200907280 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，尤係一種用於附力σ卡之λ 熱裝置。 成 【先前技術】 隨著近年來高頻圖像處理、無線通訊等技術不斷發 展，為使電腦能快速、直接運用最新發展技術，包括顯卡、 視頻圖像卡（VGA + )在内之附加卡通常裝設在電腦裝 中用來提高其運算速度、操作能力。例如圖像卡，—般包 括一單獨之處理器，稱作圖像處理器（Gpu)，記憶體及 其他電路元件一同組裝在電路板上。裝設在各種卡上之带 子兀件尤係GPU容量大、產生熱量大，如不能有效散埶將 影響圖像卡之正常運行。以，通常在Gpu之表穿— 散熱器進行散熱。文衣 〜典型之散熱器係通過銘擠成型，具有較大之體積及較 =括—從GPU等發熱電子元件上吸熱之底座及 π _ 、用以將熱量向外界散發之複數散敎片。缺 之間距離狹小，無法容納如此大體積之丄 該附= = 於對一附加卡上之電子元件散熱， 子元件貼設在附加卡頂表面相對之底表面，該電 件上之弟—散熱體、與第-散熱體間隔設置之第二 7 200907280 .散熱體及連接該二散熱體之一熱管，該熱管包括—蒸發段 及-冷凝段，其中該第二散熱體包括位於附加卡頂表 第-散熱部及自該第-散熱部延伸至附加卡底表面所在平 面下方，第二散熱部，熱管之蒸發段穿設於第—散熱體 中，熱官之冷凝段穿設於第二散熱體之第二散熱部。 與習知技術相比，本發明散熱裝置之第二散熱體延伸 至附加卡之底表面所在平面下方，能更好地利用附加 面之空間進行散熱。 【實施方式】 請參閱圖i至圖2,為本發明散熱裝置之較佳實施例， 该散熱裝置包括對附加卡6Q上之電子元件％散熱之第— :熱體1〇、與第-散熱體10間隔設置之第二散熱體2〇、 第三散熱’30及—連接第一、第二及第三散熱體仞、加、 3〇之熱官40。該附加卡6〇具有頂表面及與頂表面相對之 f表面’該電子元件5Q設置於其頂表面上，且附加卡6〇 靠近電子元件50之，開設有四個通孔69。 第一散熱體10包括貼設在電子元件50表面之一基板 12、與基板12結合之一夾合部14。該基板12 $ 一矩形金 屬板體’其上表面—端設置有一 U形溝槽121，基板12之 四角上刀別。又置有—通孔123。該夾合部為一彎折之金 屬板體，包括一平敕 I之頂板141、從頂板141相對兩側邊垂 直向下延伸出$ — —連接部143及從每一連接部143底邊垂 直向外延伸出之接合部145。該接合部145之四角上分別開 。又有通孔147。複數固定元件如螺釘16穿過爽合部14、 200907280 土板12士之通孔147、123將夹合部14與基板12結合在一 在％基板12上之U形溝槽121與夾合部14之頂板 141之—間形成—通道（圖未標）。 板 第一散熱體20設置於号·當| # μ，Λ 數相互平行之散熱鰭片22:;成乂—側，由複 σ r 乃以依久扣合組成。母一散熱鰭片22 22二：，包括一第—散熱部221及自該第-散熱部 延伸之一第二散熱部223。其中，該第一散埶 亀卡60之頂表面正上方；第二散熱部223自、 月”、、。卩221之外側邊緣向外並垂直向下延 60底表面所在平面下古 下 — ，P弟一政熱部223整體位於附加 貝’，母一散熱鰭片22第二散熱部223靠近第二散 熱部223之一端即並γ嫂門外一 ” >万、皇拔 ’、 汗0又一 I孔225，這些散熱鰭片 22相互連接形成—圓形通道（圖未標）。 /第三散熱體3〇與第二散熱體2〇相似，由複數相互平 :之散熱鰭片32依次扣合組成。每一散熱鰭片％均整體 呈L形’，括-第一散熱部321及自第一散熱部切垂直 延伸之一弟二散熱部323。其中’該第—散熱部切位於附 加卡60之頂表面正上方；第二散熱冑323自第—散敎部切 之外側邊緣向外並垂直向下延伸至附加卡6〇底表面所在平 面下方，即第二散熱部323整體位於附加卡⑼外側— 散熱鰭片32第二散熱部323靠近第二散熱_切卜 其上端開設-通孔325 ’ g些散熱 圓形通道（圖未標）。 相互連接形成一 請進一步參閱圖2至圖3，熱管40包括一蒸發段仏 200907280 由条發段42兩端垂直向上彎折形成之二平行連接段43、料 及由έ玄二連接段43、44反向垂直延伸出之二冷凝段μ、 46。其中二連接段43、44長度相等，冷凝段較冷凝俨 46長。該蒸發段42及二連接段43、料靠近蒸發段〇之二 部分通過焊接收容於基板12之u料槽ΐ2ι與失合部w 之頂板141幵》成之通道中。該冷凝段45通過焊接收容 二散熱體2G之通道中，冷凝段46通過焊接收容於 熱體3〇之通道中。該二冷凝段45、46位於附加卡的相政 下叫之強度，避免由於散熱裝置過重而m 相變形，該散熱裝置進一步包括—背板7。重 於附加卡60之底表面。該背板70呈十字形： 牛h 柱72。该螺釘16穿過第—散熱體10後，進 過附加卡60上之通孔69，並與螺 二： 固定在附加卡6。上。背板70與附加卡60間：= m墊（圖未不），當該散熱裝置受到外力震動士 緩衝作用。 刀展動時以提供 當散熱裝置固定於附加卡60後 板12之下表面肚人+ + 放熱體10之基 心卜衣面貼合在電子元件5〇之上 40之蒸發段42緊宓 录面，同％，熱管 道中，埶管40之二::夹合部14與基板12形成之通 ”、 之冷'咸^又45緊密地收容於筮-也上 通道令、冷凝段46腎 、弟一政熱體20之 π仅46緊岔地收容於第三 此時，熱管4G可以將於u 1 ，，，、體3G之通道中。 j Μ將於電子兀件5〇貼人 上之熱量傳遞到遠離電子元件50之第；之:-政熱體Π) 熱體如上，進而散發到外界環境中="：放熱體20、第三散 200907280 綜上所述，本發明符合發明專利要件，爰依法提出專 請。惟，以上所述者僅為本發明之較佳實施例，舉凡 =本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之立體組合圖。 圖2係圖i之立體分解圖。 圖3係圖1另一視角之立體分解圖。 主要元件符號說明】 第一散熱體 10 失合部 14 第二散熱體 20 第三散熱體 30 蒸發段 42 冷凝段 45 ' 46 附加卡 60 螺柱 72 頂板 141 接合部 145 基板 12 螺釘 16 散熱鰭片 22、32 勒4營 40 連接段 43、44 電子元件 50 背板 70 溝槽 121 連接部 143 第—散熱部 221 、 321 223 、 323 通孔 69、123、147、225、325 11200907280 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a λ thermal device for attaching a force σ card. [Previous technology] With the continuous development of high-frequency image processing, wireless communication and other technologies in recent years, in order to enable computers to quickly and directly use the latest development technology, including add-on cards such as video cards and video image cards (VGA + ) It is usually installed in computer equipment to improve its computing speed and operation ability. For example, an image card generally includes a separate processor, called an image processor (Gpu), and the memory and other circuit components are assembled together on a circuit board. The tapes installed on various cards are especially large in GPU capacity and generate a large amount of heat. If they are not effectively dispersed, the image card will be affected. Therefore, it is usually worn on the surface of the Gpu - the heat sink for heat dissipation. Wenyi ~ The typical radiator is made by extrusion molding, which has a larger volume and more than - a base that absorbs heat from heat-generating electronic components such as GPUs and π _ , a plurality of diffused sheets for dissipating heat to the outside. The distance between the gaps is small and cannot accommodate such a large volume. The attachment = = to dissipate heat from the electronic components on an additional card, and the sub-components are attached to the opposite surface of the top surface of the additional card. a second body and a first heat dissipating body are arranged in a second 7 200907280. a heat dissipating body and a heat pipe connecting the two heat dissipating bodies, the heat pipe comprising an evaporation section and a condensation section, wherein the second heat dissipating body comprises an additional card top table The first heat dissipating portion and the plane extending from the first heat dissipating portion to the bottom surface of the additional card, the second heat dissipating portion, the evaporation portion of the heat pipe is disposed in the first heat dissipating body, and the condensation portion of the heat officer is disposed in the second heat dissipating portion The second heat sink of the body. Compared with the prior art, the second heat dissipating body of the heat dissipating device of the present invention extends below the plane of the bottom surface of the additional card, and can better utilize the space of the additional surface for heat dissipation. [Embodiment] Please refer to FIG. 2 to FIG. 2, which is a preferred embodiment of a heat dissipating device according to the present invention. The heat dissipating device includes a heat dissipating portion of the electronic components on the add-on card 6Q: a heat body, and a heat sink. The body 10 is provided with a second heat dissipating body 2, a third heat dissipating '30, and a heat register 40 connecting the first, second and third heat dissipating bodies 加, 、, and 〇. The additional card 6 has a top surface and an opposite surface f to the top surface. The electronic component 5Q is disposed on the top surface thereof, and the additional card 6 is adjacent to the electronic component 50, and four through holes 69 are formed. The first heat sink 10 includes a sandwiching portion 14 that is attached to one of the substrates 12 on the surface of the electronic component 50 and bonded to the substrate 12. The substrate 12 $ a rectangular metal plate body has a U-shaped groove 121 at its upper surface end, and the four corners of the substrate 12 are cut. Also provided is a through hole 123. The clamping portion is a bent metal plate body, and includes a top plate 141 of the flat plate I. The connecting portion 143 extends vertically downward from opposite sides of the top plate 141 and is perpendicular to the bottom edge of each connecting portion 143. The joint portion 145 is extended. The joints 145 are respectively opened at the four corners. There is also a through hole 147. A plurality of fixing members such as screws 16 pass through the through portions 147, 123 of the splicing portion 14, the 200907280 slab 12, and the splicing portion 14 and the substrate 12 are bonded to the U-shaped groove 121 and the nip portion on the % substrate 12. The top plate 141 of 14 forms a channel (not shown). The first heat dissipating body 20 is disposed on the number of the heat sink fins 22 that are parallel to each other, and the heat sink fins 22 that are parallel to each other are formed into a side surface, and the complex σ r is formed by a long-term fastening. The female heat sink fin 22 22 2 includes a first heat dissipation portion 221 and a second heat dissipation portion 223 extending from the first heat dissipation portion. Wherein, the top surface of the first diffusing card 60 is directly above; the second heat radiating portion 223 is from the outer edge of the moon, and the outer edge of the 卩221 is outwardly and vertically downwards. The P-one-political heat department 223 is entirely located in the additional shell, and the second heat-dissipating portion 223 of the mother-heat-dissipating fin 22 is close to one end of the second heat-dissipating portion 223, and is outside the γ-嫂 & & & 万 万 万 万 万 & & & 、 、 、 、 、 An I-hole 225, these heat-dissipating fins 22 are connected to each other to form a circular channel (not shown). The third heat dissipating body 3 is similar to the second heat dissipating body 2, and is flattened by a plurality of: the heat dissipating fins 32 are sequentially snapped together. Each of the heat dissipation fins has an L-shape as a whole, and includes a first heat dissipation portion 321 and a heat dissipation portion 323 extending perpendicularly from the first heat dissipation portion. Wherein the first heat sink is cut directly above the top surface of the add-on card 60; the second heat sink 323 extends outwardly from the outer edge of the first-diverging portion and extends vertically downward to the plane below the surface of the additional card 6 That is, the second heat dissipating portion 323 is entirely located outside the additional card (9) - the second heat dissipating portion 323 of the heat dissipating fin 32 is close to the second heat dissipating hole, and the upper end opening-through hole 325'g has a heat dissipating circular passage (not shown). Referring further to FIG. 2 to FIG. 3, the heat pipe 40 includes an evaporation section 仏200907280. The two parallel connection sections 43 are formed by bending the two ends of the strip section 42 vertically upward, and the material and the connection section 43 and 44 are The two condensation sections μ, 46 are vertically extended in the reverse direction. The two connecting segments 43, 44 are of equal length and the condensation section is longer than the condensing fin 46. The evaporation section 42 and the two connecting sections 43 and the two portions of the material adjacent to the evaporation section are received by welding in the channel formed by the u-groove 2 of the substrate 12 and the top plate 141 of the missing portion w. The condensation section 45 is received in the passage of the two heat sinks 2G by welding, and the condensation section 46 is received in the passage of the heat body 3 by welding. The two condensation sections 45, 46 are located under the strength of the add-on card to avoid deformation of the m phase due to excessive weight of the heat sink, and the heat sink further includes a backing plate 7. It is heavier than the bottom surface of the additional card 60. The backing plate 70 has a cross shape: a cow h column 72. After the screw 16 passes through the first heat sink 10, it passes through the through hole 69 of the additional card 60, and is screwed to the additional card 6. on. Between the backboard 70 and the add-on card 60: = m pad (not shown), when the heat sink is subjected to external force shock buffering. When the knife is deployed, it is provided that the heat sink is fixed on the lower surface of the rear plate 12, and the base surface of the heat sink 10 is attached to the evaporation section 42 of the electronic component 5 Face, same %, heat pipe, manifold 40 bis:: the sandwiching portion 14 and the substrate 12 form a pass", the cold 'salt ^ 45 and tightly accommodated in the 筮 - also on the channel, the condensation section 46 kidney The younger brother of the political body 20 π is only 46 in the third place at this time, the heat pipe 4G can be in the channel of u 1 ,,,, body 3G. j Μ will be posted on the electronic device 5〇 The heat is transferred to the first part away from the electronic component 50; - the hot body is heated as above, and then radiated to the external environment = ": exotherm 20, third dispersal 200907280 In summary, the invention is in accordance with the invention Patent requirements are specifically claimed in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be BRIEF DESCRIPTION OF THE DRAWINGS The following is a brief description of the heat sink of the present invention. Figure 3 is an exploded perspective view of another view of Figure 1. Main component symbol description] First heat sink 10 Folding portion 14 Second heat sink 20 Third heat sink 30 Evaporation section 42 Condensation section 45 ' 46 Add-on card 60 Stud 72 Top plate 141 Joint 145 Substrate 12 Screw 16 Heat sink fins 22, 32 Le 4 bat 40 Connection section 43, 44 Electronic component 50 Back plate 70 Groove 121 Connection part 143 First heat dissipation part 221 , 321 223, 323 through holes 69, 123, 147, 225, 325 11