201041223 六、發明說明： 【發明所屬之技術領域】 尤其關於一種具有天線功能 本發明涉及一種電子裝置殼體 之電子裝置殼體及其製造方法。 【先前技術】 隨著移動通信、藍牙紐術之發展，實現這些制 置配備了絲越多之魏，細這些電子裝置之體積卻向著輕 权方向發展，耻，如域化這些電子駭巾内置元件之結構、 〇減小這些喊元狀體賴於簡化整個好裝置之結構及降低該 電子裝置之體積具有非常重要之作用。天線作為電子裝置中一收 發信號之重要元件，其結構之簡化及體狀減小對於簡化整個電 子裝置之結構及降低該電子裝置之體積具有關鍵之作用。 傳統較常見之電子裝置之天線為可伸縮式鞭狀天線，該種天 線在不使料可收_電子裝置之主體内，賴種天線由於常進 行伸縮且暴露在外，易於損壞，邱觀子裝置上之體積較大， 〇而今賴天線已較少。财之趨勢將具錢統天線功能之天 線層幵v成在電子裝置$體内部之方式，通過將導電油墨印刷在一 薄膜上，再將薄膜置入模具内一體形成一具有天線功能之殼體， 且注塑後在導電油㈣前二連接處，續電子裝置之内部電連 接端子伸人至該導電油墨層而電性導通。然而，由於所述薄膜之 厚度相對㈣’ _上導電油墨預留之連接點在與電點裝置内部 之電連接端子連接後’為保證連接穩定，電連接端子會抵持薄膜， 使薄膜凸起，從而影響殼體之外觀；若改用軟性元件連接，則不 便於、’且裝’而且常會出現連接不穩定會或隨著電子裝置之使用時 3 201041223 ’使得天線層無法有效電 =性元件與導電油墨編之情況 【發明内容】 鑒於上述内容， 製造方便且可維持與 能之電子裝置之殼體 本發明提供一種便於與電子裝置主體組裴， 電子農置之_電路連接穩定之具有天線功 體之^方:要提供—種製造該種具有天線功能之電子農置殼201041223 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device housing of an electronic device housing and a method of manufacturing the same. [Prior Art] With the development of mobile communication and Bluetooth technology, the implementation of these devices is equipped with more and more Wei, the volume of these electronic devices is moving toward the direction of light power, shame, such as domainization, these electronic wipes built-in The structure of the components, and the reduction of these shunting bodies, play a very important role in simplifying the structure of the entire device and reducing the volume of the electronic device. As an important component of a signal in an electronic device, the simplification of the structure and the reduction of the shape of the antenna play a key role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. The antenna of the conventional electronic device is a retractable whip antenna. In the main body of the electronic device, the antenna is easily stretched and exposed, and is easily damaged. The Qiuguanzi device is easily damaged. The size of the upper one is larger, and now the antenna is less. The trend of the financial system is to use the antenna layer of the antenna function to be inside the electronic device. By printing the conductive ink on a film, the film is placed in the mold to form a housing with an antenna function. After the injection molding, at the first two connections of the conductive oil (4), the internal electrical connection terminals of the electronic device extend to the conductive ink layer to be electrically connected. However, since the thickness of the film is relatively (four)' _ the connection point reserved for the conductive ink is connected to the electrical connection terminal inside the electrical point device, 'to ensure the connection is stable, the electrical connection terminal will resist the film, so that the film is convex , which affects the appearance of the housing; if it is connected with a soft component, it is inconvenient, 'and installed' and often there will be unstable connection or when the electronic device is used 3 201041223 'The antenna layer cannot be effective In the case of a conductive ink package, the present invention provides a housing that is easy to manufacture and maintains an electronic device. The present invention provides an antenna that is convenient for connection with an electronic device body. The function of the body: to provide - the manufacture of this kind of electronic farm housing with antenna function
一種具有天線功能之電子裝置之殼體，包括—薄膜層、一天 線層及-基體層’所述天線層形成於薄騎與基體層之間，包括 導電油墨層及金屬片’該殼體通過將天線層形成於薄膜層後再注 塑-體形成制得’所述金屬片嵌於基體層中且金屬片之一端連接 導電油墨，另一端從該基體層中伸出。 • -種具有天線姐之電子裝置殼體之製齡法，包括如下步 提供一薄膜； 在所述薄膜上印刷導電油墨層， 在該導電油墨層上_金屬片’該導電油墨層與金屬片 一天線層，並整體形成一薄膜層； 將該薄膜層置於-模具内，注塑與該_層成型成一體，該 注入之塑膠形成-基體層，所述金屬片嵌於基體層中且金屬片= 一端連接導電油墨層，另一端從該基體層中伸出。 相較習知技術，本具有天線功能之電子技之殼體通過 膜上印刷導電油墨後縣導f油墨上預置金Μ，該導電油墨與 4 201041223 金屬片形颜述天線層’然後將簡赌於模具哺塑膠一體成 型’所述塑膠形成基體層，所述金屬片之端部從基體層中凸出， 如此可方便殼體之天線層與電子農置之内部電路電連接，通過金 屬片與電子裝置内部之電連接端子彈性抵持或爽持，可確保殼體 之天線層與電子裝置之内部電路連接穩定。 【實施方式】 請參關1及圖2’本發明較佳實施例具有天線裝置之電子裝 置殼體ίο包括-薄膜層12，-天線層14及一基體層16。所述天 〇線層14形成於薄膜層12與基體層16之間，該天線層14包括導 電油墨層M2及金屬片U4。所述基體層16通過注塑成型結合所 述薄膜層12，即注入之塑料形成該基體層16。所述金屬片:嵌 於基體層16中且金屬片144之1連接導電油墨層142，另一端 從該基體層16中伸出。 所述雜層可為透_膜，可恥模_件注塑（iml) 成型之基酸，製作該薄騎12之材料可以選自為聚微醋（pc) 〇或聚對苯二甲酸乙二醇酯（PET)等樹脂材料，其形成電子裝置殼 體10之外表層。該薄膜層12之-表面之部分區域印刷有所述導 電油墨層142，該導電油墨層142可採用網版印刷於薄膜層口上 預設之區域，該導電油墨層142中可由金、銀、銅、導電曰碳粉、 銀碳粉、石墨粉或碳與石墨之混合粉末之—種❹種混合而成。 所述金屬>^44職使導電油錢⑷與電子之内部電路電 性連接，該金屬;M44可選擇銅、鐵、轉導電性能較好之金屬 材質，較常採用銅片。所述基體層16為—塑膠 ㈣式結合於薄_12之表面上且遮蓋所物油==成 5 201041223 =層16之材料可選自為聚乙烯、聚醯胺、聚碳_、丙稀睛_ 本乙烯-丁二稀共聚合物、聚甲基丙稀酸甲醋或聚對 醇酯等塑膠中之任一種。 一 一 力所述殼體10組裝於電子褒置上後，所述金屬片144之外露端 部固接（如抵持或夾持）電子裝置内部電路板上之導電端子（未 圖示），用於實現電子裝置收發信號之功能。 ο 本發明具有天線功能之電子裝置之殼體1G之製作方法 如下步驟： ❸ 首先提供一與薄膜層12相對應之片狀薄膜（未圖示），缺後 之-表面之預設區域印刷所述導電油麵142。接著將該 T進行缝職型，麟立卿蚊_，再對賴成型後之 翻進行裁切’如對其修邊等，如此獲得所述薄膜層12。提供所 述金屬片I44，將該金屬片m貼附在所述薄膜層u之導電油墨 =142上’該導電油墨層142與金屬片144形成所述天線層14。 請結合參_ 3 ’將制彡成有天線層14之_層12置入一模具 2〇内’合模注塑，則注入之塑膠與所述薄賴12及天線層以結 合成-體，且所述塑膠形成所述基體層16，所述金屬片144喪於 基體層I6中且金屬片10之一端連接導電油墨層⑽，另 該 基體層16中伸出，如此可獲得所述殼體1〇。 可以理解，為了加強基體層16與薄膜層以導電油墨芦⑷ 之結合力，在注塑成型基體層之前可於薄膜層U及導電油墨 層142上粘貼一粘膠層，再注塑成型基體層16。 可以理解’為了裝飾該殼體1〇 ’可在薄膜層12印刷天線層 14之前先印卿成圖案層，然後在圖案層上或圖案層之外之其他 6 201041223 區域再印卿電油墨層142，後注塑成型基體廣16。 本具有天線功能之電子裴置之殼體10藉由薄膜層12上印刷 導電油墨層I42後再在導電油墨層⑽上預置金屬片⑷，然後將 該薄膜層1_2置於模具内與塑膠一體成型，所賴膠形成基體層 16，邊導電油墨層142與金屬片144形成所述天線層14，所述金 屬片144之端部從基體層16中凸出，如此可使殼體1〇之天線層 14與電子裝置之内部電路電連接，通過金屬片144與電子裝置；A housing for an electronic device having an antenna function, comprising: a film layer, an antenna layer and a base layer, wherein the antenna layer is formed between the thin ride and the base layer, comprising a conductive ink layer and a metal sheet. After the antenna layer is formed on the film layer and then injection-molded, the metal piece is embedded in the base layer and one end of the metal piece is connected to the conductive ink, and the other end is extended from the base layer. - a method of ageing an electronic device housing having an antenna sister, comprising the steps of: providing a film; printing a conductive ink layer on the film, on the conductive ink layer - the metal foil 'the conductive ink layer and the metal sheet An antenna layer is integrally formed with a film layer; the film layer is placed in a mold, and injection molding is integrally formed with the layer, and the injected plastic forms a base layer, and the metal piece is embedded in the base layer and metal Sheet = One end is connected to the conductive ink layer and the other end is extended from the base layer. Compared with the prior art, the housing of the electronic technology having the antenna function is printed on the film by the conductive ink, and the pre-dating ink is preset on the ink, and the conductive ink and the 4 201041223 metal sheet-shaped antenna layer are then simplified. The plastic mold is formed into a base layer, and the end portion of the metal sheet protrudes from the base layer, so that the antenna layer of the housing can be electrically connected to the internal circuit of the electronic farm, through the metal sheet. The electrical connection terminal of the electronic device is elastically resisted or held, and the connection between the antenna layer of the housing and the internal circuit of the electronic device is ensured. [Embodiment] Referring to Figure 1 and Figure 2', an electronic device housing having an antenna device comprises a thin film layer 12, an antenna layer 14, and a base layer 16. The antenna layer 14 is formed between the film layer 12 and the substrate layer 16, and the antenna layer 14 includes a conductive ink layer M2 and a metal sheet U4. The base layer 16 is bonded to the film layer 12 by injection molding, i.e., the injected plastic forms the base layer 16. The metal piece is embedded in the base layer 16 and one of the metal sheets 144 is connected to the conductive ink layer 142, and the other end is extended from the base layer 16. The hybrid layer may be a transmissive film, a shame-molded (iml) shaped base acid, and the material for making the thin ride 12 may be selected from the group consisting of poly vinegar (pc) bismuth or polyethylene terephthalate. A resin material such as an ester (PET) which forms a surface layer other than the electronic device case 10. The conductive ink layer 142 is printed on a portion of the surface of the film layer 12, and the conductive ink layer 142 can be screen printed on a predetermined area on the film layer. The conductive ink layer 142 can be made of gold, silver or copper. It is a mixture of conductive tantalum carbon powder, silver carbon powder, graphite powder or a mixture of carbon and graphite. The metal > ^ 44 position electrically conductive oil (4) is electrically connected to the internal circuit of the electron, and the metal; M44 can be selected from copper, iron, and metal materials with better conductivity, and copper sheets are often used. The base layer 16 is a plastic (four) type bonded to the surface of the thin layer _12 and covers the oil of the material == into 5 201041223 = the material of the layer 16 may be selected from the group consisting of polyethylene, polyamide, polycarbon _, propylene _ Any of the plastics such as ethylene-butadiene dipolymer, polymethyl methacrylate or polyglycol ester. After the housing 10 is assembled on the electronic device, the exposed end of the metal piece 144 is fixed (eg, resisted or clamped) to a conductive terminal (not shown) on the internal circuit board of the electronic device. It is used to realize the function of transmitting and receiving signals by electronic devices. The manufacturing method of the housing 1G of the electronic device having the antenna function is as follows: ❸ First, a sheet-like film (not shown) corresponding to the film layer 12 is provided, and the missing surface-predetermined area printing station The conductive oil surface 142 is described. Then, the T is sewn into a job type, and the lining of the lining, and then the dicing of the lap is cut, as the edging is performed, and the film layer 12 is obtained. The metal piece I44 is provided, and the metal piece m is attached to the conductive ink of the film layer u = 142. The conductive ink layer 142 and the metal piece 144 form the antenna layer 14. Please insert the layer 12 with the antenna layer 14 into a mold 2〇 in conjunction with the reference _ 3 ', and insert the plastic with the thin layer 12 and the antenna layer to form a body, and The plastic layer forms the base layer 16, the metal piece 144 is lost in the base layer I6, and one end of the metal piece 10 is connected to the conductive ink layer (10), and the base layer 16 is extended, so that the case 1 can be obtained. Hey. It can be understood that in order to strengthen the bonding force between the base layer 16 and the film layer with the conductive ink reed (4), an adhesive layer may be pasted on the film layer U and the conductive ink layer 142 before the injection molding of the substrate layer, and the base layer 16 is injection molded. It can be understood that 'in order to decorate the casing 1', the patterned layer can be printed before the film layer 12 is printed on the film layer 12, and then the electro-chemical ink layer 142 is printed on the pattern layer or other 6 201041223 areas outside the pattern layer. The post-injection molding substrate is 16 wide. The housing 10 of the electronic device having the antenna function is formed by printing the conductive ink layer I42 on the film layer 12 and then presetting the metal piece (4) on the conductive ink layer (10), and then placing the film layer 1_2 in the mold and integrating with the plastic. Forming, the adhesive layer forms the base layer 16, and the conductive ink layer 142 and the metal piece 144 form the antenna layer 14. The end of the metal piece 144 protrudes from the base layer 16, so that the casing 1 can be made The antenna layer 14 is electrically connected to the internal circuit of the electronic device, through the metal piece 144 and the electronic device;
4之電連接端子彈性抵持錢持’可確保殼體之天騎Μ與電子 裝置之内部電路連接穩定。 〃 【圖式簡單說明】 圖1係本發戰佳實施村具有天線雜之電子裝置殼體之 圖。 圖2係圖1所紅具有球魏之電子裝驗體之分解示意 ^細1所权具有赠魏之電作置㈣_過程示 【主要元件符號說明】 電子裝置殼體 1Q 薄膜層 12 天線層 14 導電油墨層 142 144 16 金屬片 基體層 模具 20The electrical connection terminal of 4 is elastically resisted to ensure that the connection between the antenna of the casing and the internal circuit of the electronic device is stable. 〃 [Simple description of the diagram] Figure 1 is a diagram of the housing of an electronic device with antennas in the implementation of this warfare implementation village. Fig. 2 is a schematic diagram of the decomposition of the electronic test body with the ball Wei in Fig. 1. The weight of the electronic device is given by Wei (the fourth) _ process indication [main symbol description] electronic device housing 1Q film layer 12 antenna layer 14 conductive ink layer 142 144 16 metal sheet base layer mold 20