TW200943709A - Piezoelectric device, and electronic apparatus using the same, and automobile - Google Patents
Piezoelectric device, and electronic apparatus using the same, and automobileInfo
- Publication number
- TW200943709A TW200943709A TW97142663A TW97142663A TW200943709A TW 200943709 A TW200943709 A TW 200943709A TW 97142663 A TW97142663 A TW 97142663A TW 97142663 A TW97142663 A TW 97142663A TW 200943709 A TW200943709 A TW 200943709A
- Authority
- TW
- Taiwan
- Prior art keywords
- piezoelectric device
- automobile
- piezoelectric
- same
- electronic apparatus
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/097—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0519—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007305412A JP2009130235A (ja) | 2007-11-27 | 2007-11-27 | 圧電デバイスとこれを用いた電子機器、及び自動車 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200943709A true TW200943709A (en) | 2009-10-16 |
Family
ID=40678166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97142663A TW200943709A (en) | 2007-11-27 | 2008-11-05 | Piezoelectric device, and electronic apparatus using the same, and automobile |
Country Status (5)
Country | Link |
---|---|
US (1) | US8013500B2 (zh) |
JP (1) | JP2009130235A (zh) |
CN (1) | CN101848773A (zh) |
TW (1) | TW200943709A (zh) |
WO (1) | WO2009069251A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013219833B4 (de) | 2013-09-30 | 2020-02-13 | Infineon Technologies Ag | Halbleitermodul mit leiterplatte und vefahren zur hertellung eines halbleitermoduls mit einer leiterplatte |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3828210A (en) * | 1973-01-22 | 1974-08-06 | Motorola Inc | Temperature compensated mounting structure for coupled resonator crystals |
US3913195A (en) * | 1974-05-28 | 1975-10-21 | William D Beaver | Method of making piezoelectric devices |
US4266157A (en) * | 1979-05-18 | 1981-05-05 | The United States Of America As Represented By The Secretary Of The Army | Piezoelectric resonator assembly with thin molybdenum mounting clips |
JPH07212169A (ja) * | 1994-01-21 | 1995-08-11 | Nippon Carbide Ind Co Inc | 電子素子用パッケージ |
JPH09246904A (ja) * | 1996-03-14 | 1997-09-19 | Citizen Watch Co Ltd | 表面実装型水晶振動子 |
JP4234840B2 (ja) | 1999-04-20 | 2009-03-04 | 北陸電気工業株式会社 | 加速度センサユニット |
JP2001258879A (ja) * | 2000-03-15 | 2001-09-25 | Olympus Optical Co Ltd | 超音波トランスデューサシステムおよび超音波トランスデュー |
US6443900B2 (en) | 2000-03-15 | 2002-09-03 | Olympus Optical Co., Ltd. | Ultrasonic wave transducer system and ultrasonic wave transducer |
US6628048B2 (en) * | 2000-11-29 | 2003-09-30 | Samsung Electro-Mechanics Co., Ltd. | Crystal oscillator with improved shock resistance |
US6984925B2 (en) * | 2002-05-28 | 2006-01-10 | Delaware Capital Formation, Inc | Low acceleration sensitivity mounting structures for crystal resonators |
US7053521B2 (en) * | 2003-11-10 | 2006-05-30 | General Electric Company | Method for enhancing epoxy adhesion to gold surfaces |
JP3864952B2 (ja) * | 2003-12-01 | 2007-01-10 | セイコーエプソン株式会社 | 振動子デバイス及びそれを備えた電子機器並びに振動子デバイスの製造方法 |
US7235916B2 (en) * | 2004-06-03 | 2007-06-26 | Zippy Technology Corp. | Piezoelectric blades anchoring structure |
JP2007165664A (ja) | 2005-12-15 | 2007-06-28 | Alps Electric Co Ltd | 振動子の配線構造及び圧電ポンプ |
JP4379478B2 (ja) | 2007-02-02 | 2009-12-09 | セイコーエプソン株式会社 | 圧電デバイスおよび圧電デバイスを搭載する電子機器。 |
JP4990047B2 (ja) * | 2007-07-02 | 2012-08-01 | 日本電波工業株式会社 | 圧電振動片及び圧電デバイス |
JP2009182924A (ja) * | 2008-02-01 | 2009-08-13 | Epson Toyocom Corp | 圧電デバイス及び圧電デバイスの製造方法 |
-
2007
- 2007-11-27 JP JP2007305412A patent/JP2009130235A/ja active Pending
-
2008
- 2008-11-05 CN CN200880114853A patent/CN101848773A/zh active Pending
- 2008-11-05 WO PCT/JP2008/003175 patent/WO2009069251A1/ja active Application Filing
- 2008-11-05 TW TW97142663A patent/TW200943709A/zh unknown
- 2008-11-05 US US12/680,641 patent/US8013500B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8013500B2 (en) | 2011-09-06 |
WO2009069251A1 (ja) | 2009-06-04 |
US20100213796A1 (en) | 2010-08-26 |
CN101848773A (zh) | 2010-09-29 |
JP2009130235A (ja) | 2009-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI260056B (en) | Module structure having an embedded chip | |
HK1096832A1 (en) | Knitted transducer devices | |
WO2007124050A3 (en) | Probe structures with electronic components | |
EP2445006A3 (en) | Light-emitting device and method for manufacturing the same | |
TW200634915A (en) | Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus | |
GB2429848A (en) | Electronics module and method for manufacturing the same | |
EP2216790A4 (en) | ELECTRICALLY CONDUCTIVE PASTE AND ELECTRICAL AND ELECTRONIC ARRANGEMENT THEREOF | |
WO2007122516A3 (en) | Apparatus and method for use in mounting electronic elements | |
TW200733475A (en) | Module with a built-in antenna, card-formed information device and manufacturing methods thereof | |
TW200503205A (en) | Helical microelectronic contact and method for fabricating same | |
EP1732215A3 (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | |
TW200733843A (en) | Filter and its coils connecting frame | |
EP2432013A3 (en) | Sealing member for electronic component package and electronic component package | |
TW200802743A (en) | High frequency device module and method for manufacturing the same | |
TW200633344A (en) | Noise filter and motor | |
TW200739754A (en) | Microelectronic component with photo-imageable substrate | |
EP1848030A3 (en) | Method of manufacturing semiconductor apparatus | |
TW200504982A (en) | Semiconductor device and manufacturing method thereof | |
EP2048922A3 (en) | COF Board | |
DK1956653T3 (da) | Kredsløbsapparat med bundet SMD-komponent | |
WO2009050843A1 (ja) | 電子デバイス | |
TW200711096A (en) | Surge absorbing circuit | |
TW200744263A (en) | Terminal structure and connecting method thereof | |
TW200943709A (en) | Piezoelectric device, and electronic apparatus using the same, and automobile | |
EP1770610A3 (en) | Semiconductor device |