200843606 九、發明說明 【發明所屬之技術領域】 本發明是關於使用於電路基板的接著薄膜，覆蓋層薄 膜。 【先前技術】 可撓性電路基板，是在銅箔設於可撓性絕緣基底材的 0 表面的貼銅積層板形成電路配線圖案，而在該電路配線圖 案上，形成具有開口於形成用以連接電路零件或外部基板 等的電子零件或電路之端子的部位的表面保護層，藉由金 屬模等施以沖孔等經外形加工所製造。又，使用接著薄膜 進行積層各電路基板而來製造多層電路基板。 在此，上述表面保護層，是在一方的一面具有接著劑 層的可撓性絕緣薄膜，被稱爲覆蓋層薄膜。將此藉由金屬 模等以沖孔加工形成開口，而將該覆蓋層薄膜接著於電路 # 配線圖案上以形成表面保護層。 在製造多層電路基板中，使用真空壓機等方法而在多 ， 層電路基板黏貼接著薄膜，覆蓋層薄膜。在多層電路基板 表面安裝有1C晶片，惟藉由對晶片的大化或BGA型的變 更，在接著薄膜，覆蓋層薄膜的接著劑層，被要求電路塡 入性或壓機後的表面平滑性。 在多層電路基板內層使用著覆蓋層薄膜，惟在壓機後 若在覆蓋層薄膜表面有凹凸，則也會影響到多層電路基板 表面之故，因而在覆蓋層薄膜中，表面平滑性也很重要。 -5· 200843606 隨著電路配線圖案的微細化，成爲很難把接著劑層充 分塡入配線間。又，即使塡入也會在接著劑層的表面留下 些許凹凸段差，而重複積層時，則成爲位置精度的惡化， 基板翹曲，各層的參差不齊等的原因。欲將該凹凸段差作 成平坦化，則硏磨等工程成爲需要，而在製造方法也發生 限制。 以此種製程所製造的多層電路基板，是爲了得到該表 面平滑性，在接著薄膜，覆蓋層薄膜的接著劑層，使用流 出性大的接著劑較佳。 但是，若使用流出性大的接著劑，則多層電路基板的 表面平滑性是被改善，惟接著薄膜，覆蓋層薄膜的接著劑 流出到配線圖案端子部的開口部分，成爲後續處理的焊接 或電鍍等的作業變困難，或成爲不可能等的問題。 相反地，若使用流出性小的接著劑，則接著薄膜，覆 蓋層薄膜的接著劑不會流出到配線圖案端子部等的開口部 分，惟不但無法得到多層電路基板的表面平滑性，還有無 法充分地進入配線與配線之間，而部分地產生空隙等，有 無法得到所定的接著強度等的問題。 壓機後的表面平滑性優異，且擬儘量抑制接著材料流 出到配線圖案端子部等的開口部分，例如提案作爲接著薄 膜’覆蓋層薄膜的接著劑層積層2層以上流出性不相同的 接著劑層（例如，參照專利文獻1 )。 又，提案在多層電路基板中，作爲層間接著劑層至少 積層2層以上流出性不相同的接著劑層，而將上述接著劑 -6- 200843606 層的流出性小的接著劑層設在配線圖案上的手法（例如， 參照專利文獻2)。詳細地，在記載於專利文獻2的發明 中，在藉由接著劑層接著具有電路圖案所形成的一面的層 與其他層所積層的多層電路基板，將流出性小的接著劑熱 * 疊合上述電路圖案所形成的一面以形成具有第1接著劑層 ^ 的疊合體，而將流出性大的接著劑熱疊合於接觸在上述其 他層的一面以形成具有第2接著劑層的疊合體，然後，又 φ 藉由熱疊合來黏貼此些疊合體作爲層間接著劑層，而得到 多層電路基板者。 專利文獻1 :日本特開2003-1 98 1 07號公報 專利文獻2:日本特開2006-073934號公報（段落 0016〜002 1，第 2 圖） 【發明內容】 然而，在上述專利文獻1所述的手法，若將流出性相 φ 對地大的接著劑層設於配線圖案，則有無法得到多層電路 基板的充分表面平滑性的問題。 又，在上述專利文獻2所述的手法，形成第2接著劑 層時的壓機（熱疊合）後的表面平滑性，且可得到儘量抑 制形成第1接著劑層時接著材料流出到配線圖案端子部等 的開口部分，惟因必須將設於圖案上的第1接著劑層作成 圖案厚度以上，因此有無法使接著劑層（層間接著劑層） 儘量作成薄的問題。 如此地，本發明的目的，是在於提供表面平滑性優異 200843606 ’且可儘量抑制接著材料流出到配線圖案端子部等的開口 部分’具有更薄接著劑層的電路基板用接著薄膜，覆蓋層 及使用它的電路基板。 爲了達成該目的，對於表面平滑性優異，且可儘量抑 制接著材料流出到配線圖案端子部等的開口部分，更薄接 著劑層的要求而專心檢討之結果，發明了在多層電路基板 中’具有2層以上接著層，且將流出性小的一面設置於配 g 線圖案的接著薄膜，覆蓋層薄膜。 亦即，本發明是一種接著薄膜，其特徵爲：藉由傾斜 配置至少積層2層以上流出性不相同的接著劑層所構成。 又，本發明是一種覆蓋層薄膜，屬於在薄膜基材的單 面’設置至少積層2層以上流出性不相同的接著劑層所成 的接著薄膜層所構成者，其特徵爲：上述接著薄膜層的流 出性爲從上述薄膜基材側一直到外側（上述接著薄膜層表 面側）變小般地（朝接著薄膜的厚度方向）傾斜配置所構 φ 成。 依照本發明，可提供作爲接著薄膜，覆蓋層薄膜的接 著劑層至少積層2層以上流出性不相同的接著劑層，而將 上述接著劑層的流出性小的一面設置在配線圖案上，壓機 後的表面平滑性優異，且可儘量抑制接著材料流出到配線 圖案端子部等的開口部分的接著薄膜，覆蓋層薄膜。 又，在本發明中，成爲可提供藉由作成流出.性從薄膜 基材側一直到外側（薄膜表面）變小般地朝薄膜的厚度方 向傾斜配置所成的接著劑層，即使流出性小的接著劑層爲 -8 - 200843606 圖案厚度以下，壓機後的表面平滑性也優異，且儘量抑制 接著材料流出到配線圖案端子部等的開口部分，具有更薄 ί安者劑層（積層2層以上的接著劑層）的電路基板用接著 薄膜’覆蓋層薄膜及使用它的電路基板。 【實施方式】 本:發明的電路基板用接著薄膜，其特徵爲：藉由傾斜 配置至少積層2層以上流出性不相同的接著劑層所構成。 又’本發明的電路基板用覆蓋層薄膜，屬於在薄膜基 材的單面，設置至少積層2層以上上述流出性不相同的接 著劑層所成的本發明的電路基板用接著薄膜層所構成者， 其特徵爲：上述接著薄膜層的流出性爲從上述薄膜基材側 一直到外側變小般地傾斜配置所構成。 又’本發明的多層電路基板，其特徵爲：至少積層2 層以上上述的流出性不相同的接著劑層所成，流出性小者 配置成位於電路圖案側。 又’本發明的可撓性電路基板，其特徵爲：使用上述 電路基板用覆蓋層薄膜所構成。 在此，使用於本發明的電路基板用接著薄膜，電路基 板用覆蓋層薄膜，多層電路基板及可撓性電路基板所成的 流出性不相同的接著劑層，是藉由傾斜配置分別積層流出 性不相同的複數接著劑層可得到。 以下，針對於本發明的各實施形態，使用圖式加以說 明。第1圖是模式地表示本發明的電路基板用接著薄膜的 -9- 200843606 斷面槪略圖。第2圖是模式地表示本發明的電路基板用覆 蓋層薄膜’及形成有適用該電路基板用覆蓋層薄膜的對方 側的電路圖案的多層電路基板的構成的斷面槪略圖。 如第1圖及第2圖所示地，在流出性不相同的複數層 所成的接著劑層1 〇 4的構成，流出性大的接著劑層1 〇 2的 厚度是25μιη以下，較佳爲15〜2 5μπι。流出性大的接著劑 層102的厚度爲超過2 5 μιη時，則很難控制流出性。一方 面’有關於流出性大的接著劑層1 02的厚度下限値，並未 特別加以限制，惟未依存於電路圖案，以得到電路基板的 表面平滑性作爲目的之故，因而作爲15μπι以上較佳。 又’流出性小的接著劑層1 03，是與流出性大的接著 劑層1 02合倂考慮圖案塡入性，若有導體[在第2圖中， 導通（或電路）圖案201 )的厚度以上就可以，而依導通 (或電路）圖案20 1厚度適當地採用就可以。例如有關於 以銅箔（厚度3 5 μηι ; 1盎司）所形成的導通（或電路） 圖案20 1，合倂流出性小的接著劑層1 03與流出性大的接 著劑層1 02的接著劑層1 04的全體厚度爲3 5 μπι以上，而 在該銅箔形成鍍銅厚度15μιη，則成爲50μηι以上。藉由此 ，可提供即使流出性小的接著劑層1 爲圖案20 1厚度以 下，壓機後的表面平滑性優異，且儘量抑制接著材料流出 到配線圖案端子部等的開口部分，具有更薄的接著劑層（ 積層2層以上的接著劑層1 〇4 )的電路基板用接著薄膜 1 05，覆蓋層薄膜1 〇〇是使用它的多層電路基板或可撓性 電路基板30〇。接著劑層104的厚度，是如上述地具導通 -10-BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover film used for a circuit board, and a cover film. [Prior Art] A flexible circuit board is formed by forming a circuit wiring pattern on a copper clad laminate having a copper foil provided on a surface of a flexible insulating base material, and forming an opening for forming on the circuit wiring pattern. A surface protective layer that connects a portion of a terminal of an electronic component or a circuit such as a circuit component or an external substrate is formed by punching or the like by a metal mold or the like. Further, a multilayer circuit substrate is produced by laminating each circuit board with a film. Here, the surface protective layer is a flexible insulating film having an adhesive layer on one surface, and is called a cover film. This is formed by punching a metal mold or the like to form an opening, and the cover film is then formed on the circuit # wiring pattern to form a surface protective layer. In the production of a multilayer circuit substrate, a film is applied to a plurality of layers of a circuit board by using a vacuum press or the like to cover the film. The 1C wafer is mounted on the surface of the multilayer circuit board, but by the enlargement of the wafer or the modification of the BGA type, the surface smoothness of the adhesive layer after the film is required to be adhered to the adhesive layer of the cover film. . A cover film is used in the inner layer of the multilayer circuit substrate. However, if there are irregularities on the surface of the cover film after the press, the surface of the multilayer circuit substrate is also affected, so that the surface smoothness is also high in the cover film. important. -5· 200843606 With the miniaturization of the circuit wiring pattern, it is difficult to sufficiently insert the adhesive layer into the wiring closet. Further, even if the intrusion leaves a slight unevenness on the surface of the adhesive layer, when the lamination is repeated, the positional accuracy is deteriorated, the substrate is warped, and the layers are uneven. In order to flatten the unevenness step, engineering such as honing is required, and the manufacturing method is also limited. In order to obtain the smoothness of the surface of the multilayer circuit board manufactured by such a process, it is preferable to use an adhesive having a large flowability in the adhesive layer of the film and the cover film. However, when an adhesive having a large effluent property is used, the surface smoothness of the multilayer circuit substrate is improved, but the film, the adhesive of the cover film, flows out to the opening portion of the wiring pattern terminal portion, and becomes a solder or plating for subsequent processing. The work of the other becomes difficult, or becomes impossible. On the other hand, when an adhesive having a small outflow property is used, the adhesive of the cover film does not flow out to the opening portion of the wiring pattern terminal portion or the like, but the surface smoothness of the multilayer circuit substrate cannot be obtained. When the wiring and the wiring are sufficiently inserted, a void or the like is partially generated, and there is a problem that a predetermined adhesive strength or the like cannot be obtained. The surface smoothness after the press is excellent, and it is intended to suppress the flow of the adhesive material to the opening portion of the wiring pattern terminal portion or the like as much as possible. For example, it is proposed as an adhesive for the adhesive layer of the film "covering film". Layer (for example, refer to Patent Document 1). Further, in the multilayer circuit board, at least two or more adhesive layers having different flowability are laminated as an interlayer adhesive layer, and an adhesive layer having a small outflow property of the above-mentioned adhesive agent-6-200843606 is provided in the wiring pattern. The above method (for example, refer to Patent Document 2). In the invention described in Patent Document 2, the multilayer circuit substrate in which the layer formed on one surface of the circuit layer and the other layer are laminated by the adhesive layer is thermally bonded to the adhesive having a small outflow property. One surface of the circuit pattern is formed to form a laminate having a first adhesive layer, and an adhesive having a large flowability is thermally laminated on one surface of the other layer to form a laminate having a second adhesive layer. Then, φ is adhered to the laminate as an interlayer adhesive layer by thermal lamination to obtain a multilayer circuit substrate. [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A-2006-073934 (paragraph 0016 to 002 1, 2). In the method described above, if the adhesive layer having a large effluent phase φ to the ground is provided on the wiring pattern, there is a problem that sufficient surface smoothness of the multilayer circuit substrate cannot be obtained. Moreover, in the method described in the above Patent Document 2, the surface smoothness after the press (thermal lamination) in forming the second adhesive layer is obtained, and it is possible to prevent the material from flowing out to the wiring when the first adhesive layer is formed as much as possible. In the opening portion of the pattern terminal portion or the like, since the first adhesive layer provided on the pattern must be formed to have a pattern thickness or more, there is a problem in that the adhesive layer (interlayer adhesive layer) cannot be made as thin as possible. In view of the above, it is an object of the present invention to provide an adhesive film for a circuit board having a thinner adhesive layer, which is excellent in surface smoothness, and has a thinner adhesive layer as long as it can prevent the material from flowing out to the opening portion of the wiring pattern terminal portion. Use its circuit substrate. In order to achieve the object, it is possible to reduce the surface smoothness and to prevent the material from flowing out to the opening portion of the wiring pattern terminal portion and the like as much as possible, and to examine the result of the thinner adhesive layer. Two or more layers are laminated, and a side having a small outflow property is provided on the adhesive film having the g-line pattern to cover the layer film. That is, the present invention is a film which is formed by laminating at least two or more layers of an adhesive layer having a different flowability. Further, the present invention is a cover layer film which is composed of an adhesive film layer formed by providing at least two layers of an adhesive layer having a different flowability on one side of a film substrate, and is characterized in that the above-mentioned film is formed. The effluent of the layer is formed so as to be inclined from the side of the film substrate to the outside (the surface side of the film layer as described above) so as to be inclined (in the thickness direction of the film). According to the present invention, it is possible to provide at least two or more layers of an adhesive layer having a different flowability as an adhesive layer of a cover film, and to provide a layer having a small flowability of the adhesive layer on a wiring pattern. The surface smoothness after the machine is excellent, and the film which covers the opening portion of the wiring pattern terminal portion or the like can be suppressed as much as possible, and the film can be covered. Further, in the present invention, it is possible to provide an adhesive layer which is formed by arranging the flow-out property from the film substrate side to the outside (film surface) in a thickness direction of the film, and has a small outflow property. The adhesive layer is -8 - 200843606 below the pattern thickness, and the surface smoothness after the press is also excellent, and the opening material is prevented from flowing out to the opening portion of the wiring pattern terminal portion or the like, and has a thinner layer (layer 2 The circuit board of the adhesive layer of the layer or more is covered with a film of the adhesive film and a circuit board using the same. [Embodiment] The present invention relates to a film for a circuit board according to the invention, which is characterized in that at least two or more layers of an adhesive layer having a different flowability are laminated in an inclined manner. In addition, the cover film for a circuit board of the present invention is composed of an adhesive film layer for a circuit board of the present invention which is formed by providing at least two layers of the above-described adhesive layer having a different flowability on one surface of the film substrate. It is characterized in that the flowability of the adhesive film layer is formed so as to be inclined from the side of the film substrate to the outside. Further, the multilayer circuit board of the present invention is characterized in that at least two or more layers of the above-described adhesive layers having different outflow properties are formed, and those having a small outflow property are disposed on the side of the circuit pattern. Further, the flexible circuit board of the present invention is characterized by using the above-mentioned cover film for a circuit board. Here, the adhesive layer used for the circuit board for a circuit board of the present invention, the cover film for a circuit board, the multilayer circuit board, and the flexible circuit board, which are different in flowability, are stacked in an inclined manner. A plurality of different adhesive layers are available. Hereinafter, each embodiment of the present invention will be described using the drawings. Fig. 1 is a schematic cross-sectional view showing the -9-200843606 of the adhesive film for a circuit board of the present invention. Fig. 2 is a schematic cross-sectional view showing a configuration of a multilayer circuit substrate in which a cover film film for a circuit board of the present invention and a circuit pattern on the other side of the cover film for a circuit board are formed. As shown in Fig. 1 and Fig. 2, the thickness of the adhesive layer 1 〇 2 formed of a plurality of layers having different effluent properties is preferably 25 μm or less. For 15~2 5μπι. When the thickness of the adhesive layer 102 having a large effluent is more than 25 μm, it is difficult to control the outflow property. On the one hand, there is no particular limitation on the lower limit of the thickness of the adhesive layer 102 having a large effluent property, but it is not dependent on the circuit pattern to obtain the surface smoothness of the circuit substrate, and thus it is preferable to be 15 μm or more. good. Further, the adhesive layer 203 having a small outflow property is combined with the adhesive layer 102 having a large effluent property, and the pattern intrusion property is considered, and if there is a conductor [in the second figure, the conductive (or circuit) pattern 201) The thickness may be more than the thickness, and the thickness of the conductive (or circuit) pattern 20 1 may be appropriately employed. For example, there is a conductive (or circuit) pattern 20 formed of a copper foil (thickness 3 5 μηι; 1 ounce), followed by a bonding layer 103 having a small outflow property and an adhesive layer 102 having a large flowability. The total thickness of the agent layer 104 is 35 μm or more, and when the copper foil is formed to have a copper plating thickness of 15 μm, it is 50 μm or more. By this means, even if the adhesive layer 1 having a small outflow property is equal to or less than the thickness of the pattern 20 1 , the surface smoothness after the press is excellent, and the opening portion of the wiring material terminal portion or the like is suppressed as much as possible, and the thinner portion is provided. The adhesive layer of the adhesive layer (the adhesive layer of the two or more layers is 〇4) is used for the circuit board 205, and the cover film 1 is a multilayer circuit board or a flexible circuit board 30. The thickness of the layer 104 is then turned on as described above. -10-
200843606 (或電路）圖案20 1的厚度以上就可以，惟較佳爲 導通（或電路）圖案201的厚度+2〜2 0 μπι的範圍較 在導通（或電路）圖案201的厚度不足+2μπι時，貝[J 路周邊的空氣殘留的顧慮。一方面，在導通（或電路 案201的厚度超過+20 μιη時，本發明的作用效果（目 之一的使用具有更薄的接著劑層104的電路基板用接 膜，覆蓋層薄膜及使用它的電路基板的提供有成爲困 慮。 本發明的流出性的不相同（複數層所構成）接 1 04，是如第1、2圖所示地，藉由傾斜配置可分別 出性不相同的兩個接著劑層1 02、1 03，甚至於其以 數接著劑層。以下，對於成爲第二層以後的接著劑 (第3層以後是未圖示）的流出性，作成比成爲第 接著劑層1 02的具體性方法說明如下。 電路基板用接著薄膜1 05，是首先使用被脫模 紙或聚乙烯對苯二甲酸酯（以下，也稱爲PET )薄 的脫模劑等，而在該單面塗佈熱硬化型的接著劑， 而設置第一層接著劑層1 〇 2。 之後，作爲成爲第二層的接著劑層.1 03，在其他 劑’仍同樣地塗佈熱硬化型的接著劑，並經乾燥，威 第二層的接著劑層i 03，是使用例如以比第一層的g 層1 02的乾燥條件還高溫或長時間進行乾燥的方法， 與第一層的接著劑層1 〇2相同條件進行乾燥之後，再 施以加熱處理的方法，變更接著劑組成中的樹脂、_ 作成 佳。 有電 )圖 的） 著薄 難之 劑層 到流 的複 103 層的 理的 基材 乾燥 脫模 爲該 著劑 或以 追加 機塡 -11 - 200843606 充材、硬化劑的比率的方法中任一以上，作成比第一層還 小的流出性的接著劑層1 03。在第一層的接著劑層1 02上 ，藉由使用疊合機等進行積層成爲第二層的接著劑層103 的傾斜配置，可得到具有流出性不相同的複數層所成的接 著劑層104的電路基板用接著薄膜105 (在第1圖中，未 圖示被脫模處理的紙或薄膜基材的脫模劑等）。 如以下所示地，爲了得到適當的接著薄膜流出量（單 位g/1 〇分鐘），例如變更如實施例所示的乾燥條件，作 爲調整接著劑層1 02、1 03的流出性的乾燥條件，因接著 劑的種類等有所不同而很難同樣地規定，惟可說期盼如下 的條件。 亦即，欲形成第一層的大流出性的接著劑層時，則在 脫模劑或薄膜基材上塗佈熱硬化型接著劑之後，使用熱風 乾燥機等，在70〜130°C，較佳爲90〜110°C，進行2〜7分 鐘，較佳爲3〜6分鐘的乾燥就可以。不足70 °C時，則無法 充分乾燥接著劑，若超過1 3 0 °C時’則有低於所期望的流 出性的下限之虞。不足兩分鐘時’也有無法充分地乾燥接 著劑，而在超過7分鐘時’則有低於所期望的流出性的下 限之虞。 欲形成第二層的小流出性的接者劑層時’則在脫模劑 或薄膜基材上塗佈熱硬化型接著劑之後’使用熱風乾燥機 等’在70〜130。(：，較佳爲90〜110°C，進行2〜7分鐘’較 佳爲3〜6分鐘的乾燥。不足70°C.時’則無法充分乾燥接著 劑，若超過1 3 0。(：時，則有低於所期望的流出性的下限之 -12- 200843606 虞。不足兩分鐘時，也有無法充分地乾燥接著劑，而在超 過7分鐘時，則有低於所期望的流出性的下限之虞。上述 乾燥條件與形成第一層的大流出性的接著劑層之際的乾燥 條件相同，或是在低溫或短時間，則再追加在70〜130°C， 較佳爲90〜110C，進行2〜15分鐘，較佳爲3〜12分鐘的 加熱處理，調整成使得形成第二層的小流出性的接著劑層 之際的整體乾燥條件，比形成第一層的大流出性的接著劑 層之際的乾燥條件還高溫或更久時間就可以。不足70 °C時 ，則無法充分乾燥接著劑，若超過1 30°C時，則有低於所 期望的流出性的下限之虞。不足兩分鐘時，也有無法充分 地乾燥接著劑，而在超過1 5分鐘時，則有低於所期望的 流出性的下限之虞。但是，在本發明中，並不被限制在此 些乾燥條件者，而藉由熱硬化型接著劑的種類等，即使偏 離該範圍，也有可滿足以下的適當接著薄膜流出量的情形 。爲了此，可說事先進行預備實驗等以求出滿足下述的適 當接著薄膜流出量的條件較佳。又，即使利用乾燥條件以 外的其他手法來調整接著劑層1 02、1 03的流出性的情形 ，也可說事先進行預備實驗等以求出滿足下述的適當接著 薄膜流出量的條件較佳。 以溫度170°C，壓力9.8MPa，時間1分鐘加熱壓接所 得到的電路基板用接著薄膜1 05，而將來自經甲基乙基酮 (以下，稱爲MEK)脫脂的直徑φ 1.0mm，長度1.0mm， 材質不鏽鋼的模的接著薄膜流出量（單位g/l〇分鐘）算 出作爲流出性的指標，則第一層的接著劑層1 02的流出性 -13-The thickness of the 200843606 (or circuit) pattern 20 1 may be greater than the thickness of the conductive (or circuit) pattern 201 + 2 to 2 0 μπι when the thickness of the conductive (or circuit) pattern 201 is less than +2 μπι. , Bay [J road around the air residual concerns. On the one hand, in the case of conducting (or the thickness of the circuit 201 exceeds +20 μm, the effect of the present invention (the use of a film for a circuit substrate having a thinner adhesive layer 104, a cover film and using it) The provision of the circuit board is disadvantageous. The flowability of the present invention is different (composed of a plurality of layers) connected to 104, as shown in Figs. 1 and 2, and the tilting arrangement can be different. The two adhesive layers 102 and 103 have even a plurality of adhesive layers. Hereinafter, the flow ratio of the adhesive agent after the second layer (not shown in the third layer) is the next step. The specific method of the agent layer 012 is as follows. The adhesive film for the circuit board 205 is a mold release agent which is first made of release paper or polyethylene terephthalate (hereinafter also referred to as PET). On the other hand, a thermosetting adhesive is applied to one side, and a first adhesive layer 1 〇2 is provided. Thereafter, as the second layer of the adhesive layer .1 03, the other agent 'is still applied in the same manner. a thermosetting type of adhesive that is dried and then passed on to the second layer The layer i 03 is dried by using, for example, drying at a higher temperature or for a longer period of time than the drying condition of the g layer 102 of the first layer, and drying after the same conditions as the adhesive layer 1 〇 2 of the first layer. In the method of heat treatment, it is preferable to change the resin in the composition of the adhesive, and to make the substrate of the thin layer of the thin layer of the hard layer to be dried.塡-11 - 200843606 Any of the methods of filling the ratio of the hardener and the hardener, and forming an effluent adhesive layer 103 which is smaller than the first layer. On the adhesive layer 102 of the first layer, an adhesive layer formed by laminating a plurality of layers having different effluent properties can be obtained by laminating the adhesive layer 103 which is laminated to form a second layer by using a laminator or the like. The film substrate for use 104 is a film for the subsequent step 105 (in the first drawing, the release agent or the release agent of the film substrate is not shown). As shown below, in order to obtain an appropriate amount of subsequent film outflow (unit: g/1 〇 minute), for example, changing the drying conditions as shown in the examples, as drying conditions for adjusting the flowability of the adhesive layers 102 and 103 It is difficult to specify the same depending on the type of the adhesive, and the following conditions can be expected. In other words, when a large effluent adhesive layer of the first layer is to be formed, a thermosetting adhesive is applied to the release agent or the film substrate, and then a hot air dryer or the like is used at 70 to 130 ° C. It is preferably 90 to 110 ° C and dried for 2 to 7 minutes, preferably 3 to 6 minutes. When the temperature is less than 70 °C, the adhesive cannot be sufficiently dried, and if it exceeds 130 °C, the lower limit of the desired discharge property is lower. In less than two minutes, there is also a failure to sufficiently dry the binder, and at more than 7 minutes, there is a lower limit than the desired effluent. When a small effluent carrier layer of the second layer is to be formed, 'after applying a thermosetting type adhesive to the release agent or the film substrate, 'using a hot air dryer or the like' is 70 to 130. (:, preferably 90 to 110 ° C, for 2 to 7 minutes, preferably 3 to 6 minutes of drying. When less than 70 ° C.), the adhesive cannot be sufficiently dried, if it exceeds 130. At the time, there is a lower limit of -12-200843606 低于 below the desired effluent. In less than two minutes, the adhesive may not be sufficiently dried, and when it exceeds 7 minutes, it is lower than the desired effluent. The lower limit is the same as the drying condition at the time of forming the large effluent adhesive layer of the first layer, or is further increased at 70 to 130 ° C, preferably 90 ° at a low temperature or a short time. 110C, heat treatment for 2 to 15 minutes, preferably 3 to 12 minutes, adjusted so that the overall drying condition of the second layer of the small effluent adhesive layer is greater than the formation of the first layer The drying condition at the time of the adhesive layer may be high temperature or longer. When the temperature is less than 70 ° C, the adhesive may not be sufficiently dried, and if it exceeds 30 ° C, the lower limit of the desired flow rate may be exceeded. After less than two minutes, there is also a failure to adequately dry the adhesive, while in the super At 15 minutes, there is a lower limit than the lower limit of the desired effluent property. However, in the present invention, it is not limited to such drying conditions, and even by the type of the thermosetting type adhesive, etc. In the case of this, it is preferable to carry out a preliminary experiment or the like in advance to obtain a condition for satisfying an appropriate subsequent film outflow amount as described below. Further, even if drying conditions are utilized, In other cases, the flowability of the adhesive layers 102 and 1300 is adjusted, and it is also preferable to perform a preliminary experiment or the like in advance to obtain a condition that satisfies the following appropriate film outflow amount. The temperature is 170 ° C. The pressure of 9.8 MPa, the time of 1 minute heating and crimping of the circuit board obtained by the pressure film 205, and the diameter of the methyl ketone (hereinafter referred to as MEK) degreased by 1.0 mm, length 1.0 mm, material The amount of subsequent film outflow of the stainless steel mold (in g/l〇min) was calculated as an index of the outflow property, and the flowability of the first layer of the adhesive layer 102--13-
200843606 是在70〜120g/10分鐘，較佳爲80〜11〇g/:l〇 而第二層的接著劑層1 〇 3的流出性是在1 0〜 較佳爲20〜40g/l〇分鐘的範圍較佳’第二 1 〇 3是比第一層的接著劑層1 0 2 ’在流出性 適當選擇。本發明的流出性不相同的接著劑 時，第三層以上的接著劑層的流出性是作成 著劑層的流出性還小就可以。在此，在第一 1 02的流出性不足7〇g/l 〇分鐘時’則無法得 表面平滑性，而在超過12〇g/10分鐘時，貝L 得接著劑所流出量變多。一方面，在第二 1 0 3的流出性爲不足1 〇 g /1 〇分鐘時，則作爲 到充分的接著性，若超過50g/10分鐘時， 流出至開口部分的量變多。 欲製作第一層的接著劑層1 〇2之際，如 ，代替脫模劑，使用成爲覆蓋層薄膜基材的 構成基材薄膜）1 〇 1，則可得到具有流出性 材1 01側一直到外側（上述接著薄膜層表1 103側）變小的接著劑層102、103的電路· 膜 100。 作爲使用於上述接著劑層1〇2或103的 劑，並未特別加以限定，例如例舉配合（i 性的橡膠作成基材，（ii )熱硬化性樹脂， ，（iv )無機塡充劑，（v )又視需要所使 加劑的接著劑。 分鐘的範圍， 50g/l〇分鐘， 層的接著劑層 小的範圍內可 層爲三層以上 比第二層的接 層的接著劑層 到電路基板的 在開口部分使 層的接著劑層 接著劑無法得 則使得接著劑 第2圖所示地 薄膜（覆蓋層 從上述薄膜基 S側=接著劑層 丨板用覆蓋層薄 f熱硬化型接著 )以具有可撓 (iii)硬化劑 用的其他的添 -14- 200843606 又，使用實施例所成的接著劑組成物的 上述接著劑的各配合成分溶解（或是分散） 溶媒的溶液者。 (i )針對於具有可撓性的橡膠（基材成分） 作爲具有被使用於上述熱硬化型接著劑 可撓性的橡膠，一般有丙烯酸橡膠、丁腈橡 稱爲丙烯酸腈-丁二烯橡膠，或是NBR)、 烯-二烯嵌段共聚物（以下，也稱爲SIS)等 ’羧酸含有官能基的丙烯橡膠。 將上述羧酸含有作爲官能基的丙烯橡膠 烷基酯（也含有甲基丙烯酸酯，以下同樣） 將含有羧酸作爲官能基的乙烯單體與視需要 苯乙烯等的共聚物。 作爲丙烯酸烷基酯，例如有，丙烯酸乙 基丙烯酸乙酯，以下同樣）、丙烯酸丙酯、 丙烯酸己酯、丙烯酸辛酯、丙烯酸2-乙基己 一烷酯、丙烯酸十二烷酯等的單體，及具有 乙酯、丙烯酸2-羧基丙酯、烯丙醇等的具有 具有縮水甘油基丙烯酸酯、二甲胺基乙基丙 氧氯丙烷變質物的環氧基的單體等。由這些 或2種以上可使用。 作爲將上述羧酸含有作爲乙烯單體，例 甲基丙烯酸、衣康酸、丁烯酸、馬來酸、無 溶液，是指將 於（vi )適當 的基材成分的 膠（以下，也 苯乙烯-丁二 ，較佳例舉有 ，是以丙烯酸 作爲主成分， 含有丙烯腈、 酯（也包含甲 丙烯酸丁酯、 酯、丙烯酸十 丙烯酸2-羧基 羧基的單體， 烯酸酯等的環 中，選擇1種 如有丙烯酸、 水馬來酸，惟 -15- 200843606 並不被限定於此些者。由這些中，選擇1種或2種以上可 使用。 作爲丙烯酸橡膠的聚合方法，並未特別加以限定，惟 也可使用一般的懸濁聚合法等，例如在將聚乙烯醇（以下 ，也稱爲PVA)等的分散體、偶氮二異丁腈（AIBN)、 月桂基過氧化物（LPO )等的聚合開始劑分散於水媒體中 的液體上，滴下上述丙烯酸單體的兩種以上的混合物，並 予以聚合。聚合物是以精製水進行水洗，並進行雜質的除 去，水洗後加熱乾燥，俾進行殘留單體、水分的除去。作 爲聚合物的數平均分子量爲大約50000〜500000較佳，更 佳爲40000〜400000的範圍。又，除了上述懸濁聚合法之 外，例如也可使用乳化聚合、溶液聚合、塊狀聚合等的傳 統公知的聚合方法。 又，有關於具有上述熱硬化型接著劑的基材成分的可 撓性的橡膠（丙烯酸橡膠以外），作於該聚合方法，也並 未特別加以限定者，而可使用一般的懸濁聚合法等。又， 作爲所得到的聚合物（具有可撓性的橡膠）的數平均分子 量爲大約50000〜500000較佳，更佳爲40000〜400000的範 圍。又，除了上述懸濁聚合法之外，例如也可使用乳化聚 合、塊狀聚合等的傳統公知的聚合方法。 具有上述熱硬化型接著劑的基材成分的可撓性的橡膠 的配合量，是由熱硬化型接著劑，減去以下述的（ii )熱 硬化性樹脂，（iii )硬化劑，（W )無機塡充劑[又，視需 要所配合的其他添加劑（V)]所規定的配合量的合計量的 -16 - 200843606 殘留分。亦即，作爲具有可撓性的橡膠的配合量，對於上 述接著劑的各配合成分的合計量100重量部爲30〜80重量 部，較佳爲40〜60重量部的範圍。具有可撓性的橡膠的配 合量不足3 0重量部時，則無法得到充分的接著性，而超 過80重量部時，則會降低耐熱性。 (Π)有關於熱硬化性樹脂 作爲使用於上述熱硬化型接著劑的熱硬化性樹脂，較 佳有環氧樹脂、酚醛樹脂。這些也可單獨地使用，或是倂 用環氧樹脂與酚醛樹脂也可以。 在此，所謂上述環氧樹脂是在分子中具有兩個以上的 環氧基的化合物，例如可使用雙酚A型環氧樹脂、雙酚F 型環氧樹脂、雙酚S型環氧樹脂、苯酚酚醛清漆型環氧樹 脂、甲酚酚醛清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹 脂、雙酚F酚醛清漆型環氧樹脂、脂環式環氧樹脂、脂肪 族鏈狀環氧樹脂、縮水甘油基酯型環氧樹脂、海因型環氧 樹脂、異氰酸酯型環氧樹脂、二官能苯酚類的二縮水甘油 醚化物、二官能醇類的二縮水甘油醚化物、及此些的氫添 加物等。此些化合物是可以單獨使用或倂用兩種以上加以 使用。上述環氧樹脂的配合量，是對於將羧酸含有作爲官 能基的丙烯酸橡膠等的具有可撓性的橡膠（熱硬化型接著 劑的基材成分）100重量部，爲10〜100重量部，較佳爲 3 0〜8 0重量部。少於10重量部，則無法得到充分的耐熱性 ，而多於1 00重量部，則降低剝離接著強度而不佳。 -17- 200843606 上述苯酚樹脂，爲可溶（酚醛）型者就可以，並未特 別地限制苯酚樹脂的分子量、軟化點、烴基當量等者。可 溶（酚醛）型苯酚樹脂，是對於苯酚過剩地添加甲醛而以 鹼觸媒進行反應者。該可溶（酚醛）型苯酚樹脂是進行加 熱’或添加酸，則在常溫也進行反應而自縮合。又，在本 發明中，不僅苯酚樹脂的自縮合，對於將羧酸含有作爲官 能基的丙烯酸橡膠等的具有可撓性的橡膠（熱硬化型接著 劑的基材成分）也具有反應性之故，因而可提昇迴銲耐熱 性或體積電阻。上述苯酚樹脂的配合量，是對於丙烯酸橡 膠等的具有可撓性的橡膠（熱硬化型接著劑的基材）1 0 0 重量部，爲5〜50重量部較佳，更佳爲10〜30重量部。若 少於5重量部，則降低交聯密度，而無法得到充分的迴銲 耐熱性，若多於5 0重量部，則會損及在B級狀態的儲藏 穩定性，而產生降低剝離接著強度等的問題。 作爲上述熱硬性樹脂，倂用環氧樹脂時，作爲此些的 配合比率並未特別加以限制者，惟環氧樹脂：苯酚樹脂（ 質量比）=30〜300: 100，較佳爲50〜250: 1〇〇的範圍。對 於苯酚樹脂1〇〇重量部，若環氧樹脂爲不足30重量部時 ，則無法得到充分的耐熱性。若超過3 00重量部時，則降 低剝離強度而不理想。 (iii)針對於硬化劑 被使用於上述熱硬化型接著劑的硬化劑，爲環氧樹脂 等的熱硬化性樹脂的硬化劑或硬化觸媒。例如，可使用芳 -18- 200843606 香族聚胺、三氟化硼三乙胺錯合物等的三氟化硼的胺錯合 物.2-烷基-4-甲基咪唑、2-苯基-4-烷基咪唑等的咪唑衍生 物、苯二甲酸酐、三苯六酸酐等的有機酸、二氰基二醯胺 、三苯基膦、二氮雜環十一碳烯、肼等公知者。又，這些 硬化劑、硬化觸媒是單獨使用也可以，或視需要倂用兩種 以上也可以。硬化劑、硬化觸媒是提昇B級的儲藏穩定性 之故，因而在常溫領域幾乎不會進行反應者較佳。 B 這些硬化劑或硬化觸媒的配合量（添加量），是對於 環氧樹脂等的熱硬化性樹脂100重量部爲0.01〜10重量部 較佳，更佳爲0.05〜5重量部。若少於0.01重量部，則無 法得到環氧樹脂等的熱硬化性樹脂的充分硬化，降低焊錫 耐熱性等，若多於10重量部，則降低剝離接著強度，而 產生降低儲藏穩定性等的問題。 (iv)針對於無機塡充劑 〜 • 作爲被使用於上述熱硬化型接著劑的無機塡充劑，本 質上爲電性絕緣性者就可使用，例如，有氫氧化鋁、氫氧 化鎂等的金屬氫氧化物、氧化鋁、氧化鈣等的金屬氧化物 、其他，二氧化砍、雲母、滑石、黏土等。這些是單獨或 視需要倂用兩種以上可加以使用。 上述無機塡充劑的配合量，是對於將羧酸含有作爲官 能基的丙烯酸橡膠（具有基材成分的可撓性的橡膠）+環 氧樹脂（熱硬化性樹脂）+苯酚樹脂（熱硬化性樹脂）的 有效成分的合計100重量部，爲10〜100重量部較佳，更 •19- 200843606 佳20〜80重量部。若少於10重量部，則無法得到充分的 耐燃性，又，若多於1 〇〇重量部，則發生降低剝離接著強 度等的問題。 上述無機塡充劑是使用球磨粉機等，將粒徑調整成 1 Ομπι以下（在此所稱的粒徑，是指最大粒徑者）。若上 述無機塡充劑的粒徑大於1 〇μπι，則作爲接著薄膜，覆蓋 層薄膜時，在薄膜表面發生凹凸，降低剝離強度，焊錫耐 熱性及損及外觀性。 (ν )針對於視需要也可使用的其他添加劑 在上述熱硬化型接著劑中，又將視需要也可使用的其 他添加劑在未損失及本發明的作用效果的範圍內予以配合 者也可以。具體上，例如適當，適量配合各種矽烷偶合劑 等而可加以使用。 (vi)針對於適當的溶媒 又，作爲被使用於溶解（或分散）上述接著劑的各配 合成分的（vi )適當的溶媒，並未被特別加以限制者，惟 可適當地利用甲基乙基酮、甲苯、DMF(N，N，-二甲基甲 醛）、乙酸乙酯、甲醇、異丙醇、乙二醇等。又，上述溶 媒是在僅接著劑的各配合成分就可適合於塗佈的溶液形態 時，就未特別地加以使用，在該情形，可處理作爲接著劑 =接著劑組成物的溶液。 作爲該溶媒的配合量，對於上述接著劑的配合成分的 -20 - 200843606 合計量 100重量部，爲 100〜1 000重量部，更 200〜600重量部的範圍。在溶媒的配合量爲100重量 ，則接著劑溶液的黏度過高而無法進行塗佈，而在 1 〇〇〇重量部時，則無法得到所期望的接著劑層。 作爲經上述脫模處理的紙基材的脫模劑，並未特 以限定者，惟例如有在上質紙、牛皮紙、卷紙、玻璃 的紙兩面，設置黏土、聚乙烯、聚丙烯等的塡料劑的 層，又在各該塗佈層上塗佈著聚矽氧系、氟系、烷基 脫模劑者，及在聚乙烯、聚丙烯、乙烯-α ·烯烴共聚 、丙烯-α -烯烴共聚物等的各種烯烴薄膜單獨，及聚 二甲酸乙二醇酯等的薄膜上塗佈上述脫模劑者，惟與 劑層的脫模力，聚矽氧對電性特性會給予不良影響之 因而在上質紙的兩面施以聚丙烯塡料處理之後，在其 使用烷基系脫模劑者較佳。 上述經脫模處理的紙基材的脫模劑的厚度，是並 別加以限制者，爲50〜150 μιη，更佳爲80〜12 Ομιη的 。在經脫模處理的紙基材的脫模劑的厚度不足5 0 μπι 則作爲脫模劑的強度不充分，而在超過150μιη時，以 捲取時有旋度變大之虞。 作爲上述經脫模處理的PET薄膜基材的脫模劑， 特別加以限定者，惟有在聚酯薄膜上使用醇酸系脫模 。作爲被使用於聚酯薄膜的較佳聚酯，可列舉聚對苯 酸乙二醇酯、聚對苯二甲酸乙二醇酯與乙烯間苯二甲 的共聚合物、聚對苯二甲酸丁二酯及其共聚物、聚苯 佳爲 部時 超過 別加 紙等 塗佈 系的 合物 對苯 接著 故， 上面 未特 範圍 時， 滾子 並未 劑者 二甲 酸酯 二甲 -21 - 200843606 酸丁二酯及其共聚物、聚萘二甲酸己二酯及其共聚物。這 些聚酯薄膜是具有發塵少，加熱時的發生氣體少的優點。 上述經脫模處理的PET薄膜基材的脫模劑的厚度，是 並未特別加以限定者，爲25〜100 μηι，更佳爲38〜75 μιη的 範圍。在經脫模處理的PET薄膜基材的脫模劑的厚度不足 25 μιη時，貝IJ在剝離脫模劑之際不容易剝離，降低作業性 ，而在超過10 0 μιη時，以滾子捲取時有旋度變大之虞。 作爲成爲上述覆蓋層薄膜基材的可撓性絕緣薄膜（覆 蓋層構成基材薄膜）1 0 1，並未特別加以限定者，惟例如 有聚醯亞胺薄膜、PET薄膜、聚乙烯苯二酸鹽薄膜等。 成爲上述覆蓋層薄膜基材的可撓性絕緣薄膜（覆蓋層 構成基材薄膜）1 0 1的厚度，是並未特別加以限定者，惟 爲4〜5 0μιη，較佳爲12〜25μπι的範圍。可撓性絕緣薄膜（ 覆蓋層構成基材薄膜）101的厚度不足4 μιη時，則塗佈時 的良率顯著降低，而超過5 0 μιη時，則因愈增加電路基板 的厚度，因此較不好。 又’在本發明中，欲形成流出性不相同的複數層（ 1〇2、103、…···…）所成的接著劑層104，可使用流出性不 相同的複數接著劑層。例如，在第一層的接著劑層1 02使 用流出性大的接著劑，而在成爲第二層的接著劑層1 03使 用流出性小的接著劑，藉由積層第一層與第二層的接著劑 層1 02、1 03的傾斜配置，可得到流出性不相同的接著劑 層1 04的接著薄膜1 〇5。又，在此，作爲複數的接著劑， 有接著材料的橡膠/樹脂比爲不相同者，或即使橡膠/樹脂 -22- 200843606 比是同一，也利用添加添加劑或塡充材使得流出性不相同 者等。 藉由將如此所得到的接著薄膜1 0 5的流出性小的一面 (接著劑層1 03側），或是覆蓋層薄膜1 00的接著劑面（ 接著劑層1 03側）黏貼於形成在絕緣基板（下層基板203 )上的（電路基板200構成基材薄膜202的）金屬層部分 的所需要的配線圖案（導通或電路圖案）201上，可得到 表面平滑性優異，且儘量抑制接著材料流出到配線圖案端 子部等的開口部分，又具有更薄的接著劑層1 04的多層電 路基板3 00。 亦即，本發明的多層電路基板300是作爲上述接著劑 層1 04，如流出性大的接著劑層1 02，流出性小的接著劑 層1 03般地，至少積層2層以上流出性不相同的接著劑層 所成，而配置成流出性小的一方（接著劑層1 03 )位於圖 案（201 )側，爲其特徵者。又，本發明的可撓性電路基 板3〇0，是使用本發明的電路基板用覆蓋層薄膜1〇〇所成 ，爲其特徵者。亦即，本發明的可撓性電路基板300，也 作爲上述接著劑層1 04，如流出性大的接著劑層1 02，流 出性小的接著劑層1 03般地，至少積層2層以上流出性不 相同的接著劑層所成，而配置成流出性小的一方（接著劑 層1 0 3 )位於圖案（2 0 1 )側，爲其特徵者。換言之，本發 明的可撓性電路基板3 0 0，也如流出性大的接著劑層1 〇 2 ，流出性小的接著劑層1 03般地，設置至少積層2層以上 流出性不相同的接著劑層所成的接著薄膜層1 04所成者， -23- 200843606 可說是傾斜配置成上述接著薄膜層1 04的流出性爲從上述 薄膜基材1 〇〇側一直到外側（圖案20 1側=接著劑層1 0 3 側）變小所成，爲其特徵者。因此，上述電路基板200是 可說是被使用於多層電路基板或可撓性電路基板的構成要 素。 在此，作爲接著薄膜1 05的流出性小的一面（接著劑 層1 03側），或是覆蓋層薄膜1 00的接著劑面（接著劑層 1 〇3側）黏貼於形成在絕緣基板（下層基板203 )上的（ 電路基板200構成基材薄膜202的）金屬層部分的所需要 的配線圖案（導通或電路圖案）20 1上之際的條件，並未 特別加以限定者，可適用傳統公知的方法。例如，可適用 熱疊合等的熱壓機（加熱加壓）的方法，藉由加熱輥，進 行輥疊合的方法等。 作爲使用上述熱疊合等熱壓機（加熱加壓）的方法時 的條件，因應於經脫模處理的紙或PET薄膜基材的脫模劑 等的耐熱性或熔融溫度（或是轉移溫度等）來適當決定接 著劑層102、103或成爲覆蓋層薄膜基材的可撓性絕緣薄 膜101就可以。具體上，在70〜130°C，較佳爲80〜120°C ，以0.5〜5MPa，較佳爲1〜3MPa，而在5〜120秒鐘，較佳 爲10〜60秒鐘的範圍內進行加熱壓接（熱疊合）較佳。在 此，不足7 0 °C時，則接著層不會接著，而超過1 3 0 °c時’ 則有P E T脫模劑會變形之虞。不足0· 5 M p a時，則接著劑 不會接著，而超過5 M P a時’則有接著劑流出到開口部分 的量變多之虞。不足5秒鐘時’則接著劑不會接著’而超 -24- 200843606 過1 20秒鐘時，則有接著劑流出到開口部分的量變多之虞 。又，利用加熱輥，使用輥疊合的方法時的條件，也與使 用上述熱疊合等的熱壓機（加熱加壓）的方法時的條件大 約同樣的條件下可進行。 在配線圖案（導通或電路圖案）2 0 1上黏貼有相對地 流出性小的接著劑層1 03，惟該接著劑層1 〇3是必須設計 成充分地塡入配線與配線之間，而可得到不會產生局部性 間隙程度的流出性。 上述接著劑層1 03單獨時，接著劑不會流出到配線圖 案端子部等的開口部分，惟多層電路基板3 00或可撓性電 路基板（未圖示）的表面平滑性是無法得到。在本發明中 ，藉由積層相對地流出性大的接著劑層1 0 2的傾斜配置於 上述接著劑層1 上，雖儘量薄的接著劑層（相間接著劑 層）1 〇4，也可兩立接著劑的流出抑制與多層電路基板的 表面平滑性。 亦即，在本發明的接著薄膜105或覆蓋層薄膜1〇〇, 藉由積層相對地流出性大的接著劑層1 〇2傾斜配置於相對 地流出性小的接著劑層1 〇3上，而利用壓機（熱疊合）等 黏貼於配線圖案（導通或電路圖案）20 1上之際，首先最 初抵接有相對地流出性小的接著劑層1 〇3，利用該接著劑 層所具有的低流出性，不會局部地產生空隙地可充分地進 入配線圖案20 1的配線與配線之間，而可得到所定的接著 強度。又，在被傾斜配置於該接著劑層1 03的相對地流出 性大的接著劑層1 〇2中，接著劑層1 03爲追隨變化配線圖 -25- 200843606 案2 0 1的微細且複雜的圖案形狀之後，以連續地追隨相同 形狀的形式（描繪連續被押入的先前接著劑層的押入 後的形狀的形式），而可連續進入到接著劑層1 02已進入 後的配線圖案201的配線與配線之間。所以即使爲相對地 流出性大的接著劑層1 02，也不會局部地產生於配線圖案 20 1的配線與配線之間而可充分地進入者。如此地經壓機 (熱疊合等）而加以黏貼後的接著劑層1 〇4，可兩立接著 劑的流出抑制與多層電路基板的表面平滑性者。 (實施例） 使用以下的實施例及比較例來說明本發明的效果。但 是本發明的技術性範圍並不被限制在表示於以下的實施例 的形態者。 實施例1 (1 )調整接著劑組成物的溶液 對於將羧酸含有作爲官能基的丙烯橡膠WS 02 3D R (日本長瀨克母特克斯（譯音）製；數平均分子量11000 0 )60重量部，將甲酚酚醛清漆型環氧樹脂的ESCN-195-10 (住友化學股份有限公司製）20重量部，甲楷型苯酚樹脂 的希大能爾Η2181 (日立化成工業股份有限公司製）20重 量部，作爲硬化劑將二氰二醯胺0.6重量部，作爲無機塡 充劑將氫氧化鋁的海及來特Η42Μ (昭和電工股份有限公 司製）2 0重量部溶解於甲基乙基酮，經分散，作成不揮發 -26- 200843606 分20wt%溶液。將該溶液，使用球磨粉機而將無機塡充劑 調整爲粒徑5 μπι以下，經充分地分散作爲接著劑組成物的 溶液。 (2 )接著薄膜的製作 作爲第一層的接著劑層1 02，乾燥後的接著劑層1 02 的厚度成爲20 μπι般地將在上述（1 )所得到的接著劑組成 物的溶液塗佈於厚度9 8 μιη的被脫模處理的紙基材的脫模 劑[醇酸系脫模劑/PET (厚度16μιη ) /上質紙/PET (厚度 16 μπι )]，而在熱風乾燥機中施以100 °C χ5分鐘乾燥，作 爲流出性大的接著劑層1 02。然後，作爲第二層的接著劑 層1 03，將在上述（1 )所得到的相同接著劑組成物的溶液 作成乾燥後的接著劑層1 〇 3的厚度成爲2 0 μ m般地塗佈於 厚度50μπι的被脫模處理的PET薄膜基材的脫模劑[醇酸 系脫模劑/PET (厚度50μιη )]，在熱風乾燥機中施以1〇〇 °C χ 5分鐘乾燥，再追加施以1 〇 〇 °C X 1 0分鐘加熱處理，作 爲流出性小的接著劑層1〇3。利用熱疊合（10(rC，2MPa ，疊合時間3 0秒鐘）積層所得到的兩個接著劑層1 〇 2、 1 〇 3，進行傾斜配置而作爲具有接著劑層〗〇 4的接著薄膜 1 0 5。對於所得到的接著薄膜1 〇 5，進行以下的特性評價。 (特性評價） (3 )壓機加工性 在以厚度25μιη的聚醯亞胺薄膜與厚度35μπι的銅箔 -27- 200843606 A所形成的貼銅積層板的聚醯亞胺面，黏貼具有上述流出 性不相同的接著劑層1 〇4的接著薄膜1 05。這時候，剝離 接著薄膜105的被脫模處理的紙基材的脫模劑之後，將該 接著薄膜1 05的流出性大的面（接著劑層1 02側），黏貼 (黏貼條件：熱疊合，100°C，2MPa，30秒鐘）於積層板 的聚醯亞胺面。然後，剝離接著薄膜105的被脫模處理的 PET薄膜基材的脫模劑之後，將該接著薄膜105的流出性 小的面（接著劑層1 03側），黏貼（黏貼條件：熱疊合， 100°C，2MPa，30秒鐘）於具有所需要的配線圖案的貼銅 積層板（以厚度35μιη銅箔的配線圖案，與厚度25μιη的 聚醯亞胺製的基材薄膜所形成的貼銅積層板）的銅箔面（ 配線圖案面）。然後，進行壓機溫度170°C，壓力2.0MPa ，時間5分鐘加熱壓接，來評價最外層的銅箔A的表面平 滑性，來自端部的流出性。將所得到的結果表示於下述表 (4 )流出性 剝離所製作的接著薄膜1 05的被脫模處理的紙基材的 脫模劑及被脫模處理的PET薄膜基材的脫模劑之後，以溫 度170°C，壓力9.8MPa，時間1分鐘加熱壓接該接著薄膜 105，而將來自直徑1.0mm，長度1.0mm的不鏽鋼製模的 接著薄膜流出量（單位g/1 0分鐘）算出作爲流出性的指 標。將所得到的結果表示於下述表1。 -28- 200843606 實施例2 在實施例1中，欲製作第二層的接著劑層1 03之後， 使用將氫氧化鋁的海及來特H42M(昭和電工股份有限公 司製）作爲50重量部的接著劑組成物的溶液，除了未進 行第二層的接著劑層1 03的追加加熱處理之外，與實施例 1同樣地進行。將所得到的接著薄膜1 0 5的特性評價（表 面平滑性，來自端部的流出性及流出性）結果表示於下述 表1 〇 實施例3 在實施例1中，欲製作第一層的接著劑層1 02之際， 代替被脫模處理的紙基材的脫模劑，作爲成爲覆蓋層薄膜 基材的可撓性絕緣薄膜（覆蓋層構成基材薄膜）1 0 1，使 用厚度25 μπι的聚醯亞胺薄膜，除了作爲覆蓋層薄膜1〇〇 之外，與實施例1同樣地進行。將所得到的覆蓋層薄膜 1〇〇，進行以下的特性評價。 (特性評價） (3 )壓機加工性 剝離覆蓋層薄膜100的被脫模處理的PET薄膜基材的 脫模劑之後，將該覆蓋層薄膜1 00的流出性小的面（接著 劑層103側）黏貼（黏貼條件：熱疊合，1 〇〇°c，2MPa， 3 〇秒鐘）於具有所需要的配線圖案的貼銅積層板（以厚度 3 5 μπι的銅箔的配線圖案，與厚度2 5 μιη的聚醯亞胺製的基 -29- 200843606 材薄膜所形成的貼銅積層板）的銅箔面（配線圖案面）。 然後，進行壓機溫度170°c，壓力2.0MPa，時間5分鐘加 熱壓接，來評價最外層的覆蓋層薄膜基材101的表面平滑 性，來自端部的流出性。將所得到的結果表示於下述表1 (4 )流出性 剝離所製作的覆蓋層薄膜100的被脫模處理的PET薄 膜基材的脫模劑之後，以溫度17〇°C，壓力9.8MPa，時間 1分鐘加熱壓接該覆蓋層薄膜，而將來自直徑1 .〇mm ，長度1 · 〇 Hi m的不鏽鋼製模的覆蓋層薄膜流出量（單位 g/1 0分鐘）算出作爲流出性的指標。將所得到的結果表示 於下述表1，在此，在單面覆蓋層薄膜基材的覆蓋層薄膜 時，從覆蓋層薄膜基材的聚醯亞胺薄膜剝取接著劑層進行 測定。 比較例1 在實施例1中，作爲第一層的接著劑層1 02，乾燥後 的接著劑層的厚度成爲4 Ο μ m般地塗佈接著劑組成物的溶 ' 液，而在熱風乾燥機中施以1 〇 〇 °C X 5分鐘乾燥，除了作爲 單層的（接著劑層102所構成）接著薄膜1 05之外，與實 施例1同樣地進行。對於所得到的接著薄膜1 〇 5，進行以 下的特性評價。 -30- 200843606 (特性評價） (3 )壓機加工性 在以厚度25μπι的聚醯亞胺薄膜與厚度35μπι的銅箔 Α所形成的貼銅積層板的聚醯亞胺面，黏貼上層單層的接 著劑層102所構成的接著薄膜105。這時候，將未形成有 接著薄膜1 05的被脫模處理的紙基材的脫模劑的接著劑層 1 02面首先最初地黏貼（黏貼條件：熱疊合，1 〇〇 °C， 2MPa，3 0秒鐘）於積層板的聚醯亞胺面。然後，剝離接 著薄膜105的被脫模處理的紙基材的脫模劑之後，將該接 著薄膜105的接著劑層1 02黏貼（黏貼條件：熱疊合， 100°C，2MPa，30秒鐘）於具有所需要的配線圖案的貼銅 積層板（以厚度35μπι銅箔的配線圖案，與厚度25μιη的 聚醯亞胺製的基材薄膜所形成的貼銅積層板）的銅箔面（ 配線圖案面）。然後，進行壓機溫度170 °C，壓力2.0 MPa ，時間5分鐘加熱壓接，來評價最外層的銅箔A的表面平 滑性，來自端部的流出性。將所得到的結果表示於下述表 (4 )流出性 剝離所製作的接著薄膜1 05的被脫模處理的紙基材的 脫模劑之後，以溫度1 7 0 °C，壓力9 · 8 MP a，時間1分鐘加 熱壓接該接著薄膜1〇5，而將來自直徑 l.〇mm，長度 1.0mm的不鏽鋼製模的接著薄膜流出量（單位g/ΙΟ分鐘 )算出作爲流出性的指標。將所得到的結果表示於下述表 -31 - 200843606 比較例2 在實施例1中，欲製作第1層的接著劑層1 02之後’ 除了使用將氫氧化鋁的海及來特H42M (昭和電工股份有 限公司製）作爲5 0重量部的接著劑組成物的溶液之外， 與實施例1同樣地進行。將所得到的接著薄膜1 05的特性 評價（表面平滑性，來自端部的流出性及流出性）結果表 示於下述表1。200843606 is 70~120g/10min, preferably 80~11〇g/:l〇 and the flowability of the second layer of the adhesive layer 1 〇3 is 10~~20~40g/l〇 The range of minutes is preferably 'the second 1 〇 3 is selected appropriately in the effluent than the first layer of the adhesive layer 1 0 2 '. In the case of the adhesive having different effluent properties of the present invention, the outflow property of the adhesive layer of the third layer or more may be such that the flowability of the coating layer is small. Here, when the flowability of the first 102 is less than 7 〇g/l 〇 minutes, the surface smoothness cannot be obtained, and when it exceeds 12 〇 g/10 minutes, the amount of the adhesive from the shell L increases. On the other hand, when the effluent property of the second 103 is less than 1 〇 g /1 〇 minutes, sufficient adhesion is obtained, and when it exceeds 50 g/10 minutes, the amount of flow out to the opening portion increases. When the first layer of the adhesive layer 1 〇 2 is to be produced, for example, instead of the release agent, using the constituent substrate film which is the cover film substrate, 1 〇1, it is possible to obtain the flow-through material 01 side. The circuit/film 100 of the adhesive layers 102 and 103 which becomes small to the outside (the side of the film layer 1103 described above). The agent to be used for the above-mentioned adhesive layer 1〇2 or 103 is not particularly limited, and for example, a compound (i is a rubber-based substrate, (ii) a thermosetting resin, and (iv) an inorganic chelating agent is exemplified. (v) Further, if necessary, the adhesive of the additive. The range of minutes, 50 g / l 〇 minutes, the layer of the layer of the adhesive layer is small, the layer can be three or more layers than the adhesion layer of the second layer In the opening portion of the layer to the circuit substrate, the adhesive layer of the layer is not obtained, so that the film shown in FIG. 2 of the adhesive is applied (the cover layer is thinned from the film substrate S side = the adhesive layer is covered with the cover layer) The hardening type is followed by the addition of the solvent of the above-mentioned adhesive agent of the adhesive composition of the example of the adhesive composition of the above-mentioned adhesive composition of the adhesive composition (III) Solution (i) For rubber having flexibility (substrate component) As a rubber having flexibility for use in the above-mentioned thermosetting type adhesive, generally, acrylic rubber, nitrile rubber is called acrylic nitrile-butyl Diene rubber, or NBR), ene-two Block copolymer (hereinafter, also referred to as SIS) and the like 'propylene rubber containing a carboxylic acid functional group. The carboxylic acid contains a propylene rubber alkyl ester (which also contains a methacrylate, the same applies hereinafter) as a functional group, and a copolymer of an ethylene monomer having a carboxylic acid as a functional group and, if necessary, styrene or the like. Examples of the alkyl acrylate include acrylate ethyl acrylate (hereinafter the same), propyl acrylate, hexyl acrylate, octyl acrylate, 2-ethylhexyl acrylate, dodecyl acrylate, and the like. And a monomer having an epoxy group having a glycidyl acrylate or a dimethylaminoethyl propyl chlorohydrin modification such as ethyl ester, 2-carboxypropyl acrylate or allyl alcohol. These or two or more types can be used. The above carboxylic acid is contained as an ethylene monomer, and methacrylic acid, itaconic acid, crotonic acid, maleic acid, and no solution are referred to as (vi) suitable base material components (hereinafter, also benzene). Ethylene-butadiene is preferably a ring containing acrylic acid as a main component and containing acrylonitrile and an ester (including a butyl methacrylate, an ester, a 2-carboxycarboxyl group of acrylic acid decaacrylate, an enoate or the like). In the above, one type of acrylic acid or hydromaleic acid is selected, but -15-200843606 is not limited thereto. One or two or more of them may be used as the polymerization method of the acrylic rubber, and Although it is not particularly limited, a general suspension polymerization method or the like can be used, for example, a dispersion of polyvinyl alcohol (hereinafter also referred to as PVA), azobisisobutyronitrile (AIBN), and lauryl peroxide. A polymerization initiator such as a substance (LPO) is dispersed in a liquid in an aqueous medium, and a mixture of two or more kinds of the above acrylic monomers is dropped and polymerized. The polymer is washed with purified water, and impurities are removed and washed. After heating and drying Drying, hydrazine is carried out to remove residual monomers and water. The number average molecular weight of the polymer is preferably from about 50,000 to 500,000, more preferably from 40,000 to 400,000. Further, in addition to the above suspension polymerization method, for example, A conventionally known polymerization method such as emulsion polymerization, solution polymerization, or bulk polymerization is used. Further, a flexible rubber (other than acrylic rubber) having a base component of the above-described thermosetting adhesive is used in the polymerization method. Further, it is not particularly limited, and a general suspension polymerization method or the like can be used. Further, the number average molecular weight of the obtained polymer (having a flexible rubber) is preferably about 50,000 to 500,000, more preferably Further, in addition to the above suspension polymerization method, for example, a conventionally known polymerization method such as emulsion polymerization or bulk polymerization may be used. The substrate component having the above thermosetting adhesive is flexible. The blending amount of the rubber is a thermosetting adhesive, minus (ii) a thermosetting resin, (iii) a hardener, and (W) an inorganic filler [again, -16 - 200843606 Residue of the total amount of the compounding amount specified by the other additives (V) to be blended, that is, the total amount of the respective components of the above-mentioned adhesive as the blending amount of the rubber having flexibility The weight of 100 parts is 30 to 80 parts by weight, preferably 40 to 60 parts by weight. When the amount of the rubber having flexibility is less than 30 parts by weight, sufficient adhesion cannot be obtained, and more than 80 parts are obtained. In the case of the thermosetting resin, a thermosetting resin to be used as the thermosetting adhesive is preferably an epoxy resin or a phenol resin. These may be used alone. Either epoxy resin and phenolic resin can be used. Here, the epoxy resin is a compound having two or more epoxy groups in a molecule, and for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, or the like can be used. Phenolic novolac type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy Resin, glycidyl ester type epoxy resin, hydantoin type epoxy resin, isocyanate type epoxy resin, difunctional phenolic diglycidyl etherate, difunctional alcohol diglycidyl etherate, and the like Hydrogen additives, etc. These compounds may be used singly or in combination of two or more. The amount of the epoxy resin to be added is 10 parts by weight to 100 parts by weight of a flexible rubber (base material component of a thermosetting adhesive) such as an acrylic rubber containing a functional group as a functional group. It is preferably 30 to 80 weight parts. If it is less than 10 parts by weight, sufficient heat resistance cannot be obtained, and if it is more than 100 parts by weight, the peeling strength is lowered. -17- 200843606 The above phenol resin may be a soluble (phenolic) type, and the molecular weight, softening point, and hydrocarbon group equivalent of the phenol resin are not particularly limited. A soluble (phenolic) type phenol resin is one in which formaldehyde is excessively added to phenol and reacted with an alkali catalyst. When the soluble (phenolic) type phenol resin is heated or added with an acid, the reaction is carried out at room temperature to self-condense. In addition, in the present invention, not only the self-condensation of the phenol resin but also the flexible rubber (base component of the thermosetting adhesive) such as an acrylic rubber containing a functional group as a functional group is reactive. Therefore, the reflow heat resistance or volume resistance can be improved. The amount of the phenol resin to be added is 10 parts by weight, more preferably 5 to 50 parts by weight, more preferably 10 to 30 parts by weight of a flexible rubber (base material of a thermosetting type adhesive) such as an acrylic rubber. Weight department. If it is less than 5 parts by weight, the crosslinking density is lowered, and sufficient reflow heat resistance cannot be obtained. If it is more than 50 parts by weight, the storage stability in the B-stage state is impaired, and the peeling strength is lowered. Etc. When the epoxy resin is used as the above-mentioned thermosetting resin, the compounding ratio of these is not particularly limited, but the epoxy resin: phenol resin (mass ratio) = 30 to 300: 100, preferably 50 to 250. : The range of 1 〇〇. When the epoxy resin is less than 30 parts by weight in the weight portion of the phenol resin, sufficient heat resistance cannot be obtained. If it exceeds 300 parts by weight, it is not preferable to lower the peel strength. (iii) The curing agent used for the above-mentioned thermosetting type adhesive is a curing agent or a curing catalyst of a thermosetting resin such as an epoxy resin. For example, an amine complex of boron trifluoride such as aryl-18-200843606 aromatic polyamine, boron trifluoride triethylamine complex or the like can be used. 2-alkyl-4-methylimidazole, 2-benzene An imidazole derivative such as a 4-alkylimidazole, an organic acid such as phthalic anhydride or trimesic anhydride, dicyanodiamine, triphenylphosphine, diazetane undecene, anthracene, etc. Known. Further, these curing agents and curing catalysts may be used singly or in combination of two or more kinds as needed. The hardener and the hardening catalyst are those which improve the storage stability of the grade B, and therefore it is preferable that the reaction is hardly carried out in the normal temperature range. B. The amount of the hardening agent or the curing catalyst (addition amount) is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 5 parts by weight, per 100 parts by weight of the thermosetting resin such as an epoxy resin. When the amount is less than 0.01 parts by weight, sufficient curing of the thermosetting resin such as an epoxy resin is not obtained, and solder heat resistance and the like are lowered, and if it is more than 10 parts by weight, the peeling strength is lowered, and storage stability and the like are lowered. problem. (iv) For inorganic chelating agents~ • As an inorganic chelating agent to be used for the above-mentioned thermosetting type adhesive, it can be used as an electrically insulating substance, for example, aluminum hydroxide, magnesium hydroxide, etc. Metal oxides such as metal hydroxides, aluminum oxides, and calcium oxides, others, oxidized chopping, mica, talc, clay, and the like. These can be used alone or in combination of two or more as needed. The amount of the inorganic chelating agent to be added is an acryl rubber (a flexible rubber having a substrate component) + an epoxy resin (thermosetting resin) + a phenol resin (thermosetting property) containing a functional group as a carboxylic acid. The total weight of the active ingredient of the resin is 100 parts by weight, preferably 10 to 100 parts by weight, and more preferably 19 to 200843606 by 20 to 80 parts by weight. If it is less than 10 parts by weight, sufficient flame resistance cannot be obtained, and if it is more than 1 part by weight, problems such as reduction in peeling strength and the like occur. The above inorganic chelating agent is adjusted to have a particle diameter of 1 Ομπι or less by using a ball mill or the like (the particle diameter referred to herein means the maximum particle diameter). When the particle diameter of the above inorganic chelating agent is more than 1 〇μπι, when the film is covered as a film, irregularities are formed on the surface of the film to lower the peel strength, solder heat resistance and appearance properties. (v) Other additives which can be used as needed In the above-mentioned thermosetting type adhesive, other additives which can be used as needed may be blended without departing from the effects of the present invention. Specifically, for example, an appropriate amount of a mixture of various decane coupling agents or the like can be used as appropriate. (vi) For the appropriate solvent, (vi) a suitable solvent to be used for dissolving (or dispersing) the respective components of the above-mentioned adhesive is not particularly limited, but may suitably utilize methyl ethyl Ketone, toluene, DMF (N,N,-dimethylformaldehyde), ethyl acetate, methanol, isopropanol, ethylene glycol, and the like. Further, the solvent is not particularly used in the form of a solution which is suitable for application of only the respective components of the adhesive, and in this case, a solution which is an adhesive = an adhesive composition can be treated. The blending amount of the solvent is in the range of 100 to 1,000 parts by weight, and more preferably 200 to 600 parts by weight, based on the total amount of -20 - 200843606 of the above-mentioned adhesive. When the amount of the solvent is 100 parts by weight, the viscosity of the adhesive solution is too high to be applied, and when it is 1 part by weight, the desired adhesive layer cannot be obtained. The release agent of the paper substrate which has been subjected to the above-mentioned release treatment is not particularly limited. For example, there are enamels such as clay, polyethylene, polypropylene, etc. on both sides of paper of upper paper, kraft paper, roll paper, and glass. a layer of a material agent, which is coated with a polyfluorene-based, fluorine-based or alkyl-type release agent on each of the coating layers, and copolymerized with polyethylene, polypropylene, ethylene-α·olefin, and propylene-α- Any of various olefin films such as an olefin copolymer and a film such as polyethylene dicarboxylate may be coated with the above-mentioned release agent, but the release force of the agent layer may adversely affect the electrical properties of the polymer. Therefore, after the polypropylene crucible is applied to both sides of the upper paper, it is preferred to use an alkyl-based release agent. The thickness of the release agent of the release-treated paper substrate is not limited, and is 50 to 150 μm, more preferably 80 to 12 μm. When the thickness of the release agent of the release-treated paper substrate is less than 50 μm, the strength of the release agent is insufficient, and when it exceeds 150 μm, the curl becomes large at the time of winding. The release agent of the above-mentioned release-treated PET film substrate is particularly limited, and only the polyester film is used for demolding on the polyester film. Preferred polyesters to be used for the polyester film include polyethylene terephthalate, a copolymer of polyethylene terephthalate and ethylene meta-xylene, and polybutylene terephthalate. When the diester, its copolymer, and the polyphenylene are more than the coating system of the other paper, the benzene is followed by the benzene, and when the above is not specified, the roller is not coated with the diformate. 200843606 Butadiene dibutoxide and its copolymers, poly(phthalenedicarboxylate) and copolymers thereof. These polyester films have the advantage of less dust generation and less gas generation during heating. The thickness of the release agent of the release-treated PET film substrate is not particularly limited, and is in the range of 25 to 100 μm, more preferably 38 to 75 μm. When the thickness of the release agent of the release-treated PET film substrate is less than 25 μm, the shell IJ is not easily peeled off when the release agent is peeled off, and the workability is lowered, and when it exceeds 100 μm, the roller is rolled. When the time is taken, the curl becomes larger. The flexible insulating film (the cover layer constituting base film) 101 which is the cover film substrate is not particularly limited, but is, for example, a polyimide film, a PET film, or a polyphthalic acid. Salt film, etc. The thickness of the flexible insulating film (the cover layer constituting base film) which is the cover film substrate is not particularly limited, but is preferably in the range of 4 to 50 μm, preferably 12 to 25 μm. . When the thickness of the flexible insulating film (the cover layer-constituting base film) 101 is less than 4 μm, the yield at the time of coating is remarkably lowered, and when it exceeds 50 μm, the thickness of the circuit board is increased, so that it is less it is good. Further, in the present invention, a plurality of adhesive layers having different effluent properties may be used as the adhesive layer 104 formed by forming a plurality of layers (1, 2, 103, ..., ...) having different effluent properties. For example, in the first layer of the adhesive layer 102, a large outflowing adhesive is used, and in the second layer of the adhesive layer 103, a small outflowing adhesive is used, by laminating the first layer and the second layer. The slanted arrangement of the adhesive layers 102 and 103 gives the adhesive film 1 〇5 of the adhesive layer 104 having different effluent properties. Here, as the plurality of adhesives, the rubber/resin ratio of the adhesive material is different, or even if the rubber/resin-22-200843606 ratio is the same, the additive property or the ruthenium filler material is used to make the effluent property different. And so on. The surface of the adhesive film 1 0 5 having the small flowability (the adhesive layer 10 side) or the adhesive film surface of the cover film 100 (the adhesive layer 10 3 side) is adhered to the formed film. On the insulating substrate (lower substrate 203), a desired wiring pattern (conduction or circuit pattern) 201 of the metal layer portion (the circuit substrate 200 constitutes the base film 202) is excellent in surface smoothness, and the adhesion material is suppressed as much as possible. The multilayer circuit substrate 300 which has a thinner adhesive layer 104 is discharged to the opening portion of the wiring pattern terminal portion or the like. In other words, the multilayer circuit substrate 300 of the present invention is used as the adhesive layer 104, such as an adhesive layer 102 having a large effluent property, and has a low flowability of the adhesive layer 307, and at least two layers of the flowability are not distributed. The same adhesive layer is formed, and the one having the smaller outflow property (the adhesive layer 1300) is located on the side of the pattern (201), and is characterized by the same. Further, the flexible circuit board 3 〇 0 of the present invention is characterized by using the cover film 1 〇〇 for a circuit board of the present invention. In other words, the flexible circuit board 300 of the present invention is also used as the adhesive layer 104, such as an adhesive layer 102 having a large flowability, and an adhesive layer having a small flow-off property, and at least two layers are laminated. The adhesive layer having different effluent properties is formed, and the one having the smaller effluent property (the adhesive layer 1 0 3 ) is located on the side of the pattern (2 0 1 ). In other words, the flexible circuit board 300 of the present invention is also provided with an adhesive layer 1 〇 2 having a large effluent property and an adhesive layer 307 having a small effluent property, and at least two layers or more are provided with different effluent properties. The subsequent film layer 104 formed by the layer of the layer is -23-200843606. It can be said that the flowability of the film layer 104 is inclined from the side of the film substrate 1 to the outside (pattern 20). The 1 side = the adhesive layer 1 0 3 side) is made smaller and is characterized by it. Therefore, the above-described circuit board 200 can be said to be a constituent element used for a multilayer circuit board or a flexible circuit board. Here, the adhesive film surface (the adhesive layer 1 〇 3 side) of the cover film 100 is adhered to the insulating substrate (the adhesive layer 10 side) on the side of the film 205 (or the adhesive layer 10 side). The condition on the desired wiring pattern (conduction or circuit pattern) 20 1 of the metal layer portion (the circuit substrate 200 constituting the base film 202) on the lower substrate 203) is not particularly limited, and the conventional method can be applied. A well-known method. For example, a method of hot press (heating and pressurization) such as heat lamination, a method of laminating rolls by a heating roll, or the like can be applied. The heat treatment or melting temperature (or transfer temperature) of the mold release agent or the release agent of the PET film substrate, etc., in the case of using the above-described method of heat lamination (heating and pressurization) such as thermal lamination The adhesive layer 102, 103 or the flexible insulating film 101 to be a cover film substrate may be appropriately determined. Specifically, it is in the range of 70 to 130 ° C, preferably 80 to 120 ° C, 0.5 to 5 MPa, preferably 1 to 3 MPa, and 5 to 120 seconds, preferably 10 to 60 seconds. It is preferred to perform heat crimping (heat lamination). Here, when it is less than 70 °C, the subsequent layer does not continue, and when it exceeds 130 °C, the P E T release agent is deformed. When it is less than 0·5 M p a , the adhesive does not continue, and when it exceeds 5 M Pa a, the amount of the adhesive flowing out to the opening portion becomes large. When it is less than 5 seconds, the amount of the adhesive does not go up, and when the temperature exceeds -24-200843606, the amount of the adhesive agent flowing out to the opening portion becomes larger. Further, the conditions in the case of using the heating roll and the method of using the roll lamination can be carried out under the same conditions as those in the method of using a hot press (heating and pressurizing) such as heat lamination. An adhesive layer 103 having a relatively small outflow property is adhered to the wiring pattern (conduction or circuit pattern) 210, but the adhesive layer 1 〇3 must be designed to be sufficiently inserted between the wiring and the wiring, and It is possible to obtain an outflow which does not cause a local gap. When the adhesive layer 203 is alone, the adhesive does not flow out to the opening portion of the wiring pattern terminal portion or the like, but the surface smoothness of the multilayer circuit substrate 300 or the flexible circuit substrate (not shown) is not obtained. In the present invention, the adhesive layer 1 0 2 having a relatively large build-up property is disposed on the adhesive layer 1 so as to be as thin as possible as the adhesive layer (interphase adhesive layer) 1 〇 4 . The outflow of the two standing adhesives suppresses the surface smoothness of the multilayer circuit substrate. In other words, in the adhesive film 105 or the cover film 1 of the present invention, the adhesive layer 1 〇 2 having a relatively large flow-through property is disposed obliquely on the adhesive layer 1 〇 3 having a relatively small outflow property. When the pressure is applied to the wiring pattern (conduction or circuit pattern) 20 1 by a press (thermal lamination) or the like, first, the adhesive layer 1 〇 3 having a relatively small outflow property is first contacted, and the adhesive layer is used. The low outflow property can sufficiently enter between the wiring of the wiring pattern 20 1 and the wiring without locally generating a void, and a predetermined bonding strength can be obtained. Further, in the adhesive layer 1 〇 2 which is obliquely disposed on the adhesive layer 103 having a large relative flowability, the adhesive layer 103 is a fine and complicated following the change wiring pattern -25-200843606. The pattern shape is followed by continuously following the same shape (depicting the form of the post-injection shape of the previously adhered adhesive layer), and continuously entering the wiring pattern 201 after the adhesive layer 102 has entered. Between wiring and wiring. Therefore, even if the adhesive layer 102 having a relatively large outflow property is not locally generated between the wiring and the wiring of the wiring pattern 20 1 , it can be sufficiently entered. The adhesive layer 1 〇4 which is adhered by a press (thermal lamination or the like) can suppress the surface smoothness of the multilayer circuit board by the outflow of the two adhesives. (Examples) The effects of the present invention will be described using the following examples and comparative examples. However, the technical scope of the present invention is not limited to the embodiments shown in the following embodiments. Example 1 (1) Solution for adjusting the composition of the adhesive For the carboxylic rubber containing propylene rubber as a functional group WS 02 3D R (manufactured by Nippon Kasuga Tektronix; number average molecular weight 11000 0 ) 60 weight In addition, 20 parts by weight of ESCN-195-10 (manufactured by Sumitomo Chemical Co., Ltd.), a cresol novolac type epoxy resin, and Higashi-Neng 2181 (manufactured by Hitachi Chemical Co., Ltd.) 20 In the weight portion, 0.6 parts by weight of dicyandiamide as a curing agent, and 20 parts by weight of aluminum and aluminum carbonate (manufactured by Showa Denko Co., Ltd.) of aluminum hydroxide were dissolved in methyl ethyl ketone as an inorganic chelating agent. , dispersed, made into a non-volatile -26- 200843606 points 20wt% solution. This solution was adjusted to a particle size of 5 μm or less by using a ball mill to sufficiently disperse a solution as a binder composition. (2) Next, a film is formed as the first layer of the adhesive layer 102, and the dried adhesive layer 102 has a thickness of 20 μm, and the solution of the adhesive composition obtained in the above (1) is applied. a release agent [alcohol-based release agent/PET (thickness 16 μιη) / top quality paper / PET (thickness 16 μπι)] of a release-treated paper substrate having a thickness of 9 8 μm, and applied in a hot air dryer It was dried at 100 ° C for 5 minutes as a highly permeable adhesive layer 102. Then, as the adhesive layer 10/10 of the second layer, the solution of the same adhesive composition obtained in the above (1) is applied such that the thickness of the adhesive layer 1 〇 3 after drying is 20 μm. The release agent [alkyd-based release agent/PET (thickness 50 μm)] of the release-treated PET film substrate having a thickness of 50 μm was dried in a hot air dryer at 1 ° C for 5 minutes, and then dried. Further, heat treatment was performed at 1 〇〇 ° CX for 10 minutes to obtain an adhesive layer 1 〇 3 having a small effluent property. The two adhesive layers 1 〇 2, 1 〇 3 obtained by laminating heat lamination (10 (rC, 2 MPa, lamination time 30 sec)) were placed obliquely as a follow-up layer 〇4 Film No. 105. The following characteristics were evaluated for the obtained adhesive film 1 〇5. (Characteristic evaluation) (3) Press workability was carried out on a polyimide film having a thickness of 25 μm and a copper foil -27 having a thickness of 35 μm - 200843606 A polyimine surface of a copper-clad laminate formed by adhering to the adhesive film 205 having the above-described fluent adhesive layer 1 〇 4. At this time, the release film of the film 105 is released. After the release agent of the paper substrate, the surface of the adhesive film 105 having a large flowability (adhesive layer 102 side) is pasted (adhesive condition: heat lamination, 100 ° C, 2 MPa, 30 seconds) The polyimine surface of the laminate is laminated. Then, after releasing the release agent of the release film PET film substrate of the film 105, the surface of the adhesive film 105 having a small flowability (adhesive layer 10 side) , pasting (adhesive conditions: heat lamination, 100 ° C, 2 MPa, 30 seconds) A copper foil surface (wiring pattern surface) of a copper-clad laminate having a wiring pattern of a desired thickness (a copper-clad laminate formed of a copper foil having a thickness of 35 μm and a base film made of a polyimide having a thickness of 25 μm). Then, the press temperature was 170 ° C, the pressure was 2.0 MPa, and the pressure was pressed for 5 minutes to evaluate the surface smoothness of the outermost copper foil A and the flowability from the end. The results obtained are shown below. Table (4) The release agent of the release-treated paper substrate of the film 205 which was produced by effluent exfoliation and the release agent of the release-treated PET film substrate, at a temperature of 170 ° C, pressure 9.8 MPa, the film 105 was heated and pressure-bonded for 1 minute, and the amount of the film outflow (unit g/10 minutes) from a stainless steel mold having a diameter of 1.0 mm and a length of 1.0 mm was calculated as an index of the outflow property. The results obtained are shown in the following Table 1. -28- 200843606 Example 2 In Example 1, after the second layer of the adhesive layer 103 was produced, the sea and the H42M (showa electrician) using aluminum hydroxide were used. Co., Ltd.) as a 50-weight part The solution of the composition of the composition was carried out in the same manner as in Example 1 except that the second layer of the adhesive layer of the second layer was not subjected to the additional heat treatment. The evaluation of the properties of the obtained adhesive film 1 0 5 (surface smoothness) The results of the effluent and effluent from the end are shown in Table 1 below. Example 3 In Example 1, when the first layer of the adhesive layer 102 is to be formed, instead of the release-treated paper base A release agent for the material, as a flexible insulating film (a cover layer constituting a base film) to be a cover film substrate, a polyimide film having a thickness of 25 μm is used as a cover film. The same procedure as in Example 1 was carried out. The obtained cover layer film was subjected to the following characteristics evaluation. (Evaluation of Characteristics) (3) After the release agent of the release-treated PET film substrate of the press-processable cover film 100, the surface of the cover film 100 having a small flowability (the adhesive layer 103) Side) Adhesive (adhesive condition: thermal lamination, 1 〇〇 °c, 2 MPa, 3 〇 seconds) on a copper-clad laminate having a desired wiring pattern (a wiring pattern of copper foil having a thickness of 3 5 μm), and A copper foil surface (wiring pattern surface) of a copper-clad laminate formed of a polyimide film of the base -29-200843606 material having a thickness of 2 5 μm. Then, the surface temperature of the outermost cover film substrate 101 and the outflow property from the end portion were evaluated by press-pressing at a temperature of 170 ° C and a pressure of 2.0 MPa for 5 minutes. The results obtained are shown in the following Table 1 (4) Release agent of the release film PET film substrate of the cover film 100 produced by effluent exfoliation, and then at a temperature of 17 ° C, a pressure of 9.8 MPa. The cover film was heated and pressure-bonded for 1 minute, and the amount of the cover film of the stainless steel mold from the diameter of 1. 〇mm and the length of 1 〇Hi m (unit g/10 minutes) was calculated as the outflow property. index. The results obtained are shown in Table 1 below. Here, when the cover film of the single-layer cover film substrate was coated, the adhesive layer was peeled off from the polyimide film of the cover film substrate. Comparative Example 1 In Example 1, as the adhesive layer 102 of the first layer, the thickness of the adhesive layer after drying was 4 μm μm, and the solution of the adhesive composition was applied, and dried in hot air. The machine was dried at 1 〇〇 ° CX for 5 minutes, and was carried out in the same manner as in Example 1 except that the film was composed of a single layer (constituted by the adhesive layer 102). With respect to the obtained adhesive film 1 〇 5, the following characteristics were evaluated. -30- 200843606 (Characteristics Evaluation) (3) Press Machinability The polyimine surface of a copper-clad laminate formed by a polyimide film having a thickness of 25 μm and a copper foil having a thickness of 35 μm is adhered to the upper layer. The adhesive film 105 is composed of the adhesive film 102. At this time, the adhesive layer of the release agent which is not formed with the release-treated paper substrate of the film 105 is first adhered first (adhesion conditions: thermal lamination, 1 〇〇 ° C, 2 MPa , 30 seconds) on the polyimine surface of the laminate. Then, after peeling off the release agent of the release-treated paper substrate of the film 105, the adhesive layer 102 of the adhesive film 105 is pasted (adhesion conditions: heat lamination, 100 ° C, 2 MPa, 30 seconds) Copper foil surface of a copper-clad laminate (a copper-clad laminate formed of a polyimide film having a thickness of 35 μm) and a base film made of polyimide polyimide having a thickness of 25 μm (wiring) Pattern surface). Then, the press temperature was 170 ° C, the pressure was 2.0 MPa, and the pressure was pressed for 5 minutes to evaluate the surface smoothness of the outermost copper foil A and the outflow property from the end portion. The results obtained are shown in the following Table (4), after the release agent of the release-treated paper substrate of the film 205 produced by the effluent exfoliation, at a temperature of 170 ° C, a pressure of 9 · 8 MP a, the film 1 〇 5 was heated and pressure-bonded for 1 minute, and the amount of subsequent film outflow (unit g / ΙΟ minute) of a stainless steel mold having a diameter of 1.0 mm and a length of 1.0 mm was calculated as an index of effluent. . The results obtained are shown in the following Table - 31 - 200843606. Comparative Example 2 In Example 1, after the formation of the first layer of the adhesive layer 102, 'In addition to the use of aluminum and aluminum H42M (showa) In the same manner as in Example 1, except that a solution of an adhesive composition of 50 parts by weight was used. The results of evaluation of the characteristics (surface smoothness, outflow property and outflow property from the end) of the obtained adhesive film 1965 are shown in Table 1 below.
-32- 200843606 [表1]-32- 200843606 [Table 1]
配合(重量部）•特性 實施例1 實施例2 實施例3 比較例1 比較例2 第 丙烯橡膠 WS02 3D R 60 60 60 60 60 _ 環氧樹脂 ESCN-195-10 20 20 20 20 20 層 苯酚樹脂 希大能爾2181 20 20 20 20 20 的 硬化劑 二氰二赚 0.6 0.6 0.6 0.6 0.6 接 無機塡充劑 海及來特H42M 20 20 20 20 50 著 乾燥條件 100〇C x5 分鐘 100〇C χ5 分鐘 100〇C x5 分鐘 100〇C x5 分鐘 100〇C x5 分鐘 劑 厚度 20μ m 20μ m 2 0 μ m 40μ m 20μ m 層 流出値(g/io分鐘） 100 100 100 100 20 丙烯橡膠 WS02 3DR 60 60 60 6 第 環氧棚旨 ESCN-195-10 20 20 20 20 二 苯酚樹脂 希大能爾2181 20 20 20 20 層 硬化劑 二氰二赚 0.6 0.6 0.6 0.6 的 無機塡充劑 海及來特H42M 20 50 20 未使用 20 接 乾燥條件 100〇C x5 分鐘 100〇C χ5 分鐘 100〇C χ5 分鐘 100〇C x5 分鐘 著 追加加熱處理條件 100〇C χίο 分鐘 無 100〇C χίο分鐘 100〇C χίο 分鐘 劑 厚度 20μ m 20μ m 2 0 μ m 2 0 μ m 層 流出値(g/io分鐘） 40 20 40 40 表面平滑性 〇 〇 〇 〇 X 流出性 〇 〇 〇 X 〇 電路基板構成 A A B A A -33-. 200843606 被使用於表中的各接著劑層的形成的接著劑組成物的 溶液的配合部數（重量部）’是表不除了溶劑之外的有效 成分的重量部比。 又，表中的電路基板構成A’是作爲具有貼銅積層板/ 接著薄膜/所需要的配線圖案的貼銅積層板。 表中的電路基板構成B，是作爲具有覆蓋層薄膜/所需 要的配線圖案的貼銅積層板。 判定表中的表面平滑性，是使用如第3圖的雷射變位 計，如以下地以2階段進行評價。都對於5個樣品數進行 〇 〇 針對於所有樣品，凹凸高度不足8 μιη。 X 無論1個樣品，凹凸高度可看到8 μηι以上。 判定表中的（從端部的）流出性，是使用游標卡尺， 如以下地以2階段進行評價。都對於5個樣品數進行。 〇 流出部分的最長部爲ΙΟΟμπι以下。 X 流出部分的最長部爲超過ΙΟΟμπι。 由以上說明可知，可提供作爲接著薄膜，覆蓋層薄膜 的接著劑層至少積層2層以上流出性不相同的接著劑層， 把上述接著劑層的流出性小的一面設於配線圖案上，則可 作成具有優異壓機（加熱壓接）後的表面平滑性，且儘量 抑制接著材料流出到配線圖案端子部等的開口部分，而將 上述接著劑層作成儘量薄的接著薄膜，覆蓋層薄膜者。 【圖式簡單說明】 -34- 200843606 第1圖是模式地表示本發明的電路基板用接著薄膜的 斷面槪略圖。 第2圖是模式地表示本發明的電路基板用覆蓋層薄膜 ’及適用該電路基板用覆蓋層薄膜的對方側的電路圖案所 形成的多層電路基板的構成的斷面槪略圖。 第3圖是模式地表示對於在實施例所得到的接著薄膜 ，使用雷射變位計進行測定表面平滑性（表面的凹凸）的 情形的解說圖。 【主要元件符號說明】 100 :覆蓋層薄膜 1 〇 1 :成爲覆蓋層薄膜基材的可撓性絕緣薄膜（覆蓋 層構成基材薄膜） 1 02 :流出性大的接著劑層 103 :流出性小的接著劑層 1 04 :流出性不相同的複數層所成的接著劑層 105 :電路基板用接著薄膜 200 :電路基板 201 :導通（或電路）圖案 2 02 :電路基板構成基材薄膜 203:下層基板（絕緣基板） 3 00 :多層電路基板或可撓性電路基板 •35-Coordination (weight portion) • Characteristics Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Propylene rubber WS02 3D R 60 60 60 60 60 _ Epoxy resin ESCN-195-10 20 20 20 20 20 layer phenol resin Xidanenger 2181 20 20 20 20 20 hardener dicyandiene earn 0.6 0.6 0.6 0.6 0.6 with inorganic chelating agent Haihe Laite H42M 20 20 20 20 50 drying conditions 100 〇 C x 5 minutes 100 〇 C χ 5 minutes 100〇C x5 minutes 100〇C x5 minutes 100〇C x5 minutes Thickness 20μ m 20μ m 2 0 μ m 40μ m 20μ m Layer outflow 値 (g/io minutes) 100 100 100 100 20 Acrylic rubber WS02 3DR 60 60 60 6 The first epoxy shed ESCN-195-10 20 20 20 20 Diphenol resin Xidanenger 2181 20 20 20 20 layer hardener dicyandiene earn 0.6 0.6 0.6 0.6 inorganic enamel agent Haihe Laite H42M 20 50 20 Not used 20 Drying conditions 100〇C x5 minutes 100〇C χ5 minutes 100〇C χ5 minutes 100〇C x5 minutes Additional heat treatment conditions 100〇C χίο minutes No 100〇C χίο分钟100〇C χίο Minute thickness 20μ m 20μ m 2 0 μ m 2 0 μ m Outflow 値 (g/io minutes) 40 20 40 40 Surface smoothness 〇〇〇〇X effluent 〇〇〇X 〇Circuit substrate composition AABAA -33-. 200843606 Used in the formation of each adhesive layer in the table The number of the mating portions (weight portion) of the solution of the agent composition is a weight portion ratio of the active ingredient excluding the solvent. Further, the circuit board configuration A' in the table is a copper-clad laminate having a copper-clad laminate/sub-film/required wiring pattern. The circuit board configuration B in the table is a copper-clad laminate having a cover film/required wiring pattern. The surface smoothness in the determination table was evaluated by using a laser variator as shown in Fig. 3 in two stages as follows. For all 5 samples, 〇 〇 For all samples, the bump height is less than 8 μηη. X No matter 1 sample, the bump height can be seen above 8 μηι. The outflow property (from the end) in the determination table was evaluated in two stages using a vernier caliper as follows. All were carried out for 5 sample numbers.最 The longest part of the outflow part is ΙΟΟμπι or less. The longest part of the X outflow portion is more than ΙΟΟμπι. According to the above description, it is possible to provide an adhesive layer having at least two or more layers of an adhesive layer as a cover film and a cover film, and to provide a laminate having a small flowability of the adhesive layer on the wiring pattern. The surface smoothness after the excellent press (heating and pressure bonding) can be made, and the opening portion of the wiring material terminal portion or the like can be suppressed as much as possible, and the adhesive layer can be made as thin as possible, and the film can be covered. . [Brief Description of the Drawings] -34- 200843606 Fig. 1 is a schematic cross-sectional view showing the adhesive film for a circuit board of the present invention. Fig. 2 is a schematic cross-sectional view showing a configuration of a multilayer circuit substrate formed by a circuit layer for a circuit board of the present invention and a circuit pattern of the other side of the cover film for a circuit board. Fig. 3 is a view schematically showing a state in which surface smoothness (concavity and convexity on the surface) is measured using a laser displacement gauge for the adhesive film obtained in the examples. [Explanation of main component symbols] 100: Overcoat film 1 〇1 : Flexible insulating film to be a cover film substrate (cover film constitutes a base film) 1 02 : Adhesive layer 103 having a large effluent property: small outflow property Adhesive layer 104: Adhesive layer 105 formed by a plurality of layers having different effluent properties: Substrate film for circuit substrate 200: Circuit substrate 201: Conduction (or circuit) pattern 02: Circuit substrate constituting substrate film 203: Lower substrate (insulated substrate) 3 00 : Multi-layer circuit substrate or flexible circuit board • 35-