200935864 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種蓋體、該蓋體之製造方法及應用該 蓋體之電子裝置。 【先前技術】 &者移動通信、藍牙等技術之發展，實現這些應用之 電子裝置谷置了越來越多之功能，然而這些電子裝置之體 ❹積卻向著輕、薄之方向發展，因此，如何簡化這些電子裝 置中内置元件之結構、減小這些内置元件之體積對於簡化 整個電子裝置之結構及降低該電子裝置之體積具有非常 重要之作用。天線作為電子裝置中一收發信號之重要元 件，其結構之間化及體積之減小對於簡化整個電子裝置之 結構及降低該電子裝置之體積具有關鍵之作用。 習知如設置有内置銅箔天線之蓋體在製作時，首先在 一天線狀載體薄膜上正反兩面均黏貼一銅箔形成一天 ❾線，然後將該天線用雙面膠黏貼於一模内鑲件注塑（) 薄膜上，再將該黏貼有天線之薄膜放置於注塑模具内，通 過注塑成型一塑膠層，使該塑膠層與薄膜成型為一體，形 成一具有内置天線之蓋體。此種方法製作之蓋體，一方面 天線之結構複雜，厚度及整體體積大，不利於蓋體及電子 裝置結構之簡化，且會影響到塑膠層注塑成型後之外觀， 另一方面該蓋體製作時工藝複雜，致使蓋體及電子裝置之 成本上升。 【發明内容】 200935864 鑒於此’本發明提供一種結構簡單、體積小之内置天 線之蓋體。 另，還有必要提供一種所述蓋體之製造方法。 另，還有必要提供一種應用所述蓋體之電子裝置。 一種電子裝置殼體，其包括一薄膜層、一基體層及一 天線’所述基體層與薄膜層注塑結合，所述天線形成於薄 膜層上’該天線為以真空鍍膜之方式形成之金屬層。 ❹ 一種電子裝置殼體之製作方法，其包括如下步驟： 提供一薄膜層； 在所述薄膜層上形成一天線，該天線為以真空鍍膜之 方式形成於該薄臈層上之金屬層； 將形成有天線之薄膜層置於一模具内，注塑成型一與 該薄膜層相結合之基體層。 一種電子裝置’其包括一本體及一殼體，所述本體内 谷置有一電路板’該電路板上設置有一導電端子’所述殼 〇體包括一薄膜層、一基體層及一天線，該基體層與薄膜層 主塑結合’所述天線内置形成於薄膜層上，該天線為以真 空鑛膜之方式形成之金屬層；所述殼體裝設於本體上後導 電端子之端部接觸或靠近所述天線，實現該電子裝置之收 發電信號功能。 —本發明電子裝置之天線以真空鍍膜之方式形成於殼 ^上，製作方法簡單，製得之天線結構簡單，可達到輕、 ?體積小之效果，從而使得本發明殼體及電子裝置之結 構簡化，並可降低產品之成本。 200935864 【實施方式】 請參閱圖1至圖2’本發明較佳實施方式所述之電子 裝置10包括一本體13及一殼體11。 本體13可為行動電話、pda ( pers〇nai Digital Assistant)或Smart-phone (個人通訊助理機）等可攜式 電子裝置之本體。本體13内容置有一電路板131，該電 路板131上設置有一導電端子132，該導電端子132為彈 ❹性柱狀體，其用以饋入饋出電磁波信號。 殼體11包括一薄膜層m、一天線113及一基體層 115，所述天線113形成於薄膜層1U上，所述基體層115 注塑結合於薄膜層111。 請進厂步參閱圖3,薄膜層m為一模内鑲件注差 (IML)薄膜’其由—基礎層及印刷於該基礎層上之一身 飾油墨層組成。薄膜層m包括一第一表面im及一多 第一表面1111相對之第二表面1113，戶斤述第一表面⑴ 〇為基礎層表面，第二表面1113為裝飾油墨層表面。該， 礎層可為塑膠材料製成，該塑膠材料可以選自為聚 111 之第'一表面 1111 t jry IV . 13上形成有一天線結合區， 線結合區1112之形狀與天線113之形狀相一致。μ 天線113為一導電金屬層，其以真空鍍 於薄膜層m之第二表面1113之天線結合區= 線113之材料可& & 大· w Tt』μ為銅、銀等金屬材料。 基體層出為以注塑方式成型之塑膠層，其—端部附 200935864 近開設有一圓孔1151，該圓孔1151之直徑與内置於本體 13上之電路板131上之導電端子132之直徑相當。該基 體層115通過注塑成型之方式結合於薄膜層lu之第二表 面1113及天線113上，且所述基體層115與天線113結 合後圓孔1151之開口對準於天線113之區域。形成基體 層115之塑膠材料可選自為聚乙烯、聚醯胺、聚碳酸酯、 丙烯睛-苯乙烯-丁二婦共聚合物、聚曱基丙烯酸甲酯、聚 ❹對本一甲酸乙二醇酯等塑膠中之任一種。 所述殼體11蓋設於本體13上後，所述導電端子132 穿過基體層115之圓孔1151，使導電端子132之端部接觸 或靠近（如小於0.5mm)所述天線ι13，即可較佳實現該 電子裝置10之收發電信號功能。 可以理解，亦可在本發明殼體n之天線113上設置 V電柱，當殼體11蓋設於本體上後，所述導電柱接 觸於電路板131之導電端子132或與導電端子132之端部 ❹十分接近（如小於〇.5mm) ’即可較佳實現該電子裝置忉 之收發電信號功能。 *本發明殼體11之製作方法，首先於真空鍍膜室内將 薄膜層111之第二表面1113上真空鍍膜形成一導電金屬 層，形成天線113。再將該形成有天線113之薄膜層 置於一注塑模具内，在所述薄膜層1U之第二表面HU 上注塑成型一基體層115，使該基體層115與薄膜層^ 結合為—體，即製得該内置有天線Π3之殼體U。可以理 解，為了加強基體層115與薄膜層ill及天線113之結人 200935864 力，在注塑成型基體層115之前可於薄臈層11]L之第二表 面1113及天線113上黏貼一黏膠層，再注塑成型基體層 115。 θ 可以理解，本發明殼體n亦可以為電子裝置之蓋體， 所述天線113形成於電子裝置之蓋體中。 本心明電子裝置10之天線113以真空鍍膜之方式形 成於殼體U中，製作方法簡單，製得之天線ιΐ3結構簡 單，可達到輕、薄、體積小之效果，從而使得本發明電子 裝置10之結構簡化，並可降低生產之成本。 【圖式簡單說明】 圖1係本發明較佳實施方式電子裝置之立體組裝示 意圖。 圖2係本發明較佳實施方式電子裝置之立體分解示 意圖。 圖3係本發明較佳實施方式蓋體之另一視角立體分 0解示意圖。 【主要元件符號說明】 電子裝置 10 蓋體 11 本體 13 基體層 115 圓孔 1151 薄膜層 111 天線 113 第一表面 1111 電路板 131 導電端子 132 第二表面 1113 天線結合區 1112 11BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover body, a method of manufacturing the cover body, and an electronic device using the cover body. [Prior Art] With the development of technologies such as mobile communication and Bluetooth, electronic devices that implement these applications have more and more functions. However, the accumulation of these electronic devices is moving toward lightness and thinness. How to simplify the structure of the built-in components in these electronic devices and reduce the volume of these built-in components plays an important role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. As an important component of a signal transmission and reception in an electronic device, the structure and the reduction of the volume of the antenna play a key role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. When the cover body provided with the built-in copper foil antenna is manufactured, firstly, a copper foil is adhered to the front and back sides of an antenna-shaped carrier film to form a one-day twist line, and then the antenna is adhered to the mold with double-sided adhesive tape. The insert molding () film, the film adhered to the antenna is placed in the injection mold, a plastic layer is injection molded, and the plastic layer and the film are integrally formed to form a cover body with a built-in antenna. The cover body made by the method has the complicated structure, large thickness and overall bulk of the antenna, which is not conducive to the simplification of the structure of the cover body and the electronic device, and affects the appearance of the plastic layer after injection molding. On the other hand, the cover body The manufacturing process is complicated, resulting in an increase in the cost of the cover and the electronic device. SUMMARY OF THE INVENTION In view of the above, the present invention provides a cover body having a simple structure and a small size built-in antenna. In addition, it is also necessary to provide a method of manufacturing the cover. In addition, it is also necessary to provide an electronic device to which the cover body is applied. An electronic device housing comprising a film layer, a base layer and an antenna. The base layer is injection-molded with a film layer, and the antenna is formed on the film layer. The antenna is a metal layer formed by vacuum coating. .制作 a method for fabricating an electronic device housing, comprising the steps of: providing a thin film layer; forming an antenna on the thin film layer, the antenna being a metal layer formed on the thin germanium layer by vacuum coating; The film layer on which the antenna is formed is placed in a mold, and a base layer combined with the film layer is injection molded. An electronic device includes a body and a casing. The body is provided with a circuit board. The circuit board is provided with a conductive terminal. The casing body includes a film layer, a base layer and an antenna. The base layer is integrally molded with the film layer. The antenna is internally formed on the film layer, and the antenna is a metal layer formed by vacuum ore film; the shell is mounted on the body and the end of the conductive terminal is contacted or Adjacent to the antenna, the function of transmitting and receiving electrical signals of the electronic device is implemented. The antenna of the electronic device of the present invention is formed on the shell by vacuum coating, and the manufacturing method is simple, and the prepared antenna has a simple structure, and can achieve the effects of lightness and small volume, thereby making the structure of the casing and the electronic device of the present invention. Simplify and reduce the cost of the product. [Embodiment] Please refer to FIG. 1 to FIG. 2'. The electronic device 10 according to the preferred embodiment of the present invention includes a body 13 and a casing 11. The body 13 can be a body of a portable electronic device such as a mobile phone, a pda (pers〇ii Digital Assistant) or a Smart-phone (personal communication assistant). The main body 13 is provided with a circuit board 131. The circuit board 131 is provided with a conductive terminal 132. The conductive terminal 132 is an elastic cylindrical body for feeding and feeding electromagnetic wave signals. The housing 11 includes a film layer m, an antenna 113, and a base layer 115. The antenna 113 is formed on the film layer 1U, and the base layer 115 is injection-molded to the film layer 111. Referring to Figure 3, the film layer m is an in-mold insert (IML) film which consists of a base layer and a body ink layer printed on the base layer. The film layer m includes a first surface im and a second surface 1113 opposite to the first surface 1111. The first surface (1) is a base layer surface, and the second surface 1113 is a decorative ink layer surface. The base layer may be made of a plastic material, and the plastic material may be selected from the first surface 1111 t jry IV of the poly 111. An antenna bonding region is formed on the first surface, and the shape of the wire bonding region 1112 is opposite to the shape of the antenna 113. Consistent. The μ antenna 113 is a conductive metal layer which is vacuum-plated on the second surface 1113 of the film layer m. The material of the antenna bonding region = line 113 can be <&&<tTt" μ is a metal material such as copper or silver. The base layer is a plastic layer formed by injection molding, and the end portion is attached with a circular hole 1151 near the end of 200935864. The diameter of the circular hole 1151 is equivalent to the diameter of the conductive terminal 132 on the circuit board 131 built in the body 13. The base layer 115 is bonded to the second surface 1113 of the film layer lu and the antenna 113 by injection molding, and the opening of the circular hole 1151 is aligned with the area of the antenna 113 after the base layer 115 is combined with the antenna 113. The plastic material forming the base layer 115 may be selected from the group consisting of polyethylene, polyamine, polycarbonate, acrylonitrile-styrene-butanyl dimer, polymethyl methacrylate, poly(p-butylene phthalate) Any of various plastics such as esters. After the housing 11 is disposed on the body 13, the conductive terminal 132 passes through the circular hole 1151 of the base layer 115, so that the end of the conductive terminal 132 contacts or approaches (eg, less than 0.5 mm) the antenna ι13, that is, The function of transmitting and receiving electrical signals of the electronic device 10 can be preferably implemented. It can be understood that a V-pillar can be disposed on the antenna 113 of the casing n of the present invention. When the casing 11 is mounted on the body, the conductive post contacts the conductive terminal 132 of the circuit board 131 or the end of the conductive terminal 132. The part is very close (for example, less than 〇5mm). It can better realize the function of transmitting and receiving electric signals of the electronic device. * The manufacturing method of the casing 11 of the present invention firstly vacuum-coats the second surface 1113 of the film layer 111 to form a conductive metal layer in the vacuum coating chamber to form an antenna 113. The film layer formed with the antenna 113 is placed in an injection mold, and a base layer 115 is injection-molded on the second surface HU of the film layer 1U, so that the base layer 115 and the film layer are combined into a body. That is, the housing U having the antenna cassette 3 built therein is obtained. It can be understood that in order to strengthen the bonding force of the base layer 115 and the film layer ill and the antenna 113, an adhesive layer can be adhered to the second surface 1113 and the antenna 113 of the thin layer 11]L before the injection molding of the base layer 115. The base layer 115 is injection molded. θ It can be understood that the housing n of the present invention can also be a cover of an electronic device, and the antenna 113 is formed in a cover of the electronic device. The antenna 113 of the present electronic device 10 is formed in the casing U by vacuum coating, and the manufacturing method is simple, and the prepared antenna ΐ3 has a simple structure, and can achieve the effects of lightness, thinness and small volume, thereby making the electronic device of the invention The structure of 10 is simplified and the cost of production can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the three-dimensional assembly of an electronic device according to a preferred embodiment of the present invention. Figure 2 is a perspective exploded view of an electronic device in accordance with a preferred embodiment of the present invention. Fig. 3 is a schematic view showing another perspective view of the cover body according to a preferred embodiment of the present invention. [Description of main components] Electronic device 10 Cover 11 Body 13 Base layer 115 Round hole 1151 Film layer 111 Antenna 113 First surface 1111 Circuit board 131 Conductive terminal 132 Second surface 1113 Antenna junction area 1112 11