TW200943407A - Micro-suspension structure for a compatible semiconductor device and a fabricating method for the same - Google Patents
Micro-suspension structure for a compatible semiconductor device and a fabricating method for the sameInfo
- Publication number
- TW200943407A TW200943407A TW97112366A TW97112366A TW200943407A TW 200943407 A TW200943407 A TW 200943407A TW 97112366 A TW97112366 A TW 97112366A TW 97112366 A TW97112366 A TW 97112366A TW 200943407 A TW200943407 A TW 200943407A
- Authority
- TW
- Taiwan
- Prior art keywords
- micro
- semiconductor device
- electro
- mechanical structure
- compatible
- Prior art date
Links
Landscapes
- Pressure Sensors (AREA)
- Micromachines (AREA)
Abstract
The present invention relates to a micro-suspension structure for a compatible semiconductor device and a fabricating method for the same. At least one semiconductor device and at least one micro-electro-mechanical structure are formed in an insulating layer on a silicon substrate, and the micro-electro-mechanical structure comprises at least one microstructure, at least one compatible connecting member and metal circuits independent from one another, wherein the compatible connecting member electrically connects the semiconductor device to the micro-electro-mechanical structure. The silicon substrate is subjected to a first etching to form a cutting room and then is subjected to a second etching to form a suspension room in connection with the cutting room. At this time, the micro-electro-mechanical structure is suspending, and the compatible connecting member in the insulating layer can electrically connect the micro-electro-mechanical structure to the semiconductor device. Thereby, the micro-electro-mechanical structure can be connected to the semiconductor device effectively, and the erosion and exposure of the micro electro-mechanical structure can be avoided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97112366A TWI360177B (en) | 2008-04-03 | 2008-04-03 | Micro-suspension structure for a compatible semico |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97112366A TWI360177B (en) | 2008-04-03 | 2008-04-03 | Micro-suspension structure for a compatible semico |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200943407A true TW200943407A (en) | 2009-10-16 |
TWI360177B TWI360177B (en) | 2012-03-11 |
Family
ID=44869008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97112366A TWI360177B (en) | 2008-04-03 | 2008-04-03 | Micro-suspension structure for a compatible semico |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI360177B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI477436B (en) * | 2011-03-02 | 2015-03-21 | Memsor Corp | Method for manufacturing a micro-electromechanical device |
TWI483892B (en) * | 2011-05-06 | 2015-05-11 | Memsor Corp | Micro-electromechanical device and method for manufacturing micro-electromechanical device |
-
2008
- 2008-04-03 TW TW97112366A patent/TWI360177B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI477436B (en) * | 2011-03-02 | 2015-03-21 | Memsor Corp | Method for manufacturing a micro-electromechanical device |
TWI483892B (en) * | 2011-05-06 | 2015-05-11 | Memsor Corp | Micro-electromechanical device and method for manufacturing micro-electromechanical device |
Also Published As
Publication number | Publication date |
---|---|
TWI360177B (en) | 2012-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |