200901534 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種沈積有機薄膜用之裝置，尤指一種 沈積一有機薄膜用之裝置，該裝置可以經由調整多個直線 排列的點狀沈積源之間的間距以控制沈積薄膜的均勻性。 【先前技術】200901534 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a device for depositing an organic film, and more particularly to a device for depositing an organic film, which can be adjusted by adjusting a plurality of linearly arranged point deposition sources The spacing between them is to control the uniformity of the deposited film. [Prior Art]
10 1510 15
L 最近，隨著資訊通信技術的迅速發展和其市場的擴 大，平面顯示器得以以顯示器裝置之姿來到聚光燈下。‘ 面顯示器典型地包括液晶顯示器、電漿顯示器平面 發光二極體等等。 其中，由於諸如回應迅速、能源消耗低、質量_、^ 因無需背光而使超薄結構成為可能以及較現存液晶顯示营 還要明党的高明亮度等好處，使有機發光二極體得以成# 下一世代顯示器裝置之焦點。 有機發光二極體係裝配有—陽極膜、—有機薄膜和— 2極^其係依序塗覆在-載板，且若在陽極與陰 也ΐ!機薄膜中會形成一適當的能量差以使其自 , 庄入電子與—電洞再結合時，乘 :的激發能量會以光的方式產生。同時，被產生光的波肩 顏色的光。 整’因此可以發出各趕 二極體係裝配有一陽 —發光層、一電子傳 雖然圖中並無顯示，但有機發光 極、一電洞注入層、一電洞傳輸層、 20 200901534 輸層 '一電子注入層以及一陰極，其係依序層壓於載板上。 在此，陽極主要採用具有低表面電阻和良好的透明度之氧 化銦錫（Indium Tin Oxide)。有機薄膜係裝配有多層結構， 其包含電洞注入層、電洞傳輸層、發光層、發光層、電子 5傳輸層以及電子注入層，以增強發光效率，而用於發光層 的有機材料可採用三（8-羥基喹琳）鋁（Aiq3)、#，#，_雙（3_曱基 笨基雙苯基聯苯二胺（tpd)、2-(4-聯苯基）-5-(第三丁 基苯基）-1，3,4-噁二唑（PBD)、（4,4，，4，，-三（3-节基苯基胺基） 〇 —苯胺（m-MTDATA)、4,4’，4”-三（iV-咔唑基）三苯胺（TCTA) 10 等等。另外，一氟化鋰-鋁金屬層係被用來當作陰極。有機 薄膜是非常脆弱而無法對抗空氣中的水氣及氧氣，所以在 最外層的部份會形成一保護薄膜來增加生命週期。 同時，目前有機薄膜係以下列的方法合成：真空沈積 法（vacuum deposition)、濺鍍法（sputtering)、離子束沈積法 15 (i〇n_beam dePosition)、脈衝雷射蒸鍍沈積法（pulsed-laser deposition)、分子束沈積法（m〇lecular_beamdep〇siti〇n)、化 學蒸鍍沈積法（chernical vapor deposition)以及旋轉塗佈法 (spin coater)等等。其令，真空沈積法是商業上常用的方法。 在此，真空沈積法係在一容置有有機材料的坩鍋周圍 20加熱以蒸發或昇華有機材料以致於有機材料之蒸氣（氣體） 沈積在一放置於上述掛錯上面的載板上而實施。 如今，係以圖1與圖2來解釋一習知的有機薄膜沈積裝 置。有機沈積薄膜裝置的架構係如圖i與圖2所示一沈積 源110是被放置在沈積腔室100中以便能載入並支撐一載板 6 200901534 S。沈積源110是-直線來源，在其上部具有—開口⑴ 積源110在其直線主體中可包含有機材料，而 ' 熱器（圖未示）以蒸發有機材料。 因此’在-載板S被载人沈積腔室⑽中且被放置在沈 5積源11G上之後，有機材料可被蒸發以形成_ —歷 度的有機薄膜。 、 辱 同時，當形成有機薄膜時，薄膜沈積的均勾度是必須 要求的。-般而言，沈積在載板中間部分的進行的較為活 ° 躍’而非在其邊緣。為了解決此問題，在沈積源U0中，使 10開口形成幸間部分較其末端兩邊小，以此改善薄膜沈積的 均勻性問題’如圖1及圖2所示。 、然而，習知有機薄膜裝置之開口形狀可以藉由大量的 重複實驗來調整，不過此法既複雜又不符合經濟效益。 15 【發明内容】 因此，本發明係用來解決上述問題，本發明之一目的 〇 係在於提供一沈積有機薄膜之裝置，該裝置可以方便地控 制沈積薄膜的均勻性。其係藉由使用—具有複數個點狀沈 積源之沈積源組件，其中沈積源間的間距可被適當地調整。 20 為了達成上述目的，本發明提供一在一載板上沈積一 有機薄膜的裝置，裝置包含一沈積腔室和一沈積源組件， 其是可分離地被安裝在沈積腔室裡，並且具有複數個彼此 間互相分離且以直線排列之點狀沈積源，其中，點狀沉積 源之間的間距是從沈積源組件的中心往外遞減。 7 200901534 另外’下文中也提供除了本發明上述實施態樣外之具 體實施態樣。 根據本發明之一實施態樣’沈積源組件可具有以一列 排列之點狀沈積源，其中用以蒸發一主體（h〇st)之點狀沈積 5 源與用以蒸發一掺混物之點狀沈積源是交替排列。 根據本發明之一實施態樣，沈積源組件可具有排列成 至少兩排之點狀沈積源，其中用以蒸發一主體用的一排與 用以蒸發一掺混物的另一排是交替排列。 Γ) 根據本發明之一實施態樣，在沈積源組件上可更提供 10 一具有一狹縫的擋板（shield)，其係用以控制被蒸發有機材 料之一散射圖樣。 根據本發明之一實施態樣，該裝置可更包括一載具以 在一水平方向上移動載板。 15 【實施方式】 下文中，本發明之較佳實施例將會在伴隨其後之圖式 r \ 一併詳細地描述。 參照圖3及圖4， 膜之裝置1包括：一: 20 積源組件10。 4，根據本發明一實施例之一沈積有機薄 一沈積腔室2和一安裝在沈積腔室中之沈 沈積源組件10係農配有以直線排列之複數個點狀沉積 源，而其點狀沈積源之間的間距係被控制。 ' 200901534 另外，在载板s跟沈積源組件丨〇之間可更提供—擋板 盆抬板20係用以控制被蒸發之有機材料之一散射圖樣， ”上开/成一狹縫21以使有機材料可以通過它。 5 同時’沈積有機薄膜用之裝置1更可進一步包括 載板 八（圖未示）’以使載板s可以在水平方向上被移動然後在 沈積的過程中被掃描。載板載具可以採用在此領域中任何 已知的方法達成。 10 15 同時，沈積源組件10中點狀沈積源之間的間距是可以 被安排，例如，他們是從中心往外遞減 (d广d2>d3 = d4>d5=d6) ’如圖5所示。此安排是為了避免上述 在載板S中心部份的過分集中沈積。 如另一範例，§亥些複數個點狀沈積源可被安排以用來 …發主體之點狀沈積源與用來蒸發一掺混物之點狀沈積 源是交替排列，且此種安排允許同時間沈積不同種類的材 料。 該些複數個點狀沈積源亦可被安排成兩排，如圖6所 示。+在此例中，這兩排中的其中一排之點狀沈積源丨丨是用 來蒸發主體用的，另一排之點狀沈積源12是用來蒸發掺混 物用的。 如另一範例，沈積源組件10可包含被直線排列成三排 的複數個點狀沈積源’如圖7所示。在此範例中，三排中的 第一及第二排之點狀沈積源11是用來蒸發主體用，第二排 之點狀沈積源12疋用來蒸發掺混物用。在此範例中，對於 鄰近之對應第一及第三排的點狀沈積源來說，第二排的每 9 200901534 一個沈積源皆可被排成「z」字型。另外，與上述相反地， $排列也可以是第一及第三排之點狀沈積源是用來蒸發掺 混物用，第二排之點狀沈積源是是用來蒸發主體用。 、根據本發明之上述的沈積有機薄膜用之裝置，可藉由 5以圖3到圖7中所示直線排列的點狀沈積源而成為一線性沈 、'原且亦可藉由調整點狀沈積源之間的間距來適當地控 制薄膜的均勻性。 工業應用 如上述’藉由一具有多個其間間距可以被適當地調整的 1〇點狀'尤積源之手段，本發明可很方便地控制薄膜沈積物的 均勻性。 【圖式簡單說明】 圖1係一傳統的有機薄膜沈積裝置之剖面示意圖。 15 ®2係-傳統的有機薄膜沈積之示意圖。 圖3係根據本發明之沈積有機薄膜裝置之剖面示意圖。 圖4係根據本發明之沈積有機薄臈裝置中有機薄膜沈積流 程之示意圖。 圖5到7係為顯示根據本發明應用到有機薄膜沈積裝置中之 2〇沈積源組件之各種實施範例之示意圖。 【主要元件符號說明】 1 ^ 衣1 2 沈積腔室 1 〇沈積源組件 11點狀沈積源 12點狀沈積源 20擋板 10 200901534 110沈積源 21狹缝 100沈積腔室 111開口 S 載板L Recently, with the rapid development of information and communication technology and the expansion of its market, flat-panel displays have come to the spotlight in the form of display devices. A 'surface display typically includes a liquid crystal display, a plasma display planar light emitting diode, and the like. Among them, due to the rapid response, low energy consumption, quality _, ^ because the backlight is not required to make the ultra-thin structure possible, and the existing liquid crystal display camp to understand the party's high brightness and other benefits, so that the organic light-emitting diode can become # The focus of next generation display devices. The organic light-emitting diode system is equipped with an anode film, an organic film, and a 2-pole layer, which are sequentially coated on the carrier plate, and an appropriate energy difference is formed in the anode and the cathode film. When it is combined with the electron hole and the hole, the excitation energy of the multiplication is generated by light. At the same time, the light of the wave shoulder is produced. The whole 'so can be issued with a galvanic system with a positivity-emitting layer, an electron transmission, although not shown in the figure, but an organic luminescent electrode, a hole injection layer, a hole transmission layer, 20 200901534 The electron injecting layer and a cathode are sequentially laminated on the carrier. Here, the anode mainly employs Indium Tin Oxide having a low surface resistance and good transparency. The organic thin film is assembled with a multilayer structure including a hole injection layer, a hole transport layer, a light emitting layer, a light emitting layer, an electron 5 transport layer, and an electron injection layer to enhance luminous efficiency, and an organic material for the light emitting layer may be used. Tris(8-hydroxyquinoline)aluminum (Aiq3), #,#,_bis(3_indolyl phenyldiphenylbiphenyl (tpd), 2-(4-biphenyl)-5-( Tert-butylphenyl)-1,3,4-oxadiazole (PBD), (4,4,,4,,-tris(3-phenylphenylamino) anthracene-aniline (m-MTDATA) , 4,4',4"-tris(iV-carbazolyl)triphenylamine (TCTA) 10, etc. In addition, a lithium fluoride-aluminum metal layer is used as a cathode. The organic film is very fragile It is unable to resist moisture and oxygen in the air, so a protective film is formed on the outermost layer to increase the life cycle. At the same time, organic thin films are synthesized by the following methods: vacuum deposition, sputtering Sputtering, ion beam deposition 15 (i〇n_beam dePosition), pulsed-laser deposition, molecular beam deposition (m〇lecular) _beamdep〇siti〇n), chernical vapor deposition, spin coater, etc., so that vacuum deposition is a commonly used method in the market. Here, the vacuum deposition method is A crucible surrounding the organic material 20 is heated to evaporate or sublimate the organic material so that the vapor (gas) of the organic material is deposited on a carrier plate placed on the above-mentioned misplaced surface. A conventional organic thin film deposition apparatus is illustrated in Fig. 2. The structure of the organic deposition thin film apparatus is as shown in Fig. 1 and Fig. 2. A deposition source 110 is placed in the deposition chamber 100 so as to be able to load and support a carrier. 6 200901534 S. Deposition source 110 is a linear source with an opening (1) in its upper portion. The source 110 may contain organic material in its linear body and a 'heater (not shown) to evaporate the organic material. Therefore 'in- After the carrier S is loaded into the deposition chamber (10) and placed on the sink source 11G, the organic material can be evaporated to form an organic film of _ calendar. At the same time, when the organic film is formed, the film is deposited. of The hook is required. In general, the deposition in the middle part of the carrier is more active than on the edge. To solve this problem, in the deposition source U0, the 10 openings are formed into a lucky part. It is smaller than the two ends to improve the uniformity of film deposition as shown in Fig. 1 and Fig. 2. However, the shape of the opening of the conventional organic thin film device can be adjusted by a large number of repeated experiments, but this method Complex and not economically viable. SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to provide a device for depositing an organic thin film which can conveniently control the uniformity of a deposited film. This is achieved by using a deposition source assembly having a plurality of point-like deposition sources, wherein the spacing between deposition sources can be appropriately adjusted. In order to achieve the above object, the present invention provides an apparatus for depositing an organic thin film on a carrier, the apparatus comprising a deposition chamber and a deposition source assembly detachably mounted in the deposition chamber and having a plurality A point-like deposition source that is separated from each other and arranged in a line, wherein the spacing between the point deposition sources decreases outward from the center of the deposition source assembly. 7 200901534 Further, specific embodiments other than the above-described embodiments of the present invention are also provided hereinafter. According to an embodiment of the present invention, a deposition source assembly may have a point-like deposition source arranged in a line, wherein a point-like deposition source for evaporating a body (h〇st) and a point for evaporating a blend are used. The source of deposition is alternately arranged. According to an embodiment of the present invention, the deposition source assembly may have a point deposition source arranged in at least two rows, wherein one row for evaporating one body and the other row for evaporating one blend are alternately arranged. . According to one embodiment of the present invention, a shield having a slit for controlling a scattering pattern of one of the evaporated organic materials may be further provided on the deposition source assembly. According to one embodiment of the invention, the apparatus may further include a carrier to move the carrier in a horizontal direction. [Embodiment] Hereinafter, preferred embodiments of the present invention will be described in detail with the accompanying drawings. Referring to Figures 3 and 4, the membrane device 1 comprises: a: 20 source assembly 10. 4. A deposition apparatus 2 for depositing an organic thin deposition chamber and a deposition source assembly 10 mounted in a deposition chamber according to an embodiment of the present invention is provided with a plurality of point deposition sources arranged in a line, and a point thereof The spacing between the deposition sources is controlled. ' 200901534 In addition, between the carrier s and the deposition source component — can be further provided - the baffle basin lifting plate 20 is used to control the scattering pattern of one of the evaporated organic materials, "opening / forming a slit 21 to enable The organic material can pass through it. 5 At the same time, the apparatus 1 for depositing an organic film can further include a carrier plate eight (not shown) so that the carrier plate s can be moved in the horizontal direction and then scanned during deposition. The carrier carrier can be achieved by any method known in the art. 10 15 At the same time, the spacing between the point deposition sources in the deposition source assembly 10 can be arranged, for example, they are decremented from the center (d) D2>d3 = d4>d5=d6) 'As shown in Fig. 5. This arrangement is to avoid the above-mentioned excessive concentration deposition on the central portion of the carrier S. As another example, a plurality of point deposition sources may be used. The point deposition source arranged to be used for the main body and the point deposition source for evaporating a blend are alternately arranged, and this arrangement allows simultaneous deposition of different kinds of materials. The plurality of point deposits Sources can also be arranged in two rows , as shown in Figure 6. + In this example, one of the two rows of the point-like deposition source is used to evaporate the body, and the other row of the point-like deposition source 12 is used for evaporation. For another example, the deposition source assembly 10 can include a plurality of point deposition sources that are linearly arranged in three rows as shown in FIG. 7. In this example, the first and second of the three rows The punctate deposition source 11 is for evaporating the main body, and the second row of punctate deposition sources 12 疋 is used for evaporating the blend. In this example, for the adjacent first and third rows of dots For the deposition source, every 9 200901534 of the second row can be arranged in a z-shape. Further, contrary to the above, the $arrangement may be such that the dot-like deposition sources of the first and third rows are used for evaporating the dopant, and the dot-like deposition source of the second row is for evaporating the host. The apparatus for depositing an organic thin film according to the present invention can be made into a linear sink, 'original and can also be adjusted by a point by 5 points of a dotted deposition source arranged in a straight line as shown in FIG. 3 to FIG. The spacing between the deposition sources is used to properly control the uniformity of the film. Industrial Applicability As described above, the present invention can easily control the uniformity of film deposits by means of a one-point dot-like source which can be appropriately adjusted with a plurality of intervals therebetween. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a conventional organic thin film deposition apparatus. 15 ® 2 Series - A schematic of traditional organic film deposition. Figure 3 is a schematic cross-sectional view of a deposited organic thin film device in accordance with the present invention. Figure 4 is a schematic illustration of the deposition process of an organic thin film in a deposited organic thin tantalum apparatus in accordance with the present invention. 5 to 7 are schematic views showing various embodiments of a 2-layer deposition source assembly applied to an organic thin film deposition apparatus according to the present invention. [Main component symbol description] 1 ^ Clothing 1 2 deposition chamber 1 〇 deposition source component 11 point deposition source 12-point deposition source 20 baffle 10 200901534 110 deposition source 21 slit 100 deposition chamber 111 opening S carrier plate
1111