200922448 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種冷卻裝置，特別是指一種液冷式 辅助散熱裝置。 【先前技術】 隨著電子技術的快速進步，電子元件之運作效率大為 提昇，相對地，其運作時所產生的熱能也隨之大幅增加，200922448 IX. Description of the Invention: [Technical Field] The present invention relates to a cooling device, and more particularly to a liquid-cooled auxiliary heat sink. [Prior Art] With the rapid advancement of electronic technology, the operational efficiency of electronic components has been greatly improved. In contrast, the thermal energy generated during its operation has also increased significantly.
為避免電子元件因高熱受損或故障，了一般用於裴設於 電子元件上之散熱風扇外’目前市面上亦有採液冷原理設 計之散熱裝置，如一般常見之直接裝設於電子元件上，而 用以散熱的水冷頭裝置等。 所不，為中華民國申請案號第〇912〇2973號「 電子元件之散熱裝置」新型專利案，肖電子元件之散^裝 置是用於裝設在-運作時會產生高溫的電器設冑4之電子 疋件41上，以輔助該電子元件41散熱，該散熱裝置Q 括中工的吸熱件11、-可於該吸熱件n内流通的冷卻流 體2、-與該吸熱件U之相連通的第—導管12、一斑該吸 熱件Η之相連通的第二導管13、—與該第—、：導管12、 13相連通的冷凝件14、一設置 171 ^ 、该電斋没備3上而接設該 冷凝件14的風扇15，及一設 -^ . 夏於8亥第一導管12上的抽送 ?其中’該冷凝件14具有-分別與該第-、二導管 12、13連通而呈連續彎折狀之 -罟於好、人、泣# 凝^ 141，及複數片間隔 5又置於該冷凝营丨41間的散熱鰭片142 相較於習知直接裝設於電子元件i的水冷頭裝置，上 5 200922448 述「電子元件之散熱裝置」藉由該第一導管12上裝設該抽 U件16 ’而能夠有效提升冷卻流體2於該散熱裝置1内的 循環效率’並可克服因冷卻流體2於管線中之凝結與蒸發 作用對循環流動方向的影響，而免除習知冷凝件14必需高 於該吸熱件11的裝設限制。 然而’儘管藉由上述之設計，確實能使冷卻流體2的 猶環效率有所提升’而加速冷卻流體2之流動，但相對的 ，冷卻流體2通過該冷凝管141之時間也隨之縮短，因此 ，該冷凝管141對通過之冷卻流體2的冷卻效果也隨之降 低，不但無法使冷卻流體2通過該冷凝管141時能有效率 地降至較低的溫度，反而可能導致注入該吸熱件丨丨之冷卻 成體2的溫度過高’而造成整體散熱效率不佳的情形發生 〇 【發明内容】 因此，本發明之目的，即在提供一種可提高散熱效率 以辅助散熱之液冷式辅助散熱裝置。 於是’本發明液冷式輔助散熱裝置，可供容放冷卻流 體於内，包含一冷卻盒、一設置於該冷卻盒上的致冷晶片 、一設置於該致冷晶片上的第二散熱鰭片組。 該冷卻盒具有一界定出一可供容放冷卻流體之循環空 間的盒體’及一設置於該盒體之循環空間内的第一散熱錯 片組’該盒體具有一冷卻流體排出口及一冷卻流體注入口 。該致冷晶片通電後具有一低溫面及一高溫面，該低溫面 是貼覆設置於該冷卻盒之盒體的表面上，而可將容存於該 6 200922448 。該第二散熱鰭片組是設置於該 可將由該高溫面傳導之熱量逸散 冷卻盒中之冷卻流體冷卻 致冷晶片之高溫面上，而 至外部空間。 本發明之功效在於，蕤 藉由於3亥冷郃盒上設置該致冷晶 片及该弟二散熱鰭片組之 置而月b更有效率地使注入該 々部盖内的冷卻流體快速 降/凰田將本發明之液冷式輔助 月文’、、、4置接設於其它液冷彳丑 & 、 式放…、糸統之官路上，即可發揮 辅助散熱功能，以提升整體之冷卻效率。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配σ參考圖式之—個較佳實施例的詳細說明中，將可 清楚的呈現。 多閱圖2 3、4，本發明液冷式輔助散熱裝置3之一較 佳實施例是可供容放冷卻流體2,並用以裝設且連通於一液 冷式散熱系統5上，關助提升該液冷式散熱系統5之冷 卻Α率S夕卜’於本較佳實施例中，該冷卻流體2是採用 冷媒為例’除此之外，該冷卻流體2亦可以採用水、液態 氦等物質，而不應以本較佳實施例所舉之特定範例為限。 該液冷式辅助散熱裝置3包含—概呈—端開放之抽屜 狀的外殼件36, 一容置於該外殼件36内而可供冷卻流體2 容放之冷卻盒31、一容置於該外殼件36内而連通於該冷卻 盒3 1之泵浦組34、一設置於該冷卻盒3丨上的致冷晶片32 、一貼覆設置於該致冷晶片32上的第二散熱鰭片組33，及 二設置於該冷卻盒31上且鄰近於該第二散熱鰭片組33的 200922448 風扇35。另外一提的疋，於該較佳實施例中，該外殼件％ 之悲樣疋般具有相關領域背景者所易於變化轉用，因此 並不應以該較佳實施例中所揭露者為限。 該冷卻盒31具有一界定出一供容放冷卻流體2之循環 空間310而概呈矩形的盒體311，及一設置於該盒體311之 循環空間310内的第一散熱鰭片組312，該盒體311是設置 於該外设件36内，並具有—冷卻流體排出口 313及一冷卻 流體注入口 3 14，且該盒體3丨丨之頂壁362上開設有一可啟 閉而供冷卻流體2灌注之冷卻流體補充口 3丨5。 该泵浦組34是連通於該冷卻盒3丨，並具有一位於該外 殼件36内而用以將冷卻流體2循環抽吸的泵浦34丨、一連 接該冷卻流體排出口 313與該泵浦341間的第一輸送管342 ，以及一端連接該泵浦341而用以將該泵浦341抽取之冷 卻流體2送出的第二輸送管343。 該致冷晶片32是電連接於一電源（圖未示），而具有一 低溫面321及一高溫面322，該低溫面321是貼覆設置於該 冷卻盒31之壁面，而可產生較低的溫度，以將容存於該冷 卻盒31中之冷卻流體2冷卻，並於該致冷晶片32之高溫 面322上，設置有該第二散熱鰭片組33，藉此，而能將該 高溫面322產生之熱量向外傳導逸散。 所述風扇35是設置於該冷卻盒31之盒體311的一側， 且鄰近於該第二散熱鰭片組33，以將該第二散熱鰭片組33 所散發之熱量排除，值得一提的是，於該較佳實施例中是 以設置兩個風扇35為例，但亦可以如圖5所示，僅於該冷 200922448 卻盒31之盒體311的一側，且鄰近該第二散熱鰭片組33( 因視角關係故圖中未示）處設置有一風扇35，或者如圖6所 不，將二風扇35分別設置於該冷卻盒31之盒體311的兩相 反側，且鄰近於該第二散熱鰭片組33(因視角關係故圖中未 示），並配合風扇35之抽風需求，使該外殼件36對應該等 風扇35之設置位置而改變為呈兩端均具開口之態樣，然而 ，所述風扇35的配置，除上述之特定範例外，亦可依實際 需求調整、配置風扇35之數量及裝設位置，故不應受該較 佳實施例之特定範例為限。 復翏閱圖2 、’ §使用本發明液冷式辅助散埶裝置 3,並接設於該液冷式散㈣統5上時，是將該泵浦組μ 之該第二輸送管343與該液冷式散熱系統5之-輸入管線 51相連通，並使該液冷式散熱系統5之-送出管線52連通 於該冷卻盒31之冷卻流體注人口 3U，錢得由該液冷式 散熱系統5送出之吸熱後的冷卻流體2，能經由該送出管線 52而注人該液冷式輔助散熱裝置3之冷卻η〗内，以 輔助之冷卻散熱，並再將μ隊,w ^ 丹將4降溫後之冷卻流體2，由該 組34抽取而經由該第二輸送 系統5之該輸入管線51，= 43再度注入該液冷式散熱 、人，、、_ 、 達到對該液冷式散熱系統5内 之冷卻流體2進一步降溫之功效。 當該冷卻流體2由_冷式散 31内時，冷卻流體2之埶 入鑌冷部益 _ …、量將會傳導至該第一散埶_片έ 312’並藉由該第一散熱鯖 I、、、‘鰭片組 沿該第-散熱鰭片Μ312之：!=之使冷卻流體2 a丨皋k通，並使冷卻流體2在 200922448 冷郃盒31内之迴流路徑受到限制，因此能使冷卻流體2於 該冷卻盒31内停留更長的時間，以達到更佳的熱交換效果 ;同時藉由所述風扇35對該第二散熱鰭片組33之抽風， 以將該第二散熱鰭片組33之熱量帶走，並且，有別於習知 僅在室溫之環境下提供散熱冷卻，該錯W 32是電連接 ^該電_未示），而能藉由該低溫面321對該冷卻盒31 ::更低溫的冷卻效果，並利用該第二散熱鰭片組Μ將該 面322的熱里散發至外部空間，因&，即使冷卻流體2 經由該泵浦組34而產生較快的流動循環時，亦可以在通過 :亥冷部i 31 迅速地受到冷卻，更能達到提高整體散熱 效率以達到對⑦液冷式散熱系統5辅助散熱之功效，另外 ’在裝設於《冷式散熱系統5上時，由於該外殼件^是 將冷卻盒31等元件均集裝於内，故該液冷式辅助散熱裝置 3疋能獨立地設置，並僅須保持與該液冷式散熱系統5連通 即能達到輔助散熱之功效， θ 力效而不需如該液冷式散熱系統5 疋必須直接與所欲散熱之電器裝置相鄰接設置。 人綜上所述，本發明液冷式輔助散熱裝置3是藉由該致 :晶片32及該第二散熱鰭片組33之設置而能對該冷卻 二提供-低溫的冷卻環境，並更有效率地使注入該冷卻 二:1内的冷卻流體2快速降溫’而可發揮更佳的辅助散熱 功此以k升對該液冷式散熱系統5之冷卻效率，故確實能 達到本發明之目的。 ，不所述者，僅為本發明之—個較佳實施例而已， 虽不此以此限定本發明實施之範圍，即大凡依本發明申請 10 200922448 專利範圍及發明說明内容所作之銪留& 今所作之間早的等效變化與修飾 白仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 樣 圖1是一示意圖，說明習知一汸、人i . ^ θ ^液冷式散熱裝置之態 態樣； 圖2是-立體分解圖，說明本發明之—較佳實 施例之 圖3是-移除外殼件之頂壁的立體示㈣； 圖4是一立體示意圖’說明該較佳實施例之使用態樣 圖5是一立體示意圖 扇之另一配置態樣；及 圖6是一立體示意圖 扇之另一配置態樣。 說明該較佳 實施例中具有一風 說明該較佳 實施例中具有二風 11 200922448 【主要元件符號說明】 2 冷卻流體 34 泵浦組 3 液冷式輔助散熱裝 341 泵浦 置 342 第一輸送管 31 冷卻盒 343 第二輸送管 310 循環空間 35 風扇 311 盒體 36 外殼件 312 第一散熱鰭片組 361 底壁 313 冷卻流體排出口 362 頂壁 314 冷卻流體注入口 5 液冷式散熱系統 32 致冷晶片 51 輸入管線 321 低溫面 52 送出管線 322 南溫面 33 第二散熱鰭片組 12In order to avoid damage or malfunction of electronic components due to high heat, the heat-dissipating fan is generally used for mounting on electronic components. Currently, there are heat-dissipating devices designed on the market, such as the common ones, which are directly installed in electronic components. Upper, and water-cooled head device for heat dissipation. No, for the Republic of China application No. 912〇2973 "New Components for Heat Dissipation of Electronic Components", the device for the dissipating of the electronic components is used to install the electrical device that generates high temperatures during operation. The electronic component 41 is arranged to assist the heat dissipation of the electronic component 41. The heat dissipating device Q includes a heat absorbing member 11 of the middle, and a cooling fluid 2 permeable to the heat absorbing member n, and is connected to the heat absorbing member U. a first conduit 12, a second conduit 13 communicating with the heat absorbing member 、, a condensing member 14 communicating with the first, the conduits 12, 13, a setting 171 ^, the electric fasting 3 And the fan 15 connected to the condensing member 14 and the pumping on the first conduit 12 of the 8th sea, wherein the condensing member 14 has - communicating with the first and second conduits 12, 13, respectively The heat-dissipating fins 142 which are placed in the continuous deformation of the condensing camp 41 and the plurality of fins 142 are disposed directly on the electronic component i. Water-cooling head device, the above-mentioned 5 200922448 "heat dissipation device for electronic components" is installed on the first conduit 12 'It is possible to effectively increase the circulation efficiency of the cooling fluid 2 in the heat sink 1' and overcome the influence of the condensation and evaporation of the cooling fluid 2 in the pipeline on the direction of the circulating flow, and the conventional condensing member 14 must be eliminated. The installation of the heat absorbing member 11 is limited. However, 'although the above-described design can surely increase the efficiency of the helium ring of the cooling fluid 2', the flow of the cooling fluid 2 is accelerated, but the time during which the cooling fluid 2 passes through the condensing pipe 141 is also shortened. Therefore, the cooling effect of the condensing pipe 141 on the passing cooling fluid 2 is also reduced, and the cooling fluid 2 can not be efficiently lowered to a lower temperature when passing through the condensing pipe 141, but may cause the injection of the heat absorbing member. The temperature of the cooled body 2 is too high, and the overall heat dissipation efficiency is not good. [Invention] Therefore, the object of the present invention is to provide a liquid-cooled auxiliary that can improve heat dissipation efficiency to assist heat dissipation. Heat sink. Thus, the liquid-cooled auxiliary heat dissipating device of the present invention can accommodate a cooling fluid, and includes a cooling box, a cooling chip disposed on the cooling box, and a second heat dissipating fin disposed on the cooling chip. Slice group. The cooling box has a casing defining a circulation space for accommodating the cooling fluid and a first heat-dissipating error group disposed in the circulation space of the casing. The casing has a cooling fluid discharge port and A cooling fluid injection port. The cooling chip has a low temperature surface and a high temperature surface after being energized, and the low temperature surface is attached to the surface of the casing of the cooling box, and can be stored in the 6 200922448. The second heat dissipating fin set is disposed on the high temperature surface of the cooling chip which can dissipate the heat conducted by the high temperature surface to cool the cooling liquid in the cooling box to the external space. The effect of the present invention is that the cooling fluid injected into the clamshell cover is more efficiently lowered by the arrangement of the refrigerating wafer and the second heat dissipating fin set on the 3H cold box. Huangtian will use the liquid-cooled auxiliary moons ', , and 4 of the present invention to be installed on other official roads of liquid, cold, ugly, and sturdy, and can play an auxiliary heat-dissipating function to enhance the overall Cooling efficiency. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the present invention. 2, 4, a preferred embodiment of the liquid-cooled auxiliary heat sink 3 of the present invention is for accommodating the cooling fluid 2, and is installed and connected to a liquid-cooled heat dissipation system 5, Increasing the cooling rate of the liquid-cooled heat dissipation system 5 In the preferred embodiment, the cooling fluid 2 is exemplified by a refrigerant. In addition, the cooling fluid 2 may also be water or liquid. The substance is not limited to the specific examples given in the preferred embodiment. The liquid-cooled auxiliary heat sink 3 includes a generally open-end drawer-shaped outer casing member 36, a cooling box 31 accommodated in the outer casing member 36 for receiving the cooling fluid 2, and a housing a pumping unit 34 in the outer casing member 36 and communicating with the cooling box 31, a cooling chip 32 disposed on the cooling box 3, and a second heat dissipating fin disposed on the cooling chip 32. The group 33, and the 200922448 fan 35 disposed on the cooling box 31 and adjacent to the second heat radiation fin group 33. In addition, in the preferred embodiment, the outer casing member has a sorrowful appearance and is easily changed and used by those skilled in the relevant art, and therefore should not be limited to those disclosed in the preferred embodiment. . The cooling box 31 has a casing 311 defining a rectangular space for receiving the circulating space 310 of the cooling fluid 2, and a first heat-dissipating fin set 312 disposed in the circulating space 310 of the casing 311. The casing 311 is disposed in the peripheral member 36 and has a cooling fluid discharge port 313 and a cooling fluid injection port 314. The top wall 362 of the casing 3 is openable and closable. The cooling fluid 2 is filled with a cooling fluid supply port 3丨5. The pump set 34 is connected to the cooling box 3丨 and has a pump 34丨 located in the outer casing member 36 for circulating the cooling fluid 2, and a connection between the cooling fluid discharge port 313 and the pump. A first transfer pipe 342 between the puddles 341 and a second transfer pipe 343 to which the pump 341 is connected at one end to feed the cooling fluid 2 extracted by the pump 341. The cooling chip 32 is electrically connected to a power source (not shown) and has a low temperature surface 321 and a high temperature surface 322. The low temperature surface 321 is attached to the wall surface of the cooling box 31 to generate a lower surface. The temperature of the cooling fluid 2 stored in the cooling box 31 is cooled, and the second heat dissipating fin set 33 is disposed on the high temperature surface 322 of the refrigerating wafer 32, thereby being able to The heat generated by the high temperature surface 322 is dissipated outward. The fan 35 is disposed on one side of the casing 311 of the cooling box 31 and adjacent to the second heat dissipation fin set 33 to exclude the heat radiated by the second heat dissipation fin group 33, which is worth mentioning. In the preferred embodiment, two fans 35 are provided as an example, but as shown in FIG. 5, only on the side of the box 311 of the box 31 of the cold 200922448, and adjacent to the second A heat sink fin group 33 (not shown in the drawing) is provided with a fan 35, or as shown in FIG. 6, the two fans 35 are respectively disposed on opposite sides of the box body 311 of the cooling box 31, and adjacent thereto. In the second heat dissipation fin group 33 (not shown in the drawing due to the viewing angle relationship), and in accordance with the exhausting demand of the fan 35, the outer casing member 36 is changed corresponding to the position of the fan 35 to be opened at both ends. The configuration of the fan 35, however, can be adjusted and configured according to actual needs, in addition to the specific examples described above, and should not be limited to the specific example of the preferred embodiment. limit. Referring to FIG. 2, ' § using the liquid-cooled auxiliary bulk dispersing device 3 of the present invention, and being connected to the liquid-cooled dispersing system 4, the second conveying pipe 343 of the pumping group μ is The input line 51 of the liquid-cooled heat dissipation system 5 is connected, and the cooling fluid of the liquid-cooled heat dissipation system 5 is connected to the cooling fluid of the cooling box 31, and the liquid is cooled by the liquid. The heat-absorbing cooling fluid 2 sent out by the system 5 can be injected into the cooling η of the liquid-cooled auxiliary heat sink 3 via the delivery line 52 to assist in cooling and dissipating heat, and then the μ team, w ^ Dan will 4 After the cooling, the cooling fluid 2 is extracted by the group 34 and is reinjected into the liquid cooling heat sink, the person, the _, and the liquid cooling heat through the input line 51 of the second conveying system 5 The cooling fluid 2 in the system 5 is further cooled. When the cooling fluid 2 is in the _cooling mode 31, the enthalpy of the cooling fluid 2 is transferred to the first enthalpy _ έ 312 ′ and is transmitted by the first heat sink 鲭The I, , and 'fin group along the first heat sink fin 312: != causes the cooling fluid 2 a丨皋k to pass, and the return flow path of the cooling fluid 2 in the 200922448 cold box 31 is limited, thus The cooling fluid 2 can be allowed to stay in the cooling box 31 for a longer time to achieve a better heat exchange effect; at the same time, the second heat radiating fin group 33 is ventilated by the fan 35 to The heat of the heat sink fin group 33 is carried away, and it is different from the conventional one to provide heat dissipation cooling only in a room temperature environment, and the fault W 32 is electrically connected to the power source, not shown, and can be used by the low temperature surface. 321 cooling the cooling box 31 to a lower temperature, and using the second fin assembly Μ to dissipate the heat of the surface 322 to the external space, because & even if the cooling fluid 2 passes through the pump group 34 When a faster flow cycle occurs, it can also be quickly cooled by passing through the cold section i 31, which can improve the overall heat dissipation. The rate is to achieve the effect of assisting the heat dissipation of the 7-liquid cooling type heat dissipation system 5, and in addition, when the device is mounted on the "cooling system 5, since the casing member is assembled in the cooling box 31 and the like, The liquid-cooled auxiliary heat sink 3 can be independently disposed, and only needs to maintain the connection with the liquid-cooled heat dissipation system 5 to achieve the effect of assisting heat dissipation, and the θ force effect does not need to be like the liquid-cooled heat dissipation system. It must be placed directly adjacent to the electrical device to be cooled. In summary, the liquid-cooled auxiliary heat dissipating device 3 of the present invention can provide a cooling environment for the cooling device by providing the wafer 32 and the second heat dissipating fin group 33, and more Efficiently cooling the cooling fluid 2 injected into the cooling two: 1 to provide better auxiliary heat dissipation. The cooling efficiency of the liquid cooling heat dissipation system 5 is increased by k, so that the purpose of the present invention can be achieved. . The foregoing is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the retention andampling of the patent scope and invention descriptions of the present application 10 200922448 The early equivalent changes and modifications between the present inventions are still within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a state of the prior art, a human θ ^ θ ^ liquid-cooled heat sink; FIG. 2 is an exploded perspective view showing the preferred embodiment of the present invention. FIG. 3 is a perspective view showing the top wall of the outer casing member. FIG. 4 is a perspective view showing the use of the preferred embodiment. FIG. 5 is another configuration of a stereoscopic fan; Fig. 6 is another configuration of a stereoscopic fan. The preferred embodiment has a wind description. The preferred embodiment has two winds 11 200922448. [Main component symbol description] 2 Cooling fluid 34 Pump group 3 Liquid-cooled auxiliary heat sink 341 Pump set 342 First transport Tube 31 Cooling box 343 Second duct 310 Circulating space 35 Fan 311 Box 36 Housing 312 First fin group 361 Bottom wall 313 Cooling fluid discharge port 362 Top wall 314 Cooling fluid injection port 5 Liquid cooling system 32 Cooling wafer 51 input line 321 low temperature surface 52 delivery line 322 south temperature surface 33 second heat dissipation fin group 12