200850126 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電路板及其製作方法，其特別係關於一種 • 高散熱電路板及其製作方法。 【先前技術】200850126 IX. Description of the Invention: [Technical Field] The present invention relates to a circuit board and a method of fabricating the same, and more particularly to a high heat dissipation circuit board and a method of fabricating the same. [Prior Art]
Cj 目前應用最廣的電路板為印刷電路板，其基板材質包括以下 四種·（1)紙質基板；（2)複合基板；⑶玻璃纖維環氧基板；（4)軟質 基板。其中以玻璃纖維環氧基板最被廣泛使用，其材質為玻璃纖 維布含浸耐燃性環氧樹脂，俗稱FR4印刷電路基板。前述電路基 板材^都是樹脂與高分子材料，其導熱與散熱性質較差，對於高 發熱量的電子元件與系統，無法有效排除熱能。因此，為了改善 基，的散熱問題，藉由各種不同的接合方法，在基板的下方黏結 二金屬平板，來增加整體電路板結構的散熱效能。如第一圖所示， π明習知印刷電路板結構，該習知印刷電路板丨包括一金屬平板 11、一玻璃纖維環氧基板12及一銅箔層13。 ，而，不同的接合方法，其所獲致的散熱效能亦大不相 =主要是受到黏結劑性質與黏結過程影響所致。以玻璃纖維 土^為例，為了降低黏結劑的影響，在玻璃纖維環氧基板的 ^ ，程當中’即將金屬平板與玻璃纖維環氧基板壓合在一起， 由、ιΐ生產玻璃纖維環氧基板的同時，亦一併結合金屬平板，經 人居式獲得的電路板是目前市面上散熱效能較佳的，又稱為 孟屬心印刷電路板。 光萨功率、高亮度LED電路板為例，一般習知，LED晶片發 率ίΐΐί的功率逸散，如沒有適當地排除，將降低晶片發光效 技術，查照明設備大廠歐司朗(〇SRAM)所揭示一種散熱 又。而功率LED電路板的散熱效能，該技術藉由設置導 5 200850126 .ί;=全=r裝:了 .ίΐΪ2ίί2為了增加熱能的傳遞速度，FR4電路板 士除了必要的銅―線之外，在LED下方的導歸内辟 電路板與銘合金接合的表面上，也都鑛有一層銅金屬土。 為了 5二熱管結構的fr4電路板’ ίί，對整體散熱的影響，仍舊無法排除。此外 Ί 板ΐίίΓ内壁、導電線路等等銅金屬鍵層的表面處理相當 的ΐ要1與複雜度都很高’銅鑛層的純度也會影響敎傳i 的效果，而减所獲得的賴效能仍核理想。 ”、、寻* 545^Ht國Γ月專利595016號、中華民國新型專利 電路反專 號均揭示了一種散熱 的方々ί ^ iri!技谷仍以電板之一表面黏結金屬板 拓剂:來s加政…效果。中華民國發明專利550841號及中華民國 种5ffG號#，亦針對散熱金屬板做散熱設計的專利技 術’主要崎_>^設馳念社。 欄技 c ΐ，專業領域中具有通常知識者所習知，_對半 曰曰貝Ϊ具有一定之影響力。因此’如果沒有良好的LE〇 :pp!v^文率’再好的光取出設計，其對整體發光的貢獻將相當 發‘5’大 =專利 2案號6,346,771 B1 與 6,720,730B2 揭示一 i 職的高功率LED封裝方法，其_晶片表面 出十ί及在散熱金屬板表面製作反射金屬層，來提高光取 雷’而'電路板仍是樹脂基板黏結金屬平板之結構，來提高 ”反之散熱效率。另外’如美國專利案號6,641，284 B2利用光 6 200850126 」0_04_ Α1的LED以：;=7樣；美國專利案號 術除了從麵具 黏齡屬平板之結構，來提高電路板之會利卿曰基板 基技2提之散熱方式均是利用樹脂 溫度對此半導體元件熱效率。由此可知 Γ的重要性不可讀。予的％疋性具有決定性影響，優良散熱 來加熱方式均是在板下方接合金屬板 下缺點··⑴翻_的輸生不佳，· ⑺麻基板與散熱金屬_接合方式也會影響導熱效果。 【發明内容】 屬莫ί么月之主要目的乃^供一種高散熱電路板，包括至少-全 ϋ ^，與該絕緣層之間，以提;=板 性，並降低熱應力造成的鍍層剝離或破裂。藉[改^^= =ϊ金屬板之電路板在散熱方面的缺點，提供更“導4、曰； 之另—目的在於提供—種高散熱電路板之製作方法， 法匕括：提供至少—個金屬基板；在該金屬基板^成^· 衝層；以及，在該緩衝層上形成一絕緣層 /成一 再者，為達成上述之目的，該金屬基板之材料 金_、銀(Ag)、_)、_、购、華)及其合自^^ 7 200850126 之群組，該金屬基板厚度並無特殊的限制，只要利於電子元件所 產生的熱，可以迅速地均勻分佈於此金屬基板均 板厚度約為0·!馳至10mm之間，但不侷限J二厂旱目度月= 層之材料係選自氧化Is、氮化!g、石墨、鑽石及其混合物所構成 之群組，而該絕緣層的厚度約為〇·5μηι至5 mm之間，但不侷限 於此一厚度。该緩衝層之材料係選自銅(Cu)、金(Au)、銀(Ag)、銦 (t)、錫(Sn)、鋅(Zn)、銘(A1)及其合金所構成之群組，或該群組之 虱化物或該群組之氮化物，而該緩衝層的厚度約為〇·5μπι至2〇〇 μιη之間，但不侷限於此一厚度。Cj currently has the most widely used circuit board as a printed circuit board. The substrate material includes the following four types: (1) paper substrate; (2) composite substrate; (3) glass fiber epoxy substrate; and (4) flexible substrate. Among them, a glass fiber epoxy substrate is most widely used, and its material is a glass fiber cloth impregnated with a flame resistant epoxy resin, commonly known as an FR4 printed circuit board. The above-mentioned circuit substrate plates are all resin and polymer materials, and their heat conduction and heat dissipation properties are poor, and for high heat-generating electronic components and systems, heat energy cannot be effectively excluded. Therefore, in order to improve the heat dissipation problem of the substrate, the two metal plates are bonded under the substrate by various bonding methods to increase the heat dissipation performance of the overall circuit board structure. As shown in the first figure, the conventional printed circuit board structure includes a metal flat plate 11, a glass fiber epoxy substrate 12, and a copper foil layer 13. However, the different bonding methods, the resulting heat dissipation performance is also largely irrelevant = mainly due to the nature of the binder and the bonding process. Taking glass fiber cement as an example, in order to reduce the influence of the binder, in the glass fiber epoxy substrate, the metal plate and the glass fiber epoxy substrate are pressed together, and the glass fiber epoxy substrate is produced by ιΐ. At the same time, combined with the metal plate, the circuit board obtained by the Habitat is currently the best heat dissipation performance on the market, also known as the Meng heart printed circuit board. For example, it is common to know that the power dissipation of the LED chip is 135. If it is not properly excluded, the technology of the wafer illuminating effect will be reduced. Check the lighting equipment manufacturer Osram (〇SRAM) Reveal a heat dissipation again. The heat dissipation performance of the power LED circuit board, the technology is set by the guide 5 200850126 . ί; = full = r installed: ί ΐΪ 2 ίί2 In order to increase the heat transfer speed, FR4 circuit board in addition to the necessary copper - line, in A layer of copper metal is also deposited on the surface of the LED-incorporated circuit board that is bonded to the alloy. For the fr2 circuit board of the 5 2 heat pipe structure, the effect on the overall heat dissipation cannot be ruled out. In addition, the surface treatment of the copper metal bond layer, such as the inner wall and the conductive line, is quite high and the complexity is very high. The purity of the copper ore layer also affects the effect of the 敎 i i, Still nuclear ideal. ",, find * 545 ^ Ht Guo Haoyue Patent No. 595016, the Republic of China's new patent circuit anti-special number reveals a kind of heat dissipation 々 ^ ^ iri! Technology Valley still adheres to the surface of one of the electric plates. Jiazheng...effect. The Republic of China invention patent No. 550841 and the Chinese Republic of China 5ffG#, also the patented technology for the heat dissipation design of the heat-dissipating metal plate 'mainly _ _ gt; ^ set the company. 栏技术c ΐ, professional field It is well known to those of ordinary knowledge that _ has a certain influence on semi-mussels. Therefore, 'if there is no good LE〇: pp!v^ text rate', the best light extraction design, its contribution to the overall luminescence It will be quite a '5' large = patent 2 case number 6,346,771 B1 and 6,720,730B2 to reveal a high-power LED packaging method, which has a surface of 10 Å and a reflective metal layer on the surface of the heat-dissipating metal plate to improve the light extraction. Ray 'and' circuit board is still the structure of the resin substrate bonded metal plate to improve the heat dissipation efficiency. In addition, as in U.S. Patent No. 6,641,284 B2, the LED of the light 6 200850126 ”0_04_ Α1 is used as:;=7; the U.S. patent case except for the structure of the mask from the slab is used to improve the circuit board. The heat dissipation method proposed by the substrate of the substrate is the thermal efficiency of the semiconductor element using the resin temperature. This shows that the importance of Γ is not readable. The % 疋 予 具有 具有 具有 , 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 优良 缺点 缺点 缺点 缺点 缺点 缺点 缺点. SUMMARY OF THE INVENTION The main purpose of the Mo Mo Mo Yue is to provide a high heat dissipation circuit board, including at least - full , ^, and the insulation layer to improve; = slab, and reduce the thermal stress caused by the peeling of the coating Or rupture. By [changing ^^== ϊ metal plate circuit board in the heat dissipation shortcomings, provide more "lead 4, 曰; the other - the purpose is to provide a high-heat-dissipation circuit board manufacturing method, the law includes: provide at least - a metal substrate; a metal layer is formed on the metal substrate; and an insulating layer is formed on the buffer layer. In order to achieve the above object, the material of the metal substrate is gold, silver (Ag), _), _, purchase, hua) and its group from ^^ 7 200850126, the thickness of the metal substrate is not particularly limited, as long as the heat generated by the electronic components can be quickly and evenly distributed on the metal substrate The thickness of the plate is about 0·! and is between 10mm, but it is not limited to the J 2 plant; the material of the layer is selected from the group consisting of oxidized Is, nitriding!g, graphite, diamond and mixtures thereof. The thickness of the insulating layer is between 〇·5μηι and 5 mm, but is not limited to the thickness. The material of the buffer layer is selected from the group consisting of copper (Cu), gold (Au), silver (Ag), and indium ( t), a group of tin (Sn), zinc (Zn), indium (A1) and alloys thereof, or a telluride of the group or a nitride of the group And the thickness of the buffer layer is approximately square-between 5μπι to 2〇〇 μιη, but is not limited to this thickness.
Ο 、、此外，上述形成緩衝層及絕緣層的方法係選自電鍍法、熱噴 真空濺餘、化學氣相沈積法及其任兩種以上方法併用所 構成之群組，利用該等表面處理方法使得各層之間擁有最佳的接 合介面，免除使用黏結劑的對散熱所造成的負面效果。 本發明所，供的高散熱電路板，並不限定使用於LED驅動電 路，舉凡具有高功率、高發熱電子元件的電路系統，本發明 示之技術内容皆可應用。 ^ 【實施方式】 —為使熟悉該項技藝人士瞭解本發明之目的、特徵及功效，茲 藉由下述具體實侧，並配合賴之圖式，對本創加說明， 說明如后： 古蜎 > 考第二圖，說明本發明之高散熱電路板結構示意圖，該 =散熱電路板2包括··至少—金屬基板21 ;—絕緣層23，該絕緣 1 23係為一具有導熱性質之絕緣表面，以佈植導電線路；以及一 緩，層22，該緩衝層22介於該金屬基板21與該絕緣層23之間， 以提升該金屬基板21與該絕緣層23的接合附著性，並降低因熱 應力所產生鍵層剝離或破裂的現象。 請參考第三圖，說明本發明之高散熱電路板製作方法流程 8 200850126 圖’該製作方法包括：步驟l〇.袒 人超甘上 中，利用i 作1法在該高散熱電路板的結構 有較佳的接二的接合性質得以提升，而擁 劑對散熱所造成的負面效▲。又白知電路板製造過程愤用黏結 21的材:係刀二下’請再參考第-圖，該金屬基板 ' ^(In)' ^(Sn>' . 全屬材料。群、、且荨兩導熱金屬材料，但不侷限於這此 於此金屬基板21即可===產=迅速均勻地分佈 侷限於此一厚度。a度、力為心也至1〇 mm之間，但不 此外，該緩衝層22的材料選自銅(Cu)、金认 二(Sn)、辞(zn)、_)及其合金所構成之群組，或〜亥i组i 二°在本實施例中，該緩衝層D材料二ί (ad料度約為〇·5μη^2()()μηι，但不侷限於此—厚度。巧 再者，該絕緣層23的材料係選自氧化銘、氮化^ ;ί ΐί合ί Γί ίΐ群組。在本實施例中，該絕緣層23 ^料3 ’’、、：’’，、厚度約為0.5μηι至5mm，但不侷限於此一厚度。 ΐίί方散熱電路板之製作方法中’形成該緩衝層及 ?浐4及苴ft電鍍法、熱喷塗法、真空濺鍍法、化學氣相 真空賴法在該金屬基板21上形成—”本j例中係為 22上形成一絕緣層23 开4緩衝層22，並在該緩衝層 ㈣:Ϊ : 時參考第二圖及第三圖，製作過程如下，步驟1〇 下在施Lif ί?21 ’此處以銘為其基材，厚度為10麵以 潔f呈後，如步驟2〇在該金屬基板21上形 成、，友衝層22，此處以真空賴法在該金屬基板U之一表面形成 200850126 鋁^ (A1 layer)作為緩衝層22，其厚度可為〇·5 ,至2〇〇 接著，如步驟30在該緩衝I 22上形成一絕緣層23，在該銘緩衝 層22之表面，係以真空濺鑛法形成計量型氮化鋁鑛層，Ain，作 ，絕緣層23 ’厚度可為〇·5 μιη〜5麵，該絕緣層23可取代樹脂 基板，並提供電路佈植所需之絕緣表面。經由上述製作方法， 可製得本發明之高散熱電路板2。 另外’為說明本發明具有高散熱效能，故取姻尺寸之 ^用^脂基板之印刷電路板，在其表面佈植相同的電路，並* 1w功率的LED元件。請參考第四圖，說明本發 板ί習知印刷電路板溫度變化比較圖，本發明之高 L Ί路板及目前習用的樹脂基板之印刷電路板均以該1 w功率 作Λ祕，並均在LED下方設置溫賴，紀錄 ί 如第四圖所示’ a代表習知印刷電路板散熱 2 rt P i刷電路板使用數分鐘之後，其溫度即跳升至 率^線，#0=?地上升；B代表本發明高散熱電路板散熱效 羊3，=明之向散熱電路板使用數分鐘之後，溫度雖跳升至 产f ，至持績使用200分鐘S ’溫度仍穩定地維持在80 Ο ^更具#^=^ ^知本㈣之紐熱桃錄胃知印刷電 埶性二二t本f ?中具導熱性的絕緣材料不僅可取代習知散 加上緩衝如娜基板’亦由於排除了黏結劑的使用，再 大幅降低^⑽0 ’提升了絕緣層與金屬基板之間的接合性質， 效果ϋϋίΪ產ί鑛層剝離或破裂的現象’同時提高散熱 額外散心置、:，元件產生的熱排放至周圍環境或溫度較低的 應量用元:的電路系統中’例如··高功率、高亮度 本創’僅林齡之紐實補，當不能以此限定 、 乾圍，故，凡依本創作申請專利範圍及創作說明書 200850126 内容所作之簡單的等效變化與修飾，皆應仍屬本創作專利涵蓋之 範圍内。Further, the method of forming the buffer layer and the insulating layer is selected from the group consisting of electroplating, thermal spray vacuum sputtering, chemical vapor deposition, and a combination of two or more thereof, and the surface treatment is utilized. The method provides an optimal bonding interface between the layers, eliminating the negative effects of using a bonding agent on heat dissipation. The high heat dissipation circuit board provided by the present invention is not limited to the LED driving circuit, and the circuit system having high power and high heat generating electronic components can be applied to the technical contents of the present invention. ^ [Embodiment] - In order to familiarize the person skilled in the art with the purpose, features and effects of the present invention, the following specific aspects, together with the diagram of the Lai, are used to explain the creation, as illustrated by the following: > The second diagram illustrates the structure of the high heat dissipation circuit board of the present invention. The heat dissipation circuit board 2 includes at least a metal substrate 21, and an insulating layer 23, which is an insulating material having thermal conductivity. a surface for implanting a conductive line; and a buffer layer 22 interposed between the metal substrate 21 and the insulating layer 23 to enhance adhesion of the metal substrate 21 to the insulating layer 23, and Reduce the phenomenon of peeling or cracking of the bond layer caused by thermal stress. Please refer to the third figure for explaining the high heat dissipation circuit board manufacturing method of the present invention. The process 8 includes the following steps: Step 1 袒. 袒人超甘上中, using i as the 1 method in the structure of the high heat dissipation circuit board There is a better bonding property that is improved, and the negative effect of the agent on heat dissipation. Also know the circuit board manufacturing process indignant with the material of the bonding 21: the second knife 'Please refer to the figure - the metal substrate ' ^ (In) ' ^ (Sn> [. All materials. Group, and 荨The two heat conductive metal materials, but not limited to this, the metal substrate 21 can be ===Production = rapid and evenly distributed is limited to this thickness. The degree of a, the force is between 1 and mm, but not The material of the buffer layer 22 is selected from the group consisting of copper (Cu), gold bis (Sn), gram (zn), _) and alloys thereof, or ~Hi group i 2 ° in this embodiment The buffer layer D material is ί (ad material is about 〇·5μη^2()()μηι, but is not limited thereto. The thickness of the insulating layer 23 is selected from the group consisting of oxidation and nitrogen. In the present embodiment, the insulating layer 23"3", ":", has a thickness of about 0.5μηι to 5mm, but is not limited to this thickness. In the manufacturing method of the 散热ίί side heat-dissipating circuit board, 'the buffer layer and the ?4 and 苴ft plating method, the thermal spraying method, the vacuum sputtering method, and the chemical vapor phase vacuum method are formed on the metal substrate 21-" j case is 22 is formed with an insulating layer 23 and 4 buffer layers 22, and in the buffer layer (4): Ϊ: refer to the second and third figures, the production process is as follows, step 1 is under the application of Lif ί? 21 'here For the substrate, the thickness is 10 faces to be clean, and as shown in step 2, on the metal substrate 21, the layer 22 is formed thereon, and a vacuum film is used to form 200850126 aluminum on one surface of the metal substrate U. (A1 layer) as the buffer layer 22, the thickness of which may be 〇·5, to 2〇〇. Next, an insulating layer 23 is formed on the buffer I 22 as in step 30, and a vacuum is applied to the surface of the buffer layer 22. The sputtering method forms a metered aluminum nitride ore layer, Ain, and the insulating layer 23' can have a thickness of 〇·5 μm to 5, and the insulating layer 23 can replace the resin substrate and provide an insulating surface required for circuit implantation. Through the above manufacturing method, the high heat dissipation circuit board 2 of the present invention can be obtained. In addition, in order to explain the high heat dissipation performance of the present invention, the printed circuit board of the grease substrate is the same on the surface. Circuit, and * 1w power LED components. Please refer to the fourth figure to illustrate the release board The comparison of the temperature changes of the printed circuit board, the high-L circuit board of the present invention and the printed circuit board of the conventional resin substrate are all secreted by the 1 W power, and the temperature is set below the LED, and the record ί is as the fourth. The figure shows that 'a stands for the conventional printed circuit board heat dissipation 2 rt P i brush circuit board after a few minutes of use, its temperature jumps to the rate ^ line, #0=? ground rise; B represents the high heat dissipation circuit board of the present invention After the use of the sheep 3, = Ming to the cooling circuit board for a few minutes, the temperature jumped to the production of f, to the use of the performance of 200 minutes S 'temperature is still maintained at 80 Ο ^ more #^=^ ^知本(4) The New Zealand Hotline recorded the stomach to print the electric conductivity of the second two t. This thermal insulation material can not only replace the Xizhisan plus buffering such as the substrate, but also eliminates the use of the adhesive, and then greatly reduces ^ (10)0 'Improve the bonding property between the insulating layer and the metal substrate, the effect ϋϋ Ϊ Ϊ ί 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 矿 剥离 剥离 剥离 剥离 剥离 剥离The quantity of the element: in the circuit system 'for example · high The rate and high brightness of this creation are only the new ones of the forest age. When it is not possible to limit and dry, the simple equivalent changes and modifications made by the scope of the patent application and the creation manual 200850126 should be It is still covered by this creation patent.
11 200850126 【圖式簡單說明】 第一圖說明習知印刷電路板結構示音 fC明之高散熱電路板:構示意圖； 明本發明之高散熱電路板製作方法流程圖；以及 弟四圖祝明本發明高散熱電路板鱼 圖。 白知印刷電路板溫度變化比較 【主要元件符號說明】 1篇知印刷電路板 11金屬平板 12玻璃纖維環氧基板 13銅箔層 2高散熱電路板 21金屬基板 22緩衝層 23絕緣層 ι〇提供至少一金屬基板 20形成一緩衝層於該金屬基板上 30形成一絕緣層於該緩衝層上 A習知印刷電路板散熱效率曲線 δ本發明高散熱電路板散熱效率曲線 1211 200850126 [Simplified description of the drawings] The first figure illustrates the structure of the printed circuit board structure, the high-heat-dissipation circuit board of the structure of the printed circuit board: a schematic diagram of the method for manufacturing the high-heat-dissipation circuit board of the present invention; Invented a high heat dissipation circuit board fish chart. Baizhi printed circuit board temperature change comparison [main component symbol description] 1 knowledge printed circuit board 11 metal plate 12 glass fiber epoxy substrate 13 copper foil layer 2 high heat dissipation circuit board 21 metal substrate 22 buffer layer 23 insulation layer 〇 provide At least one metal substrate 20 forms a buffer layer on the metal substrate 30 to form an insulating layer on the buffer layer. A known printed circuit board heat dissipation efficiency curve δ. The high heat dissipation circuit board heat dissipation efficiency curve 12