TW200950606A - Insulated metal base circuit board and hybrid integrated circuit module of using the same - Google Patents

Insulated metal base circuit board and hybrid integrated circuit module of using the same Download PDF

Info

Publication number
TW200950606A
TW200950606A TW98111104A TW98111104A TW200950606A TW 200950606 A TW200950606 A TW 200950606A TW 98111104 A TW98111104 A TW 98111104A TW 98111104 A TW98111104 A TW 98111104A TW 200950606 A TW200950606 A TW 200950606A
Authority
TW
Taiwan
Prior art keywords
circuit
metal base
insulating
base circuit
conductor
Prior art date
Application number
TW98111104A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Monden
Takeshi Miyakawa
Yoichi Ogata
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008097718A external-priority patent/JP2011124241A/ja
Priority claimed from JP2008113815A external-priority patent/JP2011124244A/ja
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW200950606A publication Critical patent/TW200950606A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
TW98111104A 2008-04-04 2009-04-03 Insulated metal base circuit board and hybrid integrated circuit module of using the same TW200950606A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008097718A JP2011124241A (ja) 2008-04-04 2008-04-04 絶縁金属ベース回路基板及びそれを用いた混成集積回路モジュール
JP2008113815A JP2011124244A (ja) 2008-04-24 2008-04-24 絶縁金属ベース回路基板及びそれを用いた混成集積回路モジュール

Publications (1)

Publication Number Publication Date
TW200950606A true TW200950606A (en) 2009-12-01

Family

ID=41135499

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98111104A TW200950606A (en) 2008-04-04 2009-04-03 Insulated metal base circuit board and hybrid integrated circuit module of using the same

Country Status (2)

Country Link
TW (1) TW200950606A (fr)
WO (1) WO2009123125A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404495B (zh) * 2010-06-29 2013-08-01 Univ Nat Pingtung Sci & Tech 在基板上形成電路圖案之方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105451458B (zh) * 2014-08-19 2018-10-30 宁波舜宇光电信息有限公司 一种控制软硬结合板微量变形的方法及pcb基板半成品
FR3034951B1 (fr) * 2015-04-10 2017-04-28 Valeo Systemes Dessuyage Carte electronique protegee contre les vapeurs de soufre

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6124295A (ja) * 1984-07-13 1986-02-01 日本電気株式会社 配線基板
JP2000353826A (ja) * 1999-06-09 2000-12-19 Sanyo Electric Co Ltd 混成集積回路装置および光照射装置
JP2002261402A (ja) * 2001-03-01 2002-09-13 Alps Electric Co Ltd 電子回路ユニットの回路基板
JP2005039113A (ja) * 2003-07-17 2005-02-10 Denki Kagaku Kogyo Kk 表面実装方法及びそれを用いた混成集積回路
JP2006041087A (ja) * 2004-07-26 2006-02-09 Orion Denki Kk 両面プリント基板及びそのパターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404495B (zh) * 2010-06-29 2013-08-01 Univ Nat Pingtung Sci & Tech 在基板上形成電路圖案之方法

Also Published As

Publication number Publication date
WO2009123125A1 (fr) 2009-10-08

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