200846267 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種將電子電路基板等的基板進行預 備位置決定（pre-al ignment)且從搬入台搬運至曝光台的 基板搬運裝置。 【先前技術】 習知，在電子電路基板等的基板曝光所定的圖案時， 藉由曝光裝置將基板從搬入位置（搬入台）搬運至曝光位置 (曝光台）時，例如，以下所示般的搬運裝置被使用（例如， 專利文獻1)。此搬運裝置係，將被載置於搬入位置的基板 的上面藉由吸著保持部吸著保持，將吸著保持部沿著移動 執道移動至曝光位置，藉由交付被保持在吸著保持部的基 板至曝光位置，而進行基板的搬運。 又，基板被投入至搬入位置後，對此基板進行預備位 置決定（預對準[pre-alignment])的搬運裝置被揭露（例 如，專利文獻2)。此搬運裝置係包括：搬運滾子，載置基 板而在搬運方向移動；以及定心單元，在上述搬運滾子之 間’具有將該搬運滾子上的基板的端面押動於X方向和Y 方向的銷。 又’有關對於被搬運至曝光位置的基板進行預備位置 決定的裝置也被提出（例如，專利文獻3)。此裝置係包括： 曝光桌，將基板在曝光位置載置；光學感測器，量測被載 置於此曝光桌上的基板的位置驅動機構，基於藉由此光 2036-9599-PF；Tungming 5 200846267 學感測器被量測的基板的位置，將上述曝光桌在和光罩整 合之前移動至整合位置。因此，在進行基板預備位置決定 時’基.板不和其他構件接觸摩擦。 [專利文獻1]日本特開平06 —345279號公報 [專利文獻2]日本特開平〇6-348〇25號公報 [專利文獻3]日本特開平〇5 —326361號公報 【發明内容】 B [發明所欲解決之問題] …然而’有關在習知的搬入台和曝光台中的基板的搬運 路控中、將預備位置決定和搬運一同進行的上述技術，存 在以下所示般的問題點。 將基板的預備位置決定在曝光台進行的構成中，由於 基板的位置不在容許範圍的話無法進行下一作業，所以在 搬入台侧進行係所希望。 _ 、又，在搬入台進行基板的預備位置決定的構成中，由 於破設置為在搬運滾子下方設置的鎖從搬運滾子之間突出 的預備位置決定機構的構成，對應於基板將基板押動的銷 的設置位置的調整是費事的。 本發明係有鑑於上述問題點而提案，提供一種基板搬 運裝置，不用將基板的預備位置決定機構設置於搬入台或 曝光台，卻可在搬運至曝光台之前進行基板的預備位置決 定，且銷的設置位置調整也簡化作為課題。 ， [解決問題之技術手段] 2036-9599-PF;Tungming 6 200846267 為了解決上述誤韻 士日 I味吨，有關本發明的基板搬運裝置係為 伙被搬入至搬入台的基板的上方下降而進行預備位置決 疋且保持上述基板而搬運至曝光台的基板搬運裝置，其 構成b括.預備位置決定機構，押動被載置於上述搬入台 上的基板的端面，進行預備位置決定；以及搬運機構，將 此預備位置決疋機構藉由支持本體支持，且將完成預備位 置決定的基板吸著保持而搬運至上述曝光台；其中上述預 _ 備位置決定機構係具有被支持在上述支持本體的驅動裝 置以及藉由此驅動裝置驅動而押動上述基板的端面的押 •動裝置，上述押動裝置係，具有分別抵接在上述基板的相 互對面的-端面以及另一端面的第一抵接銷以及第二抵接 銷、以及分別支持此第一抵接銷以及第二抵接銷的第一支 持體以及第一支持體；上述驅動裝置係，具有圓筒形的磁 ㈣體、將此磁性軸體在軸周圍轉動的轉動裝置、以及與 藉由此轉動裝置轉動的磁性轴體的周面相對而設置的直線 _狀的第、縱長磁性體和第二縱長磁性體；上述第一縱長磁 性體支持上述第一 φ 4主_ L U » 支持體’上述弟二縱長磁性體支持上述 第二支持體。 基板被搬入至搬入台 藉由此構成，基板搬運裝置係 的話，搬運機構藉由具備的升降機構下降至基板侧，將驅 動裝置的磁性軸體藉由轉動裝置在一方向旋轉，將第一縱 長磁ι±體和第__縱長磁性體在直線方向移動。基板搬運裝 置係’藉由兩縱長磁性體移動，被支持在兩支持體的第一 抵接銷和第二抵㈣押動基板的端面，進行基板的預備位 7 2036-9599-PF;Tungming 200846267 置決定。基板搬運裝置係，完成了基板的預備位置決定的 話，將基板吸著保持而藉由升降機構上升，沿著搬運軌道， 從搬入台移動至曝光台，將保持的基板搬運至曝光台。 又，在上述基板搬運裝置中，上述第一支持體和上述 第二支持體的構成係包括：移動機構，將上述第一抵接銷 和上述第二抵接銷，從與上述基板的端面高度相同或比上 述基板的端面下方的高度，移動至比上述基板端面上方的 焉度。[Technical Field] The present invention relates to a substrate transfer device that performs pre-alignation on a substrate such as an electronic circuit board and transports it from the carry-in stage to the exposure stage. [Prior Art] When a substrate such as an electronic circuit board is exposed to a predetermined pattern, the substrate is transported from the loading position (loading station) to the exposure position (exposure table) by the exposure device, for example, as shown below. A handling device is used (for example, Patent Document 1). In the transport device, the upper surface of the substrate placed on the loading position is sucked and held by the absorbing holding portion, and the absorbing holding portion is moved to the exposure position along the movement path, and is kept held by the suction by the delivery. The substrate is transferred to the exposure position to carry the substrate. In addition, after the substrate is placed in the loading position, the substrate is preliminarily positioned (pre-aligned) to be transported (for example, Patent Document 2). The conveying device includes: a conveying roller that moves the substrate in the conveying direction; and a centering unit that has the end surface of the substrate on the conveying roller in the X direction and Y between the conveying rollers Direction of the pin. Further, a device for determining the position of the substrate to be transported to the exposure position has been proposed (for example, Patent Document 3). The device comprises: an exposure table for placing the substrate at an exposure position; an optical sensor for measuring a position driving mechanism of the substrate placed on the exposure table, based on the light 2036-9599-PF; Tungming 5 200846267 The position of the substrate on which the sensor is measured moves the exposure table to the integrated position before integration with the reticle. Therefore, when the substrate preparation position is determined, the base plate is not in contact with other members. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 6-348. [Problems to be Solved] However, the above-described technique for performing the determination of the preparatory position and the conveyance in the conveyance path control of the substrate in the conventional loading station and the exposure table has the following problems. When the preparatory position of the substrate is determined by the exposure stage, if the position of the substrate is not within the allowable range, the next operation cannot be performed. Therefore, it is desirable to perform the system on the loading stage. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The adjustment of the setting position of the moving pin is troublesome. The present invention has been made in view of the above problems, and it is proposed to provide a substrate transfer device which can determine a preparatory position of a substrate before being transported to an exposure table without placing the preliminary position determining mechanism of the substrate on the transfer table or the exposure table. The setting of the position adjustment is also simplified as a problem. [Technical means for solving the problem] 2036-9599-PF; Tungming 6 200846267 In order to solve the above-mentioned misunderstanding, the substrate transfer device according to the present invention is carried out by dropping the substrate onto the substrate of the loading table. a substrate transfer device that transports the substrate to the exposure table while maintaining the substrate, and includes a preparatory position determining mechanism that locks an end surface of the substrate placed on the transfer table to determine a preliminary position; The mechanism, the preparatory position determining mechanism is transported to the exposure station by supporting the main body support and absorbing and holding the substrate for determining the preparatory position; wherein the pre-positioning position determining mechanism is supported by the supporting body a driving device and a driving device for driving an end surface of the substrate by driving the driving device, wherein the pushing device has a first abutting contact with an opposite end surface and another end surface of the substrate a pin and a second abutment pin, and a first support body and a first support respectively supporting the first abutment pin and the second abutment pin The driving device has a cylindrical magnetic (four) body, a rotating device that rotates the magnetic shaft body around the shaft, and a straight line that is disposed opposite to a circumferential surface of the magnetic shaft body that is rotated by the rotating device. And the first elongated magnetic body and the second elongated magnetic body; wherein the first elongated magnetic body supports the first φ 4 main _ LU » support body, wherein the second lengthwise magnetic body supports the second support. The substrate is carried into the loading table. The substrate transporting device is configured such that the transport mechanism is lowered to the substrate side by the elevating mechanism provided, and the magnetic shaft of the driving device is rotated in one direction by the rotating device to The long magnetic body and the __long magnetic body move in a straight line direction. The substrate transfer device is configured to support the first abutting pin and the second abutting pin of the two supporting bodies by the two longitudinal magnetic bodies, and to perform the substrate preparation position 7 2036-9599-PF; Tungming 200846267 decided. In the substrate transfer device, when the preparation position of the substrate is determined, the substrate is sucked and held, and the lift mechanism is lifted up, moved from the transfer table to the exposure table along the conveyance rail, and the held substrate is transported to the exposure table. Further, in the above-described board conveying device, the first support body and the second support body include a moving mechanism that heights the first abutting pin and the second abutting pin from an end surface of the substrate The height equal to or lower than the end surface of the substrate is moved to a degree higher than the end surface of the substrate.
藉由此構成，基板搬運裝置係，將基板交付於曝光 台時，第一抵接銷和第二抵接銷的下端（前端）位於比保持 搬運機構的基板的面上方’可平順地载置基板於曝光台上。 又，在上述基板搬運裝置中，上述搬運機構係㈣成 為，具有將設置於上述支持本體下方的藉由吸著墊吸著保 持上述基板的吸著保持板、以及從此吸著保持板㈣的端 面向中央以直線狀的所定長度的缺口而形成的缺口溝；上 述第-抵接銷及上述第二抵接銷沿著上述缺口溝移動。 藉由此構成，基板搬運裝置係，不論工件的尺寸大或 小’第-抵接銷和上述第二抵接銷沿著吸著保持板的缺口 溝移動，押動基板的端面，可進行預備位置決定。 又’在上述基板搬運裝置中，上㈣_縱長磁性體和 上述第二縱長磁㈣係被構成為，將上述磁性軸體作為中 央而被配置在其一方和另一方’ #由上述磁性軸體的竣 轉’分別向相反方向直線地移動。 藉由此構成，基板搬運裝置係，藉由磁性轴體的轉動 2036-9599-PF;Tungming 8 200846267 可將上述第-縱長磁性體和上述第二縱長磁性體直線地往 復移動。 又，在上述基板搬運裝置中，上述驅動裝置係被構成 為’在上述弟一縱長磁性體和上述第二縱長磁性體，具有 $別平行地設置的從動軸；上述第—支持體係、，藉由上述 第一縱長磁性體和上述從動軸被支持而往復移動；上述第 二支持體係，藉由上述第二縱長磁性體和上述從動軸被支 _ 持而往復移動。 藉由此構成，基板搬運裝置係，可進行安定的往復移 動動作。 [發明的效果] 有關本發明的基板搬運裝置係達到以下所示的優良效 果。 基板搬運裝置係，不會使搬入台的構成複雜化，在將 基板搬運至曝光台之前，可進行預備位置決定，又，在進 瞻行預備位置決定時，由於驅動機構係藉由磁性轴體和第一 縱長磁性體、第二縱長磁性體而為非接觸，不使塵埃等的 垃圾落下至基板上。 又，基板搬運裝置係，由於預備位置決定機構的驅動 裝置為由S極和N極交互連續的磁性軸體、第一縱長磁性 體和第二縱長磁性體所構成的非接觸式構成，變更移動範 圍係容易的，即使基板大小變化，可簡單地調整第一抵接 銷和第二抵接銷的移動範圍。 基板搬運裝置係，在從支持本體的中央朝兩端侧的相 2036-9599-PF;Tungming 9 200846267 對向的位置’設置押動裝置的第一抵接銷和第二抵接銷的 話即可’預備位置決定機構的設置位置的調整成為容易。 【實施方式】 有關本發明的基板搬運裝置的實施例，參考圖示詳細 說明。 第1圖係模式化地表示設置於曝光裝置的基板搬運裝 置的側面圖，第2圖係表示基板搬運裝置的全體的立體 圖，第3圖係模式化地表示從基板搬運裝置的下方向上看 的狀態的立體圖，第4(a)圖係為省略基板搬運裝置的一部 分而表示的平面圖，第4(b)圖係為將基板搬運裝置的剖面 模式化地表示的剖面圖，第5圖係模式化地表示基板搬運 裝置的驅動裝置的構成的模式圖。 如第1圖所示般，曝光裝置A係主要包括：基板的搬 入台30 ;基板搬運裝置1，將被搬入至此搬入台別的基板 W預備地決定位置而搬運；曝光台4〇，為了載置且曝光藉 由上述基板搬運裝置〗被搬運的基板w而整合基板；曝光 光學系統50，用以朝被載置於此曝光台4〇的基板w照射 來自光源51的光，將光罩M的圖案曝光於基板f ;以及搬 出台60，用以搬出被曝光的基板界。 搬入台30係，從裝置外接收基板w、經由搬運滾子3! 移動基板w至所定的位置。此搬入台30係，如第2圖所示 般，搬運滾子31係被設置為，在軸線方向適當分割的長 度，排列在移動方向上，以使後述的預備位置決定機構2 2036-9599-PF;Tungming 10 .200846267 的作業適當地進行。 曝光台40係，將基板W從基板搬運裝置1接收保持， 進行和光罩M的整合作業，在將光罩Μ和基板W整合之後， 將基板W固定而將光罩μ的圖案曝光。此曝光台4〇係，將 基板W保持在桌面而上升，和保持光罩Μ的框架F合作而 形成真空空間，將光罩的圖案曝光在基板W。 曝光光學系統50係，由燈52和橢圓反射鏡53構成的According to this configuration, when the substrate is transported to the exposure stage, the lower end (front end) of the first abutting pin and the second abutting pin is positioned above the surface of the substrate holding the transport mechanism. The substrate is on the exposure stage. Further, in the above-described substrate transfer device, the transport mechanism (4) has a suction holding plate that sucks and holds the substrate by a suction pad provided under the support body, and an end of the suction holding plate (four). a notch groove formed in a center by a linear notch of a predetermined length; the first abutting pin and the second abutment pin are moved along the notch. According to this configuration, the substrate transfer device can be prepared by moving the end surface of the substrate by moving the end surface of the substrate while the size of the workpiece is large or small, and the first contact pin and the second contact pin move along the notch groove of the suction holding plate. Location decision. Further, in the above-described substrate transfer device, the upper (four)-longitudinal magnetic body and the second longitudinal magnetic (four) are configured such that the magnetic shaft body is disposed at one of the other and the other magnetic body as the center. The twisting of the shaft body moves linearly in the opposite direction. According to this configuration, the substrate transfer device can linearly reciprocate the first elongated magnetic body and the second elongated magnetic body by the rotation of the magnetic shaft body 2036-9599-PF; Tungming 8 200846267. Further, in the above-described substrate transfer device, the drive device is configured to have a follower shaft that is disposed in parallel with the second lengthwise magnetic body and the second lengthwise magnetic body, and the first support system The first longitudinal magnetic body and the driven shaft are supported to reciprocately move, and the second support system is reciprocated by the second elongated magnetic body and the driven shaft being supported. According to this configuration, the substrate transfer device can perform a stable reciprocating movement operation. [Effects of the Invention] The substrate transfer device of the present invention achieves the excellent effects described below. In the substrate transfer device, the configuration of the loading table is not complicated, and the preparatory position can be determined before the substrate is transported to the exposure table, and the drive mechanism is driven by the magnetic shaft body when the preparatory position is determined. It is non-contact with the first elongated magnetic body and the second elongated magnetic body, and does not allow dust such as dust to fall onto the substrate. Further, in the substrate transfer device, the drive device of the preparatory position determining means is a non-contact type constituted by a magnetic shaft body in which the S pole and the N pole are alternately continuous, the first elongated magnetic body, and the second elongated magnetic body. It is easy to change the movement range, and the movement range of the first abutment pin and the second abutment pin can be easily adjusted even if the substrate size changes. In the substrate transfer device, the first abutment pin and the second abutment pin of the urging device can be disposed at the opposite position from the center of the support body toward the both ends 2036-9599-PF; Tungming 9 200846267 It is easy to adjust the setting position of the preparatory position determining mechanism. [Embodiment] An embodiment of a substrate transfer device according to the present invention will be described in detail with reference to the drawings. 1 is a side view schematically showing a substrate transfer device provided in an exposure apparatus, and FIG. 2 is a perspective view showing the entire substrate transfer device, and FIG. 3 is a schematic view showing the upper side of the substrate transfer device. In the perspective view of the state, the fourth (a) is a plan view showing a part of the substrate transfer device, and the fourth (b) is a cross-sectional view schematically showing the cross section of the substrate transfer device. A schematic diagram showing the configuration of the drive device of the substrate transfer device. As shown in Fig. 1, the exposure apparatus A mainly includes a substrate loading table 30. The substrate transfer device 1 transports the substrate W loaded into the loading table to a predetermined position and conveys it. The exposure table 4 is loaded. And integrating the substrate by the substrate w conveyed by the substrate transfer device; and exposing the optical system 50 for illuminating the light from the light source 51 toward the substrate w placed on the exposure stage 4〇, and illuminating the mask M The pattern is exposed to the substrate f; and the unloading stage 60 is used to carry out the exposed substrate boundary. The loading table 30 is configured to receive the substrate w from outside the device and move the substrate w to a predetermined position via the transport roller 3!. In the loading table 30, as shown in Fig. 2, the transport rollers 31 are arranged such that the lengths appropriately divided in the axial direction are arranged in the moving direction so that the preparatory position determining mechanism 2, 2036-9599, which will be described later, The work of PF; Tungming 10 .200846267 is properly carried out. The exposure stage 40 is configured to receive and hold the substrate W from the substrate transfer device 1 and integrate it with the mask M. After the mask Μ and the substrate W are integrated, the substrate W is fixed and the pattern of the mask μ is exposed. This exposure stage 4 is configured to hold the substrate W on the table top and rise, and cooperate with the frame F holding the mask 而 to form a vacuum space, and expose the pattern of the reticle to the substrate W. The exposure optical system 50 is composed of a lamp 52 and an elliptical mirror 53.
光源5卜以及形成用於將來自此光源51的光照射至基板w 的光路的光學系統所構成。此曝光光學系統5〇係，在作為 平行光將光照射至基板W的情形中，將反射鏡和稜鏡複合 的平行光光學系統被使用，又，在作為散射光將光照射至 基板W的情形中，將照射的光散射的鏡子等的散射光光學 系統被使用。 ,搬出口 60係，將在曝光台40曝光完成的基板讯或異 常的基板W自|圖示的搬運裝置接收而搬出至裝置外。在 此搬出口 6 0，藉由傳送滾子6 ^將基板習搬出至裝置外。 其次，說明基板搬運裝置1。 如第1圖和第2圖所示般，基板搬運裝置i係包括· 預備位置決定機構2，進行基板W的預備位置決定；搬運 機構20 ’支持此預傷位置決定機構2,吸著預備位置決定 完成的基板W，從搬入台3〇搬運至曝光台4〇。 搬運機構20係包括：左右的移動軌道21，從搬入台 3〇橫跨至曝光台4°而被設置；支持構件17，與此移動軌 道21 21正乂且橫跨在移動軌道之間而被支持；升降機構 2036-9599-PF;Tungming 11 200846267 18被支持在此支持構丰· 又行稱仵1 7，支持本體1 2，被支持在此升 降機構1 8的下方·视|4j ^ Λ ，及者保持板1 3，吸著保持基板w設置 於此线本體12下方。又，後述的預備位置決定機構2係 被支持在支持本體12的上方（上面側）（參考第4圖）。 移動執道21係，被設置在支持本體12的左右，例如， 線ϋ v件等被使用。此移動軌道21係，儘可能使支持本體 12在直線方向往復移動，並不特別限定其構成。The light source 5 and an optical system for forming an optical path for irradiating light from the light source 51 to the substrate w are formed. This exposure optical system 5 is used in a case where light is irradiated to the substrate W as parallel light, a parallel optical system in which a mirror and a ruthenium are combined is used, and light is irradiated onto the substrate W as scattered light. In the case, a scattered light optical system such as a mirror that scatters the irradiated light is used. The 60-port is removed, and the substrate signal exposed by the exposure stage 40 or the abnormal substrate W is received from the transport device shown in Fig. and carried out to the outside of the device. At this exit 60, the substrate is moved out of the apparatus by the transfer roller 6^. Next, the substrate transfer device 1 will be described. As shown in Fig. 1 and Fig. 2, the substrate transfer device i includes a preliminary position determining mechanism 2 for determining the preparatory position of the substrate W. The transport mechanism 20' supports the pre-injury position determining mechanism 2 and sucks the preparatory position. The substrate W that has been determined to be completed is transported from the loading table 3 to the exposure table 4A. The transport mechanism 20 includes: left and right moving rails 21, which are disposed from the loading platform 3 to the exposure table by 4°; and the supporting member 17 is slid between the moving rails 21 21 and traversed between the moving rails. Support; lifting mechanism 2036-9599-PF; Tungming 11 200846267 18 is supported here to support the structure of Feng Feng · Another line of support 仵 1, 7, support body 1 2, is supported below the lifting mechanism 1 8 · view | 4j ^ Λ And holding the board 13 3, the absorbing holding substrate w is disposed under the line body 12. Further, the preparatory position determining means 2 to be described later is supported above (upper side) the support body 12 (refer to Fig. 4). The mobile lane 21 is provided on the left and right sides of the support body 12, for example, a wire member or the like is used. This moving rail 21 is such that the support body 12 reciprocates in the linear direction as much as possible, and the configuration is not particularly limited.
升降機構18係，在進行基板W的交付時，進行升降吸 著保持板13的動作（參考第3圖和第4圖）。此升降機構 18係’被連接在支持本體12的支持板心，只有可將吸著 保持板13升降即可，例如，LM導件#的滑㈣構和馬達 和傳送螺絲，或根據汽缸的驅動機構也可。又，升降機構 18係’在進行預備位置衫作f和基板？的吸著保持的作 業時，為了在不同高度進行兩作f，可為以兩階段的作動 進行動作的構成，或為了在相同高度進行兩作#，，也可 為以一階段的作動進行動作的構成。 如第2圖、第3圖和第4圖所示般，支持本體12係， 經由升降機構18被支持在被架設在左右的移動軌道21的 支持構件17。此支持本體12係，包括：矩形板狀的本體 部12a;安裝片12b、12b，從此本體部心相對的兩邊突 出至侧方而設置；以及支持& 12c，經由分別從上述安裳 片12b、12b朝上方立設的構件而被設置。在这里，支持板 12c被支持在升降機構18的下端。 此支持本體12係，在下面側支持面積比基板w 2036-*9599-PF; Tungming 12 200846267 著保持板13，且在上面侧支持後述的預備位置決定機構 2。又，在支持本體12的本體部12a，配合對應於後述的 缺口溝13b的位置，同樣地形成缺口部i2d。藉由形成此 缺口部12d ’可使本體部12a的面積變大，可使後述的預 備位置決定機構2的設置面變大。The elevating mechanism 18 is configured to elevate and suck the holding plate 13 when the substrate W is delivered (refer to Figs. 3 and 4). The lifting mechanism 18 is 'connected to the support core of the support body 12, and only the suction holding plate 13 can be lifted and lowered, for example, the sliding (four) structure of the LM guide # and the motor and the transfer screw, or the drive according to the cylinder. The agency is also available. Further, the elevating mechanism 18 is in the position of the preparatory position f and the substrate. In the operation of absorbing and holding, in order to perform two operations f at different heights, it is possible to operate in a two-stage operation, or to perform two operations at the same height, or to operate in a one-stage operation. Composition. As shown in Figs. 2, 3, and 4, the support body 12 is supported by the support member 17 that is mounted on the left and right moving rails 21 via the elevating mechanism 18. The support body 12 includes: a rectangular plate-shaped body portion 12a; mounting pieces 12b, 12b protruding from opposite sides of the body portion to the side; and support & 12c, respectively, from the above-mentioned Anshang piece 12b , 12b is set up to the upper member. Here, the support plate 12c is supported at the lower end of the elevating mechanism 18. The support body 12 is supported on the lower side by the area ratio substrate w 2036-*9599-PF; the Tungming 12 200846267 holds the holding plate 13 and supports the preparatory position determining mechanism 2 described later on the upper side. Further, the main body portion 12a of the support main body 12 is formed with a notch portion i2d in the same manner as the position corresponding to the notch groove 13b to be described later. By forming the notch portion 12d', the area of the main body portion 12a can be increased, and the installation surface of the prepared position determining mechanism 2 to be described later can be made large.
如第2圖和第3圖所示般，吸著保持板1 3係，例如， 包括：矩形板狀的吸著部本體13a ;缺口溝13b，從上述吸 著部本體13a的四邊的端部向中央以直線狀缺口的狀態形 成；以及複數個吸著墊13c，用以在吸著部本體丨3a的下 面側吸著基板W而設置。 又，缺口溝13b係，為了後述的預備位置決定機構2 的第一抵接銷3a,、3化以及第二抵接銷3bl、3bi移動而被 形成。又，吸著保持板13係，雖然未圖示，對應於基板* 的大小而適當切換吸引的區域般被構成。此吸著保持板Μ 係，只要可將基板W藉由未圖示的真空幫浦的作動而吸著 保持的話，並不限定於此構成。 如第2圖和第3圖所示般，預備位置決定機構2係， 被設置在支持本體12的上面側，進行基板w的預備位置決 定的機構。此預備位置決定機構2係，具有抵 、 的端面而押動的押動裝置3、以及使此押_ 3、： 線往復移動的驅動裝置6。 丁 如弟2圖所示般，押動裝置3係，具有在相對 口 、動4 3A、3B，由於為相同構成，因此 的押動部3A的構成作為代表說明。 、 13 2036-9599-PF；Tungming 200846267 押動部3A係，包括：第一抵接銷3ai、3ai，抵接於基 板W的端面；滑動部3a2、3a2，支持此第一抵接銷3ai、3ai ; 第一支持體3a3，支持此滑動部3a2、3a2 ;連接板3as，橫 跨第一抵接銷3ai、3ai而被配置，連接第一抵接銷3ai、3ai; 以及驅動部3a4 ’用以將此連接板3a5上下動。 又，在押動部3A，例如，將驅動部3a4以汽缸構成， 精由空氣的注入，缸的活塞（未圖示）突出至上方，藉由 連接於此活塞的連接板3as上下，沿著滑動部3a2、3a2，將 第一抵接銷3ai、3ai上下動。又，作為將第一抵接銷3ai、 3a!移動於上下方向的移動機構，在此，將滑動部3仏、3&2 作為例子說明，但其構成並不限定於此。 此押動部3 A係，被連接於後述的驅動裝置6 ,藉由在 水平方向直線地往復移動，押動基板w的端面。又，抵接 於基板w的端面的第一抵接銷3ai、3ai的前端係，在其銷 軸的軸周圍方向旋轉自如地被形成，在押動基板的端面 時’減輕施加在基板W的負荷。 如第2圖和第4圖所示般，驅動裝置6係，包括··磁 陘軸體7，以在支持本體12的中央旋轉自如地設置的圓筒 體或圓柱體形成；轉動裝置8,將此磁性軸體7作為軸心 轉動，第一縱長磁性體9A和第二縱長磁性體9β，與藉由 此轉動裝置8轉動的磁性軸體7的周面相對，舆該磁性轴 體7以非接觸狀恝被設置；第一從動軸i 〇 A和第二從動軸 1〇B，以和第一縱長磁性體9A和第二縱長磁性體卯成為平 行的方式被配置；以及導引部u，將此第一從動軸1〇A和 2〇36-9599~PF；Tungming 14 200846267 第二從動軸10B以及第一縱長磁性體9A和第二縱長磁性體 9B在磁性軸體7侧導引。又，驅動裝置6係，在第一縱+ 磁性體9A和第二縱長磁性體9B以及第一從動軸i〇a和^ 二從動軸1 0B的個別的一端側，連接押動部3A的第一支持 體3as以及押動部38的第二支持體31)3。 如第5圖所示般，驅動裝置6的磁性軸體7係包括： 相反的磁極的S極和N極在圓周上交互地配置的磁性部 7a、以及抵接於此磁性部7a的周面而設置的不銹鋼製的圓 筒蓋7b。圓筒蓋7b係，保護磁性部7a的表面，較佳為由 金屬等構成。又，第一縱長磁性體9A和第二縱長磁性體 9B係被構成為，在直線方向移動時，對面於磁性軸體7的 位置，S極和N極成連續。 此驅動裝置6係，藉由從轉動裝置8被傳達的旋轉力， 磁性軸體7轉動時，伴隨此磁性軸體7的轉動，第一縱長 磁性體9A和第二縱長磁性體⑽在相反的磁極中，暫時交 • 〖地受到S極和付極的影響。因此，第一縱長磁性體9人和 第一縱長磁性體9B係，從靜止狀態在磁極排斥的直線方向 移動。又，同時，第一從動轴1〇A和第二從動轴1〇B係在 直線方向從動而移動。因此，預備位置決定機構2係，藉 由驅動裝置6驅動押動裝置3，藉由第一抵接銷 和第二抵接銷3b!、3b押動基板W的端面，可進行基板f 的預備位置決定。 又，磁性軸體7、與第一縱長磁性體9A和第二縱長磁 性體9B的配置關係為，異物不被夾持，且以保持相互的磁 2〇36-9599-PF;Tungming 15 200846267 力影響的間隔而對峙係所希望的。又也可為，經由傳達裝 置被連結於作為轉動裝i 8的馬達等的驅動軸，藉由作為 轉動裝置8的馬達的旋轉，磁性軸體7旋轉的構成。 八人，參考第1圖和第6圖，有關曝光裝置A，主要 以將基板W從搬人台3G搬運至曝光台4G的動作，說明基 板W從被搬入到被搬出的動作。 如弟1圖和第6(a)圖所示般’基板w從裝置外被搬/As shown in Figs. 2 and 3, the absorbing holding plate 13 includes, for example, a rectangular plate-shaped absorbing portion main body 13a, and a notch groove 13b from the four end portions of the absorbing portion main body 13a. The center is formed in a state of a linear notch; and a plurality of absorbing pads 13c are provided for absorbing the substrate W on the lower surface side of the absorbing portion body 丨3a. Further, the notch groove 13b is formed to move the first abutment pin 3a, the third embodiment, and the second abutment pins 3b1, 3bi of the preliminary position determining mechanism 2 to be described later. Further, the absorbing and holding plate 13 is configured to appropriately switch the suction region in accordance with the size of the substrate*, although not shown. The absorbing holding plate is not limited to this as long as the substrate W can be sucked and held by the operation of a vacuum pump (not shown). As shown in Fig. 2 and Fig. 3, the preparatory position determining means 2 is provided on the upper surface side of the support main body 12, and the mechanism for determining the preparatory position of the substrate w is performed. The preliminary position determining mechanism 2 is a pushing device 3 that is biased with an end face that is abutted, and a driving device 6 that reciprocates the wire. As shown in Fig. 2, the urging device 3 has the same configuration, and the configuration of the urging portion 3A is the same as that of the opposite port and the movements 4 3A and 3B. 13 2036-9599-PF; Tungming 200846267 The urging portion 3A includes: a first abutting pin 3ai, 3ai, abutting against an end surface of the substrate W; and sliding portions 3a2, 3a2 supporting the first abutting pin 3ai, 3ai; the first support 3a3 supports the sliding portions 3a2, 3a2; the connecting plate 3as is disposed across the first abutting pins 3ai, 3ai, and connects the first abutting pins 3ai, 3ai; and the driving portion 3a4' The connecting plate 3a5 is moved up and down. Further, in the urging portion 3A, for example, the driving portion 3a4 is constituted by a cylinder, and the injection of air is performed, and the piston (not shown) of the cylinder protrudes upward, and is slid up and down by the connecting plate 3as connected to the piston. The portions 3a2, 3a2 move the first abutment pins 3ai, 3ai up and down. In addition, as the moving mechanism for moving the first abutting pins 3ai and 3a! in the vertical direction, the sliding portions 3A and 3&2 are described as an example, but the configuration is not limited thereto. The urging portion 3A is connected to a driving device 6 to be described later, and linearly reciprocates in the horizontal direction to erect the end surface of the substrate w. Further, the front ends of the first abutting pins 3ai and 3ai that abut against the end faces of the substrate w are rotatably formed around the axis of the pin shaft, and the load applied to the substrate W is reduced when the end surface of the substrate is pulled. . As shown in FIGS. 2 and 4, the driving device 6 includes a magnetic cylinder body 7 formed of a cylindrical body or a cylindrical body that is rotatably provided in the center of the support body 12; and a rotating device 8, The magnetic shaft body 7 is rotated as an axis, and the first elongated magnetic body 9A and the second elongated magnetic body 9β are opposed to the circumferential surface of the magnetic shaft body 7 rotated by the rotating device 8, and the magnetic shaft body is 7 is provided in a non-contact state; the first driven shaft i 〇A and the second driven shaft 1〇B are arranged in parallel with the first elongated magnetic body 9A and the second elongated magnetic body 卯And the guiding portion u, the first driven shaft 1A and 2〇36-9599~PF; the Tungming 14 200846267 second driven shaft 10B and the first elongated magnetic body 9A and the second elongated magnetic body 9B is guided on the side of the magnetic shaft body 7. Further, the driving device 6 is connected to the first longitudinal side of the first vertical + magnetic body 9A and the second elongated magnetic body 9B and the first driven shaft i〇a and the second driven shaft 10B. The first support 3as of 3A and the second support 31)3 of the urging portion 38. As shown in Fig. 5, the magnetic shaft body 7 of the drive unit 6 includes: a magnetic portion 7a in which the S pole and the N pole of the opposite magnetic pole are alternately arranged on the circumference, and a circumferential surface abutting on the magnetic portion 7a A stainless steel cylinder cover 7b is provided. The cylindrical cover 7b protects the surface of the magnetic portion 7a, and is preferably made of metal or the like. Further, the first elongated magnetic body 9A and the second elongated magnetic body 9B are configured such that when moving in the linear direction, the S pole and the N pole are continuous with respect to the position of the magnetic shaft body 7. The driving device 6 is configured such that when the magnetic shaft body 7 is rotated by the rotational force transmitted from the rotating device 8, the first elongated magnetic body 9A and the second elongated magnetic body (10) are accompanied by the rotation of the magnetic shaft body 7 In the opposite magnetic pole, the temporary intersection is 〖the ground is affected by the S pole and the pay pole. Therefore, the first elongated magnetic body 9 and the first elongated magnetic body 9B move from the stationary state in the linear direction in which the magnetic pole repels. At the same time, the first driven shaft 1A and the second driven shaft 1B are driven to move in a linear direction. Therefore, the preparatory position determining mechanism 2 drives the latching device 3 by the driving device 6, and the front end of the substrate W is pushed by the first abutting pin and the second abutting pins 3b, 3b to prepare the substrate f. Location decision. Further, the arrangement relationship between the magnetic shaft body 7 and the first elongated magnetic body 9A and the second elongated magnetic body 9B is such that the foreign matter is not clamped and the mutual magnetic force is maintained 2〇36-9599-PF; Tungming 15 200846267 The interval of force influence is desirable for the shackles. Further, the drive shaft that is connected to the motor or the like as the rotating device i via the transmission device may be configured to rotate the magnetic shaft body 7 by the rotation of the motor as the rotation device 8. In the case of the exposure apparatus A, the operation of transporting the substrate W from the transfer table 3G to the exposure stage 4G is mainly described, and the operation of the substrate W from being carried in and carried out is explained. As shown in Figure 1 and Figure 6(a), the substrate w is moved from outside the device.
至搬入台3G的話，基板¥係，籍由搬運滾子心旋轉市 被傳送至所定位置而停止。 基板W移動至搬運料31⑽定位置日夺，如第⑽ 圖所示般’基板搬運裝置i藉由升降機構18下降至下方 =第^接銷3ai、3ai和第二抵接銷仏、^的前端相 接於基板W的端面的高度的位置In the case of the loading station 3G, the substrate is transported to the predetermined position and stopped by the conveyance roller. The substrate W is moved to the position of the carrier 31 (10), and as shown in the figure (10), the substrate transfer device i is lowered to the lower side by the elevating mechanism 18 = the second pin 3ai, 3ai, and the second abutment pin 仏, The position at which the front end is in contact with the height of the end surface of the substrate W
0 ^ # 刁位置又，預備位置決定機才I 糸’猎由驅動裝置6的轉動裝置8，將磁性軸體7向一方 向旋轉(例如’右旋轉)’藉由將第-縱長磁性魏和第二 縱長磁性體9B往收納於導引部〗 # Q 〇 夺5丨邛11的方向移動，第一抵接 面ai和第二抵接銷3b!、3bi的前端押動基板w的端 面而進行預備位置決定。 又’進仃預備位置決定時的吸薯 孫、于07及者保持板13的高度位 係，被調整到接近基板w的 ^ 耨由吸者墊13c吸引而 保持的位置的話，由於可將 於n 1 W位置決定和吸著保持的 作業可通過升降機構18 一 好0木缺备 人的下降動作而完成，所以- :I然’在進行預備位置決定的情形 的吸著保持的情形’吸著保持板13的吸著塾i3c中的下c 16 2036-9599-PF;Tungming 200846267 的高度位置不同般’進行升降機構18的兩階段的下降動作 也可。 如第6U)圖所示般，基板w的預備位置決定完成的 話’藉由驅動製置6的轉動裝置8，將磁性轴體？向另一 方向旋轉(例如，左旋轉)，藉由將第一縱長磁性體Μ和第 二縱長磁性體⑽從導引部u突出的方向移動，將第一抵 接銷3ai、3ai和第二抵接銷3bl、3bi從基板$的端面離開。 與此同時，經由升降機構18，基板搬運裝置i係，使吸著 保持板13下降’使其藉由吸著墊…抵接或接近於基板冗 的狀態吸著保持該基板ψ。 …又，在基板搬運裝置丨，在藉由第一抵接銷Μ。％! 和第二抵接銷3bl、3bi進行預備位置決定的情形，由於驅 動裝置6的磁性轴體7、與第—縱長磁性體9a和第二縱長 磁性體9B為非接觸，塵埃箅的妨棋 麼；寻的垃圾不會落下到基板w侧。 基板搬運裝置1係’吸著伴拉其 汉者保符基板W後，藉由升降機 構18上升使基板ψ從搬入台川雜 σ dU離開，沿著移動軌道21移 動至曝光台40，將基板w搬運至暖本a 儆硬主曝光台40。又也可為，吸 者保持基板W後，藉由驅動驅叙邦^ 勒驅勳部3心和驅動部3b4，將連 接板3as和連接板3b5移動至卜古，你雄 t 斯主上方，使第一抵接銷3a〗、3a! 和第二抵接銷3bi、3bi的下媸办认”从 下^位於比吸者保持板1 3的吸著 墊13c的下面上方。 又’如第1圖所示般，太莫4 w 在基板w被搬運的曝光台40， 和光罩Μ的整合作業被谁；^ . a t 進仃，經由曝光光學系統50光被照 射至基板W，曝光作業被進杆 硬仃。又.，在曝光裝置A，曝光作 2 0 3 6-95 9 9-PF;Tungming 17 200846267 業完成的基板w係，藉由未圖示的搬運裝置，從曝光台4〇 被搬運至搬出台60而被搬出至裝置外。 以上如說明般，基板搬運裝置“系，從基板#的上方 進行預備位置決定，吸著保持預備位置決定完成的基板卜 從搬入台30搬運至曝光台4〇。 、又基板搬運裝置1係，藉由沿著基板w的搬運方向（假 設為X方向）’押動部3A、3B係直線地往復移動，進行基 板W的預備位置決定為例子而說明，但也可為，藉由在與 基板W的搬運方向正交的方向（假設為γ方向），將押動部 3j、3B直線地往復移動轉動，進行基板^預備位置決 疋的構成。 又’基板搬運裝置1係’從X方向和γ方向的兩方押 動基板w的端面而進行漏位置決定的構成也可。在從$ 方向和γ方向押動基板w的端面方面’例如，使磁性轴體 在轴線方向增長’可藉由將X方向的驅動裝置6和γ方 向的驅動裝置6配置在不同高度。當然，在X方向和Y方 向分別設置磁性軸體7的構成也可。 又，基板搬運裝置！係，改變處理的基板w的種類時， ^有基板w的大小變化的情形，此時作為驅動裝置6的調 :由改變第一縱長磁性體94和第二縱長磁性體卯的 矛夕動始點終點的位址，可容易地對應。 【圖式簡單說明】 弟1圖係從侧面模式化祕本_ 式化地表不利用有關本發明的基板 2036~9599-PF;Tungrtiing 18 200846267 搬運裝置的曝光裝置的全體的模式圖； 第2圖係模式化地表示有關本發明的基板搬運裝置的 全體的立體圖.； 第3圖係模式化地表示從下方向上看有關本發明的基 板搬運裝置的狀態的立體圖； 苐4(a)圖係為省略有關本發明的基板搬運裝置的一部 分而表示的平面圖，第4(b)圖係為將有關本發明的基板搬 運裝置作為剖面而模式化地表示的剖面圖； 第5圖係模式化地表示有關本發明的基板搬運裝置的 驅動裝置的構成的模式圖；以及 第6(a)〜（d)圖係分別模式化地表示有關本發明的基板 搬運裝置的動作狀態的側面圖。 【主要元件符號說明】 1〜基板搬運裝置； 3 ai〜第一抵接銷； 3〜押動機構； 3a4(3b4)〜驅動部； 3A〜押動部； 6〜驅動裝置； 7a〜磁性部； 8〜轉動裝置； 9 B〜第二縱長磁性體； 10B〜第二從動軸；0 ^ # 刁 position again, the preparatory position determines the machine I 糸 'hunting by the rotating device 8 of the driving device 6, the magnetic shaft 7 is rotated in one direction (for example, 'right rotation'' by the first longitudinal magnetic And the second elongated magnetic body 9B moves in the direction of the guide portion # # Q 〇 5丨邛11, and the front end of the first abutting surface ai and the second abutting pins 3b!, 3bi erects the substrate w The front end is determined by the end face. In addition, when the height of the sucking potato, the 07 and the holding plate 13 are adjusted to the position close to the substrate w and held by the sucker pad 13c, it is possible to The n 1 W position determination and the smear holding operation can be completed by the lifting action of the lifting mechanism 18, and the - -I is 'sucking and holding in the case where the preparatory position is determined'. The lower c 16 2036-9599-PF in the suction 塾i3c of the holding plate 13; the height position of Tungming 200846267 may be different as follows: the two-stage lowering operation of the lifting mechanism 18 may be performed. As shown in Fig. 6U), if the preliminary position of the substrate w is determined to be completed, the magnetic shaft body is driven by the rotating device 8 of the drive unit 6. Rotating in the other direction (for example, left rotation), by moving the first elongated magnetic body Μ and the second elongated magnetic body (10) from the direction in which the guiding portion u protrudes, the first abutting pins 3ai, 3ai and The second abutment pins 3b1, 3bi are separated from the end faces of the substrate $. At the same time, the substrate transfer device i is caused to lower the suction holding plate 13 via the elevating mechanism 18, so that the substrate ψ is sucked and held by the absorbing pad ... in contact with or close to the substrate. ...in addition, in the substrate transfer device, the first abutment pin is used. In the case where the second abutting pins 3b1 and 3bi are determined in the preliminary position, the magnetic shaft body 7 of the driving device 6 is in non-contact with the first longitudinal magnetic body 9a and the second elongated magnetic body 9B, and the dust 箅What is the chess? The garbage that is found will not fall to the side of the substrate w. The substrate transfer device 1 is configured to 'suck the substrate W with the susceptor, and the substrate ψ is moved away from the loading table σ dU by the lifting mechanism 18, and moves to the exposure table 40 along the moving rail 21 to move the substrate. w transport to warm a 儆 hard main exposure table 40. Alternatively, after the sucker holds the substrate W, the connecting plate 3as and the connecting plate 3b5 are moved to the Bugu by driving the drive and the drive unit 3b4, and the upper part of the main body is The lower abutting pins 3a, 3a, and the lower abutting pins 3bi, 3bi are positioned above the lower surface of the suction pad 13c of the sucker holding plate 13 from the lower side. As shown in Fig. 1, the exposure table 40 in which the substrate w is transported on the substrate w, and the integration work of the mask enamel are carried out; at the entrance, the light is irradiated to the substrate W via the exposure optical system 50, and the exposure operation is performed. The rod is hardened. In addition, in the exposure apparatus A, the exposure is made to 2 0 3 6-95 9 9-PF; Tungming 17 200846267, the substrate w system completed by the transport apparatus (not shown), from the exposure stage 4 It is carried to the unloading table 60 and is carried out to the outside of the apparatus. As described above, the substrate transfer device "determines the preparatory position from the upper side of the substrate #, and the substrate that has been determined to be completed by the suction holding preliminary position is transported from the loading table 30 to The exposure stage is 4 inches. In addition, the substrate transfer device 1 is described by taking the position of the substrate W in a straight line by reciprocating the urging portions 3A and 3B along the transport direction (assuming the X direction) of the substrate w. The urging portions 3j and 3B are linearly reciprocated and rotated in a direction orthogonal to the conveyance direction of the substrate W (assuming a γ direction), and the substrate preparation position is determined. Further, the substrate transporting apparatus 1 may be configured such that the end faces of the substrate w are pressed from both the X direction and the γ direction to determine the leak position. In terms of omitting the end face of the substrate w from the direction of the direction γ and the γ direction, for example, the magnetic axis body is grown in the axial direction can be disposed at different heights by driving the driving device 6 in the X direction and the driving device 6 in the γ direction. Of course, the configuration of the magnetic shaft body 7 may be provided in the X direction and the Y direction, respectively. Also, the substrate transfer device! When the type of the processed substrate w is changed, the size of the substrate w is changed. At this time, the adjustment of the driving device 6 is performed by changing the first elongated magnetic body 94 and the second elongated magnetic body. The address at the end of the starting point can be easily matched. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of the entire surface of the exposure apparatus of the present invention; FIG. 2 is a schematic diagram of the entire surface of the exposure apparatus of the present invention; FIG. 2 is a schematic view of the substrate 2036 to 9599-PF according to the present invention; A perspective view of the entire substrate transfer device according to the present invention is schematically illustrated. Fig. 3 is a perspective view schematically showing a state of the substrate transfer device of the present invention as seen from the bottom; 苐 4(a) is A plan view showing a part of the substrate transfer device of the present invention is omitted, and a fourth (b) is a cross-sectional view schematically showing the substrate transfer device according to the present invention as a cross section. Fig. 5 is a schematic view showing A schematic view of a configuration of a driving device of a substrate transfer device according to the present invention; and sixth (a) to (d) drawings schematically show side views of an operation state of the substrate transfer device according to the present invention. [Description of main component symbols] 1~substrate transfer device; 3 ai~first abutment pin; 3~push mechanism; 3a4(3b4)~drive unit; 3A~push part; 6~drive device; 7a~magnetic part ; 8 ~ rotating device; 9 B ~ second longitudinal magnetic body; 10B ~ second driven shaft;
2〜預備位置決定機構； 3b!〜第二抵接銷； 3a2(3b2)〜滑動部（移動機構）； 3aK3b5)〜連接板（移動機構）； 3B〜押動部； 7〜磁性軸體； 7b〜圓筒蓋； 9A〜第一縱長磁性體； 10A〜第一從動軸； 11〜導引部； 2036-9599-PF;Tungming 19 200846267 12〜支持本體； 12a〜本體部； 12b〜安裝片； 12c〜支持板； 12d〜缺口部； 13〜吸著保持板 13a〜吸著部本體； 13b〜缺口溝； 13c〜吸著墊； 17〜支持構件； 18〜升降機構； 20〜搬運機構； 21〜移動軌道； 3 0〜搬入台； 31〜搬運滾子； 40〜曝光台； 5 0〜曝光光學系統； 51〜光源； 52〜燈； 53〜橢圓反射鏡； 60〜搬出台； 61〜滾子； A〜曝光裝置； Μ〜光罩； W〜基板； 3as(3b3)〜第一支持骨 i (第二支持體）。2~preparation position determining mechanism; 3b!~second abutment pin; 3a2(3b2)~sliding part (moving mechanism); 3aK3b5)~connecting plate (moving mechanism); 3B~ urging part; 7~magnetic shaft body; 7b~cylindrical cover; 9A~first longitudinal magnetic body; 10A~first driven shaft; 11~ guiding portion; 2036-9599-PF; Tungming 19 200846267 12~ support body; 12a~ body part; 12b~ Mounting piece; 12c~ support plate; 12d~ notch; 13~ sorption holding plate 13a~ absorbing part body; 13b~ notch groove; 13c~ sorption pad; 17~ support member; 18~ lifting mechanism; Mechanism; 21~ moving track; 3 0~ moving into the table; 31~ carrying roller; 40~ exposure table; 5 0~ exposure optical system; 51~ light source; 52~ lamp; 53~ elliptical mirror; 60~ moving out; 61 ~ roller; A ~ exposure device; Μ ~ reticle; W ~ substrate; 3as (3b3) ~ first support bone i (second support).
2036-9599-PF;Tungming 202036-9599-PF; Tungming 20