WO2008105520A1 - 研磨組成物 - Google Patents

研磨組成物 Download PDF

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Publication number
WO2008105520A1
WO2008105520A1 PCT/JP2008/053579 JP2008053579W WO2008105520A1 WO 2008105520 A1 WO2008105520 A1 WO 2008105520A1 JP 2008053579 W JP2008053579 W JP 2008053579W WO 2008105520 A1 WO2008105520 A1 WO 2008105520A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
polishing composition
preferable
agent
organic acid
Prior art date
Application number
PCT/JP2008/053579
Other languages
English (en)
French (fr)
Inventor
Yoshiyuki Matsumura
Hiroshi Nitta
Original Assignee
Nitta Haas Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitta Haas Incorporated filed Critical Nitta Haas Incorporated
Publication of WO2008105520A1 publication Critical patent/WO2008105520A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

　本発明の研磨組成物は、水酸化アンモニウム、アンモニウム塩および有機酸を含むことで、従来より高速研磨が可能な研磨組成物を実現できる。さらに酸化剤を含むことで、より高速研磨が可能な研磨組成物を実現でき、これに防食剤を含むことで、ディッシングを抑制することができる。本発明の研磨組成物において、有機酸としては、アミノ酸が好ましく、酸化剤としては、過酸化水素が好ましく、防食剤としては、テトラゾール誘導体が好ましい。これにより、さらにディッシングを抑制し、高速研磨が可能な研磨組成物を実現できる。
PCT/JP2008/053579 2007-02-28 2008-02-28 研磨組成物 WO2008105520A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-050340 2007-02-28
JP2007050340 2007-02-28

Publications (1)

Publication Number Publication Date
WO2008105520A1 true WO2008105520A1 (ja) 2008-09-04

Family

ID=39721342

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053579 WO2008105520A1 (ja) 2007-02-28 2008-02-28 研磨組成物

Country Status (2)

Country Link
TW (1) TW200846454A (ja)
WO (1) WO2008105520A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010037265A1 (zh) * 2008-09-26 2010-04-08 安集微电子（上海）有限公司 一种化学机械抛光液
CN103205205A (zh) * 2012-01-16 2013-07-17 安集微电子（上海）有限公司 一种碱性化学机械抛光液

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005056879A (ja) * 2003-08-01 2005-03-03 Tosoh Corp 銅系金属用研磨液及び研磨方法
JP2005167204A (ja) * 2003-10-10 2005-06-23 Dupont Air Products Nanomaterials Llc アスパラギン酸／トリルトリアゾールを用いる化学的機械的平坦化のための調整可能な組成物および方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005014206A (ja) * 2003-05-30 2005-01-20 Sumitomo Chemical Co Ltd 金属研磨剤組成物
JP2005056879A (ja) * 2003-08-01 2005-03-03 Tosoh Corp 銅系金属用研磨液及び研磨方法
JP2005167204A (ja) * 2003-10-10 2005-06-23 Dupont Air Products Nanomaterials Llc アスパラギン酸／トリルトリアゾールを用いる化学的機械的平坦化のための調整可能な組成物および方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010037265A1 (zh) * 2008-09-26 2010-04-08 安集微电子（上海）有限公司 一种化学机械抛光液
CN103205205A (zh) * 2012-01-16 2013-07-17 安集微电子（上海）有限公司 一种碱性化学机械抛光液
CN103205205B (zh) * 2012-01-16 2016-06-22 安集微电子（上海）有限公司 一种碱性化学机械抛光液

Also Published As

Publication number Publication date
TW200846454A (en) 2008-12-01

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