TW200920212A - Bonding pad structure for electrical circuit - Google Patents

Abstract

A bonding pad structure for bonding FPC (Flexible printed circuit) includes a substrate, a testing pool formed on the substrate, a first bonding pad formed on the substrate and a second bonding pad formed on the substrates. The second bonding pad is located beside the first bonding pad. Further, the first and second bonding pads are located along a predetermined direction.

Description

200920212 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is mainly concerned with a solder bump structure, particularly for a pad structure of a press-bonding technique. (4) 樘 【 [Prior Art] LCD flat panel display has gradually become the mainstream of the display, the space occupied by the main crystal plane 7F is smaller than the traditional cathode vacuum display: however, the process of the liquid crystal flat panel display is more difficult than the cathode vacuum display 'Difficulty, the main reason is that the production of ασ requires considerable technology in every step of the process' and the process requires a higher product f. The press-bonding process is quite important in the process of flat panel displays - including wafer on glass, flexible board laminate substrate (Flexibk pHnted circuit 〇n)

Glass), wafer-bonded flexible circuit board (Chip 〇n扒1) (3) and flexible circuit board printed circuit board (FleXible Printed C Dirty Printed Circuit B〇ard), etc. Technology. Figure la is a diagram of a soft printed circuit board that is normally pressed into a printed circuit board. The figure la shows the pin 91 of the flexible circuit board (for the soft circuit board in the figure), and the pad 81 on the printed circuit board. This is the correct pressing state when the alignment is pressed against the bonding pad. On the other hand, the pressing force of the pin 91 of the flexible circuit board and the printed circuit board (10) has been shifted, And the pin 91 and the pad 81 have a pressed area less than the pin == -, beyond the allowable range of the offset, it is necessary to enter 2 N〇-: AU0706069

Ns UocketNo: 〇632-〇632-A51〗 49TWf (delivery version)/ROBERT 5 200920212 Therefore, in the process of liquid crystal flat panel display, it is necessary to detect the sizing process, and conventionally, the above-mentioned squeezing is checked. The process quality is determined by visual inspection of the product. The indentation of the product and the pressed composition of the product after the pressing process is checked to determine the electrical quality of the pressed compound and the pressed compound. However, it is quite subjective to inspect the product by visual inspection. It can only be judged qualitatively and cannot be quantitatively determined by quantitative inspection unless quantitative testing is performed after the end of the process of pressing the printed circuit board belonging to the latter part of the product. Therefore, many processes belonging to the front part of the product cannot be known early if there is a plague, and waste a lot of time and cost. In addition, the traditional method of visual inspection by personnel also makes the process unable to achieve automation. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a circuit pad structure including a board body and a first solder pad, a second solder pad and a test pad formed on the board body, wherein the second solder pad Located on one side of the first solder pad, and the first solder pad and the second solder pad are disposed along a predetermined direction, that is, parallel along the longitudinal direction of the board. a test pad is disposed between the first solder pad and the second solder pad, and the test pad includes a first contact pad, a second contact pad, a first test pad, and a second test pad, and the first contact pad and the first The two contact pads are disposed along the short side direction of the board body, that is, orthogonal to the predetermined direction of the first solder pad and the second solder pad. In addition, the test pad has a spacing from the first solder pad and the second solder pad, and the pitch is less than or equal to one-half of the width of the pin. When the pin is pressed against the first pad and the second pad, if the offset occurs and the offset exceeds one-half of the width of the pin, the pin will be pressed to the test pad.

Client's Docket No.: AU0706069

Dr rs Docket No: 0632-0632-A5] 149 butyl Wf (delivery version) / ROBERT 6 200920212, and the first contact pad and the second contact pad are electrically connected to form a state of electrical connection. In addition, the present invention provides a circuit pad structure that can be used for pin connection with a flexible circuit board, wherein the circuit pad structure includes a board body and a first group of solder pads, a second group of solder pads and a test formed on the board body. pad. The first group of solder pads and the second group of solder pads are disposed along a predetermined direction, that is, parallel along the longitudinal direction of the board, and the test pad includes a first contact pad, a second contact pad, and a first test pad. And a second test pad, and the first contact pad and the second contact pad are disposed along a short side direction of the board body, that is, orthogonal to a predetermined direction of the first group of solder pads and the second group of solder pads. In addition, the test pad has a distance from the first group of solder pads and the second group of solder pads, and the pitch is less than or equal to one-half of the width of the pins. When the pin is pressed against the first group of solder pads and the second group of solder pads, if the offset occurs and the offset exceeds one-half of the width of the pin, the pin will be pressed to the test lining. And forming a state in which the first contact pad and the second contact pad are electrically connected to each other. In addition, the present invention provides a circuit pad structure that can be applied to a liquid crystal display having a flexible circuit board, and the flexible circuit board has at least one lead, the circuit pad structure including a board body, forming a first soldering pad, a second soldering pad and a test pad on the board, wherein the first soldering pad and the second soldering pad are disposed along a predetermined direction, that is, parallel along the longitudinal direction of the board body The test pad includes a first contact pad, a second contact pad, a first test pad, and a second test pad, and the first contact pad and the second contact pad are disposed along a short side direction of the board, that is, positive A predetermined orientation of the first solder pad and the second solder pad, and a test pad and a first solder pad and a second solder pad

Client’s Docket No·: AU0706069

TTs Docket No: 0632-0632-A51149TWf (delivery version) / R0BERT 7 200920212 distance, and the pitch is less than or equal to one-half of the width of the pin, when the pin is pressed with the first solder pad and the second solder pad When the offset occurs and the offset exceeds one-half of the width of the pin, the pin will be pressed onto the test pad, and the first contact pad and the second contact pad are electrically connected to form an electrical property. The status of the connection. The above described objects, features and advantages of the present invention will become more apparent from the following description of the preferred embodiments of the invention. A schematic plan view of a first embodiment of the structure, as shown in the figure: the circuit pad structure of the embodiment includes a plate body 10, a first group of solder pads 20, a second group of solder pads 30, and a test pad 40, wherein the plate body 10 can be a conventional circuit board, a glass substrate on a display, or any material substrate that can conduct current; the invention is not limited to the constituent materials of the board. The first group of solder pads 20, the second group of solder pads 30, and the test pads 40 are all formed on the board body 10, wherein the first group of pads 20 includes a first pad 201, and the first pad 201 is A group of pads on the rightmost side of the solder pad 20. The second group of solder pads 30 includes a second pad 301, and the second pad 301 is the leftmost pad of the second group of pads 30. The first group of solder pads 20 and the second group of solder pads 30 are disposed along a predetermined direction A. In the present embodiment, the predetermined direction A is along the long side direction of the board body 10, that is, the first group of solder pads 20 And the second group of solder pads 30 are arranged in parallel along the long sides of the board 10, and the test pads 40 are located between the first group of solder pads 20 and the second group of solder pads 30; specifically, in this embodiment The test pad 40 is located between the first pad 201 on the far right side of the first group of solder pads 20 and the second pad 301 on the leftmost side of the second group of solder pads 30. Test lining

Client's Docket No.: AU0706069

TT's DocketNo: 0632-0632-A51149TWf (delivery version)/ROBERT 8 200920212 The pad 40 includes a first contact pad 41, a second contact pad 42, a first test pad 43 and a second test pad 44, wherein the first contact pad 41 and the second contact pad 42 are both formed on the board body 10, and the first contact pad 41 and the second contact pad 42 are disposed along a direction orthogonal to the predetermined direction A; in other words, the first contact pad 41 and the second The contact pads 42 are disposed parallel to the short side direction of the board body 10, and the first contact pads 41 and the second contact pads 42 are located at the same vertical position, but are electrically separated from each other. In addition, the widths of the first contact pads 41 and the second contact pads 42 are equal, so that the sides of the first contact pads 41 and the sides of the second contact pads 42 are substantially aligned with each other, and the first contact pads 41 are in contact with the second contacts. The two sides of the pad 4 2 are separated from each other by a distance d from the rightmost first pad 201 of the first group of solder pads 20 and the leftmost second pad 301 of the second group of solder pads 30, respectively. The first test pad 43 and the second test pad 44 are also formed on the board body 10, and the first test pad 43 is electrically connected to the first contact pad 41, and the second test pad 44 is electrically connected to the second contact pad 42. Referring to FIG. 3a, when the circuit pad structure of the embodiment is applied to a display (for example, a liquid crystal display), the circuit pad structure is combined with the pin 51 of the flexible circuit board 50 on the display, and can be The pad 40 is tested to detect if an offset condition has occurred. In order to clarify the principle and process of the detection, the details of the pin 51 shown in Fig. 3a combined with the first pad 201 and the second pad 301 are enlarged, as shown in Fig. 3b. In Fig. 3b, the design of the distance d between the first pad 201 and the test pad 40 needs to match the width of the pin 51 of the flexible circuit board. In the present embodiment, the pitch d is less than or equal to one-half of the width of the pin 51. For example, when the width of the pin 51 is W, the pitch d is less than or equal to W/2. In this way, when the pin 51 is pressed against the first group of solder pads 20 and the second group of solder pads 30, if the offset occurs and the offset exceeds the pin 51.

Client’s Docket No.: AU0706069

TT's Docket No: 0632-0632-A51149TWf (delivery version) / R0BERT 9 200920212 When the width is one-half, the pin 51 will be pressed onto the test pad 40 and the first contact pad 41 is in contact with the second contact pad 41 The pad 42 is electrically connected to each other, and the first test pad 43 is electrically connected to the first contact pad 41, and the second test pad 44 is electrically connected to the second contact pad 42. Therefore, the first test pad 43 and the second test pad 43 are electrically connected. The test pad 44 is also in a state of being electrically connected; in other words, as long as the first test pad 43 is electrically connected to the second test pad 44, it indicates that the offset has occurred during the press-fitting, and the press-fitting procedure needs to be performed again. . In a second embodiment, the test pad 40 can be disposed between two pads, i.e., a test pad 40 can be disposed between every two pads. As shown in Fig. 4 of Fig. 4, it is a plan view showing a second embodiment of the circuit pad structure of the present invention. In the present embodiment, the test pad 40 is formed on the first pad 201 and the second pad 301, and may of course be disposed between other pads, and the test pad 40 also includes the first contact pad 41 and The second contact pads 42 are located at the same vertical position but are electrically separated from each other. In addition, the widths of the first contact pads 41 and the second contact pads 42 are equal, so that the sides of the first contact pads 41 and the sides of the second contact pads 42 are substantially aligned with each other, and the first contact pads 41 are in contact with the second contacts. The two sides of the pad 42 are separated from each other by a distance d from the first pad 201 (and the second pad 301). Similarly, the first test pad 43 and the second test pad 44 are formed on the board 10, and the first A test pad 43 is electrically connected to the first contact pad 41, and the second test pad 44 is electrically connected to the second contact pad 42. When the circuit pad structure is combined with the pin 51 of the flexible circuit board 50 on the display (also please Referring to Figure 3a, the test pad 40 can also be used to detect the occurrence of an offset (see also Figure 3b). The design of the pitch d still needs to match the width of the pin 51 of the flexible circuit board. Therefore, in this example, the spacing d is still less than or equal to one-half the width of the pin 51.

Client's Docket No.: AU0706069

TT, s DocketNo: 0632-0632-A5] 149TWf (send version) / R0BERT 10 200920212 degrees, for example, when pin 51 * W/2. See also W, the spacing d is less than or equal to such a ', when the wood g丨 is pressed, the two feet 51 and the first pad 201, the second pad 301 - width, the foot /: shift and The contact pad 41 with an offset exceeding the lead 5] looks like _ : έ is pressed onto the test pad 40, and the first state is referred to as the 3rd contact ί 42 is electrically connected. In the first embodiment, the power is: 3b and 5, wherein the 3a is a schematic diagram, and the 3b is the third junction and the pins on the flexible circuit board are connected as the first embodiment. Partially enlarged schematic view, FIG. 5 shows the offset/structure of the junction and the pin on the flexible circuit board. The first embodiment is as shown in FIGS. 3a and 3b, at the first pad 201" Human heart: When the plate 5〇 and the plate stomach 10 are properly pressed together, 51, and respectively; ^ dry 塾 3〇1 should be respectively combined with the corresponding pin abnormality, there will be a factory connection; In the case of the splicing process, the case is shifted by the column i. As shown in Fig. 5: the real pad 44 is inspected: port: two different pairs of the test pad 43 and the second test pin 51 The offset occurs and the offset exceeds 4〇, and the pin 51 is pressed to the test pad u·, and the contact pad 41 and the second contact pad 42 are turned on. :: state 'definite test test * 60 measured the first - test pad 43] When the second = 44 is on, it represents the first contact 塾 41 and the second contact pad ϋ ^ test fixture 6 in Figure 5 By two 'The knife does not touch the first test pad 43 and the second test pad 44. Try: 'When the indicator light 62 with 6 turns on, it means that the first test pad 43 K pad 44 is electrically conductive' also represents The pressing of the flexible plate 1〇 is inaccurate, and the p51 and the first pad 2〇1 or the opposite ^

Client s Docket No.: AU0706069 Dry* T s Docket No: 〇632-0632-A5ll49TWf(5t^®^:)/R〇BERT n 200920212 The nip offset of pad 301 has exceeded the two-point of pin 51 A width can be judged as a poor press at this time, and the press-fitting procedure needs to be repeated. While the present invention has been described above by way of example, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

Client's Docket No.: AU0706069 12

TT’s DocketNo: 0632-0632-A51U9TWf (delivery version)/ROBERT 200920212 [Simple description of the drawing] The first drawing is a schematic diagram of a normal printed circuit board of a flexible circuit board. Figure lb is a schematic view showing the state of the biased deflection of the flexible circuit board and the printed circuit board. Fig. 2 is a plan view showing a first embodiment of the circuit pad structure of the present invention. Fig. 3a is a schematic view showing the structure of the circuit pad in the first embodiment of the present invention and the pin connection on the flexible circuit board. Figure 3b is a partial enlarged view of Figure 3a. Fig. 4 is a plan view showing a second embodiment of the circuit pad structure of the present invention. Fig. 5 is a view showing a state in which the circuit pad structure of the first embodiment of the present invention is offset from the pin connection on the flexible circuit board. [Main component symbol description] 10~ plate body; 20~ first group solder pad; 201~first pad; 30~ second group solder pad; 301~second pad; 40~ test pad; 41~ a contact pad; 42~ second contact pad; 43~ first test 塾; 44~ second test pad; 50~soft circuit board; 51~ pin; 60~ test fixture; 61~ probe; Light; d ~ spacing. A~the established direction;

Client’s Docket No·: AU0706069 TT,s DocketNo: 0632-0632-八51149丁\¥【(送送版)/}1(off £11丁 13

Claims (1)

200920212 X. Patent application scope: 1. A circuit pad structure comprising: a plate body; a first soldering pad formed on the plate body; a second soldering pad formed on the plate body and located at the a side of the first solder pad, wherein the first solder pad and the second solder pad are disposed along a predetermined direction; and a test pad formed on the board and located at the first solder pad Between the second solder pads. 2. The circuit pad structure of claim 1, wherein a distance between the first solder pad and the test pad and between the second solder pad and the test pad is spaced apart. 3. The circuit pad structure of claim 1, wherein the test pad comprises: a first contact pad formed on the board; a second contact pad formed on the board body, Wherein the first contact pad and the second contact pad are disposed along a direction orthogonal to the predetermined direction; a first test pad electrically connected to the first contact pad; and a second test pad Electrically connected to the second contact pad. 4. The circuit pad structure of claim 3, wherein the first contact pad and the second contact pad have substantially the same width. 5. The circuit pad structure of claim 3, wherein the first contact pad is electrically separated from the second contact pad. 6. A circuit pad structure suitable for a flexible circuit board having a pin, the circuit pad structure comprising: a board body; Client's Docket No.: AU0706069 TT, s Docket No: 0632- 0632-A51149TWf (delivery version) / R0BERT 14 200920212 The soldering pad 'is formed on the plate body; the welding is in the middle; on the plate body and located in the first group of the group along a predetermined direction And the second group of solder pad tests (in general, forming I # and the second group of solder pads. "z reverse face and located in the first group of solder pads 7. As claimed in the sixth item of the first group The welding pad and the circuit of the circuit I know the pad structure, wherein the pad and the "two groups of welding pads respectively have a plurality of welding items (four) 亀 structure, with a - contact pad, formed on the plate; a second contact pad formed on the second contact pad system > VL, wherein the first contact pad is -,,, ":r is electrically connected with a contact; The 14 pad is electrically connected to the second contact pad. The test pad is as described in claim 6 of the patent application. And the first > pad structure, wherein the spacing between the spacers and the second group of solder pads is substantially the width of the second contact pad and the second contact pad: η. In the electric power according to item 8 of the patent application scope, the first contact and the second contact pad are electrically separated from each other. U 冓12. As claimed in the eighth item Clienfs Docket No.: AU0706069 TT s Docket No. 0632-0632-A51149TWf(|gfi(:/g2(;:yR〇BERT) When the flexible circuit board is bonded to the board, it is not raised, and the soft board of the board is lightly connected to the first- Test Art II Clienfs Docket No.: AU07^nS〇Λ Le 15 200920212 — Test 塾. As for the circuit Tan pad # 所述 申 申 专利 专利 专利 专利 专利 专利 专利 专利 , 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软 软2丨心+〒里, '口称, the second tan pad (4) (4) is connected to the first-welding pad and 14. A circuit pad structure, suitable for a liquid crystal display with a soft thunder, 'shoulders a liquid lead, the circuit pad structure comprises: a negative main body and a plate body; a welding pad formed on the plate body And the second soldering raft is disposed on the slab and is disposed on the slab and is located on the slab and is located on the slab And wherein the at least-pitch spacing is less than or equal to 15. The test pad comprises: a bad pad... a structure, wherein the test pad comprises: a first contact pad is formed on the plate body; a second contact pad is formed on the plate body, and the second contact pad is along the π ^ 蜀 ^ 一 test pad orthogonal to the predetermined direction Electrically connecting to the first contact pad = and a first test pad, and the second contact pad is electrically. 16. The first contact pad and the f as described in claim 5 The width of the second contact pad is opposite to that of the structure. The circuit solder structure of the circuit of claim 15 is Client's Docket No.: AU0706069 ', TT=s Docket No: 0632-0632-A51149TWf (^ The first contact pad is electrically separated from the second contact pad in W)/R〇BERT 16 200920212. 18. The circuit pad structure of claim 15, wherein the flexible circuit board is coupled to the first test when the flexible circuit board is bonded to the board and is not positioned at a predetermined position. Pad and the second test. 19. The circuit pad structure of claim 14, wherein the flexible circuit board is coupled to the first solder pad and the second solder pad via the pin. Client^ Docket No.: AU0706069 17 TT’s Docket No: 0632-0632-AM149TWf (send version)/R0BERT