200945975 九、發明說明： 【發明所屬之技術領域】 冬發明係涉及 裡丄 ---1干切割方法，特 有膠帶之工件切割面切割方法之創新設=★種貼附 【先前技術】 〇 ❹ ’對於一些精密工件如電路板、⑽封裝 2狀切割加卫而言，為了便於切割加卫時進行切割= 值精岔度的檢視等需要，業界通 先f机屮且古β A 吊會在待切割工件頂面預 : 有適*凹陷深度的切割道，以作為切割加工時 件二又依據’進—步地’如第1圖所示，並有業界於工 :。之：割面U上再貼附一層膠帶2〇;惟查，目前此種切 ::工作法’因為所述膠帶2°與工件10切割面u所設各 ?道12之間並無密合而形成切割道12部位膠帶2〇懸空的 b *切割刀具30切過時’會對懸空部位的膠帶 扯作用，進而造成膠帶_面不良並且產生沾黏 :拉絲的現象；再I ’所述切割道12部位因膠帶20懸空所 的凹陷空隙21 ’將讓刀具30切割所產生的粉塵31殘留 :膠㈣和工件i。切割道12中’難以被切削液所沖刷帶走 象問題點，同時，為了避免產生嚴重的膠帶沾黏、拉絲現 钬办該切割刀具3〇之位移速度亦必須相對放慢，然如此顯 〇曰加工速度及生產效能而*符較佳之產業利用效益。 疋以針對上述習知貼附有膠帶之工件切割面切割方 >所存在之問題‘點，如何研發出一種能夠更具理想實用性 5 200945975 =新構造1有待相關業界再加以思索突破之目標及方 有鑑於此’發明人本於多年從事相關產品之 與設計經驗’針對上述…，詳加設計與審慎評估後， 終得一確具實用性之本發明。 f依便 【發明内容】 本發明之主要目的，係在提供一種貼附有膠帶之工件 〇 ㈣面切割方法’其所欲解決之問題點，係針對習知貼附 有膠帶之工件切割面切割方法仍舊存在有膠帶沾黏、拉絲 現象以及影響加工速度及產能之問題點加以思索突破丨本 '發明特別是指—種針對待切割工件之切割面預設有切割道 之切割方法，所述方法包括貼附一膠帶於工件切割面上， 以將工件切割面之各切割道及各切割道二側之工件表面加 以覆蓋； 本發明解決問題之技術特點，主要在於所述膠帶完成 Ο 貼附後，並再藉由一施壓構件朝工件之切割面進行抵壓動 作’所述施壓構件設有凸伸部位與工件切割面之各切割道 相對位’令所述施壓構件下壓時，其各凸伸部位得將對應 之膠帶壓入其對應切割道中；藉此創新獨特設計，使本發 明對照先前技術而言’大致可達到如下之優點： 其一、確實防止膠帶沾黏、拉絲現象之發生，且大幅降低 粉塵殘留量而能有效提昇加工品質。 其二、可有效提昇切割刀具之位移加工速度，達到提昇產 6 200945975 能之較佳產業利用效益。 【實施方式】 5月參閱第2、3圖所示’係本發明貼附有膠帶之工件 切割面切割方法之較佳實施例，惟此等實施例僅供說明之 用在專利申請上並不受此結構之限制；本發明特別是指 種針對待切割工件4〇之切割面41預設有切割道42之切割 方法，所述方法，首先如第2圖所示，係包括貼附一膠帶 〇 50於所述工件40之切割面41上’以將工件40切割面41之各 切。彳道42以及各切割道42二側之工件表面43加以黏貼覆蓋 ’而本發明之核心設計在於： 所述膠帶50完成貼附後，如第3圖所示，並再藉由一 施壓構件60朝工件4〇之切割面41進行抵壓動作，所述施壓 構件60設有間隔分佈之凸伸部位61與工件4〇切割面41之各 切割道42相對位，令所述施壓構件6〇下壓時，其各凸伸部 位61得將對應之膠帶5〇壓入其對應之切割道拉中，接著如 © f 4圖所示，再進行切割刀具7〇之切割作業，以將工件4〇 切割成預疋數量之個體；其中所述工件4〇，可為電路板、 LED封裝材、晶圓等材料。 其中’所述施壓構件6〇所設凸伸部位61之寬度係大於 切割刀具70之寬度，以使膠帶5〇被壓入切割道42後所形成 的内凹空間寬度能夠大於切割刀具7〇之寬度，以確實防止 切割刀具70與膠帶50之間產生磨擦沾黏現象者。 其中’所述施壓構件6〇之凸伸部位61可設為凸條型態 7 200945975 、3圖所示）；除此之夕卜’所述凸伸部位亦可設 為滾輪型態、’而能夠透過橫向滚壓位移方式達到將^ 入切割道中之等同功效者。 本發明之優點：200945975 Nine, invention description: [Technical field of invention] Winter invention relates to Li---1 dry cutting method, innovative design of cutting surface cutting method for special workpiece of tape] ★ ★ Attachment [Prior Art] 〇❹ ' For some precision workpieces such as circuit boards, (10) package 2-shaped cutting and defensive, in order to facilitate the cutting and defensive when cutting, the value of the precision inspection, etc., the industry first f machine and the ancient β A hang will be waiting Cutting the top surface of the workpiece: There is a cutting channel with a suitable depth of the recess, as the second part of the cutting process is based on the 'step-by-step' as shown in Figure 1, and there are industries in the industry: A: a layer of tape 2 贴 is attached to the cut surface U; however, the current cut:: work method 'because the tape 2° is not in close contact with each of the tracks 12 of the workpiece 10 When the b* cutting tool 30 which is formed by the dicing tape 12 is vacant, the b* cutting tool 30 is detached, and the tape of the vacant portion is pulled, thereby causing the tape _ surface to be defective and causing sticking: the phenomenon of drawing; The depressed portion 21' of the 12 portion due to the hanging of the tape 20 will cause the dust 31 generated by the cutting of the cutter 30 to remain: the glue (4) and the workpiece i. In the cutting path 12, it is difficult to be washed away by the cutting fluid, and at the same time, in order to avoid serious tape sticking, the speed of the cutting of the cutting tool must be relatively slow, so it is so obvious.曰 Processing speed and production efficiency and * better industrial utilization benefits.疋The problem with the cutting surface of the workpiece with the tape attached to the above-mentioned] is how to develop a kind of more practical and practical. 5 200945975 = New construction 1 is waiting for the relevant industry to think again In view of the fact that the 'inventors have been engaged in related products and design experience for many years', the detailed design and careful evaluation have resulted in the practical invention. f 依 【 发明 【 【 【 【 【 【 【 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 发明 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 The method still has the problem that the tape is sticky, the drawing phenomenon and the processing speed and the production capacity are affected. The invention is in particular a cutting method in which a cutting surface is pre-set for the cutting surface of the workpiece to be cut, the method The utility model comprises the following steps: attaching a tape to the cutting surface of the workpiece to cover the cutting surfaces of the cutting surface of the workpiece and the surface of the workpiece on both sides of the cutting channel; the technical feature of the problem solving of the invention is mainly that the tape is finished after being attached And pressing the pressing surface toward the cutting surface of the workpiece by the pressing member. The pressing member is provided with a protruding portion and a cutting position of the cutting surface of the workpiece cutting surface to press the pressing member. Each of the protruding portions has to press the corresponding tape into its corresponding cutting lane; thereby, the innovative and unique design makes the present invention substantially as follows according to the prior art. Points: First, do to prevent sticking tape, drawing phenomena occurred, and significantly reduce the amount of residual dust can effectively improve processing quality. Second, it can effectively improve the displacement processing speed of the cutting tool, and achieve better industrial utilization benefits. [Embodiment] Referring to Figures 2 and 3, a preferred embodiment of the method for cutting a cutting surface of a workpiece to which the tape is attached according to the present invention is used in May, but these embodiments are for illustrative purposes only and are not used in patent applications. The invention is particularly limited to a cutting method in which a cutting path 42 is preliminarily provided for a cutting surface 41 of a workpiece to be cut, the method being first shown in FIG. 2, including attaching a tape. The crucible 50 is 'on the cut surface 41 of the workpiece 40' to cut each of the cut faces 41 of the workpiece 40. The tunnel 42 and the workpiece surface 43 on both sides of each cutting lane 42 are adhered and covered. The core design of the present invention is as follows: after the tape 50 is attached, as shown in FIG. 3, and further by a pressing member 60 is pressed against the cutting surface 41 of the workpiece 4, and the pressing member 60 is provided with a spaced-apart projection portion 61 opposite to each of the cutting passages 42 of the workpiece 4's cutting surface 41, so that the pressing member 6〇 When pressing down, each of the protruding portions 61 has to press the corresponding tape 5〇 into its corresponding cutting lane, and then, as shown in the image of f 4, the cutting operation of the cutting tool 7〇 is performed, The workpiece 4 is cut into a predetermined number of individuals; wherein the workpiece 4〇 can be a circuit board, an LED package material, a wafer, or the like. Wherein the width of the protruding portion 61 of the pressing member 6 is greater than the width of the cutting tool 70, so that the width of the concave space formed after the tape 5 is pressed into the cutting path 42 can be larger than the cutting tool 7〇. The width is such as to prevent friction between the cutting tool 70 and the tape 50. Wherein, the protruding portion 61 of the pressing member 6〇 can be set to be a convex strip type 7 200945975 and 3); in addition, the protruding portion can also be set as a roller type, It is also possible to achieve the equivalent effect in the cutting pass by the lateral rolling displacement. Advantages of the invention:
1·本發明所揭方法主要藉由㉟設一施壓構件，㈣用其凸 伸部位將膠帶壓入其對應切割道中之創新獨特設ς, 令膠帶整體能夠球實密纟貼附於工件切割面之㈣、首 内凹空間以及切割道二側之工件表面，如此相較^ 先前技術】所提之習知方法而言，本發明將可確實防 t膠贡沾黏、拉絲現象之發生，且大幅降低粉塵殘留 1、有效提昇加工品質而確具實用進步性。 2.本發明所揭方法能夠消除【先前技術】所提切割道部 位因勝帶懸空所形成的空隙，因此可確實防止膠帶沾 黏、拉絲現象發生，且粉塵殘留量得以大幅降低，由 於解決此一問題點，故可有效提昇切割刀具之位移加 工速度，從每秒40刪提高到每秒100刪甚至更高狀嗥， 使得產能能夠提高50 %以上，進而達到大幅提昇產能 之較佳產業利用效益者。 ^ 上述實施例所揭示者係藉以具體說明本發明，且文中 雖^過特定的術語進行說明，當不能以此限定本發明之專 利範圍；熟悉此項技術領域之人士當可在瞭解本發明之 神與原則後對其進行變更與修改而達到等效之目的，而此 等雙更與修改，皆應涵蓋於如后所述之申請專利範圍所界 定範_中。 8 200945975 【圖式簡單說明】 第1圖：係習知方法之實施狀態示意圖。 第2圖：本發明所揭方法之實施步驟圖一。 第3圖：本發明所揭方法之實施步驟圖二。 第4圖：本發明所揭方法之實施步驟圖三。 【主要元件符號說明】 習知部份： 工件 1 0 切割道 1 2 膠帶 2 0 刀具 3 0 本發明部份： 切割工件 4 0 切割道 4 2 膠帶 5 0 施壓構件 6 0 7 0 切割刀具1. The method disclosed in the present invention mainly uses 35 to set a pressing member, and (4) uses the protruding portion to press the tape into the corresponding unique design of the corresponding cutting channel, so that the entire tape can be attached to the workpiece by the ball. The surface of the workpiece (4), the first concave space and the surface of the workpiece on both sides of the cutting path, so that the present invention can surely prevent the sticking and drawing phenomenon of the glue. And greatly reduce the residual dust 1, effectively improve the processing quality and it is practical and progressive. 2. The method disclosed in the present invention can eliminate the gap formed by the hanging zone of the boring section mentioned in the prior art, thereby reliably preventing the tape from sticking and drawing, and the residual amount of dust is greatly reduced. A problem point, it can effectively improve the displacement processing speed of the cutting tool, from 40 per second to 100% per second or even higher, so that the production capacity can be increased by more than 50%, thereby achieving better industrial utilization by greatly increasing production capacity. Benefits. The above embodiments are disclosed to illustrate the invention, and the specific terms are used herein to limit the scope of the invention, and those skilled in the art can understand the invention. God and the principle change and modify it to achieve the purpose of equivalence, and such doubles and modifications shall be covered in the scope defined in the scope of patent application as described later. 8 200945975 [Simple description of the diagram] Figure 1: Schematic diagram of the implementation state of the conventional method. Figure 2: Figure 1 of the implementation steps of the method disclosed in the present invention. Figure 3: Step 2 of the implementation of the method disclosed in the present invention. Figure 4: Figure 3 of the implementation steps of the method disclosed in the present invention. [Main component symbol description] Conventional part: Workpiece 1 0 Cutting path 1 2 Tape 2 0 Tool 3 0 Part of the invention: Cutting the workpiece 4 0 Cutting path 4 2 Tape 5 0 Pressing member 6 0 7 0 Cutting tool
切割面 凹陷空隙 21 粉塵 3 1 切割面 41 工件表面 43 凸伸部位 9Cutting surface Depressed void 21 Dust 3 1 Cutting surface 41 Workpiece surface 43 Projecting part 9