200952576 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種組裝方法，且特別是有關於表面接合 元件（surface mount device，SMD)與線路板的組裝方法及苴 使用之線路板。 ^ 【先前技術】 ❹ 圖1A至圖1C是習知一種將表面接合元件組裝於兩層印 刷電路板的組裝方法之流程圖。在習知技術中，將表面接合元 件組裝於兩層印刷電路板的組裝方法包括下列步驟：首先，如 圖1A所示，提供一第一印刷電路板(printed} 110」此第一印刷電路板110之一側具有多個焊墊112a、’U2b。 接著，進行一表面接合技術製程（surface mount technology P職ss，SMT process )。亦即，在第一印刷電路板！ i 〇之焊墊 U2a上形成錫膏（solderpaste) 13〇，接著將一第一表面接合 兀件⑽軸於錫膏13G，然後進行—迴焊製程（她w process)，以藉由錫膏130將第一表面接合元件i2〇固著於 一印刷電路板110上。 - 如圖1B所不，提供一第二印刷電路板140，此第 =刷電路板140具有多個焊塾142a、M2b，其中焊墊咖 與焊塾142b分別位於第二印刷雷致 著，# d n u 電路板140之相對的兩側。接 的度轨7表接口技術製程。亦即’在第二印刷電路板140 =墊_上形成錫㈣，接著 == 貼附於錫膏13G，然後進行—迴㈣# 兀件150 ^ icn 谇製私，以猎由錫膏130將第 -表3合兀件15〇固著於第二印刷電路板⑽上。 固著於第一印刷電路板110上，轉由錫t印刷電路板140 尤精由錫嘗130使第二印刷電 5 200952576 路板M0之焊塾142b電性連接至第一印刷電路板ΐι〇之焊塾 112b。 基於上述，習知技術需進行兩次表面接合技術製程 process)，以祕將第二印刷電路板14〇組裝於第—印刷電路 板110上’所以較耗費時間。 【發明内容】 本發明提供-種表面接合元件與線路板的組裝方法， 升組裝效率。 的組另提供—種線路板’以提升表面接合元件與線路板 鮮ίΐ上ίίΓ本發明提出一種表面接合元件與線路板的 j方法，其包括下列步驟：魏，提供—第—線路板。此第 是被ϊί 2 :第一板、一一第二板以及一絕緣層，其中絕緣層 =:板與第二板之間，且第二板暴露出部分第一 。接著，將多個第-表面接合元件設置於第—板與第二板。 ❹ 紙裝實施例中，上述之表面接合元件與線路板的 路拓/ $匕括下列步驟：提供一第二線路板，並在第二線 置ί第少一第二表面接合元件。接著，將第-線路板設 、f一線路板上，且第—線路板暴露出部分第二線路板。 ,且事方實施例中’上述之表面接合元件與線路板的 於第將至少一第二表面接合元件設置 兩側。第 元件與第二板是位於第一板的相對 多個發明之一實施例中，上述之第一板與第二板分別具有 法包面接合元件設置於第—板與第二板之方 匕括下列步驟：於第—板與第二板之焊墊上分別形成-錫 6 200952576 i制ί者’使第—表面接合元件_於騎。賊，進行一迴 知H以使第-表面接合元個定於第_板與第二板。 在本發明之—實施例中，上述之於第—板與第二板之焊塾 刷=3?膏：方法包括下列步驟:提供-印刷鋼板。此印 刷鋼板區分成-第-部分與—第二部分，其中第 大於第二部分的厚度，且第一部分盥 ^夕又 刷鋼板與線路板對位 ❹ :旁印刷於第—板上’錢貫絲露出料。之後，將 本發明另提出一種線路板，其包括一第一板、一第二板以 緣層。絕緣層是被壓合於第—板與第二板之間，且第二 鄰部分第—板。第—板具有至少—溝槽，錢溝槽是緊 本發明之—實施例中，上述之第二板的厚度小於8密爾 ，本發面接合元件與線路板的組裝方法巾因使用的 弟二線路板具有尺寸不同的兩層（即第—板與第二板），所以 第行—絲面接合技術製程即可將表面接合科接合於 虚魏Ϊ板之第—板與第二板。因此，本發明之表面接合元件 因^板敝裝綠可提物裝效率。此外，本發明之線路板 尺寸不同的兩層板（即第—板與第二板），所以能使表 ㈣:件在同—表面接合技術製程中組裝於線路板的第一 板/、弟二板，如此可提升組裝效率。 ^讓本發明之上述和其他目的、特徵和優點能更明顯易 文特舉較it實施例’並配合所附圖式，作詳細說明如下。 【實施方式】 7 200952576 線路方二/===，合元件與 ❹BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembly method, and more particularly to a surface mount device (SMD) and a method of assembling a circuit board and a circuit board for use. ^ [Prior Art] Fig. 1A to Fig. 1C are flowcharts showing a conventional assembling method of assembling a surface bonding component to a two-layer printed circuit board. In the prior art, the assembly method of assembling the surface bonding component to the two-layer printed circuit board includes the following steps: First, as shown in FIG. 1A, a first printed circuit board (printed) 110 is provided. One side of the 110 has a plurality of pads 112a, 'U2b. Next, a surface mount technology (sMT process) is performed. That is, in the first printed circuit board! i 〇 pads U2a Solder paste 13 〇 is formed thereon, then a first surface bonding member (10) is soldered to the solder paste 13G, and then a solder process is performed to bond the first surface bonding component by the solder paste 130. I2 is fixed on a printed circuit board 110. - As shown in FIG. 1B, a second printed circuit board 140 is provided. The first printed circuit board 140 has a plurality of soldering pads 142a, M2b, wherein the solder pads are soldered. The 塾 142b are respectively located on the opposite sides of the second printing ray, #dnu circuit board 140. The grading rail 7 table interface technology process, that is, 'forming tin (four) on the second printed circuit board 140 = pad _, Then == attached to the solder paste 13G, then proceed - back (four) # 150 150 ^ icn 谇 私 , , , 猎 猎 猎 猎 猎 猎 猎 猎 猎 猎 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡 锡The tin t printed circuit board 140 is particularly made of tin solder 130 to electrically connect the second printed circuit 5 200952576 of the board M0 to the first printed circuit board 塾 〇 塾 112b. Based on the above, the prior art needs to be performed. The two surface bonding process process, in which the second printed circuit board 14 is assembled on the first printed circuit board 110, is time consuming. SUMMARY OF THE INVENTION The present invention provides a method of assembling a surface bonding component and a wiring board, and improves assembly efficiency. The invention further provides a circuit board for lifting surface engaging components and circuit boards. The present invention provides a method for surface bonding components and circuit boards, which comprises the following steps: Wei, providing - a first circuit board. The first is ϊί 2 : a first board, a second board, and an insulating layer, wherein the insulating layer is between the board and the second board, and the second board exposes a portion of the first. Next, a plurality of first surface-engaging elements are disposed on the first plate and the second plate. In the paper-loaded embodiment, the surface-engaging element and the circuit board are described in the following steps: a second wiring board is provided, and a second surface-engaging element is provided on the second line. Next, the first circuit board is disposed, the circuit board is f, and the first circuit board exposes a portion of the second circuit board. And in the embodiment of the invention, the surface engaging component and the circuit board are disposed on both sides of the at least one second surface engaging component. The first element and the second plate are one of the embodiments of the first plurality of inventions, wherein the first plate and the second plate respectively have a method for the surface of the first plate and the second plate to be disposed on the first plate and the second plate. The following steps are included: forming a tin-on-pad on the pads of the first plate and the second plate respectively. The thief, one time knows H to make the first-surface joint element set to the first plate and the second plate. In an embodiment of the invention, the soldering brush of the first and second plates is a paste: the method comprises the steps of: providing a printed steel plate. The printed steel plate is divided into a - part - and a second part, wherein the thickness is greater than the thickness of the second part, and the first part of the 刷 夕 又 刷 刷 刷 刷 刷 刷 刷 刷 刷 ❹ 旁 旁 旁 旁 旁 旁 旁 旁 旁 旁 旁 旁 旁Silk exposed. Hereinafter, the present invention further provides a circuit board comprising a first board and a second board as an edge layer. The insulating layer is pressed between the first plate and the second plate, and the second adjacent portion is a plate. The first plate has at least a groove, and the money groove is tightly applied to the present invention. In the embodiment, the thickness of the second plate is less than 8 mils, and the method for assembling the joint element and the circuit board is used. The two circuit boards have two layers of different sizes (ie, the first plate and the second plate), so the first line-filament bonding technology process can join the surface joints to the first plate and the second plate of the virtual Wei board. Therefore, the surface engaging member of the present invention is capable of loading green extractable materials. In addition, the two-layer boards (ie, the first board and the second board) having different circuit board sizes of the present invention enable the table (4): the first board to be assembled on the circuit board in the same-surface bonding technology process. The second board can improve assembly efficiency. The above and other objects, features, and advantages of the present invention will become more apparent from the description of the accompanying claims. [Embodiment] 7 200952576 Line side two /===, combined components and ❹
圖。本實施例之表面接合元件與線路板的組裝方法 ，：首先，如圖2A與圖3所示’提供—第一線路板細。此 第一線路板200例如是一印刷電路板，其包括一第一板 -第二板220以及-絕緣層230 ’其中絕緣層23〇是被壓合於 第-板21〇與第二板220之間，且第二板22〇暴露出部分第 板2H)。此外，第-板21〇與第二板22〇分別具有多個焊些 212、222。第一板220的厚度例如是小於8密爾。 另外，第一板210、第二板220與絕緣層23〇的材料包含 沾有膠的玻璃纖維布（prepreg)，且在製作第一線路板2〇〇 時，第一板210、第二板220與絕緣層230需在高溫環境下經 過長時間的壓合，所以可能會導致絕緣層23〇與第二板22〇之 玻璃纖維布（prepreg)中的膠溢出，使第一板21〇之焊墊212 遭文污染。因此，第一板210可設有一溝槽214，此溝槽214 是緊鄰第二板220，以使膠流入溝槽214内，進而防止第一板 210之焊墊212遭受膠的污染。 接著，如圖2B至圖2E所示，將多個第一表面接合元件 310設置於第一板210與第二板220。在本實施例中，將第一 表面接合元件310設置於第一板210與第二板220之方法是進 行一表面接合技術製程’其包括下列步驟：首先，如圖2b與 圖2C所示，於第一板21〇與第二板220之焊墊212、222上分 別形成~錫膏330。更詳細地說，於第一板210與第二板220 之焊墊212、222上分別形成錫膏330的方法例如是先提供一 印刷鋼板320 (如圖2B所示）。此印刷鋼板320區分成一第 一部分322與一第二部分324，其中第一部分322的厚度D1 8 200952576 大於第一，分324的厚度D2 ’且第一部分奶與第二部分324 分別具有夕個貫孔323、325。接著，將印刷鋼板创斑第― 線路板200對位’使第—部分322與第二部分324分別位 -板210與第二板22〇上’並使貫孔奶必暴露出焊魯犯、 222。之後，如圖2C所示’將錫膏33G印刷於焊塾2i2、222 上。 於第一板210與第二板22〇之焊塾212、222 錫膏330後’接著是使第一表面接合元件31〇貼附於錫膏= (如圖2D所示）。然後，如圖2E所示，進行一迴 以使第-表面接合元件3H)固定於第—板21()與第二板22〇。 在本實施例之表面接合元件與線路板的組裝方法中， 用的第-線路板200具有尺寸不同的兩層 第二板’所以只需進行—次表面接合技術製 ; 面接合元件3難合於第-板21G與第二板⑽。相較於習= 技術，本實施狀組裝紐除了可減少域面接合技術製程 外，還可省略將第二印刷電路板14〇 (如lc所示） ❹ 第-印刷電路板(如圖1C所示）上的製程。因此，本實 施例之表面接合元件與線路板的組裝方法可節省時間，進而提 升組裝效率。 此外，本實施例之線路板（即第一線路板細）因且有尺 寸不同的兩層（即第-㈣0與第二板22〇) ’所以能使表面 接合元件310在同-表面接合技㈣財纟赠於第—板2融 第二板220，如此可提升組裝效率。 圖4是本發明另-實施例之表面接合元件與線路板的組 I結構示思圖4參照圖4 ’相較於圖沈之第—線路板2qq， 本實施例之第-線路板200,的第—板21()，更具有多 9 200952576 216’且焊墊216與焊墊212是位於第一板21〇,之相對的兩側。 此外，在本發明另一實施例的表面接合元件與線路板的組襄方 法中，將第一表面接合元件310設置於第一線路板2〇〇,後，還 可進一步包括下列步驟。即，提供一第二線路板41〇，並在第 二線路板410上設置至少一第二表面接合元件42〇。接著，將 第一線路板200’設置於第二線路板41〇上，且第一線路板2〇〇, 暴露出部分第二線路板410。另外’第一線路板2〇〇，是透過位Figure. The method of assembling the surface bonding component and the wiring board of this embodiment is as follows: First, as shown in Figs. 2A and 3, the first wiring board is thin. The first circuit board 200 is, for example, a printed circuit board including a first board - a second board 220 and an insulating layer 230 ' wherein the insulating layer 23 is pressed against the first board 21 and the second board 220 Between and the second plate 22 〇 exposes a portion of the second plate 2H). Further, the first plate 21'' and the second plate 22'' have a plurality of welds 212, 222, respectively. The thickness of the first plate 220 is, for example, less than 8 mils. In addition, the material of the first plate 210, the second plate 220 and the insulating layer 23〇 comprises a glass fiber cloth prepreg, and when the first circuit board 2 is fabricated, the first board 210 and the second board 220 and the insulating layer 230 need to be pressed for a long time in a high temperature environment, so that the rubber in the insulating layer 23〇 and the prepreg of the second plate 22 may overflow, so that the first plate 21 is smashed. The pad 212 is contaminated. Therefore, the first plate 210 may be provided with a groove 214 which is adjacent to the second plate 220 to allow the glue to flow into the groove 214, thereby preventing the pad 212 of the first plate 210 from being contaminated by glue. Next, as shown in Figs. 2B to 2E, a plurality of first surface engaging elements 310 are disposed on the first plate 210 and the second plate 220. In the present embodiment, the method of disposing the first surface bonding component 310 on the first board 210 and the second board 220 is to perform a surface bonding technology process, which includes the following steps: First, as shown in FIG. 2b and FIG. 2C, A solder paste 330 is formed on the pads 212 and 222 of the first plate 21 and the second plate 220, respectively. In more detail, the method of forming the solder paste 330 on the pads 212, 222 of the first board 210 and the second board 220, for example, first provides a printed steel sheet 320 (as shown in Fig. 2B). The printed steel sheet 320 is divided into a first portion 322 and a second portion 324, wherein the thickness D1 8 200952576 of the first portion 322 is greater than the first portion, the thickness D2 ′ of the portion 324 and the first portion of the milk portion and the second portion 324 have the outer portion of the hole 323, 325. Next, the printed steel plate plaque-the circuit board 200 is aligned, so that the first portion 322 and the second portion 324 are respectively-positioned on the plate 210 and the second plate 22, and the through-hole milk is exposed to the weld, 222. Thereafter, as shown in Fig. 2C, the solder paste 33G is printed on the pads 2i2, 222. After the solder paste 212, 222 of the first board 210 and the second board 22 is solder paste 330, the first surface bonding component 31 is attached to the solder paste = (as shown in Fig. 2D). Then, as shown in Fig. 2E, one step is performed to fix the first-surface engaging member 3H) to the first plate 21() and the second plate 22''. In the method of assembling the surface joint component and the wiring board of the present embodiment, the first wiring board 200 used has two second boards of different sizes, so that only the surface bonding technique is required; the surface bonding component 3 is difficult to combine. The first plate 21G and the second plate (10). In contrast to the Xi = technology, in addition to the process of reducing the surface bonding technology, the second printed circuit board 14 (shown as lc) ❹ the first printed circuit board can be omitted (as shown in FIG. 1C). The process on the display). Therefore, the method of assembling the surface joint component and the wiring board of the present embodiment can save time and thereby improve assembly efficiency. In addition, the circuit board of the present embodiment (ie, the first circuit board is thin) has two layers of different sizes (ie, the first (fourth) 0 and the second board 22 〇), so that the surface engaging component 310 can be bonded to the same surface. (4) The financial gift is given to the second board 220 of the first board 2, which can improve the assembly efficiency. 4 is a view showing a structure of a surface I of a surface bonding element and a circuit board according to another embodiment of the present invention. FIG. 4 is a comparison with FIG. 4', and a circuit board 2qq, the first circuit board 200 of the present embodiment. The first plate 21() has more than 9 200952576 216' and the pad 216 and the pad 212 are located on opposite sides of the first plate 21A. Further, in the stacking method of the surface engaging member and the wiring board according to another embodiment of the present invention, the first surface engaging member 310 is disposed on the first wiring board 2, and further, the following steps may be further included. That is, a second wiring board 41 is provided, and at least one second surface bonding member 42 is provided on the second wiring board 410. Next, the first circuit board 200' is disposed on the second circuit board 41, and the first circuit board 2 is exposed to expose a portion of the second circuit board 410. In addition, the first circuit board 2〇〇 is a transmissive bit.
於焊墊2!6與焊墊412之間的錫膏33〇而電性連接至第二線路 板 410。 圖5疋本毛明另-實施例之表面接合元件與線路板的組 裝結構不㈣。請參照圖5，本實施例之第—線路板·，與圖 it第2路板相同。此外，在本發明另—實施例之表面 Ϊ二::的組裝方法中，將第-表面接合元件310設 置祕板·，後，射進—步包括下財驟 二絲接合元件42〇設置於第 合⑽與第二板220是位於第一板21〇，第= 而言’在本實施例中，是先職 ί 具體 500 ’之後再進行一表面接合技術製程，二^置==架 件420接合於第—線路板，的第-板21(Γ—表面接合凡 ίΪΓϋί發明至少具有下列優點·· 的第一線路板具有板， 合於第-板與第二板。H術製程即可將表面接合元件接 接合元件與線路板的組裝目_^於習知技術，本發明之表面 率。 财去可節省時間，進而提升組裝效 200952576 2. 相較於習知技術，由於本發明之線路板（即第一線路板） 具有尺寸不同的兩層板（即第一板與第二板），所以能使表面 接合元件在同一表面接合技術製程中組裝於尺寸不同的兩層 板’如此可提升組裝效率。 3. 本發明之線路板（即第一線路板）因具有溝槽，以防止 第二板中的膠溢出而污染第一板之焊墊，所以本發明之線路板 具有較佳的可靠度。 雖然本發明已以較佳實施例揭露如上，然其並非用以限定 ❹本發明，所屬技術領域中具有通常知識者，在不脫離本發明之 精神和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A至圖1C是習知一種將表面接合元件組裝於兩層印 刷電路板的組裝方法之流程圖。 圖2A至圖2E是本發明一實施例之一種表面接合元件與 線路板的組裝方法之流程圖。 ❹ 圖3是圖2A中線路板的俯視圖。 圖4是本發明另一實施例之表面接合元件與線路板的組 裝結構示意圖。 圖5是本發明另一實施例之表面接合元件與線路板的組 裝·結構不意圖。 【主要元件符號說明】 110 :第一印刷電路板 112a、112b、142a、142b、212、216、222、412 :谭塾 120、310:第一表面接合元件 130、330 :錫膏 11 200952576 140 :第二印刷電路板 150、420 :第二表面接合元件 200、200’ ：第一線路板 210、210’ ：第一板 214 :溝槽 220 :第二板 230 :絕緣層 320 :印刷鋼板 ❹ 322:第一部分 323、325 :貫孔 324 :第二部分 410 :第二線路板 500 :承載架 Dl、D2 :厚度The solder paste 33 between the pads 2! 6 and the pads 412 is electrically connected to the second wiring board 410. Fig. 5 shows the assembly structure of the surface joint member and the wiring board of the present invention, which is not (4). Referring to Fig. 5, the first circuit board of the present embodiment is the same as the second circuit board of Fig. Further, in the method of assembling the surface of the second embodiment of the present invention, the first surface engaging member 310 is provided with a secret plate, and then the injection step includes the lower second wire engaging member 42. The first (10) and the second plate 220 are located on the first plate 21, and in the second embodiment, in the present embodiment, the first work is performed after the first position ί, and then the surface is joined by a surface bonding technique. 420 is joined to the first board 21 of the first circuit board, and the first circuit board having at least the following advantages has a board, which is combined with the first board and the second board. Assembly of the surface-engaging element to the bonding board and the circuit board. The surface rate of the present invention saves time and improves assembly efficiency. 200952576 2. Compared with the prior art, due to the present invention, The circuit board (ie, the first circuit board) has two layers of different sizes (ie, the first board and the second board), so that the surface engaging components can be assembled in two layers of different sizes in the same surface bonding technology process. The assembly efficiency can be improved. 3. The invention The circuit board of the present invention has better reliability because it has grooves to prevent the glue in the second board from overflowing and contaminating the pads of the first board. The preferred embodiments are disclosed above, but are not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of protection is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1A to Figure 1C are flow diagrams of a conventional assembly method for assembling a surface-engaging component to a two-layer printed circuit board. 2A to 2E are flowcharts showing a method of assembling a surface bonding component and a wiring board according to an embodiment of the present invention. Fig. 3 is a plan view of the wiring board of Fig. 2A. Fig. 4 is a surface bonding component of another embodiment of the present invention. Fig. 5 is a schematic view showing the assembly and structure of the surface joint component and the wiring board according to another embodiment of the present invention. [Main component symbol description] 110: First printing The boards 112a, 112b, 142a, 142b, 212, 216, 222, 412: Tan 120, 310: first surface bonding elements 130, 330: solder paste 11 200952576 140: second printed circuit board 150, 420: second Surface bonding elements 200, 200': first wiring board 210, 210': first board 214: trench 220: second board 230: insulating layer 320: printed steel sheet 322: first portion 323, 325: through hole 324: Second part 410: second circuit board 500: carrier D1, D2: thickness
1212