TW200944812A - Apparatus for testing a chip and taping a carrier tape containing the tested chip - Google Patents

Abstract

Provided is there an apparatus for testing a chip and taping a carrier tape containing the tested chip, including a chip-carrying-plate support unit supporting a chip-carrying plate; a chip-carrying-plate supply unit supplying the chip-carrying plate to the chip-carrying-plate support unit; a first rotation unit with a plurality of holding means, rotating by a given angle, the chip being held in placed in each holding means; a chip-transfer unit picking up the chip from the chip-carrying plate and place the picked-up chip in the holding means in the first rotation unit; a tape-supply unit supplying a carrier tape having a plurality of pockets; a second rotation unit with a plurality of sucking heads, each sucking head rotating by a given angle to pick up the chip from the circular pocket in the first rotation unit and place the picked-up chip in the pocket in the carrier tape; a test unit testing the chip being picked up by the sucking head of the second rotation unit; a film-supply unit supplying a cover file film to cover the pockets in the carrier tape, the chip being placed in each pocket; a sealing unit sealing the carrier tape with the cover film; and a retrieving unit retrieving the carrier tape sealed with the cover film. The present invention provides advantages of performing various tests on the chips, placing the tested chip in the pocket in the carrier tape, and then taping the carrier tape, concurrently at high speeds.

Description

200944812 VI. Description of the Invention: [Technical Field] The present invention relates to a test wafer and a device for sealing a carrier tape containing a test wafer. [Prior Art] After the wafer is manufactured, the electrical performance and circuit functions of each semiconductor wafer (hereinafter referred to as "wafer") are electrically tested to confirm compliance with customer specifications. Test equipment requires simultaneous high-speed execution of various wafer tests to increase productivity. Since the wafer is shaken when the wafer is tested at high speed, the test equipment must be fixed to the small size wafer during transfer and testing. The S-study of the S-type s is described in Japanese Patent Application Publication No. JP-A-2003-066096 A. This test device is simple in structure and can perform high speed tests. However, it is not suitable for performing various wafer tests. The wafer in the pocket of the index table may be separated from the pocket when the index table is rotated. Furthermore, since the wafer is placed in the pocket of the index table, it is not suitable for testing the bottom side of the wafer. Another type of test equipment is described in Korean Patent Registration No. 1614〇8 B1. This test device can perform various wafer tests. However, the wafer in the cake of the complex device may be placed in the bag of the rotating device in the transfer domain, but the wafer is placed in the bag of the rotating device, so it is not suitable. [Invention] 200944812 Therefore, one of the objects of the present invention is Test the appearance quality of the upper and bottom sides of the wafer and test the electrical and circuit functions of the wafer. Another object of the present invention is to test the electrical properties and circuit functions of the wafer on the upper and lower sides of the wafer at high speed, to place the wafer in the carrier of the carrier tape, and then to carry the carrier tape. According to one aspect of the present invention, there is provided a test wafer and a device for sealing a carrier tape comprising a test wafer, the device comprising: a wafer carrier support unit, a wafer carrier, and a wafer carrier supply unit a wafer carrier selection unit; the first rotation unit having a plurality of support devices rotated by a predetermined angle in which the wafer is supported in each of the support devices; the wafer transfer unit picking up the wafer from the wafer carrier and picking up the picked up The wafer is placed in the supporting device of the first rotating unit; the tape supply unit supplies a carrier tape having a plurality of bag members; the second rotating unit has 'a plurality of suction heads, and each of the suction heads rotates by a predetermined angle to The supporting device of the rotating unit picks up the wafer and places the picked wafer on the carrier tape; the testing unit tests the wafer picked up by the tip of the second rotating unit; the 臈 supply unit supplies the cover film, ❿ to cover the piece of the scale' The towel wafer is placed in each bag member; the 'sealing unit' seals the carrier tape and the cover film; and the pick-up unit picks up the carrier tape sealed with the cover film. The belt supply unit may comprise: a guiding member having a guiding bag for connecting the perforation of the guiding bow pocket and a vacuum passage connecting the perforations; the perforation of the women's clothing in the guiding bag is used to sense whether the wafer is placed on the carrying With . and the hollow supply unit, providing vacuum to the perforation and vacuum channel to fix the wafer 7 200944812 views, and advantages, with reference to the foregoing and other objects, features, detailed description and accompanying drawings of the present invention, will be more clearly understood [Embodiment] The present invention will be described in detail with reference to the preferred embodiments of the invention and the accompanying drawings.

Figure 1 is a perspective view of an embodiment of the present invention. Reference examples. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the present invention. The wafer carrier board unit 100 is provided on the side of the substrate 1 to support the b carrier carrier. A wafer carrier supply sheet a 200 is provided on the side of the wafer carrier board unit 100 for supplying the wafer carrier to the wafer carrier support unit 100. The wafer bond # unit is positioned between the pure 1G and the crystal plate supply unit 200. The wafer carrier support unit 100 is connected to the substrate 10.

The wafer carrier supporting unit 1GG includes a carrier table 110 on which a crystal domain plate is placed, a table driving unit 12A that horizontally moves the wafer carrier table 110, and a pushing unit 13G that pushes a wafer attached to the wafer carrier. The pushing unit 13G The wafer carrier supply unit 200 is disposed inside the wafer carrier table 110. The wafer carrier supply unit 200 includes a cassette N for mounting a plurality of wafer carriers, a cassette holder unit 21 for mounting and disassembling the cassette N, and a transfer unit 220, for transferring the wafer carrier from the cassette N to the wafer carrier table 11 (), or transferring the wafer carrier to the cassette N from the wafer carrier table 110. 8 200944812, the cartridge holder unit 210 can be positioned on the wafer The side of the board table 11A. The cassette holder unit 210 includes a support 2n for placing N, and a cassette driving unit 212 for moving the support plate 211 up and down. The transfer unit το 220 includes a guiding member mounted on the substrate 1 A buzzer drive unit 222 that generates a line in the complex motion, and a handle 223 that picks up the crystal from the cassette N and transmits it to the wafer carrier table 110' or from the wafer carrier table. The wafer carrier is picked up and placed in the cassette N. Guide member 221 The holder drive unit 222 is mountable on the guide member 221. The holder 223 is coupled to the support drive unit 222 and movably mounted to the guide member 221. The holder drive unit 222 operates As a result, the holder 223 is moved along the guiding member 221. As shown in Fig. 2, the wafer carrier includes a circular plate 21 having perforations, a diaphragm 22 positioned in the perforation of the circular plate 21, and a plurality of attached to the film. The wafer of the sheet 22. The circular plate 21 may have a uniform thickness. The diaphragm 22 is fixed to the circular plate 21. It is explained that the wafer carrier 2 is transferred from the cassette N to the wafer carrier table, or from the wafer carrier table 11 The wafer carrier is transferred and placed in the cassette N. The holder driving unit 222 moves the holder 223 to the cassette N. The holder 223 picks up the wafer carrier 2 from the cassette n. The holder driving unit 222 moves the branch The tray 223 is placed on the wafer carrier table 110. The holder 223 is placed on the wafer carrier 20 at 9 200944812: the wafer n carrier table 110. All the wafers are picked up from the wafer carrier 20. Then the support is f ^ 23 from the wafer The carrier table 110 picks up the empty wafer carrier 20. The holder driving unit 222 moves the holder 223 to the hiding The cartridge 223 is placed on the empty wafer carrier 20 to Ν. Then, the cartridge driving unit 212 moves up or down to move the lower tray Ν to position the holder 223 to pick up the next wafer carrier. The second rotating unit 300 is mounted on the substrate 1 to support the wafer. The second rotating unit can record the side of the carrier carrier element 1 (). The first rotating unit 300 includes a rotating shaft 31 for connecting the air tube 311. The first index table 320' has a plurality of supporting means for selectively fixing the wafer and the first driving unit 33 for rotating the rotating shaft 310. The first index table 320 includes a plurality of air passages (not shown) formed of a circular plate 32 having a uniform thickness and formed inside the circular plate 321, and a plurality of supporting means formed on the upper side of the circular plate 321. The support device includes a round bag and a vent 322 that connects the side of the bottom of the bag. The round bag can have other shapes. A plurality of air passages are respectively connected to the air pipe 311. The air holes 322 on the bottom side of the round bag connect the air passages inside the circular plate 321 to allow outside air to pass through the air holes 322 and the air passage. A round pocket can be formed on the circular plate 321 with the air vent 322 at the center. The inner diameter of the round file is larger than the inner diameter of the air hole 322. The round bag has a predetermined depth. The round pocket is concentric with the air vent 322. The air holes 322 may be formed equidistant from each other on a virtual circle 200944812 concentric with the circular plate 321. A virtual line is drawn from the center point of each of the air holes 322 to the center point of the circular plate 321 . Then, the two imaginary lines have the same angle with respect to each other. The air holes 322 may be equally spaced apart such that the two virtual lines are at an angle of 30, 60, or 90 degrees with respect to each other. The air holes 322 and the round bag constituting the supporting device can have various shapes and sizes. When the wafer is placed in the round bag of the supporting device, the air pipe 311, the air passage, and the air hole 322 are in a vacuum, so the wafer is sucked to the bottom side of the round bag. Thereby fixed in a round bag. In this manner, the wafer can be secured in a round pocket of the first index table 32''. Thus, when the first index table 320 is rotated at a high speed, the wafer 23 can be prevented from being separated from the first index table 320. As a result, the wafer 23 can be transferred quickly. When the air tube 311, the air passage, and the air vent 322 are not under vacuum, the wafer 23 is free to move. The first driving unit 330 is mounted on the upper side or the lower side of the substrate 1A. A frame is provided on the substrate 10. The auxiliary test sheet 34〇 is installed in the frame, so that the auxiliary test sheet S34 (M stands on the top of the index table 32〇. The auxiliary test sheet 34〇 not only checks whether the crystal #23 is in the jjj bag, when the ^ 23 is still The upper side appearance quality of the test wafer 23. The auxiliary test sheet 34 can be mounted on a support frame described later. 200944812 The wafer transfer unit 400 is mounted on the substrate 10. The wafer transfer unit 40 is loaded from the wafer placed on the wafer carrier table 110. The board 20' picks up the wafer 23 to place the wafer 23 in a round pocket of the first index table 320. The wafer transfer unit 400 includes a support frame 41 that connects the substrate 10, and a linear motion (lm) guide that connects the support frame 410. 420. Connect the head unit 430 of the linear motion guide 420 and the head drive unit 44 of the moving head unit 430.

The linear motion guide 420 includes a guide rail 421 and a slider 422 that slidably connects the guide rails 曰21. The guide rail 421 is connected to the support frame 41 (eight). The guide rail 421 is positioned on the side of the wafer carrier table Π 0 and on the side of the first index table 320. ' can be positioned parallel to the wafer carrier table 110 and the first index table ^ rail 421

The head unit 430 includes a head 422 that connects the slider 422 or a head body 431. The head drive unit 440 includes a linear motor. The auxiliary test unit can be positioned on the round bag of the table 5 of the table 5 for the transfer head 432 to be placed 2 曰 = above the bag's - 12 200944812 tape supply early 500 installed on the substrate ~ ι〇. : The belt supply unit 500 supplies the carrier tape 3〇. An example of a carrier tape 3 is shown in Fig. 3, having a uniform width and depth, and having a plurality of pocket members 31 spaced equidistant from each other. The carrier tape 30 can be pressed down from the top to form the pocket member 31. The first perforations 32 are formed adjacent to the respective pocket members 31. The second through hole 33 is formed on the bottom side of the bag member 31. The pocket member 31 can be matched to the shape, form, and size of the wafer. _ tape supply unit 500 includes a reel 51 供 for winding the carrier tape 3, a reel support unit (not shown) for mounting the reel 510, a feeder 520 for transferring the carrier tape 3, and a guide carrier tape 30 moving roller 53 〇 and with guiding unit TG. The reel 510 mounted on the reel support unit can be mounted on the bottom side of the substrate 1A. The tape guiding unit TG is connected to the upper side of the substrate 1A. The roller 53 is positioned above the substrate 1A. The carrier tape 30 of the winding reel 510 is unloaded from the reel 510 and transferred. At this time, the roller 530 and the belt guiding unit TG guide the movement of the carrier tape 30. As shown in FIGS. 4 and 5, the tape guiding unit TG includes a guiding member 54A, a sensor 550, and a vacuum supply unit (not shown). The guiding member 540 is provided on the substrate 1A. The guiding member 540 includes a guiding body 54 having a predetermined length and a rectangular cross section, and a stepped guiding bag 542 formed in the guiding body 541 for placing the wafer, passing through the bottom side of the step guiding bag 542 and guiding The perforation 底 on the bottom side of the main body 541 and the vacuum passage F connected to the through hole η and the bottom side of the guiding body 541. The stepped guide bag 542 is formed in the longitudinal direction of the guide body 541. The stepped guide bag 542 has a stepped shape. 13 200944812 The perforated crucible includes a first hole 543 formed in a vertical direction on the bottom side of the stepped guide bag 542, a second hole 544 forming a vertical connection first hole 543 and having an inner diameter larger than the first hole 543, and a vertical connection guide The bottom side of the main body 541 has a third hole 545 which is smaller than the inner diameter of the second hole 544. The sensor 55 is mounted on the three holes 545. The vacuum channel F includes a first vacuum channel 546 forming a horizontal connection first hole 543, and is formed to be vertically connected between the first vacuum channel 546 and the bottom side of the guiding body 541. The second vacuum channel 547. A vacuum supply unit (not shown) is connected to the second vacuum passage 547. A sensor 550 senses whether the wafer 23 is held in the pocket member 31 of the carrier tape. The sensor 550 includes an optical sensor. When the vacuum passage F is under vacuum, it is placed in the bag member 31 to be sucked to the bottom side of the bag member 31. The cover portion of the stepped guide bag 覆盖 2 covering the cover portion 56 〇 540. The auxiliary plate 570 is coupled to the guide member 54A and is positioned with the cover plate 56. The auxiliary plate 57G can be positioned and the cover-end is at a distance approximately equal to the distance of the bag member. The bag member 31 of the carrier tape 30 is located at the cover 鸠 and the auxiliary plate 200944812. The guiding member 54 如图 can be divided into two halves as shown in FIG. As a result, the perforated Η and the true two-channel ρ can be divided into two halves, respectively. Thus, the through hole η and the vacuum passage F can be easily formed in the guiding member mo. That is, the guiding member mo is divided into an upper half 540 Α and a lower half 540 Β. When the upper half 54〇Α and the lower half 5 will be integrated, a second hole 544 and a first vacuum passage 546 may be formed. . The guide member 54 is divided into an upper half 540 Α and a lower half 54 〇Β ' so that various types of upper halves 54 应用 can be applied depending on the type of the carrier tape 30. Thus, when different types of carrier tapes 30 are to be used, the entire guiding member S40 needs to be replaced. The guiding member 540 can be connected to the substrate 10 without being directly connected to the substrate 1β, and can be connected by a supporting member (not shown). The lead member 540 can be coupled to the support member. The perforations η and the vacuum passage F in the guiding member 540 can have many shapes and sizes. 10 The feeder 52A can be mounted to the side of the guiding member 540. The second rotating unit 600 is mounted on the substrate 1 and the second rotating unit 600 is positioned on the side of the first rotating unit 3''. The second rotating unit 600 includes a rotating shaft 61 连接 connecting the air tube 611 , a second index table 620 connecting the rotating shaft 610 , and a plurality of suction heads 630 provided on the second index table 62 , when the vacuum is supplied through the air tube. A suction head driving unit 64A that sucks the wafer and connects the respective suction heads 630 is used to move the suction heads 63A and a second driving unit (not shown) for rotating the rotating shaft 610. 15 200944812 The second index table 620 is in the form of a circular plate.

A plurality of tips 630 can be provided equidistantly spaced apart from each other on a virtual circle concentric with the second index table 620. A virtual line is drawn from the center point of each of the tips 63 to the center point of the second index table 620. Then, the two imaginary lines have an _ angle with respect to each other. The tips 63G can be equally spaced apart such that the two virtual lines can be at an angle of 30 degrees relative to one another. At this time, the total number of tips 630 provided on the second index table 62 is 12. ', and the angles of the two imaginary lines relative to each other, the tips 630 can be equally spaced, can be 60 or 90 degrees. The second driving unit rotates the second index table 62 3 3 degrees by the case where the tips 630 are equally spaced apart so that the two imaginary lines can be 30 degrees with respect to each other. Also, the second driving unit rotates the second index #62〇 to provide a distance between the tips 630 of the index table 620. The outer diameter of the second index table 62〇 may be greater than the first index table 32〇 above the first index table 320. The second index table _ can overlap with the first index table 320. That is, the virtual circle on the second index table 620 sucked from the second index table 62 intersects the virtual circle of the index table 620 where the hole is located at a contact point. When the tape supply unit 500 is transferred below the carrier table 620. When the second index table is thus slid, the carrier tape 30 can pass the first pocket of the wafer 23 16 200944812 through the suction head 63 of the second index 620. When viewed from the top of the second index table, the path intersects the contact and the carrier tape 30 follows the head drive unit; the position of the wafer 23 that is attracted by (4). Thus, the test to be tested is placed in the bag member 31 as appropriate. The month is in the pre-emptive position, « 421. The path of the carrier tape 3 is parallel to the guide rail unit 43 〇 moving rail between the second rotation unit 600 path. The reference point 430 and the carrier tape 3 are followed by the suction head 630 sucking the wafer 23 placed on the round bag and rotating W degrees, wherein the suction head (4) is positioned in the position of the first correction table holder 2 The air holes 322 are on the same vertical line. In doing so, the tip 630 of the wafer is held over the bag member 31 of the carrier tape by suction. The test unit 700 is mounted on the substrate 1A. The test unit 7 tests the wafer 23 picked up by the suction head 63. Test unit 700 includes a component 710 that is less than the number of tips 630 of the second index table 62A. The assembly 710 can be mounted to the substrate 1A. The component 71 is positioned below the second index table 620. 17 200944812 Rice. And the head 630 # is spaced apart, and the angles of the two virtual lines relative to each other can be 3 degrees. From the center point of the air hole 322 of the first rotating unit 300, the virtual = straight line is as shown in Fig. 7, when sucking The head 63 is stopped at the contact point of the virtual vertical line, and the tip 630 is clamped to pick up the wafer 23 from the supporting device. It is assumed that the suction head 63 is positioned from the first point P1 to the tenth point P11 in the clockwise direction from the contact point PS. Then, the component 710 is positioned between the first point P1 and the eighth point P8.组件 The component 710 is not positioned between the ninth point p9 and the contact point ps. The above component 710 constitutes a test unit 7A. The number of components 710 is determined. Depending on the type of wafer the tip is intended to hold, the test unit 700 can include five components 71. The first component is mounted at the first point P and the second component is installed at the second point p2. The third component is installed with P3. The fourth component is installed at the sixth point P6. The fifth component is mounted to the first component as a camera for capturing an image of the wafer 23 to adjust the position of the wafer 23. The second component tests the electrical and circuit functions of the wafer 23. The third component is a camera for capturing an image of the wafer 23 to identify the position of 23; This is done by placing the 帛#23 placement field with a pocket of %. The appearance quality of the bottom side of the PSA 23 film. live. The fifth component is a sensor 'which senses whether the wafer 23 is still sucked by the tip 630 18 200944812 The auxiliary frame 40 is mounted on the side of the substrate 10. The film supply unit 8 供应 for supplying the cover film is attached to the auxiliary frame 4〇. The film supply unit 8 is alternatively mounted on the substrate 10 °. The film supply unit 800 includes a reel 810 for winding the cover film, a reel support unit 82 for mounting the reel 810, and feeds forward from the reel 81 A cover film feeder (not shown), and a roller 830 that guides the movement of the cover film. The sealing unit 850 is mounted to the auxiliary frame 40. The sealing unit 850 seals the carrier tape 30 with the bag member 31 on which the wafer 23 is placed. The sealing unit 850 can be mounted on the substrate 10 instead. And, the sealing unit 850 includes a platform 851, and the carrier tape 3 密封 sealed by the cover film is located on the table 851, the tool 852 applies pressure or heat to the cover film and the carrier tape 3, and the driving unit 853 moves up and down. Tool 852. Tool 852 contains a heater (not shown). The picking unit 900 is mounted to the auxiliary frame 40. The picking unit 9 is self-sealing unit 850 to pick up the carrier tape 3密封 sealed with a cover film. The capturing unit 9A includes a reel driving unit 91〇 mounted on the auxiliary frame 4, a reel 920 rotated by the reel driving unit 910 and wound by a cover film, and a guide tape 30 The roller of motion is 93〇. The operation of the embodiments of the present invention will now be described. 19 200944812 To the crystal = board = board supply unit 2 ° _ transfer wafer carrier 2 . =:=== Take =3 to make == put the first: Zhuo. The transfer head 43 = Ο The air passage is in the 桌 ^ t wide H lead table 320 in the lead table: round ^ result, the wafer 23 is firmly _ in the first cable ^ ^ Wei, the frequency 432 shift _ placed the wafer 23 The cymbal carrier 20 is provided. The transfer head 432 picks up the next wafer from the wafer carrier 2, and the auxiliary test unit 34 recognizes the position in the round pocket of the wafer 23, and tests the appearance of the upper side of the wafer 23, the result of the material table 320, and the result of two T seconds. T丨 Nine moved to a predetermined angle. Below the yuan 340.疋 Round bags in the auxiliary test unit wafer transfer unit tin turn The first index table 320 is in the empty Weng Guangyuan round. At the same time, it is fixed to the space of the first clock, whereby the wafer transfer table 432 is transferred from the wafer carrier 20 in a repeating manner to the first transfer head 432 in a repeating manner. The transfer head 432 picks up the wafer 23 from the wafer carrier 20 and then places the wafer 23 in a round pocket of the first index table 32''. At the same time, the second drive unit rotates the second index table 620 by a predetermined angle. When the center point of the air hole 322 of the supporting device and the center point of the suction head 630 are in a virtual vertical line, the second rotating unit 600 is positioned at the suction head 630 of the virtual vertical line contact point ps from the first index table 320. The round bag picks up the wafer. After picking up the wafer 23, the second index table 620 is rotated, causing the tip 630 to rotate clockwise. Then, the next tip of the second index table 62A is positioned at the contact point PS. At the same time, the first cable bow table 320 is rotated, with the result that the wafer 23 is positioned at any point of the virtual vertical line. Then, the tip 63 of the contact point PS of the virtual vertical line is positioned. In this manner, the first index table 320 is continuously rotated by a predetermined angle such that the wafers 23 in the wafer of the first index table 320 are sequentially wafer-to-wafer at any point of the virtual vertical line. At the same time, the second index table 62 〇 continuously rotates the pre-angle ’, so that the suction head 630 is sequentially positioned by the suction head to the contact point PS of the virtual vertical line, and the suction head 630 picks up the wafer 23. When so, the test unit 700 tests the wafer 23 sucked by the tip 630. That is, when the suction head 63 of the fixed wafer 23 is positioned above the first assembly by the suction force, the first component recognizes the position of the wafer 23. The tip driving unit 64 turns the tip 630, and the wafer 21 200944812 piece 23 sucked by the tip 63 is positioned at the test position based on the position information of the wafer 23. The head 630 is moved over the second component. The second component of the first and second test cymbal 23 can be tested for the wafer 23 held by the tip 630. m position suction =: == 3 The third component, the position of the wafer 23 is placed in the pocket position 3f of the carrier tape 30. For the preview position. Whether or not the pre-wafer 23 is held at the suction head 63. ],, above the cow. The fifth component inspects the suction head to move downward, and the wafer is gas-filled, so that the instrument is empty or provides an empty hole. The vacuum channel F and the through hole 23 of the guiding member 54G are firmly fixed to the member 31. The bottom side is attracted to the bottom side of the pocket member 31, and in the wafer 550, 31, the tip is allowed to move upward when the sensing 550 sensing wafer 23 is present in the pocket member 22 200944812 630. The bag member 31 31 in which the bag 542 moves the carrier tape 3 is placed at a predetermined distance between the cover plate 56 and the auxiliary feeder 520 along the guide member 54. When this is done, the wafer will be transferred under the cover 560 and between the next pocket assisting plate 570. After moving the sheet 23 in the bag member 31 carrying the 3G, the tip (4) is moved up to the original position. The tip 630 passes the contact point PS of the first sheet i. When the tip (4) moves, the ten points p "suck = the head _ paper point p9, the woven silk fresh box side 3, 23 from the first - index table 32. The round Ο - the feeder 520' will be placed with the wafer 23 The carrier tape 3 is transferred to the sealing unit 850. The cover film supplied from the film supply unit _ covers the upper side of the carrier tape 30. The sealing unit 850 seals the carrier bag 3 with a cover film. The tape 30 is wound around a reel 920 of the scooping unit 900. The wafer transfer unit 4 〇 transfers the wafer 23 23 200944812 from the wafer carrier 2 to the round pocket of the index table in a repeated manner. During the rotation, the second rotating unit 600 The tip-630 picks up the wafer 23 transferred to the first index table 320. The test unit 700 tests the wafer 23 sucked by the tip 630, and then the tested wafer 23 is placed on the carrier tape 30, the piece 31. When transferring the wafer When the tape 30 is carried, the sealing unit 850 seals the carrier tape 30 with a cover film. The drawing unit 900 draws the carrier tape 3 sealed by the cover film. 4 Simultaneously testing the wafer 23 and placing the wafer 23 on the carrier tape 30 according to the present invention The operation of the bag member 31 increases the test wafer 23 W and the cover film seal has a test 0 test crystal The efficiency of the carrier tape. When the wafer is positioned in the round pocket of the first index table 320, the auxiliary test sheet το 340 tests the appearance quality of the upper side of the wafer, and the wafer 23 is sucked by the rotating tip 630. Appearance quality, electrical performance, and circuit function of the bottom side of the wafer. During the transfer, various wafers 23 can be detected. According to the present invention, the wafer can be firmly fixed in the round pocket of the first index table 32. An index table 320 can be rotated rapidly. As a result, the wafer 23 can be quickly transferred without being separated from the round bag. Although the invention can be implemented by the Kawasaki (four) type of implementation, the spirit and the important features of the time system (4) In addition to the above-mentioned ambiguity, it should be made in the spirit and scope of the scope of the attached patent application, so that the secret is not to be deviated from the scope of the scope of the scope of the application. Variations and modifications within the scope of the scope or spirit are intended to be included within the scope of the appended claims.

25 2009 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 2 is a perspective view of a wafer carrier applied to an embodiment of the present invention; FIG. 3 is a top view of a carrier bag applied to an embodiment of the present invention;

Moving single county (four) real-touch and second rotation = 5 is = front view of the guiding member of the feeding unit; side view; and flap (four) position (four) - section of the embodiment Figure 7 is a view of the present invention Operate the view above. [Main component symbol description] 1 〇 substrate 2 〇 wafer carrier 21 circular plate 22 film 23 wafer 30 carrier tape 31 pocket member 32 first perforation 33 second perforation 40 auxiliary frame 100 wafer carrier support unit 26 200944812 110 wafer Plate table 120 table drive unit 130 push unit 200 wafer carrier supply unit 210 cassette support unit 211 support plate 212 cassette drive unit 220 transfer unit 221 guide member 222 supporter drive unit 223 supporter 300 first rotation Unit 310 rotating shaft 311 air tube 320 first index table 321 circular plate 322 air hole φ 330 first driving unit 340 auxiliary test sheet 400 wafer transfer unit 410 support frame 420 linear motion guide 421 rail 422 slider 430 head unit 431 head main body 27 200944812 432 Transfer head 433 Up and down drive unit 440 Head drive unit 500 Supply unit 510 Reel 520 Feeder 530 Roller 540 Guide member © 540A Upper half 540B Lower half 541 Guide body 542 Step guide bag 543 First hole 544 second hole 545 third hole 546 first vacuum channel 547 second vacuum channel 550 550 sensor 560 cover plate 570 auxiliary plate 600 second rotating unit 610 rotating shaft 611 gas 620 second index table 630 tip 640 tip drive unit 200944812 700 test unit - 710 assembly 800 film supply unit 810 reel 820 reel support unit 830 roller 850 sealing unit 851 platform 852 tool 853 third drive unit 900 capture Unit 910 reel drive unit 920 reel 930 roller F vacuum channel Η perforated cassette PS contact point Ρ Ρ 2, Ρ 3, Ρ 4, Ρ 5, Ρ 6, Ρ 7, Ρ 8, Ρ 9, Ρ 10, Ρ 11 point TG belt guiding unit 29

Claims (1)

200944812 VII. Application for special spears if: 1. A test wafer and a device for sealing a carrier tape containing the test wafer include: & a wafer carrier support unit 'supporting a wafer carrier; a wafer carrier supply unit Supplying the wafer carrier to the wafer carrier support unit; a first rotating unit having a plurality of supporting devices, rotating a predetermined wafer support in each of the supporting devices; a wafer transfer unit for picking up the wafer from the wafer carrier and placing the picked wafer in the support device of the first rotating unit; a tape supply unit for supplying a carrier tape having a plurality of bag members; a first rotating unit having a plurality of tips, each of the tips being rotated by a predetermined angle 'to pick up the wafer taken from the holder of the first rotating unit and placed on the carrier tape; The wafer-film supply unit picked up by the tip of the second rotating unit supplies a cover film to cover the carrier tape and the wafer is placed on each bag member _· A cover sheet 7C seals the carrier tape and the cover film, and a pick-up unit that picks up the carrier tape sealed with the cover film. The test wafer and the package containing the test wafer containing the test wafer, wherein the auxiliary test unit is provided in the first test unit for testing the branch of the first rotary unit The side of the bracket is 0 30 200944812 above the support device of the first rotating unit. 4. The test wafer of claim 1 and the device for sealing a carrier tape comprising the test wafer, wherein the first rotating device comprises: a rotating shaft for connecting the air tube; a first index table having the plurality of a supporting device for selectively fixing the wafer; and a first driving unit for rotating the rotating shaft. 5) The test wafer of claim 1 and the device for sealing a carrier tape comprising the test wafer, wherein the second rotating device comprises: a rotating shaft for connecting the air tube; the first index table is connected to the rotating shaft The plurality of tips are provided on the second index table to "carry the wafer when vacuum is supplied through the air tube; 'a suction head driving unit that connects the tips to move the tips; And a second driving unit for rotating the rotating shaft. 6 The test wafer of claim 5, wherein the plurality of tips are equidistantly provided with respect to each other on a virtual circle concentric with the first index table. . The test device described in claim 1 and the package device comprising the test chip, wherein the test unit comprises a plurality of components provided on the substrate, = the position of the plurality of tips, at least - The component is used to test the bottom side of the wafer to quality, and the other component is used to test the electrical performance of the wafer and/or the function of circuit 31 200944812. 8. The test wafer of claim 1 and the device for sealing a tape containing the test wafer, wherein the tape supply unit comprises: a guiding member having a stepped guiding bag for guiding the load a perforation, connecting the guiding bag, and a vacuum channel connecting the perforations; a sensor mounted on the perforation of the guiding bag for sensing whether the wafer is placed in the carrier And a vacuum supply to the perforation and the vacuum channel to secure the wafer to the carrier tape. 9. The test wafer of claim 8 and the device for sealing a carrier tape comprising the test wafer, wherein a cover plate covering the stepped guide bag connects the guiding member, and an auxiliary plate connects the guiding And a member for guiding the carrier tape into the step guiding bag in the guiding member, the auxiliary plate being spaced apart from the cover plate by a predetermined distance. 10. The test wafer of claim 8 and the device for sealing a carrier tape comprising the test wafer, wherein the perforation is coupled between a bottom side of the stepped guide bag and a bottom side of the guiding member, and The vacuum channel is connected between the perforation and the bottom side of the guiding member. The test wafer of claim 8 and the device for carrying the test wafer, wherein the through hole is connected in a straight line to the bottom side of the stepped guide bag and the bottom side of the edge guiding member. And the sensor is mounted in the perforation. 32. The test wafer of claim 8 and the apparatus for enclosing a carrier tape comprising the test wafer, wherein the guiding member is comprised of two halves sharing the perforation and the vacuum channel. 33