TW200904272A - Manufacturing method of electric circuit board with directly-embedded passive components - Google Patents
Manufacturing method of electric circuit board with directly-embedded passive components Download PDFInfo
- Publication number
- TW200904272A TW200904272A TW96125657A TW96125657A TW200904272A TW 200904272 A TW200904272 A TW 200904272A TW 96125657 A TW96125657 A TW 96125657A TW 96125657 A TW96125657 A TW 96125657A TW 200904272 A TW200904272 A TW 200904272A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- circuit board
- support plate
- passive component
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 18
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000002955 isolation Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 2
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 16
- 239000003990 capacitor Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96125657A TW200904272A (en) | 2007-07-13 | 2007-07-13 | Manufacturing method of electric circuit board with directly-embedded passive components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96125657A TW200904272A (en) | 2007-07-13 | 2007-07-13 | Manufacturing method of electric circuit board with directly-embedded passive components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200904272A true TW200904272A (en) | 2009-01-16 |
| TWI327879B TWI327879B (enrdf_load_stackoverflow) | 2010-07-21 |
Family
ID=44722312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96125657A TW200904272A (en) | 2007-07-13 | 2007-07-13 | Manufacturing method of electric circuit board with directly-embedded passive components |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200904272A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI449147B (zh) * | 2011-11-02 | 2014-08-11 | Tripod Technology Corp | 內埋元件之多層基板的製造方法 |
| TWI510831B (zh) * | 2009-09-21 | 2015-12-01 | Corning Inc | 在於基板上被動對準光電元件組裝之方法 |
-
2007
- 2007-07-13 TW TW96125657A patent/TW200904272A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI510831B (zh) * | 2009-09-21 | 2015-12-01 | Corning Inc | 在於基板上被動對準光電元件組裝之方法 |
| TWI449147B (zh) * | 2011-11-02 | 2014-08-11 | Tripod Technology Corp | 內埋元件之多層基板的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI327879B (enrdf_load_stackoverflow) | 2010-07-21 |
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