M420835 五、新型說明： 【新型所屬之技術領域】’ .r u .M420835 V. New description: [New technical field] ’.
[0001] 本新型係有關一種整流晶片端子，尤指一種應用於功率 整流器的整流晶片端子。 【先前技術】 [0002] 一般所指之整流端子，係專門配置於汽車發電機之電極 上，可將交流電轉為直流電，此種端子係設有一平台， 於該平台上置有一錫片，再將一晶片置於該錫片上，待 錫片受熱熔固後，該晶片即能被銲固於平台上，最後再 以塑膠或樹脂順著端子的圓周加以封裝。 [0003]傳統整流端子如US6060776 的「Rect i f ier diode」.， 其主要具備一基座，該基座具有一平台，該平台固設一 半導體晶片以支撐裝設一引線，且該基座設有一護套， 並灌注一封裝材料而將該平台、該半導體晶片等穩固於 該護套内之空間，當該整流二極管壓入到整流板中時， 該基座與該護套相接處易受力而變形，因此降低整流二 極管的使用壽命；為改善上述缺失，另如 US20070105454的「diode」，係於基座與護套間設置 一區段，使二極管壓入整流板時，得具有一緩衝空間而 避免該基座變形。 [0004]另外，又如 US6667545 的「Recti fier diode with improved means for tension relief of the connected headwire」，主要包含一基座，該基座延 伸設有一平台以支撐裝設一半導體晶片，該半導體晶片 上設置一引線，且該平台具有一周緣部並延設一環部， 表單编號A0101 第3頁/共16頁 M420835 其中，該環部及該周緣部分別與引線的中心軸形成一夾 •角α、α ’ ·，夹角i k；娘味滅夹角α ’ ，使該丰導體晶片 周圍形成一絕緣區。 [0005] 然，上述各習知技術雖都達到整流之效，但實質上仍存 在一些缺失：上述各習知技術的該護套與該平台間為一 簡易凹槽結構，在該整流器運作時，因不同導熱係數可 能會使該護套與該基座間產生空隙，容易有水氣進入， 可能導致短路。 【新型内容】 [0006] 本新型的主要目的，在於解決上述在該整流器運作時， 水氣進入容易進入導致短路的缺失。 [0007] 為達上述目的，本新型提出一種整流晶片端子，包括一 底座、一設於該底座上的整流晶片、一設於該整流晶片 上的導電元件以及一裝設於該底座之端緣的套環。該底 座内部具有一組裝平台以裝設周緣設有一絕緣部的該整 流晶片，且該底座具有一環繞該組裝平台的外環部，該 組裝平台與該外環部間設有一間隔區段，該外環部面向 該組裝平台的壁面，該壁面向該間隔區段延伸出一第一 緩衝面與一第二緩衝面，該第一、二緩衝面之高度不同 ，該組裝平台面向該外環部的壁面延伸出高度不同的第 三緩衝面與第四緩衝面，且該組裝平台與該間隔區段底 部之間設有至少一卡勾部。而該導電元件具有設置於該 整流晶片上的一基部，該基部與該整流晶片接觸面延伸 出向上漸縮的一導流部，該導流部至少具有相互平行的 二導流面，且該導流部上設有一緩衝區段，可強化該導 表單編號Α0101 第4頁/共16頁 電元件的抗振能力。該套環裝設於該底座之端緣並於内 部容設一身t舞;#料，該.套學上下端緣皆具有與該外環部 Λ 1,- 相應的接合部。 [0008] 藉由上述的該第一緩衝面、第二緩衝面、第三緩衝面及 第四緩衝面，增加該間隔區段的蜿蜒程度以及該間隔區 段的表面積，延長了水氣由該外環部滲入沿該間隔區段 至該整流晶片所需經過的路徑長度，降低水氣進入造成 短路之風險。 【實施方式】 [0009] 有關本新型之詳細說明及技術内容，茲配合圖式說明如 下： [0010] 請參閱『圖1、圖2以及圖3』所示，係為本新型的外觀、 結構分解以及第二實施例剖面示意圖；如圖所示，本新 型所提出的整流晶片端子，其主要包含有一底座10、一 整流晶片20、一導電元件30及一套環40 ;該套環40係裝 設於該底座10之端緣並於其内部容設一封裝材料41 (如 環氧樹脂）；該底座10内部係具有一組裝平台11以及一 環繞該組裝平台11的外環部12，該組裝平台11於中心位 置裝設該整流晶片20，該整流晶片20周緣設有一絕緣部 21，本新型圖式中該絕緣部21可為一種絕緣膠，該絕緣 膠係填充於該導電元件30及該組裝平台11之間而包覆該 整流晶片20之周緣，用以形成絕緣而避免該整流晶片20 形成短路之現象。該組裝平台11與該外環部12間設有一 間隔區段14，該外環部12面向該組裝平台11的壁面不同 高度位置延伸出一第一緩衝面121與一第二緩衝面122， 表單編號Α0101 第5頁/共16頁 M420835 而該組裝平台11面向該外環部12的壁面延伸出高度不同 的第三緩衝面ί Ϊ1與第四衝面1.1_又^藉第一释衝面111丨 、第二緩衝面112、第三緩衝面121及第四緩衝面122增 加該間隔區段14的蜿蜒程度以及表面積，延長水氣由該 外環部12滲入沿該間隔區段14至該整流晶片20所需經過 的路徑長度，降低水氣滲入造成短路之風險。該間隔區 段14亦可防止該封裝材料41應力造成該整流晶片20破裂 ，且該組裝平台11與該間隔區段14底部之間設有至少一 卡勾部13，本新型圖式中，該卡勾部13可為配置於該組 裝平台11與該間隔區段14底部之間的環狀構造，而該卡 勾部13更可為複數分離配置於該組裝平台11與該間隔區 段14底部之間（圖未示），藉以卡扣該封裝材料41使該封 裝材料41不致脫離，且使該底座10不致相對該封裝材料 41產生旋轉，該導電元件30係具有一基部31，該基部31 與該整流晶片20接觸面延伸出向上漸縮的一導流部32， 該導流部32至少具有相互平行的二導流面，如是構成本 新型整流晶片端子。 [0011] 組裝時，係將該整流晶片20及該導電元件30依序銲錫而 疊設於該組裝平台11，再將該套環40與該底座10以對應 螺紋或黏合之方式相結合，於該導流部32注入該絕緣膠 ，藉該導流部32導引該絕緣膠沿該基部31邊緣流至該整 流晶片20周緣。復以該封裝材料41注入套環40内部，待 該封裝材料41固化後即形成該整流晶片端子之成品，利 用該套環40與該底座10採分離設計，令本新型於銲錫過 程中可具有較大的操作空間，並且節省製程時間；而藉 由該卡勾部13呈自軸心向外傾斜之結構，使該封裝材料 表單编號A0101 第6頁/共16頁 [0012] 41限位於該套環4〇内而不致脫離’此外該底座另設有 一握持部:15，該握持部15.環設複數間·隔排列之&紋' • .·. 請參閱圖4及圖5，係為本新型的第二實施例剖面示意圖 及第二實施例剖面不意圖，如圖所示，該基部31另側延 伸出-緩衝H段33 ’當外力介人時可提供_緩衝抗振之 效果，避㈣整流晶片20因外力過大而破裂，該緩衝區 段33可為排列緊密之螺紋（如圖4所示），或以“距離間隔 排列之螺紋形成另一緩衝區段33a (如圖5所示），其中 ，該緩衝區段33a間隔排列之距離其外徑係小於該導電元 件30之外徑，當外力施於該導電元件3〇時可透過該缓 衝區段33、33a提供-緩衝抗振之能力，以防止該整流晶 片20¾外力而破損；另外，，在本新型的圖式實施例中 且該套壤40内緣係呈弧面結構，可為該套環4{)内緣向該 組裝平台11凸出的弧面結構（如圖4所示），或可為該套環 40内緣由該組裝平台！ ！向該套環4〇方向凹陷的弧面結構（ 如圖5所示），該套環40内緣更包含一種斜面設計（圖中 未示）配合該卡勾部13，更加穩固該封裝材料41限位於 該套環40内而不致脫離。 [0013] 藉由上述的第一緩衝面U1、第二緩衝面112、第三緩衝 面121及第四緩衝面丨22，增加該間隔區段14的婉蜒程度 以及。玄間隔區段14的表面積’延長了水氣由該外環部】2 滲入沿該間隔區段14至該整流晶片20所需經過的路徑長 度，降低水氣進入造成短路之風險。 綜上所述僅為本新型的較佳實施例而已並非用來限定 本新型之實施範圍。即凡依本翻申料㈣圍之内容 表單编號A0101 -第7頁/共16頁 [0014] M420835 所為的等效變化與修飾，皆應為本新型之技術範疇。 【圖k簡單被明】1' [0015] 圖1，為本新型的外觀示意圖。 [0016] 圖2，為本新型的結構分解示意圖 〇 [0017] 圖3，為本新型的第一實施例剖面示意圖。 [0018] 圖4，為本新型的第土#施例剖面示意圖。 [0019] 圖5，為本新型的第三實施例剖面示意圖。 【主要元件符號說明】 [0020] 10.............. 底座 [0021] 11.............. 組裝平台 _] 111............. •第三緩衝面 [0023] 112............. •第四緩衝面 [0024] 12.............. 外環部 [0025] 121............. 第一緩衝面 [0026] 122............. •第二緩衝面 [0027] 13.............. 卡勾部 [0028] 14.......... . ·.. 間隔區段 [0029] 15.............. 握持部 [0030] 20.............. 整流晶片 [0031] 21.............. 絕緣部 表單编號A0101 第8頁/共16頁 M420835 [0032] 30..............導電元件 [0033] - - 31.....·. . .......基部 [0034] 32..............導流部 [0035] 33、33a...........缓衝區段 [0036] 40..............套環 [0037] 41 · · . · ..........封裝材料[0001] The present invention relates to a rectifying chip terminal, and more particularly to a rectifying chip terminal for use in a power rectifier. [Prior Art] [0002] Generally referred to as a rectifying terminal, which is specially configured on an electrode of an automobile generator, can convert an alternating current into a direct current. The terminal is provided with a platform on which a tin piece is placed, and then A wafer is placed on the tin sheet. After the tin sheet is heat-sealed, the wafer can be soldered to the platform and finally encapsulated with plastic or resin along the circumference of the terminal. [0003] A conventional rectifying terminal, such as the "Rect if ier diode" of US6060776, which mainly has a base, the base has a platform, the platform is fixed with a semiconductor wafer to support a lead, and the base is provided Having a sheath and injecting a packaging material to stabilize the platform, the semiconductor wafer, etc. in a space in the sheath, and when the rectifier diode is pressed into the rectifying plate, the susceptor is easily connected to the sheath Deformed by force, thus reducing the service life of the rectifier diode; in order to improve the above-mentioned deficiency, another "diode" of US20070105454 is provided with a section between the base and the sheath, so that when the diode is pressed into the rectifier, it has a Buffer space to avoid deformation of the base. [0004] In addition, the "Recti fier diode with improved means for tension relief of the connected headwire" of US Pat. No. 6,677,545, mainly comprises a pedestal extending to provide a platform for supporting a semiconductor wafer on the semiconductor wafer. A lead wire is disposed, and the platform has a peripheral edge portion and a ring portion is extended, and the form number A0101 is 3/16 M420835, wherein the ring portion and the peripheral portion respectively form a clip angle α with the central axis of the lead wire , α ' ·, the angle ik; the female taste angle α ', so that an insulating area is formed around the abundance conductor wafer. [0005] However, although the above-mentioned conventional techniques all achieve the effect of rectification, there are still some defects in existence: the sheath of the above-mentioned various prior art and the platform are a simple groove structure, when the rectifier operates Because of different thermal conductivity, there may be a gap between the sheath and the base, and moisture may easily enter, which may cause a short circuit. [New Content] [0006] The main purpose of the present invention is to solve the above-mentioned problem that when the rectifier is operated, water and gas enter easily and cause a short circuit. [0007] In order to achieve the above object, the present invention provides a rectifying chip terminal, comprising a base, a rectifying chip disposed on the base, a conductive component disposed on the rectifying wafer, and an edge mounted on the base The collar. The base has an assembly platform for mounting the rectifying wafer with an insulating portion on the periphery thereof, and the base has an outer ring portion surrounding the assembly platform, and the assembly platform and the outer ring portion are provided with a spacing portion. The outer ring portion faces the wall surface of the assembly platform, and the wall extends a first buffer surface and a second buffer surface facing the spacing portion, the heights of the first and second buffer surfaces are different, and the assembly platform faces the outer ring portion The wall surface extends a third buffer surface and a fourth buffer surface with different heights, and at least one hook portion is disposed between the assembly platform and the bottom of the spacing portion. The conductive element has a base portion disposed on the rectifying wafer, and the base portion and the rectifying wafer contact surface extend a downwardly tapered flow guiding portion having at least two parallel flow guiding surfaces, and the guiding portion A buffer section is arranged on the flow guiding portion, which can strengthen the anti-vibration capability of the electric component of the guide form number Α0101, page 4/16 pages. The collar is mounted on the end edge of the base and accommodates a dance inside. The material has an engaging portion corresponding to the outer ring portion Λ 1,-. [0008] The first buffer surface, the second buffer surface, the third buffer surface, and the fourth buffer surface are increased by the above-mentioned first buffer surface, the third buffer surface, and the fourth buffer surface, and the surface area of the interval portion is increased, and the water vapor is extended. The outer ring portion penetrates the path length along the interval section to the rectifying wafer, reducing the risk of moisture entering the short circuit. [Embodiment] [0009] The detailed description and technical contents of the present invention are as follows: [0010] Please refer to FIG. 1, FIG. 2 and FIG. 3, which are the appearance and structure of the present invention. Dissection and cross-sectional view of the second embodiment; as shown in the figure, the rectifying chip terminal of the present invention mainly comprises a base 10, a rectifying chip 20, a conductive element 30 and a set of rings 40; An encapsulating material 41 (such as an epoxy resin) is disposed in an inner edge of the base 10; the base 10 has an assembly platform 11 and an outer ring portion 12 surrounding the assembly platform 11 . The rectifying wafer 20 is disposed at a central position of the assembly platform 11 . The rectifying wafer 20 is provided with an insulating portion 21 . The insulating portion 21 of the present invention may be an insulating rubber filled with the conductive member 30 . The periphery of the rectifying wafer 20 is covered between the assembly platforms 11 to form an insulation to prevent the rectifying wafer 20 from forming a short circuit. A spacing section 14 is disposed between the assembly platform 11 and the outer ring portion 12, and the outer ring portion 12 extends from the wall surface of the assembly platform 11 to a first buffer surface 121 and a second buffer surface 122. No. 1010101, page 5/16, M420835, and the assembly platform 11 extends to the wall surface of the outer ring portion 12 to extend a third buffer surface ί 与1 and a fourth punch surface 1.1_ The second buffer surface 112, the third buffer surface 121, and the fourth buffer surface 122 increase the extent and surface area of the spacer portion 14, and the extended moisture permeates from the outer ring portion 12 along the interval portion 14 to the The path length required to rectify the wafer 20 reduces the risk of moisture infiltration causing a short circuit. The spacer section 14 can also prevent the rectifying wafer 20 from being broken by the stress of the encapsulating material 41, and at least one hook portion 13 is disposed between the assembly platform 11 and the bottom of the spacing section 14. In the present drawing, the The hook portion 13 can be an annular structure disposed between the assembly platform 11 and the bottom of the spacing portion 14 , and the hook portion 13 can be disposed at a plurality of separate positions on the assembly platform 11 and the bottom of the spacing portion 14 . Between the illustrations (not shown), the encapsulation material 41 is buckled to prevent the encapsulation material 41 from being detached, and the base 10 is not rotated relative to the encapsulation material 41. The conductive element 30 has a base portion 31, and the base portion 31 has a base portion 31. A flow guiding portion 32 which is tapered upward is formed in contact with the surface of the rectifying wafer 20. The flow guiding portion 32 has at least two parallel flow guiding surfaces which are parallel to each other, and constitute the novel rectifying wafer terminal. [0011] When assembling, the rectifying wafer 20 and the conductive element 30 are sequentially soldered and stacked on the assembly platform 11, and the collar 40 and the base 10 are combined in a corresponding thread or bonding manner. The flow guiding portion 32 injects the insulating glue, and the insulating material guides the insulating rubber to flow along the edge of the base portion 31 to the periphery of the rectifying wafer 20. The package material 41 is injected into the inside of the collar 40, and after the package material 41 is cured, the finished product of the rectifying chip terminal is formed, and the sleeve 40 is separated from the base 10, so that the novel can have a soldering process. The operation space is large, and the process time is saved; and the structure of the package material form A0101 is 6th/16 pages [0012] 41 is limited by the structure that the hook portion 13 is inclined outward from the axis. The collar 4 is not detached from the inside. In addition, the base is further provided with a grip portion: 15. The grip portion 15 is provided with a plurality of partitions and spacers. • Please refer to FIG. 4 and FIG. 5 is a schematic cross-sectional view of a second embodiment of the present invention and a cross-section of the second embodiment. As shown, the base portion 31 extends from the other side to the buffer H segment 33' to provide a buffering resistance when the external force is interposed. The effect of the vibration, avoiding (4) the rectifying wafer 20 is broken due to excessive external force, the buffer segment 33 may be a closely arranged thread (as shown in FIG. 4), or the other buffer segment 33a may be formed by "distance-arranged threads" ( As shown in FIG. 5, wherein the buffer segments 33a are arranged at intervals The outer diameter is smaller than the outer diameter of the conductive element 30, and when the external force is applied to the conductive element 3, the buffer section 33, 33a can be provided with a buffering anti-vibration capability to prevent the rectifying wafer 205⁄4 from being damaged by external force; In addition, in the illustrated embodiment of the present invention, and the inner edge of the sleeve 40 has a curved surface structure, the inner surface of the collar 4{) protrudes from the assembly platform 11 (see FIG. 4). The inner edge of the collar 40 is a curved surface structure (shown in FIG. 5) which is recessed toward the collar 4 by the assembly platform! The inner edge of the collar 40 further includes a bevel design ( The first hooking surface U1, the second buffering surface 112, and the third surface are further stabilized by the hooking portion 13 in the sleeve 40. The buffer surface 121 and the fourth buffer surface 22 increase the degree of enthalpy of the spacer portion 14 and the surface area of the mysterious spacer portion 14 extends the water vapor from the outer ring portion 2 into the interval portion 14 to The length of the path that the rectifying wafer 20 needs to pass reduces the risk of moisture entering the short circuit. It is only a preferred embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. That is, the content form A0101 - page 7 / 16 pages [0014] M420835 of the present application (4) The effect change and modification should be the technical scope of the new type. [Fig. k is simply illustrated] 1' [0015] Fig. 1 is a schematic view of the appearance of the present invention. [0016] Fig. 2 is a schematic exploded view of the structure of the present invention 3 is a cross-sectional view showing a first embodiment of the present invention. [0018] FIG. 4 is a cross-sectional view showing a third embodiment of the present invention. [0019] FIG. schematic diagram. [Main component symbol description] [0020] 10.............. Base [0021] 11.............. Assembly platform _] 111.. ........... • Third buffer surface [0023] 112............. Fourth buffer surface [0024] 12........ ...... outer ring portion [0025] 121............. first buffer surface [0026] 122............. • second Buffer surface [0027] 13.............. Hook section [0028] 14.......... ... Interval section [0029] 15. ............ Grip [0030] 20.............. Rectifier Wafer [0031] 21........... ... Insulation Part No. A0101 Page 8 of 16 M420835 [0032] 30..............Conductive Components [0033] - - 31..... . . . base [0034] 32.............. diversion [0035] 33, 33a..... buffer Section [0036] 40.............. collar [0037] 41 · · · · .......... packaging material
表單編號A0101 第9頁/共16頁Form No. A0101 Page 9 of 16