200936031 f 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種遮罩結構’更詳而言之，係有關 於一種用於軟性印刷電路板之遮罩結構。 【先前技術】 由於電子產品朝向輕薄短小型、高功能化以及高速度 化發展，因此，其配線材料大多採用設計自由度高、彎曲 性良好的軟性印刷電路板（Flexible printed Circuit， O' c)」@ $同的電子產品將產生不同之電磁波，易造 成電磁干擾(ΕΜΙ)而導致電子產品損壞，甚至危害人體健 康之虞慮在這種情況下，將具有遮罩膜薄膜型軟性印刷 電路板的應用於手機、數位照相機、數位攝影機等電子產 品已為廣泛採用。 W技術係採用塑膠材料作為電磁干擾之遮罩 =其製造方法可為於塑膠材料中摻雜導電性之纖維或顆 以形成導電型塑膠材料，或藉由荡片黏貼法、離子束 ^、真玄4鑛法、電鍍法等於塑膠材料表面鍍上導電金 ，藉由導電金屬對電磁波之遮罩效率以降低電磁干擾、。 導雷用於塑膠材料中加入導電金屬、或於其表面鍍上 =金屬㈣成電子產品之遮罩層，其具有加卫簡單、重 =2等等，然而，由於塑膠材料及導電金屬之膨腸 佳、導==溫度(Tg)等特性不同，易造成結合性不 導電性降低、柔軟性不佳等問題。 因此，如何提出-種可克服先前技術之種種缺失之遮 110658 5 200936031 罩材料，實已成爲目前亟待克服之難題。 【發明内容】 鑑於上述習知技術之種種缺點’本發明之主要目 於提供一種具有高柔軟性且可撓性佳之遮罩結構。 本發明之再一目的在於提供一種具有高柔軟性且可 撓性佳之遮罩結構的軟性印刷電路板。 為達上述及其他目的，本發明揭露一種遮罩結構，包 括金屬層及形成於該金屬層上之聚醯亞胺層，且該金屬層 ©t厚度係介於1至20微米，該聚醯亞胺層之厚度係介於 1至15微米。該遮罩結構具有優異的柔軟性與撓性佳， 特別適合用於翻蓋、滑蓋手機等電子產品中。 本發明亦揭示一種具有該遮罩結構之軟性印刷電路 板，包括軟性印刷電路板以及設置於該軟性印刷電路板之 遮罩結構，其中，該遮罩結構包括金屬層及聚醯亞胺層， 且該金屬層之厚度係介於i至20微米，該聚醯亞胺層之 厚度係介於1至15微米。 【實施方式】 以下係藉由特定的具體實例說明本發明之實施方式。 第1圖係說明本發明遮罩結構之具體實例。該遮罩結 構110包括金屬層112及形成於該金屬層上之聚醯亞胺層 114。於該具體實例中係使用鋼作為金屬層，該銅金屬的 實例包括電解銅、壓延銅等。本發明之遮罩結構中，該金 屬層之厚度通常係介於1至20微米之範圍，較佳係介於 1至6微米之範圍；該聚醯亞胺層之厚度通常係介於j至 6 110658 200936031 15微米，較佳係介於3至1Q微米之範圍。 該遮罩結構11 〇可以利用塗布法形成。例如，以鋼绪 為基材’將聚醢胺酸（p 1 oyami c acid )塗布於該銅箔上， 經烘箱乾燥以及亞酿胺化（Imidization)，以形成單面 無膠的雙層覆銅箔膜。 第2圖係說明本發明具有遮罩結構之軟性印刷電路 板的具體實例，包括軟性印刷電路板2〇〇 ;以及設置於該 軟性印刷電路板之遮罩結構21〇。該遮罩結構21〇包括金 ©屬層212及聚酿亞胺層214,係透過導電膠220設置於該 軟性印刷電路板。通常，該遮罩結構中的金屬層之厚度係 介於1至20微米之範圍，較佳係介於丨至6微米之範圍； 該聚醯亞胺層之厚度通常係介於丨至15微米，較佳係介 於3至1〇微米之範圍。200936031 f IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a mask structure. More specifically, it relates to a mask structure for a flexible printed circuit board. [Prior Art] Since electronic products are becoming light, short, small, high-functional, and high-speed, most of the wiring materials are flexible printed circuits (O' c) with high design freedom and good flexibility. @@ The same electronic products will produce different electromagnetic waves, which may cause electromagnetic interference (ΕΜΙ), which may cause damage to electronic products and even harm to human health. In this case, there will be a film film type flexible printed circuit board. It has been widely used in electronic products such as mobile phones, digital cameras, and digital cameras. W technology uses plastic materials as a mask for electromagnetic interference = it can be made by doping conductive fibers or particles into plastic materials to form conductive plastic materials, or by smear bonding method, ion beam ^, true The Xuan 4 ore method and electroplating method are equivalent to the plating of conductive gold on the surface of the plastic material, and the electromagnetic shielding effect of the conductive metal on the electromagnetic wave is reduced. The lightning guide is used for adding a conductive metal to a plastic material, or plating a surface of the metal (4) into an electronic product, which has a simple decoration, a weight of 2, etc., however, due to the swelling of the plastic material and the conductive metal. Different characteristics such as intestinal gland, conduction == temperature (Tg), etc., are liable to cause problems such as reduced non-conductivity of bonding, poor flexibility, and the like. Therefore, how to propose a cover material that overcomes the various shortcomings of the prior art has become a difficult problem to be overcome. SUMMARY OF THE INVENTION In view of the above disadvantages of the prior art, the main object of the present invention is to provide a mask structure having high flexibility and flexibility. Still another object of the present invention is to provide a flexible printed circuit board having a high flexibility and a flexible mask structure. To achieve the above and other objects, the present invention discloses a mask structure including a metal layer and a polyimide layer formed on the metal layer, and the metal layer has a thickness of 1 to 20 μm. The thickness of the imine layer is between 1 and 15 microns. The mask structure has excellent flexibility and flexibility, and is particularly suitable for use in electronic products such as flip-tops and slider phones. The invention also discloses a flexible printed circuit board having the mask structure, comprising a flexible printed circuit board and a mask structure disposed on the flexible printed circuit board, wherein the mask structure comprises a metal layer and a polyimide layer. And the thickness of the metal layer is between i and 20 microns, and the thickness of the polyimide layer is between 1 and 15 microns. [Embodiment] Hereinafter, embodiments of the present invention will be described by way of specific examples. Fig. 1 is a view showing a specific example of the mask structure of the present invention. The mask structure 110 includes a metal layer 112 and a polyimide layer 114 formed on the metal layer. In this specific example, steel is used as the metal layer, and examples of the copper metal include electrolytic copper, rolled copper, and the like. In the mask structure of the present invention, the thickness of the metal layer is usually in the range of 1 to 20 μm, preferably in the range of 1 to 6 μm; the thickness of the polyimide layer is usually between j and 6 110658 200936031 15 microns, preferably in the range of 3 to 1 Q microns. The mask structure 11 can be formed by a coating method. For example, a coating of polyacrylic acid (p 1 oyami c acid) on the copper foil, drying in an oven, and Imidization to form a double-sided coating with no surface and no glue Copper foil film. Fig. 2 is a view showing a specific example of a flexible printed circuit board having a mask structure of the present invention, comprising a flexible printed circuit board 2; and a mask structure 21 provided on the flexible printed circuit board. The mask structure 21 includes a gold-based layer 212 and a polyimide layer 214 which are disposed on the flexible printed circuit board through the conductive paste 220. Typically, the thickness of the metal layer in the mask structure is in the range of 1 to 20 microns, preferably in the range of 丨 to 6 microns; the thickness of the polyimide layer is typically between 丨 and 15 microns. Preferably, it is in the range of 3 to 1 micron.
Sl&m. 實施例及比較例中所用之載板詳述如下： 使用塗布法將聚亞醯胺前驅體（Precurs〇r) —聚醯胺 馱（PAA)、或聚亞醯胺塗料（p〇lyimide 均勻塗布 於銅箔上以形成半成品遮罩結構層。將該半成品遮罩結構 層置入密閉式氮氣焕箱，氮氣供箱之氧含量需控制在低於 最佳地，係可保持在〇 2%以下或是更低，而其加 …溫度為5(TC〜35D度（。〇、焕烤時間為15 接著，騎脫水錢及環化（ImidizatlQn)、或可直刀接鐘乾 無以製作成雙層覆銅箱膜。藉由上述製程以完成不同厚度 II0658 7 200936031 之覆銅箔膜，俾藉異方向性導 完成線路部佈局的軟性 …（F)直接使用於已 且有逨罩钍馗> 包路板上，以形成不同厚度且 二構之載板’其結〜所示。 材料作為遮罩結構層，並藉由異方向性導電 膠膜黏置於印刷電路板上。Sl&m. The carrier plates used in the examples and comparative examples are detailed as follows: Polyimide precursor (Precurs〇r) - polyamidoxime (PAA), or polyamidamine coating (p) using a coating method 〇lyimide is evenly coated on the copper foil to form a semi-finished mask structure layer. The semi-finished mask structure layer is placed in a closed nitrogen gas box, and the oxygen content of the nitrogen supply tank is controlled to be lower than optimal, and the system can be kept at 〇 2% or less, and the temperature is 5 (TC ~ 35D degrees (. 〇, rejuvenation time is 15 then, riding dehydration money and cyclization (ImidizatlQn), or can be straight knife to dry no To make a double-layer copper clad film. Through the above process to complete the copper foil film with different thickness II0658 7 200936031, the softness of the layout of the line is completed by the directional guide... (F) It is used directly. Cover 钍馗 > On the road board, to form a carrier plate of different thickness and two structures. The material is used as a mask structure layer and is adhered to the printed circuit board by an isotropic conductive film. .
分別將上述所製成不同厚度之電路板樣品裁取成合 適大小之測試樣片，進行柔軟性、滑台測試與彎折測試， 並於滑台測試與彎折測試後計算阻值變化率。藉由反應 力柔軟性測試儀測試樣片之柔軟性（g f ),其測試條件為電 歷為AC220V、測量範圍為410克、可讀性為〇 〇〇1克以 及測試R角2· 35毫米（mm);藉由滑台測試儀測試樣片以 8 110658 200936031 計算其阻值變化率，其測試條件為電壓為AC220V、間距 3. Omm、R角處1 · 5mm以及速度=400 (轉速）rpm ;藉由彎 折實驗機測試樣片以計算其阻值變化率，其測試條件為電 壓為AC220V、彎曲角度為0至160度、彎曲速度為4〇次 /分以及彎曲R角：1.5毫米（半徑），其結果如表2所示。 表2The samples of the different thicknesses of the circuit boards prepared above were cut into suitable test pieces for softness, sliding table test and bending test, and the resistance change rate was calculated after the sliding table test and the bending test. The softness (gf) of the test piece was tested by a reactivity softness tester under the conditions of an electrical history of AC 220 V, a measurement range of 410 g, a readability of 〇〇〇1 g, and a test R angle of 2.35 mm ( Mm); the resistance change rate is calculated by the slide tester test sample by 8 110658 200936031, and the test condition is voltage 220V, pitch 3. Omm, R angle 1 · 5mm and speed = 400 (speed) rpm; The sample was tested by a bending test machine to calculate the rate of change of resistance. The test conditions were a voltage of AC220V, a bending angle of 0 to 160 degrees, a bending speed of 4 times/min, and a bending R angle of 1.5 mm (radius). The results are shown in Table 2. Table 2
由表2之測試結果可知，本發明具遮罩結構之軟性印 刷電路板具有高柔軟性與撓曲性，其台測試之阻值變化 率低於3. 1 %之標準以下，經十六萬次之彎折測試，其彎 折測試之阻值變料可低於2.9%以下，亦即其彎折測試 之阻值變化率可低於標準值15%以下。 上述實施例僅例示性說明本發明之原理及其功效，而 非用於限制本發明。任何熟f此項技藝之人士均可在不違 110658 9 200936031 ，對上述實施例進行修飾與改 產範圍，應如後述之申請專利 背本發明之精神及範a壽下 變。因此，本發明之權利保 範圍所列。 【圖式簡單說明】 第1圖係本發明遮罩結構之示意圖；以及 一第2圖係本發明具有遮罩結構之軟性印刷電路板之 示意圖。 【主要元件符號說明】 _11〇、210遮罩結構 112、212 金屬層 114、214聚醯亞胺層 200 軟性印刷電路板 22〇 導電膠 10 110658It can be seen from the test results of Table 2 that the flexible printed circuit board with the mask structure of the present invention has high flexibility and flexibility, and the resistance change rate of the test in the table is less than 3.1%, and is 160,000. In the second bending test, the resistance value of the bending test may be less than 2.9%, that is, the resistance change rate of the bending test may be less than 15% of the standard value. The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Anyone who is familiar with this skill can modify and modify the above-mentioned embodiments without departing from 110658 9 200936031, and should apply for patents as described later. Therefore, the scope of the invention is set forth in the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a mask structure of the present invention; and Fig. 2 is a schematic view showing a flexible printed circuit board having a mask structure of the present invention. [Main component symbol description] _11〇, 210 mask structure 112, 212 metal layer 114, 214 polyimine layer 200 flexible printed circuit board 22〇 conductive adhesive 10 110658