CN202259237U - Rectifier chip terminal - Google Patents
Rectifier chip terminal Download PDFInfo
- Publication number
- CN202259237U CN202259237U CN2011203489399U CN201120348939U CN202259237U CN 202259237 U CN202259237 U CN 202259237U CN 2011203489399 U CN2011203489399 U CN 2011203489399U CN 201120348939 U CN201120348939 U CN 201120348939U CN 202259237 U CN202259237 U CN 202259237U
- Authority
- CN
- China
- Prior art keywords
- rectification chip
- assembly platform
- base
- chip terminal
- terminal according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003139 buffering effect Effects 0.000 claims description 32
- 125000006850 spacer group Chemical group 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 6
- 241000278713 Theora Species 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A rectifier chip terminal comprises a base, a rectifier chip, a conductive element and a lantern ring. The base is internally provided with an assembly platform for installing a rectifier chip with an insulating part arranged on the periphery, and an outer ring part surrounding the assembly platform, a spacing section is arranged between the assembly platform and the outer ring part, the outer ring part and the assembly platform respectively extend to the spacing section to form a first buffer surface, a second buffer surface, a third buffer surface and a fourth buffer surface which are different in height, and the assembly platform is provided with at least one clamping hook part. The conductive element is provided with a base part arranged on the rectifying chip, and a flow guide part which is tapered upwards extends out of a contact surface of the base part and the rectifying chip. The lantern ring is arranged on the end edge of the base and internally provided with a packaging material, and the upper end edge and the lower end edge of the lantern ring are provided with joint parts corresponding to the outer ring part. The utility model discloses a rectifier chip terminal can reduce the risk that vapor got into and causes the short circuit to avoid this rectifier chip to break because of external force is too big.
Description
Technical field
The utility model relates to a kind of rectification chip terminal, refers to a kind of rectification chip terminal that is applied to power rectifier especially.
Background technology
The rectification terminal of general indication, be special configuration on the electrode of automobile current generator, can transfer alternating current to direct current; This kind terminal is provided with a platform; On this platform, be equipped with a tin sheet, again a chip placed on this tin sheet, treat that the tin sheet is heated after the blow; This chip can be welded on the platform, encapsulates along the circumference of terminal with plastics or resin more at last.
" the Rectifier diode " of tradition rectification terminal such as US6060776, it mainly possesses a pedestal, and this pedestal has a platform; This platform sets firmly the semiconductor chip to support installing one lead-in wire; And this pedestal is provided with a sheath, and pours into an encapsulating material and this platform, this semiconductor chip etc. is stable in the space in this sheath, when this rectifier diode is pressed in the cowling panel; This pedestal and this sheath joint are prone to stressed and are out of shape the useful life of therefore reducing rectifier diode; For improving above-mentioned defective, for another " diode " of US20070105454, a section is set between pedestal and sheath, when making diode be pressed into cowling panel, must have a cushion space and avoid the distortion of this pedestal.
In addition; And for example " the Rectifier diode with improved means fortension relief of the connected headwire " of US6667545 mainly comprises a pedestal, and this base extension is provided with a platform to support installing semiconductor chip; One lead-in wire is set on this semiconductor chip; And this platform has a circumference and extends a ring portion, and wherein, this ring portion and this circumference form an angle, α ' with the central shaft that goes between respectively; Angle is greater than angle ', make this semiconductor chip form an insulation layer on every side.
Yet; Though above-mentioned each known technology all reaches the effect of rectification; But in fact still there are some defectives: be a simple and easy groove structure between this sheath of above-mentioned each known technology and this platform, when this rectifier running, produce the space because of different conductive coefficients may make between this sheath and this pedestal; There is aqueous vapor to get into easily, possibly causes short circuit.
The utility model content
The main purpose of the utility model is to solve above-mentioned when the running of this rectifier, and aqueous vapor gets into and gets into the defective that causes short circuit easily.
For reaching above-mentioned purpose, the utility model is taked following technical scheme.
A kind of rectification chip terminal; Comprise: a base; Base has one and is positioned at inner an assembly platform and an outer portion around assembly platform; Be provided with a spacer segment between assembly platform and the outer portion, outer portion is extended one first buffering suface and one second buffering suface towards the wall of assembly platform, and first buffering suface is different with the second buffering suface height; Assembly platform extends the 3rd highly different buffering sufaces and the 4th buffering suface towards the wall of outer portion, and is provided with at least one hook part between assembly platform and the spacer segment bottom; One rectification chip is installed in assembly platform, and rectification chip is provided with an insulation division in periphery; One conducting element has a base portion that is arranged on the rectification chip, and base portion and rectification chip contact-making surface extend a upwards diversion division of convergent, and diversion division has two guide faces that are parallel to each other at least; One collar is installed in the ora terminalis of base and is installed with an encapsulating material in inside, and collar ora terminalis up and down all has and the corresponding junction surface of outer portion.
Further, this insulation division is a kind of insulating cement.
Further, this diversion division is provided with a buffer field.
Further, this buffer field can be and arranges screw thread closely.
Further, this buffer field can be the spaced screw thread of a distance, and the external diameter of this distance is less than the external diameter of this conducting element.
Further, this collar inner edge is a cambered surface.
Further, this collar inner edge is the inclined-plane.
Further, this base is provided with a grip part, and this grip part ring is established a plurality of spaced burrs.
The beneficial effect of the utility model is:
Through above-mentioned this first buffering suface, second buffering suface, the 3rd buffering suface and the 4th buffering suface; Increase the sinuous degree of this spacer segment and the surface area of this spacer segment; Prolonged aqueous vapor and infiltrated along the path of this spacer segment, reduced the aqueous vapor entering and cause short risk to the required process of this rectification chip by this outer portion.And this buffer field can provide the effect of a buffering antivibration when external force gets involved, avoid this rectification chip to break because of external force is excessive.
Description of drawings
Fig. 1 is the schematic appearance of the utility model.
Fig. 2 is the STRUCTURE DECOMPOSITION sketch map of the utility model.
Fig. 3 is the first embodiment generalized section of the utility model.
Fig. 4 is the second embodiment generalized section of the utility model.
Fig. 5 is the 3rd embodiment generalized section of the utility model.
Embodiment
Detailed description of relevant the utility model and technology contents cooperate graphic explanation following at present:
See also Fig. 1, Fig. 2 and shown in Figure 3, be outward appearance, STRUCTURE DECOMPOSITION and the second embodiment generalized section of the utility model; Rectification chip terminal as shown in the figure, that the utility model proposed, it consists predominantly of a base 10, a rectification chip 20, a conducting element 30 and a collar 40; This collar 40 is installed in the ora terminalis of this base 10 and is installed with an encapsulating material 41 (like epoxy resin) in its inside; These base 10 inside have an assembly platform 11 and an outer portion 12 around this assembly platform 11; This assembly platform 11 is this rectification chip 20 of installing in the center; These rectification chip 20 peripheries are provided with an insulation division 21; This insulation division 21 can be a kind of insulating cement during the utility model was graphic, and this insulating cement is filled between this conducting element 30 and this assembly platform 11 and coats the periphery of this rectification chip 20, in order to form insulation and to avoid this rectification chip 20 to form the phenomenon of short circuits.12 of this assembly platform 11 and this outer portion are provided with a spacer segment 14; This outer portion 12 is extended one first buffering suface 121 and one second buffering suface 122 towards the wall differing heights position of this assembly platform 11; And this assembly platform 11 extends the 3rd highly different buffering sufaces 111 and the 4th buffering suface 112 towards the wall of this outer portion 12; First buffering suface 111, second buffering suface 112, the 3rd buffering suface 121 and the 4th buffering suface 122 increase the sinuous degree and the surface area of these spacer segment 14 by this; Prolong aqueous vapor and infiltrate along the path of this spacer segment 14, reduce the aqueous vapor infiltration and cause short risk to these rectification chip 20 required processes by this outer portion 12.This spacer segment 14 can prevent that also these encapsulating material 41 stress from causing this rectification chip 20 to break; And be provided with at least one hook part 13 between this assembly platform 11 and this spacer segment 14 bottoms; During the utility model is graphic; This hook part 13 can be the ring-shaped structure that is disposed between this assembly platform 11 and this spacer segment 14 bottoms; And this hook part 13 also can be a plurality of configured separate (figure does not show) between this assembly platform 11 and this spacer segment 14 bottoms, uses this encapsulating material 41 of buckle and makes this encapsulating material 41 unlikely disengagings, and make these base 10 unlikely these encapsulating materials 41 relatively produce rotation; This conducting element 30 has a base portion 31; This base portion 31 extends a upwards diversion division 32 of convergent with these rectification chip 20 contact-making surfaces, and this diversion division 32 has two guide faces that are parallel to each other at least, constitutes the utility model rectification chip terminal in this way.
During assembling; With this rectification chip 20 and this conducting element 30 scolding tin and be stacked at this assembly platform 11 in regular turn; Again this collar 40 is combined with the mode of this base 10 with corresponding screw thread or bonding; Inject these insulating cements in this diversion division 32, these diversion division 32 these insulating cements of guiding of mat along these base portion 31 marginal flows to these rectification chip 20 peripheries.Multiple with these encapsulating material 41 injection collars 40 inside; Treat promptly to form after this encapsulating material 41 solidifies the finished product of this rectification chip terminal; Utilize this collar 40 to adopt separate design, make the utility model in the scolding tin process, can have bigger operating space, and save the processing procedure time with this base 10; And be the structure outward-dipping from the axle center through this hook part 13, and this encapsulating material 41 is limited in this collar 40 and unlikely disengaging, in addition, this base is provided with a grip part 15 in addition, and these grip part 15 rings are established a plurality of spaced burrs.
See also Fig. 4 and Fig. 5, for the second embodiment generalized section and the 3rd embodiment generalized section of the utility model, as shown in the figure; This base portion 31 side in addition extends a buffer field 33; The effect of one buffering antivibration can be provided when external force gets involved, avoid this rectification chip 20 to break because of external force is excessive, this buffer field 33 can be arranges screw thread (as shown in Figure 4) closely; Or with the spaced screw thread formation of a distance another buffer field 33a (as shown in Figure 5); Wherein, this buffer field 33a is spaced apart from the external diameter of its external diameter less than this conducting element 30, when external force imposes on this conducting element 30; The ability of one buffering antivibration can be provided through this buffer field 33,33a, receive external force and breakage to prevent this rectification chip 20; In addition; In the graphic embodiment of the utility model and these collar 40 inner edges be globoidal structure; Can be the globoidal structure (as shown in Figure 4) of these collar 40 inner edges to these assembly platform 11 protrusions; Or can be that these assembly platforms 11 of cause are to the globoidal structure (as shown in Figure 5) of this collar 40 directions depression in this collar 40, and these collar 40 inner edges also comprise a kind of inclined design (not shown) and cooperate this hook part 13, and firm more this encapsulating material 41 is limited in this collar 40 and unlikely disengaging.
Through above-mentioned this first buffering suface 111, second buffering suface 112, the 3rd buffering suface 121 and the 4th buffering suface 122; Increase the surface area of sinuous degree and this spacer segment 14 of this spacer segment 14; Prolonged aqueous vapor and infiltrated along the path of this spacer segment 14, reduced the aqueous vapor entering and cause short risk to these rectification chip 20 required processes by this outer portion 12.And this buffer field 33 can provide the effect of a buffering antivibration when external force gets involved, avoid this rectification chip 20 to break because of external force is excessive.
Being merely the preferred embodiment of the utility model in sum, is not the practical range that is used for limiting the utility model.Be that all equivalences of doing according to the content of the utility model claim scope change and modification, all should be the technological category of the utility model.
Claims (8)
1. a rectification chip terminal is characterized in that, said rectification chip terminal comprises:
One base; Said base has one and is positioned at inner an assembly platform and an outer portion around said assembly platform; Be provided with a spacer segment between said assembly platform and the said outer portion; Said outer portion is extended one first buffering suface and one second buffering suface towards the wall of said assembly platform; Said first buffering suface is different with the second buffering suface height, and said assembly platform extends the 3rd highly different buffering sufaces and the 4th buffering suface towards the wall of said outer portion, and is provided with at least one hook part between said assembly platform and the said spacer segment bottom;
One rectification chip is installed in said assembly platform, and said rectification chip is provided with an insulation division in periphery;
One conducting element has a base portion that is arranged on the said rectification chip, and said base portion and said rectification chip contact-making surface extend a upwards diversion division of convergent, and said diversion division has two guide faces that are parallel to each other at least;
One collar is installed in the ora terminalis of said base and is installed with an encapsulating material in inside, and said collar ora terminalis up and down all has and the corresponding junction surface of said outer portion.
2. rectification chip terminal according to claim 1 is characterized in that, said insulation division is a kind of insulating cement.
3. rectification chip terminal according to claim 1 is characterized in that said diversion division is provided with a buffer field.
4. rectification chip terminal according to claim 3 is characterized in that, said buffer field is for arranging screw thread closely.
5. rectification chip terminal according to claim 3 is characterized in that, said buffer field is the spaced screw thread of a distance, and the external diameter of said distance is less than the external diameter of said conducting element.
6. rectification chip terminal according to claim 1 is characterized in that, said collar inner edge is a cambered surface.
7. rectification chip terminal according to claim 1 is characterized in that, said collar inner edge is the inclined-plane.
8. rectification chip terminal according to claim 1 is characterized in that said base is provided with a grip part, and said grip part ring is established a plurality of spaced burrs.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100215362U TWM420835U (en) | 2011-08-18 | 2011-08-18 | Rectifier chip terminal |
| TW100215362 | 2011-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259237U true CN202259237U (en) | 2012-05-30 |
Family
ID=46120436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203489399U Expired - Lifetime CN202259237U (en) | 2011-08-18 | 2011-09-16 | Rectifier chip terminal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202259237U (en) |
| TW (1) | TWM420835U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956341A (en) * | 2014-04-30 | 2014-07-30 | 江苏云意电气股份有限公司 | Screw-connection-type diode for automobile generator |
| TWI619566B (en) * | 2015-08-06 | 2018-04-01 | 朋程科技股份有限公司 | Manufacturing method and device of lead line structure of rectifier diode |
| CN109643619A (en) * | 2016-08-26 | 2019-04-16 | Abb瑞士股份有限公司 | Switch and for disconnect switch method |
-
2011
- 2011-08-18 TW TW100215362U patent/TWM420835U/en not_active IP Right Cessation
- 2011-09-16 CN CN2011203489399U patent/CN202259237U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956341A (en) * | 2014-04-30 | 2014-07-30 | 江苏云意电气股份有限公司 | Screw-connection-type diode for automobile generator |
| CN103956341B (en) * | 2014-04-30 | 2017-02-01 | 江苏云意电气股份有限公司 | Screw-connection-type diode for automobile generator |
| TWI619566B (en) * | 2015-08-06 | 2018-04-01 | 朋程科技股份有限公司 | Manufacturing method and device of lead line structure of rectifier diode |
| CN109643619A (en) * | 2016-08-26 | 2019-04-16 | Abb瑞士股份有限公司 | Switch and for disconnect switch method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM420835U (en) | 2012-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120530 |