200933825 • 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種整流晶片端子構造，尤指一種應用於功率整流器的 整流晶片端子構造。 【先前技術】 一般所指之整流端子，係專門配置於汽車發電機之電極上，可將交流 電轉為直流電，此種端子係設有一平台，於該平台上置有一錫片，再將一 晶片置於該錫片上’待錫片受熱溶固後’該晶片即能被鲜固於平台上，最 後再以塑膠或樹脂順著端子的圓周加以封裝。 ^ 傳統整流端子如US6060776的「Rectifier diode」’其主要具備一基座， 該基座具有一平台，該平台固設一半導體晶片以支撐裝設一引線，且該基 座設有一護套，並灌注一封裝材料而將該平台、該半導體晶片等穩固於該 護套内之空間，當該整流二極管壓入到整流板中時，該基座與該護套相接 處易受力而變形’因此降低整流二極管的使用壽命；為改善上述缺失，另 如US20070105454的「diode」’係於基座與護套間設置一區段，使二極管 壓入整流板時，得具有一緩衝空間而避免該基座變形。 另外，又如 US6667545 的「Rectifier diode with improved means for tension relief of the connected headwire」，主要包含一基座，該基座延伸設有 ❹-平台以支撐裝設-半導體晶片，辭導體晶片上設置_引線，且該平台 具有-周緣部並延設-環部’其巾’該環部及該周緣部分難引線的中心 軸形成-夹角《、《，，夾角α係大於夾角α，，使該半導體晶片周圍形成一絕 然，上述各習知技術雖都達到整流之效，但實質上仍存在一些缺 ^述各習知，術的護套其内㈣垂直於該基座的平面，當封裝㈣注入時 谷易產生胁的絲’且裝設紐二極義平自其麟料呈環狀連 續性配置’故使㈣該基座料相對該封裝材料旋轉。 【發明内容】 〃本發明的主要目的’在於解虹述缺失，本發明不但便於組裝製造， 可㈣生產擁所需之時間，更可防止注人的封裝材料產生脫落，且避免 5 200933825 基座相對封襞材料旋轉。 為=上述目的，本發明提出一種整流晶片端子構造，其主要包含 兩端緣之面積係與其内緣任一載面之面積不同。 °〆套衣 ❹ ❹ ^發^的另—目的’在於強傾導電树的抗振能力 段，藉以防止料力施加於該導電元件時而造 【實施方式】 有關本發明之詳細綱及技術魄，兹配合圖式說明如下. 圖1、圖Μ、圖2·2及圖〜所示，係為本發明的立體外觀 :構刀解及不賴；域所示，本個所提出的麵晶片端子構造 、主要包含有-底座1G、-整流晶片2G、—導電元件％及—套環4〇 . ^套環40錄麟絲座1G之職册其邮_—封裝· q如環 氧樹脂）’且該套環4G兩端緣之面_熟内雜—截蚊面積不 該封裝材料42凝固後不致脫離該套環4G，在本發_圖式實施例中，該 環40兩端緣之面義小於其内緣任—截面之面積（如圖^所示》該= 4成〇兩端緣之面積更可大於其内緣任—截面之面積（如圖3_2所示），^該套 壤40内緣係錄面結構，更包含—麟錢計（圖_未示）；該底座 部係具有-組裝平台n，該組裝平台u於中心位置凸設—第—凸點 12以裝設該整流晶片2〇，該整流晶片2〇周緣設有一絕緣部21，在本實施 例中’該絕緣部21可為—厚度略大於該整流晶片2〇之封裝玻璃，用以形 成絕緣而避免該整流晶# 2〇產生祕，另，驗裝平台n與該底座⑴内 緣區分出一間隔區段14，用以防止水氣沿著内壁滲入，亦可防止該封裝材 料42應力造成該整流晶片2〇破裂，且該組裝平台n與該間隔區段丨/底 部之間設有至少-卡勾部13，本發明圖式中，該卡勾部13可為複數分離配 6 200933825 置於5亥組裝平台11與该間隔區段14底部之間，藉以卡· 該封裝材料42不致脫離，且使該底座10不致相對該D該封裝材料42使 ，該導電元件30係具有一基部31，且該基部31之二側轨材料42產生旋轉 構32以連接該整流晶片20，如是構成本發明整流晶片端有第一凸點架 組裝時，係將該整流晶片20及該導電元件邛:第二^構造。。 銲錫而叠設於該組裝平台11的該第—凸點架構12，再架構32依序 座10以對應螺、紋或黏合之方式相結合，復以該封裳材料^套環40與該底 部’待該封裝材料42固化後即形成該整流晶片端子構 ^口入套環4〇内 ❹ 〇 環40與該座體10採分離設計，令本發明於鲜錫過程中%’利用該套 空間，並且節省製程時間；透過該第一、二凸點架構12、大的操作 晶片20之二侧而區隔出對應之空fa1 ’用以避免當封裝材料幻目接於該整流 使該絕緣部21破裂或受擠屢而損壞之情事，而㈣ 因熱膨服而 衝區段33，當外力介入時可提供-緩衝抗振之效果，避免該緩 ^卜力過大而破裂，而藉由該套環4G兩端緣之面積係小於細緣 面積’又，該卡勾部13呈自軸心向外傾斜之結構，使該封裝 戴面之 於該套環40内而不致脫離，此外，該底座10設有第一導入斜角 套環40設有第二導入斜角4卜該第一、二導入斜角16、4ι係用以導= 整流晶片端子與待接物相接設之角度，該底座另設有—握持部Μ = 部〗5環設複數間隔排列之凸紋。 遽将 本發明的具施樣S巾，錄環4G_其外緣接設於該底座1〇之 内緣（如@ 3-1所示），或，該套環4〇以其内緣與該底座1〇之外緣相結合 (如圖5所示而該導電元件3〇的該緩衝區段33可為排列緊密之螺， 或以一距離間隔排列之螺紋形成另一緩衝區段33a (如圖4所示），其令， 該緩衝區段33a間隔排列之距離其外徑係小於該導電元件3〇之外徑j當外 力施於該導電元件30時，可透過該緩衝區段33、33a提供 =: 力，以防止該整流晶片20受外力而破損；另外，如圖Η及圖 絕緣部21更可為-麵、雜，且触裝平纟n設有將舰轉定位的至 )一阻流槽17，該絕緣膠係填充於該導電元件3〇及該組裝平台u之間而 包覆該整流晶片20之周緣，避免該整流晶片2〇形成短路之現象。 7 200933825 綜上所述僅為本發明的較佳實施例而已，並非用來限定本發明之實施 範圍。即凡依本發明申請專利範圍之内容所為的等效變化與修飾，皆應為 本發明之技術範_。 200933825 【圖式簡單說明】 圖1，為本發明的立體外觀示意圖。 圖2-1，為本發明的結構分解示意圖。 圖2-2，為圖2-1的局部放大剖面示意圖。 圖3-1及圖3-2，為本發明的剖面示意.圖。 圖4，為本發明的另一實施態樣示意圖。 圖5，為本發明的再一實施態樣示意圖。 圖6-1，為本發明的又一實施態樣示意圖。 圖6-2，為圖6-1的局部放大示意圖。 【主要元件符號說明】 10..............底座 11 ..............組裝平台 12 ..............第一凸點架構 13 ..............卡勾部 14 ..............間隔區段 15 ..............握持部 16 ...............第一導入斜角 17 ..............阻流槽BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rectifying wafer terminal structure, and more particularly to a rectifying wafer terminal structure applied to a power rectifier. [Prior Art] Generally referred to as the rectifier terminal, it is specially configured on the electrode of the automobile generator to convert the alternating current into direct current. The terminal is provided with a platform, and a tin piece is placed on the platform, and then a wafer is placed. Placed on the tin sheet, 'after the tin sheet is heated and dissolved,' the wafer can be freshly fixed on the platform, and finally encapsulated by plastic or resin along the circumference of the terminal. The conventional rectifying terminal, such as the "Rectifier diode" of the US6060776, mainly has a base, the base has a platform, the platform is fixed with a semiconductor wafer to support the installation of a lead, and the base is provided with a sheath, and The substrate, the semiconductor wafer, and the like are stabilized in a space in the sheath by injecting a package material, and when the rectifier diode is pressed into the rectifying plate, the base is easily deformed by being in contact with the sheath. Therefore, the service life of the rectifier diode is reduced; in order to improve the above-mentioned deficiency, another "diode" of US20070105454 is provided with a section between the base and the sheath, so that when the diode is pressed into the rectifier, it has a buffer space to avoid The base is deformed. In addition, the "Rectifier diode with improved means for tension relief of the connected headwire" of US Pat. No. 6,667,545, mainly comprises a pedestal extending from a slab-platform to support the mounting of the semiconductor wafer. a lead wire, and the platform has a peripheral portion and a ring portion of the ring portion, and the central portion of the ring portion and the peripheral portion of the hard lead wire are formed at an angle ",", the angle α is greater than the angle α, so that the The formation of a semiconductor wafer is abrupt. Although the above-mentioned conventional techniques have achieved the effect of rectification, there are still some conventional drawbacks. The inner sheath of the surgical sheath is perpendicular to the plane of the pedestal when the package is packaged. (4) The silk which is easy to be threatened when injecting, and the installation of the New Two-pole Yiping is cyclically arranged from its stalk. Therefore, (4) the susceptor is rotated relative to the packaging material. SUMMARY OF THE INVENTION The main purpose of the present invention is to solve the problem of missing, and the invention not only facilitates assembly and manufacture, but also (4) the time required for production, and prevents the falling of the encapsulating material, and avoids the relative sealing of the base of 200933825.襞 Material rotation. In order to achieve the above object, the present invention provides a rectifying wafer terminal structure which mainly comprises an area of both end edges which is different from an area of either of its inner edges. The other purpose of the 〆 发 发 发 在于 在于 在于 在于 在于 在于 发 发 发 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强 强BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 , FIG. 2 , FIG. 2 and FIG. 2 are the three-dimensional appearance of the present invention: a knife solution and a defect; the field surface terminal structure of the present invention is shown. Mainly includes - base 1G, - rectifier wafer 2G, - conductive component % and - collar 4 〇. ^ collar 40 recorded Linsi seat 1G book postal _ - package · q such as epoxy resin' and The surface of the two ends of the collar 4G_cooked inner-the mosquito-cutting area is not to be detached from the collar 4G after the encapsulating material 42 is solidified. In the embodiment of the present invention, the opposite ends of the ring 40 are Less than the inner edge of the area of the cross-section (as shown in Figure 2), the area of the two ends of the crucible can be larger than the area of the inner edge of the cross-section (as shown in Figure 3_2), ^ the set of 40 The inner edge is a recording surface structure, and further includes a lining meter (not shown); the base portion has an assembly platform n, and the assembly platform u is at the center position The first bump 14 is provided to mount the rectifying wafer 2, and the rectifying wafer 2 is provided with an insulating portion 21 at the periphery thereof. In the embodiment, the insulating portion 21 may be thicker than the rectifying wafer 2 Encapsulating the glass to form an insulation to avoid the rectification of the rectifying crystal. Further, the inspection platform n and the inner edge of the base (1) are separated by a spacing section 14 for preventing moisture from penetrating along the inner wall. The stress of the encapsulating material 42 is prevented from causing the rectifying wafer 2 to be broken, and at least a hook portion 13 is disposed between the assembly platform n and the spacing portion 丨/bottom. In the figure of the present invention, the hook portion 13 can be For the plural separation 6 200933825 is placed between the 5 hai assembly platform 11 and the bottom of the spacer section 14, whereby the package material 42 is not detached, and the base 10 is not caused by the package material 42 relative to the D, the conductive The component 30 has a base portion 31, and the two side rail materials 42 of the base portion 31 generate a rotating structure 32 for connecting the rectifying wafer 20. If the rectifying wafer end of the present invention has a first bump frame assembly, the rectifying wafer is used. 20 and the conductive element 邛: the second ^ structure. Tin-stacked on the first-bump structure 12 of the assembly platform 11, and the structure 32 is sequentially combined in a manner corresponding to a screw, a pattern or an adhesive, and the sleeve material 40 is connected to the bottom portion. After the encapsulation material 42 is cured, the rectifying wafer terminal is formed into the collar 4, and the crucible 40 is separated from the housing 10, so that the present invention utilizes the space in the process of fresh tin. And saving the processing time; separating the corresponding empty fa1 ' through the first and second bump structures 12 and the two sides of the large operation wafer 20 to avoid the insufficiency of the packaging material when the packaging material is connected to the rectification 21 rupture or crushing and damage, and (4) rushing section 33 due to thermal expansion, when external force is involved, it can provide the effect of cushioning anti-vibration, avoiding the rupture of the mitigation force, and by The area of the two end edges of the collar 4G is smaller than the area of the thin edge. In addition, the hook portion 13 is inclined outward from the axis, so that the package is worn in the collar 40 without being detached. The base 10 is provided with a first lead-angled collar 40 and a second lead-in angle 4 for the first and second guides. = Angle 16,4ι system for conducting terminals to be wafer bonded article disposed in contact angle of the rectifier, the other with the base - relief arrangement of the grip portion 5 [mu] =〗 portion disposed around a plurality of intervals.遽 Having the sample S towel of the present invention, the outer edge of the recording ring 4G_ is attached to the inner edge of the base 1 (as indicated by @ 3-1), or the collar 4 is with its inner edge and The outer edge of the base 1 is combined (as shown in FIG. 5, the buffer segment 33 of the conductive element 3〇 may be a closely arranged screw, or the threads arranged at a distance interval form another buffer segment 33a ( As shown in FIG. 4, the buffer segments 33a are spaced apart from each other by an outer diameter smaller than the outer diameter j of the conductive member 3. When the external force is applied to the conductive member 30, the buffer segment 33 is permeable. 33a provides a force to prevent the rectifying wafer 20 from being damaged by an external force; in addition, as shown in FIG. 1 and the insulating portion 21, the insulating portion 21 may be a face-to-face, miscellaneous, and the contact pinch n is provided to position the ship to A choke groove 17 is filled between the conductive element 3 and the assembly platform u to cover the periphery of the rectifying wafer 20, thereby preventing the rectifying wafer 2 from forming a short circuit. 7 200933825 The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equivalent variations and modifications of the content of the patent application scope of the present invention should be the technical scope of the present invention. 200933825 [Simplified description of the drawings] Fig. 1 is a schematic perspective view of the present invention. Figure 2-1 is a schematic exploded view of the structure of the present invention. 2-2 is a partially enlarged cross-sectional view of FIG. 2-1. 3-1 and 3-2 are schematic cross-sectional views of the present invention. Figure 4 is a schematic view of another embodiment of the present invention. Fig. 5 is a schematic view showing still another embodiment of the present invention. 6-1 is a schematic view of still another embodiment of the present invention. Figure 6-2 is a partially enlarged schematic view of Figure 6-1. [Description of main component symbols] 10..............Base 11 ............. Assembly platform 12 .......... ....first bump structure 13 .............. hook portion 14 .............. interval section 15 .... .......... grip 16 ............... first lead angle 17 .............. Flow cell
20 ..............整流晶片 21 ..............絕緣部 30 ..............導電元件 31 ..............基部 32 ..............第二凸點架構 33、33a...........緩衝區段 40 ..............套環 41 ..............第二導入斜角 42 ..............封裝材料 920 ..............Rectifier wafer 21 ..............Insulation 30 ..............Conductive Element 31 .............. base 32 .............. second bump structure 33, 33a.......... Buffer segment 40 .............. collar 41 .............. second lead angle 42 ........ ...packaging material 9