200945938 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於搭載發光元件之佈線基板，更詳 細而言，係關於一種用於搭載對於來自基板表面之光之反 射良好的發光元件之佈線基板、及於該用於搭載發光元件 之佈線基板上搭載有發光元件之發光裳置。 【先前技術】 先鈿，對於將南免度之發光二極體（led)、半導體雷射 (LD)等之發光元件搭載於用於搭載發光元件之佈線基板 (以下，亦僅稱為佈線基板）上的發光裝置，於各種顯示 板、照明、背光等中有所使用。 虫圖5所示，上述先岫之發光裝置一般例如形成為封裝 構造，其係由搭載有發光元件丨之基體2、及含有貫通孔〕 之框體4所構成，於基體2上，設置有從外部對發光元件】 通電以使其發光之複數個佈線導體5a、5b(參照專利文獻 1)。 搭載於上述封裝内之發光元件1係經由佈線導體5a、5b 及接線6而從外部通電來發光。 亦了較夕地使用未設置有上述圖5所示之框體4、而 僅將發光元件1搭載於基體2上之構造之發光裝置。 於圖5所示之構造之發光裝置中，由發光元件1所發出之 光^接射出到外部，同時向框體4之内周面仆、及包含佈 線¥體53、5b之上述基體表面。之由該框體4所包圍之部 刀反射後射出到外部。於上述基體表面2a之由該框體*所 139217.doc 200945938 包圍之部分上，當佈線導體5a、5b之配設面積比例較大 時，该佈線導體5a、5b之表面之光反射率會對全體光之射 出量有較大影響。 又，對於未設置有上述圖5所示之框體4、而僅將發光元 件1搭載於基體2上之構造之發光裝置而言，與設置有框體 4之圖5所不之構造之發光裝置相比，佈線導體5a、％之表 面之反射比例進一步增加，因此佈線導體5a、％之表面之 光反射率會對全體光之射出量有更大影響。 作為上述佈線導體5a、5b所使用之金屬，一般使用銀、 銀系合金、金等之貴金屬導體或者銅、鎢（w)、錮等 之導體，根據需要，以賦予焊料濡濕性等為目的而對導體 之表面實施鍍鎳（Ni)、鍍銀或鍍金。上述佈線導體让 以較大之配設面積比例被使用，故而從光之射出量之觀 點，最好佈線導體5a、5b之最表層使用光反射率良好之 銀。 然而，銀系之佈線導體隨著時間之經過，其表面會因化 學變化而變色，光反射率下降，所以一般在需要長期可靠 性之用途方面使用反射率低的金導體或者施以鍍金之導 體。因此，先前之發光裝置存在如下問題：基體表面。之 光反射率低，且光之射出量小。 專利文獻1:曰本專利特開20〇4_228531號公報 【發明内容】 本發明之問題在於消除上述先前之發光裝置之問題點， 即提供一種基體表面之光反射率高、長期維持較高的光反 139217.doc 200945938 射率之用於搭载發光元件之佈線基板。 本發明者等經過反覆專心研究之結果發現，藉由於銀系 之佈線導體上形成玻璃層可解決上述問題，從而完成本發 明。 χ 即，本發明提供一種用於搭載發光元件之佈線基板，其 特徵在於.其係於基體上形成有用以驅動纟光元件之佈線 • H ^至少該發光元件發出之光所照射之預定部位的該 Φ 料導體為㈣之佈線導體，於該料、之佈料體之表面 上形成有玻璃層。 又，本發明提供一種於上述本發明之用於搭載發光元件 之佈線基板上搭載有發光元件之發光裝置。 又，本發明提供一種發光裝置之製造方法，作為上述本 發明之發光裝置之製造方法，其特徵在於包括如下步驟： 以至J發光π件發出之光所照射之預定部位的佈線導體成 為銀系之佈線導體之方式，於基體上形成用以驅動發光元 © 件之佈線導體；於該㈣之佈料體之表面上形成玻璃 層；及於佈線基板上搭載發光元件。 【實施方式】 、下 面參照圖式，一面說明本發明之用於搭載發光 元件之基板之較佳實施形態。 、首先，對圖1所示之實施形態進行說明。圖〗⑷及圖i(b) 分別係表示本發明之用於搭載發光元件之佈線基板之一較 佳實施形態的剖面圖及俯視圖，圖】⑷係圖】⑻之a_a線刮 面圖。 139217.doc 200945938 如圖1所示，為了讓玻璃層8之位置變得明確，將本實施 形態之用於搭载發光元件之佈線基板八以於佈線基板上配 設有發光元件1與接線6之狀態進行圖示。 如圖1(a)及圖1(b)所示，本實施形態之用於搭載發光元 件之佈線基板A係於基體2上，從基體2之上部表面2a覆蓋 外緣部並直至下部表面為止而形成有用以驅動發光元件^ 之銀系之佈線導體5a、5b。並且，於基體2之上部表面& 上所形成之銀系之佈線導體5a、5b的表面、且除發光元件 1之搭載部分及接線6之接合部分（無助於光反射之部分）以 外之整個表面上’形成有玻璃層8。 在形成於基體2之上部表面2a上之—方之銀系佈線導體 5a上搭載有發光元件i ’該發光元件！與另一方之銀系佈線 導體5b藉由接線6而電性連接。 接著，對圖2所示之本發明之用於搭載發光元件之佈線 基板的另-較佳實施形態進行說明。圖2⑷係相當於圖冰 不之實施形態之圖1(a)的剖面圖，圖2(b)係相當於上述圖 1(b)之俯視圖，圖2(a)係圖2(b)之b_b線剖面圖。 如圖2(a)及（b)所示’本實施形態之用於搭載發光元件之 佈線基板B係於佈線基板上設置有含有貫通孔3之框體4之 封裝構造的佈線基板，設置有該框體4，並且僅於由該框 體4之内周面_包圍之部分之銀系佈線導體％之表 面上形成有玻璃層8 ’除此以外，與圖i所示之實施形態之 用於搭載發光元件之佈線基板纽相同方式而構成。^ 本實施形態之用於搭載發光元件之佈線基板㈣以於設 139217.doc 200945938 置有框體4之封裝構造之佈線基板上配設有發光元件丨與接 線6之狀態而顯示。 在使用有本實施形態之用於搭載發光元件之佈線基板B 的發光裝置中，由發光元件i所發出之光直接射出到外 部，同時向框體4之内周面4b、及包含佈線導體5a、几之 ' 上述基體表面2a之由該框體4所包圍之部分反射後射出到 * 外部。再者’圖2中’ 4a為框體4之外周面。 _ 其次，對圖3所示之本發明之用於搭载發光元件之佈線 基板的又一較佳實施形態進行說明。圖3(a)係相當於圖 示之實施形態之圖1(a)的剖面圖，圖3(b)係相當於上述圖 1(b)之俯視圖，圖3(a)係圖3(b)iC_c線剖面圖。 如圖3所示，本實施形態之用於搭載發光元件之佈線基 板C係設置有框體4之封裝構造之佈線基板，其以於該封裝 内配設有發光元件丨、熱阻器元件9及接線6之狀態而圖 示0 ❹ 如圖3(a)及（b)所示，本實施形態之用於搭載發光元件之 佈線基板C係於基體2上，從基體2之上部表面以覆蓋外緣 .部並直至下部表面為止而形成有用以驅動發光元件丨及熱 阻器元件9之銀系之佈線導體5a、5b。並且，於基體2之上 部表面2a上所形成之銀系之佈線導體5a、讣的表面、且除 發光元件1之搭載部分、熱阻器元件9之搭載部分及接線6 之接合部分（無助於光反射之部分）以外的整個表面上形 成有玻璃層8。 為了對形成於基體2之上部表面2a上之銀系佈線導體 139217.doc 200945938 5a 5b之表面、且未形成有玻璃層8之佈線導體5a、5b之 表面賦予防止該佈線導體隨時間經過而產生之化學變化或 <賦予線接合性’本實施形態之用於搭載發光元件之佈線 基板c中形成有鍍鎳層1〇。 以下，對構成本發明之用於搭載發光元件之佈線基板之 上述基體2、銀系之佈線導體5&、处及玻璃層8進行更詳細 地說明。 構成本發明之用於搭載發光元件之佈線基板之基體2 中，圖1、2及3所示之用於搭載發光元件之佈線基板A、B 及C係使用長方形或正方形之形狀者，但亦可為圓形、橢 圓形或多角形之形狀者，只要為板狀之形狀，則無特別限 制。 二作為基體2，可使用例如氧化鋁質燒結體（氧化鋁陶 竞）、氮化鋁質燒結體、莫來石質燒結體、玻璃陶瓷等之 陶瓷，或者於鋁或不鏽鋼等上塗佈有絶緣材之金屬基板 等。 基體2之製造方法並無特別限定’可使用例如生坯片材 法、粉體成型法等，其中，上述生远片材法係在使用陶究 之情況下，於該陶瓷原材料之粉末中添加混合適當之有機 黏結劑、溶劑等而形成泥漿狀，並將此藉由先前周知之到 刀成形法或砑光輥法等而成形為片材狀，獲得生坯片材， 然後，以高溫（約1600。〇進行煅燒而製作，上述粉體成型 法係將原料粉體填充到成型機中成型後進行煅燒，但由於 板狀之關係，故而較好的是以生坯片材法進行製造。生坯 139217.doc 200945938 片材法之製造使用公知之生坯片材法。 上述基體2上所形成之体線導體化、5b只要為可讓 於基體2上之發光元件1因外部之通電而發光之形態，則可 形成於基體2之任一部分上，為了至少與發光元件!直接或 者經由接線6而與發光元件1進行電性連接，上述佈線導體 53、51?可形成於用以讓搭载有發光元件！之上述基體2之上 部表面2a與外部通電之預定的部位。 々圖1 2及3所不’佈線導體化、％之配設例如可為從 基肢2之上部表面23覆蓋外緣部並直至下部表面為止而形 成佈線導體5a、5b之配設形態。又，作為另 所不’可舉出將形成於基體2之下部表面上之佈線導體 5a、5b及形成於基體2之卜 土遛2之上。p表面2a上之佈線導體&、讣 :由通孔7而連接之配設形態等’但並非限制於該等形 態。 於基體2之上部表面2a上所形成之佈線導體％之配 設形態可根據所搭载之發光元件！、其他的電子元件、接 線6、及其他的輔助構件之配設設計而自由選擇。 佈線導體5a、外之厚度可根據其製造方法而決定最佳 值，但對於厚膜印刷之㈣之佈線導“言，較好的是 3〜20 _ ’更好的是5〜12 μιη。佈線導體心％若過薄，則 =生飛白或針孔等印刷性問題，又，若過厚，則難以形 成精細之電路且成本上漲。 為了提高佈線基板上之發光元件i發出之光之反射率， 在形成於基體2上之佈線導體5a、㈣，至少該發光元件i 139217.doc 200945938 發出之光所照射之預定部位上的該佈線導體5a、％必須為 銀系之佈線導體。 作為形成銀系之佈線導體之金屬，除銀以外，可舉出銀/ 鉑、銀/鈀等之銀系合金，銀之含有率較好的是8〇%以上， 更好的是90%以上。 發光元件1發出之光所照射之預定部位以外之部位上的 佈線導體5a、5b未必要為銀系之佈線導體，作為形成該等 部位上之佈線導體之金屬，可使用鎢、鉬、銅、纪、麵等 之金屬。 再者，所謂「發光元件1發出之光所照射之預定部位」， 例如係指於圖2所示之封包構造之佈線基板上基體2之上部 表面2a、且由框體4之内周面4b所包圍之部分。又，對於 未使用有圖1所示之框體4、而僅將發光元件〖搭載於基體2 上之構造之佈線基板，則係指基體2之整個上部表面。 作為佈線導體5a ' 5b之形成方法，並無特別限制，可舉 出例如電鑛之方法、以及將使上述金屬之粉末分散於有機 洛劑中之導體膏進行塗佈、乾燥、煅燒而獲得之方法等。 在使用上述導體膏時，例如，利用網版印刷等而將導體 膏塗佈於基體2上，以80〜15CTC之溫度乾燥1〇〜60分鐘之 後，以峰值溫度500〜900。(：煅燒3〜15分鐘，藉此可獲得佈 線導體5a、5b。 在發光元件1發出之光所照射之預定部位上的銀系之佈 線導體5a、5b之表面上所形成之玻璃層8可長期保護具有 咼光反射率之銀系之佈線導體Sa、5b之表面，因而本發明 139217.doc •10· 200945938 之用於搭載發光元件之佈線基板可長期維持高光反射率。 玻璃層8形成於至少基體2之上部表面2a_L所形成之銀系 之佈線導體5_a、外之表面上、且除了發光元件匕搭載部 刀熱阻益70件9等之其他電子元件之搭載部分、接線6之 接合部分、其他輔助構件之接合部分、框體4之外側部分 等無助於發光元件"务出 本 赞出之先之反射的部分以及電性連 部以外之整個表面上。 玻璃層8之厚度較好的是5〜4〇陣，更好的是〜3〇叫。 右玻璃層8之厚度較薄，則玻璃層8上易產生針孔等而使佈 線導體之料效果降低。若玻璃層8之厚度較厚，則光之 反射率會降低。 玻璃層8較好的是透明無色。作為形成玻璃層8之玻璃材BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board for mounting a light-emitting element, and more particularly to a light-emitting element for carrying light reflection from a surface of a substrate. The wiring board and the light-emitting element mounted on the wiring board on which the light-emitting element is mounted are mounted on the wiring board. [Prior Art] A light-emitting element such as a light-emitting diode (LED) or a semiconductor laser (LD) of the South Korea is mounted on a wiring board on which a light-emitting element is mounted (hereinafter, simply referred to as a wiring substrate). The light-emitting device on the screen is used in various display panels, illumination, backlights, and the like. As shown in FIG. 5, the light-emitting device of the above-described prior art is generally formed, for example, in a package structure, and is composed of a base body 2 on which a light-emitting element 搭载 is mounted and a frame body 4 including a through-hole, and is provided on the base 2 A plurality of wiring conductors 5a and 5b that are energized to emit light to emit light from the outside (see Patent Document 1). The light-emitting element 1 mounted in the package is electrically supplied from the outside via the wiring conductors 5a and 5b and the wiring 6 to emit light. In the same manner, a light-emitting device having a structure in which the casing 4 shown in Fig. 5 is not provided and the light-emitting element 1 is mounted on the base 2 is used. In the light-emitting device of the structure shown in Fig. 5, the light emitted from the light-emitting element 1 is emitted to the outside, and simultaneously faces the inner peripheral surface of the casing 4 and the surface of the substrate including the wiring bodies 53, 5b. The blade surrounded by the frame 4 is reflected and then emitted to the outside. On the portion of the substrate surface 2a surrounded by the frame body 139217.doc 200945938, when the arrangement area ratio of the wiring conductors 5a, 5b is large, the light reflectance of the surface of the wiring conductors 5a, 5b will be The amount of light emitted by the whole light has a greater impact. Further, in the light-emitting device having the structure in which the light-emitting element 1 is mounted on the base 2 without the frame 4 shown in FIG. 5 described above, the light-emitting device having the structure of the frame 4 provided in FIG. Since the reflection ratio of the surface of the wiring conductors 5a and % is further increased, the light reflectance of the surface of the wiring conductors 5a and % has a greater influence on the amount of light emitted by the entire light. As the metal used for the wiring conductors 5a and 5b, a noble metal conductor such as silver, a silver alloy, or gold, or a conductor such as copper, tungsten (w) or tantalum is used, and for the purpose of imparting solder wettability or the like as needed. The surface of the conductor is plated with nickel (Ni), silver plated or gold plated. Since the wiring conductor is used in a large ratio of the arrangement area, it is preferable that the outermost layer of the wiring conductors 5a and 5b is silver having a good light reflectance from the viewpoint of the amount of light emitted. However, silver-based wiring conductors change color due to chemical changes over time, and light reflectance decreases. Therefore, gold conductors with low reflectance or gold-plated conductors are generally used for applications requiring long-term reliability. . Therefore, the prior illuminating device has the following problems: the surface of the substrate. The light reflectance is low and the amount of light emitted is small. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 20-228531. SUMMARY OF THE INVENTION The problem of the present invention is to eliminate the problem of the above-mentioned conventional light-emitting device, that is, to provide a light having a high light reflectance on the surface of the substrate and maintaining high light for a long period of time. Anti-139217.doc 200945938 The transmittance is used for the wiring board on which the light-emitting elements are mounted. As a result of repeated intensive studies, the inventors of the present invention have found that the above problems can be solved by forming a glass layer on a wiring conductor of a silver type, thereby completing the present invention. That is, the present invention provides a wiring board for mounting a light-emitting element, characterized in that it is formed on a substrate to form a wiring for driving the light-emitting element, and at least a predetermined portion irradiated by light emitted from the light-emitting element The Φ material conductor is a wiring conductor of (4), and a glass layer is formed on the surface of the material and the cloth body. Moreover, the present invention provides a light-emitting device in which a light-emitting element is mounted on a wiring board on which a light-emitting element is mounted according to the present invention. Moreover, the present invention provides a method of manufacturing a light-emitting device, which is characterized in that the method of manufacturing a light-emitting device according to the present invention includes the steps of: a wiring conductor of a predetermined portion irradiated with light emitted from a light-emitting element of J is made of silver A wiring conductor is formed on the substrate to form a wiring conductor for driving the light-emitting element, a glass layer is formed on the surface of the cloth body (4), and a light-emitting element is mounted on the wiring substrate. [Embodiment] A preferred embodiment of a substrate for mounting a light-emitting device of the present invention will be described below with reference to the drawings. First, the embodiment shown in Fig. 1 will be described. Fig. 4(4) and Fig. 1(b) are respectively a cross-sectional view and a plan view showing a preferred embodiment of a wiring board for mounting a light-emitting element of the present invention, and Fig. 4 is a plan view of the a_a line of (8). 139217.doc 200945938 As shown in Fig. 1, in order to clarify the position of the glass layer 8, the wiring substrate 8 for mounting a light-emitting element of the present embodiment is provided with a light-emitting element 1 and a wiring 6 on the wiring substrate. The status is shown. As shown in Fig. 1 (a) and Fig. 1 (b), the wiring board A for mounting a light-emitting element of the present embodiment is attached to the base 2, and the outer edge portion is covered from the upper surface 2a of the base 2 to the lower surface. On the other hand, silver wiring conductors 5a and 5b for driving the light-emitting elements are formed. Further, on the surface of the silver-based wiring conductors 5a and 5b formed on the upper surface & of the base 2, and the joint portion of the light-emitting element 1 and the joint portion of the wiring 6 (the portion which does not contribute to light reflection) A glass layer 8 is formed on the entire surface. The light-emitting element i' is mounted on the silver-based wiring conductor 5a formed on the upper surface 2a of the base 2; The silver wiring conductor 5b of the other side is electrically connected by the wiring 6. Next, another preferred embodiment of the wiring board for mounting a light-emitting element of the present invention shown in Fig. 2 will be described. Fig. 2(4) is a cross-sectional view corresponding to Fig. 1(a) showing an embodiment of the ice, Fig. 2(b) is a plan view corresponding to Fig. 1(b), and Fig. 2(a) is a view of Fig. 2(b) B_b line profile. As shown in Fig. 2 (a) and (b), the wiring board B on which the light-emitting element is mounted in the present embodiment is a wiring board in which a package structure including the frame 4 of the through-hole 3 is provided on the wiring board, and is provided. The frame 4 is formed of a glass layer 8' only on the surface of the silver-based wiring conductor % of the portion surrounded by the inner peripheral surface of the frame 4, and is used in the embodiment shown in FIG. It is configured in the same manner as the wiring board on which the light-emitting elements are mounted. The wiring board (4) for mounting a light-emitting element of the present embodiment is displayed in a state in which the light-emitting element 丨 and the wiring 6 are disposed on the wiring board on which the package structure of the housing 4 is provided in 139217.doc 200945938. In the light-emitting device using the wiring board B for mounting a light-emitting element of the present embodiment, the light emitted from the light-emitting element i is directly emitted to the outside, and the inner peripheral surface 4b of the casing 4 and the wiring conductor 5a are included. The portion of the substrate surface 2a surrounded by the frame 4 is reflected and then emitted to the outside of *. Further, '4a' in Fig. 2 is the outer peripheral surface of the casing 4. Next, still another preferred embodiment of the wiring board for mounting a light-emitting element of the present invention shown in Fig. 3 will be described. Fig. 3(a) is a cross-sectional view corresponding to Fig. 1(a) of the embodiment shown in the drawings, Fig. 3(b) is a plan view corresponding to Fig. 1(b), and Fig. 3(a) is Fig. 3(b) ) iC_c line profile. As shown in FIG. 3, the wiring board C on which the light-emitting element is mounted in the present embodiment is provided with a wiring board having a package structure of the housing 4, and a light-emitting element 丨 and a thermal resistor element 9 are disposed in the package. And the state of the wiring 6 and the figure 0 ❹ As shown in Fig. 3 (a) and (b), the wiring board C for mounting the light-emitting element of the present embodiment is attached to the base 2, and is covered from the upper surface of the base 2 The silver-based wiring conductors 5a and 5b for driving the light-emitting element 丨 and the thermistor element 9 are formed on the outer edge portion up to the lower surface. Further, the silver-based wiring conductor 5a formed on the upper surface 2a of the base 2, the surface of the crucible, and the mounting portion of the light-emitting element 1, the mounting portion of the thermistor element 9, and the joint portion of the wiring 6 (not helpful) A glass layer 8 is formed on the entire surface other than the portion where the light is reflected. In order to prevent the wiring conductor from passing over the surface of the wiring conductors 5a, 5b on the surface of the silver-based wiring conductor 139217.doc 200945938 5a 5b formed on the upper surface 2a of the base 2 and not having the glass layer 8 formed thereon Chemical change or <wire bonding property' The nickel plating layer 1 is formed in the wiring board c for mounting a light-emitting element of this embodiment. Hereinafter, the substrate 2, the silver-based wiring conductor 5& and the glass layer 8 constituting the wiring board on which the light-emitting element of the present invention is mounted will be described in more detail. In the base 2 constituting the wiring board on which the light-emitting element of the present invention is mounted, the wiring boards A, B, and C for mounting the light-emitting elements shown in FIGS. 1, 2, and 3 are formed in a rectangular or square shape, but The shape which may be a circular shape, an elliptical shape or a polygonal shape is not particularly limited as long as it is a plate shape. As the substrate 2, for example, a ceramic such as an alumina sintered body (aluminum terracotta), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic can be used, or coated on aluminum or stainless steel or the like. A metal substrate of an insulating material or the like. The method for producing the base 2 is not particularly limited. For example, a green sheet method, a powder molding method, or the like can be used. The above-mentioned raw sheet method is added to the powder of the ceramic raw material in the case of using ceramics. The slurry is formed by mixing a suitable organic binder, a solvent, or the like, and is formed into a sheet shape by a conventionally known method such as a knife forming method or a calender roll method to obtain a green sheet, and then at a high temperature ( It is produced by calcination at about 1600. The powder molding method is performed by filling a raw material powder into a molding machine and then calcining it. However, since it is in the form of a plate, it is preferably produced by a green sheet method. The green sheet 139217.doc 200945938 The sheet method is produced by using a known green sheet method. The body line conductor formed on the base 2 is 5b, and the light-emitting element 1 on the substrate 2 can be externally energized. The light-emitting form may be formed on any portion of the base 2, and the wiring conductors 53 and 51 may be formed to allow the wire to be electrically connected to the light-emitting element 1 at least directly or via the wire 6. There is a predetermined portion of the upper surface 2a of the base 2 and the external portion of the substrate 2, and the wiring conductors and % are disposed, for example, from the upper surface 23 of the base member 2. The arrangement of the wiring conductors 5a and 5b is formed in the edge portion up to the lower surface. Further, the wiring conductors 5a and 5b formed on the lower surface of the substrate 2 and the wiring body 2 are formed as the other portions. Above the soil 2, the wiring conductors on the surface 2a of the p surface 2a, and the arrangement of the vias 7 are not limited to these forms. The layout of the wiring conductor % can be freely selected according to the arrangement of the mounted light-emitting elements, other electronic components, the wiring 6, and other auxiliary members. The thickness of the wiring conductor 5a and the outer layer can be made according to the manufacturing method thereof. Determine the best value, but for thick film printing (four) wiring guide "say, it is better 3~20 _ 'better 5~12 μιη. If the wiring conductor core% is too thin, then = raw white or needle Printability problems such as holes, if too thick, then In order to form a fine circuit and increase the cost. In order to increase the reflectance of light emitted from the light-emitting element i on the wiring substrate, at least the light-emitting element i 139217.doc 200945938 is formed on the wiring conductor 5a, (4) formed on the substrate 2. The wiring conductor 5a and % at the predetermined portion to be irradiated must be a silver-based wiring conductor. Examples of the metal forming the silver-based wiring conductor include silver-based alloys such as silver/platinum and silver/palladium. The silver content is preferably 8% or more, more preferably 90% or more. The wiring conductors 5a and 5b on the portions other than the predetermined portion irradiated by the light emitted from the light-emitting element 1 are not necessarily silver-based wiring. As the conductor, as the metal forming the wiring conductor on the portions, a metal such as tungsten, molybdenum, copper, or a surface can be used. In addition, the "predetermined portion to which the light emitted from the light-emitting element 1 is irradiated" means, for example, the upper surface 2a of the base 2 on the wiring board of the package structure shown in FIG. 2, and the inner peripheral surface 4b of the frame 4 The part enclosed. In addition, the wiring board having the structure in which the light-emitting element is mounted on the base 2 without using the frame 4 shown in Fig. 1 means the entire upper surface of the base 2. The method for forming the wiring conductors 5a to 5b is not particularly limited, and examples thereof include a method of electrowinning, and a method of coating, drying, and calcining a conductor paste in which the powder of the metal is dispersed in an organic binder. Method, etc. When the above conductor paste is used, for example, a conductor paste is applied onto the substrate 2 by screen printing or the like, and dried at a temperature of 80 to 15 CTC for 1 to 60 minutes, and a peak temperature of 500 to 900. (: calcination for 3 to 15 minutes, whereby wiring conductors 5a, 5b can be obtained. The glass layer 8 formed on the surface of the silver-based wiring conductors 5a, 5b at a predetermined portion irradiated with light emitted from the light-emitting element 1 can be Since the surface of the silver-based wiring conductors Sa and 5b having the calender reflectance is protected for a long period of time, the wiring board for mounting a light-emitting element of the present invention 139217.doc •10·200945938 can maintain the high light reflectance for a long period of time. At least the silver-based wiring conductor 5_a formed on the upper surface 2a_L of the base 2, the outer surface, and the mounting portion of the other electronic components such as the light-emitting element 匕 mounting portion, the heat resistance 70, and the like, and the joint portion of the wiring 6. The joint portion of the other auxiliary members, the outer portion of the frame 4, and the like do not contribute to the light-emitting element, and the portion of the reflection and the entire surface other than the electrical joint. The thickness of the glass layer 8 is higher. Preferably, it is a 5 to 4 array, and more preferably a ~3 squeak. When the thickness of the right glass layer 8 is thin, pinholes or the like are easily generated on the glass layer 8, and the effect of the wiring conductor is lowered. Thicker, Light reflectance decreases. Glass layer 8 is preferably transparent and colorless. The glass material forming the glass layer 8
料’可使用以Si〇2、A 2〇3 Pb〇、A!203、RO(R為鹼土類 金屬）等為主成分之粉末玻璃等。 ❹ 作為玻璃層8之形成方法’可舉出：將使上述玻璃材料 之粉體分散於有機溶财之玻㈣塗佈乾燥後進行锻燒之 方法將預先成型為特定形狀之玻璃箱重疊於特定之佈線 ^表面上並進仃加熱熔融之方法等’但從效率的觀點 而言，較好的是利用玻璃膏之方法。 對於利用玻璃膏之方法，例如，藉由網版㈣等將玻璃 膏塗佈於佈線導體5a、5b之特定表面上，以8〇〜15代之溫 度乾燥10〜6 0分鐘之德，丨v成杜、ra 士 灸乂峰值>现度500〜9〇〇。(：煅燒3〜15分 鐘，由此可獲得玻璃層8。 如圖2及圖3所示，根據需要，本發明之用於搭載發光元 139217.doc -11 - 200945938 件之佈線基板可為設置有框體4之封裝構造之佈線基板。 上述框體4之材料可使用與上述基體2之形成材相 1同之材 料。 框體4之製造方法並無特別限制，可藉由上述之生坯片 材法、粉體成型法而製造，但從可製造正確形狀之框體4 且發光裝置之發光效率變高之觀點而言，較好的是粉體成 型法。粉體成型法可使用公知之方法或者國際公開第 2007/058361號（界〇2007/058361幻）小冊子中所記載之粉體 製造法。 一般而言，框體4係藉由使用接著劑而與佈線導體、 5b或基體2接著所設置。例如，於基體2之特定部位塗佈接 著劑，將框體4疊合併接著。 作為上述接著劑，可使用玻璃膏、熱硬化性之環氧樹 脂、矽樹脂等之各種樹脂接著劑等。 在使用熱硬化性之環氧樹脂、石夕樹脂等之各種樹脂接著 劑而將基體2與框體4加以接著時，於基體2上塗佈接著劑 之後，讓基體2與框體4疊合併於特定之硬化條件下使接著 劑硬化。 在使用玻璃膏將基體2與框體4加以接著時，由於玻璃膏 係含有玻璃粉末、有機黏結劑、溶劑、進而根據需要而含 有氧化矽、氧化鋁等之填充劑之膏狀之組成物，故而必須 進行溶劑之乾燥及玻璃之燒結。 在塗佈接著劑時，可使用網版印刷、分配器等之裝置進 行塗佈。 1392l7.doc -12- 200945938 關於接著劑之塗佈厚度，诵堂，I# u 手度通常對於樹脂系之接著劑而 言，較好的是（UH〜(M _，更好的是⑽〜⑽咖，對 於玻璃膏而S，較好的是〇〇1〜〇 3咖，更好的是 0.02〜0.15 mm。若接著劑之塗佈厚度未滿上述下限值，則 會在接著劑層與框體4之間產生間隙，造成接著不足， 又，若接㈣之塗佈厚度超^述上限值，則會使接著劑 層向模穴側流出，從而有反射效率下降之傾向。As the material, powder glass containing Si 〇 2, A 2 〇 3 Pb 〇, A 203, RO (R is an alkaline earth metal) or the like as a main component can be used. ❹ As a method of forming the glass layer 8 , a method in which the glass material of the glass material is dispersed in an organic solvent (four) is dried and then calcined, and a glass box previously molded into a specific shape is superposed on a specific one. The wiring is a method of heating and melting, etc. on the surface, but from the viewpoint of efficiency, a method using a glass paste is preferred. For the method using a glass paste, for example, a glass paste is applied to a specific surface of the wiring conductors 5a, 5b by a screen (four) or the like, and dried at a temperature of 8 Torr to 15 for 10 to 60 minutes, 丨v Cheng Du, ra 乂 乂 乂 peak > now 500~9 〇〇. (: calcination for 3 to 15 minutes, whereby the glass layer 8 can be obtained. As shown in Fig. 2 and Fig. 3, the wiring substrate for mounting the illuminating element 139217.doc -11 - 200945938 of the present invention can be set as needed. A wiring board having a package structure of the frame 4. The material of the frame 4 can be the same as that of the substrate 2 of the substrate 2. The manufacturing method of the frame 4 is not particularly limited, and the green body can be used. Though it is produced by a sheet method or a powder molding method, a powder molding method is preferred from the viewpoint that a frame 4 having a correct shape can be produced and the luminous efficiency of the light-emitting device is increased. A powder molding method can be used. The method of powder production described in the pamphlet of International Publication No. 2007/058361 (U.S. Patent No. 2007/058361). In general, the frame 4 is connected to the wiring conductor, the 5b or the substrate 2 by using an adhesive. Then, for example, an adhesive is applied to a specific portion of the base 2, and the frame 4 is laminated and laminated. As the adhesive, various resins such as a glass paste, a thermosetting epoxy resin, and a enamel resin may be used. Agent, etc. When the substrate 2 and the frame 4 are bonded together with various resin adhesives such as epoxy resin and Shishi resin, after the adhesive is applied onto the substrate 2, the substrate 2 and the frame 4 are stacked and bonded to a specific hardening. In the case where the substrate 2 and the frame 4 are bonded together by using a glass paste, the glass paste contains a glass powder, an organic binder, a solvent, and a filler such as cerium oxide or aluminum oxide as needed. The paste-like composition is required to be dried in a solvent and sintered in glass. When the adhesive is applied, it can be applied by a device such as screen printing or a dispenser. 1392l7.doc -12- 200945938 About the adhesive Coating thickness, 诵堂, I# u Hand is usually preferred for resin-based adhesives (UH~(M _, more preferably (10)~(10) coffee, for glass paste and S, Preferably, it is 〇〇1 to 〇3 coffee, more preferably 0.02 to 0.15 mm. If the coating thickness of the adhesive is less than the above lower limit, a gap is formed between the adhesive layer and the frame 4, resulting in a gap. Then insufficient, and if the coating thickness of (4) is super Limit, the adhesive layer will flow out to the side of the cavity, so that the reflection efficiency tends to be lowered.
所塗佈之各種接著劑係於推薦各個接著劑之乾燥，锻燒 條件下經乾燥，煅燒等而將基體2與框體4加以接著。 再者，接著劑層未圖示於圖中。 如圖3所示，為了對未形成有玻璃層8之佈線導體5a、5b 之表面賦予防止該佈線導體隨時間經過而引起之化學變化 或者賦予線接合性，本發明之用於搭载發光元件之佈線基 板中亦可形成電鍍層10〇作為該電鍍層1〇，較好的是鍍 鎳、鍍金。電鍍層10之厚度較好的是卜“ μιη，更好的是 2〜1 0 μηι。 為提高製造效率，本發明之用於搭載發光元件之佈線基 板之工業製造法較好的是採用如下方法：通常，於基板片 材上製作許多個佈線基板單位，並設置發光元件1、接線6 等之後’或者於適當之階段，將該片材進行分割。可於本 發明之用於搭載發光元件之佈線基板上搭载發光元件^及 根據需要而搭載其他的各種電子元件，並進行佈線，向模 穴中填充密封劑，形成發光裝置。上述發光元件1並無特 別限定，可使用LD(半導體雷射）、LED(發光二極體）等之 139217.doc 】3 200945938 光半導體元件。 作為上述密封劑’可舉出環氧樹脂、矽樹脂、醯亞胺樹 脂等之樹脂系密封劑、玻璃系密封劑，但玻璃系密封劑需 要於高溫下進行處理，故會對既已設置之發光元件丄等之 電子元件及其他零件造成，惡劣影響，因而較好的是樹脂系 密封劑。 實施例 以下舉出實施例，但本發明絲毫不限制於該等實施例。 實施例1 以如下方式而製造圖1所示的本發明之用於搭載發光元 件之佈線基板A。 於作為基體2之陶曼板之特定位置（圖形成有佈線導 體5a: 5b之位置)上塗佈導體膏’乾燥後進行煅燒，形成 佈線導體5a、5b。具體而言’準備由北陸CERAMic公司製 之純度96%之氧化㈣製作之厚度〇3職、大小8()咖以〇 m的氧化鋁基板，於該基板之上述特定位置上塗佈導體 膏（京都ELEX公司製，Giade名「DDU3〇」），以15〇。〇之 溫度乾燥ίο分鐘之後，使其升溫並以最高溫度85(rc保持 1 〇刀鐘以此進行煅燒後，將厚度12 μιη之銀系之佈線導 體5a、5b形成為圖1所示之配設形態。 其次，在形成於基體2上之銀系之佈線導體5a、几之表 面的形成有玻璃層8之位置上塗佈玻璃膏，乾燥後進行煅 燒，獲得形成有玻璃層8之用於搭載發光元件之佈線基 板。具體而言，將玻璃膏（旭硝子股份有限公司製，GUde 139217.doc -14· 200945938 名「AP5700」）塗佈於上述位置上，並以15〇〇c之溫度乾燥 20分鐘之後’使其升溫並以最高溫度85〇»c保持1〇分鐘， 以此進行锻燒，獲得形成有厚度2〇 ^瓜之玻璃層8之圖丄所 示的本發明之用於搭載發光元件之佈線基板八（其中，為未 配設發光元件1與接線6之狀態）。 ' 實施例2 ' 以如下方式而製造圖2所示的本發明之用於搭載發光元 件之佈線基板B。 於作為基體2之陶瓷板上以與實施例丨相同之方式形成厚 度12 μιη之銀系之佈線導體5a、5b。 接著，在圖2之形成有玻璃層8之位置上塗佈玻璃膏，除 此之外，以與實施例i相同之方式獲得形成有厚度2〇 之 玻璃層8之佈線基板。 另一方面，使用PVA(黏結劑）將氧化鋁純度為96%之氧 化鋁粉體進行水分散，並實施喷霧乾燥而獲得粒狀物之 9 後，進行粉體成型，將成型物於160(TC下進行煅燒，製作 圓筒狀之框體4。該框體4之厚度、即：外周面乜之高度為 I.5 mm，外周面4a之俯視圖上的圓之直徑為6 5 mm，内周 面4b之俯視圖上的圓之直徑為3 7 mm。 對上述佈線基板表面之由框體4所設置預定之部分，以 30 pm之塗佈厚度來塗佈玻璃膏（旭硝子股份有限公司製， Giade名「ΑΡ5700」塗佈形狀係相當於圖2(b)中表示外 周面4a之點線及表示内周面朴之點線所夾持之部分的 狀。 夕 139217.doc 200945938 將塗佈有上述玻璃膏之佈線基板以l5(rc加熱20分鐘而 使玻璃膏部分乾燥’使上述框體4重疊並以固定器具固定 之後，以85(TC煅燒10分鐘，獲得封裝構造的本發明之用 於搭載發光元件之佈線基板B(其中，為未配設發光元件i 與接線6之狀態）。 實施例3 以如下方式而製造圖3所示的本發明之用於搭載發光元 件之佈線基板C。 於作為基體2之陶瓷板之特定位置（圖3中形成有佈線導 © 體5a、5b之位置）上塗佈導體膏，乾燥後進行煅燒，形成 佈線導體5a、5b。具體而言，準備由北陸CERAMIC公司 製之純度96%之氧化鋁所製作之厚度〇 5 mm、大小15 〇 mmxl5.0 mm的氧化鋁基板，於該基板之上述特定位置上 塗佈導體膏（京都ELEX公司製，Gladeg「DDU3〇」），以 下以與實施例1相同之方式，將厚度12 μηΐ2銀系之佈線導 體5a、5b形成為圖3所示之配設形態。 接下來，在圖3之形成有玻璃層8之位置上塗佈玻璃膏，© 除此之外以與實施例1相同之方式，獲得形成有厚度20 μιη 之玻璃層8之佈線基板。 . 另一方面，使用PVA(黏結劑）將氧化鋁純度為96%之氧 ， 化銘粉體進行水分散，並實施喷霧乾燥*獲得粒狀物之 後，進行粉體成型，將成型物於16〇〇r下進行煅燒，製作 圖3/斤示之形狀之框體4。該框體4之厚度、即；外周面乜 尚又為2·5 mm外周面4a之俯視圖上的一邊之長度為 139217.doc 16 200945938 •〇mm，内周面4b之俯視圖上的圓之直徑為l〇5mm。 、以與實施例2相同之方法將上述佈線基板與上述框體4加 、接著之後，對形成於基體2上之銀系之佈線導體化、5b 辛面的开/成有電鑛層1〇之位置實施電解鑛鎳、電解鍍 金’以獲得封裝構造的本發明之用於搭載發光元件之佈線 . 基板C(其中，為未配設發光元件1與接線6之狀態）。電鍍 ， <具體的方法為：將框體4接著，且藉由脫脂液或酸性液 _ 而對佈線導體5a' 5b及形成有玻璃層8之基體2進行前處理 之後，利用陶瓷上之電極對上述佈線導體通電，進行電解 鍍鎳、電解鑛金，將包含厚度4 _之錄層與厚度〇 5叫之 金層的電鍍層10形成為圖3所示之配設形態。 [產業上之可利用性] 本發明之用於搭載發光元件之佈線基板係在至少該發光 元件發出之光所照射之預定部位上形成有銀系之佈線導 體，且於該銀系之佈線導體之表面上形成有玻璃層，因此 β 料導體表面之光反射率高，又，由於佈料體不會隨時 間經過而黑化，故而可長期維持較高的光反射率，因此可 • 適合用作搭載^3(半導體雷射）、LED(發光二極體）等之光 半導體元件之用於搭載發光元件之佈線基板。 又，本發明之用於搭載發光元件之佈線基板中，至少發 光疋件發出之光所照射之預定部位之佈線導體為銀系之佈 線導體，且於該銀系之佈線導體之表面上形成有破璃層， 因此佈線導體表面之光反射率高，從而可長期維持較高光 的反射率。 ° 139217.doc -17- 200945938 【圖式簡單說明】 圖1 (a)及圖1 (b)分別係為了讓玻璃層之位置變得明確而 以於佈線基板上配設有發光元件與接線之狀態來表示本發 月的用於搭載發光元件之佈線基板之一較佳實施形態的剖 面圖及俯視圖，圖1(a)係圖1(b)之a_a線剖面圖； 圖2(a)及圖2(b)分別係為了讓玻璃層之位置變得明確而 以於佈線基板上配設有發光元件與接線之狀態來表示本發 明的用於搭載發光元件之佈線基板之另一較佳實施形態的 剖面圖及俯視圖，圖2(a)係圖2(b)之b-b線剖面圖； 圖3(a)及圖3(b)分別係為了讓玻璃層之位置變得明確而 以配設有發光元件、熱阻器元件及接線之狀態來表示本發 明的用於搭載發光元件之佈線基板之又一較佳實施形態的 剖面圖及俯視圖’圖3(a)係圖3(b)之c-c剖面圖； 圖4(a)及圖4(b)分別係表示本發明的用於搭载發光元件 之佈線基板上之佈線導體之較佳配設狀態之一例的剖面圖 及俯視圖，圖4(a)係圖4(b)之d-d線剖面圖；及 圖5係對先前之用於搭載發光元件之佈線基板上於載有 發光元件1之發光裝置之構造加以說明的示意圖，其中（a) 係其剖面圖，（b)係其俯視圖。 【主要元件符號說明】 1 發光元件 2 基體 2a 基體表面 3 貫通孔 139217.doc 200945938 4 框體 4a 外周面 4b 内周面 5a, 5b 佈線導體 6 接線 7 通孔 8 玻璃層 9 熱阻器元件 10 電鍍層 A, B, C 佈線基板 Ο 139217.doc -19-The various adhesives applied are recommended to dry the respective adhesives, and the substrate 2 and the frame 4 are subsequently dried by calcination, calcination or the like. Further, the adhesive layer is not shown in the drawing. As shown in FIG. 3, in order to impart chemical change or to impart wire bonding property to the surface of the wiring conductors 5a and 5b on which the glass layer 8 is not formed, the wiring conductor is prevented from passing over time, and the present invention is used for mounting a light-emitting element. A plating layer 10A may be formed in the wiring substrate as the plating layer 1 , preferably nickel plating or gold plating. The thickness of the plating layer 10 is preferably "μιη, more preferably 2 to 10 μm. In order to improve the manufacturing efficiency, the industrial manufacturing method for the wiring substrate on which the light-emitting element of the present invention is mounted is preferably the following method. Usually, after a plurality of wiring substrate units are formed on a substrate sheet, and the light-emitting elements 1, the wirings 6, and the like are provided, or the sheet is divided at an appropriate stage, the light-emitting element can be mounted in the present invention. A light-emitting element is mounted on the wiring board, and various other electronic components are mounted as needed, and wiring is performed, and a sealing agent is filled in the cavity to form a light-emitting device. The light-emitting element 1 is not particularly limited, and an LD (semiconductor laser) can be used. 139217.doc of LED (Light Emitting Diode), etc. 3 200945938 Optical semiconductor element. As the above-mentioned sealant, a resin sealant such as an epoxy resin, a ruthenium resin or a ruthenium imide resin, or a glass seal is used. Agent, but the glass-based sealant needs to be processed at a high temperature, so it will cause adverse effects on electronic components and other parts of the light-emitting component, etc. Therefore, a resin-based sealant is preferred. EXAMPLES Examples are given below, but the present invention is not limited to the examples. Example 1 The present invention shown in Fig. 1 was produced in the following manner for carrying light. The wiring board A of the element is coated with a conductor paste at a specific position (a position where the wiring conductors 5a: 5b are formed) of the base 2, and then baked to form wiring conductors 5a and 5b. 'Prepare the alumina substrate made of 96% pure oxidized (4) manufactured by Hokuriku CERAMic Co., Ltd., thickness 〇3, size 8 () coffee 〇m, and coat the conductor paste at the above specific position of the substrate (Kyoto ELEX Corporation) The system, Giade name "DDU3〇", to 15〇. After the temperature of the crucible is dried for a few minutes, the temperature is raised and the calcination is carried out at a maximum temperature of 85 (rc is maintained for 1 knives), and the silver-based wiring conductors 5a and 5b having a thickness of 12 μm are formed as shown in Fig. 1. Next, a glass paste is applied to the silver-based wiring conductor 5a formed on the substrate 2 at a position where the glass layer 8 is formed on the surface of the substrate 2, dried, and then calcined to obtain a glass layer 8 for forming. A wiring board on which a light-emitting element is mounted. Specifically, a glass paste (GUDE 139217.doc -14·200945938 "AP5700" manufactured by Asahi Glass Co., Ltd.) is applied to the above position and dried at a temperature of 15 ° C. After 20 minutes, the temperature was raised and maintained at a maximum temperature of 85 〇»c for 1 minute, and calcination was carried out to obtain a glass layer 8 having a thickness of 2 Å. The wiring board 8 of the light-emitting element (the state in which the light-emitting element 1 and the wiring 6 are not disposed). 'Example 2' The wiring board B for mounting a light-emitting element of the present invention shown in FIG. 2 is manufactured as follows. As the base 2 A silver-based wiring conductor 5a, 5b having a thickness of 12 μm was formed on the porcelain plate in the same manner as in Example 接着. Next, a glass paste was applied at a position where the glass layer 8 was formed in Fig. 2, and A wiring substrate on which a glass layer 8 having a thickness of 2 Å was formed was obtained in the same manner as in Example i. On the other hand, alumina powder having an alumina purity of 96% was water-dispersed using PVA (adhesive), and sprayed. After the mist was dried to obtain 9 of the granules, powder molding was carried out, and the molded product was fired at 160 (TC) to prepare a cylindrical frame 4. The thickness of the frame 4, that is, the height of the outer peripheral surface In the case of I.5 mm, the diameter of the circle on the plan view of the outer peripheral surface 4a is 65 mm, and the diameter of the circle on the plan view of the inner peripheral surface 4b is 37 mm. The surface of the wiring substrate is set by the frame 4 In the part, the glass paste was applied at a coating thickness of 30 pm (made by Asahi Glass Co., Ltd., the Giade name "ΑΡ5700" coating shape corresponds to the dotted line indicating the outer peripheral surface 4a in Fig. 2(b) and the inner circumference. The shape of the part held by the point line of the face. 夕139217.doc 200945938 The wiring board on which the glass paste was placed was heated at 15 ° for 15 minutes by rc (the glass paste was partially dried). After the frame 4 was overlapped and fixed by a fixture, the present invention was obtained by calcining for 85 minutes at TC for 10 minutes. A wiring board B on which a light-emitting element is mounted (in a state in which the light-emitting element i and the wiring 6 are not disposed). Embodiment 3 A wiring board for mounting a light-emitting element of the present invention shown in FIG. 3 is manufactured as follows C. The conductor paste is applied to a specific position of the ceramic plate as the substrate 2 (the position where the wiring guide bodies 5a and 5b are formed in Fig. 3), dried, and then fired to form wiring conductors 5a and 5b. Specifically, an alumina substrate having a thickness of mm5 mm and a size of 15 〇mmxl5.0 mm, which is made of alumina having a purity of 96% manufactured by Hokuriku CERAMIC Co., Ltd., is prepared, and a conductor paste is applied to the specific position of the substrate ( In the same manner as in the first embodiment, the wiring conductors 5a and 5b having a thickness of 12 μm 2 silver are formed in the arrangement shown in Fig. 3 in the same manner as in the first embodiment. Next, a glass paste was applied to the position where the glass layer 8 was formed in Fig. 3, and a wiring substrate on which the glass layer 8 having a thickness of 20 μm was formed was obtained in the same manner as in the first embodiment. On the other hand, using PVA (adhesive), the purity of the alumina is 96%, the powder is dispersed in water, and spray-drying is performed to obtain a granule, which is then subjected to powder molding to form a molded product. Calcination was carried out at 16 Torr to produce a frame 4 having the shape shown in Fig. 3/kg. The thickness of the frame 4, that is, the length of one side of the outer peripheral surface of the outer peripheral surface 4a of the outer peripheral surface 4a is 139217.doc 16 200945938 • 〇mm, the diameter of the circle on the plan view of the inner peripheral surface 4b It is l〇5mm. After the wiring board and the frame body 4 are added in the same manner as in the second embodiment, the wiring of the silver-based wiring formed on the substrate 2 and the opening/forming of the 5b-white surface are formed. A wiring for mounting a light-emitting element of the present invention in which electrolytic nickel or electrolytic gold plating is performed at a position to obtain a package structure. The substrate C (in a state in which the light-emitting element 1 and the wiring 6 are not disposed). Electroplating, <Specific method: after the frame 4 is followed by the pre-treatment of the wiring conductor 5a' 5b and the substrate 2 on which the glass layer 8 is formed by the degreasing liquid or the acidic liquid _, using the electrode on the ceramic The wiring conductor is energized, electrolytic nickel plating, electrolytic gold plating, and a plating layer 10 including a recording layer having a thickness of 4 Å and a gold layer having a thickness 〇 5 is formed in the arrangement shown in FIG. [Industrial Applicability] The wiring board for mounting a light-emitting element of the present invention has a silver-based wiring conductor formed on at least a predetermined portion irradiated with light emitted from the light-emitting element, and the wiring conductor of the silver-based wiring Since the glass layer is formed on the surface of the material, the surface of the beta conductor has a high light reflectance, and since the cloth body does not blacken over time, it can maintain a high light reflectance for a long period of time, so it is suitable for use. A wiring board on which a light-emitting element is mounted, which is an optical semiconductor element such as a semiconductor (semiconductor laser) or an LED (light-emitting diode). Further, in the wiring board on which the light-emitting element of the present invention is mounted, at least a predetermined wiring conductor of the light emitted from the light-emitting element is a silver-based wiring conductor, and a wiring conductor is formed on the surface of the silver-based wiring conductor. Since the glass layer is broken, the light reflectance of the surface of the wiring conductor is high, so that the reflectance of the higher light can be maintained for a long period of time. ° 139217.doc -17- 200945938 [Simplified Schematic] Figure 1 (a) and Figure 1 (b) are used to make the position of the glass layer clear, so that the light-emitting components and wiring are arranged on the wiring substrate. FIG. 1(a) is a cross-sectional view taken along line a_a of FIG. 1(b); FIG. 2(a) and FIG. 1(a) and FIG. 2(b) shows another preferred embodiment of the wiring board for mounting a light-emitting element of the present invention in a state in which a light-emitting element and a wiring are arranged on a wiring board in order to make the position of the glass layer clear. FIG. 2(a) is a cross-sectional view taken along line bb of FIG. 2(b); FIG. 3(a) and FIG. 3(b) are respectively arranged to make the position of the glass layer clear. A cross-sectional view and a plan view showing another preferred embodiment of the wiring board for mounting a light-emitting element of the present invention in the state of a light-emitting element, a resistor element, and a wiring. FIG. 3(a) is a diagram of FIG. 3(b) Cc sectional view; Fig. 4 (a) and Fig. 4 (b) show wiring on a wiring substrate for mounting a light-emitting element of the present invention, respectively FIG. 4(a) is a cross-sectional view taken along line dd of FIG. 4(b); and FIG. 5 is a view showing a conventional wiring board for mounting a light-emitting element. A schematic view for explaining the structure of a light-emitting device of the light-emitting element 1, wherein (a) is a cross-sectional view thereof, and (b) is a plan view thereof. [Main component symbol description] 1 Light-emitting element 2 Base 2a Base surface 3 Through-hole 139217.doc 200945938 4 Frame 4a Outer peripheral surface 4b Inner peripheral surface 5a, 5b Wiring conductor 6 Wiring 7 Through-hole 8 Glass layer 9 Thermal resistor element 10 Plating Layer A, B, C Wiring Board Ο 139217.doc -19-