201201655 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置殼體及其製作方法，尤其涉及 一種具有三維天線之電子裝置殼體及其製作方法。 【先前技術】 [0002] 隨著通訊、藍牙等技術之發展，實現該等應用之電子裝 置具有愈來愈多之功能，然該等電子裝置之體積向著輕 、薄之方向發展，故，如何簡化該等電子裝置中内置元 ^ 件之結構、減小該等内置元件之體積對於簡化整個電子201201655 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device housing and a method of fabricating the same, and more particularly to an electronic device housing having a three-dimensional antenna and a method of fabricating the same. [Prior Art] [0002] With the development of technologies such as communication and Bluetooth, electronic devices that implement such applications have more and more functions, and the volume of such electronic devices is moving toward a light and thin direction. Simplify the structure of built-in components in these electronic devices, reduce the size of these built-in components, and simplify the entire electronics
II 裝置之結構及降低該電子裝置之體積具有非常重要之作 用。天線作為電子裝置中一收發訊號之重要元件，其結 構之簡化及體積之減小對於簡化整個電子裝置之結構及 降低該電子裝置之體積具有關鍵之作用。 [0003] 習知電子裝置之天線採用絲網印刷之方法於電子裝置之 殼體上形成天線，然，上述方法僅限於殼體上印刷制得 二維天線，無法製作成三維天線。 〇 【發明内容】 [0004] 有鑒於此，有必要提供一種與三維天線一體成型之電子 裝置殼體。 [0005] 另，還有必要提供一種上述電子裝置殼體之製作方法。 [0006] —種電子裝置殼體，其包括一第一本體、一第二本體及 一三維天線輻射體，該三維天線輻射體包括一印刷層及 一電鍍層，該印刷層形成於該第一本體上，該電鍍層覆 蓋於該印刷層上，該第二本體形成於該第一本體上並覆 099120762 表單編號A0101 第3頁/共14頁 0992036640-0 201201655 蓋該三維天線輻射體，且該三維天線輻射體包括至少一 部分地露出於所述第一本體及第二本體外部之端子。 [0007] 一種電子裝置殼體之製作方法，其包括如下步驟： [0008] 提供一第一成型模具及一第二成型模具，該第一成型模 具具有一第一型腔，該第二成型模具具有一第二型腔； [0009] 向所述第一型腔中注塑熱塑性材料形成該電子裝置殼體 之第一本體； [0010] 向該第一本體上移印一可被電鍍材料以形成一印刷層； [0011] 對該形成有印刷層之第一本體進行電鍍，該印刷層上形 成一電鍍層並與該電鍍層形成一三維天線輻射體； [0012] 向所述第二型腔中注塑熱塑性材料以形成該電子裝置殼 體之第二本體，該第二本體與該第一本體相結合並將該 三維天線輻射體部分地覆蓋。 [0013] 本發明較佳實施方式之電子裝置殼體之製作方法將三維 天線輻射體藉由兩次注塑成型而形成於電子裝置之殼體 中，該電子裝置殼體可將三維天線輻射體進行保護，防 止三維天線輻射體被劃傷或損壞，保證電子裝置之通訊 性能。另，該三維天線輻射體藉由移印及電鍍技術形成 於電子裝置殼體内，故無須考慮殼體與三維天線輻射體 之間存在間隙之問題，可減小電子裝置之體積。 【實施方式】 [0014] 請參閱圖1及圖2，本發明較佳實施方式之電子裝置殼體 10包括一第一本體11、第二本體13及一形成於第一本體 099120762 表單編號A0101 第4頁/共14頁 0992036640-0 201201655 11及第二本體13之間之三維天線輻射體15，該三維天線 輻射體15至少一端延伸至第一本體11及第二本體13之外 部。 [0015] 該第一本體11以注塑成型之方式製成，以作為該三維天 線輻射體15之載體。該第一本體11之材質可為熱塑性絕 緣塑膠，該熱塑性絕緣塑膠可選自聚丙烯（PP)、聚醯 胺（PA)、聚碳酸酯（PC)、聚對苯二甲酸乙二酯（PET )及聚甲基丙烯酸甲酯（PMMA)中之任一種。 Ο [0016] 所述三維天線輻射體15為一不經過破壞無法展開於同一 平面上之天線。該三維天線輻射體15包括一印刷層150及 一覆蓋於該印刷層150上之電鍍層152。該印刷層150由 可被電鍍之材料製成，如銅漿，其以移印之方式形成於 該第一本體11上。該印刷層150之厚度以2 為最佳。該 印刷層150可依所需天線圖樣而形成於該第一本體11上， 以使絕緣之第一本體11可以於電鍍層152上進行電鍍。為 使該印刷層150能夠牢固地附著於該第一本體11上，可於 〇 注塑成型時，於該第一本體11對應該印刷層150之位置形 成有增加附著力之結構，如形成凹凸不平之粗糙面等。 該電鍍層152包括依次形成於該印刷層150表面之電鍵銅 層、電鍍鎳層及電鍍金層。所述電鍍銅層主要起天線之 作用；所述電鍍鎳層為中間過渡層，其可增強電鍍金層 與電鍍銅層之結合力；所述電鍍金層之抗氧化能力較強 ，其可防止所述三維天線輻射體15被氧化，且該電鍍金 層之導電能力較強，其可保證所述三維天線輻射體15與 電子裝置之控制系統之電性連接之穩定性。該電鍍層152 099120762 表單編號A0101 第5頁/共14頁 0992036640-0 201201655 之厚度以l〇ym-12/zm為最佳。 [0017] 該第二本體13以注塑成型之方式形成於該第一本體11上 並將三維天線輻射體15遮蓋。注塑成型第二本體13之材 料選自為聚丙烯、聚醯胺、聚碳酸酯、聚對苯二甲酸乙 二酯及聚甲基丙烯酸甲酯中之任一種。 [0018] 請一併參閱圖3及圖4，本發明較佳實施方式之製作所述 電子裝置殼體10之方法包括如下步驟： [0019] 提供一第一成型模具及一第二成型模具，該第一成型模 具包括一第一型腔，該第二成型模具包括一第二型腔。 [0020] 向所述第一型腔中注塑熱塑性絕緣塑膠以形成電子裝置 殼體之第一本體11，並於一預選區域上成形有粗糙面。 該粗糙面可為於注塑成型時直接形成，亦可為將成型後 之第一本體11經過粗糙化處理而形成。該預選區域與三 維天線輻射體15之形狀一致。 [0021] 製作一銅凹版或鋼凹版，該銅凹版或鋼凹版之一表面上 形成有與該三維天線輻射體15之形狀相對應之凹槽，該 凹槽中裝有可被電鍍之材料，如銅漿。移印時，使移印 機之矽膠頭先壓向所述銅凹版或鋼凹版，使所述矽膠頭 吸取凹槽中之可被電鍍之材料，然後再使該矽膠頭壓向 該第一本體11之預選區域，將所述可被電鍍之材料轉印 至該第一本體11上以形成該印刷層150。該第一本體11上 形成有粗糙面，故，印刷層150可牢固地附著於該第一本 體11上。 [0022] 對形成有印刷層150之第一本體11進行電鍍處理，以於該 099120762 表單編號A0101 第6頁/共14頁 0992036640-0 201201655 印刷層150上形成電鑛層152。該電鍍過程為：將形成有 印刷層15〇之第-本體U與-陰極連接，然後放入具有銅 離子之電鍍溶液中，再將一銅棒與—陽極連接並放入該 電鍍溶液中。於通電之情況下，帶正電之銅離子於印刷 層1 50處得到電子而形成銅分子而附著於該印刷層15〇之 表面。然後再應用類似之方法電鍵—錄層，最後電鑛一 金層以形成該電鍍層152。 [0023] 再將第一本體11及形成於第一本體u之三維天線輻射體 Ο 15放置於該第二型腔中，並向所述第二型腔中注塑熱塑 性塑膠形成該第二本體1 3 ’該第二^體】3結合於第一本 體11之一側並將三維天線輻射體15部分覆蓋，使得三維 天線轄射趙15之至少一端子151由第一本髅11及第二本體 13之間延伸而形成一端子以連接其他電子元件。 [0024] 本發明所述之電子裝置殼體10可應用於無線通訊產品如 筆記本電腦、手機等產品中。 [0025] ❹ 本發明較佳實施方或之電子裝置殼體1〇之製作方法將三 維天線輻射體15籍由兩次注塑成型而形成於電子裝置之 殼體中，該電子裝置殼體10可將三維天線輻射體15進行 保護，防止三維天線輻射體15被劃傷或損壞，保證電子 裝置之通訊性能。另，該三維天線輻射體15藉由移印及 電鍍技術形成於電子裝置殼體10内，故無須考慮殼體與 二維天線輻射體1 5之間存在間隙之問題，可減小電子裝 置之體積。 [0026] 綜上所述，本發明符合發明專利要件，爰依法提出專利 099120762 表單編號Α0ΗΠ 第7頁/共14頁 0992036640-0 201201655 申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟悉本案技藝之 人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 [0027] 圖1為本發明較佳實施方式電子裝置殼體之立體示意圖。 [0028] 圖2為圖1中電子裝置殼體之局部分解示意圖。 [0029] 圖3為圖1中電子裝置殼體之天線輻射體形成於第一本體 上之立體示意圖。 [0030] 圖4為沿圖1中IV- IV方向之局部剖視圖。 【主要元件符號說明】 [0031] 電子裝置殼體：10 [0032] 第一本體：11 [0033] 第二本體：13 [0034] 三維天線輻射體：15 [0035] 印刷層：150 [0036] 端子：151 [0037] 電鍍層：152 099120762 表單編號A0101 第8頁/共14頁 0992036640-0The structure of the II device and the reduction of the volume of the electronic device play a very important role. As an important component of an electronic signal in an electronic device, the simplification and volume reduction of the antenna plays a key role in simplifying the structure of the entire electronic device and reducing the volume of the electronic device. [0003] The antenna of the conventional electronic device uses a screen printing method to form an antenna on the casing of the electronic device. However, the above method is limited to printing a two-dimensional antenna on the casing, and cannot be fabricated into a three-dimensional antenna. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide an electronic device housing integrally formed with a three-dimensional antenna. [0005] In addition, it is also necessary to provide a method of fabricating the above-described electronic device housing. [0006] An electronic device housing includes a first body, a second body, and a three-dimensional antenna radiator. The three-dimensional antenna radiator includes a printed layer and a plating layer, and the printed layer is formed on the first On the body, the plating layer covers the printed layer, and the second body is formed on the first body and covers the three-dimensional antenna radiator with the 099120762 form number A0101 page 3/14 pages 0992036640-0 201201655 The three-dimensional antenna radiator includes terminals that are at least partially exposed outside the first body and the second body. [0007] A method of manufacturing an electronic device housing includes the following steps: [0008] providing a first molding die and a second molding die, the first molding die having a first cavity, the second molding die Having a second cavity; [0009] molding a thermoplastic material into the first cavity to form a first body of the electronic device housing; [0010] printing a platable material onto the first body to form a printed layer; [0011] electroplating the first body on which the printed layer is formed, forming a plating layer on the printed layer and forming a three-dimensional antenna radiator with the plating layer; [0012] toward the second cavity The thermoplastic material is injection molded to form a second body of the electronic device housing, the second body is coupled to the first body and partially covers the three-dimensional antenna radiator. [0013] The manufacturing method of the electronic device casing of the preferred embodiment of the present invention forms a three-dimensional antenna radiator in a casing of an electronic device by two injection molding, and the electronic device casing can perform the three-dimensional antenna radiator Protection to prevent the three-dimensional antenna radiator from being scratched or damaged, and to ensure the communication performance of the electronic device. In addition, the three-dimensional antenna radiator is formed in the housing of the electronic device by pad printing and electroplating technology, so that there is no need to consider the problem of the gap between the housing and the three-dimensional antenna radiator, and the volume of the electronic device can be reduced. [0014] Referring to FIG. 1 and FIG. 2, an electronic device housing 10 according to a preferred embodiment of the present invention includes a first body 11, a second body 13, and a first body 099120762. Form No. A0101 The three-dimensional antenna radiator 15 between the fourth body 13 and the second body 13 extends at least one end of the three-dimensional antenna radiator 15 to the outside of the first body 11 and the second body 13. [0015] The first body 11 is formed by injection molding as a carrier of the three-dimensional antenna radiator 15. The material of the first body 11 may be a thermoplastic insulating plastic, and the thermoplastic insulating plastic may be selected from the group consisting of polypropylene (PP), polyamine (PA), polycarbonate (PC), and polyethylene terephthalate (PET). And any of polymethyl methacrylate (PMMA). [0016] The three-dimensional antenna radiator 15 is an antenna that cannot be unfolded on the same plane without being broken. The three-dimensional antenna radiator 15 includes a printed layer 150 and a plating layer 152 overlying the printed layer 150. The printed layer 150 is made of a material that can be plated, such as a copper paste, which is formed on the first body 11 by pad printing. The thickness of the printed layer 150 is preferably 2. The printed layer 150 can be formed on the first body 11 according to the desired antenna pattern, so that the insulated first body 11 can be plated on the plating layer 152. In order to enable the printed layer 150 to be firmly adhered to the first body 11, a structure for increasing adhesion, such as unevenness, may be formed at a position corresponding to the printed layer 150 of the first body 11 during injection molding. Rough surface, etc. The plating layer 152 includes a key copper layer, an electroplated nickel layer, and an electroplated gold layer which are sequentially formed on the surface of the printing layer 150. The electroplated copper layer mainly functions as an antenna; the electroplated nickel layer is an intermediate transition layer, which can enhance the bonding force between the electroplated gold layer and the electroplated copper layer; the electroplated gold layer has strong anti-oxidation ability, which can prevent The three-dimensional antenna radiator 15 is oxidized, and the electroplating gold layer has a strong electrical conductivity, which can ensure the stability of the electrical connection between the three-dimensional antenna radiator 15 and the control system of the electronic device. The plating layer 152 099120762 Form No. A0101 Page 5 of 14 0992036640-0 201201655 The thickness is preferably l〇ym-12/zm. [0017] The second body 13 is formed on the first body 11 by injection molding and covers the three-dimensional antenna radiator 15 . The material of the injection molded second body 13 is selected from any of polypropylene, polyamide, polycarbonate, polyethylene terephthalate, and polymethyl methacrylate. [0018] Referring to FIG. 3 and FIG. 4, a method for fabricating the electronic device housing 10 according to a preferred embodiment of the present invention includes the following steps: [0019] providing a first molding die and a second molding die, The first molding die includes a first cavity, and the second molding die includes a second cavity. [0020] The thermoplastic insulating plastic is injection molded into the first cavity to form the first body 11 of the electronic device housing, and a rough surface is formed on a preselected area. The rough surface may be formed directly at the time of injection molding, or may be formed by subjecting the formed first body 11 to a roughening treatment. The preselected area coincides with the shape of the three-dimensional antenna radiator 15. [0021] fabricating a copper intaglio or steel intaglio having a groove corresponding to the shape of the three-dimensional antenna radiator 15 formed on one surface of the copper intaglio or steel intaglio, the groove being provided with a material that can be plated, Such as copper paste. When printing, the glue head of the pad printing machine is first pressed against the copper intaglio or steel gravure, so that the silicone head absorbs the material that can be plated in the groove, and then presses the silicone head toward the first body. A preselected area of 11 is used to transfer the material that can be plated onto the first body 11 to form the printed layer 150. The first body 11 is formed with a rough surface, so that the printed layer 150 can be firmly attached to the first body 11. [0022] The first body 11 on which the printed layer 150 is formed is subjected to a plating process to form an electric ore layer 152 on the printed layer 150 on the 099120762 Form No. A0101, page 6 / page 14 0992036640-0 201201655. The electroplating process is: connecting the first body U having the printed layer 15 to the cathode, then placing it in a plating solution having copper ions, and then connecting a copper rod to the anode and placing it in the plating solution. In the case of energization, the positively charged copper ions acquire electrons at the printed layer 150 to form copper molecules and adhere to the surface of the printed layer 15 . A similar method of applying a key-recording layer is then applied, and finally a layer of gold is electroplated to form the plating layer 152. [0023] The first body 11 and the three-dimensional antenna radiator 15 formed on the first body u are placed in the second cavity, and the thermoplastic is molded into the second cavity to form the second body 1. 3 'the second body 3' is coupled to one side of the first body 11 and partially covers the three-dimensional antenna radiator 15 such that at least one terminal 151 of the three-dimensional antenna illuminating camera 15 is composed of the first body 11 and the second body The 13 extends to form a terminal to connect other electronic components. [0024] The electronic device housing 10 of the present invention can be applied to wireless communication products such as notebook computers, mobile phones, and the like. [0025] The preferred embodiment of the present invention or the electronic device housing 1 〇 manufacturing method of the three-dimensional antenna radiator 15 is formed by two injection molding in the housing of the electronic device, the electronic device housing 10 The three-dimensional antenna radiator 15 is protected to prevent the three-dimensional antenna radiator 15 from being scratched or damaged, and the communication performance of the electronic device is ensured. In addition, the three-dimensional antenna radiator 15 is formed in the electronic device casing 10 by pad printing and electroplating technology, so that there is no need to consider the problem of the gap between the casing and the two-dimensional antenna radiator 15 , and the electronic device can be reduced. volume. In summary, the present invention complies with the invention patent requirements, and patents are filed according to law. 099120762 Form No. ΗΠ0ΗΠ Page 7/14 pages 0992036640-0 201201655 Application. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0027] FIG. 1 is a perspective view of a housing of an electronic device according to a preferred embodiment of the present invention. 2 is a partial exploded view of the electronic device housing of FIG. 1. 3 is a perspective view showing the antenna radiator of the electronic device housing of FIG. 1 formed on the first body. 4 is a partial cross-sectional view taken along line IV-IV of FIG. 1. [Main component symbol description] [0031] Electronic device housing: 10 [0032] First body: 11 [0033] Second body: 13 [0034] Three-dimensional antenna radiator: 15 [0035] Printing layer: 150 [0036] Terminal: 151 [0037] Plating: 152 099120762 Form No. A0101 Page 8 of 14 0992036640-0