TW200951614A - Exposure apparatus and device manufacturing method - Google Patents

Exposure apparatus and device manufacturing method

Info

Publication number
TW200951614A
TW200951614A TW098106689A TW98106689A TW200951614A TW 200951614 A TW200951614 A TW 200951614A TW 098106689 A TW098106689 A TW 098106689A TW 98106689 A TW98106689 A TW 98106689A TW 200951614 A TW200951614 A TW 200951614A
Authority
TW
Taiwan
Prior art keywords
correction value
reference substrate
determining
measurement
unit
Prior art date
Application number
TW098106689A
Other languages
English (en)
Inventor
Masataro Shiroiwa
Hiroki Suzukawa
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200951614A publication Critical patent/TW200951614A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
TW098106689A 2008-03-04 2009-03-02 Exposure apparatus and device manufacturing method TW200951614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008054065A JP5166916B2 (ja) 2008-03-04 2008-03-04 パターンの重ね合わせを行う装置およびデバイス製造方法

Publications (1)

Publication Number Publication Date
TW200951614A true TW200951614A (en) 2009-12-16

Family

ID=41053255

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098106689A TW200951614A (en) 2008-03-04 2009-03-02 Exposure apparatus and device manufacturing method

Country Status (4)

Country Link
US (2) US8248584B2 (zh)
JP (1) JP5166916B2 (zh)
KR (1) KR101014100B1 (zh)
TW (1) TW200951614A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5166916B2 (ja) * 2008-03-04 2013-03-21 キヤノン株式会社 パターンの重ね合わせを行う装置およびデバイス製造方法
KR101651860B1 (ko) * 2015-01-30 2016-08-29 최은국 기판분류장치
CN110062914B (zh) * 2016-12-08 2021-09-07 株式会社V技术 接近式曝光装置以及接近式曝光方法
EP3396458A1 (en) * 2017-04-28 2018-10-31 ASML Netherlands B.V. Method and apparatus for optimization of lithographic process
JP6688273B2 (ja) * 2017-11-13 2020-04-28 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、決定方法及び物品の製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2990530B2 (ja) * 1990-07-03 1999-12-13 富士通株式会社 半導体装置の製造方法
JPH04273115A (ja) * 1991-02-27 1992-09-29 Hitachi Ltd ロット編成方法および装置
US6278957B1 (en) 1993-01-21 2001-08-21 Nikon Corporation Alignment method and apparatus therefor
JP3451607B2 (ja) * 1994-12-08 2003-09-29 株式会社ニコン 位置合わせ方法及び装置、並びに露光方法及び装置
US20010049589A1 (en) 1993-01-21 2001-12-06 Nikon Corporation Alignment method and apparatus therefor
JPH1055949A (ja) * 1996-08-12 1998-02-24 Nikon Corp 位置合わせ方法
KR20010109212A (ko) 2000-05-31 2001-12-08 시마무라 테루오 평가방법, 위치검출방법, 노광방법 및 디바이스 제조방법,및 노광장치
JP2001345243A (ja) * 2000-05-31 2001-12-14 Nikon Corp 評価方法、位置検出方法、露光方法及びデバイス製造方法
JP4022374B2 (ja) * 2001-01-26 2007-12-19 株式会社ルネサステクノロジ 半導体デバイスの製造方法およびそのシステム
JP2005148531A (ja) * 2003-11-18 2005-06-09 Adtec Engineeng Co Ltd 基板伸縮に対応したプリント配線基板用露光装置
KR20080003618A (ko) * 2006-07-03 2008-01-08 삼성전자주식회사 노광 장치의 웨이퍼 정렬 방법 및 이를 이용한 노광 시스템
US7808613B2 (en) * 2006-08-03 2010-10-05 Asml Netherlands B.V. Individual wafer history storage for overlay corrections
US20080294282A1 (en) * 2007-05-24 2008-11-27 Applied Materials, Inc. Use of logical lots in semiconductor substrate processing
JP5166916B2 (ja) * 2008-03-04 2013-03-21 キヤノン株式会社 パターンの重ね合わせを行う装置およびデバイス製造方法

Also Published As

Publication number Publication date
JP2009212312A (ja) 2009-09-17
US20090225292A1 (en) 2009-09-10
KR20090095510A (ko) 2009-09-09
US8248584B2 (en) 2012-08-21
US20120274916A1 (en) 2012-11-01
KR101014100B1 (ko) 2011-02-14
JP5166916B2 (ja) 2013-03-21

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