200914239 九、發明說明： 【發明所屬之技術領域】 本發明係主張關於2007年9月21日申請之曰本專利案號 — 特願2007-245819之優先權。藉以引用的方式併入本文用作參 考。 本發明係關於一種用以對壓模進行擠壓，而將微細形狀之 圖案轉印至熱塑性板的表面的熱壓成形裝置及其應用之模具 糸統。 【先前技術】 習知之熱壓成形裝置係用於成形於表面具有微細形狀之 圖案之光學零件或高創意性之面板’例如，液晶顯示器之背光 用導光板或擴散板、以及透鏡或光碟基板。用於進行此種熱壓 成形之模具之構造例如已揭示於日本專利特開2〇〇4_74769號 公報。根據該揭示，將板狀之壓模，安裝於具有加熱冷卻機構 之加熱冷卻板之上，藉由加熱冷卻板而對壓模進行加熱冷卻， 接著，經由加熱冷卻板而將壓模按壓至熱塑性樹脂板之表面。 【發明内容】 [發明所欲解決之問題] 經習知熱壓成形而經轉印之形狀圖案之凹凸高度一妒而 言為數微米Um)至數十微米（_)。另―方面，作為被加 料之熱塑性樹脂板之厚度具有扨」mm左右之不均。、 於安裝壓模之模具之尺寸、壓模自身之厚度及平面 0.01〜0.05 mm左右之不均。 于牡 5 200914239 〆又，曰本專利特開2004-74769號公報中揭示之熱壓成形 係將經加熱冷卻板加熱之㈣下的麈模施胁被加工材料之 表面，接判用該加熱冷卻板來冷卻顧後，使壓模對被加工 材料之施壓結走。+ Α #、入，、1 , a 士 。采因此，加熱冷部板上會產生加熱冷卻時 畸變所導致之翹曲。 =上述現㈣導致在成料翻與被加讀料之接觸面 上之壓力分布不均勻，從而產生以下局面，即，麗模之一部分 無法以所需璧力對被加工材料進行施壓。其結果為，於被加工 材料之表^局部地產生圖案未被完全轉印（未轉印）之缺陷。 又’當被加工材料為厚度極薄之薄板材料時（例如，！麵 =下\’若_與被加叫料之接觸面上之壓力分布產生差 ^則被加材料之板厚方向之_變形量會產生差異，並且 ^加工材料之面方向之延展變形量亦會產生局部之差里。錄 果’被加叫料上容易產生翹曲或料。 …、、·，口 轉印戶^力解^些問題而想到了若干對策。例如，負載較大於 轉加屢力以上之加屢力。或者，增加愿模之加熱 以降低轉印所需之面壓力。或 ，、、"皿又 被加工㈣夕Μ * -者L長將已加熱之歷模按壓於 被加工材叙按壓時間，增域加 所需之面勤。 —之軟化層而降低轉印 而且該些對策不僅增加設備成本、運轉成本、生產時間 而且要將過量之溫度或轉力施 ， 成形時她藤之賴，麵職权後，=;=增力 料側面進行後加工。尤其當被加 4對已祕之材 材科為缚板材料時，會增加 200914239 其龜曲或彎曲。 目此，本發明之目的錄，在將凹凸圖案轉印至熱塑性板 之表面之熱壓成形中，使熱塑性板與墨模之接觸狀態均一化。 [解決問題之技術手段] ，根據本發明之一實施例，用以對顧I42進行顧而將形 狀圖案轉印至被加工材料2 〇 〇 (如熱塑性板)表面的熱壓成形裴 置1〇〇包3 .壓製裝置，其具有承載板102、滑動板1〇4、及 對上述β動板進行驅動之驅動裝置1〇6 ;以及模組112、， 其係搭載於上述滑動板或承載板上，且包括框體120、底板(為 熱板136或隔熱板326)、彈性體(為橡膠構件138、328)、柔性 頂板140、及加熱冷卻機構(為熱板136或熱交換管33〇)。框 體120内部為具有彈性之收納空間。底板插入至框體12〇之内 部，且以使收納空間之容積以可改變之方式而相對於框體12〇 進行滑動。彈性體收納於收納空間内，且當底板以使收納空間 之容積縮小之方式滑動時受到壓縮。柔性頂板14〇安裝於框體 120，且具有面向收納空間之内表面與支持壓模之外表面。加 熱冷卻機構使用熱媒流體來對壓模142進行加熱及冷卻。而 且，當底板以使收納空間之容積縮小之方式滑動時，柔性頂板 140於内表面承受經壓縮之彈性體的彈性力而向外方變形。 於較佳之實施例中，彈性體係橡膠構件或樹脂構件，橡膠 構件或樹脂構件無間隙地填充於收納空間内。橡膠構件或樹脂 構件具有處於與框體之内表面相接區域附近的第丨區域、及第 1區域内側之第2區域。填充於第1區域之第1橡膠構件或第 200914239 1樹脂構件之硬度高於填充於第2區域之第2橡膠構件或第2 樹脂構件之硬度。 於較佳之實施例中，加熱冷卻機構形成於底板内，熱媒流 體通過熱板内部。 於該情形時，彈性體係橡膠構件或樹脂構件，橡膠構件或 樹脂構件無間隙地填充於收納空間内。進而，橡膠構件或樹脂 構件具有處於與框體之内表面相接區域附近的第1區域、及第 1區域内側之第2區域，第2區域由混入有用以提高熱導率之 添加劑的橡膠材料或樹脂材料所構成，第丨區域由未混入有添 加劑或所混入之添加劑量少於第2區域之橡膠材料或樹脂材 料所構成。 於較佳之實施例中，加熱冷卻機構係通過彈性體内部之熱 交換管，熱媒流體通過熱交換管之内部。 於該情形時，彈性體係橡膠構件或樹脂構件，橡膠構件或 树月曰構件無間隙地填充於收納空間内。進而’橡膠構件或樹脂 構件具有：由與框體之内表面相魏域附近及與熱板相接之區 域附近構成的第i區域、以及由第i區域所包圍之區域及愈頂 板之内表面相接區域附近的第2區域，填充於第ι區域之第i =^件或第丨樹脂構件其硬度高於填充於第2區域之第2橡 勝構件或第2樹脂構件之硬度。 件心 =體係橡膠構件或樹月旨構件，橡膠構件或樹脂構 體之内表面相接區域附近及與熱板相接之區域㈣ 200914239 f成的第1區域'以及由第1區域所包圍之區域及與頂板之内 表面相接區域附近的第2區域，第2區域由混人用以提高 率之添加__材料或樹脂材料所構成，第丨區域由未以 有添加劑或所以之添加缝少於第2區域之 脂材料所構成。 衬 於較佳之實施例中，壓模以其所有外緣處於彈性變形區域 之外侧方式，支持於頂板外表面，彈性變形區域係頂板之内表 面承受彈性體彈性力後向外方變形而成之區域，熱壓成形裝置 將形狀圖案轉印至熱塑性板的表面，該熱塑性板以其所有外緣 處於彈性變形區域外側之方式配置。 ν 於較佳之實施例中，壓模以其所有外緣處於彈性變形區域 外側之方式，支持於頂板之外表面，彈性變形區域係頂板之内 表面承受彈性雜性力後向外方變形而成之區域。鍾成形裝 置更包括間隔件’關隔件具有實f上與熱_板相同之板厚 且由剛體構成，對間隔件進行岐，使得#_性板的所有外 緣處於彈性變顧域_時’間隔件之所有外緣處於彈性變形 區域外緣之外側’且間隔件之内緣較熱塑性板的外緣稍偏向外 側。 根據本發明之一實施例，用以對壓模142進行擠壓而將形 狀圖案轉印至被加工材料2〇〇(如熱塑性板)表面的熱壓成形裝 置1〇〇包含：壓製裝置，其具有承載板1〇2、滑動板104、及 對滑動板進行驅動之驅動裝置1〇6 ;以及模組112、114，其係 搭载於滑動板或承载板，且包括框體120、底板、低熔點合金 200914239 構件、頂板140、及加熱冷卻機構（為熱板136或熱交換管 330)。框體120於内部具有收納空間’底板(為熱板136或隔 熱板326)插入至框體内部，且以使收納空間之容積可改變方式 而進行滑動。低熔點合金構件收納於收納空間内且熔點低於熱 塑性板的軟化溫度。頂板140安裝於框體，且具有面向收納空 間之内表面及支持壓模之外表面。加熱冷卻機構使用熱媒流體 來對壓模進行加熱及冷卻。而且，當收納空間之容積因熱板而 縮小時，柔性頂板於内表面承受來自低熔點合金構件之按壓力 而向外方變形。 根據本發明之一實施例，用於熱壓成形裝置之模具系統包 含格載於壓製裝置之滑動板或承載板上之模組、114，熱 壓成形裝置用以對壓模進行擠壓而將凹凸圖案轉印至熱塑: 板的表面。該模組包含：框體12〇，其於内部具有彈性體之收 納空間；底板(為熱板136或隔熱板326)，其插入至框體之内 部，且以使收納空間之容積以可改變方式而相對於框體進= 動；彈性體(為橡膠構件138、32δ)，其收納於收納空間内^滑 於底板以使I納空間之容積縮小方式進行滑_受到壓维；^ 度頂，刚’其文襄於框體’且具有面向收納空間之内表面、 支持塵模之外表面；以及加熱冷卻機構(為熱板136或熱= 管330)，其使肖熱媒流體來對顯物加熱及冷卻。而且\ 底板以使_”之容韻付錢行_時，纽頂板^ 表面承受經壓縮彈性體彈性力而向外方變形。 内 【實施方式】 200914239 以下，請參照圖式以對本發明一實施例之熱壓成形裝置進 行說明。 圖1表示本發明之第一實施例之熱壓成形裝置的整體構 成。 熱壓成形裝置1〇〇構成為通用之壓製裝置與用於熱壓成 形之模具系統之組合。通用之壓製裝置包含固定於地面之承載 板102、及配置於承載板102之上方之滑動板104。滑動板104 藉由驅動裝置106而受到驅動，藉此，以接近或遠離承載板 1〇2之方式而沿著未圖示之支柱於上、下方移動。驅動裝置ι〇6 例如亦可包含對滑動板104進行驅動之伺服馬達、以及驅動並 控制伺服馬達之控制器。對於驅動裝置106而言，亦可使用利 用油壓致動器之驅動裝置’以代替使用伺服馬達之驅動裝置。 模具系統包含上、下模組112、114，該上、下兩模組112、 Π4以彼此相對配置之方式而分別搭載於承載板1〇2與滑動板 104。圖2為第一實施例之該兩模組η]、114部分之放大圖。 兩模組112、114實質上具有相同之構成’因此以上模組U2 為例，請參照圖1與圖2對其構成進行說明。 上模組112包含基底板116、冷卻板118、框體120、框體 支持機構122、熱板136、作為彈性體之橡膠構件138、柔性 頂板140及框架126。 基底板116大致呈矩形之板形，且固定於滑動板1〇4上。 冷卻板118大致呈矩形，且固定於基底板116之中央。冷 卻板118内形成有複數個水孔119，各水孔119相通。相通水 11 200914239 孔119之一端部連接冷卻水供給口供給冷卻水，並使冷卻水自 相通之水孔另一端部連接之冷卻水返回口流出而循環，藉此使 冷卻板118之溫度保持固定，從而阻止熱板之熱量向基底板 116側傳遞。 框體支持機構122固定於冷卻板118上。框體支持機構 122及框體12〇大致呈矩形之筒形。框體支持機構122包含嵌 座128與彈簧130 ’嵌座128經由彈簧13〇來對框體12〇進行 支持。框體120藉由彈簧13〇而向下方施壓。框體支持機構 122之底部形成有開口，熱板136自該開口插入至框體支持機 構122及框體120之内側。 框架126大致呈矩形，且固定於基底板116上。於框架 126之頂面上安裝有具有真空襯墊之密閉齒條132。當框架 下降，密閉齒條132與下模組ι14之密閉齒條132抵接時，於 密閉齒條之内側形成真空腔室。真空腔室係藉由未圖示之真空 泵進行真空抽吸，且藉由大氣開放閥而對大氣開放。 熱板136大致呈矩形，且固定於冷卻板118上。熱板136 為加熱、冷卻機構，於其内部形成有作為熱媒流體通路之複數 個水孔141。水孔141例如沿著熱板之長度方向彼此平行且等 間距地自熱板136之-端面貫通至另—端面為止而形成，兩端 部藉㈣封栓143㈣。藉由設置於各水孔141之長度方向兩 側之歧官145來連結各水孔14ι。當進行加熱時，自連結於一 歧管145之熱媒供給口所供給之高溫熱媒流體（蒸 油），通過各水孔⑷而自另—歧管145排出。藉此，對ς 12 200914239 構件138進行加熱。當進行冷卻時，低溫之熱雜體（冷卻水、 低溫油等）以相同路徑通過各水孔141，以使橡膠構件138冷 郃。於熱板136之歧管145内側形成有隔熱狹縫147，防止歧 管145之熱量擴散。 熱板136插入至框體12〇内，框體12〇之内側面與熱板 136之外側面密接。於框體12〇之内側面與熱板136之外側面 密接狀態下，熱板136可相對於框體12〇而向上、下方向（被 加工材料之厚度方向）移動。換言之，框體12〇可相對於熱板 136而向上、下方向移動。亦即，熱板136相對於框體12〇滑 動，藉此實現作為底板之作用。 柔性頂板14 0藉由螺栓等之固定機構而固定於框體丨2 〇之 頂面。頂板140以使框體12〇之頂面開口部121密閉之方式而 受到固定。頂板140之厚度例如可為〇 5〜3mm左右。 框體120於其内部藉由頂板14〇、熱板136 '框體12〇之 側壁而形成收納空間124。該收納空間124内收納有橡膠構件 138。該收納空間124實質上已密閉，不會使橡膠構件138漏 出。熱板136相對於框體12〇滑動，隨之，已密閉之收納空間 124容積發生變化。 橡膠構件138收納於由熱板136、框體12〇及頂板14〇所 形成之收納空間124内。例如，收納空間124内亦可無間隙地 填充有橡膠構件138。橡膠構件138亦可為提高熱導率之橡賸 構件。橡膠構件138之材質將於以下進行敍述。 再者，本說明書中，主要對使用橡膠構件作為彈性體構件 13 200914239 之-例的實施例進行說明，但亦可代替橡膠而使用其他彈性 體，例如使用合成樹脂等。亦可使用氟樹脂作為合成樹脂之一 例。氟樹脂中，例如，可使用四氟乙烯樹脂（pTFE，㈧卜 tetrafluoroethylene)。PTFE具有如下所示之物理性質。 耐熱性：260°C 拉伸強度：13.7〜34.3 MPa 延展：200〜400% 硬度：蕭氏D50〜55 彎曲模數：550 GPa 拉伸模數：400〜550 GPa 熱導率：0.25 W/mk 模組112之頭部外表面（頂面）上固定有柔性之較薄壓模 丨42。作為壓模142之狀方法，例如，可使用真空吸附（省 略為此所使用之真空泵之圖示）與固定夾具之組合，該真空吸 附係藉由於頂板140外表面上加工出之真空吸附槽而實施，該 固定夾具設置於頂板14〇外表面上。 圖3B係對被加工材料2〇()進行衝壓時加壓狀態之說明圖 示’圖3A係A-A剖面圖。 如圖3A所示，壓模142之尺寸大於框體12〇開口部121， 且以其所有外緣處於開口部121外側之方式而密接於頂板14〇 外表面。被加工材料之尺寸亦大於框體12之開口部121，且 0又置成其所有外緣處於開口部121外側。 以下’請參照圖1至圖為說明對被加工材料200 (如熱塑 14 200914239 性板)進行衝壓時之動作。再者，此處，對上、下模組ιΐ2、ιΐ4 之動作進行說明，於下文中對溫度控制進行說明。 當上模組112相對於以圖丨所示方式設置之下模組114下 降日守，上、下壓模142、142與被加工材料2〇〇之兩面相接觸 (加壓開始狀態）。此時之狀態為圖3B之左側。當自壓模142、 142與被加工材料2〇〇之兩面相接觸之狀態開始，接著上模組 112下降而施加加壓力時，框體12〇亦會抵抗彈簧13〇之施壓 力而向基底板116側後退。與此同時，橡膠構件138承受來自 熱板136之按壓力及來自被加工材料2〇〇之斥力，其體積減 小，内壓增大。亦即，橡膠構件138受到壓縮。接著，熱板 136相對於框體120前進因橡膠構件138之體積受到壓縮而減 小之部分。 此時，受到壓縮之橡膠構件Π8藉由彈性而產生均一之按 壓力。因此，若將橡膠構件138無間隙地填充於由框體12〇、 熱板136及頂板140所形成之收納空間124内，則藉由受到壓 縮之橡膠構件138，該收納空間124内之壓力會均勻地上升。 此時’框體120利用彈簧130之施壓力而被擠壓於頂板14〇， 因此橡膠構件138不會自頂板140與框體120之間之間隙漏 出。此處，除了柔性頂板140之外，形成收納空間124之所有 内壁均為剛體，不會因受到壓縮之橡膠構件138之彈性力而發 生變形。與此相對’柔性頂板140於内表面承受受到壓縮之橡 膠構件138之彈性力，從而會以向外方膨脹之方式發生變形。 此處’柔性頂板140以向外方膨脹之方式發生變形之彈性變形 15 200914239 區域，實質上與框體120之開口部121相同。 當進行如圖3B所示之熱壓成形時 H2向作秘塑性樹脂之板的被加 =模142、 上、ΊΓ $ ϋ 一 # r· 竹科200(如熱塑性板)之 下兩面進仃擠壓。此時，被加工材料細之所 框體120之開口部121外側，因此 '' 夕古彳欢^ μ 1 員板14〇以向外方膨脹 ^生變形之彈性變形區域均收納於被加工材料細之 1而二其結果’壓杈142、142不會伴輸頂板140之 ^而於被加工材料細之外緣部分局部地發生變形，從而與 先^比’壓模⑷、142對被加工材料細之表面施加之成 形壓力之分布變得更均一。 再者，於使用該方法之情形時，無法均勻地對彈性變形區 知、周圍之框體區域的被加工材料進行加壓，其中彈性變形 區域中的柔性頂板140向外方膨脹，框體區域中的柔性頂板 140未向外方膨脹。目此，有時無法高精度地將圖案轉印至框 體區域之—部分。此時，亦可於成形之後雜體區域之被加工 材料進行修整。 圖3中，對被加工材料2〇〇之尺寸大於框體12〇開口部 121之情形進行了說明，圖4係被加工材料2〇〇之尺寸小於框 體口部121之情形的說明圖示。亦即，圖犯係對被加 工材料200之尺寸小於框體12〇之開口部121的被加工材料 200進行衝壓時之加壓狀態之說明圖示，圖4A係圖4B之α·α 剖面圖。 如圖4Α所示，首先，與圖3Α相同地，壓模142密接於 16 200914239 頂板140夕卜矣品 V» r衣面。被加工材料2〇〇之尺寸小於框體之開口部 因此以使被加工材料2〇〇之所有外緣處於開口部内 之方式，將該被加工材料2〇〇設置於壓模⑷之上。此時，進 而將剛體間隔件21〇固定於被加工材料周圍之壓模⑷ 上。 、 剛體間隔件21G之内側形狀（内緣）稍大於被加工材料 緣亦即被加工材料200與剛體間隔件21〇之間有 間隙s。剛體間隔件210之外侧形狀（外緣）大於框體12〇之 開口指卜又’剛體間隔件210之板厚可實質上與被加工材 料200之厚度相同’亦可稍厚於被加工材料細厚度。例如， 被加工材料200板厚不均之最大厚度亦可為+〇 imm左右。剛 體間隔件210之材質亦可為不鏽鋼（SUS，stainless sted)等 與頂板140或壓模142相同之材質。根據頂板140、壓模142、 被加工材,料200之厚度，對剛體間隔件21〇與被加工材料· 之間間隙、及剛體間隔件210之板厚進行調整，藉此當對被加 工材料200進行加壓時，剛體間隔件21〇亦被加壓，從而橡膠 構件138之整體於賴狀態下均—地受到壓縮。亦即，與圖^ 之情形相同’可防止壓模142局部變形，從而可均勻地對被加 工材料200進行加壓。 此處’若自使熱板136之熱量快速地傳遞至頂板14〇及安 裝於頂板H0之壓模I42此方面考慮，則較理想的是橡膠構件 138之板厚度較薄。另一方面，當橡膠構件138受到壓縮時， 若自產生以均勻之壓力來擠壓頂板140之效果之方面考慮，則 17 200914239 是橡膠構件138之板厚度較厚。因此，橡膠構件i38 之扳厚例如可為2〜5 mm左右。 又，例如可使用聚石夕氧橡膠作為橡街冓件⑽之材質。一 般而言’砂氧橡膠之解率較低，因此，需藉由將添加=(氧 化铭、陶，）混人至基質聚魏中而提高熱導率。—般而士， 若添加劑之混人量增多，卿魏橡膠之熱科會提高，^其 硬度會降低’聚魏橡膠之狀態會成為凝膠狀錢土狀。再 者，當使用PTFE來代替橡騎料時，並非必須混人如上所述 之添=劑來對熱導率進行破，但亦可混人添加劑。 田使用硬度低之橡膠材料作為橡膠構件138時，有時於進 打加壓時’橡膠構件138會自紐136外側面與框體⑽内側 面之間的微小間隙漏出。為了防止漏出該橡膠構件138之情 形亦此夠以如下方式而組合硬度彼此不同之橡膠材料 橡膠構件138。 ‘ 例如，圖5B係於橡膠構件138中組合不同材質之橡膠材 料牯之下模組114的說明圖示，圖5A係圖5B之A-A剖面圖。 如該些圖所示，由硬度高之聚石夕氧橡膠（例如，蕭氏硬度 為A7〇以上）來構成大致呈矩形之橡膠構件138的周邊區域 139A，亦可由硬度低之高導熱聚矽氧橡膠來構成由該硬度高 之聚石夕氧橡膠所包圍之内側區域139B。於周邊區域139A之硬 度南橡膠材料巾’添加劑之混人f可少於内側H域139B之硬 度低橡膝材料’或者可完全不混人添加劑。藉此，於進行加壓 時可使橡膠構件138不會進入框體120與熱板136之間等。 18 200914239 構成周邊區域1撤之橡膠構件Π8之 當構成周邊區域139Α之橡膠構件13 ，、、、率，、軏低。 少傅仵U8熱導率較低時，可 熱量自熱板136向框體120傳遞，從而可 脹及熱收縮。 ㈣^可之熱膨 又，亦可使用合成樹脂材料來代替橡膠材料，以實現 5所示之構成。亦即，周邊區域Π9Α亦可由硬度高之合成樹 脂材料構成，内㈣域聰亦可由硬度低之合成細旨材 成。 進而’亦可將橡膠構件138置換為組合橡騎料與合成樹 脂材料Μ。亦即，周邊區域139Α亦可由氟樹賴成，内侧 區域139Β亦可由橡膠材料構成。 a又’如上所述，將硬度不同之橡膠材料加以組合而作為橡 膠構件138，取而代之，亦可於在加壓時會漏出橡膠構件⑶ 之部位設置〇形環。例如，如圖5C所示，亦可於框體⑽之 與頂板140接觸之面、及熱板136外側面上之與框體12〇内側 面接觸之部分，分別設置Ο形環230。 再者，亦可使用耐磨損性及機械性強度優於聚矽氧橡膠之 氟橡膠來作為橡膠構件138之材質。 圖6 成 表示本發明之第二實施例之熱壓成形裝置之整體構 第二實施例與第一實施例不同點主要在於橡膠構件之加 熱、冷卻機構，而於其他方面大多相同。以下，以上述不同點 為中心進行說明，並省略與第一實施例相同部分之說明。 19 200914239 本實施例中’上模組312及下模組314實質上亦具有相同 之構成ϋ此，以上模組312為例進行說明。上模組包含 基底板116、間隔件322、框體12〇、彈菁、隔熱板孤、 橡膠構件328、熱父換管33〇、柔性頂板14〇及框架126。 間隔件322大致呈矩形，且固定於基底板116上。框體 120經由彈簣13G而安裝於間隔件322。冷卻板118固定於間 隔件322上。隔熱板326大致呈矩形，且固定於冷卻板m上。 隔熱板326之外側面與關12〇之内側面密接。隔熱板326阻 斷橡膠構件328與冷卻板118間之熱傳導。亦可使關如耐熱 環氧樹脂來作為隔熱板326之材質。 本實施例中，與第-實施例相同，藉由頂板14〇、隔熱板 326、框體120之侧壁而形成收納空間124。於收納空間124 内收納有橡膠構件328。作為橡膠構件328，可使用材質與第 一貫施例相同者。本實施例中，於收納空間124内穿通有熱交 換管330。而且，利用橡膠構件328 ^_^_1_ 間124内熱交換管330以外之空間。 熱交換管330沿著收納空間之長度方向彼此平行且等間 距地配置。熱交換管330之兩端藉由貫通框體12〇且設置於框 體120外部之歧管342、342而連結。而且，當進行加熱時， 若自連結於一歧管342之熱媒供給口接受高溫之熱媒流體（蒸 氣、高溫油等）之供給，則該高溫之熱媒流體通過熱交換管 330後，自另一歧管342排出。藉此對橡膠構件328進行加熱。 當進行冷卻時，低溫之熱媒流體（冷卻水、低溫油等）以相同 20 200914239 之路徑通過熱交換管330而使橡膠構件328冷卻。 再者’於框體120之内側面與隔熱板326之外側面密接之 狀態下’隔熱板326可相對於框體120而向上下方向（被加工 材料之厚度方向）移動，藉此收納空間124之容積發生變化， 此方面與第一實施例相同。進而，於本實施例中，與第一實施 例相同地，可對尺寸大於框體120之開口部121之被加工材料 200進行衝壓，亦可使用剛體間隔件21〇來對尺寸小於框體 之開口部121之被加工材料2〇〇進行衝壓。 接著’對第二實施例中之橡膠構件328之材質及構成進行 說明。 例如，圖7A係於橡膠構件328中組合不同材質之橡膠材 料時之下模組314說明圖示。 如圖7A所示，大致呈矩形之橡膠構件328中、與框體12〇 及隔熱板326相接面之附近區域329A可由硬度高之聚矽氧橡 膠構成，其他區域、亦即橡膠構件328之中心區域及與頂板 140之内表面相接面之附近區域329B亦可由硬度低之高導熱 聚矽氧橡膠構成。亦即，於藉由頂板14〇、框體12〇及隔熱板 326而形成之收納空間内，亦可在硬度低之高導熱聚矽氧橡膠 與框體120及隔熱板326之間配置硬度高之聚矽氧橡膠。於區 域329A之硬度而橡膠材料中，添加劑之混入量可少於區域 329B之硬度低橡膠材料’或者亦可完全不混入添加劑。藉此， 當進行加壓時’可使橡膠構件328不會進入至框體12〇與隔熱 板326之間等。 21 200914239 構成與框體120及隔熱板326相接之面之附近區域329A 的橡膠構件328之熱導率亦可較低。於此情形時，可阻止熱量 自熱交換管330向框體120傳遞，從而可抑制框體120之熱膨 脹及熱收縮。 與第一實施例之情形相同，亦可使用合成樹脂材料來代替 橡膠材料’以實現如圖7所示之構成。亦即，與框體120及隔 熱板326相接面之附近區域329A可由硬度高之合成樹脂材料 構成，橡膠構件328之中心區域及與頂板14〇之内表面相接面 之附近區域329B亦可由硬度低之合成樹脂材料構成。 進而，亦可將橡膠構件328置換為組合橡膠材料與合成樹 脂材料而成者。亦即’周邊區域329A可由氟樹脂構成’中心 區域及與頂板14〇之内表面相接之面之附近的區域329b可由 橡膠材料構成。 又，如圖7B所示，亦可設置〇形環。亦即，如該圖所示， 亦可於在加壓時會漏出橡膠構件328之部位設置◦形環。例 如，亦可於框體120與頂板14〇内表面接觸之面、及隔熱板 326之外側面上與框體12〇内側面接觸的部分，分別設置〇形 環 230。 根據本實施例，由於無需複雜之執板，故而模組之大型化 變得容易。 … /接著，參照圖8來對本發明之第一及第二實施例之熱壓成 /，置100中的成型動作進行說明。圖8A表示成型動作之一 '中之/月動板位置變化，圖表示成变動作之一循環中之 22 200914239 壓製加壓力變化，圖8C表示成型動作之一循環中之頂板溫度 變化’圖8D表示成型動作之一循環中之真空腔室内壓力變化。 首先’滑動板104處於上限位置S1。而且，於直至時間 tl為止之期間，被加工材料200(如熱塑性板)設置於下模組U4 之壓模142上。 於時間ti，對伺服壓機之位置進行控制，滑動板104隨之 開始下降。接著’上、下模組U2、114之框架126、126之頂 面上密閉齒條132彼此抵接，滑動板1〇4下降至形成真空腔室 之位置S2為止時，滑動板1〇4之下降暫時停止（時間口）。 於時間t2，開始將真空腔室内抽吸成真空v狀態，並且 開始向熱板136 (第二實施例中為熱交換管33〇)供給高溫之 熱媒流體。於進行真空抽吸之直至時間T3為止之期間，壓模 142、142不對被加工材料200進行加壓。其原因在於，防止 空氣進入被加工材料200與壓模142、142之間。 當達到時間t3時，對伺服壓機之加壓力進行控制，滑動 板104隨之再次開始下降，時間t3係真空腔室内之真空度自 大氣壓P1達到適合轉印成形之真空度P2的時間。真空度p2 例如可為-90 KPa以下。接著，以預備加壓力L1將上、下壓模 142、142向被加工材料200進行擠壓。利用預備加壓力u來 將上、下壓模142、142向被加工材料2〇〇進行擠壓，藉此， 熱板136 (第二實施例中為熱交換管33〇)、橡膠構件138、頂 板140及壓模142密接，從而促進熱板136 (第二實施例中為 熱父換管330)之熱傳導。對於預備加壓力li而言，例如施 23 200914239 加至被加工材料200之加壓面之面壓力為丨MPa左右。 當達到時間t4時，滑動板104進一步下降，以達到可轉 印之轉印加壓力L2之方式而對壓模進行控制，時間料係頂板 140之溫度達到可轉印之溫度H2時間。轉印加壓力L2例如設 定成使施加至被加工材料200之加壓面面壓力為4〜6 Μρ&。 若被加工材料200為聚甲基丙烯酸曱酯（PMMA，㈧ methacrylate)材料，則可轉印之溫度H2例如可為 ◦C。 而且，自加壓力達到轉印加壓力L2之時間t5開始，於規 定時間T内’持續進行加熱H狀態下之加壓。當達到經過了 規定時間Τ之時間t6時’開始向熱板136 (第二實施例中為熱 父換官330)供給低溫之熱媒流體，並開始對頂板刚及壓模 142進行冷卻C。規定時間τ係根據被加工材料之材質或壓模 形狀，以不會產生未轉印等之轉印異常方式而適當地設定。 於頂板H0及麵142朗冷卻，且溫度達到可脫模之溫 度H1之時間t7，使真空腔室大氣開放，真空腔室内之壓力恢 復至大氣壓P1。當被加工材料為PMMA材料時，可脫模之溫 度H1例如可為40〜70。(：。 —於真空腔室内之壓力恢復至大氣壓？1之時間t8，再次進 行位置控制，滑動板104隨之開始上升。接著，滑動板刚返 回至上限位置S1，從而可取出被加工材料2〇〇。 圖9表示藉由上述實施例之熱壓成形裝置來對被加工材 料進行壓製時之成型面壓力分布的—例。該圖係以相當於6 24 200914239 MPa之負荷’對小於框體120開口部πΐ之丙烯酸製之被加工 材料（256 mmxl59 mm，厚度0.2 mm)進行壓製時之成型面 壓力的分布。而且，圖9A係未使用橡膠構件之先前模組中之 成型面壓力之分布，圖9B係第一實施例中之圖4所示之態樣 (使用剛體間隔件，橡谬構件為厚度2 mm之聚；g夕氧橡膠製） 之成型面壓力之分布。圖9中，顏色較濃之部分表示壓力較 尚’顏色較淺之部分表示壓力較低。 如圖9A所示，被加工材料部分250之成型面壓力存在較 大不均。亦即，被加工材料部分25〇外緣附近之成型面壓力較 高’被加工材料部分250之上述以外區域的成型面壓力低於外 緣附近之成型面壓力。 與此相對，如圖9B所示，於被加工材料部分25〇之周圍 存在剛體間隔件部分260。而且，根據本實施例可知，被加工 材料部分250之成型面壓力分布大致均等。 於上述任-個實施例中，亦可使用炫點低於熱塑性被加工 材料軟化溫度的低溶點合金來代替橡膠構件。所謂健點合金 係指利用了如下性質之幕所周知之合金，該性質為藉由將種類 =同之金屬（Pb (錯 等）加以組合而合金化，以降低熔點。 根據上述兩個實施例，能夠以均一之壓力將壓模向被加工 材料之表面按壓。其結果，能夠以均一之壓力來壓縮被加工材 料因此可減夕被加工材料内部所產生之内部應變不均―，且 可減少被加工材料之彎曲或翹曲。 25 200914239 又，藉由以密閉狀態對橡膠構件進行壓縮，彈性體表現出 接近非壓縮性流體之特性，於藉由靜水壓效果而使加壓面壓力 均勻化之同時’亦減少因彈性體之物理性質（硬度或彈性係數） -不均之影響而引起的墨力不均。 進而，因橡膠構件内部僅產生壓縮應力，故可防止由拉伸 應力引起之彈性體斷裂。又，因於橡膠構件與熱板之間、及橡 膠構件與頂板之間不會產生滑動，故亦可防止橡膠構件之磨 損。 上述本發明之實施例係用以對本發明進行說明之例示，本 發明之範圍並非僅限定於該些實施例。業者只要不脫離本發明 之宗旨，則能夠以其他各種態樣來實施本發明。例如，本發明 並不限定於將形狀圖案轉印至被加工材料之兩面之情形，亦可 適用於將形狀圖案僅轉印至一面之情形。 【圖式簡單說明】 圖1表示本發明第—實施例熱壓成形裝置之整體構成。 圖2係第一實施例兩個模組放大圖。 圖3係對被加工材料進行衝壓時之加壓狀態說明圖示。 圖4係對被加工材料進行衝壓時之加壓狀態說明圖示。 圖5係橡膠構件之防漏構成說明圖示。 圖6表示本發明第二實施例熱壓成形裝置之整體構成。 圖7係橡膠構件之防漏構成說明圖示。 圖8係成型動作說明圖示。 圖9係被加工材料之成型面壓力分布測定結果之—例。 26 200914239 【主要元件符號說明】 100 102 104 106 112、114、312、314 116 118 119 、 141 120 121 122 124 126 128 130 132 136 138 、 328 139A、139B、329A、329B 140 142 143 熱壓成形裝置 承載板 滑動板 驅動裝置 模組 基底板 冷卻板 水孔 框體 開口部 框體支持機構 收納空間 框架 散座 彈簧 密閉齒條 熱板 橡膠構件 區域 頂板 壓模 密封栓 27 200914239 145 、 342 147 200 ' 250 210 ' 260 230 322 326 328 330 SI LI L2 HI H2 PI P2 tl 〜t9。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 This is incorporated herein by reference for reference. The present invention relates to a hot press forming apparatus for pressing a stamper to transfer a pattern of a fine shape to a surface of a thermoplastic sheet, and a die system for use thereof. [Prior Art] A conventional hot press forming apparatus is an optical component or a highly creative panel formed on a surface having a finely shaped pattern, for example, a light guide plate or a diffusion plate for a backlight of a liquid crystal display, and a lens or a optical disk substrate. The structure of the mold for performing such hot press forming is disclosed, for example, in Japanese Laid-Open Patent Publication No. Hei. No. Hei. According to the disclosure, a plate-shaped stamper is mounted on a heating and cooling plate having a heating and cooling mechanism, and the stamper is heated and cooled by heating the cooling plate, and then the stamper is pressed to the thermoplastic by heating the cooling plate. The surface of the resin board. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] The shape of the concave and convex shape of the transferred shape by conventional hot press forming is a few micrometers Um) to several tens of micrometers (_). On the other hand, the thickness of the thermoplastic resin sheet to be fed has an unevenness of about 扨 mm. , the size of the mold for mounting the stamper, the thickness of the stamper itself, and the plane. 01~0. Unevenness around 05 mm. The hot press forming system disclosed in Japanese Laid-Open Patent Publication No. 2004-74769 discloses the surface of the material to be processed by the mold heated by the heating and cooling plate (4), and is cooled by the heating. After the plate is cooled, the stamper is pressed against the material to be processed. + Α #,入,,1, a 士. Therefore, the heating of the cold plate causes warpage caused by distortion during heating and cooling. = The above (4) results in uneven pressure distribution on the contact surface between the material turning and the material to be read, resulting in the situation that one part of the Ramo cannot press the material to be processed with the required force. As a result, a defect in which the pattern is not completely transferred (untransferred) is locally generated on the surface of the material to be processed. 'When the material to be processed is a thin sheet material with a very thin thickness (for example, ! face = lower\' if the pressure distribution on the contact surface with the added material is poor, then the thickness direction of the material to be added is _ There will be a difference in the amount of deformation, and the amount of deformation of the surface of the processed material will also produce a local difference. The recorded fruit is prone to warp or material on the added material. ...,, ·, the mouth transfer household ^ I have thought of a number of countermeasures to solve some problems. For example, the load is larger than the force of adding more than the force. Or, the heating of the mold is increased to reduce the surface pressure required for the transfer. Or, , " It is processed (4) Μ Μ * - The person L long presses the heated calendar to the pressing time of the material to be processed, and increases the area to add the required face. - The softening layer reduces the transfer and these countermeasures not only increase the equipment Cost, running cost, production time and the need to apply excessive temperature or force, when the formation of her vines, after the face of power, =; = side of the force material for post-processing. Especially when added 4 pairs have been secret When the material is a binding material, it will increase its tortuosity or bending in 200914239. Therefore, in the hot press forming in which the uneven pattern is transferred to the surface of the thermoplastic sheet, the contact state between the thermoplastic sheet and the ink mold is made uniform. [Technical means for solving the problem] According to the present invention In one embodiment, the hot press forming device 1 for transferring the shape pattern to the surface of the workpiece 2 (such as a thermoplastic plate) is performed on the film I42. a pressing device having a carrier plate 102, a sliding plate 1〇4, and a driving device 1〇6 for driving the β-moving plate; and a module 112 mounted on the sliding plate or the carrier plate, and including The frame 120, the bottom plate (which is the hot plate 136 or the heat insulation plate 326), the elastic body (which is the rubber member 138, 328), the flexible top plate 140, and the heating and cooling mechanism (which is the hot plate 136 or the heat exchange tube 33). The inside of the frame 120 is an elastic storage space. The bottom plate is inserted into the inner portion of the frame 12, and the volume of the storage space is slid relative to the frame 12A in a changeable manner. The elastic body is housed in the storage space, and is compressed when the bottom plate slides so that the volume of the storage space is reduced. The flexible top plate 14 is mounted to the frame 120 and has an inner surface facing the receiving space and an outer surface supporting the stamper. The heating and cooling mechanism heats and cools the stamper 142 using a heat medium fluid. Further, when the bottom plate slides in such a manner as to reduce the volume of the storage space, the flexible top plate 140 is deformed outward by the elastic force of the compressed elastic body on the inner surface. In a preferred embodiment, the elastic system rubber member or the resin member, the rubber member or the resin member is filled in the housing space without a gap. The rubber member or the resin member has a second region in the vicinity of the region in contact with the inner surface of the casing and a second region on the inner side of the first region. The hardness of the first rubber member or the 200914239 1 resin member filled in the first region is higher than the hardness of the second rubber member or the second resin member filled in the second region. In a preferred embodiment, the heating and cooling mechanism is formed in the bottom plate and the heat medium fluid passes through the interior of the hot plate. In this case, the elastic rubber member or the resin member, the rubber member or the resin member is filled in the housing space without a gap. Further, the rubber member or the resin member has a first region in the vicinity of the region in contact with the inner surface of the casing and a second region on the inner side of the first region, and the second region is a rubber material in which an additive useful for improving thermal conductivity is mixed. Or a resin material, the second region is composed of a rubber material or a resin material in which the additive is not mixed or the amount of the additive is less than the second region. In a preferred embodiment, the heating and cooling mechanism passes through a heat exchange tube inside the elastomer, and the heat medium fluid passes through the interior of the heat exchange tube. In this case, the elastic rubber member or the resin member, the rubber member or the tree member is filled in the storage space without a gap. Further, the 'rubber member or the resin member has an i-th region formed by the vicinity of the vicinity of the inner surface of the frame body and the region in contact with the hot plate, and the region surrounded by the i-th region and the inner surface of the top plate In the second region in the vicinity of the contact region, the hardness of the i-th member or the second resin member filled in the first region is higher than the hardness of the second rubber member or the second resin member filled in the second region. Core = system rubber member or tree member, the vicinity of the inner surface of the rubber member or the resin member, and the region where the hot plate is in contact with each other. (4) The first region of 200914239 and the area surrounded by the first region a second region in the vicinity of the region and the region in contact with the inner surface of the top plate, the second region is composed of a material added to the increase rate, or a resin material, and the second region is added with no additives or It is composed of less fat material than the second region. In a preferred embodiment, the stamper is supported on the outer surface of the top plate with all of its outer edges being outside the elastic deformation region, and the elastic deformation region is formed by the inner surface of the top plate being subjected to the elastic elastic force and deformed outward. In the region, the hot press forming device transfers the shape pattern to the surface of the thermoplastic sheet, which is disposed such that all of its outer edges are outside the elastic deformation region. ν In a preferred embodiment, the stamper is supported on the outer surface of the top plate in such a manner that all of its outer edges are outside the elastic deformation region, and the elastic deformation region is deformed outward by the inner surface of the top plate subjected to elastic hybrid force. The area. The bell forming device further comprises a spacer 'the spacer member having the same plate thickness as the hot plate on the real f and consisting of the rigid body, and the spacer is twisted so that all the outer edges of the #_ sex plate are in the elastic state. 'All outer edges of the spacer are on the outer side of the outer edge of the elastically deformable region' and the inner edge of the spacer is slightly outwardly opposite the outer edge of the thermoplastic sheet. According to an embodiment of the present invention, a hot press forming apparatus 1 for pressing a stamper 142 to transfer a shape pattern to a surface of a workpiece 2 such as a thermoplastic sheet comprises: a pressing device, The utility model has a carrier board 1 and 2, a sliding plate 104, and a driving device 1〇6 for driving the sliding plate; and a module 112 and 114, which are mounted on the sliding plate or the carrier plate, and include a frame body 120, a bottom plate and a low plate. Melting point alloy 200914239 member, top plate 140, and heating and cooling mechanism (for hot plate 136 or heat exchange tube 330). The casing 120 has a storage space inside (the hot plate 136 or the heat shield 326) is inserted into the casing, and is slid in such a manner that the volume of the storage space can be changed. The low-melting-point alloy member is housed in the storage space and has a melting point lower than the softening temperature of the thermoplastic sheet. The top plate 140 is mounted to the frame and has an inner surface facing the receiving space and supporting the outer surface of the stamper. The heating and cooling mechanism uses a heat medium fluid to heat and cool the stamper. Further, when the volume of the accommodation space is reduced by the hot plate, the flexible top plate is deformed outward by the pressing force from the low melting point alloy member on the inner surface. According to an embodiment of the present invention, a mold system for a hot press forming apparatus includes a module, 114 mounted on a sliding plate or a carrier plate of a pressing device, and a hot press forming device for pressing the stamper The bump pattern is transferred to the thermoplastic: the surface of the board. The module comprises: a frame body 12 having an elastic body storage space therein; and a bottom plate (which is a heat plate 136 or a heat insulation plate 326) inserted into the interior of the frame body so as to make the volume of the storage space Changing the mode and moving in the frame; the elastic body (for the rubber members 138, 32δ) is stored in the storage space, and is slid on the bottom plate to make the volume of the I-nano space to be reduced in a sliding manner. Top, just 'inside the frame' and having an inner surface facing the storage space, supporting the outer surface of the dust mold; and a heating and cooling mechanism (for the hot plate 136 or the heat = tube 330), which causes the heat medium to come Heat and cool the display. Moreover, when the bottom plate is used to make the volume of the _", the surface of the top plate ^ is deformed outward by the elastic force of the compressed elastic body. [Embodiment] 200914239 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows an overall configuration of a hot press forming apparatus according to a first embodiment of the present invention. The hot press forming apparatus 1 is constructed as a general pressing apparatus and a mold system for hot press forming. The universal pressing device comprises a carrier plate 102 fixed to the ground and a sliding plate 104 disposed above the carrier plate 102. The sliding plate 104 is driven by the driving device 106, thereby being close to or away from the carrier plate The drive unit 例如6 may include a servo motor that drives the slide plate 104 and a controller that drives and controls the servo motor, for example, in a manner of 1〇2. For the device 106, a driving device using a hydraulic actuator may be used instead of a driving device using a servo motor. The mold system includes upper and lower modules 112, 114, which The lower two modules 112 and Π4 are respectively mounted on the carrier plate 1〇2 and the sliding plate 104 so as to face each other. FIG. 2 is an enlarged view of a portion of the two modules η] and 114 of the first embodiment. The modules 112 and 114 have substantially the same configuration. Therefore, the above module U2 is taken as an example. Please refer to FIG. 1 and FIG. 2. The upper module 112 includes a base plate 116, a cooling plate 118, and a frame 120. The frame supporting mechanism 122, the hot plate 136, the rubber member 138 as an elastic body, the flexible top plate 140, and the frame 126. The base plate 116 has a substantially rectangular plate shape and is fixed to the sliding plate 1〇4. The cooling plate 118 is substantially The rectangular plate is fixed to the center of the base plate 116. A plurality of water holes 119 are formed in the cooling plate 118, and the water holes 119 are communicated with each other. The water supply port 11 200914239 one end of the hole 119 is connected to the cooling water supply port to supply cooling water and is cooled. The water flows out from the cooling water return port connected to the other end of the water hole of the communicating water, thereby keeping the temperature of the cooling plate 118 fixed, thereby preventing the heat of the hot plate from being transmitted to the base plate 116 side. The frame supporting mechanism 122 is fixed to Cooling plate 118. The body support mechanism 122 and the frame body 12 are substantially rectangular cylindrical. The frame support mechanism 122 includes a nest 128 and a spring 130 'the nest 128 supports the frame 12 through the spring 13 。. The frame 120 is supported by The spring 13 is pressed downward. An opening is formed in the bottom of the frame supporting mechanism 122, and the hot plate 136 is inserted into the frame support mechanism 122 and the frame 120 from the opening. The frame 126 is substantially rectangular and fixed to the base. A sealing rack 132 having a vacuum gasket is mounted on the top surface of the frame 126. When the frame is lowered, the sealing rack 132 abuts against the sealed rack 132 of the lower module ι14, and the sealed rack is closed. A vacuum chamber is formed inside. The vacuum chamber is vacuumed by a vacuum pump (not shown) and opened to the atmosphere by an open air valve. The hot plate 136 is generally rectangular in shape and is fixed to the cooling plate 118. The hot plate 136 is a heating and cooling mechanism, and a plurality of water holes 141 as heat medium fluid passages are formed therein. The water holes 141 are formed, for example, parallel to each other along the longitudinal direction of the hot plate and equally spaced from the end face of the hot plate 136 to the other end face, and the ends are borrowed by the (four) plug 143 (four). Each of the water holes 14ι is connected by a rivet 145 provided on both sides in the longitudinal direction of each of the water holes 141. When heating is performed, the high-temperature heat medium fluid (steamed oil) supplied from the heat medium supply port connected to the manifold 145 is discharged from the other manifold 145 through the respective water holes (4). Thereby, the 138 12 200914239 member 138 is heated. When cooling is performed, the low temperature thermal impurities (cooling water, low temperature oil, etc.) pass through the respective water holes 141 in the same path to cool the rubber member 138. An insulating slit 147 is formed inside the manifold 145 of the hot plate 136 to prevent heat diffusion from the manifold 145. The hot plate 136 is inserted into the frame body 12, and the inner side surface of the frame body 12 is in close contact with the outer side surface of the heat plate 136. In a state in which the inner side surface of the casing 12 is in close contact with the outer surface of the hot plate 136, the hot plate 136 is movable in the upward and downward directions (the thickness direction of the material to be processed) with respect to the frame 12 〇. In other words, the frame 12A can be moved in the upward and downward directions with respect to the hot plate 136. That is, the hot plate 136 slides relative to the frame 12 to thereby function as a bottom plate. The flexible top plate 140 is fixed to the top surface of the frame 丨 2 藉 by a fixing mechanism such as a bolt. The top plate 140 is fixed so that the top surface opening portion 121 of the frame body 12 is sealed. The thickness of the top plate 140 can be, for example, about 5 to 3 mm. The housing 120 has a housing space 124 formed therein by a side wall of the top plate 14A and the hot plate 136' housing 12. A rubber member 138 is housed in the storage space 124. The storage space 124 is substantially sealed and does not leak the rubber member 138. The hot plate 136 slides relative to the frame 12, and accordingly, the volume of the sealed storage space 124 changes. The rubber member 138 is housed in a housing space 124 formed by the hot plate 136, the frame body 12, and the top plate 14A. For example, the rubber member 138 may be filled in the storage space 124 without a gap. The rubber member 138 may also be a rubber residual member that improves thermal conductivity. The material of the rubber member 138 will be described below. Further, in the present specification, an example in which a rubber member is used as an example of the elastic member 13 200914239 is mainly described, but other elastomers may be used instead of the rubber, and for example, a synthetic resin or the like may be used. A fluororesin can also be used as an example of a synthetic resin. Among the fluororesins, for example, a tetrafluoroethylene resin (pTFE, (tetra)ethylene) can be used. PTFE has the physical properties shown below. Heat resistance: 260 ° C Tensile strength: 13. 7~34. 3 MPa Extension: 200~400% Hardness: Xiao's D50~55 Flexural modulus: 550 GPa Tensile modulus: 400~550 GPa Thermal conductivity: 0. A thinner stamper 丨42 is attached to the outer surface (top surface) of the head of the 25 W/mk module 112. As a method of the stamper 142, for example, vacuum adsorption (illustration of a vacuum pump used for this purpose) may be used in combination with a fixing jig by a vacuum suction groove machined on the outer surface of the top plate 140. In practice, the fixing fixture is disposed on the outer surface of the top plate 14 . Fig. 3B is an explanatory view showing a state of pressurization when the workpiece 2〇() is pressed, and Fig. 3A is a cross-sectional view taken along line A-A. As shown in Fig. 3A, the stamper 142 has a size larger than the opening portion 121 of the frame body 12, and is in close contact with the outer surface of the top plate 14 with all of its outer edges being outside the opening portion 121. The material to be processed is also larger than the opening portion 121 of the frame 12, and 0 is placed such that all of its outer edges are outside the opening portion 121. Hereinafter, please refer to Fig. 1 to Fig. 1 for explaining the operation when the workpiece 200 (e.g., thermoplastic 14 200914239 plate) is pressed. Here, the operation of the upper and lower modules ι 2 and ι 4 will be described, and the temperature control will be described below. When the upper module 112 is lowered with respect to the module 114 as shown in the figure, the upper and lower stampers 142, 142 are in contact with both sides of the workpiece 2 (pressure start state). The state at this time is the left side of FIG. 3B. When the self-pressing molds 142, 142 are in contact with the two sides of the workpiece 2, and then the upper module 112 is lowered to apply the pressing force, the frame 12〇 is also biased against the pressing force of the spring 13〇 toward the base. The plate 116 side is retracted. At the same time, the rubber member 138 receives the pressing force from the hot plate 136 and the repulsive force from the material 2 to be processed, and the volume thereof is reduced, and the internal pressure is increased. That is, the rubber member 138 is compressed. Next, the hot plate 136 advances relative to the frame 120 by the portion of the rubber member 138 that is compressed and reduced. At this time, the compressed rubber member Π 8 generates a uniform pressing force by elasticity. Therefore, when the rubber member 138 is filled in the housing space 124 formed by the frame body 12, the hot plate 136, and the top plate 140 without a gap, the pressure in the storage space 124 is caused by the compressed rubber member 138. Rise evenly. At this time, the frame 120 is pressed against the top plate 14A by the pressing force of the spring 130, so that the rubber member 138 does not leak from the gap between the top plate 140 and the frame 120. Here, all the inner walls forming the accommodation space 124 except the flexible top plate 140 are rigid bodies, and are not deformed by the elastic force of the compressed rubber member 138. On the other hand, the flexible top plate 140 receives the elastic force of the compressed rubber member 138 on the inner surface, thereby being deformed in such a manner as to expand outward. Here, the flexible top plate 140 is elastically deformed by being expanded outwardly. The area of the 200914239 is substantially the same as the opening 121 of the frame 120. When the hot press forming as shown in Fig. 3B is performed, the H2 is pressed into the lower surface of the plate which is the plastic resin, and the two sides are pressed under the mold 142, the upper layer, the ΊΓ $ ϋ a # r · the bamboo 200 (e.g., the thermoplastic plate). Pressure. At this time, the material to be processed is thinner than the opening portion 121 of the frame body 120, so that the elastic deformation region of the 夕 彳 彳 ^ ^ μ 1 member plate 14 〇 is expanded outward and is accommodated in the material to be processed. The result is that the pressure 142, 142 is not accompanied by the top plate 140 and is locally deformed at the outer edge portion of the material to be processed, so that the pair of stampers (4) and 142 are processed. The distribution of the forming pressure applied to the surface of the material becomes more uniform. Furthermore, in the case of using the method, the material to be processed which is known in the elastic deformation zone and the surrounding frame region cannot be uniformly pressurized, wherein the flexible top plate 140 in the elastic deformation region expands outward, and the frame region The flexible top plate 140 does not expand outward. For this reason, it is sometimes impossible to transfer the pattern to a portion of the frame region with high precision. At this time, the material to be processed in the impurity region may be trimmed after the forming. In FIG. 3, the case where the size of the workpiece 2〇〇 is larger than the opening 121 of the casing 12〇 is described. FIG. 4 is an explanatory diagram showing the case where the size of the workpiece 2〇〇 is smaller than the frame opening 121. . That is, the figure is a diagram illustrating the state of pressurization when the material to be processed 200 is smaller than the material to be processed 200 of the opening 121 of the casing 12, and FIG. 4A is an α·α sectional view of FIG. 4B. . As shown in Fig. 4A, first, in the same manner as Fig. 3A, the stamper 142 is in close contact with the top plate 140 of the 2009-14239 top plate. The size of the workpiece 2 is smaller than the opening of the frame. Therefore, the workpiece 2 is placed on the stamper (4) so that all the outer edges of the workpiece 2 are placed in the opening. At this time, the rigid body spacer 21 is further fixed to the stamper (4) around the material to be processed. The inner shape (inner edge) of the rigid body spacer 21G is slightly larger than the edge of the workpiece, that is, there is a gap s between the workpiece material 200 and the rigid body spacer 21〇. The outer side shape (outer edge) of the rigid body spacer 210 is larger than the opening of the frame body 12, and the thickness of the rigid body spacer 210 may be substantially the same as the thickness of the workpiece 200. It may be slightly thicker than the material to be processed. thickness. For example, the maximum thickness of the material to be processed 200 may be about 〇 imm. The material of the rigid spacer 210 may be made of the same material as the top plate 140 or the stamper 142, such as stainless steel (SUS, stainless sted). According to the thickness of the top plate 140, the stamper 142, the material to be processed, and the thickness of the material 200, the gap between the rigid body spacer 21 and the material to be processed, and the thickness of the rigid body spacer 210 are adjusted, thereby When the pressurization is performed, the rigid body spacer 21 is also pressurized, so that the rubber member 138 is uniformly compressed in the entire state. That is, as in the case of Fig. 2, the stamper 142 is prevented from being locally deformed, so that the workpiece material 200 can be uniformly pressurized. Here, if the heat of the hot plate 136 is quickly transmitted to the top plate 14 and the stamper I42 mounted on the top plate H0, it is preferable that the thickness of the rubber member 138 is thin. On the other hand, when the rubber member 138 is compressed, if the effect of pressing the top plate 140 with a uniform pressure is generated, 17 200914239 is a rubber member 138 having a thick plate thickness. Therefore, the thickness of the rubber member i38 can be, for example, about 2 to 5 mm. Further, for example, poly stone oxide rubber can be used as the material of the rubber sheet member (10). In general, the rate of sand oxide rubber is low, so it is necessary to increase the thermal conductivity by adding the addition = (oxidation, ceramics, and the like) to the matrix. As usual, if the amount of additives is increased, the heat of the Weiwei rubber will increase, and the hardness will decrease. The state of the Weiwei rubber will become gelatinous. Further, when PTFE is used instead of the rubber rider, it is not necessary to mix the above-mentioned additive to break the thermal conductivity, but it is also possible to mix the additive. When a rubber material having a low hardness is used as the rubber member 138, the rubber member 138 may leak from a small gap between the outer surface of the yoke 136 and the inner surface of the casing (10). In order to prevent leakage of the rubber member 138, it is also possible to combine the rubber material rubber members 138 having different hardnesses from each other in the following manner. For example, Fig. 5B is an explanatory view of the module 114 under the rubber material 不同 of the rubber member 138, and Fig. 5A is a cross-sectional view taken along line A-A of Fig. 5B. As shown in the above figures, the peripheral region 139A of the substantially rectangular rubber member 138 is formed of a high-strength poly-stone rubber (for example, a Shore hardness of A7 〇 or more), or a high-heat-conducting polycondensation having a low hardness. The oxy rubber constitutes an inner region 139B surrounded by the high-strength polyoxo rubber. The hardness of the rubber material in the peripheral region 139A 'the additive' may be less than the hardness of the inner H domain 139B, or may be completely non-mixable. Thereby, the rubber member 138 can be prevented from entering between the frame body 120 and the hot plate 136 or the like when the pressurization is performed. 18 200914239 The rubber member 13 constituting the peripheral region 1 is removed. The rubber member 13 constituting the peripheral region 139 is at a lower rate. When the thermal conductivity of the Shaofu 仵 U8 is low, the heat can be transferred from the hot plate 136 to the frame 120, thereby expanding and shrinking. (4) The thermal expansion of the material can also be achieved by using a synthetic resin material instead of the rubber material. That is, the peripheral region Π9Α can also be composed of a synthetic resin material having a high hardness, and the inner (four) domain can also be formed from a synthetic material having a low hardness. Further, the rubber member 138 may be replaced with a composite rubber material and a synthetic resin material. That is, the peripheral region 139 Α may also be formed of a fluorine tree, and the inner region 139 Β may also be composed of a rubber material. Further, as described above, rubber materials having different hardnesses are combined as the rubber member 138, and instead, a ring-shaped ring may be provided at a portion where the rubber member (3) is leaked during pressurization. For example, as shown in Fig. 5C, a beak ring 230 may be provided on a portion of the frame body (10) that is in contact with the top plate 140 and a portion of the outer surface of the hot plate 136 that is in contact with the inner side surface of the frame body 12b. Further, as the material of the rubber member 138, a fluororubber having a wear resistance and a mechanical strength superior to that of a silicone rubber can be used. Fig. 6 shows the entire structure of the hot press forming apparatus according to the second embodiment of the present invention. The second embodiment differs from the first embodiment mainly in the heating and cooling mechanism of the rubber member, and is mostly the same in other respects. Hereinafter, the differences will be mainly described, and the description of the same portions as those of the first embodiment will be omitted. 19 200914239 In the present embodiment, the upper module 312 and the lower module 314 have substantially the same configuration. The above module 312 will be described as an example. The upper module includes a base plate 116, a spacer 322, a frame 12, an elastomer, a heat shield, a rubber member 328, a hot parent tube 33, a flexible top plate 14 and a frame 126. The spacer 322 is substantially rectangular and is fixed to the base plate 116. The frame 120 is attached to the spacer 322 via the magazine 13G. The cooling plate 118 is fixed to the spacer 322. The heat shield 326 is substantially rectangular and is fixed to the cooling plate m. The outer side of the heat shield 326 is in close contact with the inner side of the closed 12 inch. The heat shield 326 blocks heat transfer between the rubber member 328 and the cooling plate 118. It is also possible to use a heat-resistant epoxy resin as the material of the heat insulating plate 326. In the present embodiment, as in the first embodiment, the storage space 124 is formed by the top plate 14A, the heat insulating plate 326, and the side walls of the casing 120. A rubber member 328 is housed in the housing space 124. As the rubber member 328, the same material as that of the first embodiment can be used. In the present embodiment, the heat exchange tube 330 is inserted through the housing space 124. Further, a space other than the heat exchange tube 330 in the space between the rubber members 328 ^_^_1_ is utilized. The heat exchange tubes 330 are arranged parallel to each other along the longitudinal direction of the storage space and equidistantly arranged. Both ends of the heat exchange tube 330 are connected by manifolds 342 and 342 which are provided through the frame 12 and are provided outside the frame 120. Further, when heating is performed, if the supply of the high-temperature heat medium fluid (steam, high-temperature oil, etc.) is received from the heat medium supply port connected to the manifold 342, the high-temperature heat medium fluid passes through the heat exchange tube 330. Discharged from another manifold 342. Thereby, the rubber member 328 is heated. When cooling is performed, the low temperature heat medium fluid (cooling water, low temperature oil, etc.) passes through the heat exchange tube 330 in the same path of 20 200914239 to cool the rubber member 328. Further, in a state in which the inner side surface of the casing 120 is in close contact with the outer surface of the heat insulating panel 326, the heat insulating panel 326 can be moved upward and downward (in the thickness direction of the workpiece) with respect to the casing 120, thereby accommodating The volume of the space 124 changes, which is the same as the first embodiment. Further, in the present embodiment, as in the first embodiment, the material to be processed 200 having a size larger than the opening portion 121 of the frame 120 may be punched, or the rigid body spacer 21 may be used to make the size smaller than the frame. The material to be processed 2 of the opening 121 is pressed. Next, the material and configuration of the rubber member 328 in the second embodiment will be described. For example, Fig. 7A illustrates the illustration of the module 314 when a rubber material of a different material is combined in the rubber member 328. As shown in FIG. 7A, a region 329A of the substantially rectangular rubber member 328 that is in contact with the frame 12A and the heat insulating plate 326 may be made of a high-hardness polyoxymethylene rubber, and other regions, that is, rubber members 328. The central region and the vicinity 329B of the surface in contact with the inner surface of the top plate 140 may also be composed of a highly thermally conductive polyoxymethylene rubber having a low hardness. In other words, the storage space formed by the top plate 14 〇, the frame 12 〇 and the heat insulating plate 326 may be disposed between the high-temperature conductive polyoxyethylene rubber having a low hardness and the frame 120 and the heat shield 326. Polyoxyethylene rubber with high hardness. In the hardness of the region 329A and the rubber material, the amount of the additive may be less than the hardness of the rubber material of the region 329B' or the additive may not be mixed at all. Thereby, when the pressurization is performed, the rubber member 328 can be prevented from entering between the frame body 12 and the heat insulating plate 326 or the like. 21 200914239 The rubber member 328 constituting the vicinity 329A of the surface in contact with the frame 120 and the heat shield 326 may have a low thermal conductivity. In this case, heat can be prevented from being transferred from the heat exchange tube 330 to the frame 120, so that thermal expansion and heat shrinkage of the frame 120 can be suppressed. As in the case of the first embodiment, a synthetic resin material may be used instead of the rubber material ' to realize the constitution as shown in Fig. 7. That is, the vicinity 329A of the surface in contact with the frame 120 and the heat shield 326 may be made of a synthetic resin material having a high hardness, and the central region of the rubber member 328 and the vicinity 329B of the surface in contact with the inner surface of the top plate 14〇 are also It can be composed of a synthetic resin material having a low hardness. Further, the rubber member 328 may be replaced by a combination of a rubber material and a synthetic resin material. That is, the region 329b in which the peripheral region 329A may be made of a fluororesin and the vicinity of the surface in contact with the inner surface of the top plate 14A may be made of a rubber material. Further, as shown in Fig. 7B, a ring-shaped ring may be provided. That is, as shown in the figure, a ◦-shaped ring may be provided at a portion where the rubber member 328 is leaked during pressurization. For example, a ring-shaped ring 230 may be provided on a surface of the frame 120 that is in contact with the inner surface of the top plate 14 and a portion of the outer surface of the heat insulating plate 326 that is in contact with the inner side surface of the frame body 12, respectively. According to this embodiment, since a complicated board is not required, the size of the module becomes easy. Then, the molding operation in the hot pressing/setting of the first and second embodiments of the present invention will be described with reference to Fig. 8 . Fig. 8A shows the change of the position of the / month moving plate in one of the forming operations, the figure shows the change of the pressurizing pressure in one of the cycle of the variable action, and the pressure change of the top plate in one of the forming actions of the forming action is shown in Fig. 8D. Indicates the pressure change in the vacuum chamber in one of the molding operations. First, the sliding plate 104 is at the upper limit position S1. Further, during the period until time t1, the material to be processed 200 (e.g., a thermoplastic plate) is placed on the stamper 142 of the lower module U4. At time ti, the position of the servo press is controlled and the slide plate 104 begins to descend. Then, the closed racks 132 on the top surfaces of the frames 126 and 126 of the upper and lower modules U2 and 114 abut each other, and when the sliding plate 1〇4 is lowered to the position S2 where the vacuum chamber is formed, the sliding plate 1〇4 The descent is temporarily stopped (time port). At time t2, the vacuum chamber is started to be evacuated to a vacuum v state, and the supply of the high temperature heat medium fluid to the hot plate 136 (the heat exchange tube 33A in the second embodiment) is started. The stampers 142 and 142 do not pressurize the workpiece 200 during the vacuum suction until the time T3. The reason for this is that air is prevented from entering between the workpiece material 200 and the stampers 142, 142. When the time t3 is reached, the pressing force of the servo press is controlled, and the sliding plate 104 starts to fall again. The time t3 is the time when the vacuum in the vacuum chamber reaches the vacuum degree P2 suitable for the transfer forming from the atmospheric pressure P1. The degree of vacuum p2 can be, for example, -90 KPa or less. Next, the upper and lower stampers 142, 142 are pressed against the workpiece 200 by the preliminary pressing force L1. The upper and lower stampers 142, 142 are pressed against the workpiece 2 by the preliminary pressing force u, whereby the hot plate 136 (the heat exchange tube 33 in the second embodiment), the rubber member 138, The top plate 140 and the stamper 142 are in close contact to promote heat transfer of the hot plate 136 (the hot parent change tube 330 in the second embodiment). For the preliminary pressing force li, for example, the surface pressure applied to the pressing surface of the workpiece 200 is 丨MPa or so. When the time t4 is reached, the slide plate 104 is further lowered to control the stamper to achieve the transferable pressure L2, and the temperature of the top plate 140 reaches the transferable temperature H2. The transfer pressing pressure L2 is set, for example, so that the pressure of the pressing surface applied to the workpiece material 200 is 4 to 6 Μρ & If the material to be processed 200 is a poly(meth) methacrylate (PMMA, methacrylate) material, the transferable temperature H2 can be, for example, ◦C. Further, from the time t5 at which the pressure application reaches the transfer pressure L2, the pressurization in the H state is continued for a predetermined time T. When the time t6 elapses after the predetermined time elapses, the supply of the low-temperature heat medium fluid to the hot plate 136 (the hot parent change 330 in the second embodiment) is started, and the cooling of the top plate and the stamper 142 is started. The predetermined time τ is appropriately set depending on the material of the material to be processed or the shape of the stamper, without causing a transfer abnormality such as untransfer. The top plate H0 and the surface 142 are cooled, and the temperature reaches the temperature T1 of the mold release time T7, the atmosphere of the vacuum chamber is opened, and the pressure in the vacuum chamber is restored to the atmospheric pressure P1. When the material to be processed is a PMMA material, the mold release temperature H1 can be, for example, 40 to 70. (: - When the pressure in the vacuum chamber returns to atmospheric pressure? At time t8, the position control is performed again, and the sliding plate 104 starts to rise. Then, the sliding plate just returns to the upper limit position S1, so that the material to be processed can be taken out 2 Fig. 9 is a view showing an example of a pressure distribution of a molding surface when a material to be processed is pressed by the hot press forming apparatus of the above embodiment. The figure is equivalent to a frame by a load equivalent to 6 24 200914239 MPa. 120 open π ΐ acrylic material (256 mm x l59 mm, thickness 0. 2 mm) Distribution of the pressure of the forming surface when pressed. Further, Fig. 9A shows the distribution of the molding surface pressure in the prior art module in which the rubber member is not used, and Fig. 9B shows the state shown in Fig. 4 in the first embodiment (using the rigid body spacer, the thickness of the rubber member is 2 mm) The distribution of the molding surface pressure of the polyglycol; In Fig. 9, the portion where the color is thicker indicates that the pressure is higher. The portion where the color is lighter indicates that the pressure is lower. As shown in Fig. 9A, there is a large unevenness in the molding surface pressure of the material portion 250 to be processed. That is, the molding surface pressure in the vicinity of the outer edge of the workpiece portion 25 is higher. The molding surface pressure in the region other than the above-mentioned portion of the workpiece portion 250 is lower than the molding surface pressure in the vicinity of the outer edge. On the other hand, as shown in Fig. 9B, a rigid body spacer portion 260 is present around the portion 25 of the workpiece to be processed. Further, according to the present embodiment, the pressure distribution of the molding surface of the material portion 250 to be processed is substantially equal. In any of the above embodiments, a low melting point alloy having a lowering point than the softening temperature of the thermoplastic material to be processed may be used instead of the rubber member. The term "hard-point alloy" refers to an alloy known by the following properties, which is alloyed by combining the same type of metal (Pb (missing), etc.) to lower the melting point. According to the above two embodiments The stamper can be pressed against the surface of the workpiece by a uniform pressure. As a result, the material to be processed can be compressed at a uniform pressure, so that the internal strain unevenness generated inside the material to be processed can be reduced, and can be reduced. Bending or warping of the material to be processed. 25 200914239 In addition, by compressing the rubber member in a sealed state, the elastomer exhibits characteristics close to the incompressible fluid, and the pressure of the pressurizing surface is uniform by the hydrostatic effect. At the same time, it also reduces the unevenness of the ink caused by the physical properties (hardness or elastic modulus) of the elastomer - unevenness. Further, since only the compressive stress is generated inside the rubber member, it is prevented from being caused by the tensile stress. The elastic body is broken. Moreover, since the sliding between the rubber member and the hot plate and between the rubber member and the top plate does not occur, the wear of the rubber member can also be prevented. The embodiments of the present invention are intended to be illustrative of the present invention, and the scope of the present invention is not limited to the embodiments. The present invention can be implemented in other various aspects without departing from the spirit of the invention. For example, the present invention is not limited to the case where the shape pattern is transferred to both sides of the material to be processed, and may be applied to the case where the shape pattern is transferred only to one side. [Schematic Description] FIG. - The overall configuration of the embodiment of the hot press forming apparatus Fig. 2 is an enlarged view of two modules of the first embodiment. Fig. 3 is a diagram showing the state of pressurization when the material to be processed is stamped. Fig. 4 is a pair of materials to be processed. Fig. 5 is a view showing a configuration of a leakage preventing structure of a rubber member. Fig. 6 is a view showing an overall configuration of a hot press forming apparatus according to a second embodiment of the present invention. Fig. 7 is a leakproof constitution of a rubber member. Fig. 8 is a diagram showing the molding operation. Fig. 9 is an example of the measurement result of the pressure distribution of the molding surface of the material to be processed. 26 200914239 [Description of main component symbols] 100 102 104 1 06 112, 114, 312, 314 116 118 119 , 141 120 121 122 124 126 128 130 132 136 138 , 328 139A , 139B , 329A , 329B 140 142 143 Hot press forming device carrier plate sliding plate drive unit module base plate cooling Plate water hole frame opening frame support mechanism storage space frame loose spring sealing rack hot plate rubber member area top plate die sealing plug 27 200914239 145 , 342 147 200 ' 250 210 ' 260 230 322 326 328 330 SI LI L2 HI H2 PI P2 tl ~t9
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C 歧管 隔熱狹縫 被加工材料 剛體間隔件 0形環 間隔件 隔熱板 橡膠構件 熱交換管 上限位置 預備加壓力 轉印加壓力 可脫模之溫度 可轉印之溫度 大氣壓 真空度 時間 規定時間 加熱 冷卻 真空 28C manifold insulation slit processed material rigid body spacer 0 ring spacer insulation board rubber member heat exchange tube upper limit position preparation pressure transfer pressure plus mold release temperature transfer temperature atmospheric pressure vacuum time specified time Heating and cooling vacuum 28
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