qualified assembly circuit board 2a by defective assembly circuit plate 2bChange the state of the defective assembly circuit plate of goods sheet 1.
About as passing through shown in above-mentioned Fig. 1, be that on same goods sheet 1, alignment is pastedClose in the flexible base, board of multiple assembly circuit plates 2, in this goods sheet 1, have defective groupWhen part circuit board, this defective assembly circuit plate is replaced with to the qualified electrical component of independent preparationRoad plate, makes the method for goods sheet 1 qualifiedization, according to the process chart of Fig. 2, Fig. 3 and Fig. 4And describe.
First, shown in Fig. 2, goods sheet 1 is according to the inside in scrap portion 3,Be formed with at the state of the assembly circuit plate 2 shown in dashed region inside and form. In addition, existIn the scrap portion 3 of goods sheet 1, pilot hole 4a, the 4b of location use is set. Here, existWhen assembly circuit plate 2 is defective assembly circuit plate, cuts off to remove and comprise and being illustrated by the broken linesAssembly circuit plate 2 in region, and do not comprise the goods profile Stamping Area of pilot hole 4a, 4bTerritory 5. Now, be installed on the state of assembly circuit plate both sides at connecting portion 6a, 6b, cut offRemove this assembly circuit plate 2.
Then, shown in Fig. 3, cut off and separate scrap portion 3 and defective electrical componentRoad plate 2b, in the inner hollow part of this scrap portion 3, it is qualified that assembling is prepared separatelyAssembly circuit plate 2a. In other words, adopt and comprise the guide part with pilot hole 4a1,4b17a, 7b, the shape that the region beyond it is identical with the defective assembly circuit plate 2 of punching press in advanceThe qualified assembly circuit board 2a that shape cuts off, by pilot hole 4a, the 4b of scrap portion 3 and qualifiedThe pilot hole 4a1 of assembly circuit plate 2a, 4b1 contraposition, the inner hollow of aligning scrap portion 3Part, qualified assembly circuit board 2a fits. The laminating of qualified assembly circuit board 2a nowUndertaken by following manner, which is: at the guide part of qualified assembly circuit board 2aThe region of 7a, 7b, application of resin bonding agent, by bonding to itself and scrap portion 3.
Like this, shown in Fig. 4, in the inner hollow part of scrap portion 3, pasteQualified assembly circuit board 2a, the whole of the assembly circuit plate in goods sheet 1 are qualified. ?Here, design in the following manner, which is: at qualified assembly circuit board 2aGuide part 7a, 7b and scrap portion 3, produce overlap part, thickness is not more than otherRegion (, is assembled in the qualified assembly circuit board 2a's of the inner hollow part of scrap portion 3Region).
Fig. 5 is the cutaway view along the A-A line of the goods sheet 1 shown in Fig. 4. In addition, asShown in Fig. 1, according to the continuous mode of goods sheet 1, form assembly circuit plate 2,Thus, Fig. 5 represents to suppose in the region of the goods sheet 1 shown in Fig. 4, assembles qualified assemblyCircuit board 2a, in the adjacent region (not shown) of this goods sheet 1, exists as closingThe cutaway view of the state of the assembly circuit plate 2 of lattice assembly circuit plate.
Shown in the cutaway view of Fig. 5, goods sheet 1 is two-sided installation base plate, in placeIn the assembly circuit plate 2 in adjacent region, respectively on the two sides of insulated substrate 11-1,Form electric circuit metal layer 12a-1,12b-1, in addition, on corresponding surface, coating coversFilm 13a-1,13b-1. The qualified assembly circuit board 2a equally, newly replacing is also two-sidedInstallation base plate, respectively on the two sides of dielectric base 11-2, form electric circuit metal layer 12a-2,12b-2, in addition, on corresponding surface, coating cover film 13a-2,13b-2.
Here, in order to be positioned at assembly circuit plate 2 and new the closing of replacing in adjacent regionIn lattice assembly circuit plate 2a, make the height of thickness direction consistent, will be positioned at adjacent regionThe dielectric base 11-1 of assembly circuit plate 2 and the new qualified assembly circuit board 2a replacingThe height of the thickness direction of dielectric base 11-2 is consistent. Now, in new qualified clusters of replacingIn the connecting portion 6a1 of part circuit board 2a, be extended with the insulation base of qualified assembly circuit board 2aEnd 11-2, slightly by the connecting portion 6a1 bending of qualified assembly circuit board 2a, before being arranged atThe guide part 7a (with reference to Fig. 3) of end part with the mode closely bonding be equipped on be positioned at adjacentThe dielectric base 11-1's (, the scrap portion 3 of goods sheet 1) of the assembly circuit plate 2 in regionOn end face. Obviously, now, by the pilot hole 4a1 of qualified assembly circuit board 2a, with adjacencyThe guide part 4a contraposition of scrap portion 3 of goods sheet 1, by both (, assembly circuit platesThe guide part 7a of 2 dielectric base 11-1 and qualified assembly circuit board 2a) closely bond.
Thus, shown in Fig. 5, can make to lay respectively at the electrical component in adjacent regionRoad plate 2 is consistent with the height of the new qualified assembly circuit board 2a replacing. In addition, owing to going backHave in assembly circuit plate 2 and qualified assembly circuit board 2a highly not knifeedge oneSituation about causing, therefore the occasion in the time that parts are installed etc. is in the time exerting an influence because of thickness, best,Guide part 7a, the 7b of qualified assembly circuit board 2a are set in the region that does not produce very big impact.
(embodiment 2)
In above-described embodiment 1, to assembly circuit plate (, not the conforming to of Fig. 3 before replacingLattice assembly circuit plate 2b) punching press shape, with replace after assembly circuit plate (, Fig. 3Qualified assembly circuit board 2a) variform occasion be illustrated, still, implementIn example 2, to can according to same punching press shape by change assembly circuit plate towards, realizeAssembly circuit plate after assembly circuit plate (defective assembly circuit plate) before replacement and replacementThe occasion of (qualified assembly circuit board) describes.
Fig. 6 is the assembly circuit replacement method that represents the assembly substrate of embodiments of the invention 2The process chart of the 1st operation.
, Fig. 6 is illustrated in mutual assembly circuit plate 12,12b and the connection that comprise adjacencyThe global shape of the 13a of portion, 13b is identical, and the mutual assembly circuit plate 12 of adjacency,When 12b is the contrary shape of parts installation direction (direction of the larger arrow in figure), removeThe operation of adjacent defective assembly circuit plate 12b. In addition, Fig. 7 is of the present invention for representingThe process chart of the 2nd operation of the assembly circuit replacement method of the assembly substrate of embodiment 2. ,Fig. 7 represents to be the 1st operation of Fig. 6, having removed defective group from goods sheet 11On the marking of part circuit board 12b, assemble the operation of qualified assembly circuit board 12a. In addition,Fig. 8 be represent the assembly substrate of embodiments of the invention 2 assembly circuit replacement method theThe process chart of 3 operations. That is, Fig. 8 represents the operation by Fig. 7, by goods sheet 11 notQualified assembly circuit board for replacing is the state of qualified assembly circuit board 12a.
First, shown in Fig. 6, in goods sheet 11, form following structure,Wherein, comprise mutual assembly circuit plate 12,12b and connecting portion 13a, the 13b of adjacencyGlobal shape identical, and the peace of the electronic unit of the assembly circuit plate 12 of adjacency, 12bDress direction is mutually contrary. , at the assembly circuit plate of assembly circuit plate 12 and adjacency (at thisIn, be defective assembly circuit plate 12b) in, the shape of corresponding connecting portion 13a, 13bIdentical, the installation direction (the larger arrow in figure) of parts is contrary. In addition, in qualified clustersCorresponding connecting portion in the defective assembly circuit plate 12b of part circuit board 12 and adjacencyThe fore-end of 13a, 13b, forms respectively pilot hole 14a, 14b. In addition, relativelyConnecting portion 13a, 13b and pilot hole 14a, 14 keep the goods sheet 11 of symmetrical positionOn face, form pilot hole 15a, 15b.
In the goods sheet 11 forming as Fig. 6, the assembly circuit plate 12 on the right side of figureFor qualified assembly circuit board, still, due to the assembly circuit plate of the left side adjacency of figure for notCertified products assembly circuit plate 12b, therefore to not conforming to this defective assembly circuit plate 12b and thisConnecting portion 13a, 13b that lattice assembly circuit plate 12b connects carry out punching press, by its removal.
In addition, shown in Fig. 7, its parts installation direction (larger arrow in figureDirection) with punching press in Fig. 6 and contrary the closing of defective assembly circuit plate 12b of removingLattice assembly circuit plate 12a takes out from another goods sheet (not shown), this qualified electrical componentThe parts installation direction (the larger direction of arrow in figure) of road plate 12a be with as Fig. 6Parts installation direction (the larger arrow in figure of the defective assembly circuit plate 12b arrangingDirection) identical direction (, the side of the blacking arrow in qualified assembly circuit board 12a picture figureTo like that, rotate by 180 degree), the removal in goods sheet 11 defective electrical componentThe part of road plate 12b, embeds this qualified assembly circuit board 12a.
In addition, by the pilot hole 14a of the connecting portion 13 of qualified assembly circuit board 12a and pre-The pilot hole 15a being first opened in goods sheet 11 carries out contraposition, by qualified assembly circuit boardIt is right that the pilot hole 15b of the pilot hole 14b of the connecting portion 13 of 12a and goods sheet 11 sides carries outPosition, fits by peucinous bonding agent. Like this, by defective assembly circuit plate12b replaces with qualified assembly circuit board 12a, fits on goods sheet 11.
Thus, shown in Fig. 8, closing on the left of the embedding view in goods sheet 11The parts installation direction (the larger direction of arrow in figure) of lattice assembly circuit plate 12a according toAs the parts peace of the assembly circuit plate 12 on the qualified assembly circuit board separately on view right sideDress direction (the larger direction of arrow in figure) arranges mutually on the contrary, the electrical component in goods sheet 11The whole of road plate are qualified. Like this, in the inside of goods sheet 11, change the group of adjacencyThe parts installation direction of part circuit board, thus, can be by the stamped metal mould of assembly circuit plateUnification is a kind.
Here, in Fig. 6～Fig. 8, ° identical by assembly circuit plate 12 Rotate 180sThe example of shape represent, still, be not and assembly circuit plate Rotate 180 ° separatelyThe occasion of identical shape, forms and the combination of 2 assembly circuit plates, and Rotate 180 is ° identicalThe assembly of shape, in the underproof occasion of certain assembly circuit plate, also can replace altogether 2Individual. Such as, in Fig. 9, assembly circuit plate 12-1,12-2 are separately trapezoidal shape, eachFrom be not with by the identical shape of the occasion of 180 ° of rotations, still, be and by by 2Combination, Rotate 180 ° identical shape.
In addition, the same occasion for embodiment 2, with the field of the embodiment 1 shown in Fig. 5Close identically, can make to lay respectively at assembly circuit plate 12 and new the closing of replacing in adjacent regionThe height alignment of lattice assembly circuit plate 12a. , with the A-A line of the Fig. 4 along embodiment 1Cutaway view be Fig. 5 occasion is identical, along the cutaway view of the B-B line in Fig. 8 as Fig. 5Shown, pilot hole 14a and the shape of the connecting portion 13 of qualified assembly circuit board 12aThe bonding part that is formed in the pilot hole 15a on goods sheet 11, shown in Fig. 5, connectsBe contained in the scope of height of assembly circuit plate 12a.
In addition, in embodiment 1,2, shown in Fig. 5, fixed owing to removingThe electric circuit metal paper tinsel of the intersection (the guide part 7a of Fig. 5) that is positioned at pilot hole and fit12a-2,12b-2 and cover film 13a-2,13b-2, by part thick of the coincidence of laminatingThe situation that degree changes suppresses Min., thus can suppress the installation of electronic unit time transport thereforeThe situations such as barrier.
In addition,, in embodiment 1,2, suppose that pilot hole is as through hole, by guide fingerThrough this pilot hole, situation about positioning, still, if can adopt perspective qualified clustersThe pilot hole of the pilot hole of part circuit board and goods sheet side, the positioner reading (ratioAs, x ray camera) etc., pilot hole is not limited to through hole, also can be such as,While forming circuit, the mark being formed by metal forming together. In this occasion, also can be not sameOne position, arranges location and intersection and the pilot hole of laminating.
Further, in embodiment 1, as comprising scrap portion 3 and the qualified clusters of replacingThe bonding method of region portion of part circuit board 2a, in pilot hole neighboring area, inserts resinProperty bonding agent, still, be not limited to this, also can be make filtering material etc. flow into pilot hole (or,Also can be other hole) in and the method that is fixed. It is in embodiment 2, obvious equally,Also filtering material etc. can be flowed in pilot hole, be fixed.
Above for the assembly circuit plate replacement method of assembly substrate of the present invention, to 2 realitiesExecute example and be illustrated, still, the present invention is not limited to these embodiment, can not depart fromIn the situation of spirit of the present invention, carry out various changes, in addition, certainly, the present invention also relates toAnd the scheme of this change.
Claims (3)
1. an assembly circuit plate replacement method for assembly substrate, in the method, by positionDefective electrical component in the goods sheet of assembly substrate that is formed with multiple assembly circuit platesRoad plate replaces with qualified assembly circuit board, it is characterized in that the method comprises:
The 1st operation, wherein, according to the ministry of electronics industry being equipped on the assembly circuit plate of adjacencyThe installation direction of part is mutually opposite direction, and from said modules circuit board separatelyThe connecting portion extending is phase unidirectional mode each other, and each assembly circuit plate is arranged atOn said products sheet;
The 2nd operation, wherein, certain person in said modules circuit board is defective assemblyWhen circuit board, cut off and remove above-mentioned including above-mentioned connecting portion from said products sheetDefective assembly circuit plate;
The 3rd operation, wherein, prepares above-mentioned electronic unit from another goods sheet cut-outInstallation direction be the qualified electrical component of the direction contrary with above-mentioned defective assembly circuit plateRoad plate;
The 4th operation, wherein, according to the relative assembly circuit of adjacency on said products sheetPlate, the installation direction of above-mentioned electronic unit is the mode of contrary direction, by above-mentioned qualifiedAssembly circuit plate towards reversion, to be pre-formed in said products sheet the 1st guidingHole and the 2nd pilot hole being formed in the above-mentioned connecting portion of above-mentioned qualified assembly circuit board enterRow contraposition, above-mentioned defective assembly circuit plate has been removed in the cut-out in said products sheetRegion, assembles above-mentioned qualified assembly circuit board;
The 5th operation, wherein, by bonding agency, by above-mentioned the 1st pilot hole and above-mentionedThe neighboring area of the 2nd pilot hole is fixed.
2. the assembly circuit plate replacement method of assembly substrate according to claim 1,It is characterized in that in the bonding part of above-mentioned the 1st pilot hole and above-mentioned the 2nd pilot hole,Removal is formed at electric circuit metal paper tinsel and the cover film on said modules circuit board.
3. the assembly circuit plate replacement side of assembly substrate according to claim 1 and 2Method, is characterized in that, said modules circuit board is flexible PCB.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008204855A JP5033079B2 (en) | 2008-08-07 | 2008-08-07 | Method for replacing unit wiring board of collective substrate, and collective substrate |
| JP2008-204855 | 2008-08-07 | ||
| CN200910161857A CN101646306A (en) | 2008-08-07 | 2009-08-05 | Assembly circuit board replacing method of integrated substrate and the integrated substrate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910161857A Division CN101646306A (en) | 2008-08-07 | 2009-08-05 | Assembly circuit board replacing method of integrated substrate and the integrated substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105611746A true CN105611746A (en) | 2016-05-25 |
| CN105611746B CN105611746B (en) | 2018-07-13 |
Family
ID=41657961
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910161857A Pending CN101646306A (en) | 2008-08-07 | 2009-08-05 | Assembly circuit board replacing method of integrated substrate and the integrated substrate |
| CN201610091931.6A Expired - Fee Related CN105611746B (en) | 2008-08-07 | 2009-08-05 | The assembly circuit plate replacement method and assembly substrate of assembly substrate |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910161857A Pending CN101646306A (en) | 2008-08-07 | 2009-08-05 | Assembly circuit board replacing method of integrated substrate and the integrated substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5033079B2 (en) |
| CN (2) | CN101646306A (en) |
| TW (2) | TWI398201B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3013128A1 (en) | 2010-07-26 | 2016-04-27 | Nippon Mektron Ltd. | Flexible printed circuit board and method of manufacturing the same |
| JP5516369B2 (en) * | 2010-11-29 | 2014-06-11 | ブラザー工業株式会社 | Wiring board manufacturing method and actuator device |
| JP5581260B2 (en) * | 2011-04-21 | 2014-08-27 | 日本メクトロン株式会社 | Method for replacing unit wiring board of collective substrate and collective substrate |
| JP5643728B2 (en) * | 2011-08-24 | 2014-12-17 | 日本メクトロン株式会社 | Circuit board unit wiring board replacement method and circuit board product sheet |
| JP5913867B2 (en) * | 2011-08-29 | 2016-04-27 | 日本メクトロン株式会社 | Circuit board unit wiring board replacement method and circuit board product sheet manufacturing method |
| CN104619130B (en) * | 2013-11-05 | 2018-06-19 | 健鼎（无锡）电子有限公司 | Circuit board implantation structure and the method for transplanting circuit board |
| JP5463435B1 (en) * | 2013-11-14 | 2014-04-09 | 株式会社フジクラ | Replacing the printed wiring board on the product sheet |
| CN104284525A (en) * | 2014-09-29 | 2015-01-14 | 昆山思拓机器有限公司 | Method for repairing jointed PCB |
| CN106612588A (en) * | 2015-10-23 | 2017-05-03 | 中兴通讯股份有限公司 | Splicing PCB subunit transplanting method and splicing PCB |
| CN106216483A (en) * | 2016-07-29 | 2016-12-14 | 领胜城科技（江苏）有限公司 | The Sheet Metal Forming Technology of one Seed packaged band precision positioning |
| CN108513449A (en) * | 2018-03-23 | 2018-09-07 | 高德（无锡）电子有限公司 | A kind of blind fishing transplanting technique in micro-force sensing position |
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| US5528826A (en) * | 1994-04-04 | 1996-06-25 | Hughes Aircraft Company | Method of constructing high yield, fine line, multilayer printed wiring board panel |
| KR100236633B1 (en) * | 1996-10-19 | 2000-01-15 | 김규현 | Printed circuit strip sturucture and making method of semiconductor package using the same |
| JPH11191668A (en) * | 1997-12-26 | 1999-07-13 | Sony Corp | Assembly substrate and quality discrimination method of each fragmentation part |
| US6574862B1 (en) * | 1999-02-23 | 2003-06-10 | Samsung Electro-Mechanics Co., Ltd. | Method for coupling PCB sheet |
| KR20020074129A (en) * | 2002-09-03 | 2002-09-28 | 신태명 | Method of performing PCB X-out replacement |
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| CN1993023A (en) * | 2005-12-30 | 2007-07-04 | 杨合卿 | Processing method and structure for replacing bad element in printed circuit board |
| JP4848226B2 (en) * | 2006-08-08 | 2011-12-28 | 日本メクトロン株式会社 | Manufacturing method of flexible wiring board |
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2008
- 2008-08-07 JP JP2008204855A patent/JP5033079B2/en active Active
-
2009
- 2009-05-20 TW TW101126840A patent/TWI398201B/en not_active IP Right Cessation
- 2009-05-20 TW TW098116625A patent/TWI398200B/en not_active IP Right Cessation
- 2009-08-05 CN CN200910161857A patent/CN101646306A/en active Pending
- 2009-08-05 CN CN201610091931.6A patent/CN105611746B/en not_active Expired - Fee Related
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| JPH0451588A (en) * | 1990-06-20 | 1992-02-20 | Mitsumi Electric Co Ltd | Printed wiring board |
| JPH07214958A (en) * | 1994-02-07 | 1995-08-15 | Ibiden Co Ltd | Printed circuit board for ic card |
| CN1642386A (en) * | 2004-01-14 | 2005-07-20 | 赖金泉 | Method for replacing and resetting imperfect multi-piece printed circuit board |
| CN2855005Y (en) * | 2005-12-09 | 2007-01-03 | 翌阳科技有限公司 | Printed circuit board replacement structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5033079B2 (en) | 2012-09-26 |
| CN101646306A (en) | 2010-02-10 |
| TW201008414A (en) | 2010-02-16 |
| TWI398200B (en) | 2013-06-01 |
| CN105611746B (en) | 2018-07-13 |
| TW201247063A (en) | 2012-11-16 |
| JP2010040949A (en) | 2010-02-18 |
| TWI398201B (en) | 2013-06-01 |
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Granted publication date: 20180713 Termination date: 20190805 |