JP2003217416A - Temperature fuse and protective device mounted with the same - Google Patents
Temperature fuse and protective device mounted with the sameInfo
- Publication number
- JP2003217416A JP2003217416A JP2002016539A JP2002016539A JP2003217416A JP 2003217416 A JP2003217416 A JP 2003217416A JP 2002016539 A JP2002016539 A JP 2002016539A JP 2002016539 A JP2002016539 A JP 2002016539A JP 2003217416 A JP2003217416 A JP 2003217416A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- substrate
- temperature
- temperature fuse
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、薄型小型化に適
する温度ヒュ−ズおよびこれを用いた保護装置に関し、
特に、セラミック基板へのヒュ−ズ素子と導出用リ−ド
の改良された配置によりコンパクト化を可能にする温度
ヒュ−ズおよび改良された実装構造でこの温度ヒューズ
を用いた保護装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature fuse suitable for thinning and miniaturization and a protective device using the same.
In particular, the present invention relates to a temperature fuse that enables compactness due to an improved arrangement of a fuse element and a lead-out lead on a ceramic substrate, and a protective device using this thermal fuse in an improved mounting structure.
【0002】[0002]
【従来の技術】従来、温度ヒュ−ズは、被保護機器の過
電流により生ずる過大発熱で作動させるほかに、機器に
生ずる異常信号を検知しこの信号により抵抗発熱させて
作動させる温度ヒュ−ズとが知られている。例えば、携
帯情報端末装置である電子機器の主電源として保存特性
や耐漏液性に優れた高密度エネルギーのリチウムイオン
二次電池が利用されているが、その安全性の確保に温度
ヒューズが保護部品として使用される。一般に二次電池
では過充電および過放電を防止するために復帰型と非復
帰型の二重の保護回路を設けるのが望まれ、電池の電圧
が所定の設定電圧を越えたとき充電電流を遮断する復帰
型保護回路と、その保護回路が何らかの原因で作動せず
電池電圧が異常に上昇したとき温度ヒューズを溶断する
非復帰型保護回路とで安全性の高い保護装置を構成する
ことが知られている(特開平10−56742号参
照)。非復帰型保護回路で使用する温度ヒューズは、充
電器と電池との間に直列接続した2個の可溶体エレメン
トおよびこれらのエレメントと熱的に結合する発熱素子
の抵抗により構成された抵抗内蔵温度ヒューズであっ
て、発熱素子は電池電圧を検知し電池電圧が設定値以上
になるとオン信号を出力する電圧検出回路のオン信号で
動作するようにしている。2. Description of the Related Art Conventionally, a temperature fuse is operated by an excessive heat generation caused by an overcurrent of a protected device, and also an abnormal signal generated in the device is detected and resistance heat is generated by this signal to operate the temperature fuse. Is known. For example, a high-density energy lithium-ion secondary battery with excellent storage characteristics and liquid leakage resistance is used as a main power source for electronic devices such as portable information terminal devices, but a thermal fuse is a protective component to ensure its safety. Used as. Generally, in secondary batteries, it is desirable to provide a dual protection circuit of a reset type and a non-reset type to prevent overcharge and overdischarge, and shut off the charging current when the battery voltage exceeds a specified set voltage. It is known that a highly safe protective device is configured by a resettable protection circuit that operates and a non-resettable protection circuit that blows off the thermal fuse when the protection circuit does not work for some reason and the battery voltage rises abnormally. (See JP-A-10-56742). The thermal fuse used in the non-reset type protection circuit is a temperature built-in resistor composed of two fusible element elements connected in series between the charger and the battery and the resistance of the heating element thermally coupled to these elements. The fuse is a fuse, and the heating element is operated by an ON signal of a voltage detection circuit that detects a battery voltage and outputs an ON signal when the battery voltage exceeds a set value.
【0003】図8は従来この種の保護回路に使用してい
た抵抗内蔵温度ヒューズ1の構造を一部断面視した側面
図で示しており、セラミック基板2と、この基板の表面
側に装着した低融点合金の可溶体エレメント3とこれを
カバーするセラミックキャップ5、この可溶体エレメン
トを溶着する電極にはんだ付けする導出用リード4、お
よびこの基板2の裏面側に形成した抵抗体6とにより構
成している。この抵抗内蔵温度ヒュ−ズは、上述する2
次電池の非復帰型保護回路として組み込まれ過充電など
の異常を検出した場合、可溶体エレメント3と熱結合さ
せた抵抗体6に通電させることにより抵抗を加熱し、強
制的に可溶体エレメントを溶断して回路を遮断させる。
通常、保護回路は充放電を制御するMOSFETなどの
スイッチング素子を含む専用の制御IC等の制御素子と
共にプリント板上に搭載して構成される。例えば、抵抗
内蔵温度ヒューズが制御回路部品のスイッチング素子の
上方側に積み重ねたり、横方側に並置して配置される。
これらの詳細は、NEC技報vol.53No.10p
p93−96の題名「抵抗内蔵温度ヒューズの開発」に
関する記載を参照することで容易に理解され、その詳述
は省略する。FIG. 8 is a side view showing a partial cross-section of the structure of a thermal fuse 1 with a built-in resistor, which has been conventionally used in a protection circuit of this type. It is mounted on a ceramic substrate 2 and on the front side of this substrate. It is composed of a fusible element 3 of a low melting point alloy, a ceramic cap 5 covering it, a lead-out lead 4 for soldering the fusible element to an electrode for welding, and a resistor 6 formed on the back surface side of the substrate 2. is doing. This temperature fuse with built-in resistor is the same as the above-mentioned 2
When an abnormality such as overcharging is detected by being incorporated as a non-recoverable type protection circuit for the secondary battery, the resistor 6 that is thermally coupled to the fusible element 3 is energized to heat the resistance and forcibly remove the fusible element. Cuts the circuit by melting.
Usually, the protection circuit is configured by being mounted on a printed board together with a control element such as a dedicated control IC including a switching element such as MOSFET for controlling charge / discharge. For example, thermal fuses with built-in resistors are stacked on the upper side of the switching element of the control circuit component or arranged side by side on the lateral side.
For details of these, refer to NEC Technical Report vol. 53 No. 10p
It can be easily understood by referring to the description of "Development of thermal fuse with built-in resistor" in p93-96, and its detailed description is omitted.
【0004】[0004]
【発明が解決しようとする課題】従来の抵抗内蔵温度ヒ
ューズは、上述するように単体または2個の可溶体エレ
メントを絶縁基板の一方の面にリードと共に実装してい
たので必然的に所要する実装面積が広くなり、保護回路
への取付けに大きなスペースを必要とする。これは小形
薄型化を要求する携帯情報機器などへの適用に際して不
都合を生じ、組み立て上の問題となっていた。そして、
温度ヒューズのみならず組み込み後の機器類に対しても
コンパクトにするべく可及的に薄くて小形の実現が望ま
れていた。加えて、温度ヒューズの温度検知感度を高め
て高精度で動作させるには、異常過熱の可能性のあるス
イッチング素子等への密着的に接近した実装配置が望ま
れ、そのために、温度ヒューズの機器回路部品への改善
された実装構造の提示が望まれていた。In the conventional thermal fuse with a built-in resistor, as described above, the single or two fusible element are mounted together with the lead on one surface of the insulating substrate, so that the necessary mounting is inevitable. The area is large and a large space is required for mounting to the protection circuit. This causes inconvenience when applied to a portable information device or the like that requires miniaturization and thinning, which is a problem in assembly. And
It has been desired to make the device as thin and compact as possible in order to make it compact not only for the thermal fuse but also for the devices after being incorporated. In addition, in order to increase the temperature detection sensitivity of the thermal fuse and operate it with high accuracy, it is desirable that the mounting arrangement be closely attached to the switching element or the like that may have abnormal overheating. It has been desired to provide an improved mounting structure for circuit components.
【0005】したがって、本発明は上述する従来の未解
決である温度ヒューズの本体構造が大きくなり取付けス
ペ−ス大となることに鑑み提案されたものであり、これ
らを解消するコンパクト化を実現する新規且つ改良され
た温度ヒューズの提供を目的とするものである。Therefore, the present invention has been proposed in view of the fact that the above-mentioned unsolved conventional thermal fuse has a large body structure and a large mounting space. It is an object of the present invention to provide a new and improved thermal fuse.
【0006】本発明の別の目的は、絶縁基板の一方の面
にヒューズ素子、他方の面に導出用リード部材を配置す
ることで小形化された温度ヒューズを提供し、且つこれ
を改善された実装方法で保護回路へ組み込み、性能面で
より効率的に作動させると共にスペース面でもより有効
活用が図れる新規且つ改良された温度ユーズを用いる保
護装置の提供にある。Another object of the present invention is to provide a miniaturized thermal fuse by disposing a fuse element on one surface of an insulating substrate and a lead member for lead-out on the other surface, and to improve the thermal fuse. It is to provide a protection device using a new and improved temperature fuse that can be incorporated into a protection circuit by a mounting method, operate more efficiently in terms of performance, and can be more effectively utilized in terms of space.
【0007】[0007]
【課題を解決するための手段】本発明は、上述の目的を
達成するための手段を提供するものであり、パタ−ン電
極とスル−ホ−ルを有する絶縁基板と、この絶縁基板の
表面側に配置したヒュ−ズ素子と、裏面側に配置したリ
−ド部材とを具備し、ヒューズ素子とリード部材をそれ
ぞれ所定のパタ−ン電極と接続した温度ヒューズであ
り、ヒューズ素子は低融点合金の可溶体を絶縁キャップ
により封じしてなり、このヒューズ素子と熱的結合する
発熱素子を絶縁基板に配置することを開示する。ここ
で、低融点合金可溶体は溶断する動作温度が同一または
異なる温度に設定される複数個の部分で構成することが
可能であり、発熱素子の発生熱により溶断するようにし
たことを特徴とする温度ヒューズを開示する。好ましく
は、発熱素子を絶縁基板の裏面側、またはスルーホール
に配置した抵抗体とし、リ−ド部材ははんだめっき平角
状銅線を所定のパターン電極とはんだ付けで合体させて
固着した温度ヒュ−ズである。SUMMARY OF THE INVENTION The present invention provides a means for achieving the above-mentioned object, including an insulating substrate having a pattern electrode and a through hole, and a surface of the insulating substrate. Side fuse element and a lead member disposed on the back surface side, and a fuse element and a lead member are each a thermal fuse in which a predetermined pattern electrode is connected, and the fuse element has a low melting point. It is disclosed that a fusible alloy body is sealed by an insulating cap, and a heat generating element that is thermally coupled to the fuse element is arranged on an insulating substrate. Here, the low melting point alloy fusible body can be composed of a plurality of parts whose operating temperatures for fusing are set to the same or different temperatures, and is characterized in that it is fused by the heat generated by the heating element. A thermal fuse is disclosed. Preferably, the heating element is a resistor arranged on the back side of the insulating substrate or in a through hole, and the lead member is a temperature fuse in which a solder-plated rectangular copper wire is united with a predetermined pattern electrode by soldering and fixed. It is.
【0008】本発明の別の観点によれば、温度ヒュ−ズ
を用いた非復帰型保護装置での実装構造において、パタ
−ン電極とスル−ホ−ルを有する絶縁基板の表面側に配
置したヒュ−ズ素子と裏面側に配置したリ−ド部材を有
する温度ヒューズ、および異常信号を発生する制御素子
を有する保護回路から構成し、絶縁基板表面側のヒュー
ズ素子を素子の近傍間隙に実装した温度ヒューズを用い
た保護装置が提供される。ここで、制御素子は少なくと
も2個使用され、温度ヒューズは低融点合金の可溶体エ
レメントを絶縁キャップで封じしたヒューズ素子および
このヒューズ素子と熱的結合状態で絶縁基板に装着した
発熱素子を具備し、ヒューズ素子の絶縁キャップを2個
の制御素子の間隙に嵌め込んで実装する非復帰型保護装
置である。具体的には、保護回路が2個の制御素子を含
む電池パック用充放電制御回路に適用され、この制御回
路が異常信号を検知して発熱素子に抵抗発熱を生じさせ
るようにしたことを特徴とする温度ヒュ−ズを用いた保
護装置を開示する。According to another aspect of the present invention, in a mounting structure of a non-reset type protective device using a temperature fuse, the mounting structure is arranged on the front surface side of an insulating substrate having a pattern electrode and a through hole. The fuse element on the front surface side of the insulating substrate is mounted in the gap near the element, which is composed of a thermal fuse having a fuse element and a lead member arranged on the back side, and a protection circuit having a control element for generating an abnormal signal. A protection device using the thermal fuse is provided. Here, at least two control elements are used, and the thermal fuse includes a fuse element in which a fusible element of a low melting point alloy is sealed with an insulating cap and a heating element mounted on an insulating substrate in a state of being thermally coupled with the fuse element. Is a non-recoverable type protection device in which an insulating cap of a fuse element is fitted into a gap between two control elements and mounted. Specifically, the protection circuit is applied to a charge / discharge control circuit for a battery pack including two control elements, and this control circuit detects an abnormal signal and causes the heating element to generate resistance heat. Disclosed is a protection device using a temperature fuse.
【0009】[0009]
【発明の実施の形態】本発明は、複数個のスルーホール
を形成したセラミック基板、この基板の両方の面に前記
スルーホールを介して相互に接続した複数個の電極、こ
の基板の一方の面に搭載配置した低融点合金可溶体をセ
ラミックキャップで封止したヒューズ素子、この基板の
他方の面に搭載配置したリード部材、およびヒューズ素
子と熱的結合するようにセラミック基板に配置した発熱
素子を具備し、セラミック基板上のヒューズ素子とリー
ド部材の配置面を分離してコンパクト化した温度ヒュ−
ズである。特に、キャップの封じするカバー範囲はセラ
ミック基板の一方の面に配置したパタ−ン電極と低融点
合金可溶体を含めて被覆し、その被覆面積はセラミック
基板全体の面積より小さくされ、リード部材は平板状銅
線を使用して薄型化するのが好ましい。BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to a ceramic substrate having a plurality of through holes, a plurality of electrodes connected to each other on both sides of the substrate through the through holes, and one side of the substrate. The fuse element in which the low melting point alloy fusible material mounted on the substrate is sealed with a ceramic cap, the lead member mounted on the other surface of this substrate, and the heating element disposed on the ceramic substrate so as to be thermally coupled with the fuse element. In addition, the fuse is provided on the ceramic substrate and the arrangement surface of the lead member is separated to make it compact.
It is. In particular, the area covered by the cap is covered by including the pattern electrode arranged on one surface of the ceramic substrate and the low melting point alloy fusible material, and the coating area is made smaller than the entire area of the ceramic substrate. It is preferable to use a flat copper wire to reduce the thickness.
【0010】本発明にかかる別の実施の形態は、保護装
置が温度ヒューズを使用した電池パック用充放電制御回
路であり、制御回路が異常を検知して信号を発熱素子に
通電して抵抗発熱を生じさせて温度ヒューズの可溶体を
溶断させるようにした非復帰型保護回路に係るのもので
ある。なお、ここで使用する温度ヒュ−スは、上述の両
面に複数個のパタ−ン電極と両面のパターン電極を接続
する導通用スル−ホ−ルとを有するセラミック基板と、
このセラミック基板の表面側に配置したパタ−ン電極に
溶着した低融点合金の低融点合金可溶体をを被覆して封
止するセラミックキャップからなるヒューズ素子と、セ
ラミック基板に形成した発熱素子の薄膜抵抗と、セラミ
ック基板の裏面側パタ−ン電極にはんだ付けした複数個
のリ−ド部材とを具備する。According to another embodiment of the present invention, the protection device is a charge / discharge control circuit for a battery pack using a temperature fuse, and the control circuit detects an abnormality and applies a signal to a heating element to generate resistance heat. The present invention relates to a non-reset type protection circuit in which a fusible body of a temperature fuse is melted and cut. The temperature fuse used here is a ceramic substrate having a plurality of pattern electrodes on both sides and a conductive through hole connecting the pattern electrodes on both sides,
A fuse element consisting of a ceramic cap for covering and sealing a low melting point alloy fusible body of a low melting point alloy deposited on a pattern electrode arranged on the surface side of this ceramic substrate, and a thin film of a heating element formed on the ceramic substrate. A resistor and a plurality of lead members soldered to the pattern electrode on the back surface side of the ceramic substrate are provided.
【0011】[0011]
【実施例1】以下、本発明に係る実施例について、図面
を参照しつつ詳述する。本発明の温度ヒュ−ズ10は、
図1、図2又は図3に示すように、アルミナからなるの
セラミック基板12と、その一方の面に配置したヒュ−
ズ素子13および他方の面に配置した導出用リ−ド部材
14a、14b、14cとを具備する。ヒュ−ズ素子1
3は低融点合金の可溶体エレメントをセラミックキャッ
プ15により封止して構成される。加えて、セラミック
基板12にはヒューズ素子13と熱的結合状態で配置さ
れたて抵抗の発熱素子16がある。ここで各構成要素は
可及的に小さく且つ薄くなるように形成加工され、具体
的に発熱素子16の抵抗は裏面の薄膜抵抗やスル−ホ−
ルe、f、gに装着の抵抗器が使用され、リ−ド部材1
4a、14b、14cには平角銅線をパタ−ン電極には
んだ付けして使用される。また、セラミック基板12や
キャップ15は、これらが焼結処理前のグリ−ンシ−ト
の段階で所定の形状にされ、キャップの縁部や基板のス
ル−ホ−ルe、f、gの加工処理が行われる。焼結後の
セラミック基板12には所定のパターン電極が加熱加工
して形成され、必要に応じこの工程で発熱素子16の薄
膜型抵抗も同様に形成される。発熱素子16の抵抗は所
定のパタ−ン電極に抵抗器をはんだ付けしてもよく、配
置場所にはスル−ホ−ルe、f、gの使用もできる。セ
ラミック基板12は、良好な絶縁性を維持するものであ
ればアルミナ以外の絶縁材でもよく、この絶縁基板の各
面に所定の形状でパタ−ン電極が形成される。そして、
予め決められた位置では、3個のスル−ホ−ルe、f、
gを介在して両面のパターン電極間が電気的に接続する
よう導通スル−ホ−ルが形成されている。Embodiment 1 An embodiment of the present invention will be described in detail below with reference to the drawings. The temperature fuse 10 of the present invention is
As shown in FIG. 1, FIG. 2 or FIG. 3, a ceramic substrate 12 made of alumina and a fuse arranged on one surface thereof.
Device 13 and lead-out lead members 14a, 14b, 14c arranged on the other surface. Fuse element 1
3 is formed by sealing a fusible element of a low melting point alloy with a ceramic cap 15. In addition, the ceramic substrate 12 has a heat generating element 16 of a resistor arranged in thermal connection with the fuse element 13. Here, each constituent element is formed and processed so as to be as small and thin as possible. Specifically, the resistance of the heating element 16 is a thin film resistance on the back surface or a through hole.
The resistors mounted on the reels e, f, and g are used, and the lead member 1
The rectangular electrodes 4a, 14b and 14c are used by soldering flat copper wires to the pattern electrodes. Further, the ceramic substrate 12 and the cap 15 are formed into a predetermined shape at the stage of the green sheet before the sintering process, and the edges of the cap and the through holes e, f and g of the substrate are processed. Processing is performed. A predetermined pattern electrode is formed by heating on the ceramic substrate 12 after sintering, and the thin film resistor of the heating element 16 is similarly formed in this step as needed. As for the resistance of the heating element 16, a resistor may be soldered to a predetermined pattern electrode, and the through holes e, f, g may be used at the place of arrangement. The ceramic substrate 12 may be an insulating material other than alumina as long as it maintains a good insulating property, and the pattern electrodes are formed in a predetermined shape on each surface of the insulating substrate. And
At a predetermined position, three through holes e, f,
A conductive through-hole is formed so as to electrically connect the pattern electrodes on both sides with g interposed therebetween.
【0012】図4および図5に示すように、セラミック
基板12の表面には3つのパターン電極21、22、2
3が3個のスルーホール31、32、33とそれぞれ接
続するように形成され、セラミック基板12の裏面には
3個のスルーホール31、32、33と接続する三つの
パターン電極21、22、23に加えて独立する一つの
電極パターン27が形成される。基板表面側の三本川状
のパターン電極21、22、23には低融点合金の可溶
体エレメント17が橋渡しされて三つのパターン電極2
1,22,23と溶着され、第1の可溶体18と第2の
可溶体19とを有するデュアルタイプ温度ヒューズ素子
を形成する。各パターン電極に溶着された可溶体エレメ
ント17はフラックスが被着された後、3個のパターン
電極21〜23を含めて絶縁性セラミック基板12より
やや小さめの絶縁性セラミックキャップ15で封止され
密閉カバーされる。なお、ヒューズ素子13は、シング
ルタイプ可溶体エレメントでもよく、更にはデュアルタ
イプ可溶体エレメントの場合にはそれそれの可溶体の動
作温度を同一にしたり異なるものにしたりすることがで
きる。異なる動作温度のデュアルタイプでは温度差を動
作温度のばらつきの範囲内にするのが望ましい。As shown in FIGS. 4 and 5, three pattern electrodes 21, 22, 2 are formed on the surface of the ceramic substrate 12.
3 is formed so as to be connected to the three through holes 31, 32, and 33, respectively, and three pattern electrodes 21, 22, and 23 connected to the three through holes 31, 32, and 33 are formed on the back surface of the ceramic substrate 12. In addition, one independent electrode pattern 27 is formed. The fusible element 17 of a low melting point alloy is bridged to the pattern electrodes 21, 22 and 23 in the form of a triple river on the surface side of the substrate so that three pattern electrodes 2 are formed.
1, 22, and 23 are welded together to form a dual-type thermal fuse element having a first fusible body 18 and a second fusible body 19. The fusible element 17 welded to each pattern electrode is covered with a flux and then sealed with an insulating ceramic cap 15 which is slightly smaller than the insulating ceramic substrate 12 including the three pattern electrodes 21 to 23. Covered. The fuse element 13 may be a single-type fusible element, and in the case of a dual-type fusible element, the operating temperatures of the fusible elements can be the same or different. For dual types with different operating temperatures, it is desirable to keep the temperature difference within the range of operating temperature variations.
【0013】一方、セラミック基板12の裏面側を示す
図5では、中央部分に二つのパタ−ン電極26および2
7が形成され、この間に発熱素子16が配置されてい
る。そして、パターン電極26、パターン電極24およ
び25は、スル−ホ−ル32、31および33を介在し
て表面側パターン電極23、21、22にそれぞれ接続
される。裏面側に配置される3本のリード部材14は、
はんだめっきの平角型銅線が使用され、スル−ホ−ルの
31〜33介在により表面側に接続のパターン電極24
および25と独立のパターン電極27にそれぞれはんだ
付けして固着される。温度ヒューズは定格DC32V、
10A、動作温度135℃、発熱抵抗50Ωであり、完
成品の外形寸法はセラミック基板本体部分が長さ4m
m、幅5mm、厚さ1.5mmと極めて小形なものであ
る。なお、方形状に設定したセラミック基板12は厚さ
0.4mmのアルミナ基板であり、小型化によりアルミ
ナセラミックの所要容量が大幅に削減され、コスト面で
の経済的メリットが得られると共に、パターン電極の形
成をスクリーン印刷で実施する際に、小さい基板である
ので、1回の印刷で多数の印刷加工が同時にできる等製
造上での経済的効果も得られる。更に、リード部材14
は幅0.7〜1.0mm、厚さ0.2〜0.4mmの平
板状のSn−Agめっき銅線を使用したので本体部分の
厚み低減に寄与して薄型化に役立つ。On the other hand, in FIG. 5 showing the back surface side of the ceramic substrate 12, two pattern electrodes 26 and 2 are provided in the central portion.
7 are formed, and the heating element 16 is arranged between them. The pattern electrode 26 and the pattern electrodes 24 and 25 are connected to the front surface side pattern electrodes 23, 21 and 22, respectively, with the through holes 32, 31 and 33 interposed therebetween. The three lead members 14 arranged on the back side are
A rectangular copper wire of solder plating is used, and the pattern electrode 24 is connected to the front surface side by interposing 31-33 of through holes.
And 25 and the pattern electrodes 27 independent of each other are soldered and fixed. Thermal fuse is rated 32VDC,
10A, operating temperature 135 ° C, heating resistance 50Ω, the external dimensions of the finished product are 4m long for the ceramic substrate body.
m, width 5 mm, thickness 1.5 mm, which is extremely small. The ceramic substrate 12 set in a rectangular shape is an alumina substrate having a thickness of 0.4 mm, and the required capacity of the alumina ceramic is significantly reduced due to the miniaturization, and the economical merit in terms of cost is obtained, and the pattern electrode is also provided. When the formation is carried out by screen printing, since it is a small substrate, a large number of printing processes can be simultaneously performed by one printing, so that an economical effect in manufacturing can be obtained. Further, the lead member 14
Since a flat Sn—Ag plated copper wire having a width of 0.7 to 1.0 mm and a thickness of 0.2 to 0.4 mm is used, it contributes to the reduction of the thickness of the main body portion and is useful for thinning.
【0014】[0014]
【実施例2】図6および図7は、本発明に係る温度ヒュ
ーズの改良された実装構造を示す部分平面図および側面
図である。本発明に係る温度ヒュ−ズ10は、二次電池
の過充電保護回路への実装において、プリント基板35
に搭載されるMOSFETなどの能動素子36、37間
にセラミックキャップ側を下にして嵌め込むようにして
取付けられる。温度ヒューズ10のヒュ−ズ素子は上述
のようにセラミック基板の一方の面にセラミックキャッ
プで封止構成されるので、この部分を能動素子の感熱部
に近接して実装できる。また、回路部品素子間の間隙空
間を利用して温度ヒュ−ズを実装したので、この種保護
回路が使用される携帯用情報通信機器は、コンパクトで
小形薄型化に有利となる。したがって、本発明の着眼点
である絶縁基板に対する導出用リード部材とヒューズ素
子との分離配置は、部品の小形化を実現すると共に実装
方法で保護回路制御素子間のスペースを有効利用して保
護装置全体のコンパクト化に役立つ。Second Embodiment FIGS. 6 and 7 are a partial plan view and a side view showing an improved mounting structure of a thermal fuse according to the present invention. The temperature fuse 10 according to the present invention is mounted on a printed circuit board 35 when mounted on an overcharge protection circuit of a secondary battery.
Mounted between the active elements 36 and 37 such as MOSFETs mounted on the substrate with the ceramic cap side facing down. Since the fuse element of the thermal fuse 10 is sealed on one surface of the ceramic substrate with the ceramic cap as described above, this portion can be mounted close to the heat sensitive portion of the active element. Further, since the temperature fuse is mounted by utilizing the gap space between the circuit component elements, the portable information communication device using this type of protection circuit is advantageous in that it is compact, small and thin. Therefore, the separate arrangement of the lead-out lead member and the fuse element with respect to the insulating substrate, which is the focus of the present invention, realizes downsizing of the component and makes effective use of the space between the protection circuit control elements in the mounting method to protect the device. Useful for making the whole compact.
【0015】[0015]
【発明の効果】上述する実施例からも明らかなように、
本発明に係る温度ヒュ−ズは小形化に対して極めて顕著
な効果を発揮し、保護部品としてのみならず実装される
保護装置においても小形化やコンパクト化に有利であ
る。ここで、本発明の温度ヒュ−ズ製品を自社の従来製
品および在来の市場製品と比較して外形寸法(単位m
m)等を示すと次ぎの表1ようになる。As is apparent from the above embodiment,
The temperature fuse according to the present invention exerts a very remarkable effect on downsizing, and is advantageous for downsizing and downsizing not only as a protection component but also as a protection device to be mounted. Here, the temperature fuse product of the present invention is compared with its own conventional product and a conventional market product, and the external dimensions (unit: m
Table 1 below shows m) and the like.
【表1】 本発明の温度ヒュ−ズ製品と在来の市場製品
との比較
項目 本発明製品 従前の製品 市場の製品
絶縁基板の寸法 4.0×5.0 7.5×4.2 6.2×6.2
基板の占有面積 20mm平方 32mm平方 38mm平方
製品全体の厚さ 1.4〜1.6 1.2Max 2.0Max
基板上の絶縁構造 キャップタイプ キャップタイプ モールドタイプ
ヒューズ素子 デュアルタイプ シングルタイプ デュアルタイプ
リード取付け 基板の裏面 基板の表面 基板の表面
したがって、従来品に比べ絶縁基板の寸法と占有面積で
大きく異なり、前述するような絶縁材使用量の節減やパ
タ−ン電極の加工処理などで製造上の経済効果が発揮さ
れる。[Table 1] Comparison between the temperature fuse product of the present invention and a conventional market product Item of the present invention Product of the prior art Market product Product of insulating substrate 4.0 x 5.0 7.5 x 4.2 6 .2 × 6.2 Board occupied area 20 mm square 32 mm square 38 mm square Total product thickness 1.4 to 1.6 1.2 Max 2.0 Max Insulation structure on the substrate Cap type Cap type Mold type Fuse element Dual type Single Type Dual type Lead mounting Substrate backside Substrate surface Substrate surface Therefore, the dimensions and occupying area of the insulating substrate differ greatly from those of conventional products, reducing the amount of insulating material used and processing pattern electrodes as described above. The economic effect in manufacturing is demonstrated in.
【0016】本発明の温度ヒュ−ズは従来製品に比べて
外形寸法、特に占有面積を大幅に縮小している。これは
絶縁基板上へのヒュ−ズ素子とリード部材の配置を両面
分割したことに基くものであり、それによって使用する
絶縁基板を30%程度縮小できた。加えて、ヒュ−ズ素
子の封じ構造にキャップタイプを適用することで表面側
の絶縁構造を正確に寸法規制し、実装において保護回路
部品の空隙間への実装配置を容易にし、それによって保
護装置自体のコンパクト化を実現可能にした。このよう
に本発明の温度ヒュ−ズは、小形コンパクト化による実
用化に役立ち工業的価値を高めるなどの効果を奏する。The temperature fuse of the present invention has a greatly reduced external dimension, particularly the occupied area, as compared with the conventional product. This is based on the fact that the arrangement of the fuse element and the lead member on the insulating substrate is divided on both sides, and the insulating substrate used can be reduced by about 30%. In addition, by applying a cap type to the fuse element sealing structure, the surface side insulation structure is accurately dimensioned, facilitating the mounting arrangement of the protective circuit component in the empty space during mounting, and thereby the protective device. It has become possible to make itself compact. As described above, the temperature fuse of the present invention is useful for practical use due to miniaturization and has an effect of increasing industrial value.
【図1】本発明に係る抵抗内蔵温度ヒューズの正面図FIG. 1 is a front view of a thermal fuse with a built-in resistor according to the present invention.
【図2】本発明に係る抵抗内蔵温度ヒューズの一部断面
視した側面図FIG. 2 is a side view of a thermal fuse with a built-in resistor according to the present invention as seen in partial cross section.
【図3】本発明に係る抵抗内蔵温度ヒューズの背面図FIG. 3 is a rear view of the thermal fuse with a built-in resistor according to the present invention.
【図4】本発明に係る抵抗内蔵温度ヒューズのセラミッ
ク基板の表面側平面図FIG. 4 is a front side plan view of a ceramic substrate of a thermal fuse with a built-in resistor according to the present invention.
【図5】本発明に係る抵抗内蔵温度ヒューズのセラミッ
ク基板の裏面側背面図FIG. 5 is a rear side view of the ceramic substrate of the thermal fuse with built-in resistor according to the present invention.
【図6】本発明に係るの抵抗内蔵温度ヒューズの実装構
造を示す平面図FIG. 6 is a plan view showing a mounting structure of a thermal fuse with a built-in resistor according to the present invention.
【図7】本発明に係るの抵抗内蔵温度ヒューズの実装構
造を示す側面図FIG. 7 is a side view showing a mounting structure of a thermal fuse with a built-in resistor according to the present invention.
【図8】従来の抵抗内蔵温度ヒューズの一部断面視した
側面図FIG. 8 is a side view of a conventional thermal fuse with a built-in resistor, which is partially sectioned.
10…抵抗内蔵温度ヒューズ 12…セラミック基板(絶縁基板) 13…ヒューズ素子 14a、14b、14c…リード部材 15…セラミックキャップ(絶縁キャップ) 16…発熱素子(抵抗体) 17…低融点合金可溶体 e、f、g…スル−ホ−ル 10 ... Thermal fuse with built-in resistor 12 ... Ceramic substrate (insulating substrate) 13 ... Fuse element 14a, 14b, 14c ... Lead member 15 ... Ceramic cap (insulation cap) 16 ... Heating element (resistor) 17 ... Low melting point alloy fusible body e, f, g ... through-hole
Claims (10)
基板と、この絶縁基板の表面側に配置したヒュ−ズ素子
と、裏面側に配置したリ−ド部材とを具備し、前記ヒュ
ーズ素子およびリード部材をそれぞれ所定のパタ−ン電
極に接続したことを特徴とする温度ヒューズ。1. An insulating substrate having a pattern electrode and a through hole, a fuse element arranged on the front surface side of the insulating substrate, and a lead member arranged on the rear surface side, A thermal fuse in which the fuse element and the lead member are connected to predetermined pattern electrodes, respectively.
絶縁キャップにより封止してなり、発熱素子を前記絶縁
基板に前記ヒューズ素子と熱的結合するように配置した
ことを特徴とする請求項1に記載の温度ヒュ−ズ。2. The fuse element is formed by sealing a fusible material of a low melting point alloy with an insulating cap, and arranging a heating element on the insulating substrate so as to be thermally coupled to the fuse element. Item 1. The temperature fuse according to item 1.
溶断する動作温度を同一または異なる温度に設定し、前
記発熱素子の発熱により作動させることを特徴とする請
求項2に記載の温度ヒューズ。3. The temperature according to claim 2, wherein the fusible body is composed of a plurality of parts, and the operating temperature at which each part melts is set to the same or different temperature, and the fusible element is operated by the heat generation of the heating element. fuse.
はスルーホールに配置した抵抗体であることを特徴とす
る請求項2または請求項3に記載の温度ヒュ−ズ。4. The temperature fuse according to claim 2, wherein the heating element is a resistor arranged on the back surface side or through hole of the insulating substrate.
平坦面を所定のパターン電極にはんだ固着したことを特
徴とする請求項1ないし請求項4に記載の温度ヒュ−
ズ。5. The temperature fuse according to claim 1, wherein the lead member is a rectangular conductor and its flat surface is soldered to a predetermined pattern electrode.
Z.
ク基板、この基板の両方の面に前記スルーホールを介し
て相互に接続した複数個の電極、この基板の一方の面に
搭載配置した低融点合金可溶体をセラミックキャップで
封じしたヒューズ素子、この基板の他方の面に搭載配置
した複数個のリード部材、および前記ヒューズ素子と熱
的結合するように前記基板に配置した発熱素子を具備
し、前記ヒューズ素子とリード部材を前記絶縁基板の異
なる面に配置してコンパクト化したことを特徴とする温
度ヒュ−ズ。6. A ceramic substrate having a plurality of through holes, a plurality of electrodes connected to each other on both surfaces of the substrate through the through holes, and a low melting point mounted on one surface of the substrate. A fuse element in which a fusible alloy is sealed with a ceramic cap; a plurality of lead members mounted on the other surface of the substrate; and a heating element disposed on the substrate so as to be thermally coupled to the fuse element, A temperature fuse in which the fuse element and the lead member are arranged on different surfaces of the insulating substrate to be compact.
した電極と低融点合金可溶体を含めた範囲をカバー被覆
し、その被覆面積は前記基板の全面積より同一またはや
や狭くし、前記リード部材は平角状のめっき銅線を前記
基板の他方の面に形成した電極にはんだ付けして合体し
たことを特徴とする請求項6に記載の温度ヒュ−ズ。7. The cap covers and covers a range including an electrode arranged on one surface of the substrate and a fusible alloy having a low melting point, and the covering area is the same as or slightly smaller than the entire area of the substrate. 7. The temperature fuse according to claim 6, wherein the lead member is obtained by soldering a rectangular-shaped plated copper wire to an electrode formed on the other surface of the substrate to combine them.
基板と、この絶縁基板の表面側に配置したヒュ−ズ素子
および裏面側に配置したリ−ド部材とを有する温度ヒュ
ーズ並びに異常信号を検知する制御素子を有する保護回
路からなる非復帰型保護装置において、前記ヒューズ素
子を前記制御素子の近傍間隙に実装したことを特徴とす
る温度ヒューズを用いた保護装置。8. A thermal fuse having an insulating substrate having a pattern electrode and a through hole, a fuse element arranged on the front surface side of the insulating substrate and a lead member arranged on the rear surface side, and A non-recoverable type protection device comprising a protection circuit having a control element for detecting an abnormal signal, wherein the fuse element is mounted in a gap in the vicinity of the control element.
を具備し、前記温度ヒューズは低融点合金可溶体を絶縁
キャップで封じしたヒューズ素子とこの温度ヒューズと
熱的結合状態で前記絶縁基板に装着した発熱素子とを具
備し、前記絶縁キャップを2個の制御素子の間隙に嵌め
込んで実装したことを特徴とする請求項8に記載の温度
ヒュ−ズを用いた保護装置。9. The protection circuit includes at least two control elements, and the thermal fuse is a fuse element in which a fusible alloy having a low melting point is sealed with an insulating cap, and the thermal fuse is thermally coupled to the thermal fuse on the insulating substrate. The protection device using the temperature fuse according to claim 8, further comprising a mounted heating element, wherein the insulating cap is fitted into a gap between two control elements and mounted.
池パック用充放電制御回路であり、この制御回路の検知
する異常信号を前記発熱素子で抵抗発熱させ前記ヒュー
ズ素子を作動させることを特徴とする請求項9に記載の
温度ヒュ−ズを用いた保護装置。10. The protection circuit is a charge / discharge control circuit for a battery pack including two control elements, and an abnormal signal detected by the control circuit is resistance-heated by the heating element to activate the fuse element. The protection device using the temperature fuse according to claim 9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002016539A JP2003217416A (en) | 2002-01-25 | 2002-01-25 | Temperature fuse and protective device mounted with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002016539A JP2003217416A (en) | 2002-01-25 | 2002-01-25 | Temperature fuse and protective device mounted with the same |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007319096A Division JP4573865B2 (en) | 2007-12-11 | 2007-12-11 | Protective device using temperature fuse |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003217416A true JP2003217416A (en) | 2003-07-31 |
JP2003217416A5 JP2003217416A5 (en) | 2005-04-28 |
Family
ID=27652569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002016539A Pending JP2003217416A (en) | 2002-01-25 | 2002-01-25 | Temperature fuse and protective device mounted with the same |
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JP (1) | JP2003217416A (en) |
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JP2007087783A (en) * | 2005-09-22 | 2007-04-05 | Uchihashi Estec Co Ltd | Fuse with resistor |
US7286037B2 (en) * | 2002-12-27 | 2007-10-23 | Sony Corporation | Protective element |
JP2009070803A (en) * | 2007-08-20 | 2009-04-02 | Uchihashi Estec Co Ltd | Temperature fuse with resistor and battery protection circuit board |
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