TW200842370A - Contactor, probe card, and method of manufacturing contactor - Google Patents

Contactor, probe card, and method of manufacturing contactor Download PDF

Info

Publication number
TW200842370A
TW200842370A TW097110521A TW97110521A TW200842370A TW 200842370 A TW200842370 A TW 200842370A TW 097110521 A TW097110521 A TW 097110521A TW 97110521 A TW97110521 A TW 97110521A TW 200842370 A TW200842370 A TW 200842370A
Authority
TW
Taiwan
Prior art keywords
contact
layer
electronic component
conductive
tested
Prior art date
Application number
TW097110521A
Other languages
English (en)
Chinese (zh)
Inventor
Masanori Nakamura
Hidenori Kitazume
Shigeru Matsumura
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of TW200842370A publication Critical patent/TW200842370A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
TW097110521A 2007-04-03 2008-03-25 Contactor, probe card, and method of manufacturing contactor TW200842370A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007097405 2007-04-03

Publications (1)

Publication Number Publication Date
TW200842370A true TW200842370A (en) 2008-11-01

Family

ID=39808169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110521A TW200842370A (en) 2007-04-03 2008-03-25 Contactor, probe card, and method of manufacturing contactor

Country Status (2)

Country Link
TW (1) TW200842370A (ja)
WO (1) WO2008120587A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727789A (ja) * 1993-07-09 1995-01-31 Nitto Denko Corp 回路配線板およびその製造方法
JPH09297154A (ja) * 1996-05-07 1997-11-18 Matsushita Electric Ind Co Ltd 半導体ウエハの検査方法
JP2846851B2 (ja) * 1996-05-31 1999-01-13 株式会社双晶テック プローブユニット
JP2000155132A (ja) * 1998-09-14 2000-06-06 Toppan Printing Co Ltd 検査治具及びその製造方法
US6255727B1 (en) * 1999-08-03 2001-07-03 Advantest Corp. Contact structure formed by microfabrication process
JP2974214B1 (ja) * 1998-12-16 1999-11-10 株式会社双晶テック プローブユニット
JP2001249144A (ja) * 1999-12-28 2001-09-14 Mitsubishi Materials Corp コンタクトプローブ、プローブ装置及びコンタクトプローブ製造方法
JP3792580B2 (ja) * 2002-01-30 2006-07-05 ジェネシス・テクノロジー株式会社 コンタクトプローブおよびその製造方法
US20040119485A1 (en) * 2002-12-20 2004-06-24 Koch Daniel J. Probe finger structure and method for making a probe finger structure
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置
JP5232382B2 (ja) * 2005-12-06 2013-07-10 株式会社エンプラス プローブチップ及びプローブカード

Also Published As

Publication number Publication date
WO2008120587A1 (ja) 2008-10-09

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