TW200943407A - Micro-suspension structure for a compatible semiconductor device and a fabricating method for the same - Google Patents

Micro-suspension structure for a compatible semiconductor device and a fabricating method for the same

Info

Publication number
TW200943407A
TW200943407A TW97112366A TW97112366A TW200943407A TW 200943407 A TW200943407 A TW 200943407A TW 97112366 A TW97112366 A TW 97112366A TW 97112366 A TW97112366 A TW 97112366A TW 200943407 A TW200943407 A TW 200943407A
Authority
TW
Taiwan
Prior art keywords
micro
semiconductor device
electro
mechanical structure
compatible
Prior art date
Application number
TW97112366A
Other languages
Chinese (zh)
Other versions
TWI360177B (en
Inventor
Siew Seong Tan
Original Assignee
Memsmart Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memsmart Semiconductor Corp filed Critical Memsmart Semiconductor Corp
Priority to TW97112366A priority Critical patent/TWI360177B/en
Publication of TW200943407A publication Critical patent/TW200943407A/en
Application granted granted Critical
Publication of TWI360177B publication Critical patent/TWI360177B/en

Links

Landscapes

  • Pressure Sensors (AREA)
  • Micromachines (AREA)

Abstract

The present invention relates to a micro-suspension structure for a compatible semiconductor device and a fabricating method for the same. At least one semiconductor device and at least one micro-electro-mechanical structure are formed in an insulating layer on a silicon substrate, and the micro-electro-mechanical structure comprises at least one microstructure, at least one compatible connecting member and metal circuits independent from one another, wherein the compatible connecting member electrically connects the semiconductor device to the micro-electro-mechanical structure. The silicon substrate is subjected to a first etching to form a cutting room and then is subjected to a second etching to form a suspension room in connection with the cutting room. At this time, the micro-electro-mechanical structure is suspending, and the compatible connecting member in the insulating layer can electrically connect the micro-electro-mechanical structure to the semiconductor device. Thereby, the micro-electro-mechanical structure can be connected to the semiconductor device effectively, and the erosion and exposure of the micro electro-mechanical structure can be avoided.
TW97112366A 2008-04-03 2008-04-03 Micro-suspension structure for a compatible semico TWI360177B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97112366A TWI360177B (en) 2008-04-03 2008-04-03 Micro-suspension structure for a compatible semico

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW97112366A TWI360177B (en) 2008-04-03 2008-04-03 Micro-suspension structure for a compatible semico

Publications (2)

Publication Number Publication Date
TW200943407A true TW200943407A (en) 2009-10-16
TWI360177B TWI360177B (en) 2012-03-11

Family

ID=44869008

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97112366A TWI360177B (en) 2008-04-03 2008-04-03 Micro-suspension structure for a compatible semico

Country Status (1)

Country Link
TW (1) TWI360177B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477436B (en) * 2011-03-02 2015-03-21 Memsor Corp Method for manufacturing a micro-electromechanical device
TWI483892B (en) * 2011-05-06 2015-05-11 Memsor Corp Micro-electromechanical device and method for manufacturing micro-electromechanical device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477436B (en) * 2011-03-02 2015-03-21 Memsor Corp Method for manufacturing a micro-electromechanical device
TWI483892B (en) * 2011-05-06 2015-05-11 Memsor Corp Micro-electromechanical device and method for manufacturing micro-electromechanical device

Also Published As

Publication number Publication date
TWI360177B (en) 2012-03-11

Similar Documents

Publication Publication Date Title
EP2441530A3 (en) Electromechanical transducer and method of manufacturing the same
WO2010111601A3 (en) Methods of forming printable integrated circuit devices and devices formed thereby
WO2016192373A1 (en) Integrated structure of mems microphone and pressure sensor, and manufacturing method thereof
WO2011162953A3 (en) Planar cavity mems and related structures, methods of manufacture and design structures
JP2009194322A5 (en)
JP2012085239A5 (en)
JP2013115289A5 (en)
WO2008067294A3 (en) Microfabrication methods for forming robust isolation and packaging
WO2009071595A3 (en) Device with encapsulated integrated circuit and a n/mems and method for production
TW200731369A (en) A method of thinning a semiconductor structure
WO2010090798A3 (en) Substrate bonding with metal germanium silicon material
WO2009003542A3 (en) Method for the production of a component, and component
WO2007117829A3 (en) Method for bonding a semiconductor substrate to a metal substrate
US9761557B2 (en) CMOS-MEMS integration by sequential bonding method
JP2013512792A5 (en)
WO2010011009A9 (en) Metal substrate for an electronic component module, module comprising same, and method for manufacturing a metal substrate for an electronic component module
US10457546B2 (en) Micro-electro-mechanical system structure and method for forming the same
JP2010219513A5 (en)
JP2009105291A (en) Junction structure and its manufacturing method
TW200943407A (en) Micro-suspension structure for a compatible semiconductor device and a fabricating method for the same
JP2007069341A5 (en)
WO2013126033A3 (en) Apparatus and methods for uniformly forming porous semiconductor on a substrate
TW200633923A (en) Method for releasing a micromechanical structure
WO2011095386A3 (en) Production method for a porous micro needle assembly having rear face connection and corresponding porous micro needle assembly
WO2010136986A3 (en) Mems element

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees