TW200846454A - Polishing composition - Google Patents

Polishing composition Download PDF

Info

Publication number
TW200846454A
TW200846454A TW97107219A TW97107219A TW200846454A TW 200846454 A TW200846454 A TW 200846454A TW 97107219 A TW97107219 A TW 97107219A TW 97107219 A TW97107219 A TW 97107219A TW 200846454 A TW200846454 A TW 200846454A
Authority
TW
Taiwan
Prior art keywords
ammonium
polishing
acid
tetrazole
composition
Prior art date
Application number
TW97107219A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshiyuki Matsumura
Hiroshi Nitta
Original Assignee
Nitta Haas Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Haas Inc filed Critical Nitta Haas Inc
Publication of TW200846454A publication Critical patent/TW200846454A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW97107219A 2007-02-28 2008-02-29 Polishing composition TW200846454A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007050340 2007-02-28

Publications (1)

Publication Number Publication Date
TW200846454A true TW200846454A (en) 2008-12-01

Family

ID=39721342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97107219A TW200846454A (en) 2007-02-28 2008-02-29 Polishing composition

Country Status (2)

Country Link
TW (1) TW200846454A (ja)
WO (1) WO2008105520A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101684392B (zh) * 2008-09-26 2015-01-28 安集微电子（上海）有限公司 一种化学机械抛光液
CN103205205B (zh) * 2012-01-16 2016-06-22 安集微电子（上海）有限公司 一种碱性化学机械抛光液

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005056879A (ja) * 2003-08-01 2005-03-03 Tosoh Corp 銅系金属用研磨液及び研磨方法
US7153335B2 (en) * 2003-10-10 2006-12-26 Dupont Air Products Nanomaterials Llc Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole

Also Published As

Publication number Publication date
WO2008105520A1 (ja) 2008-09-04

Similar Documents

Publication Publication Date Title
JP6023125B2 (ja) 化学的機械的研磨スラリー組成物およびそれを使用した銅のための方法およびシリコン貫通ビア適用
JP5032214B2 (ja) 銅／タンタル基体に有用な化学的機械研磨スラリー
JP4494538B2 (ja) 銅系基板に有用な化学的・機械的研磨用スラリー
JP4261058B2 (ja) 銅／タンタル基体に有用な化学的機械研磨スラリー
JP5539934B2 (ja) 銅基材に有益な化学機械的研磨スラリー
TWI248970B (en) Tantalum barrier removal solution
JP4644434B2 (ja) 研磨用組成物
TWI398473B (zh) 用於拋光在鑲嵌結構中之鋁／銅及鈦之組合物
JP6130380B2 (ja) アルミニウム半導体基材研摩用の組成物および研磨方法
TWI547551B (zh) Ｃｍｐ研磨液以及研磨方法
JP2002231666A (ja) 研磨用組成物およびそれを用いた研磨方法
JP5643183B2 (ja) ダマシン構造におけるアルミニウム／銅及びチタンを研磨するための組成物
WO2013003991A1 (zh) 一种基于金属co的抛光工艺的抛光液及其应用
JP6734854B2 (ja) コバルト及び／又はコバルト合金含有の基板の研磨のための化学機械研磨（ｃｍｐ）組成物の使用
TW200540240A (en) Chemical-mechanical polishing composition and method for using the same
JP2008512871A (ja) メタレート変性シリカ粒子を含有する水性スラリー
TW200916567A (en) Polishing composition
TWI586793B (zh) A polishing composition, a polishing method using the same, and a method for manufacturing the same
TWI787329B (zh) 用於鈷的化學機械拋光方法
TW200535218A (en) Polishing composition and polishing method
WO2014089905A1 (zh) 一种金属化学机械抛光浆料及其应用
JP2005167219A (ja) バリヤ除去のための組成物及び方法
TWI399428B (zh) Ｃｍｐ研磨液以及使用此ｃｍｐ研磨液的基板研磨方法
WO2010040280A1 (zh) 一种化学机械抛光液
TW200846454A (en) Polishing composition