TW200901341A - Compression molding method and device for electronic component - Google Patents

Compression molding method and device for electronic component Download PDF

Info

Publication number
TW200901341A
TW200901341A TW097116617A TW97116617A TW200901341A TW 200901341 A TW200901341 A TW 200901341A TW 097116617 A TW097116617 A TW 097116617A TW 97116617 A TW97116617 A TW 97116617A TW 200901341 A TW200901341 A TW 200901341A
Authority
TW
Taiwan
Prior art keywords
hole
mold
resin
electronic component
compression molding
Prior art date
Application number
TW097116617A
Other languages
English (en)
Chinese (zh)
Other versions
TWI376753B (enExample
Inventor
Shinji Takase
Takashi Tamura
Takeaki Taka
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007141640A external-priority patent/JP2008296382A/ja
Priority claimed from JP2008038892A external-priority patent/JP5128309B2/ja
Application filed by Towa Corp filed Critical Towa Corp
Publication of TW200901341A publication Critical patent/TW200901341A/zh
Application granted granted Critical
Publication of TWI376753B publication Critical patent/TWI376753B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW097116617A 2007-05-29 2008-05-06 Compression molding method and device for electronic component TW200901341A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007141640A JP2008296382A (ja) 2007-05-29 2007-05-29 電子部品の圧縮成形方法及び金型
JP2008038892A JP5128309B2 (ja) 2008-02-20 2008-02-20 電子部品の圧縮成形方法及び金型

Publications (2)

Publication Number Publication Date
TW200901341A true TW200901341A (en) 2009-01-01
TWI376753B TWI376753B (enExample) 2012-11-11

Family

ID=40366480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097116617A TW200901341A (en) 2007-05-29 2008-05-06 Compression molding method and device for electronic component

Country Status (2)

Country Link
KR (1) KR20080104966A (enExample)
TW (1) TW200901341A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573199B (zh) * 2013-06-20 2017-03-01 Towa Corp Electronic component compression resin sealing method and compression resin sealing device
TWI645520B (zh) * 2015-03-23 2018-12-21 日商Ｔｏｗａ股份有限公司 樹脂密封裝置以及樹脂密封方法
CN115738897A (zh) * 2022-11-03 2023-03-07 巨玻固能(苏州)薄膜材料有限公司 制粒设备

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573199B (zh) * 2013-06-20 2017-03-01 Towa Corp Electronic component compression resin sealing method and compression resin sealing device
TWI645520B (zh) * 2015-03-23 2018-12-21 日商Ｔｏｗａ股份有限公司 樹脂密封裝置以及樹脂密封方法
US10170346B2 (en) 2015-03-23 2019-01-01 Towa Corporation Resin sealing apparatus and resin sealing method
CN115738897A (zh) * 2022-11-03 2023-03-07 巨玻固能(苏州)薄膜材料有限公司 制粒设备

Also Published As

Publication number Publication date
KR20080104966A (ko) 2008-12-03
TWI376753B (enExample) 2012-11-11

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