TW200920212A - Bonding pad structure for electrical circuit - Google Patents
Bonding pad structure for electrical circuit Download PDFInfo
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- TW200920212A TW200920212A TW96138996A TW96138996A TW200920212A TW 200920212 A TW200920212 A TW 200920212A TW 96138996 A TW96138996 A TW 96138996A TW 96138996 A TW96138996 A TW 96138996A TW 200920212 A TW200920212 A TW 200920212A
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Abstract
Description
200920212 九、發明說明: 【發明所屬之技術領域】 本發明主要關於-種焊塾結構,特別 用於壓合技術之焊墊結構。 ㈣樘應 【先前技術】 液晶平面顯不器已漸成為顯示器的主流,主 晶平面顯7F器所佔空間較傳統陰極真空顯示器來得小:然 而,液晶平面顯示器的製程卻比陰極真空顯示器來得困' 難/、主要理由是產ασ在製程的每广步驟都需要相當的技 術’而且製程需要較高的品f。壓合製程在平面顯示器的 製程中是相當重要的-段,包括晶片壓合基板(Chip on Glass)、軟性電路板壓合基板(Flexibk pHnted circuit 〇n200920212 IX. Description of the invention: [Technical field to which the invention pertains] The present invention is mainly concerned with a solder bump structure, particularly for a pad structure of a press-bonding technique. (4) 樘 【 [Prior Art] LCD flat panel display has gradually become the mainstream of the display, the space occupied by the main crystal plane 7F is smaller than the traditional cathode vacuum display: however, the process of the liquid crystal flat panel display is more difficult than the cathode vacuum display 'Difficulty, the main reason is that the production of ασ requires considerable technology in every step of the process' and the process requires a higher product f. The press-bonding process is quite important in the process of flat panel displays - including wafer on glass, flexible board laminate substrate (Flexibk pHnted circuit 〇n)
Glass)、晶片壓合軟性電路板(Chip 〇n扒以化1£ ⑶地)與軟性電路板壓合印刷電路板(FleXible Printed C臟lt on Printed Circuit B〇ard)等都會利用到壓合製程的 技術。 第la圖係軟性電路板正常壓合印刷電路板的 圖。第la圖中顯示有軟性電路板之引腳91(為易千忍 =圖式中未將軟性電路板”),以及印刷電路板^遍 其上的焊墊81。各引腳91係逐—對準壓合於焊墊Μ人 此即為正確的壓合態樣。另—方面,帛㈣巾所 , 軟性電路板之引腳91與印刷電路板⑽的壓合狀能已= 偏移,且引腳91與焊塾81壓合面積已少於引腳= =之-,超出了偏移量的容許值範圍,必需要進2 N〇-: AU0706069Glass), wafer-bonded flexible circuit board (Chip 〇n扒1) (3) and flexible circuit board printed circuit board (FleXible Printed C Dirty Printed Circuit B〇ard), etc. Technology. Figure la is a diagram of a soft printed circuit board that is normally pressed into a printed circuit board. The figure la shows the pin 91 of the flexible circuit board (for the soft circuit board in the figure), and the pad 81 on the printed circuit board. This is the correct pressing state when the alignment is pressed against the bonding pad. On the other hand, the pressing force of the pin 91 of the flexible circuit board and the printed circuit board (10) has been shifted, And the pin 91 and the pad 81 have a pressed area less than the pin == -, beyond the allowable range of the offset, it is necessary to enter 2 N〇-: AU0706069
n s UocketNo: 〇632-〇632-A51〗49TWf(送件版本)/ROBERT 5 200920212 因此,在液晶平面顯示器的製程中,必需要有對壓合 製程進行檢測,而在傳統上,檢驗上述壓合製程品質都是 利用人員目檢的方式,經由檢驗壓合製程後產品之壓合物 與被壓合物之壓痕是否明顯,以決定壓合物與被壓合物壓 合的電性品質。然而以人貝目檢的方式檢驗產品是相當主 觀的,只能作定性判斷而無法透過定量檢驗來作定量判 斷,除非等到屬於產品後段的壓合印刷電路板製程結束後 才能進行定量的測試。因此,屬於產品前段部分的許多製 程若有瑕疫便無法及早得知,徒浪費許多時間與成本。另 外,傳統上採用人員目檢的方式檢測亦使製程無法達到自 動化的目的。 【發明内容】 有鑑於此,本發明的目的在於提供一種電路焊墊結 構,其包括板體以及形成於板體上之第一焊接墊、第二焊 接墊與測試襯墊,其中第二焊接墊位於該第一焊接墊之一 侧,且第一焊接墊以及第二焊接墊係沿著一既定方向設 置,亦即沿板體的長邊方向平行設置。測試襯墊位於該第 一焊接墊與該第二焊接墊之間,而測試襯墊包括第一接觸 墊、第二接觸墊、第一測試墊以及第二測試墊,且第一接 觸墊與第二接觸墊係沿著板體的短邊方向設置,亦即正交 於第一焊接墊、第二焊接墊的既定設置方向。此外,測試 襯墊與第一焊接墊及第二焊接墊間均具有一間距,且該間 距小於或等於引腳的二分之一寬度。當引腳與第一焊接 墊、第二焊接墊進行壓合時,若發生偏移且偏移量超過引 腳的二分之一寬度的狀況,則引腳將會壓合至測試襯墊Ns UocketNo: 〇632-〇632-A51〗 49TWf (delivery version)/ROBERT 5 200920212 Therefore, in the process of liquid crystal flat panel display, it is necessary to detect the sizing process, and conventionally, the above-mentioned squeezing is checked. The process quality is determined by visual inspection of the product. The indentation of the product and the pressed composition of the product after the pressing process is checked to determine the electrical quality of the pressed compound and the pressed compound. However, it is quite subjective to inspect the product by visual inspection. It can only be judged qualitatively and cannot be quantitatively determined by quantitative inspection unless quantitative testing is performed after the end of the process of pressing the printed circuit board belonging to the latter part of the product. Therefore, many processes belonging to the front part of the product cannot be known early if there is a plague, and waste a lot of time and cost. In addition, the traditional method of visual inspection by personnel also makes the process unable to achieve automation. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a circuit pad structure including a board body and a first solder pad, a second solder pad and a test pad formed on the board body, wherein the second solder pad Located on one side of the first solder pad, and the first solder pad and the second solder pad are disposed along a predetermined direction, that is, parallel along the longitudinal direction of the board. a test pad is disposed between the first solder pad and the second solder pad, and the test pad includes a first contact pad, a second contact pad, a first test pad, and a second test pad, and the first contact pad and the first The two contact pads are disposed along the short side direction of the board body, that is, orthogonal to the predetermined direction of the first solder pad and the second solder pad. In addition, the test pad has a spacing from the first solder pad and the second solder pad, and the pitch is less than or equal to one-half of the width of the pin. When the pin is pressed against the first pad and the second pad, if the offset occurs and the offset exceeds one-half of the width of the pin, the pin will be pressed to the test pad.
Client's Docket No.: AU0706069Client's Docket No.: AU0706069
丁rs Docket No: 0632-0632-A5】149丁Wf(送件版本)/ROBERT 6 200920212 上,並使第一接觸墊與第二接觸墊導通形成電性連接的狀 態。 另外,本發明提供一種電路焊墊結構,可用於與軟性 電路板之引腳連結,其中電路焊墊結構包括板體以及形成 於板體上之第一群焊接墊、第二群焊接墊與測試襯墊。第 一群焊接墊以及第二群焊接墊係沿著一既定方向設置,亦 即沿板體的長邊方向平行設置,而測試襯墊包括第一接觸 墊、第二接觸墊、第一測試墊以及第二測試墊,且第一接 觸墊與第二接觸墊係沿著板體的短邊方向設置,亦即正交 於第一群焊接墊、第二群焊接墊的既定設置方向。此外, 測試襯墊與第一群焊接墊及第二焊群接墊間均具有一間 距,且該間距小於或等於引腳的二分之一寬度。當引腳與 第一群焊接墊、第二群焊接墊進行壓合時,若發生偏移且 偏移量超過引腳的二分之一寬度的狀況,則引腳將會壓合 至測試襯墊上,並使第一接觸墊與第二接觸墊導通形成電 性連接的狀態。 另外,本發明提供一種電路焊墊結構,其可應用於液 晶顯示器上,該液晶顯示器具有軟性電路板,且該軟性電 路板上具有至少一引腳,該電路焊墊結構包括一板體、形 成於板體上之第一焊接墊、第二焊接墊以及測試襯墊,其 中該第一焊接墊以及該第二焊接墊係沿著一既定方向設 置,亦即沿板體的長邊方向平行設置,而測試襯墊包括第 一接觸墊、第二接觸墊、第一測試墊以及第二測試墊,且 第一接觸墊與第二接觸墊係沿著板體的短邊方向設置,亦 即正交於第一焊接墊、第二焊接墊的既定設置方向,此 外,測試襯墊與第一焊接墊及第二焊接墊間均具有一間Dr rs Docket No: 0632-0632-A5] 149 butyl Wf (delivery version) / ROBERT 6 200920212, and the first contact pad and the second contact pad are electrically connected to form a state of electrical connection. In addition, the present invention provides a circuit pad structure that can be used for pin connection with a flexible circuit board, wherein the circuit pad structure includes a board body and a first group of solder pads, a second group of solder pads and a test formed on the board body. pad. The first group of solder pads and the second group of solder pads are disposed along a predetermined direction, that is, parallel along the longitudinal direction of the board, and the test pad includes a first contact pad, a second contact pad, and a first test pad. And a second test pad, and the first contact pad and the second contact pad are disposed along a short side direction of the board body, that is, orthogonal to a predetermined direction of the first group of solder pads and the second group of solder pads. In addition, the test pad has a distance from the first group of solder pads and the second group of solder pads, and the pitch is less than or equal to one-half of the width of the pins. When the pin is pressed against the first group of solder pads and the second group of solder pads, if the offset occurs and the offset exceeds one-half of the width of the pin, the pin will be pressed to the test lining. And forming a state in which the first contact pad and the second contact pad are electrically connected to each other. In addition, the present invention provides a circuit pad structure that can be applied to a liquid crystal display having a flexible circuit board, and the flexible circuit board has at least one lead, the circuit pad structure including a board body, forming a first soldering pad, a second soldering pad and a test pad on the board, wherein the first soldering pad and the second soldering pad are disposed along a predetermined direction, that is, parallel along the longitudinal direction of the board body The test pad includes a first contact pad, a second contact pad, a first test pad, and a second test pad, and the first contact pad and the second contact pad are disposed along a short side direction of the board, that is, positive A predetermined orientation of the first solder pad and the second solder pad, and a test pad and a first solder pad and a second solder pad
Client’s Docket No·: AU0706069Client’s Docket No·: AU0706069
TTs Docket No: 0632-0632-A51149TWf(送件版本)/R0BERT 7 200920212 距,且間距小於或等於引腳的二分之一寬度,當引腳與第 一焊接墊、第二焊接墊進行壓合時,若發生偏移且偏移量 超過引腳的二分之一寬度的狀況,則引腳將會壓合至測試 襯墊上,並使第一接觸墊與第二接觸墊導通形成電性連接 的狀態。 【實施方式】 為使本發明之上述目的、特徵和優點能更明顯易懂, 下文特舉較佳實施例,並配合所附圖式,作詳細說明如下: 第2圖係本發明電路焊墊結構之第一實施例平面示意 圖,如圖所示:本實施例之電路焊墊結構包括有板體10、 第一群焊接墊20、第二群焊接墊30以及測試襯墊40,其 中板體10可為傳統電路板、顯示器上之玻璃基板,或是 任何可以傳導電流之材料基板;本發明不受限於板體的構 成材料。第一群焊接墊20、第二群焊接墊30以及測試襯 墊40均形成於板體10上,其中第一群悍接墊20包括有 第一焊墊201,且第一焊墊201為第一群焊接墊20最右 邊之焊墊。第二群焊接墊30包括有第二焊墊301,且第 二焊墊301為第二群焊接墊30最左邊之焊墊。第一群焊 接墊20與第二群焊接墊30沿著一個既定方向A設置, 在本實施例中,此既定方向A為沿著板體10之長邊方 向,亦即第一群焊接墊20係與第二群焊接墊30沿著板體 10之長邊平行配置,而測試襯墊40位於第一群焊接墊20 與第二群焊接墊30之間;確切而言,在本實施例中,測 試襯墊40位於第一群焊接墊20最右侧的第一焊墊201與 第二群焊接墊30的最左側的第二焊墊301之間。測試襯TTs Docket No: 0632-0632-A51149TWf (delivery version) / R0BERT 7 200920212 distance, and the pitch is less than or equal to one-half of the width of the pin, when the pin is pressed with the first solder pad and the second solder pad When the offset occurs and the offset exceeds one-half of the width of the pin, the pin will be pressed onto the test pad, and the first contact pad and the second contact pad are electrically connected to form an electrical property. The status of the connection. The above described objects, features and advantages of the present invention will become more apparent from the following description of the preferred embodiments of the invention. A schematic plan view of a first embodiment of the structure, as shown in the figure: the circuit pad structure of the embodiment includes a plate body 10, a first group of solder pads 20, a second group of solder pads 30, and a test pad 40, wherein the plate body 10 can be a conventional circuit board, a glass substrate on a display, or any material substrate that can conduct current; the invention is not limited to the constituent materials of the board. The first group of solder pads 20, the second group of solder pads 30, and the test pads 40 are all formed on the board body 10, wherein the first group of pads 20 includes a first pad 201, and the first pad 201 is A group of pads on the rightmost side of the solder pad 20. The second group of solder pads 30 includes a second pad 301, and the second pad 301 is the leftmost pad of the second group of pads 30. The first group of solder pads 20 and the second group of solder pads 30 are disposed along a predetermined direction A. In the present embodiment, the predetermined direction A is along the long side direction of the board body 10, that is, the first group of solder pads 20 And the second group of solder pads 30 are arranged in parallel along the long sides of the board 10, and the test pads 40 are located between the first group of solder pads 20 and the second group of solder pads 30; specifically, in this embodiment The test pad 40 is located between the first pad 201 on the far right side of the first group of solder pads 20 and the second pad 301 on the leftmost side of the second group of solder pads 30. Test lining
Client's Docket No.: AU0706069Client's Docket No.: AU0706069
TT’s DocketNo: 0632-0632-A51149TWf(送件版本)/ROBERT 8 200920212 墊40包括有第一接觸墊41、第二接觸墊42、第一測試墊 43以及第二測試墊44,其中第一接觸墊41和第二接觸墊 42均形成於板體10上,且第一接觸墊41與第二接觸墊 42係沿著正交於既定方向A之方向設置;換言之,第一 接觸墊41與第二接觸墊42係平行於板體10之短邊方向 設置,且第一接觸墊41與第二接觸墊42位於同一垂線位 置上,但彼此電性分離。此外,第一接觸墊41與第二接 觸墊42之寬度相等,故第一接觸墊41之侧邊與第二接觸 墊42之侧邊大致相互切齊,且第一接觸墊41與第二接觸 墊4 2之兩側邊分別相對於第一群焊接墊2 0的最右侧第一 焊墊201及第二群焊接墊30的最左側第二焊墊301相互 分隔一個間距d。第一測試墊43及第二測試墊44亦形成 於板體10上,且第一測試墊43與第一接觸墊41電性連 接,第二測試墊44與第二接觸墊42電性連接。 請參閱第3a圖所示,當本實施例之電路焊墊結構應 用於顯示器上(例如液晶顯示器)時,電路焊墊結構將與顯 示器上軟性電路板50之引腳51結合,並可藉由測試襯墊 40來檢測是否發生偏移的狀況。為了更清楚說明檢測之 原理及過程,在此將第3a圖所示之引腳51與第一焊墊 201及第二焊墊301結合的細部放大,如第3b圖所示。 在第3b圖中,第一焊墊201與測試襯墊40之間距d的設 計需配合軟性電路板之引腳51的寬度。在本實施例中, 間距d係小於或等於引腳51的二分之一寬度,例如當引 腳51寬度為W時,間距d即小於或等於W/2。 如此一來,當引腳51與第一群焊接墊20、第二群焊 接墊30進行壓合時,若發生偏移且偏移量超過引腳51的TT's DocketNo: 0632-0632-A51149TWf (delivery version)/ROBERT 8 200920212 The pad 40 includes a first contact pad 41, a second contact pad 42, a first test pad 43 and a second test pad 44, wherein the first contact pad 41 and the second contact pad 42 are both formed on the board body 10, and the first contact pad 41 and the second contact pad 42 are disposed along a direction orthogonal to the predetermined direction A; in other words, the first contact pad 41 and the second The contact pads 42 are disposed parallel to the short side direction of the board body 10, and the first contact pads 41 and the second contact pads 42 are located at the same vertical position, but are electrically separated from each other. In addition, the widths of the first contact pads 41 and the second contact pads 42 are equal, so that the sides of the first contact pads 41 and the sides of the second contact pads 42 are substantially aligned with each other, and the first contact pads 41 are in contact with the second contacts. The two sides of the pad 4 2 are separated from each other by a distance d from the rightmost first pad 201 of the first group of solder pads 20 and the leftmost second pad 301 of the second group of solder pads 30, respectively. The first test pad 43 and the second test pad 44 are also formed on the board body 10, and the first test pad 43 is electrically connected to the first contact pad 41, and the second test pad 44 is electrically connected to the second contact pad 42. Referring to FIG. 3a, when the circuit pad structure of the embodiment is applied to a display (for example, a liquid crystal display), the circuit pad structure is combined with the pin 51 of the flexible circuit board 50 on the display, and can be The pad 40 is tested to detect if an offset condition has occurred. In order to clarify the principle and process of the detection, the details of the pin 51 shown in Fig. 3a combined with the first pad 201 and the second pad 301 are enlarged, as shown in Fig. 3b. In Fig. 3b, the design of the distance d between the first pad 201 and the test pad 40 needs to match the width of the pin 51 of the flexible circuit board. In the present embodiment, the pitch d is less than or equal to one-half of the width of the pin 51. For example, when the width of the pin 51 is W, the pitch d is less than or equal to W/2. In this way, when the pin 51 is pressed against the first group of solder pads 20 and the second group of solder pads 30, if the offset occurs and the offset exceeds the pin 51.
Client’s Docket No.: AU0706069Client’s Docket No.: AU0706069
TT’s Docket No: 0632-0632-A51149TWf(送件版本)/R0BERT 9 200920212 二分之一寬度時,引腳51將會壓合至測試襯墊40上,並 使第一接觸墊41與第二接觸墊42導通形成電性連接的狀 態,且第一測試墊43與第一接觸墊41電性連接,第二測 試墊44與第二接觸墊42電性連接,所以第一測試墊43 與第二測試墊44也會形成電性連接的狀態;換言之,只 要發現第一測試墊43與第二測試墊44形成電性連接的狀 態,則表示壓合時已發生偏移,需重新進行壓合程序。 在第二實施例中,測試襯墊40可配置於兩個焊墊之 間,亦即在每兩個焊墊之間均可設置有測試襯墊40。如 f 4 第4圖所示:,其為本發明電路焊墊結構之第二實施例平面 示意圖。在本實施例中,測試襯墊40係形成於第一焊墊 201與第二個焊墊301,當然亦可設置於其他焊墊間,而 測試襯墊40同樣包括有第一接觸墊41與第二接觸墊42, 且位於同一垂線位置上但彼此電性分離。此外,第一接觸 墊41與第二接觸墊42之寬度相等,故第一接觸墊41之 側邊與第二接觸墊42之侧邊大致相互切齊,且第一接觸 墊41與第二接觸墊42之兩側邊分別相對於第一焊墊201 ( 及第二焊墊301相互分隔一個間距d。 同樣地,第一測試墊43及第二測試墊44皆形成於板 體10,且第一測試墊43與第一接觸墊41電性連接,第 二測試墊44與第二接觸墊42電性連接。 當電路焊墊結構與顯示器上軟性電路板50之引腳51 結合時(同樣請參閱第3a圖所示),亦可藉由測試襯墊40 來檢測是否發生偏移的狀況(同樣請參閱第3b圖所示)。 間距d之設計仍需配合軟性電路板之引腳51寬度,因此 在本例中,間距d仍為小於或等於引腳51的二分之一寬TT's Docket No: 0632-0632-A51149TWf (delivery version) / R0BERT 9 200920212 When the width is one-half, the pin 51 will be pressed onto the test pad 40 and the first contact pad 41 is in contact with the second contact pad 41 The pad 42 is electrically connected to each other, and the first test pad 43 is electrically connected to the first contact pad 41, and the second test pad 44 is electrically connected to the second contact pad 42. Therefore, the first test pad 43 and the second test pad 43 are electrically connected. The test pad 44 is also in a state of being electrically connected; in other words, as long as the first test pad 43 is electrically connected to the second test pad 44, it indicates that the offset has occurred during the press-fitting, and the press-fitting procedure needs to be performed again. . In a second embodiment, the test pad 40 can be disposed between two pads, i.e., a test pad 40 can be disposed between every two pads. As shown in Fig. 4 of Fig. 4, it is a plan view showing a second embodiment of the circuit pad structure of the present invention. In the present embodiment, the test pad 40 is formed on the first pad 201 and the second pad 301, and may of course be disposed between other pads, and the test pad 40 also includes the first contact pad 41 and The second contact pads 42 are located at the same vertical position but are electrically separated from each other. In addition, the widths of the first contact pads 41 and the second contact pads 42 are equal, so that the sides of the first contact pads 41 and the sides of the second contact pads 42 are substantially aligned with each other, and the first contact pads 41 are in contact with the second contacts. The two sides of the pad 42 are separated from each other by a distance d from the first pad 201 (and the second pad 301). Similarly, the first test pad 43 and the second test pad 44 are formed on the board 10, and the first A test pad 43 is electrically connected to the first contact pad 41, and the second test pad 44 is electrically connected to the second contact pad 42. When the circuit pad structure is combined with the pin 51 of the flexible circuit board 50 on the display (also please Referring to Figure 3a, the test pad 40 can also be used to detect the occurrence of an offset (see also Figure 3b). The design of the pitch d still needs to match the width of the pin 51 of the flexible circuit board. Therefore, in this example, the spacing d is still less than or equal to one-half the width of the pin 51.
Client's Docket No.: AU0706069Client's Docket No.: AU0706069
TT,s DocketNo: 0632-0632-A5]149TWf(送件版本)/R0BERT 10 200920212 度,例如,當引腳51 * W/2。 見又為W時,間距d即小於或等於 如此一'來,木g丨 進行壓合時,甚二腳51與第一焊墊201、第二焊墊301 -寬度,,腳/ :移且偏移量超過引腳5】的二分之 接觸墊41輿望_ : έ壓合至測試襯墊40上,並使第一 請參閱第3=觸ί 42導通形成電性連接的狀態。 第一實施例中電^ : 3b圖及第5圖,其中第3a圖係 示意圖,第3b圖係第3結图構與軟性電路板上之引腳連結 為第―實施例令带路/孰圖之局部放大示意圖,第5圖則 結發生偏移之狀/結構與軟性電路板上之引腳連 第一實施例ί 如第3a圖及第3b圖所示,在 第-烊墊201“ _人心:板5〇與板胃10正確壓合時, 51上,並分別;^干塾3〇1應分別堡合於相對應的引腳 異常,則會形成有厂連結;然:而,若於壓合製程發生 施例係藉由列i移的情況’如第5圖所示:本實 墊44進行檢:口:二別對弟一測試墊43及第二測試 引腳51的二f合難發生偏移且偏移量超過 4〇上,並^ Γ 引腳51便會壓合至測試襯墊 u·、击 使弟—接觸墊41與第二接觸墊42導通來杰爺 第一::態’故當測試治* 60量測到第-測試墊43】 二=44導通時,代表第—接觸塾41與第二接觸墊 探ϋ ^ 第5圖中的測試治具6 〇係藉由兩個 者、’刀別觸抵於第一測試墊43及第二測試墊44上, 試:'具6〇之指示燈62亮起時,表示第-測試墊43 K墊44即已電性導通’亦代表軟性 板體1〇的壓合不準確,引胳p51與第一焊墊2〇1或反^TT, s DocketNo: 0632-0632-A5] 149TWf (send version) / R0BERT 10 200920212 degrees, for example, when pin 51 * W/2. See also W, the spacing d is less than or equal to such a ', when the wood g丨 is pressed, the two feet 51 and the first pad 201, the second pad 301 - width, the foot /: shift and The contact pad 41 with an offset exceeding the lead 5] looks like _ : έ is pressed onto the test pad 40, and the first state is referred to as the 3rd contact ί 42 is electrically connected. In the first embodiment, the power is: 3b and 5, wherein the 3a is a schematic diagram, and the 3b is the third junction and the pins on the flexible circuit board are connected as the first embodiment. Partially enlarged schematic view, FIG. 5 shows the offset/structure of the junction and the pin on the flexible circuit board. The first embodiment is as shown in FIGS. 3a and 3b, at the first pad 201" Human heart: When the plate 5〇 and the plate stomach 10 are properly pressed together, 51, and respectively; ^ dry 塾 3〇1 should be respectively combined with the corresponding pin abnormality, there will be a factory connection; In the case of the splicing process, the case is shifted by the column i. As shown in Fig. 5: the real pad 44 is inspected: port: two different pairs of the test pad 43 and the second test pin 51 The offset occurs and the offset exceeds 4〇, and the pin 51 is pressed to the test pad u·, and the contact pad 41 and the second contact pad 42 are turned on. :: state 'definite test test * 60 measured the first - test pad 43] When the second = 44 is on, it represents the first contact 塾 41 and the second contact pad ϋ ^ test fixture 6 in Figure 5 By two 'The knife does not touch the first test pad 43 and the second test pad 44. Try: 'When the indicator light 62 with 6 turns on, it means that the first test pad 43 K pad 44 is electrically conductive' also represents The pressing of the flexible plate 1〇 is inaccurate, and the p51 and the first pad 2〇1 or the opposite ^
Client s Docket No.: AU0706069 干* T s Docket No: 〇632-0632-A5ll49TWf(5t^®^:)/R〇BERT n 200920212 墊301的壓合偏移已超過了引腳51的二分之一寬度,此 時即可判定為壓合不良,需重新進行壓合程序。 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明,任何具有本發明所屬技術領域之通常知識者,在 不脫離本發明之精神和範圍内,當可作各種更動與潤飾, 因此本發明之保護範圍當視後附之申請專利範圍所界定 者為準。Client s Docket No.: AU0706069 Dry* T s Docket No: 〇632-0632-A5ll49TWf(5t^®^:)/R〇BERT n 200920212 The nip offset of pad 301 has exceeded the two-point of pin 51 A width can be judged as a poor press at this time, and the press-fitting procedure needs to be repeated. While the present invention has been described above by way of example, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
Client's Docket No.: AU0706069 12Client's Docket No.: AU0706069 12
TT’s DocketNo: 0632-0632-A51U9TWf(送件版本)/ROBERT 200920212 【圖式簡單說明】 第la圖係軟性電路板正常壓合印刷電路板的示意圖。 第lb圖係顯示係軟性電路板與印刷電路板的壓合偏 移狀態示意圖。 第2圖係本發明電路焊墊結構之第一實施例平面示意 圖。 第3a圖係本發明第一實施例中電路焊墊結構與軟性 電路板上之引腳連結不意圖。 第3b圖係第3a圖之局部放大示意圖。 第4圖係本發明電路焊墊結構之第二實施例平面示意 圖。 第5圖係本發明第一實施例中電路焊墊結構與軟性電 路板上之引腳連結發生偏移之狀態示意圖。 【主要元件符號說明】 10〜板體; 20〜第一群焊接墊; 201〜第一焊墊; 30〜第二群焊接墊; 301〜第二焊墊; 40〜測試襯墊; 41〜第一接觸墊; 42〜第二接觸墊; 43〜第一測試塾; 44〜第二測試墊; 50〜軟性電路板; 51〜引腳; 60〜測試治具; 61〜探針; 62〜指示燈; d〜間距。 A〜既定方向;TT’s DocketNo: 0632-0632-A51U9TWf (delivery version)/ROBERT 200920212 [Simple description of the drawing] The first drawing is a schematic diagram of a normal printed circuit board of a flexible circuit board. Figure lb is a schematic view showing the state of the biased deflection of the flexible circuit board and the printed circuit board. Fig. 2 is a plan view showing a first embodiment of the circuit pad structure of the present invention. Fig. 3a is a schematic view showing the structure of the circuit pad in the first embodiment of the present invention and the pin connection on the flexible circuit board. Figure 3b is a partial enlarged view of Figure 3a. Fig. 4 is a plan view showing a second embodiment of the circuit pad structure of the present invention. Fig. 5 is a view showing a state in which the circuit pad structure of the first embodiment of the present invention is offset from the pin connection on the flexible circuit board. [Main component symbol description] 10~ plate body; 20~ first group solder pad; 201~first pad; 30~ second group solder pad; 301~second pad; 40~ test pad; 41~ a contact pad; 42~ second contact pad; 43~ first test 塾; 44~ second test pad; 50~soft circuit board; 51~ pin; 60~ test fixture; 61~ probe; Light; d ~ spacing. A~the established direction;
Client’s Docket No·: AU0706069 TT,s DocketNo: 0632-0632-八51149丁\¥【(送件版本)/}1(犯£11丁 13Client’s Docket No·: AU0706069 TT,s DocketNo: 0632-0632-八51149丁\¥【(送送版)/}1(off £11丁 13
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TW96138996A TWI420997B (en) | 2007-10-18 | 2007-10-18 | Bonding pad structure for electrical circuit |
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TW96138996A TWI420997B (en) | 2007-10-18 | 2007-10-18 | Bonding pad structure for electrical circuit |
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CN105988056A (en) * | 2015-02-04 | 2016-10-05 | 凌巨科技股份有限公司 | Layout structure for detecting bonding reliability of circuit |
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JP2002313864A (en) * | 2001-04-12 | 2002-10-25 | Nec Corp | Semiconductor device |
TWI302290B (en) * | 2005-08-17 | 2008-10-21 | Au Optronics Corp | Structure for circuit assembly |
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CN105988056A (en) * | 2015-02-04 | 2016-10-05 | 凌巨科技股份有限公司 | Layout structure for detecting bonding reliability of circuit |
CN105988056B (en) * | 2015-02-04 | 2018-10-09 | 凌巨科技股份有限公司 | Detection circuit engages the layout structure of reliability |
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