200939928 ‘ 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種殼體、該殼體之製造方法及應用該 殼體之電子裝置。 【先前技術】 隨著移動通信、藍牙等技術之發展，實現這些應用之 電子裝置容置了越來越多之功能，然而這些電子裝置之體 積卻向著輕、薄之方向發展，因此，如何簡化這些電子裝 ❾置中内置元件之結構、減小這些内置元件之體積對於簡化 整個電子裝置之結構及降低該電子裝置之體積具有非常 重要之作用。天線作為電子裝置中一收發信號之重要元 件’其結構之簡化及體積之減小對於簡化整個電子裝置之 結構及降低該電子裝置之體積具有關鍵之作用。 習知如設置有内置銅箔天線之殼體在製作時，首先在 一天線狀載體薄膜上正反兩面均黏貼一銅箔形成一天 ❾線’然後將該天線用雙面膠黏貼於一模内鑲件注塑（JML ) 薄膜上，再將該黏貼有天線之薄膜放置於注塑模具内，通 過注塑成型一塑膠層，使該塑膠層與薄臈成型為一體，形 成一具有内置天線之殼體。此種方法製作之殼體，一方面 天線之結構複雜，厚度及整體體積大，不利於殼體及電子 裝置結構之簡化，且會影響到塑膠層注塑成型後之外觀， 另一方面該殼體製作時工藝複雜，致使殼體及電子裝置之 成本上升。 【發明内容】 6 200939928 * 、體積小之内置天 鑒於此，本發明提供一種結構簡單 線之殼體。 另，還有必要提供一種所述殼體之製造方法。 另，還有必要提供一種應用所述殼體之電子裝置。 :種電子裝置殼體’其包括—基體層及—天線，所述 天線形成於基體層上，該天線為一導電油墨層。 一種電子裝置殼體之製作方法，其包括如下步驟：200939928 ‘9. Description of the Invention: TECHNICAL FIELD The present invention relates to a casing, a method of manufacturing the casing, and an electronic device using the casing. [Prior Art] With the development of technologies such as mobile communication and Bluetooth, electronic devices that implement these applications accommodate more and more functions, but the size of these electronic devices is moving toward lightness and thinness, so how to simplify The structure of the built-in components in these electronic devices and the reduction of the volume of these built-in components play a very important role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. The simplification of the structure and the reduction of the volume of the antenna as an important component of the signal transmission and reception in the electronic device play a key role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. Conventionally, when a housing provided with a built-in copper foil antenna is manufactured, first, a copper foil is adhered to the front and back sides of an antenna-shaped carrier film to form a one-day twist line, and then the antenna is adhered to the mold with double-sided tape. On the insert molding (JML) film, the film with the antenna attached is placed in the injection mold, and a plastic layer is formed by injection molding, so that the plastic layer and the thin layer are integrally formed to form a casing with a built-in antenna. The housing made by this method has the complicated structure, large thickness and overall bulk of the antenna, which is not conducive to the simplification of the structure of the housing and the electronic device, and affects the appearance of the plastic layer after injection molding. On the other hand, the housing The manufacturing process is complicated, resulting in an increase in the cost of the housing and the electronic device. SUMMARY OF THE INVENTION 6 200939928 *, small built-in days In view of this, the present invention provides a housing having a simple structure. In addition, it is also necessary to provide a method of manufacturing the housing. In addition, it is also necessary to provide an electronic device to which the housing is applied. The electronic device housing 'includes a base layer and an antenna, and the antenna is formed on the base layer, and the antenna is a conductive ink layer. A method of manufacturing an electronic device housing, comprising the steps of:
❹ 提供一基體層； …在該基體層上形成-天線，該天線為以油墨印刷之方 式形成於該基體層上之導電油墨層。 -種電子裝置’其包括一本體及一殼體，所述本體内 容置有-電路板’該電路板上設置有—導電端子，所述殼 體包括-基體層及-天線，所述天線形成於基體層上，該 天線為-導電m所述殼體裝設於本體上後導電端^ 之端部靠近所述天線，實現該電子裝置之收發 能。 本發明電子裝置之天線以油墨印刷之方式形成於殼 體上，製作方法簡便，製得之天線結構簡單，可達到輕、 薄、體積小之效果，從而使得本發明殼體及電子裝置之結 構簡化’並可降低產品之成本。 … 【實施方式】 »月參閱圖1至圖2，本發明較佳實施方式所述之電子 裝置10包括一本體13及一裝設於本體13上之殼體u。 本體 13 可為手機、PDA ( Personal Dighal Assistant , 200939928 個人數位助理）或Smart-phone (智慧手機）等可攜式電 子裝置之本體。本體13内容置有一電路板131’該電路 板131上設置有一導電端子132，該導電端子132為彈性 柱狀體，其用以饋入饋出電磁波信號。 殼體11包括一基體層111、一天線113及一天線保護 層114，所述天線113形成於基體層111上，天線保護層 114形成於天線113上。 請進一步參閱圖3,基體層111為一塑膠層，其可通 ® 過注塑成型之方式製成。形成基體層111之材料可選自為 聚乙烯、聚醯胺、聚碳酸酯、丙烯睛-苯乙烯-丁二烯共聚 合物、聚甲基丙烯酸甲酯或聚對苯二甲酸乙二醇酯等塑膠 中之任一種。基體層111亦可以為玻璃層，該玻璃可為石夕 酸鹽玻璃、硼酸鹽玻璃或磷酸鹽玻璃等。基體層包括 一第一表面1111及一與第一表面U11相對之第二表面 1113’在所述第一表面1113上形成有一結合區m2，該 ❾結合區1112之形狀與所述天線us之形狀相一致。 天線113為一導電油墨層，其以油墨印刷之方式形成 於基體層111之第二表面1113之結合區m2上。該導電 油墨層中可添加金、銀或銅等金屬粉末材料，也可添加導 電碳粉、銀碳粉、 石墨粉或碳與石墨之混合粉末等導電材 料。所述天線113之厚度為〇 〇〇2〜〇 〇15mm。❹ providing a base layer; ... forming an antenna on the base layer, the antenna being a conductive ink layer formed on the base layer by ink printing. An electronic device that includes a body and a housing, the body content is provided with a circuit board. The circuit board is provided with a conductive terminal, and the housing includes a base layer and an antenna, and the antenna is formed. On the base layer, the antenna is electrically conductive. The housing is mounted on the body, and the end of the conductive end is adjacent to the antenna to realize the transmission and reception of the electronic device. The antenna of the electronic device of the invention is formed on the casing by ink printing, and the manufacturing method is simple, and the prepared antenna has a simple structure, and can achieve the effects of lightness, thinness and small volume, thereby making the structure of the casing and the electronic device of the invention. Simplify 'and reduce the cost of the product. [Embodiment] Referring to FIG. 1 to FIG. 2, an electronic device 10 according to a preferred embodiment of the present invention includes a body 13 and a housing u mounted on the body 13. The main body 13 can be a portable electronic device such as a mobile phone, a PDA (Personal Dighal Assistant, 200939928 Personal Digital Assistant) or a Smart-phone (smartphone). The main body 13 is provided with a circuit board 131'. The circuit board 131 is provided with a conductive terminal 132. The conductive terminal 132 is an elastic column for feeding electromagnetic waves. The housing 11 includes a base layer 111, an antenna 113, and an antenna protection layer 114. The antenna 113 is formed on the base layer 111, and the antenna protection layer 114 is formed on the antenna 113. Referring to FIG. 3 further, the base layer 111 is a plastic layer which can be formed by injection molding. The material forming the base layer 111 may be selected from the group consisting of polyethylene, polyamide, polycarbonate, acrylonitrile-styrene-butadiene copolymer, polymethyl methacrylate or polyethylene terephthalate. Any of the plastics. The base layer 111 may also be a glass layer, which may be a silicate glass, a borate glass or a phosphate glass. The base layer includes a first surface 1111 and a second surface 1113' opposite to the first surface U11. A joint area m2 is formed on the first surface 1113, and the shape of the ❾ joint area 1112 and the shape of the antenna us Consistent. The antenna 113 is a conductive ink layer formed on the bonding area m2 of the second surface 1113 of the base layer 111 by ink printing. A metal powder material such as gold, silver or copper may be added to the conductive ink layer, and a conductive material such as conductive carbon powder, silver carbon powder, graphite powder or a mixed powder of carbon and graphite may be added. The thickness of the antenna 113 is 〇 〇〇 2 〇 〇 mm 15 mm.
層114為親塑性之油墨層， 之表面被氧化和擦傷。該天線保護 層其厚度為0.002〜〇.〇15mm。 200939928 所述殼體11蓋設於本體13上後，所述導電端子132 之端部接觸天線保遵層14或靠近（如小於所述 天線113，即可較佳實現該電子裝置之收發電信號功 可以理解，亦可在本發明殼體u之天線113上設置 一導電柱’當殼體11蓋設於本體13上後，所述導電柱接 觸或靠近（如小於〇.5mm)所述電路板ι31之導電端子 ❺132，即可實現所述電子裝置1〇之收發電信號功能。 本發明殼體11之製作方法，首先對基體層ιη之第 二表面1113之結合區1112使用氮氣（n2)、氧氣（〇2) 或氫氣（Hz )之等離子體進行活化處理，再於該活化後之 結合區1112上印刷一導電油墨層，即形成天線113。再於 該天線113上印刷一天線保護層114。 可以理解，本發明殼體11亦可以為電子裝置之蓋體， 所述天線113形成於該蓋體中。 ❹，本發明電子裝置10之天線113以印刷導電油墨之方 式形？於设體11中’製作方法簡便，製得之天線113結 構簡單T達到輕、薄、體積小之效果，從而使得本發明 電子裝置10之結構簡化，並可降低生產之成本。 【圖式簡單說明】 圖1係本發明較佳實施方式電子裝置之立體組裝示 意圖。 立圖2係本發明較佳實施方式電子裝置之立體分解示 9 200939928 . 圖3係本發明較佳實施方式殼體之另一視角立體分 解示意圖。 【主要元件符號說明】 電子裝置 10 殼體 11 本體 13 基體層 111 天線 113 第一表面 1111 電路板 131 導電端子 132 第二表面 1113 天線結合區 1112 天線保護層 114Layer 114 is an inotropic ink layer whose surface is oxidized and scratched. The antenna protective layer has a thickness of 0.002 〇.〇15 mm. 200939928 After the housing 11 is covered on the body 13, the end of the conductive terminal 132 contacts the antenna protection layer 14 or is close to the antenna 113, and the electrical signal of the electronic device can be better realized. It can be understood that a conductive post can be disposed on the antenna 113 of the housing u of the present invention. When the housing 11 is mounted on the body 13, the conductive post contacts or approaches (eg, less than 〇5 mm) the circuit. The conductive terminal ❺132 of the board ι31 can realize the function of transmitting and receiving electrical signals of the electronic device 1 . The manufacturing method of the housing 11 of the present invention firstly uses nitrogen (n2) for the bonding region 1112 of the second surface 1113 of the base layer ιn. The plasma of oxygen (〇2) or hydrogen (Hz) is activated, and a conductive ink layer is printed on the activated bonding region 1112 to form an antenna 113. An antenna protective layer is printed on the antenna 113. 114. It can be understood that the housing 11 of the present invention can also be a cover of an electronic device, and the antenna 113 is formed in the cover. The antenna 113 of the electronic device 10 of the present invention is formed by printing conductive ink. 'production in body 11 The method is simple, and the prepared antenna 113 has a simple structure T, which is light, thin, and small in size, so that the structure of the electronic device 10 of the present invention is simplified, and the cost of production can be reduced. [Simplified Schematic] FIG. 1 is the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a perspective exploded view of another embodiment of the preferred embodiment of the present invention. FIG. 3 is a perspective exploded view of the housing of the preferred embodiment of the present invention. DESCRIPTION OF THE MAIN ELEMENTS SYMBOLS Electronic device 10 Housing 11 Main body 13 Base layer 111 Antenna 113 First surface 1111 Circuit board 131 Conductive terminal 132 Second surface 1113 Antenna bonding area 1112 Antenna protection layer 114