TW200910649A - Direct molding system and process - Google Patents

Direct molding system and process Download PDF

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Publication number
TW200910649A
TW200910649A TW097103557A TW97103557A TW200910649A TW 200910649 A TW200910649 A TW 200910649A TW 097103557 A TW097103557 A TW 097103557A TW 97103557 A TW97103557 A TW 97103557A TW 200910649 A TW200910649 A TW 200910649A
Authority
TW
Taiwan
Prior art keywords
molding
substrate
plate
cooling
central cavity
Prior art date
Application number
TW097103557A
Other languages
Chinese (zh)
Other versions
TWI403000B (en
Inventor
hong jian Chen
Zi-Yao Wang
Eng Soon Lim
Original Assignee
Advanced Systems Automation Ltd
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Filing date
Publication date
Application filed by Advanced Systems Automation Ltd filed Critical Advanced Systems Automation Ltd
Publication of TW200910649A publication Critical patent/TW200910649A/en
Application granted granted Critical
Publication of TWI403000B publication Critical patent/TWI403000B/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/78—Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling
    • B29C48/86—Thermal treatment of the extrusion moulding material or of preformed parts or layers, e.g. by heating or cooling at the nozzle zone
    • B29C48/865—Heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/16—Cooling
    • B29C2035/1608—Cooling using Peltier-effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B29C2043/046—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds travelling between different stations, e.g. feeding, moulding, curing stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/5061—Removing moulded articles using means movable from outside the mould between mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
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    • H01—ELECTRIC ELEMENTS
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01038—Strontium [Sr]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Ophthalmology & Optometry (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

The present invention provides a molding system for molding a substrate with a molding material. The present invention further provides a process for molding a substrate with a molding material.

Description

200910649 九、發明說明： 【發明所屬之技術領域】 本發日⑽有_塑技術，更進-步言之，係有關— 杈塑的設備及方法，用來以一模塑材料模塑一基材。 【先前技術】200910649 IX. INSTRUCTIONS: [Technical field to which the invention belongs] This issue (10) has a plastic technology, and it is a step-by-step description. It is related to the equipment and method of molding, which is used to mold a base with a molding material. material. [Prior Art]

電子裝置通常都會以一種模塑材料進行封裝，使 ;外部環境隔絕，果膽難降到最低、使 舉個例說，一顆發光二極體（LED)通常包含了—透明的M ί 光 從其發展史來看，環氧樹脂混合物最常被用來製作半導體 ϊίΐϊ魏鏡。然而，環氧樹脂混合物在硬化之後容易枯到 拉八的表面，這樣一來’當導線架與模板分離時，透鏡的表 ^此會叉到影響。此外，當環氧樹脂混合物用在LED時，我 二ί ’如果這些透鏡是用*高功率的LED，環氧樹脂透鏡 的先子特性會減降（也就是說，會變得不透明或是變黃）。 ♦橡膠材锻魏獅齡触好轉代品，0為當它們 ==力率的LED時’歧佳的光學特性。然、而，祕膠材料 i FD\ iff低’且固化時間較短。因此，帶有石夕橡谬透鏡的 红個轉131相製造的。雜觀触經模塑， =if二到LE1)上製作或有石夕鄉透鏡的-LE1)總成（參看 _^_A1 师㈤。 ^ 昀工奢是奪鳆盘較鮝時<= ^ I發明科溶_3 紐的—實施例提供了—種用來以—難材料模塑― 該模塑設備包含了一模塑模組，在該模組 &卩，二逢々卩料站，其有一冷卻機構，謗 八而模塑材料在進行模塑之前，經給入轉模穴裡;以及〜 200910649 模塑站’該模塑站包含了一頂 央模穴板連同基材可經放在_^，/、日 才f中 溫度與時間進行難在板之間’財—預先設定的 自包ί 的ί:實施例裡’該冷卻機構乃係選 個制冷器模組的冷卻系統的族;液冷部系統，或有著一個或多 加熱ΐ本發明的㈣㊉備的另—實施例裡，該模架板包含了- 抓;3塑備的另™實施例裡，其另包含了—進料 平a卜一進料氣组移送到設置在該冷卻/注料站 從^ ϋ丄ί ^板上；以及—出料抓爪用來將模塑好的基材 =置在該料/注料站平台上的中央模穴板移送到一^ 齡的模塑設備的另—實施例裡，其另包含一注料機 來:塑/料，以及一電氣-機 ι 賴較—實侧裡，料包含一進料模 架；組包含一自動上料機用來將基材移送到一上料執 抓爪用來取放基材到一導八板上；該導入板用在 基材^德；从—均__緒雜在粒。 驗f本發明的鶴塑設備的:另—實施例輕，該上料板包含了 -加無，職雜齡義1祕:絲的雖。 槿為在ΐ鲁彌麵雜_ 一鮝施韻裡，其芬包含了 一虚料· 白叙料模組包含了—下料細來接受模㈣的基材；一 自動=放妓用來縣馳下料板取下並放到—下料軌架 爽料健絲接雙難_級；峨―自動下料機用 偌沾從摸邀設襟取走。在惠發麼的援塑設 的另—實施例裡，該下料執架包含了一目視檢测裝置用來檢 200910649 測模塑好的基材。 在本發明的模塑設備的另一實施例裡，該基材係一導線 架。在本發明的模塑設備的另一實施例裡，該導線架經植上數 個電子裝置。在本發明的模塑設備的另一實施例裡，該電子農 置係發光二極體（LED)。 ^ 在本發明的模塑設備的另一實施例裡，該模塑材料係一種 碎橡膠。 _在本發明的模塑設備的另一實施例裡，該冷卻/注料站包 含了一平台’該冷卻機構的結構使得它能控制該平台的溫度， 且該平台在注料作業期間對該中央模穴板提供支撐。 在本發明的模塑設備的另一實施例裡，該冷卻/注料站包 含了 一冷卻板’該冷卻板的溫度乃是藉由該冷卻機構控制，以 及該平台在注料作業期間對該中央模穴板提供支撐。 在本發明的模塑方法的另一實施 一 方法。該方法包含了下列步驟=-Li 魏健穴；將射捕妹朗-支撐板上; 今美材該等模穴裡；將基板放到巾央模穴板上，而 2；將基材射央歡__ 一模具 和模勉，細顧先設定的時間，對紐進行加壓 中央模穴化：賴_基材與 好的騎從中央^的穴板称以及將模塑 可為論ir爾塑方法的另-實轉’該娜與冷卻板 架。，該基材為一導線 置旅發光讀體細_。财騎另ι_裡，該電子裝 在本發明的模塑方法的另一實施_，該 200910649 矽橡膠。 在務後對本發明的較佳實施例之詳細說明並配合參照後 附的圖說’則對本發明以上所述以及其他目的和好處乃顯而易 懂。 【實施方式】 參考以下對本發明的幾個實施例的詳細說明，自可對本發 ，有更清楚的瞭解。然而，内行人應當知道，在沒有這些特^ 實施例之詳細說明情況下，亦可實施本發明。在幾個實施例 裡，早為人知的方法、步驟和組件等並沒有作詳細說明，以免 本發明變得更齦深難懂。 一在本案的整個内容裡，所提到的專利案，這些專利案的揭 示均經納入本說明書中供參考，儘量保持其完整性’以便對本 發明所涉的當今最新的工藝作更完整的說明。 如同先前所討論的，業界總希望能將矽橡膠蓋模塑到一電 子裝置（比方說’發光二極體’ LED)上。然而，現在市面上 的石夕橡，材料（比方說，Dow Corning公司出品的以樹脂為基 材的液態吩橡膠SR-7010 ;GE-Toshiba公司出品的熱固型梦橡 膠材料IVSM4500等）都不適合用在傳統的多模六模塑工法， 因為它們通常有著非常短的硬化時間（比方說，丨〜1〇分鐘） 霉相當低的溫度（比方讓，150°C)。此外，如果鶴也湿度太高， ，場愈鞠矽橡膠透鏡無法適當地與晶片和導線翻合。 本發明提供了 一種模塑設備及方法，其可以將矽基材的蓋 直接雄^塑到、電子·裝置和導線架上’因此，它免狳了將預先模 齡麵。綱上，本綱雜^備的巧妙 ，計乃是注料和模塑是分別在兩個實際上不同,位置進行的。值 每注晷的是’本說明書中以下封論齡_轰導線架、發患二極體 (LEDs)、矽橡膠材料’但是這些並不表示將本發明的模塑設 雜方.法韵.辏袜麵·翻在這些特定的實施倒？ 現在，參着圖1，提供的是依照本發明一實施例的模塑設 200910649 備的一功能的方塊圖。模塑設備1包含了一進料模組1〇、— 模塑模組20、一出料模组30，以及一控制器60。簡單地說， 進料模組10接受了即將被模塑的基材5〇(在圖3(c)中有示）， 並且將這些基材依照使用者需求排列，以使這些基材準備好進 行模塑模組的加工，模塑模組2〇有著兩個工作站，使得模塑 材料的注入與模塑加工分別地進行；出料模組3〇接受了模塑 好的基材並且執行模塑後加工包括目視檢測；控制器6〇負責 控制由三個前述的模組所執行的工序。值得注意的是，我們將 整個設備^分成三個模組其目的乃在敘述的方便；完全沒有表示 或暗示這個設備是有必要分成幾個模組才能執苴 意。每-個模組更詳細的說明在以下有述。力^ 現在，參看圖2，圖示為依照本發明的一實施例的模塑模 組20的一功能的方塊圖。該模塑模組包含一冷卻/注料站找 以及-模塑站25。在-實關裡，該冷卻/注料站泣包含了 二平f f f構旨在完成至少兩項功能，—項是對有著數個模穴 央模穴板4G (在圖3(a)中有示）提供支撐，另一項是 SI ίί穴板40在模塑站25與該基材進行模塑之後，將執 Ϊΐίίΐ六板4G帶開。該冷卻/注料站22另包含一冷卻機 該平台的溫度。舉個例說，該冷卻機構可： 卻ί:例以是空氣式冷 :個=二在产多簡冷二=壓上i 個例_鐘咖之間驗-纖。舉 耝可為熱的而第二表面可為冷的，以遂行加熱 了以逐订冷膽式，使得第一表面可為冷的而第二表面可為ί 200910649 結ί^ίίΐί f說，在注料期間），而該支撐裝置的 得、、主要時，該巾紐穴板可與該冷卻板絲接觸。值 卻該中央模穴板，使得它可 ^ J«；i 在該模架板裡的加熱器。在只蝴裡’該加熱機構係一安裝 組ι=ίί^^=ΐ!=該進料模 職計與結構可為非常相似^抓爪恐 及攜帶該__糾。 £_ _二者_來抓住 時，該注__迦可將描模穴板經放到該乎会上方 裡。該注料機構24包含—注料中條穴板鱗模穴 說，當難軸啊， 200910649 液態模塑_注人到财央模穴的模穴裡。 船-，在i參看圖3(a)〜(g) ’對依照本發明的-實施例的模 塑她裡所進行的加工提供了更詳細的圖示。 如圖3(a)中所示，該中央模穴板4〇係經配置在冷卻/注 =22的平台上’而模架板25a、25b為開啟狀態。值得注意 在該^上可配置—個以上財央歡板贿注給模塑 材料，而在麵物可崎—伽上的巾央歡㈣來進行模 塑。 如圖3(b)中所示’該等模穴經充填了由注料頭注給的液 態模塑材料41。 如圖3(c)中所示，一基材5〇經放置到中央模穴板上並且 正準備被姐财央模穴板上。圖示的基材是—導線架連同數 個電子裝置，而這些電子裝置是發光二極體（LED)。很明顯的， 本發明的模塑設備與方法不應如此設限的。 如圖3(d)中所示’導線架連同發光二極體（LE：D)乃疊放 在中央模穴板上’而LED是浸入到注入模穴裡的液態模塑材料 裡0Electronic devices are usually packaged in a molding material, so that the external environment is isolated, and the gallbladder is difficult to minimize. For example, a light-emitting diode (LED) usually contains - transparent M ί light In terms of its history, epoxy resin blends are most commonly used to make semiconductors. However, the epoxy resin mixture tends to dry up to the surface of the lacquer after hardening, so that when the lead frame is separated from the stencil, the lens of the lens will be affected. In addition, when the epoxy resin mixture is used in LEDs, I can't reduce the precursor properties of the epoxy lens if it is used with *high-power LEDs (that is, it will become opaque or change). yellow). ♦ Rubber material forging Wei lion age touches the substitute product, 0 is the optical characteristic when they === force rate LED. However, the gel material i FD\ iff is low and the curing time is short. Therefore, the red one with the Shishi rubber lens is made of 131 phase. Hybrid touch molding, =if two to LE1) or the -LE1) assembly with the Shi Xixiang lens (see _^_A1 division (five). ^ 昀 奢 是 是 & & & & & = = = = = = I Invented the _3 NZ - the examples provide - used to mold - difficult materials - the molding equipment contains a molding module, in the module & , having a cooling mechanism, and the molding material is fed into the mold cavity before molding; and ~ 200910649 molding station 'the molding station includes a central cavity plate together with the substrate In the _^, /, day f temperature and time to do difficult between the board 'financial - pre-set self-packaged ί: in the embodiment 'the cooling mechanism is selected cooling system cooling module Family; liquid cooling system, or another embodiment having one or more heating devices of the present invention, the mold plate includes - grasping; 3 plastics in another embodiment, which additionally includes - feeding a flat feed a set of feed gas to the cooling/fitting station from the ^ ϋ丄 ί ^ board; and - discharge gripper for placing the molded substrate = placed on the material / The central cavity plate on the platform of the station is transferred to another embodiment of a molding apparatus of the same age, which further comprises a filling machine: plastic/material, and an electric-machine-like-real side. The material comprises a feeding mold frame; the group comprises an automatic feeding machine for transferring the substrate to a feeding claw for picking up and placing the substrate to a guide plate; the introduction plate is used for the substrate ^ De; from - all __ mixed in the grain. Test f of the invention of the crane equipment: another - the example is light, the loading plate contains - plus no, the occupation of the age of 1 secret: silk though. In the rhyme of the ΐ 弥 _ 鮝 鮝 鮝 鮝 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 其 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝 鮝The lowering plate is taken down and placed on the lower rail frame, and the cool material is connected to the double difficulty. The 峨-automatic cutting machine is used to remove the entanglement from the touch. In an embodiment, the blanking bracket includes a visual inspection device for inspecting the molded substrate of 200910649. In another embodiment of the molding apparatus of the present invention, the substrate is a lead frame. In this hair In another embodiment of the molding apparatus, the lead frame is implanted with a plurality of electronic devices. In another embodiment of the molding apparatus of the present invention, the electronically-mounted light-emitting diode (LED). In another embodiment of the molding apparatus of the present invention, the molding material is a crushed rubber. In another embodiment of the molding apparatus of the present invention, the cooling/injecting station includes a platform The structure of the cooling mechanism is such that it can control the temperature of the platform and the platform provides support to the central cavity plate during the injection operation. In another embodiment of the molding apparatus of the present invention, the cooling/feeding station A cooling plate is included 'the temperature of the cooling plate is controlled by the cooling mechanism, and the platform provides support to the central cavity plate during the filling operation. Another embodiment of the molding method of the present invention is a method. The method comprises the following steps =-Li Weijian point; will shoot the sister Lang-support plate; the current US material in the cavity; the substrate is placed on the towel cavity plate, and 2; Yang Huan __ A mold and mold, pay attention to the set time, pressurize the central cavity for the New Zealand: Lai _ substrate and good ride from the central ^ hole plate and the mold can be ir The other method of the plastic method is to turn the 'Na' with the cooling plate. The substrate is a wire illuminating reading body _. In the other hand, the electronic device is mounted in another embodiment of the molding method of the present invention, which is the 200910649 rubber. The above and other objects and advantages of the present invention will become apparent from the Detailed Description of the appended claims. [Embodiment] A detailed description of several embodiments of the present invention will be made with reference to the following description. However, it should be understood by those skilled in the art that the present invention may be practiced without the detailed description of these embodiments. In the several embodiments, well-known methods, procedures, and components have not been described in detail so as not to obscure the invention. In the entire content of the present application, the patents mentioned, the disclosures of these patents are hereby incorporated by reference herein in their entirety in their entire entire entire entire entire entire entire entire entire extent . As previously discussed, the industry has always wanted to mold a silicone rubber cap onto an electronic device (e.g., a 'light emitting diode' LED). However, the current Shixia rubber, materials (for example, resin-based liquid pheno-rubber SR-7010 produced by Dow Corning; GE-Toshiba company's thermosetting dream rubber material IVSM4500, etc.) are not suitable. Used in the traditional multi-mode six molding process, because they usually have a very short hardening time (say, 丨~1〇 minutes) mildew relatively low temperature (for example, 150 ° C). In addition, if the crane is too humid, the field lens rubber lens cannot be properly folded with the wafer and the wire. SUMMARY OF THE INVENTION The present invention provides a molding apparatus and method which can directly mold a lid of a crucible substrate onto an electronic device and a lead frame. Therefore, it is free from premature molding. In the outline, the cleverness of this class is that the injection and molding are carried out in two actually different positions. The value of each note is 'in the following description of the age of the _ bomber lead frame, the occurrence of diodes (LEDs), enamel rubber material 'but these do not mean that the molding of the present invention is made.辏 面 · 翻 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Referring now to Figure 1, there is provided a block diagram of a function of a molding apparatus 200910649 in accordance with an embodiment of the present invention. The molding apparatus 1 includes a feed module 1A, a molding module 20, a discharge module 30, and a controller 60. Briefly, the feed module 10 accepts the substrate 5 to be molded (shown in Figure 3(c)) and arranges the substrates according to user requirements to prepare the substrates. For the processing of the molding module, the molding module 2 has two workstations, so that the injection molding and molding processing of the molding material are separately performed; the discharging module 3〇 receives the molded substrate and executes the molding. Post-plastic processing includes visual inspection; controller 6 is responsible for controlling the operations performed by the three aforementioned modules. It is worth noting that we have divided the entire device into three modules for the convenience of the description; there is no indication or suggestion that the device is divided into several modules to be able to perform. A more detailed description of each module is described below. Forces Now, referring to Fig. 2, a block diagram of a function of a molding die set 20 in accordance with an embodiment of the present invention is illustrated. The molding module includes a cooling/feeding station and a molding station 25. In - the real customs, the cooling / injection station weep contains the two flat fff structure is designed to complete at least two functions, - the item is for a number of cavities central cavity plate 4G (in Figure 3 (a) The support is provided, and the other is that the SI ίί plate 40 is opened after the molding station 25 is molded with the substrate. The cooling/feeding station 22 additionally includes a cooler for the temperature of the platform. For example, the cooling mechanism can: But ί: For example, the air type is cold: one = two in the production of more than two cold = two on the case - between the clock and the coffee - fiber. The second surface may be cold, and the heating may be performed to heat the cold, so that the first surface may be cold and the second surface may be ί 200910649 结^ίίΐί f said that During the feeding period, and the support device is obtained, in the main case, the towel core plate can be in contact with the cooling plate wire. The value is the central cavity plate so that it can ^ J«;i the heater in the formwork board. In the butterfly only, the heating mechanism is a group of installations ι=ίί^^=ΐ!= The feeding model and structure can be very similar. The gripper is afraid to carry the __ correction. £_ _ Both _ to catch, the note __ ga can put the drawing hole plate above the meeting. The injection mechanism 24 includes - a hole in the acupoint plate scale hole said, when the difficult axis, 200910649 liquid molding _ injection into the cavity of the Caiyang cavity. The ship-, in reference to Figures 3(a) to (g)', provides a more detailed illustration of the machining performed in the molding according to the embodiment of the present invention. As shown in Fig. 3(a), the central cavity plate 4 is disposed on a platform of cooling/note = 22, and the formwork plates 25a, 25b are in an open state. It is worth noting that more than one of the financial cards can be allocated to the molding materials, and the noodles can be molded on the surface of the food. As shown in Fig. 3 (b), the cavities are filled with the liquid molding material 41 injected from the injection head. As shown in Fig. 3(c), a substrate 5 is placed on the central cavity plate and is ready to be placed on the motherboard. The substrate shown is a lead frame with several electronic devices, and these electronic devices are light emitting diodes (LEDs). It will be apparent that the molding apparatus and method of the present invention should not be so limited. As shown in Figure 3(d), the lead frame together with the light-emitting diode (LE:D) is stacked on the central cavity plate' and the LED is immersed in the liquid molding material in the injection cavity.

如爵3(e)中所示，模架板25a和25b經關合’發光二極 體（LED)經以模塑材料模塑。 如圖3(〇中所示，經模塑好的LED以及中央模穴板經從 模塑站移法’敢且經放置到冷卻/注料站的平台上以便被（如 前述蝣)冷靜機耩冷卻。 如圖3(g)中所示，經硬化的励_軟出縣雜來23抵隹 且經移送到出料模組。 現在’參奮衝4 ’厨示了依照本發明的一實施例的進轉模 組與出料;隱組的一功能的方塊圖。以上所敘述的是模塑模組。 進料模組10包含了一自動上料機11、一軌架/抓爪12、 —導入板13，以及一上料扳14。在下面對進料模組所作的說 明將使用導線架作例子來說明每一個組件的功能。另外很明顯 11 200910649As shown in the triumph 3 (e), the formwork plates 25a and 25b are molded by molding materials by closing the 'light emitting diodes' (LED). As shown in Fig. 3 (the stencil, the molded LED and the central cavity plate are moved from the molding station) and placed on the platform of the cooling/injection station to be cooled (as described above)耩Cooling. As shown in Fig. 3(g), the hardened _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Example of a feed module and discharge; a block diagram of a function of the hidden group. The mold module is described above. The feed module 10 includes an automatic feeder 11 and a rail/gripper. 12. The induction plate 13 and a loading plate 14. The description of the feeding module below will use the lead frame as an example to illustrate the function of each component. It is also obvious that 11 200910649

的是，個別的功能可被合併而且由較少的組件來進 料機11挾持了導線架的卡匣，並且將裝了導線架的卡 " 到-上料赠的正確高度；然後，—上機拖板料線 J 匣移送到上料軌架上。執架/抓爪12係位在上料執架' 方，以將導線架抓起放到導入板13上。導入板13包含了 轉機構’其可將該導、餘定位’使得該料聽有了正 f 位以便被移送到上料板14。上料板14接受經正確定位 ^ 架，使得它們可以被移送到配置在該冷卻^/注料站上的中央模 穴板上。在中央模穴板經放到模塑站的模架板之後，娄、 架可經移送财央模穴板上。此外，該上料板14可另包含L 加熱機構以將導線架預熱到所希望的溫度。該加熱機構可以是 任何一種可控制的加熱系統包括制冷器系統。 出料模組30包含一下料板31、一自動取放裝置32、一下 料執架33，以及一自動下料機34。接著前面對進料模組的敘 述，接下來就要以導線架例子對每一個組件的功能作說明。另 外很明顯的是，個別的功能可被合併並且由較少的组件來進 行。經模塑好的導線架經從該冷卻/注料站的平台被移送到下 料板31，然後，被自動取放裝置32移送到下料軌架。下料轨 架33可配合設置一目視檢測裝置以檢測驗收經模塑好的產 品。完成的經模塑好的產品經放到自動下料機34並經貯放以 便從設備取下。 現在’參看圖5 ’圖示為依照本發明的一實施例的模塑摸 组的一透視圖。每一鳴_袢已如前延。 現在’我姆對银彌本繚_的一實施例爾模塑方法作一簡短 的敘述。自動上料機11將導線架從卡匣移送到上料轨架上； 轨1/抓水12將.導線架抓起並將它們放到導入板η上，在這 兒，導入板可挾持一個或多個導線架；而該等導線架經移送到 上料板14 Λ ;在這裡，上料板可挾持一個或多個導線板且該 等導線架可經預熱；在此同時，注料頭將模塑材料注入到中央 12 200910649 模穴板的模穴裡；然後，進料抓爪21將該等導線架移送並且 放到中央模穴板上；然後，經對準的中央模穴板和導線架在模 具故移出時被移送到模塑站25裡；然後，經模塑的導線架連 同中央模穴板經移送到冷卻/注料平台上經冷卻；然後，經冷 卻的導線架由出料抓爪23移送到下料板31 ;然後，自動取放 裝置32將模塑好的導線架取出並將它們放到下料轨架33上而 再行移送到自動下料機34。 至於談到以液態矽橡膠樹脂或彈性材料製造高功率電子 裝置£比方說’發光二極體’ LEDs)的方法，並參照圖5中所 不的貫施例’液態矽橡膠的外部注模可延遲矽橡膠的硬化過 裎’直到導線架與LEDs疊合並移送到模塑站25 (如圖3(e) ^所示）為止。緊跟著;5夕橡膠的硬化溫度到達之後，本發明的 貫施例將頂模架板25a與底模架板25b放開，並將模塑到導線 架上已硬化的LEDs移送到冷卻/注料站22。這個冷卻步驟防 止了晶片與導線架與矽橡膠的界面（在矽橡膠硬化過度時）所 發生的粘著問題。這樣一來，細緻的電子組件（比方說，高功 率LEDs)的量產可以較依靠單獨的LE：D透鏡的工法產出更多 的良品，而同時又能降低整體的製造成本。 、儘官本發明連同參考的特定實施例已作了說明，大家應當 ，道，這些實施例旨在為了說明的目的，且本說明之範餐不應 又限於此。對本發明所屬領域裡的内行人自可輕易地對本發明 作來其他撖實施例。這些其他的實施例應當被當作是在本發明 忽，與範疇之中。據此’本發麟的:精褲與範翁在後_ 审請專利範圍”有述’並由以上的說明隹證。 【圖式簡單説明】 圖1不出了依照本發明的-實施例的模塑的一功能 的方塊圖。 圖2示出了依照本發明的一實施例的模麵組的一功能 的方塊圖。 13 200910649 圖3 (a)〜（g)係依照本發明的一實施例的模 行的模塑方法之更詳細的圖心 、.組裡進 圖4示出了依照本取 组的一功能的方塊圖。*明的—貫施例的進料模組和出料模 圖5示出了依照本 一 圖。 的—貫施例的模塑模組的一透視 【主要元件符號說明】 模塑設備... 1 10 11 12 13 14 20 21 進料模組.. • · * 自動上料機 執架/抓爪.％ 導入板....... 上料板...... 模塑模組.._ _ 進料抓爪____ 冷卻/注料站_ 22 .24 .25 • 25a .25 b .31 出料抓爪...I 23 注料機構.. . . 模塑站... * · * 模架板...... 模架板.... * » 出斜_組... 下麵... 自動取放裝置..32 下料軼架......... 自動下料機...34 中央模穴板..，.40 液態模塑材料...41 基材...........50 14 200910649 控制器.........60 15The individual functions can be combined and the feeder 11 holds the clamp of the lead frame with fewer components, and the card will be loaded with the correct height of the card-to-upload; then, The upper pallet feed line J 匣 is transferred to the upper rail frame. The bracket/gripper 12 is positioned on the loading bracket's side to grasp the lead frame and place it on the induction plate 13. The induction plate 13 contains a rotating mechanism 'which can position the guides' so that the material is heard with a positive f position for being transferred to the loading plate 14. The loading plates 14 are properly positioned so that they can be transferred to a central cavity plate disposed on the cooling/slot station. After the central cavity plate is placed on the formwork plate of the molding station, the frame and the frame can be transferred to the financial cavity plate. Additionally, the loading plate 14 may additionally include an L heating mechanism to preheat the leadframe to a desired temperature. The heating mechanism can be any of a controllable heating system including a chiller system. The discharge module 30 includes a lowering plate 31, an automatic pick-and-place device 32, a lower material holder 33, and an automatic loader 34. Following the previous description of the feed module, the function of each component will be explained by the lead frame example. It is also apparent that individual functions can be combined and performed by fewer components. The molded lead frame is transferred from the platform of the cooling/feeding station to the lowering plate 31 and then transferred to the lower rail by the automatic pick-and-place device 32. The lower rail frame 33 can be fitted with a visual inspection device to detect the acceptance of the molded product. The finished molded product is placed in the automatic unloader 34 and stored for removal from the apparatus. Referring now to Figure 5, there is shown a perspective view of a molded mold set in accordance with an embodiment of the present invention. Every sound has been delayed. Now, I am going to give a brief description of the method of molding silver. The automatic loading machine 11 transfers the lead frame from the cassette to the upper rail frame; the rail 1/catch 12 will grab the lead frames and place them on the induction plate n, where the induction plate can hold one or a plurality of lead frames; and the lead frames are transferred to the loading plate 14; wherein the loading plate can hold one or more of the wire plates and the lead frames can be preheated; at the same time, the injection head The molding material is injected into the cavity of the central 12 200910649 cavity plate; then, the feed gripper 21 transfers the lead frames and places them on the central cavity plate; then, the aligned central cavity plate and The lead frame is transferred to the molding station 25 as the mold is removed; the molded lead frame is then transferred to the cooling/injecting platform along with the central cavity plate for cooling; then, the cooled lead frame is removed The gripper gripper 23 is transferred to the lower feed plate 31; then, the automatic pick-and-place device 32 takes the molded lead frames out and places them on the lower rail rack 33 and then transfers them to the automatic unloader 34. As for the method of manufacturing high-power electronic devices such as 'light-emitting diodes' LEDs with liquid enamel rubber resin or elastic materials, and referring to the external injection molding of the liquid enamel rubber as described in FIG. The hardening of the rubber is delayed until the lead frame is stacked with the LEDs and transferred to the molding station 25 (as shown in Figure 3(e)^). Immediately after the hardening temperature of the rubber is reached, the embodiment of the present invention releases the top mold frame 25a and the bottom mold frame 25b, and transfers the hardened LEDs molded to the lead frame to the cooling/ Injection station 22. This cooling step prevents sticking problems between the wafer and the lead frame and the rubber (when the rubber is hardened). In this way, the mass production of meticulous electronic components (for example, high-power LEDs) can produce more good products than the single LE:D lens method, while at the same time reducing the overall manufacturing cost. The present invention has been described in connection with the specific embodiments of the present invention, and it should be understood that these embodiments are intended to be illustrative, and the description of the invention should not be limited thereto. Other embodiments of the invention can be readily made by those skilled in the art to which the invention pertains. These other embodiments should be considered as being within the scope of the present invention. According to this, 'Benfa Lin: Fine Pants and Fan Weng _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Figure 2 shows a block diagram of a function of a die face set in accordance with an embodiment of the present invention. 13 200910649 Figure 3 (a) - (g) is a block in accordance with the present invention. A more detailed view of the molding method of the molding of the embodiment, and a block diagram of a function according to the present drawing is shown in Fig. 4. * The embodiment of the feeding module and the output of the embodiment Figure 5 shows a perspective view of a molded module according to the present embodiment. [Main component symbol description] Molding equipment... 1 10 11 12 13 14 20 21 Feed module. • • * Automatic Feeder Holder / Gripper.% Importer Plate....... Feeder Plate... Molding Module.._ _ Feed Gripper ____ Cooling/Note Material station _ 22 .24 .25 • 25a .25 b .31 Discharge gripper...I 23 Injection mechanism.. . . Molding station... * · * Mold plate... Mold Shelf.... * » Outgoing _ group... Below... Automatic pick and place device..32 Unloading truss....... .. automatic cutting machine...34 central cavity plate..,.40 liquid molding material...41 substrate...........50 14 200910649 controller..... ....60 15

Claims (1)

200910649 十、申請專利範圍： 1. 一種模塑設備，用以使用一模塑材料模塑一基材，前述模塑設 備包含： 一模塑模組，其包含： 一冷卻/注料站，其有一冷卻機構，在該設備裡，該冷卻/ 注料站將熱從一中央模穴板導開，且在該設備裡，該中央模 穴板有數個模穴，而模塑材料在進行模塑之前，經注入到該 等模穴裡；以及 —模塑站，在該設備裡，模塑站包含了一頂模架板和一底模 架板’致該中央模穴板與基材可被放置在它們中間以便在— 預先設定的時間和溫度進行模塑。 根據申請補細第丨難設備，在該設備裡，該冷卻機 構係選自包含了空氣式冷卻機構、流液冷卻系統，或有著〜個 或多個制冷器模組的冷卻系統的族群。 3.根齡請專纖圍第丨_模塑設備，在該設備裡，該模架板 包含一加熱器。 / 4·根據申請專利範圍第〗項的模塑設備，其另包含： —進料抓爪絲將基材從—進料馳轉送到配置在冷卻/注料 站平台上的中央模穴板上；以及 ' ’ —出料抓爪躲將模贿的基材從配置在冷卻/注料站平△ 的中央模穴板轉送到一出料模組。 D本 5.根據申請專利範圍第！項的模塑設備’其另包含： 16 200910649 二’;機構其有—注料頭、—容器用來盛裝模塑材料，以及— 電乳機械輸送機構用來將注料頭移動進入/離開位置，使得該 ’主料機構能觸賭概人财央敎板的模穴裡。 6’根據申請專利範圍第丨項賴塑設備，其另包含： 一進料模組其包含： 一自動上料機用來將基材移送到上料執架； —軌架/抓爪絲將基材取放到—導人板上；該導入板用 來將基材定位；以及 一上料板用來將基材保持在適當的定位。 rj 據申明專利乾圍第6項的模塑設備，其中該上料板包含了一 如熱機構用來將基材預熱到一預先設定的溫度。 8·根據申請專利範圍第1項的模塑設備，其另包含： 一出料模組，其包含： 一下料板用來接受模塑好的基材； 一自動取放裝置用來將模塑好的基材從下料板取出並放到 一下料軌架上；該下料軌架用來接受模塑好的基材；以及 一自動下料機用來收取模塑好的基材，準備從模塑設備取 走。 根據申請專利範圍第8項的模塑設備，其中該下料軌架包含了 一目視檢測裝置用來檢測模塑好的基材。 10> 根據申請專利範圍第1項的模塑設備，其中該基材係一導 17 200910649 線架。 11.根射請專雜㈣10獅模塑設備，其巾該導線架經植 上許多電子裝置。 12·根據申請專利範圍第1〗項的模塑設備，其中該電子裝置係 發光二極體（LED)。 13. 根據t請翻範ϋ第1項的麵賴，其巾賴塑材料係 一種梦橡膠。 14. 根射料概圍第丨項賴塑設備，其中該冷卻/注料 站包含了-平台’該冷卻機構的結構使得它能控制該平台的溫 度，且該平台在注料作業期間對該中央模穴板提供支撐。 15. 根據申請專利範圍第丨項的模塑設備，其中該冷卻/注料 站包含了-冷卻板，該冷卻板的溫度乃是藉由該冷卻機構控 制，以及-支撐袭置用來在注料作業期間對該中央模穴板提供 支撐。 16. 一種制—模㈣料模塑—基材的方法，前述方法包含了 下列步驟： 提供一中央模穴板其有數個模穴； 將該中央模穴板放到一支撐板上； 將模塑材料注入到該等模穴裡； 將基板放到中央模穴板上，而該基材係與該等模穴對準； 將基材與中央模穴板移送到一模具裡； 18 200910649 以預先設定的溫度以及預先設定的時間，對基材進行加壓和模 塑’致使得模塑材料能被模塑並硬化； 將模塑好絲材和巾央敎板移蝴—冷卻板上讓巾央模穴板 冷卻；以及 將模塑好的基材從中央模穴板的模穴取出來。 Π.根據申料職圍第16 _方法，在财法裡，該支撐板 與冷卻板可為同一塊。 18.根據申請專利範圍第16項的方法，在該方法裡，該基材為 一導線架。 19·根據申請專利範圍第18項的方法，在該方法裡，該導線架 經植入許多電子裝置。 20·根據申請專利範圍第19項的方法，在該方法裡，該電子裝 置為發光二極體（LED)。 21.根據申明專利範圍第16項的方法，在該方法裡，該模塑材 料為矽橡膠。200910649 X. Patent Application Range: 1. A molding apparatus for molding a substrate using a molding material, the molding apparatus comprising: a molding module comprising: a cooling/feeding station, There is a cooling mechanism in which the cooling/feeding station guides heat away from a central cavity plate, and in the apparatus, the central cavity plate has a plurality of cavities, and the molding material is being molded. Previously, injected into the cavities; and - a molding station in which the molding station includes a top mold plate and a bottom mold plate 'to the central cavity plate and substrate Place them in between for molding at a predetermined time and temperature. In accordance with the application for a refractory device, the chiller is selected from the group consisting of an air cooling mechanism, a fluid cooling system, or a cooling system having one or more chiller modules. 3. For the root age, please specialize in the 丨_ molding equipment, in which the mold plate contains a heater. / 4· The molding apparatus according to the scope of the patent application, further comprising: - feeding gripper wire to transfer the substrate from the feed to the central cavity plate disposed on the cooling/settling station platform And the ''---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- D this 5. According to the scope of the patent application! The molding apparatus of the item 'includes another: 16 200910649 2'; the mechanism has a - injection head, the container is used to hold the molding material, and - the electric milk mechanical conveying mechanism is used to move the injection head into/out of position So that the 'main material agency can touch the cavities of the people's financial board. 6' According to the scope of the patent application section, the utility model further comprises: a feeding module comprising: an automatic loading machine for transferring the substrate to the loading rack; - the rail/gripper wire The substrate is placed on a guide plate; the introduction plate is used to position the substrate; and a loading plate is used to maintain the substrate in proper positioning. Rj The molding apparatus of claim 6, wherein the loading plate comprises a thermal mechanism for preheating the substrate to a predetermined temperature. 8. The molding apparatus according to claim 1, further comprising: a discharge module comprising: a blanking plate for receiving the molded substrate; and an automatic pick and place device for molding A good substrate is removed from the blanking plate and placed on a lower rail frame; the lower rail frame is used to receive the molded substrate; and an automatic feeder is used to collect the molded substrate, ready Remove from the molding equipment. The molding apparatus according to claim 8 wherein the lower rail comprises a visual inspection device for detecting the molded substrate. 10> The molding apparatus according to claim 1, wherein the substrate is a wire guide. 11. The root shot should be mixed with (4) 10 lion molding equipment, and the lead frame is planted with many electronic devices. 12. The molding apparatus according to claim 1, wherein the electronic device is a light emitting diode (LED). 13. According to t, please refer to the first item of Fan Fan, which is a kind of dream rubber. 14. The root shot material 丨 赖 赖 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 该 该 该 该 该 该 该 该 该 该The central cavity plate provides support. 15. The molding apparatus according to claim 3, wherein the cooling/fusing station comprises a cooling plate, the temperature of the cooling plate is controlled by the cooling mechanism, and the support is used for the injection. Support is provided to the central cavity plate during the material operation. 16. A method of molding (four) material molding - a substrate, the method comprising the steps of: providing a central cavity plate having a plurality of cavities; placing the central cavity plate on a support plate; Plastic material is injected into the cavity; the substrate is placed on the central cavity plate, and the substrate is aligned with the cavity; the substrate and the central cavity plate are transferred to a mold; 18 200910649 Pre-set temperature and pre-set time, pressurizing and molding the substrate', so that the molding material can be molded and hardened; the molded wire and the towel board are transferred to the butterfly plate. The central cavity plate is cooled; and the molded substrate is removed from the cavity of the central cavity plate. Π According to the 16th method of the application, in the financial method, the support plate and the cooling plate can be the same piece. 18. The method of claim 16, wherein the substrate is a lead frame. 19. The method of claim 18, wherein the lead frame is implanted in a plurality of electronic devices. 20. The method of claim 19, wherein the electronic device is a light emitting diode (LED). 21. The method of claim 16, wherein in the method, the molding material is a ruthenium rubber.
TW097103557A 2007-01-31 2008-01-30 Direct molding system and process TWI403000B (en)

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US9412717B2 (en) * 2011-11-04 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for molded underfills in flip chip packaging
GB2545349A (en) * 2014-06-27 2017-06-14 Globe Machine Mfg Company Slipper tool, system and method for using the slipper tool for molding
US10994449B2 (en) 2017-02-13 2021-05-04 Lightweight Labs, Llc Air impingement device, system and method for thermal processing and consolidation

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US6319739B1 (en) * 2000-04-06 2001-11-20 Advanced Micro Devices, Inc. Mold compound selection for TSOP post mold cure processing
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die

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KR100887441B1 (en) 2009-03-10

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