TW200949950A - Heat treatment apparatus - Google Patents

Heat treatment apparatus Download PDF

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Publication number
TW200949950A
TW200949950A TW098110446A TW98110446A TW200949950A TW 200949950 A TW200949950 A TW 200949950A TW 098110446 A TW098110446 A TW 098110446A TW 98110446 A TW98110446 A TW 98110446A TW 200949950 A TW200949950 A TW 200949950A
Authority
TW
Taiwan
Prior art keywords
heat treatment
processing container
processed
film
treatment apparatus
Prior art date
Application number
TW098110446A
Other languages
English (en)
Chinese (zh)
Inventor
Shintaro Aoyama
Kouji Shimomura
Sensho Kobayashi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200949950A publication Critical patent/TW200949950A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
TW098110446A 2008-03-31 2009-03-30 Heat treatment apparatus TW200949950A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008089069A JP5077018B2 (ja) 2008-03-31 2008-03-31 熱処理装置

Publications (1)

Publication Number Publication Date
TW200949950A true TW200949950A (en) 2009-12-01

Family

ID=41135299

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098110446A TW200949950A (en) 2008-03-31 2009-03-30 Heat treatment apparatus

Country Status (5)

Country Link
JP (1) JP5077018B2 (https=)
KR (1) KR20100138984A (https=)
CN (1) CN101855708B (https=)
TW (1) TW200949950A (https=)
WO (1) WO2009122913A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492307B (zh) * 2011-07-01 2015-07-11 日立國際電氣股份有限公司 The method of manufacturing a substrate processing apparatus and a semiconductor device
TWI650039B (zh) * 2015-03-06 2019-02-01 SCREEN Holdings Co., Ltd. 熱處理裝置

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5466670B2 (ja) * 2010-10-28 2014-04-09 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP5640890B2 (ja) * 2011-05-23 2014-12-17 ウシオ電機株式会社 光照射装置および光照射方法
KR101297981B1 (ko) * 2011-10-07 2013-08-23 (주) 예스티 기판의 열처리 장치
JP5964630B2 (ja) * 2012-03-27 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US8785815B2 (en) * 2012-06-22 2014-07-22 Applied Materials, Inc. Aperture control of thermal processing radiation
CN105261576A (zh) * 2014-07-15 2016-01-20 北京北方微电子基地设备工艺研究中心有限责任公司 一种加热腔室及半导体加工设备
JP6518548B2 (ja) * 2015-08-10 2019-05-22 東京応化工業株式会社 紫外線照射装置、レジストパターン形成装置、紫外線照射方法及びレジストパターン形成方法
JP6546512B2 (ja) * 2015-11-04 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN107706139A (zh) * 2017-11-13 2018-02-16 上海华力微电子有限公司 一种半导体加工机台的温度控制装置
JP7048372B2 (ja) * 2018-03-20 2022-04-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
KR102737498B1 (ko) 2019-12-13 2024-12-04 삼성전자주식회사 비-접촉식 온도 센서를 가진 공정 설비
JP7546417B2 (ja) * 2020-09-09 2024-09-06 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN115064471B (zh) * 2022-08-01 2023-11-28 北京屹唐半导体科技股份有限公司 晶圆的热处理装置
CN115411174A (zh) * 2022-08-30 2022-11-29 三三智能科技(日照)有限公司 一种用于压电薄膜稳定连续退火装置
FR3142757A1 (fr) * 2022-12-05 2024-06-07 Annealsys Four de recuit thermique rapide à uniformité de chauffage améliorée
CN118712105B (zh) * 2024-08-29 2025-02-14 一塔半导体(安徽)有限公司 一种快速热退火装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270390A (ja) * 1996-03-29 1997-10-14 Dainippon Screen Mfg Co Ltd 基板の光照射式熱処理装置
JPH10321547A (ja) * 1997-05-22 1998-12-04 Kokusai Electric Co Ltd 熱処理装置
JP4200844B2 (ja) * 2003-08-11 2008-12-24 東京エレクトロン株式会社 熱処理装置
JP2006005177A (ja) * 2004-06-17 2006-01-05 Tokyo Electron Ltd 熱処理装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492307B (zh) * 2011-07-01 2015-07-11 日立國際電氣股份有限公司 The method of manufacturing a substrate processing apparatus and a semiconductor device
US9082797B2 (en) 2011-07-01 2015-07-14 Hitachi Kokusai Electric, Inc. Substrate processing apparatus and method of manufacturing semiconductor device
TWI650039B (zh) * 2015-03-06 2019-02-01 SCREEN Holdings Co., Ltd. 熱處理裝置
US11089657B2 (en) 2015-03-06 2021-08-10 SCREEN Holdings Co., Ltd. Light-irradiation heat treatment apparatus
US12219670B2 (en) 2015-03-06 2025-02-04 SCREEN Holdings Co., Ltd. Light-irradiation heat treatment apparatus

Also Published As

Publication number Publication date
WO2009122913A1 (ja) 2009-10-08
JP5077018B2 (ja) 2012-11-21
KR20100138984A (ko) 2010-12-31
CN101855708A (zh) 2010-10-06
CN101855708B (zh) 2012-10-10
JP2009246061A (ja) 2009-10-22

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