TW200903834A - High heat-dissipation light emitting diode device - Google Patents

High heat-dissipation light emitting diode device Download PDF

Info

Publication number
TW200903834A
TW200903834A TW096124432A TW96124432A TW200903834A TW 200903834 A TW200903834 A TW 200903834A TW 096124432 A TW096124432 A TW 096124432A TW 96124432 A TW96124432 A TW 96124432A TW 200903834 A TW200903834 A TW 200903834A
Authority
TW
Taiwan
Prior art keywords
emitting diode
light
guiding
conductive
high heat
Prior art date
Application number
TW096124432A
Other languages
English (en)
Chinese (zh)
Other versions
TWI357669B (https=
Inventor
Ching-Lin Tseng
Ming-Li Chang
Original Assignee
Bright Led Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bright Led Electronics Corp filed Critical Bright Led Electronics Corp
Priority to TW096124432A priority Critical patent/TW200903834A/zh
Priority to US12/216,407 priority patent/US20090010011A1/en
Publication of TW200903834A publication Critical patent/TW200903834A/zh
Application granted granted Critical
Publication of TWI357669B publication Critical patent/TWI357669B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
TW096124432A 2007-07-05 2007-07-05 High heat-dissipation light emitting diode device TW200903834A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096124432A TW200903834A (en) 2007-07-05 2007-07-05 High heat-dissipation light emitting diode device
US12/216,407 US20090010011A1 (en) 2007-07-05 2008-07-03 Solid state lighting device with heat-dissipating capability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096124432A TW200903834A (en) 2007-07-05 2007-07-05 High heat-dissipation light emitting diode device

Publications (2)

Publication Number Publication Date
TW200903834A true TW200903834A (en) 2009-01-16
TWI357669B TWI357669B (https=) 2012-02-01

Family

ID=40221272

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096124432A TW200903834A (en) 2007-07-05 2007-07-05 High heat-dissipation light emitting diode device

Country Status (2)

Country Link
US (1) US20090010011A1 (https=)
TW (1) TW200903834A (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101539250A (zh) * 2009-04-21 2009-09-23 薛信培 一种大功率led灯
CN101943356B (zh) * 2010-07-14 2013-03-13 深圳市华星光电技术有限公司 背光模块及其发光源封装构造
US8288782B2 (en) 2010-07-14 2012-10-16 Shenzhen China Star Optoelectronics Technology Co., Ltd. Backlight module and light-emitting source package structure thereof
CN102097577B (zh) * 2010-12-30 2013-07-10 江苏欣力光电有限公司 一种高导热量缓冲器
US9935251B1 (en) * 2013-03-15 2018-04-03 Hutchinson Technology Incorporated LED chip packaging with high performance thermal dissipation
DE102016100320A1 (de) * 2016-01-11 2017-07-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Bauelements
US11769843B1 (en) * 2019-07-30 2023-09-26 Hrl Laboratories, Llc Photonic integrated module with metal embedded chips
CN118757750A (zh) * 2024-09-05 2024-10-11 江苏天白光电有限公司 一种便于散热的灯罩

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
EP1387412B1 (en) * 2001-04-12 2009-03-11 Matsushita Electric Works, Ltd. Light source device using led, and method of producing same
JP4174823B2 (ja) * 2003-03-27 2008-11-05 サンケン電気株式会社 半導体発光装置
US6903380B2 (en) * 2003-04-11 2005-06-07 Weldon Technologies, Inc. High power light emitting diode
US7300182B2 (en) * 2003-05-05 2007-11-27 Lamina Lighting, Inc. LED light sources for image projection systems
DE102004034166B4 (de) * 2003-07-17 2015-08-20 Toyoda Gosei Co., Ltd. Lichtemittierende Vorrichtung
JP2005159296A (ja) * 2003-11-06 2005-06-16 Sharp Corp オプトデバイスのパッケージ構造
US7236366B2 (en) * 2004-07-23 2007-06-26 Excel Cell Electronic Co., Ltd. High brightness LED apparatus with an integrated heat sink
US7417220B2 (en) * 2004-09-09 2008-08-26 Toyoda Gosei Co., Ltd. Solid state device and light-emitting element
WO2006065007A1 (en) * 2004-12-16 2006-06-22 Seoul Semiconductor Co., Ltd. Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
JP2006237190A (ja) * 2005-02-24 2006-09-07 Toshiba Discrete Technology Kk 半導体発光装置
KR100616684B1 (ko) * 2005-06-03 2006-08-28 삼성전기주식회사 고출력 ｌｅｄ 패키지 및 그 제조방법
JP2007081234A (ja) * 2005-09-15 2007-03-29 Toyoda Gosei Co Ltd 照明装置

Also Published As

Publication number Publication date
TWI357669B (https=) 2012-02-01
US20090010011A1 (en) 2009-01-08

Similar Documents

Publication Publication Date Title
US8067782B2 (en) LED package and light source device using same
CN102263095B (zh) 发光装置以及照明装置
TW200903834A (en) High heat-dissipation light emitting diode device
CN104024722B (zh) 照明组件、光源和灯具
US8801238B2 (en) Light-emitting device
US20090323346A1 (en) Light emitting diode structure
JP3138795U (ja) 半導体発光装置及び半導体発光装置を用いた面状発光源
CN102779934A (zh) 发光二极管元件
TW200814362A (en) Light-emitting diode device with high heat dissipation property
CN101614326A (zh) 发光二极管
US8907371B2 (en) Light emitting diode package and light emitting device having the same
TW200830581A (en) Sideway lighting device
JP2007294867A (ja) 発光装置
TW201407748A (zh) 發光二極體燈條
CN101476683B (zh) 侧射型发光二极管背光模块
TW201218467A (en) Light emitting element
CN101586795B (zh) 光源装置
CN101369617B (zh) 高散热性发光二极管装置
TWI385824B (zh) 光源裝置
CN107785475B (zh) 发光装置复合基板及具有该发光装置复合基板的led模组
KR102148846B1 (ko) 인쇄회로기판 조립체 및 이를 포함하는 발광장치
CN101556034B (zh) 光源装置
KR101247380B1 (ko) 발광 다이오드
JP3128613U (ja) 発光ダイオード
TW201010022A (en) Light emitting diode heatsink