JP2006221919A - Fuse with substrate type resistor and battery pack - Google Patents

Fuse with substrate type resistor and battery pack Download PDF

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JP2006221919A
JP2006221919A JP2005033239A JP2005033239A JP2006221919A JP 2006221919 A JP2006221919 A JP 2006221919A JP 2005033239 A JP2005033239 A JP 2005033239A JP 2005033239 A JP2005033239 A JP 2005033239A JP 2006221919 A JP2006221919 A JP 2006221919A
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resistor
fuse
metal piece
fusible metal
insulating substrate
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Yasuhiko Tomitaka
康彦 冨高
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Uchihashi Estec Co Ltd
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Uchihashi Estec Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Abstract

<P>PROBLEM TO BE SOLVED: To provide a fuse with a substrate type resistor which can reduce a planar dimension and can improve heat transference from the outside to the fuse (a fusible metal piece). <P>SOLUTION: The fuse with a resistor has the resistor 2 and the fusible metal piece 4 fused with heat generation by conduction of the resistor 2. The resistor 2 is embedded in an insulating substrate 1. Electrodes 32-34 for mounting a fusible metal piece are provided to one face of the insulating substrate in which the resistor is embedded. The fusible metal piece 4 is connected to the electrodes 32-34. The resistor 2 in the insulating substrate 1 is electrically conducted to the electrode 34 for mounting a fusible metal piece through a hole h1 of the insulating substrate 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は基板型抵抗体付きヒューズ、より詳しくは、被保護機器の異常時に抵抗体を通電発熱させ、その発生熱で可溶金属片を溶断させて被保護機器を通電に対し遮断する基板型抵抗体付きヒューズ及びその基板型抵抗体付きヒューズを組み込んだ電池パックに関するものである。   The present invention relates to a fuse with a board-type resistor, and more specifically, a board-type that heats a resistor when the protected device is abnormal, and melts a fusible metal piece with the generated heat to cut off the device to be protected from energization. The present invention relates to a fuse with a resistor and a battery pack incorporating the fuse with a substrate type resistor.

リチウムイオン二次電池やリチウムポリマー二次電池等の二次電池においては、エネルギー密度が高く、異常時にはそのエネルギーが一挙に放出されて危険な状態に曝される可能性が高い。
そこで、これら二次電池の電池パックにおいては、例えば図2において、過充電から電池を保護するために、過充電突入時に生じる電圧変化によってツエナダイオードDを導通させ、これに連動してトランジスターTrを導通させて抵抗体付きヒューズFの抵抗体2を通電発熱させ、この抵抗体2の通電発熱でヒューズ4を溶断させて二次電池Eを充電器Cから遮断することが知られている。(例えば、特許文献1参照)
特開平7−153367号公報
A secondary battery such as a lithium ion secondary battery or a lithium polymer secondary battery has a high energy density, and when it is abnormal, the energy is likely to be released all at once and exposed to a dangerous state.
Therefore, in the battery packs of these secondary batteries, for example, in FIG. 2, in order to protect the battery from overcharging, the Zener diode D is made conductive by the voltage change generated at the time of overcharging, and the transistor Tr is connected in conjunction with this. It is known that the resistor 2 of the fuse F with a resistor is energized and heated, and the fuse 4 is blown by the energized heat of the resistor 2 to disconnect the secondary battery E from the charger C. (For example, see Patent Document 1)
JP-A-7-153367

従来、この抵抗体付きヒューズとしては、セラミックス等の絶縁基板上に膜抵抗を形成し、この膜抵抗上に耐熱性・良熱伝導性の絶縁膜、例えばガラス焼付け膜を設け、この絶縁膜上に配する可溶金属片と前記膜抵抗とを図の点線枠内のように接続するための接続用電極やリード導体接続用電極を印刷・焼付けにより形成し、前記絶縁膜上に可溶金属片を配設し、この可溶金属片と前記膜抵抗とを前記接続用電極により接続し、前記のリード導体接続用電極にリード導体を接続したものが知られている。(例えば、特許文献1参照)   Conventionally, as this fuse with a resistor, a film resistance is formed on an insulating substrate such as ceramics, and a heat-resistant and heat-conductive insulating film such as a glass baking film is provided on the film resistance. A connecting electrode and a lead conductor connecting electrode for connecting the fusible metal piece and the film resistor to be connected to each other as shown in the dotted frame of the figure are formed by printing and baking, and the fusible metal piece is formed on the insulating film. It is known that a piece is disposed, the soluble metal piece and the membrane resistance are connected by the connection electrode, and a lead conductor is connected to the lead conductor connection electrode. (For example, see Patent Document 1)

前記の抵抗体付きヒューズにおいては、膜抵抗上に良熱伝導性の絶縁膜を介して可溶金属片を設けて抵抗体と可溶金属片とを上下にラップさせているから、膜抵抗の発生熱を可溶金属片に効率良く伝達させ得、迅速に動作させることができる。
しかしながら、この抵抗体付きヒューズでは、平面寸法が大きく、電池パック内への装着上支障になることがあり、平面寸法の小サイズ化が要請されている。
In the above-mentioned fuse with a resistor, a soluble metal piece is provided on a film resistor via an insulating film having good heat conductivity, and the resistor and the soluble metal piece are wrapped up and down. The generated heat can be efficiently transmitted to the fusible metal piece and can be operated quickly.
However, this fuse with a resistor has a large planar dimension, which may hinder mounting in the battery pack, and a reduction in the planar dimension is required.

前記電池パックの保護回路においては、一部の回路素子としてFETが使用されており、前記抵抗体付きヒューズをこのFETに装着し、万一FETが異常発熱したときに可溶金属片を溶断させてその異常発熱による被害の拡大を未然に防止することが望まれる。
而して、前記抵抗体付きヒューズの絶縁基板の厚みを可及的に薄くすることが有効であるが、従来の抵抗体付きヒューズでは、セラミックス絶縁基板の薄肉化が難しく、500μm程度が限度であり、これを超えて薄くすると、リード導体の引っ張りによる絶縁基板の破断が避けられない。
In the battery pack protection circuit, an FET is used as a part of the circuit element, and the fuse with a resistor is attached to the FET so that the fusible metal piece is blown when the FET is abnormally heated. It is desirable to prevent the spread of damage due to abnormal heat generation.
Thus, it is effective to reduce the thickness of the insulating substrate of the fuse with resistor as much as possible. However, it is difficult to reduce the thickness of the ceramic insulating substrate with the conventional fuse with resistor, and the limit is about 500 μm. If the thickness exceeds this range, the insulating substrate cannot be ruptured due to the pulling of the lead conductor.

本発明の目的は、平面寸法の小型化を図り得、また外部からヒューズ(可溶金属片)への熱伝達性を向上できる基板型抵抗体付きヒューズを提供することにある。   SUMMARY OF THE INVENTION An object of the present invention is to provide a fuse with a substrate-type resistor that can be reduced in planar dimension and can improve heat transfer from the outside to a fuse (fusible metal piece).

請求項1に係る基板型抵抗体付きヒューズは、抵抗体及びこの抵抗体の通電発熱により溶断される可溶金属片を有する抵抗体付きヒューズであり、抵抗体を絶縁基板に埋設し、この抵抗体埋設絶縁基板の片面に可溶金属片取付け用電極を設け、この電極に可溶金属片を接続し、同絶縁基板内の前記抵抗体を絶縁基板の孔を経て前記可溶金属片取付け用電極に電気的に導通したことを特徴とする。
請求項2に係る基板型抵抗体付きヒューズは、請求項1の基板型抵抗体付きヒューズにおいて、抵抗体がシート状であり、その外郭が可溶金属片を包囲する寸法とされていることを特徴とする。
請求項3に係る基板型抵抗体付きヒューズは、請求項2の基板型抵抗体付きヒューズにおいて、抵抗体埋設絶縁基板の片面にリード導体の先端部を前記シート状抵抗に上下にラップさせて取付けたことを特徴とする。
請求項4に係る基板型抵抗体付きヒューズは、請求項3の基板型抵抗体付きヒューズにおいて、所定の外部温度でも可溶金属片を溶断させるように可溶金属片の融点を所定の温度としたことを特徴とする。
請求項5に係る電池パックは、請求項4の基板型抵抗体付きヒューズを組込み電池の異常を検出させて前記基板型抵抗体付きヒューズの抵抗体を通電発熱させて可溶金属片を溶断させる保護回路及び二次電池を有し、保護回路中のFETに前記基板型抵抗体付きヒューズを絶縁基板の裏面において取付け、前記基板型抵抗体付きヒューズの可溶金属片の融点をFETの許容温度に対応した所定の温度に設定したことを特徴とする。
A fuse with a substrate type resistor according to claim 1 is a fuse with a resistor having a resistor and a fusible metal piece that is melted by energization heat generation of the resistor, and the resistor is embedded in an insulating substrate. An electrode for attaching a soluble metal piece is provided on one side of the body-embedded insulating substrate, a soluble metal piece is connected to this electrode, and the resistor in the insulating substrate is attached to the soluble metal piece through a hole in the insulating substrate. It is characterized in that it is electrically connected to the electrode.
The fuse with a substrate type resistor according to claim 2 is the fuse with a substrate type resistor according to claim 1, wherein the resistor is in a sheet shape and its outer dimension is a size surrounding a soluble metal piece. Features.
A fuse with a substrate-type resistor according to claim 3 is the fuse with a substrate-type resistor according to claim 2, wherein the tip of the lead conductor is wrapped up and down on the sheet-like resistor on one side of the resistor-embedded insulating substrate. It is characterized by that.
A fuse with a substrate type resistor according to claim 4 is the fuse with a substrate type resistor according to claim 3, wherein the melting point of the fusible metal piece is set to a predetermined temperature so that the fusible metal piece is melted even at a predetermined external temperature. It is characterized by that.
According to a fifth aspect of the present invention, there is provided a battery pack including the fuse with a substrate type resistor according to the fourth aspect, wherein an abnormality of the battery is detected, and the resistor of the fuse with the substrate type resistor is energized and heated to melt the fusible metal piece. A fuse having a substrate type resistor is attached to the FET in the protection circuit on the back surface of the insulating substrate, and the melting point of the fusible metal piece of the fuse with the substrate type resistor is set to an allowable temperature of the FET. It is characterized in that it is set to a predetermined temperature corresponding to.

(1)絶縁基板にシート状抵抗を埋設し、この抵抗体埋設絶縁基板上に可溶金属片を配設し、可溶金属片取付け用電極とシート状抵抗とを基板の孔(スルホールやベアホール)を介して導通して可溶金属片とシート状抵抗との電気的連結を行っており、その連結を絶縁基板の厚み方向に行っているから、シート状抵抗側の電極が不要であり、その電極を設けるための平面スペースが不要であり、基板型抵抗体付きヒューズの平面寸法を小さくできる。
(2)シート状抵抗埋設絶縁基板にリード導体の先端部をシート状抵抗に上下にラップさせるようにその先端部をシート状抵抗埋設絶縁基板の表面に取付けてあり、リード導体の引っ張りに対しシート状抵抗にその引っ張り力の一部を支持させることができるので、絶縁基板の引っ張り破断強さを増大できる。従って、絶縁基板の厚みを全体として薄くして外部から可溶金属片への熱伝達性をアップできる。
(1) A sheet-like resistor is embedded in an insulating substrate, a fusible metal piece is disposed on the resistor-buried insulating substrate, and the fusible metal piece mounting electrode and the sheet-like resistor are connected to a hole (through hole or bare hole) of the substrate. ) Through the electrical connection between the fusible metal piece and the sheet-like resistor, and the connection is made in the thickness direction of the insulating substrate, so the electrode on the sheet-like resistor side is unnecessary, A plane space for providing the electrode is not necessary, and the plane size of the fuse with a substrate type resistor can be reduced.
(2) The tip of the lead conductor is attached to the surface of the sheet-like resistance-embedded insulating substrate so that the tip of the lead conductor is wrapped up and down on the sheet-like resistor on the sheet-like resistance-embedded insulating substrate. Since a part of the tensile force can be supported by the state resistor, the tensile breaking strength of the insulating substrate can be increased. Therefore, the thickness of the insulating substrate as a whole can be reduced to improve the heat transfer from the outside to the soluble metal piece.

以下、図面を参照しつつ本発明の実施の形態について説明する。
図1の(イ)は本発明に係る基板型抵抗体付きヒューズの一実施例を示す一部切欠き上面図、図1の(ロ)は図1の(イ)におけるロ−ロ断面図、図1の(ハ)は図1の(ロ)におけるハ−ハ断面図である。
図1において、1はシート状抵抗2を埋設したセラミックス絶縁基板であり、比抵抗値の高い金属シート、例えばニッケル−クロム合金シートをアルミナのグリーンシートで挾み、焼成により一体化したものを使用できる。31〜34は抵抗体埋設絶縁基板1の片面に設けた膜電極であり、導電ペースト例えば銀ペーストの印刷・焼き付けにより形成できる。4は可溶金属片であり、膜電極32−33間に溶接し、その中間を膜電極34に溶接してある。51〜53はリード導体であり、それぞれの先端部を膜電極31〜33にはんだ付けまたは溶接(例えば、スポット溶接)により連結してある。
前記膜電極31〜34の厚みは20μm〜10μmであり、可溶金属片4やリード導体51〜53の太さや厚みは400μm〜600μmである。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A is a partially cutaway top view showing an embodiment of a fuse with a substrate type resistor according to the present invention, FIG. 1B is a cross-sectional view of FIG. FIG. 1C is a cross-sectional view of FIG.
In FIG. 1, reference numeral 1 denotes a ceramic insulating substrate in which a sheet-like resistor 2 is embedded. A metal sheet having a high specific resistance value, for example, a nickel-chromium alloy sheet that is sandwiched with an alumina green sheet and integrated by firing is used. it can. Reference numerals 31 to 34 denote film electrodes provided on one surface of the resistor-embedded insulating substrate 1 and can be formed by printing or baking a conductive paste, for example, a silver paste. Reference numeral 4 denotes a fusible metal piece, which is welded between the membrane electrodes 32-33 and the middle thereof is welded to the membrane electrode. Reference numerals 51 to 53 denote lead conductors, and the respective leading ends thereof are connected to the membrane electrodes 31 to 33 by soldering or welding (for example, spot welding).
The thickness of the membrane electrodes 31 to 34 is 20 μm to 10 μm, and the thickness and thickness of the soluble metal piece 4 and the lead conductors 51 to 53 are 400 μm to 600 μm.

前記抵抗体2と可溶金属片4とは図2のように並列的に接続され、この場合、図2における可溶金属片4の中間34と抵抗体2との接続は、図1において抵抗体埋設絶縁基板に設けたスルホールhを介して膜電極34とシート状抵抗2とをはんだ付けすることにより行い、図2における抵抗体2とリード導体31との接続は、図1においてリード導体31を接続した接続膜電極31とシート状抵抗2とを抵抗体埋設絶縁基板1に設けたスルホールhを介してはんだ付けすることにより行い、何れの接続にもスルホールに代えてベアホールを使用することも可能である。
6は可溶金属片4に塗布したフラックス、7は絶縁基板1の片面上に設けた封止保護体であり、例えば、エポキシ樹脂液の滴下塗装により設けることができる。この封止保護体は、蓋片、例えば裏面周囲を突出させたセラモックス蓋を裏面周囲において接着剤で絶縁基板に接着することにより設けることもできる。
The resistor 2 and the fusible metal piece 4 are connected in parallel as shown in FIG. 2. In this case, the connection between the middle 34 of the fusible metal piece 4 and the resistor 2 in FIG. The membrane electrode 34 and the sheet-like resistor 2 are soldered through the through hole h 1 provided in the body-embedded insulating substrate, and the connection between the resistor 2 and the lead conductor 31 in FIG. 31 and the connection film electrode 31 was connected to the sheet resistance 2 via a through hole h 2 provided on the resistor buried insulating substrate 1 was carried out by soldering, using a Beahoru instead of through holes in either connection It is also possible.
6 is a flux applied to the fusible metal piece 4, and 7 is a sealing protector provided on one side of the insulating substrate 1, and can be provided by, for example, dropping coating of an epoxy resin liquid. This sealing protector can also be provided by adhering a lid piece, for example, a Cerammox lid with the back surface protruding, to the insulating substrate with an adhesive around the back surface.

前記シート状抵抗2の外郭は、各リード導体51〜53の先端部をシート状抵抗2に上下にラップさせる寸法としてある。従って、各リード導体51〜53に引っ張り力が作用しても、その引っ張り力をシート状抵抗2とその上下のセラミックス層とで支持でき、それだけセラミックス層に作用する引っ張り力を小さくできるから、絶縁基板1全体に対する引っ張り強度を増すことができる。従って、シート状抵抗の埋設がない絶縁基板に較べ、同一引っ張り強度のもとで絶縁基板のセラミックス厚みを薄くでき、抵抗体埋設絶縁基板裏面から可溶金属片への熱伝達性をアップできる。   The outer periphery of the sheet-like resistor 2 is dimensioned to wrap the leading ends of the lead conductors 51 to 53 up and down on the sheet-like resistor 2. Therefore, even if a tensile force is applied to each of the lead conductors 51 to 53, the tensile force can be supported by the sheet resistance 2 and the upper and lower ceramic layers, and the tensile force acting on the ceramic layer can be reduced accordingly. The tensile strength with respect to the whole substrate 1 can be increased. Therefore, the ceramic thickness of the insulating substrate can be reduced under the same tensile strength as compared with the insulating substrate in which the sheet-like resistor is not embedded, and the heat transfer property from the back surface of the resistor embedded insulating substrate to the soluble metal piece can be improved.

本発明に係る基板型抵抗体付きヒューズは、電池パックの保護回路に組み込んで好適に使用できる。
図2は電池パックの充電中の電気回路を示し、回路端に充電器Cを接続してある。
この充電中、過充電のために電池電圧が異常に変化すると、ツェナダイオードDが導通され、この導通に連動してトランジスターTrが導通され、抵抗体付きヒューズFの抵抗体2が通電発熱され、その発生熱で可溶金属片4が溶断され、電池Eの充電が停止される。
図2において、可溶金属片4をA、Bの2部分に分けて使用する理由は、部分AまたはBがなく、その間が直結されていると、部分BまたはAの溶断後も電池または充電器から電流が流されつづけ、抵抗体の発熱が停止されないからである。
The fuse with a substrate type resistor according to the present invention can be suitably used by being incorporated in a protection circuit of a battery pack.
FIG. 2 shows an electric circuit during charging of the battery pack, and a charger C is connected to the circuit end.
During this charging, if the battery voltage changes abnormally due to overcharging, the Zener diode D is turned on, the transistor Tr is turned on in conjunction with this conduction, and the resistor 2 of the fuse F with resistor is energized and heated, The fusible metal piece 4 is melted by the generated heat, and the charging of the battery E is stopped.
In FIG. 2, the reason why the soluble metal piece 4 is divided into two parts A and B is that there is no part A or B, and if the part is directly connected between them, the battery or charging is performed even after the part B or A is melted. This is because the current continues to flow from the vessel and the heating of the resistor is not stopped.

上記の保護回路には、図示されていないが、例えば過放電時に放電制御スイッチのFETをオフにして充電方向への電流経路をFETのボディーダイオードにより確保することがあり、このときFETが異常に発熱する畏れがある。
本発明に係る電池パックにおいては、本発明に係る基板型抵抗体付きヒューズを組込み、電池の異常を検出させて前記基板型抵抗体付きヒューズの抵抗体を通電発熱させて可溶金属片を溶断させる保護回路及び二次電池を有し、保護回路中のFETに前記基板型抵抗体付きヒューズを絶縁基板の裏面において取付けており、前記した通り抵抗体付きヒューズの平面寸法を小さくできるので、その取付けを容易に行うことができ、さらに、絶縁基板の厚みを薄くできるので、FETの異常発生熱を可溶金属片に効率良く伝達でき、迅速にFETの通電を遮断して被害の拡大を良好に抑制できる。
Although not shown in the above protection circuit, for example, the FET of the discharge control switch may be turned off during overdischarge, and a current path in the charging direction may be secured by the body diode of the FET. There is a fear of fever.
In the battery pack according to the present invention, the fuse with the substrate type resistor according to the present invention is incorporated, the abnormality of the battery is detected, the resistor of the fuse with the substrate type resistor is energized and heated, and the fusible metal piece is blown out. The fuse with the substrate type resistor is attached to the FET in the protection circuit on the back surface of the insulating substrate, and as described above, the planar dimension of the fuse with the resistor can be reduced. Can be easily installed, and the insulation substrate can be made thinner, allowing the heat generated by the FET to be efficiently transferred to the fusible metal piece, quickly turning off the FET and increasing damage. Can be suppressed.

本発明に係る基板型抵抗体付きヒューズの一実施例を示す図面である。It is drawing which shows one Example of the fuse with a board | substrate type resistor which concerns on this invention. 電池パックの回路図である。It is a circuit diagram of a battery pack.

符号の説明Explanation of symbols

1 抵抗体埋設絶縁基板
2 シート状抵抗
31 膜電極
32 膜電極
33 膜電極
34 膜電極
4 可溶金属片
51 リード導体
52 リード導体
53 リード導体
h1 スルホール
h2 スルホール
DESCRIPTION OF SYMBOLS 1 Resistor embedding insulating board 2 Sheet-like resistance 31 Membrane electrode 32 Membrane electrode 33 Membrane electrode 34 Membrane electrode 4 Soluble metal piece 51 Lead conductor 52 Lead conductor 53 Lead conductor h1 Through hole h2 Through hole

Claims (5)

抵抗体及びこの抵抗体の通電発熱により溶断される可溶金属片を有する抵抗体付きヒューズであり、抵抗体を絶縁基板に埋設し、この抵抗体埋設絶縁基板の片面に可溶金属片取付け用電極を設け、この電極に可溶金属片を接続し、同絶縁基板内の前記抵抗体を絶縁基板の孔を経て前記可溶金属片取付け用電極に電気的に導通したことを特徴とする基板型抵抗体付きヒューズ。 A fuse with a resistor having a resistor and a fusible metal piece that is melted by the heat generated by the resistor. The resistor is embedded in an insulating substrate, and the fusible metal piece is attached to one side of the resistor-embedded insulating substrate. An electrode is provided, a fusible metal piece is connected to the electrode, and the resistor in the insulating substrate is electrically connected to the fusible metal piece mounting electrode through a hole in the insulating substrate. Type resistor fuse. 抵抗体がシート状であり、その外郭が可溶金属片を包囲する寸法とされていることを特徴とする請求項1記載の基板型抵抗体付きヒューズ。 2. The fuse with a substrate type resistor according to claim 1, wherein the resistor is in a sheet form and has an outer dimension that surrounds the fusible metal piece. 抵抗体埋設絶縁基板の片面にリード導体の先端部を前記シート状抵抗に上下にラップさせて取付けたことを特徴とする請求項2記載の基板型抵抗体付きヒューズ。 3. The fuse with a substrate type resistor according to claim 2, wherein a tip end portion of a lead conductor is attached to one side of the resistor-embedded insulating substrate so as to be wrapped up and down with the sheet-like resistor. 所定の外部温度でも可溶金属片を溶断させるように可溶金属片の融点を所定の温度としたことを特徴とする請求項3記載の基板型抵抗体付きヒューズ。 4. The fuse with a substrate type resistor according to claim 3, wherein the melting point of the fusible metal piece is set to a predetermined temperature so that the fusible metal piece is melted even at a predetermined external temperature. 請求項4記載の基板型抵抗体付きヒューズを組込み、電池の異常を検出させて前記基板型抵抗体付きヒューズの抵抗体を通電発熱させて可溶金属片を溶断させる保護回路及び二次電池を有し、保護回路中のFETに前記基板型抵抗体付きヒューズを絶縁基板の裏面において取付け、前記基板型抵抗体付きヒューズの可溶金属片の融点をFETの許容温度に対応した所定の温度に設定したことを特徴とする電池パック。 A protection circuit and a secondary battery, wherein the fuse with a substrate type resistor according to claim 4 is incorporated, the abnormality of the battery is detected, the resistor of the fuse with the substrate type resistor is energized and heated to melt the fusible metal piece. And mounting the fuse with the substrate type resistor on the back surface of the insulating substrate to the FET in the protection circuit, and the melting point of the fusible metal piece of the fuse with the substrate type resistor to a predetermined temperature corresponding to the allowable temperature of the FET Battery pack characterized by setting.
JP2005033239A 2005-02-09 2005-02-09 Fuse with substrate type resistor and battery pack Withdrawn JP2006221919A (en)

Priority Applications (1)

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JP2009070805A (en) * 2007-08-20 2009-04-02 Uchihashi Estec Co Ltd Substrate type temperature fuse with resistor and secondary battery protection circuit
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JP2019008946A (en) * 2017-06-22 2019-01-17 三菱電機エンジニアリング株式会社 ESD suppression structure

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