200933683 九、發明說明 【發明所屬之技術領域】 本發明是有關附電阻的溫度保險絲，例如作爲搭載於 二次電池保護用電路體之附電阻的溫度保險絲用。 【先前技術】 將二次電池，例如鋰離子電池作爲攜帶用電子機器的 Φ 電源使用時，在容器内收容二次電池單元及保護電路，該 保護電路是具備過充電防止開關、過放電防止開關，更具 備該等的開關無法處理時非恢復性地遮斷電路之保險絲部 〇 圖4是表示對二次電池之保護電路的一例，在過充電 % 防止開關用FET (N)與過放電防止開關用FET ( Μ )之 間連接附電阻的溫度保險絲Αο。 在此附電阻的溫度保險絲中，是針對直列的2個保險 〇 絲元件部份η、m，熱結合設置電阻r例如膜電阻，而能 夠以該電阻的通電發熱來使兩保險絲元件部份熔斷，針對 兩保險絲元件部份電性並連該電阻。S是1C控制部，充 電時，檢測出過充電，產生過充電防止信號，而使過充電 防止用FET開啓，放電時，檢測出過放電，產生過放電防 止信號，而使過放電防止用FET開啓。該等FET是在無 法處理時，從1C電路S對電晶體Tr發出開啓信號，藉由 電晶體Tr的導通，以二次電池作爲電源來使附電阻的溫 度保險絲Αο的電阻r通電發熱，以該發熱來使保險絲元 -4- 200933683 件熔斷，而遮斷二次電池與負荷（充電時爲充電源）之間 〇 以往，附電阻的溫度保險絲，如圖9的（彳）所示’ 在絕緣基板1的一面1 01設置兩側膜電極a，b及中間膜 電極2，跨越該等的膜電極a，b，2來連接保險絲元件3 ，在該保險絲元件3塗佈熔劑（flux )，如圖9的（D )所 示，在絕緣基板1的他面10設置藉由貫通孔來使導通至 上述膜電極a，b的兩側膜電極a'、b1，在該等的膜電極a’ 、b’接合帶狀引線導體A，B，更在同上基板他面10設置 前後的膜電極41、42，藉由貫通孔24來導通該等前後的 膜電極41、42的一方42與上述中間膜電極2，在前後的 膜電極41、42間設置膜電阻r，在前後膜電極41、42的 他方41接合帶狀引線導體C，如圖9的（Λ )所示，以絕 緣密封物5來覆蓋基板一面10者被提案（專利文獻1) 〔專利文獻1〕特開2003-2 1 74 16號公報 【發明內容】 (發明所欲解決的課題） 在上述的附電阻的溫度保險絲，必須將基板他面i 〇 的平面尺寸設爲：在膜電阻r及其端子用膜電極41、42 的形成所必要的主空間附加保險絲元件引線導體連接用膜 電極a '、b1的形成所必要的副空間，必須賦予基板比主空 間更廣的空間，因此不利於附電阻的溫度保險絲本體部的 小型保證。 -5- 200933683 在上述的二次電池保護電路中，於圖4所示的充電時 ，使充電源D側保險絲元件部份η比二次電池側保險絲元 件部份m時間上優先熔斷，而先放開功率大的充電源d 爲安全。然而，在上述的附電阻的溫度保險絲，難以確實 保證此優先的熔斷。 在上述附電阻的溫度保險絲中，如上述般，是藉由在 保護電路異常時之膜電阻r的發熱傳達至保險絲元件3, φ 而來熔斷保險絲元件3，因此若膜電阻r的上述發熱量（ 電力）過小，則不作動，對於運轉電力而言有下限，且若 加諸於膜電阻r的電力爲大電力時保險絲元件不熔斷，則 會因爲大電力，膜電阻有爆裂破壊的危險性。 然而，在以往附電阻的溫度保險絲，動作可能的運轉 電力的下限相當高，且保險絲元件的熔斷可能的運轉電力 的上限相當低，全體亦有運轉電力範圍窄的不適。 本發明的目的是在基板的一面具有互相直列的保險絲 φ 元件部份，在基板的他面具有膜電阻，藉由膜電阻的通電 發熱來使保險絲元件熔斷之附電阻的溫度保險絲中，良好 地達成本體部的小型性、一方的保險絲元件部份對他方的 保險絲元件部份之確實的優先熔斷、搭載附電阻的溫度保 險絲之二次電池保護用電路體的小型化。 並且，擴大附電阻的溫度保險絲之使用可能的運轉電 力範圍。 (用以解決課題的手段） -6- 200933683 本案的請求項1之附電阻的溫度保險絲，其特徵爲： 在基板的一面上具有兩側膜電極a、b及中間膜電極 ，橫跨該等的膜電極而設有保險絲元件，在兩側的各膜電 極接合帶狀引線導體A、B的前端，上述基板的一係以絕 緣密封物所覆蓋，在基板的他面上設有前後的膜電極，跨 越該等前後的膜電極而設有膜電阻，前後的兩膜電極的其 中一方係被電性接線至相對於上述保險絲元件的上述中間 ^ 膜電極’在同兩膜電極的其中他方的膜電極設有側部c， 帶狀引線導體C的前端部係以面接觸來接合於該側部c， 在帶狀引線導體A、B之接近上述基板的緣端之處形成有 上升至基板他面側的階差，該階差的上側面與基板他面的 高度差幾乎等於帶狀引線導體C的厚度。 本案之請求項2的附電阻的溫度保險絲，其特徵爲： 在基板的一面上具有兩側膜電極a、b及中間膜電極 ，橫跨該等的膜電極而設有保險絲元件，在兩側的各膜電 Q 極a、b設有通至基板他面的孔，前端彎曲成鉤狀，藉由 前端附近部面接觸於基板他面的狀態下之鉤狀前端部收容 至來自基板他面側的上述孔及焊錫充塡至各孔，上述帶狀 引線導體A、B係被連接至上述膜電極a、b，在基板的他 面上設有前後的膜電極，跨越該等前後的膜電極而設有膜 電阻，前後的兩膜電極的其中一方係被電性接線至相對於 上述保險絲元件的上述中間膜電極，在同兩膜電極的其中 他方的膜電極設有側部c，帶狀引線導體C的前端部係以 面接觸來接合於該側部c，上述基板的一係以絕緣密封物 200933683 所覆蓋。 本案的請求項3之附電阻的溫度保險絲，其特徵爲： 在基板的一面上具有兩側膜電極a、b、中間膜電極及 側膜電極，橫跨兩側膜電極a、b及中間膜電極設有保險 絲元件，在基板他面設有藉由貫通孔來導通至上述膜電極 a、b的輔助膜電極a"、b” ’帶狀引線導體A、B係以面接 觸來接合於各輔助膜電極a"、b"，在基板的他面上設有前 ❹ 後的膜電極，橫跨該等前後的膜電極而設有膜電阻，前後 的兩膜電極的其中一方係被電性接線至相對於上述保險絲 元件的上述中間膜電極，前後的兩膜電極的其中他方係被 電性接線至上述基板一面的側膜電極，帶狀引線導體C的 前端係被接合於側膜電極，經由面對該接合處的基板缺口 部’上升至基板的他面側之階差係被形成於帶狀引線導體 C，上述基板的一係以絕緣密封物所覆蓋。 本案的請求項4之附電阻的溫度保險絲，係於請求項 〇 1之附電阻的溫度保險絲中，前後的兩膜電極的其中一方 之往相對於上述保險絲元件的上述中間膜電極的電性接線 係藉由貫通孔來進行。 本案的請求項5之附電阻的溫度保險絲，係於請求項 1之附電阻的溫度保險絲中，帶狀引線導體A、B、C的厚 度相等。 本案的請求項6之附電阻的溫度保險絲，係於請求項 1之附電阻的溫度保險絲中，保險絲元件係由複數條的並 列素線所構成。 -8 - 200933683 本案的請求項7之附電阻的溫度保險絲，係於請求項 1之附電阻的溫度保險絲中，基板的厚度爲450〜250μχη , 帶狀引線導體A、Β或C與膜電極的接合係藉由錫焊來進 行。 本案的請求項8之附電阻的溫度保險絲，係於請求項 7之附電阻的溫度保險絲中，引線導體接合焊錫的融點係 比保險絲元件的融點更高。 Q 本案的請求項9之附電阻的溫度保險絲，係於請求項 7或8之附電阻的溫度保險絲中，在膜電極a或b，從帶 狀引線導體A或B與膜電極a或b的接合處到膜電極&或 b與保險絲元件的接合處之間設有焊錫擴散防止勢壘。 本案的請求項1 0之附電阻的溫度保險絲，係於請求 項1之附電阻的溫度保險絲中，以使膜電極a與中間電極 之間的保險絲元件部份及膜電極b與中間電極之間的保險 絲元件部份能夠以所定的優先順序來熔斷之方式，使膜電 Q 極a與中間電極的間隔及與膜電極b與中間電極的間隔或 相對於兩保險絲元件部份的中間電極的緣端形狀有所不同 〇 本案的請求項1 1之附電阻的溫度保險絲，係於請求 項1之附電阻的溫度保險絲中，保險絲元件係以熔劑所覆 蓋。 本案的請求項1 2之附電阻的溫度保險絲，係於請求 項1之附電阻的溫度保險絲中，構成一絕緣密封物，其係 由：在基板的一面上與熔劑接觸而以所定的高度來配置之 -9- 200933683 保護薄板、及在該薄板與基板一面之間包圍熔劑來配置之 硬化樹脂所構成。 本案的請求項1 3之附電阻的溫度保險絲，係於請求 項1之附電阻的溫度保險絲中，以保險絲元件能夠在FET 的容許溫度下熔斷之方式來設定保險絲元件的融點。 本案的請求項14之附電阻的溫度保險絲，係於請求 項1之附電阻的溫度保險絲中，帶狀引線導體C的長度方 0 向熱電阻係比帶狀引線導體A或B的長度方向熱電阻更高 〇 本案的請求項1 5之附電阻的溫度保險絲，係於請求 項1 4之附電阻的溫度保險絲中，帶狀引線導體C的材質 爲鐵系，帶狀引線導體A及B的材質爲銅系。 本案的請求項16之電池保護用電路板，其特徵爲： 在配線板上取間隔來安裝順向彼此相反的F E T，使如 請求項1〜1 5中任一項所記載之附電阻的溫度保險絲的基 0 板部的絕緣密封物側朝向配線板側來收容於FET間的空間 ，將帶狀引線導體A、B抵接於一方的FET上，將帶狀引 線導體C抵接於他方的FET上面，使帶狀引線導體A、B 、C接合於配線板的配線圖案的所定位置。 〔發明的效果〕 (1)可將基板他面的全面使用於膜電阻端子用的膜 電極及膜電阻的形成，可不用擴大其外廓來確保膜電阻形 成空間，可保證附電阻的溫度保險絲本體部的小型性。 -10- 200933683 (2)可將基板他面的膜電阻設置成對基板一面的中 間膜電極兩側的各保險絲元件部份隔開遠近的距離，可使 —方的保險絲元件部份比他方的保險絲元件部份還要確實 地快熔斷。 (3 )如圖6所示，在隔一間隔安裝的FET之間，收 容附電阻的溫度保險絲的絕緣密封物5，將各帶狀引線導 體（A，B)、（：乘載於各FET的（Μ) 、N的上面時，沒 Q 有比帶狀引線導體的上面水平還要突出至上側的部份，安 裝所必要的空間是形成〔（FET的安裝高度）+ (帶狀引 線導體的厚度）〕，可提供一種充分薄的二次電池保護用 電路板。 (4 )因爲膜電阻r的引線導體之帶狀引線導體C的 長度方向熱電阻被形成高，所以可良好地防止從該引線導 體C漏出膜電阻發熱，而使效率佳地傳達至保險絲元件， 因此即使膜電阻的發熱所耗費的電力低，還是可使保險絲 〇 元件良好地熔斷作動。並且，可提高保險絲元件的熔斷性 降低保險絲元件不熔斷的危險性，即使在高運轉電力的基 礎下也可排除保險絲元件的不熔斷來充分地迴避膜電阻的 爆裂破斷。因此，可擴張能夠使用附電阻的溫度保險絲的 運轉電力範圍。 【實施方式】 以下，一面參照圖面，一面說明本發明之附電阻的溫 度保險絲的實施例。 -11 - 200933683 圖1是表示請求項1的實施例’圖1的（/)是省略 絕緣密封物來圖示的上面圖，圖1的（p)是背面圖’圖1 的（Λ )是圖1的（Ο的Λ - λ剖面圖。 在圖1的（彳）中，1是耐熱性、熱良傳導性的絕緣基 板例如陶瓷板。a及b是形成於絕緣基板的一面的兩側之 膜電極，2是中間電極，藉由導體膏例如銀膏的印刷•燒 附所形成。3是保險絲元件’跨越兩側膜電極a、b及中間 膜電極2來配設，熔接膜電極a、b、2的交叉處。保險絲 元件3是被區分成夾著中間膜電極2的部份η及m°在保 險絲元件3塗佈有熔劑，但其圖示省略。A、B是分別接 合於兩側膜電極a、b的帶狀引線導體’基板1的前側的 兩角落被局部沖裁’在各帶狀引線導體A、B’如圖1的 (Λ)所示，在接近缺口緣端的位置形成有上升至基板的 他面側的階差e，階差e的上側的面α ( β )對基板他面10 而言僅帶狀引線導體A、Β的厚度位於上側。 在圖1的（口）中，41、42是設於基板他面10上之前 後的膜電極’與上述基板一面的膜電極a、b同様藉由導 體膏的印刷·燒附來設置。r是設於前後的膜電極41、42 間的膜電阻，藉由電阻膏例如氧化釕粉末膏的印刷•燒附 來設置。在膜電阻r上設有保護膜例如玻璃燒附膜g。前 後的膜電極41、42的一方42是藉由貫通孔24來接線至 基板一面的中間膜電極2。c是附設於前後膜電極41、42 的他方41的側部，C是帶狀引線導體’前端部會在上述 側部c以面接合來接合。5是覆蓋基板一面101的絕緣密 -12-[Technical Field] The present invention relates to a thermal fuse with a resistor, for example, as a thermal fuse attached to a secondary battery protection circuit body. [Prior Art] When a secondary battery such as a lithium ion battery is used as a Φ power source for a portable electronic device, a secondary battery unit and a protection circuit are housed in the container, and the protection circuit is provided with an overcharge prevention switch and an overdischarge prevention switch. In addition, the fuse portion that interrupts the circuit is non-recoverable when the switch cannot be processed. FIG. 4 is an example of a protection circuit for the secondary battery, and the FET (N) and overdischarge are used for the overcharge prevention switch. A temperature fuse Αο is provided to prevent the switch FET ( Μ ) from being connected with a resistor. In the thermal fuse with the resistor, the two fuse elements η and m are arranged in series, and a resistor r such as a film resistor is thermally coupled, and the fuse elements can be partially blown by the energization heat of the resistor. The two fuse elements are electrically connected to the resistor. S is a 1C control unit. When charging is performed, overcharge is detected, an overcharge prevention signal is generated, and the overcharge prevention FET is turned on. When discharging, an overdischarge is detected to generate an overdischarge prevention signal, and an overdischarge prevention FET is generated. Open. When the FETs are unable to process, an ON signal is sent from the 1C circuit S to the transistor Tr, and the resistor Tr is turned on, and the secondary battery is used as a power source to energize and heat the resistor r of the temperature resistor Αο. This heat causes the fuse element-4-200933683 to be blown, and the secondary battery and the load (which is the charging source during charging) are blocked. In the past, the temperature fuse with the resistor is shown in Fig. 9(彳). One surface 101 of the insulating substrate 1 is provided with two membrane electrodes a, b and an intermediate membrane electrode 2, and the fuse element 3 is connected across the membrane electrodes a, b, 2, and a flux is applied to the fuse element 3, As shown in FIG. 9(D), on both sides 10 of the insulating substrate 1, the film electrodes a' and b1 which are electrically connected to the film electrodes a and b through the through holes are provided, and the film electrodes a are provided. ', b' joins the strip lead conductors A, B, and the film electrodes 41, 42 are provided before and after the same substrate 10, and the ones 42 of the front and rear film electrodes 41, 42 are turned on by the through holes 24 and the above The interlayer membrane electrode 2 is provided with a membrane resistance r between the front and rear membrane electrodes 41 and 42 It is proposed that the other side of the film electrodes 41 and 42 is bonded to the strip-shaped lead conductor C, and the substrate is covered with the insulating sealing material 5 as shown in FIG. 9 (Patent Document 1) [Patent Document 1] SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In the above-mentioned thermal fuse with electric resistance, it is necessary to set the plane size of the substrate surface to be the same as the film resistance r and its terminal. In the main space necessary for the formation of the membrane electrodes 41 and 42, the subspace necessary for the formation of the membrane electrode a' and b1 for the fuse element lead conductor connection must be provided with a wider space than the main space, which is disadvantageous for the resistance. Small guarantee for the body part of the thermal fuse. -5- 200933683 In the above secondary battery protection circuit, in the charging shown in FIG. 4, the charging element D side fuse element portion η is preferentially blown over the secondary battery side fuse element portion m, and the first It is safe to release the power source d with a large power. However, in the above-mentioned temperature-fuse with a resistor, it is difficult to surely ensure this preferential blow. In the above-described thermal fuse with the resistance, as described above, the fuse element 3 is blown by the heat generated by the film resistance r when the protection circuit is abnormal, and the fuse element 3 is blown, so that the above-mentioned calorific value of the film resistance r is obtained. (Electric power) is too small to operate, and there is a lower limit for the operating power. If the power applied to the film resistor r is a large power, the fuse element is not blown, and the film resistance may be broken or broken due to large electric power. . However, in the case of a conventional thermal fuse with a resistor, the lower limit of the operation power is relatively high, and the upper limit of the operational power of the fuse element is relatively low, and the entire operating power range is also uncomfortable. The object of the present invention is to have a fuse φ element portion which is arranged in parallel with each other on one surface of the substrate, and a film resistor having a film resistance on the other side of the substrate, and a fuse for the resistance of the fuse element to be blown by the electric resistance of the film resistor is well The miniaturization of the main body portion is achieved, and the fuse element portion of one of the fuse element portions is surely blown preferentially, and the secondary battery protection circuit body of the thermal fuse with the resistor is miniaturized. Also, expand the range of possible operating power for the use of the temperature fuse with the resistor. (Means for Solving the Problem) -6- 200933683 The temperature fuse of claim 1 of the present invention is characterized in that: on both sides of the substrate, there are two membrane electrodes a, b and an intermediate membrane electrode, which straddle the same The membrane electrode is provided with a fuse element, and the membrane electrodes on both sides are joined to the front ends of the strip-shaped lead conductors A and B. One of the substrates is covered with an insulating seal, and the front and back films are provided on the other surface of the substrate. The electrode is provided with a membrane resistance across the front and rear membrane electrodes, and one of the two membrane electrodes before and after is electrically connected to the intermediate membrane electrode ' with respect to the fuse element in the other two membrane electrodes The membrane electrode is provided with a side portion c, and the front end portion of the strip-shaped lead conductor C is joined to the side portion c by surface contact, and the strip-shaped lead conductors A and B are formed to rise to the substrate at the edge of the substrate near the edge of the substrate. The step on the side of the face, the height difference between the upper side of the step and the other side of the substrate is almost equal to the thickness of the strip lead conductor C. The temperature-attached thermal fuse of claim 2 of the present invention is characterized in that: on both sides of the substrate, there are two membrane electrodes a and b and an intermediate membrane electrode, and fuse elements are provided across the membrane electrodes on both sides. Each of the film electrodes Q and a is provided with a hole leading to the other side of the substrate, and the front end is bent into a hook shape, and the hook-shaped front end portion in a state in which the vicinity of the front end is in contact with the substrate is received to the other side from the substrate. The holes and the solder on the side are filled to the respective holes, and the strip lead conductors A and B are connected to the film electrodes a and b, and the front and rear film electrodes are provided on the other surface of the substrate, and the front and rear films are spanned. The electrode is provided with a membrane resistance, and one of the two membrane electrodes is electrically connected to the intermediate membrane electrode with respect to the fuse element, and the membrane electrode of the same membrane electrode is provided with a side c, The front end portion of the lead conductor C is joined to the side portion c by surface contact, and the substrate is covered with an insulating seal 200933683. The temperature fuse of claim 3 of the present invention is characterized in that: on one side of the substrate, there are two membrane electrodes a, b, an intermediate membrane electrode and a side membrane electrode, across the membrane electrodes a, b and the intermediate membrane The electrode is provided with a fuse element, and an auxiliary film electrode a", b" which is electrically connected to the film electrodes a and b through the through hole is provided on the other surface of the substrate, and the strip conductors A and B are bonded to each other by surface contact. The auxiliary membrane electrode a", b" has a membrane electrode on the other side of the substrate, and a membrane resistor is provided across the front and rear membrane electrodes, and one of the two membrane electrodes before and after is electrically charged. Wiring to the intermediate film electrode of the fuse element, the other of the front and rear film electrodes is electrically connected to the side film electrode on one side of the substrate, and the front end of the strip lead conductor C is bonded to the side film electrode. The stepped portion that rises to the other side of the substrate via the notch portion of the substrate facing the joint is formed on the strip lead conductor C, and one of the substrates is covered with an insulating seal. Resistance temperature The fuse is attached to the thermal fuse of the resistor of claim 1, and the electrical connection of one of the front and rear membrane electrodes to the intermediate membrane electrode of the fuse element is performed through the through hole. The temperature fuse of the resistor of claim 5 is in the temperature fuse of the resistor of claim 1, and the thickness of the strip conductors A, B, and C is equal. The temperature fuse of the resistor of claim 6 of the present invention is In the temperature fuse of the resistor of claim 1, the fuse element is composed of a plurality of parallel wires. -8 - 200933683 The temperature fuse of the resistor of claim 7 of the present invention is the temperature of the resistor of claim 1. In the fuse, the thickness of the substrate is 450~250μχ, and the bonding of the strip lead conductor A, Β or C to the membrane electrode is performed by soldering. The temperature fuse of the resistor of claim 8 of the present invention is claimed in claim 7. In the thermal fuse with the resistor, the melting point of the lead conductor bonding solder is higher than the melting point of the fuse element. Q The temperature fuse of the resistor of claim 9 is In the thermal fuse of the resistor of claim 7 or 8, in the membrane electrode a or b, from the junction of the strip conductor A or B to the membrane electrode a or b to the junction of the membrane electrode & or b and the fuse element A solder diffusion prevention barrier is provided between the heat dissipation fuse of claim 10 of the present application, in the temperature fuse of the resistor of claim 1, so that the fuse element portion between the membrane electrode a and the intermediate electrode And the portion of the fuse element between the membrane electrode b and the intermediate electrode can be blown in a predetermined priority order to make the interval between the plasma electrode Q a and the intermediate electrode and the interval between the membrane electrode b and the intermediate electrode or relative to The shape of the edge of the intermediate electrode of the two fuse element portions is different. The temperature fuse of the resistor of claim 1 of the present invention is in the temperature fuse of the resistor of claim 1, and the fuse element is covered by the flux. The temperature fuse of the claim 1 of the present invention is attached to the temperature fuse of the resistor of claim 1, and constitutes an insulating seal which is contacted with the flux on one side of the substrate at a predetermined height. -9-200933683 The protective sheet is composed of a hardened resin disposed between the sheet and the substrate and surrounded by a flux. The temperature fuse of the resistor of claim 1 of the present invention is in the temperature fuse of the resistor of claim 1, and the melting point of the fuse element is set such that the fuse element can be blown at the allowable temperature of the FET. The temperature fuse of the resistor of claim 14 of the present invention is in the temperature fuse of the resistor of claim 1, the length of the strip conductor C is 0, and the thermal resistance is hotter than the length of the strip conductor A or B. The higher the resistance, the temperature fuse of the resistor of claim 1 of the present invention is in the temperature fuse of the resistor of claim 14, the strip conductor C is made of iron, and the strip conductors A and B are The material is copper. The battery protection circuit board of claim 16 of the present invention is characterized in that: the FETs of the opposite directions are mounted on the wiring board, and the temperature of the resistors as described in any one of claims 1 to 15 is set. The insulating sealing member side of the base plate portion of the fuse is housed in the space between the FETs toward the wiring board side, and the strip-shaped lead conductors A and B are brought into contact with one of the FETs, and the strip-shaped lead conductor C is brought into contact with the other side. On the FET, the strip conductors A, B, and C are bonded to a predetermined position of the wiring pattern of the wiring board. [Effects of the Invention] (1) The entire surface of the substrate can be used for the formation of the membrane electrode and the membrane resistor for the membrane resistor terminal, and the membrane resistor can be formed without space expansion, and the temperature fuse of the resistor can be secured. The small size of the body part. -10- 200933683 (2) The film resistance of the substrate can be set to be a distance between the fuse element parts on both sides of the intermediate film electrode on one side of the substrate, so that the fuse element part can be more than the other side. The fuse element part must also be surely blown quickly. (3) As shown in Fig. 6, between the FETs mounted at intervals, an insulating seal 5 of a thermal fuse with a resistor is placed, and each of the strip conductors (A, B) and (: is carried by each FET) (Μ), the top of N, no Q has a portion that protrudes above the upper level of the strip lead conductor to the upper side, and the space necessary for mounting is formed [(the mounting height of the FET) + (the strip lead conductor) (4) A sufficiently thin secondary battery protection circuit board can be provided. (4) Since the longitudinal direction thermal resistance of the strip conductor conductor C of the lead conductor of the film resistance r is formed high, it is possible to satisfactorily prevent Since the lead conductor C leaks out of the film resistance and is efficiently transmitted to the fuse element, even if the power consumed by the heat generation of the film resistor is low, the fuse element can be blown well, and the fuse element can be blown. It reduces the risk that the fuse element will not be blown, and even if it is based on high operating power, the fuse element can be prevented from being blown to sufficiently avoid the bursting of the film resistor. Therefore, the expansion can be performed. The operating power range of the thermal fuse with a resistor. [Embodiment] Hereinafter, an embodiment of the thermal fuse with a resistor according to the present invention will be described with reference to the drawings. -11 - 200933683 FIG. 1 is a view showing an embodiment of the claim 1. '() is the upper diagram shown by omitting the insulating seal, and (p) of FIG. 1 is the rear view '(1) of Fig. 1 is the Λ-λ sectional view of Fig. 1 In the case of (1), 1 is an insulating substrate such as a ceramic plate which is heat-resistant and thermally conductive, and a and b are film electrodes formed on both sides of one surface of the insulating substrate, and 2 is an intermediate electrode, for example, a conductor paste. The printing and burning of the silver paste is formed. 3 is that the fuse element is disposed across the membrane electrodes a and b and the intermediate membrane electrode 2, and the intersection of the welding membrane electrodes a, b, and 2. The fuse element 3 is a zone. The portion η and m° sandwiching the interlayer film electrode 2 are coated with a flux on the fuse element 3, but the illustration thereof is omitted. A and B are strip conductors' substrates bonded to the film electrodes a and b on both sides. The two corners of the front side of 1 are partially punched 'in each of the strip lead conductors A, B' as As shown by (Λ), a step e rising to the other side of the substrate is formed at a position close to the edge of the notch, and the upper surface α (β ) of the step e is only a strip lead to the substrate 10 The thicknesses of the conductors A and Β are located on the upper side. In the (port) of Fig. 1, 41 and 42 are the film electrodes ' before and after the substrate 10, and the film electrodes a and b on one side of the substrate are the same as the conductor paste. It is provided by printing and baking. r is a film resistance between the film electrodes 41 and 42 provided before and after, and is provided by printing and baking of a resistor paste such as yttrium oxide powder paste. A protective film is provided on the film resistor r. For example, the glass burnt film g. One of the front and rear film electrodes 41 and 42 is an intermediate film electrode 2 which is connected to one side of the substrate by the through hole 24. c is a side portion of the other side 41 attached to the front and rear film electrodes 41, 42, and C is a front end portion of the strip lead conductor. The front end portion is joined by surface bonding at the side portion c. 5 is an insulating layer covering one side of the substrate 101 -12-
G 200933683 封物，例如圖1的（Λ)所示，由在基板一面上與蹈 觸來配置的保護薄板例如陶瓷薄板、玻璃纖維薄板及 保護薄板51與基板一面101之間包圍熔劑而變硬的 性樹脂例如環氧樹脂52所構成。上述帶狀引線導體 及帶狀引線導體C皆是厚度相等，如圖1的（Λ )所 從基板他面僅以其厚度高的水平來延伸於同一面内。 圖2是表示請求項2的實施例，圖2的（〇是 絕緣密封物來圖示的上面圖，圖2的（0)是背面圖， 的（Α)是圖2的（4)的Λ-Λ剖面圖。 在圖2的（彳）中，1是耐熱性、熱良傳導性的絕 板例如陶瓷板。a、b是形成於絕緣基板1的一面101 側之膜電極，2是中間電極，藉由導體膏（paste)例 膏的印刷·燒附來形成。3是保險絲元件，跨越兩側 極a、b及中間膜電極2來配設，熔接與膜電極a、 的交叉處。保險絲元件3是被區分成夾著中間膜電極 部份η及m。在保險絲元件3塗佈有熔劑，但其圖示 。a’、b'是設於上述各膜電極a、b的引線導體接合用 A、B是帶狀引線導體，如圖2的（Λ)所示，前端會 成鉤狀，此鉤部會在上述的孔a'、b'由基板他面10側 ，藉由焊錫充塡至a·、b’，前端部會在面接觸於基板 10的狀態下接合於上述的各膜電極a、b。 在圖2的（D)中，41、42是設於基板他面10上 後的膜電極，與上述基板一面101的膜電極a、b同 由導體膏的印刷·燒附來設置。r是設於前後的膜電;| 劑接 在該 硬化 A、B 示， 省略 圖2 緣基 的兩 如銀 膜電 b、2 2的 省略 孔， 彎曲 收容 他面 —L— ·» /- 之即 樣藉 亟41 -13- 200933683 、42間之膜電阻，藉由電阻膏例如氧化釕粉末膏的印刷· 燒附來設置。在膜電阻上設有保護膜例如玻璃燒附膜g。 前後的膜電極41、42之一方42是藉由貫通孔24來接線 至基板一面101的中間膜電極2。c是附設於前後膜電極 41、42的他方41之側部，C是帶狀引線導體，前端部會 在上述側部c以面接觸接合。5是覆蓋基板一面101的絕 緣密封物，例如圖2的所示，由在基板一面1〇1上 H 與熔劑接觸而配置的保護薄板5 1例如陶瓷薄板、玻璃纖 維薄板及在該保護薄板51與基板一面101之間包圍熔劑 而變硬的硬化性樹脂52例如環氧樹脂所構成。 上述帶狀引線導體A、B及帶狀引線導體C皆是厚度 相等、如圖2的（Λ )所示，從基板他面1 0僅以該引線導 體厚度高的水平來延伸於同一面内。 圖3是表示請求項3的實施例，圖3的（〇是省略 絕緣密封物來圖示的上面圖，圖3的（0)是背面圖，圖3 φ 的（Λ )是圖3的（〇的Λ-Λ剖面圖。 在圖3的（彳）中，1是耐熱性、熱良傳導性的絕緣基 板例如陶瓷板。a、b是形成於絕緣基板1的一面1〇1的兩 側之膜電極，2是中間電極，藉由導體膏例如銀膏的印刷 .燒附來形成。3是保險絲元件，跨越兩側膜電極a、b及 中間膜電極2來配設，熔接與膜電極a、b、2的交叉處。 保險絲元件3是被區分成夾著中間膜電極2的部份η及m 。在保險絲元件3塗佈有熔劑，但其圖不被省略。a "、b" 是設於基板他面10的輔助膜電極，藉由貫通孔a’、V來導 -14- 200933683 通至上述膜電極a、b。A、B是以面接觸來接合於各個輔 助膜電極a”、b"的帶狀引線導體。 在圖3的（P)中，41、42是設於基板他面10上之前 後的膜電極，與上述基板一面101的膜電極a、b同様藉 由導體膏的印刷·燒附來設置。r是設於前後的膜電極41 、42間之膜電阻，藉由電阻膏例如氧化釕粉末膏的印刷· 燒附來設置。在膜電阻上設有保護膜例如玻璃燒附膜g。 前後的膜電極41、42之一方42是藉由貫通孔24來 接線至基板一面101的中間膜電極2。 在圖3的（〇中，c是設於基板一面101的側膜電極 ，藉由貫通孔240來接線至基板他面10之上述前後膜電 極41、42的他方41。C是接合至基板一面101的側膜電 極c之帶狀引線導體，經由在基板緣端面對側膜電極c來 形成的凹溝〔在圖3的（口） （ Λ )中以c ”來表示〕，如圖 3的（Λ )所示形成有上升至基板他面側的階差e，帶狀引 線導體C的前端會接合至基板一面101的側膜電極c，如 圖3的（Λ )所示因爲上述階差e而上升至基板他面1 〇側 ，延伸於與基板他面10同一面内。 5是覆蓋基板一面1 0 1的絕緣密封物，例如圖3的（Λ )所示，由在基板一面101上與熔劑接觸而配置的保護薄 板51例如陶瓷薄板、玻璃纖維薄板及在該保護薄板51與 基板一面101之間包圍熔劑而變硬的硬化性樹脂52例如 環氧樹脂所構成。 上述帶狀引線導體Α、Β及帶狀引線導體C皆是厚度 -15- 200933683 相等，從基板他面僅以其厚度高的水平來延伸於同一面内 〇 在上述哪個實施例中，皆是使帶狀引線導體A、B與 帶狀引線導體C的厚度相等，但當帶狀引線導體A、B與 帶狀引線導體C的厚度相異時，可調整上述階差e的高度 ，藉由該調整來吸收其厚度的差，而使帶狀引線導體A、 B的上面與帶狀引線導體C的上面能夠位於同一面上。 Q 爲了儘可能縮小上述附電阻的溫度保險絲的膜電阻的 外廓尺寸，儘可能擴大每單位面積的電阻値，因此被要求 儘可能弄薄膜電阻的厚度。然而，在電阻膏的印刷上，膜 厚度的薄度有限。通常，膜電阻厚度是5μιη〜15μπι，在二 次電池保護電路用附電阻的溫度保險絲所被要求的膜電阻 的尺寸是縱方向（電流方向）長度1.2mmx寬1.5mm。 在本發明之附電阻的溫度保險絲中，是將基板他面10 的幾乎全面使用於膜電阻r及其端子用膜電極41、42的 〇 形成，可在基板的他面確保膜電阻的形成所必要的上述空 間，可擔保小型性。 圖4是裝入了本發明之附電阻的溫度保險絲之二次電 池保護電路的充電時的等效電路。A〇是本發明之附電阻 的溫度保險絲，η及m是保險絲元件部份，r是膜電阻，N 是過充電防止開關用FET，Μ是過放電防止開關用FET， S是1C控制部，Tr是電晶體，Ε是二次電池，D是充電源 〇 此充電時，使充電源D側的保險絲元件部份η比二次 -16- 200933683 電池E側的保險絲元件部份m更先熔斷，形成先放開 大的充電源D爲安全。 然而，在本發明之附電阻的溫度保險絲中，是使 他面的膜電阻r對基板一面的保險絲元件3的中心偏 保險絲元件部份η接近膜電阻r，保險絲元件部份m ，因此可使保險絲元件部份η比保險絲元件部份m更 斷。 φ 亦可使膜電極a與中間電極2的間隔及膜電極b 間電極2的間隔不同、或如圖5 -1或圖5 -2所示使相 兩保險絲元件部份η、m的中間電極2的緣端形狀不 來使膜電極a與中間電極2之間的保險絲元件部份m 電極b與中間電極2之間的保險絲元件部份η能夠以 的優先順序熔斷。 圖6是表示搭載本發明之附電阻的溫度保險絲之 電池保護用電路板，在印刷配線板Ρ安裝過放電防止 Q 用FET ( Ν )及過充電防止開關用 FET ( Μ)，將本 之附電阻的溫度保險絲的絕緣密封物5朝下側來收 FET間的空間，使帶狀引線導體A，Β乘載於一方的 的上面，且使帶狀引線導體C乘載於他方的FET的 ，將各帶狀引線導體A，B，C連接至印刷配線板ρ 線導體的所定位置。1C控制電路部亦被搭載，但比圖 高度Η更低。 在該二次電池保護用電路板中，附電阻的溫度保 的基板他面10是處於比帶狀引線導體A、B、C的上 功率 基板 在， 較遠 先熔 與中 對於 同， 及膜 所定 二次 開關 發明 容於 FET 上面 的配 示的 險絲 面更 -17- 200933683 低的位置，附電阻的溫度保險絲的本體部對引線導體的上 面不會突出，可將最大安裝厚度Η止於FET的安裝高度h 加上帶狀引線導體A、B、C的厚度者，可將二次電池保 護用電路板的最大厚度Hmax壓在2000μιη程度’而容易 進行往電池容器内的收容。 在附電阻的溫度保險絲中，基板（陶瓷板）是設成薄 厚，爲450μιη〜250μιη，而使能夠迅速地傳達膜電極的通 0 電發熱至保險絲元件。若在該薄厚的陶瓷板的膜電極藉由 點（spot )熔接等來熔接帶狀引線導體，則會擔心陶瓷板 裂縫破損。 因此，膜電極與帶狀引線導體的接合，較理想是藉由 錫焊來進行。 本發明之附電阻的溫度保險絲，是作爲圖4所示的二 次電池保護電路的保險絲使用，檢測電池電壓，一旦電池 電壓形成設定値以上，則會根據來自IC控制電路的信號 Q 導通電晶體Tr’膜電阻T會以充電源D或二次電池E作 爲電源來通電發熱，而熔斷保險絲元件部份n、m。並且 ，FET的容許溫度也是可以能夠使保險絲元件熔斷的方式 來設定保險絲元件的融點’可使用融點1 2 5。(：、1 4 5。(：的保 險絲元件。 上述帶狀引線導體A’ B’ C之對膜電極a，b，c的 錫焊溫度是設定成比保險絲元件的融點更高，在帶狀引線 導體的錫焊接合後’進行保險絲元件與兩側膜電極及中間 膜電極的熔接。此熔接可使用雷射熔接、電阻熔接、反流 -18- 200933683 (reflow)熔接。 如圖7所示，從兩側膜電極a ( b )與保險絲元件2的 各熔接處到往該等膜電極（b)之帶狀引線導體A(B)的 錫焊處爲止的距離，爲了基板的縮小化，最好是極力縮短 ，且在其間設置焊錫的浸潤擴散遮斷勢壘（barrier) 6a ( 6b )。例如最好使玻璃糸融著。藉由該構成，即使從兩側 的各膜電極a ( b )與保險絲元件2的各熔接處到往該等膜 Q 電極a(b)之帶狀引線導體A(B)的接合處爲止的間隔 變窄，在接合保險絲元件時，還是可防止保險絲元件浸潤 擴散來連接至帶狀引線導體，可防止保險絲元件的合金組 _ 成的變化所造成的融點變動，因此可防止作動偏差。在圖 7中，f是表示熔劑。 在本發明的附電阻的溫度保險絲中，爲了使動作速度 迅速化，除了上述基板的薄厚化以外，如圖8的（彳）及 圖8的（卩）〔圖8的之D-P剖面圖〕所示，藉由並 〇 列多條素線例如並列2條素線3 0，3 0來構成保險絲元件3 亦爲有效。亦即，即使保險絲元件的剖面積相同，若設爲 多條數’則可將每一條的剖面弄細，儘可能使加快熔斷， 可使動作速度迅速化。G 200933683 The seal, for example, as shown in Fig. 1, is hardened by a flux between a protective sheet such as a ceramic sheet, a glass fiber sheet, and a protective sheet 51 and a substrate side 101 disposed on one side of the substrate. The resin is composed of, for example, an epoxy resin 52. The strip lead conductor and the strip lead conductor C are all of equal thickness, and extend from the other side of the substrate in the same plane as the thickness of the substrate as shown in Fig. 1 (Λ). Fig. 2 is a view showing an embodiment of the claim 2, wherein (〇 is an upper view shown as an insulating seal, (0) of Fig. 2 is a rear view, and (Α) is a Λ of (4) of Fig. 2; In Fig. 2 (彳), 1 is a heat-resistant, heat-conductive plate such as a ceramic plate. a, b are film electrodes formed on one side 101 side of the insulating substrate 1, and 2 is the middle. The electrode is formed by printing and baking of a paste paste. 3 is a fuse element which is disposed across the both sides a and b and the interlayer film electrode 2, and is welded to the intersection of the membrane electrode a. The fuse element 3 is divided into sandwiching the intermediate film electrode portions η and m. The fuse element 3 is coated with a flux, but is shown in the drawings. a', b' are lead conductors provided at the respective film electrodes a, b. The bonding A and B are strip conductors, and as shown in (Λ) of Fig. 2, the front end is formed in a hook shape, and the hook portion is formed on the substrate 10 side by the holes a' and b' by soldering. The front end portion is bonded to the respective film electrodes a and b while being in surface contact with the substrate 10. In (D) of Fig. 2, 41 and 42 are provided on the substrate side. 10 on The subsequent membrane electrode is provided in the same manner as the membrane electrode a and b on the substrate side 101, and is printed and burned by the conductor paste. r is the membrane electricity provided before and after; the agent is attached to the hardening A and B, and the illustration is omitted. 2 The two edges of the rim are like the silver film b, the omitting hole of the 2 2, bending to accommodate the other side - L - ·» / - is the same as the film resistance of 41 -13- 200933683, 42, by the resistor paste, for example The yttrium oxide powder paste is printed and burned, and a protective film such as a glass burnt film g is provided on the film resistor. One of the front and rear film electrodes 41 and 42 is connected to the substrate side 101 through the through hole 24. The intermediate film electrode 2, c is a side portion of the other side 41 attached to the front and rear film electrodes 41, 42, and C is a strip-shaped lead conductor, and the front end portion is joined by surface contact at the side portion c. 5 is insulation covering the substrate side 101. The sealing material, for example, as shown in FIG. 2, is surrounded by a protective sheet 5 1 such as a ceramic sheet, a glass fiber sheet, and a flux between the protective sheet 51 and the substrate side 101, which is disposed on the substrate 1 〇1 with H in contact with the flux. The hardened curable resin 52 is made of, for example, an epoxy resin. The lead conductors A and B and the strip conductor C are all of equal thickness, as shown by (Λ) in Fig. 2, and extend from the substrate surface 10 only in the same plane at a level at which the thickness of the lead conductor is high. 3 is an embodiment showing the request item 3, and FIG. 3 is a top view of the illustration in which the insulating seal is omitted, (0) of FIG. 3 is a rear view, and (Λ) of FIG. 3 is a view of FIG. In the (彳) of Fig. 3, 1 is an insulating substrate such as a ceramic plate having heat resistance and heat conductivity, and a and b are formed on both sides of one surface 1〇1 of the insulating substrate 1. The membrane electrode, 2 is an intermediate electrode, which is formed by printing and baking of a conductor paste such as a silver paste. 3 is a fuse element which is disposed across the membrane electrodes a and b on both sides and the intermediate membrane electrode 2, and is welded to the intersection of the membrane electrodes a, b, and 2. The fuse element 3 is a portion η and m which are divided to sandwich the intermediate film electrode 2. The fuse element 3 is coated with a flux, but its drawing is not omitted. a ", b" is an auxiliary film electrode provided on the substrate 10, and leads to the above-mentioned film electrodes a and b through the through holes a' and V to conduct -14-200933683. A and B are strip conductors which are bonded to the respective auxiliary film electrodes a" and b" by surface contact. In (P) of Fig. 3, 41 and 42 are film electrodes before and after the substrate 10 is provided. The film electrodes a and b on the substrate side 101 are provided by printing and baking of the conductor paste. r is a film resistance between the film electrodes 41 and 42 provided before and after, and a resistor paste such as yttrium oxide powder paste The film is made of a protective film such as a glass burnt film g. One of the front and rear film electrodes 41 and 42 is connected to the intermediate film electrode 2 of the substrate side 101 through the through hole 24. In Fig. 3, c is a side film electrode provided on one side 101 of the substrate, and is connected to the other side of the front and rear film electrodes 41, 42 of the substrate 10 by a through hole 240. C is bonded to the substrate. The strip-shaped lead conductor of the side film electrode c of the one side 101 is represented by a groove formed by the opposite-side film electrode c at the edge of the substrate edge (in the (port) of FIG. 3 (c)", as shown in the figure The (e) of 3 is formed with a step e rising to the other side of the substrate, and the leading end of the strip lead conductor C is joined. As shown in (Λ) of FIG. 3, the side film electrode c of the substrate side 101 rises to the side of the substrate 1 side due to the step e, and extends in the same plane as the substrate 10. 5 is a cover substrate side 1 The insulating sealing material of 0 1 is, for example, a protective sheet 51 disposed on the substrate surface 101 in contact with the flux, such as a ceramic thin plate, a glass fiber sheet, and a side of the protective sheet 51 and the substrate 101, as shown in FIG. The curable resin 52 which is hardened by encapsulating the flux is made of, for example, an epoxy resin. The strip lead conductors Α, Β and the strip lead conductor C are all equal in thickness -15 to 200933683, and the thickness of the substrate is only high. The level extends in the same plane. In the above embodiment, the strip conductors A, B and the strip conductor C are equal in thickness, but when the strip conductors A, B and the strip conductor are When the thicknesses of C are different, the height of the step e can be adjusted, and the difference in thickness can be absorbed by the adjustment, so that the upper surfaces of the strip conductors A and B and the upper surface of the strip conductor C can be located on the same side. On. Q In order to shrink as much as possible The outer dimensions of the film resistance of the temperature fuse with the resistance increase the resistance 每 per unit area as much as possible, so it is required to make the thickness of the film resistance as much as possible. However, in the printing of the resistance paste, the film thickness is limited. In general, the film resistance is 5 μm to 15 μm, and the size of the film resistor required for the thermal fuse with a resistor for the secondary battery protection circuit is a longitudinal direction (current direction) length of 1.2 mm x a width of 1.5 mm. In the thermal fuse, the substrate surface 10 is almost entirely used for the film resistor r and the terminal film electrodes 41 and 42, and the space necessary for forming the film resistance can be ensured on the other side of the substrate. Guaranteed smallness. Fig. 4 is an equivalent circuit of the secondary battery protection circuit incorporating the temperature fuse of the present invention. A〇 is a temperature fuse with a resistor of the present invention, η and m are fuse element parts, r is a film resistor, N is an overcharge prevention switch FET, Μ is an over discharge prevention switch FET, and S is a 1C control unit. Tr is a transistor, Ε is a secondary battery, and D is a charging source. When charging, the fuse element portion η on the charging source D side is blown earlier than the fuse element portion m on the battery side E of the second-16-200933683 battery. It is safe to form a large charging source D first. However, in the temperature fuse of the present invention, the fuse resistor r of the surface of the fuse element 3 on the substrate side is close to the film resistance r, and the fuse element portion m is The fuse element portion η is interrupted more than the fuse element portion m. φ may also be such that the interval between the membrane electrode a and the intermediate electrode 2 and the interval between the electrodes 2 of the membrane electrode b are different, or the intermediate electrodes of the phase two fuse element portions η, m are as shown in FIG. 5-1 or FIG. The edge shape of 2 is such that the fuse element portion η between the fuse element portion m electrode b and the intermediate electrode 2 between the film electrode a and the intermediate electrode 2 can be blown in the priority order. 6 is a circuit board for protecting a battery in which a thermal fuse with a resistor according to the present invention is mounted, and an FET (Ν) for over-discharge prevention Q and an FET for over-charge prevention switch are mounted on a printed wiring board, and the present invention is attached thereto. The insulating seal 5 of the thermal fuse of the resistor receives the space between the FETs toward the lower side, and the strip lead conductor A and the crucible are carried on one of the upper sides, and the strip lead conductor C is carried on the other FET. Each of the strip conductors A, B, and C is connected to a predetermined position of the p-wire conductor of the printed wiring board. The 1C control circuit unit is also mounted, but it is lower than the height of the figure. In the secondary battery protection circuit board, the temperature-protected substrate surface 10 of the resistor is in the upper power substrate than the strip conductors A, B, and C, and is farther in the first and the same, and the film The specified secondary switch is designed to accommodate the dangerous surface of the FET on the lower side of the -17-200933683. The body of the thermal fuse with the resistor does not protrude above the lead conductor, and the maximum mounting thickness can be stopped. When the thickness of the strip conductors A, B, and C is increased, the maximum thickness Hmax of the secondary battery protection circuit board can be reduced to about 2000 μm, and the FET can be easily accommodated in the battery container. In the thermal fuse with a resistor, the substrate (ceramic plate) is made thin and has a thickness of 450 μm to 250 μm, so that the conduction of the membrane electrode can be quickly transmitted to the fuse element. When the strip-shaped lead conductor is welded by the spot welding or the like on the film electrode of the thin ceramic plate, there is a fear that the ceramic plate crack is broken. Therefore, the bonding of the membrane electrode to the strip lead conductor is preferably carried out by soldering. The temperature fuse of the present invention is used as a fuse of the secondary battery protection circuit shown in FIG. 4, and detects the battery voltage. When the battery voltage is set to 値 or higher, the transistor is energized according to the signal Q from the IC control circuit. The Tr' film resistance T is energized by the charging source D or the secondary battery E as a power source, and the fuse element portions n, m are blown. Further, the allowable temperature of the FET is also such that the fuse element can be melted so that the melting point of the fuse element can be set. (:, 1 4 5 (: fuse element. The above-mentioned strip conductor A' B' C is soldered to the film electrodes a, b, c. The soldering temperature is set to be higher than the melting point of the fuse element. After the soldering of the lead conductors is completed, the fuse element is welded to the membrane electrodes and the interlayer membrane electrodes on both sides. The fusion bonding can be performed by laser welding, resistance welding, and reverse flow-18-200933683 (reflow). The distance from each of the two membrane electrodes a ( b ) and the fuse element 2 to the solder joint of the strip conductor A (B) of the membrane electrode (b) is shown for the reduction of the substrate. Preferably, it is preferably shortened, and a solder diffusion barrier 6a (6b) is provided therebetween. For example, it is preferable to melt the glass crucible. With this configuration, even from the film electrodes a on both sides (b) the interval from the fusion of the fuse element 2 to the junction of the strip conductors A (B) of the film Q electrodes a (b) is narrowed, and the fuse can be prevented when the fuse element is joined The component is wetted and diffused to connect to the strip lead conductor to prevent the fuse element from being combined In the case of the thermal fuse with the electric resistance of the present invention, in addition to the above substrate, in order to speed up the operation speed, in the thermal fuse with the electric resistance of the present invention, f is a change in the melting point caused by the change of the gold group _. In addition to thinning, as shown in (彳) of FIG. 8 and (卩) of FIG. 8 (DP cross-sectional view of FIG. 8), by arranging a plurality of prime lines, for example, two parallel lines 3 0, 3 0 is also effective for forming the fuse element 3. That is, even if the cross-sectional area of the fuse element is the same, if the number is 'multiple', the cross section of each strip can be thinned, and the fuse can be accelerated as much as possible, so that the speed of operation can be accelerated. .
在圖4中，A、B、C是對應於帶狀引線導體A、B、C ’在帶狀引線導體A、B中經常有電路電流流動，因此使 用銅、銅合金等通常的導電性材質鍍Sn者。只在異常時 ’電晶體開關Tr會被開啓，在帶狀引線導體C流動電流 ’膜電阻r發熱而使保險絲元件n、m以上述的優先順序 -19- 200933683 熔斷。此情況，帶狀引線導體C，爲了防止膜電阻r的發 熱傳導於該引線導體C而漏洩，而使用熱電阻高的金屬、 例如鐵、鐵合金等鐵系或鎳等鍍Sn者，最好使帶狀引線 導體C的長度方向熱電阻形成比帶狀引線導體A或B的 長度方向熱電阻更高。又，亦可使帶狀引線導體C的寬形 成比帶狀引線導體A或B的寬更細，而使帶狀引線導體C 的長度方向熱電阻形成比帶狀引線導體A或B的長度方向 ❹ 熱電阻更高。此情況也可使帶狀引線導體C的電阻相較於 膜電阻r的電阻還要充分地低，可保證二次電池E或充電 源D之膜電阻r的高效率發熱。 【圖式簡單說明】 圖1是表示本發明之附電阻的溫度保險絲之一實施例 的圖面。 圖2是表示本發明之附電阻的溫度保險絲之別的實施 G 關 H ® ° 圖3是表示本發明之附電阻的溫度保險絲之別的實施 例的圖面。 圖4是表示裝入了本發明之附電阻的溫度保險絲之二 次電池保護電路的等效電路的圖面。 圖5 -1是表示本發明之附電阻的溫度保險絲之別的實 施例的要部圖面。 圖5 -2是表示本發明之附電阻的溫度保險絲之別的實 施例的要部圖面。 -20- 200933683 圖6是表示搭載本發明之附電阻的溫度保險絲的二二欠 電池保護電路板的圖面。 圖7是表示本發明之附電阻的溫度保險絲之別的實施 例的要部圖面。 圖8是表示本發明之附電阻的溫度保險絲之別的實施 例的要部圖面。 圖9是表示以往的附電阻的溫度保險絲的圖面。 φ 【主要元件符號說明】 1 :基板 1 0 :基板他面 1 0 1 :基板一面 a、b :兩側膜電極 2 :中間膜電極 3 :保險絲元件 η、m :保險絲兀件部份 41、42 :前後膜電極 c :前膜電極的側部 r :膜電阻 A、B、C :帶狀引線導體 5 :絕緣密封物 -21 -In FIG. 4, A, B, and C correspond to the strip lead conductors A, B, and C', and circuit current flows in the strip lead conductors A and B. Therefore, a common conductive material such as copper or copper alloy is used. Plated with Sn. Only in the case of an abnormality, the transistor switch Tr is turned on, and the current flows in the strip conductor C. The film resistance r generates heat, and the fuse elements n and m are blown in the above-described priority order -19-200933683. In this case, the strip conductor conductor C is preferably leaked by preventing the heat generation of the film resistor r from being transmitted to the lead conductor C, and it is preferable to use a metal having a high thermal resistance, for example, iron or nickel such as iron or iron alloy, or nickel plating. The longitudinal direction thermal resistance of the strip lead conductor C is formed to be higher than the longitudinal direction thermal resistance of the strip lead conductor A or B. Further, the width of the strip lead conductor C may be made thinner than the width of the strip lead conductor A or B, and the longitudinal direction thermal resistance of the strip lead conductor C may be formed longer than the length direction of the strip lead conductor A or B. ❹ The thermal resistance is higher. In this case as well, the resistance of the strip lead conductor C can be sufficiently lower than the resistance of the film resistor r, and high-efficiency heat generation of the film resistance r of the secondary battery E or the charge source D can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an embodiment of a temperature fuse with a resistor according to the present invention. Fig. 2 is a view showing another embodiment of the thermal fuse with electric resistance of the present invention. G OFF H ® ° Fig. 3 is a view showing another embodiment of the electric resistance resistor of the present invention. Fig. 4 is a view showing an equivalent circuit of a secondary battery protection circuit incorporating a temperature fuse of the present invention. Fig. 5-1 is a plan view showing another embodiment of the temperature fuse of the present invention. Fig. 5-2 is a diagram showing the principal part of another embodiment of the temperature fuse with a resistor according to the present invention. -20- 200933683 Fig. 6 is a view showing a two-two battery protection circuit board on which a temperature fuse of the present invention is mounted. Fig. 7 is a plan view showing another embodiment of a temperature fuse with a resistor according to the present invention. Fig. 8 is a plan view showing another embodiment of a temperature fuse with a resistor according to the present invention. Fig. 9 is a view showing a conventional thermal fuse with a resistor. φ [Description of main component symbols] 1 : Substrate 10 0 : Substrate 10 1 : Substrate side a, b : Both sides of film electrode 2 : Intermediate film electrode 3 : Fuse element η, m : Fuse part 41 42: front and rear film electrode c: side portion of front film electrode r: film resistance A, B, C: strip lead conductor 5: insulating seal 21 -